JP2011218665A - Pressing method, pressing device, connection structure, liquid discharge head, and liquid discharge device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a pressing method for reliably connecting a terminal part and an electrode at low cast by using an insulating resin.SOLUTION: The pressing method includes a step of pressing the terminal part 73 having a plurality of protrusions 81 formed on the surface thereof to the electrode 47 by a pressing tool 201. The plurality of protrusions 81 are arranged in an extending direction of the terminal part 73 at predetermined intervals Wp. The lengths of the plurality of protrusions 81 in the extending direction are equal to each other. The pressing tool 201 has a pressing surface 201A for pressing the terminal part 73 toward the electrode 47. The length Wt of the pressing surface 201A in the extending direction is a natural number times the predetermined interval Wp.

Description

  The present invention relates to a pressing method, a pressing device, a connection structure, a droplet discharge head, and a droplet discharge device.

  A droplet discharge method (inkjet method) is known as one of methods for manufacturing a microdevice. In the droplet discharge method, a liquid containing a material for forming a device is formed into droplets and discharged from a droplet discharge head. For example, Patent Document 1 discloses an example of a technique related to a droplet discharge head (inkjet recording head). In the droplet discharge head disclosed in Patent Document 1, a drive circuit unit (IC driver) and a drive element (piezoelectric element) are connected by a wire bonding technique.

  By the way, when manufacturing a microdevice based on the droplet discharge method, in order to meet the demand for further miniaturization of the microdevice, the distance between the nozzle openings provided in the droplet discharge head (nozzle pitch) Is preferably as small (narrow) as possible. Since a plurality of the piezoelectric elements are formed corresponding to the nozzle openings, if the nozzle pitch is reduced, the distance between the piezoelectric elements needs to be reduced according to the nozzle pitch. However, when the distance between the piezoelectric elements becomes small, it becomes difficult to connect each of the plurality of piezoelectric elements and the IC driver by a wire bonding technique.

  For this reason, for example, Patent Document 2 describes a droplet discharge device in which an electrode of a piezoelectric element formed in a groove of a droplet discharge head and an IC driver are connected via a flexible substrate. According to the droplet discharge device disclosed in Patent Document 2, the end portion (connecting portion) of the flexible substrate that goes down in the depth direction of the groove is bent in the horizontal direction, and the electrode of the piezoelectric element is bent. The ends of the flexible substrate are connected in surface contact.

  Conventionally, in the connection between the terminal portion of the flexible substrate and the electrode of the connection component to be connected, for example, as shown in Patent Document 3, between the terminal portion of the flexible substrate and the electrode of the connection component. In addition, an anisotropic conductive resin (ACP: Anisotropic Conductive Paste) sandwiched as a bonding material is known. An anisotropic conductive resin is obtained by dispersing conductive particles (for example, silver particles) in an insulating resin. Conductivity is obtained only in the joining direction of the terminal portions, and the arrangement direction of the terminal portions is insulative. It can be secured.

  However, anisotropic conductive resin is extremely expensive, and if the formation pitch between adjacent terminal portions is narrowed, the insulation between the terminal portions is lowered, so that the terminal portions cannot be arranged with high density at a narrow interval. There was a problem. For this reason, for example, in Patent Documents 4 and 5, a relatively inexpensive insulating resin (NCP: Non Conductive Paste) is sandwiched between the terminal portion of the flexible substrate and the electrode of the connection component. It is described that the flexible substrate and the connection component are electrically connected by reliably bringing each terminal portion of the flexible substrate into contact with the electrode of the connection component.

JP 2000-127379 A JP 2008-263049 A JP 2006-086153 A Japanese Patent Laid-Open No. 5-166884 JP 62-184788 A

  When connecting the terminal part of the flexible substrate and the electrode of the connecting part using an insulating resin, since the insulating resin does not contain conductive particles, the terminal part of the flexible board and the connecting part In order to ensure contact with the electrode, a large load must be applied to the flexible substrate with the pressing tool to eliminate the insulating resin between the terminal portion of the flexible substrate and the electrode of the connection component. Don't be. For that purpose, a load approximately 15 times that in the case of connecting using an anisotropic conductive resin is required.

  When a large load is applied to the flexible substrate, the connection component may be damaged. Therefore, for example, in Patent Document 5, the width of the terminal portion of the flexible substrate is partially narrowed to increase the load per unit area of the pressing portion.

  However, in the structure of Patent Document 5, since the narrow portions of the terminal portion of the flexible substrate are periodically arranged at regular intervals, the pressing between the terminal portion of the flexible substrate and the electrode of the connection component When the portion is displaced in the extending direction of the terminal portion of the flexible substrate, the area of the pressing portion between the terminal portion of the flexible substrate and the electrode of the connection component changes. Therefore, even when the same load is applied, the load per unit area becomes small, and there is a concern that conduction failure may occur.

  An object of the present invention is to provide a pressing method and a pressing device that can reliably connect a terminal portion and an electrode at low cost using an insulating resin, and to provide such a pressing method and pressing device. It is an object of the present invention to provide a connection structure, a droplet discharge head, and a droplet discharge device that are excellent in connection reliability.

  The pressing method of the present invention includes a pressing step of pressing a terminal portion having a plurality of convex portions formed on a surface thereof against an electrode with a pressing tool, and the plurality of convex portions are arranged at predetermined intervals in the extending direction of the terminal portion. The lengths in the extending direction of the plurality of convex portions are equal to each other, the pressing tool has a pressing surface that presses the terminal portion toward the electrode, and the extending direction of the pressing surface The length of is a natural number multiple of the predetermined interval.

  According to this configuration, even if the pressing portion between the terminal portion and the electrode is displaced in the extending direction of the terminal portion, the area of the pressing portion between the terminal portion and the electrode does not change. Therefore, the magnitude of the load per unit area of the pressing portion becomes constant, and the occurrence of poor conduction is suppressed.

  When the number of convex portions formed on the surface of the terminal portion is m and the length of the pressing surface in the extending direction is n times the predetermined interval (m and n are natural numbers), m It is desirable that the relationship> n is satisfied.

  According to this configuration, even if the pressing position of the pressing tool is slightly shifted, it is possible to reliably press the arrangement area of the convex portion. Therefore, the occurrence of poor conduction is suppressed and the yield is improved.

  It is desirable that the length of the convex portion in the extending direction is equal to or less than the length of the concave portion between the convex portions in the extending direction.

  According to this structure, the area of the convex part in a terminal part becomes small, and the load per unit area of a press part becomes large. Therefore, the occurrence of poor conduction is suppressed and the yield is improved.

  It is desirable to include a step of pressing the plurality of convex portions on the surface of the terminal portion using a processing tool before pressing the terminal portion against the electrode with the pressing tool.

  According to this structure, before pressing a terminal part to an electrode, the space | interval of the convex part of the surface of a terminal part can be adjusted with a pressurization tool. For example, when the member having a terminal part with a convex part formed on the surface is purchased, when the distance between the convex parts cannot be changed arbitrarily, a specific press according to the predetermined convex part interval is used. It is necessary to select a pressing tool having a surface width. However, when the interval between the convex portions can be adjusted using the processing tool as in the present invention, the interval between the convex portions may be adjusted according to the width of the pressing surface of the pressing tool. There is an advantage of spreading.

  The pressing device of the present invention includes a pressing tool that presses the terminal portion having a plurality of convex portions formed on the surface against the electrode, and the plurality of convex portions are arranged at predetermined intervals in the extending direction of the terminal portion, The lengths of the plurality of convex portions in the extending direction are equal to each other, and the pressing tool has a pressing surface that presses the terminal portion toward the electrode, and the length of the pressing surface in the extending direction. Is a natural number multiple of the predetermined interval.

  According to this configuration, even if the pressing portion between the terminal portion and the electrode is displaced in the extending direction of the terminal portion, the area of the pressing portion between the terminal portion and the electrode does not change. Therefore, the magnitude of the load per unit area of the pressing portion becomes constant, and the occurrence of poor conduction is suppressed.

  It is desirable to include a processing tool for pressing the plurality of convex portions on the surface of the terminal portion.

  When a processing tool is not provided, it is necessary to select a pressing tool having a specific pressing surface width in accordance with a predetermined interval between convex portions. However, when a processing tool that can freely control the width of the convex portion is provided, the interval between the convex portions may be adjusted according to the width of the pressing surface of the pressing tool. Therefore, there is an advantage that the selection range of the pressing tool is widened.

  The pressing method of the present invention can be widely applied when connecting the terminal portion and the electrode. The terminal portion and the electrode may be formed on any substrate. When the terminal portion is formed on the surface of the flexible substrate, the pressing surface of the pressing tool is in contact with the surface of the flexible substrate opposite to the surface on which the terminal portion is formed, and the surface is the electrode. The length of the pressing surface in the extending direction is a natural number times the predetermined interval.

  The connection structure of the present invention is a connection structure in which a terminal portion having a plurality of convex portions formed on the surface is pressed and connected to an electrode, and the plurality of convex portions are spaced at a predetermined interval in the extending direction of the terminal portion. The lengths in the extending direction of the plurality of convex portions are equal to each other, and the length in the extending direction of the pressing portion where the terminal portion and the electrode are pressed is a natural number of the predetermined interval. It is characterized by being double.

  According to this configuration, even if the pressing portion between the terminal portion and the electrode is displaced in the extending direction of the terminal portion, the area of the pressing portion between the terminal portion and the electrode does not change. Therefore, the magnitude of the load per unit area of the pressing portion becomes constant, and the occurrence of poor conduction is suppressed.

  The droplet discharge head of the present invention drives a first substrate, a driving element formed on the first substrate, a second substrate provided on the driving element side of the first substrate, and the driving element. And a flexible substrate on which a wiring for connecting the driving element and the driving circuit unit is formed, and a terminal connected to an electrode of the driving element at an end of the wiring A plurality of convex portions are formed on the surface of the terminal portion, and the plurality of convex portions are arranged at a predetermined interval in the extending direction of the terminal portion, and the extension of the plurality of convex portions is formed. The lengths in the extending direction are equal to each other, and the length in the extending direction of the pressing portion where the terminal portion and the electrode are pressed is a natural number multiple of the predetermined interval.

  According to this configuration, even if the pressing portion between the terminal portion and the electrode is displaced in the extending direction of the terminal portion, the area of the pressing portion between the terminal portion and the electrode does not change. Therefore, the magnitude of the load per unit area becomes constant, and the occurrence of poor conduction is suppressed.

  A droplet discharge apparatus according to the present invention includes the droplet discharge head according to the present invention.

  According to this configuration, since the occurrence of poor conduction between the terminal portion and the electrode can be suppressed, a droplet discharge device with excellent connection reliability is provided.

It is an external appearance perspective view of one form of a droplet discharge head. It is a disassembled perspective view of a droplet discharge head. It is a partially broken view of the perspective view of the droplet discharge head as seen from the nozzle opening side. It is AA arrow sectional drawing of FIG. It is a figure which expands and shows the principal part of an OLB connection part. It is a top view of a flexible circuit board. It is explanatory drawing of the manufacturing method of a flexible circuit board. It is explanatory drawing of the manufacturing method of a flexible circuit board. It is the schematic of the press apparatus which presses a flexible circuit board to a reservoir | reserver formation board | substrate. It is explanatory drawing of the process of pressing a flexible circuit board against a reservoir formation board. It is explanatory drawing for demonstrating the subject of a press process. It is explanatory drawing for demonstrating the effect of the press process of this invention. It is a schematic perspective view of the 1st form of a droplet discharge device. It is a schematic perspective view of the 2nd form of a droplet discharge device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following description, an XYZ orthogonal coordinate system is set, and the positional relationship of each member will be described with reference to this XYZ orthogonal coordinate system. The longitudinal direction of the droplet discharge head (nozzle arrangement direction) is the Y-axis direction, the short direction of the droplet discharge head (the direction perpendicular to the Y-axis direction) is the X-axis direction, and the thickness direction of the droplet discharge head (X The direction orthogonal to the axial direction and the Y-axis direction) is taken as the Z-axis direction.

[Droplet ejection head]
1 is an external perspective view showing an embodiment of a droplet discharge head, FIG. 2 is an exploded perspective view of the droplet discharge head, and FIG. 3 is a partially cutaway view of the perspective view of the droplet discharge head viewed from the nozzle opening side. 4 is a cross-sectional view taken along line AA in FIG. 1, FIG. 5 is an enlarged cross-sectional view showing a connection portion of the flexible substrate, and FIG. 6 is a plan view of the flexible substrate.

  As shown in FIGS. 1 to 4, the liquid droplet ejection head 1 includes a nozzle substrate 21 having a nozzle opening 31 through which liquid droplets are ejected, and a flow path forming substrate 22 (first) provided on the upper surface of the nozzle substrate 21. 1 substrate), a diaphragm 24 provided on the upper surface of the flow path forming substrate 22 and displaced by driving the piezoelectric element 23, a reservoir forming substrate 25 (second substrate) provided on the upper surface of the diaphragm 24, and a reservoir A base provided with a case member 101 provided on the upper surface side of the formation substrate 25, and a flexible substrate 27 on which wiring for electrically connecting the piezoelectric element 23 and a driver IC (drive circuit portion) 26 is formed. It is composed mainly of 1A. The operation of the droplet discharge head 1 is controlled by an external controller CT. In the present embodiment, the droplet discharge head is configured by one substrate 1A. However, the droplet discharge head may be configured by unitizing a plurality of substrates 1A.

  As shown in FIG. 3, the lower surface side of the flow path forming substrate 22 is open, and the nozzle substrate 21 is connected to the lower surface of the flow path forming substrate 22 so as to cover the opening. The nozzle substrate 21 is made of, for example, stainless steel or glass ceramics. The nozzle substrate 21 is formed with a plurality of nozzle openings 31 which are through-holes penetrating the nozzle substrate 21 in the thickness direction and discharge functional liquid droplets. A plurality of nozzle openings 31 formed side by side in the Y-axis direction constitute first to fourth nozzle opening groups 31A to 31D. The first nozzle opening group 31A and the second nozzle opening group 31B are arranged to face each other in the X axis direction, and the third nozzle opening group 31C and the fourth nozzle opening group 31D are arranged to face each other in the X axis direction. The third nozzle opening group 31C is formed adjacent to the first nozzle opening group 31A in the Y-axis direction, and the fourth nozzle opening group 31D is adjacent to the second nozzle opening group 31B in the Y-axis direction. Is formed.

  In FIG. 3, the first to fourth nozzle opening groups 31 </ b> A to 31 </ b> D are shown to be configured by six nozzle openings 31, but actually, for example, about 720 nozzle openings 31 are formed. Is formed.

  A plurality of partition walls 35 are formed inside the flow path forming substrate 22. The flow path forming substrate 22 is formed of, for example, a rigid silicon single crystal. The plurality of partition walls 35 are formed by anisotropically etching a silicon single crystal substrate that is a base material of the flow path forming substrate 22. The nozzle substrate 21 is fixed to the lower surface of the flow path forming substrate 22 through, for example, an adhesive or a heat welding film. A vibration plate 24 is provided on the upper surface of the flow path forming substrate 22. A space surrounded by the flow path forming substrate 22, the nozzle substrate 21, and the vibration plate 24 forms a pressure generating chamber 36 in which the functional liquid discharged from the nozzle opening 31 is disposed. A plurality of pressure generating chambers 36 are formed side by side in the Y-axis direction so as to correspond to the plurality of nozzle openings 31 constituting each of the first to fourth nozzle opening groups 31A to 31D. Each pressure generating chamber 36 is partitioned by a partition wall 35.

  A first pressure generating chamber group 36A is constituted by a plurality of pressure generating chambers 36 formed corresponding to the first nozzle opening group 31A. A plurality of pressure generation chambers 36B corresponding to the second nozzle opening group 31B constitute a second pressure generation chamber group 36B. A plurality of pressure generation chambers 36C corresponding to the third nozzle opening group 31C constitute a third pressure generation chamber group 36C. A fourth pressure generation chamber group 36D is constituted by the plurality of pressure generation chambers 36 corresponding to the fourth nozzle opening group 31D. The first pressure generation chamber group 36A and the second pressure generation chamber group 36B are arranged to face each other in the X-axis direction, and a partition wall 22K is formed between them. The third pressure generation chamber group 36C and the fourth pressure generation chamber group 36D are arranged to face each other in the X-axis direction, and a partition wall 22K is formed between them.

  As shown in FIGS. 3 and 4, one end of the plurality of pressure generating chambers 36 constituting the first pressure generating chamber group 36 </ b> A is connected to a communicating portion 39 via a supply path 38 constituting a part of the reservoir 37. Are communicated with each other. The communication part 39 is a through hole formed in the flow path forming substrate 22 and is connected to the reservoir part 51. The communication portion 39 and the reservoir portion 51 are both formed to extend in the Y-axis direction. The reservoir 37 is constituted by the reservoir 51 and the communication part 39. The reservoir 37 is a functional liquid holding chamber (ink chamber) common to the plurality of pressure generating chambers 36 constituting the first pressure generating chamber group 36A. In the reservoir forming substrate 25, an introduction path 52 that is connected to the side wall of each communication portion 39 and introduces the functional liquid into each communication portion 39 is formed. The functional liquid introduced from the functional liquid introduction port 58 flows into the reservoir 37 through the introduction path 52, and is supplied to each of the plurality of pressure generation chambers 36 constituting the first pressure generation chamber group 36A via the supply path 38. Is done.

  The end portions of the pressure generation chambers 36 constituting the second to fourth pressure generation chamber groups 36 </ b> B to 36 </ b> D are also communicated with each other by the communication portion 39 via the supply path 38. The functional liquid introduced from the functional liquid introduction port 58 flows into the reservoir 37, passes through the supply path 38, and enters each of the plurality of pressure generation chambers 36 constituting the second to fourth pressure generation chamber groups 36B to 36D. Supplied.

  The reservoir forming substrate 25 is formed, for example, by etching a silicon single crystal that is the same material as the flow path forming substrate 22. The reservoir forming substrate 25 is in a state where an insulating film is formed on the surface by, for example, thermal oxidation. The reservoir forming substrate 25 is preferably formed of a material having a thermal expansion coefficient substantially the same as the thermal expansion coefficient of the flow path forming substrate 22. For example, glass or a ceramic material may be used.

  The vibration plate 24 disposed between the flow path forming substrate 22 and the reservoir forming substrate 25 is provided on the elastic film 41 so as to cover the upper surface of the flow path forming substrate 22 and on the upper surface of the elastic film 41. And a lower electrode film 42. The elastic film 41 is made of, for example, silicon dioxide having a thickness of about 1 to 2 μm, and the lower electrode film 42 is made of, for example, platinum having a thickness of about 0.2 μm. In the present embodiment, the lower electrode film 42 is an electrode common to the plurality of piezoelectric elements 23.

  The piezoelectric element 23 for displacing the diaphragm 24 includes a piezoelectric film 45 provided on the upper surface of the lower electrode film 42, an upper electrode film 46 provided on the upper surface of the piezoelectric film 45, and an upper electrode film 46. A lead electrode 47 (electrode) which is a lead wiring is provided. The piezoelectric film 45 is made of, for example, a metal oxide having a thickness of about 1 μm. The upper electrode film 46 is made of, for example, platinum having a thickness of about 0.1 μm, and the lead electrode 47 is made of, for example, gold having a thickness of about 0.1 μm. An insulating film (not shown) is provided between the lead electrode 47 and the lower electrode film 42.

  A plurality of piezoelectric elements 23 are provided so as to correspond to each of the plurality of nozzle openings 31 and the pressure generation chamber 36. The piezoelectric element 23 is provided for each nozzle opening 31 (for each pressure generation chamber 36). The lower electrode film 42 functions as a common electrode for the plurality of piezoelectric elements 23, and the upper electrode film 46 and the lead electrode 47 function as individual electrodes for the plurality of piezoelectric elements 23.

  The piezoelectric element 23 may include a lower electrode film 42 in addition to the piezoelectric film 45, the upper electrode film 46, and the lead electrode 47. That is, the lower electrode film 42 in the present embodiment may be configured to have both the function as the piezoelectric element 23 and the function as the diaphragm 24. In the present embodiment, the diaphragm 24 is constituted by the elastic film 41 and the lower electrode film 42, but the elastic film 41 may be omitted and the lower electrode film 42 may have the function of the elastic film 41.

  A first piezoelectric element group 23A is formed by a plurality of piezoelectric elements 23 provided side by side in the Y-axis direction so as to correspond to the respective nozzle openings 31 constituting the first nozzle opening group 31A. A second piezoelectric element group 23B is formed by a plurality of piezoelectric elements 23 provided side by side in the Y-axis direction so as to correspond to the respective nozzle openings 31 constituting the second nozzle opening group 31B. The first piezoelectric element group 23A and the second piezoelectric element group 23B are arranged so as to face each other in the X-axis direction. Although not shown in FIG. 4, the third piezoelectric element group 23 </ b> C is formed by a plurality of piezoelectric elements 23 provided side by side in the Y-axis direction so as to correspond to the nozzle openings 31 constituting the third nozzle opening group 31 </ b> C. Is formed. A second piezoelectric element group 23D is formed by a plurality of piezoelectric elements 23 provided side by side in the Y-axis direction so as to correspond to the respective nozzle openings 31 constituting the fourth nozzle opening group 31D. The third piezoelectric element group 23C and the fourth piezoelectric element group 23D are arranged to face each other in the X-axis direction.

  A compliance substrate 53 is bonded to the upper surface of the reservoir forming substrate 25. The compliance substrate 53 includes a sealing film 54 and a fixing plate 55. The sealing film 54 is formed of a material having low rigidity and flexibility such as a polyphenylene sulfide film having a thickness of about 6 μm. The upper part of the reservoir unit 51 is sealed by the sealing film 54. The fixing plate 55 is formed of a hard material such as a metal such as stainless steel having a thickness of about 30 μm. A region of the fixed plate 55 corresponding to the reservoir 51 is an opening 56 that is completely removed in the thickness direction. The upper part of the reservoir 51 is sealed only by a flexible sealing film 54. The sealing film 54 above the reservoir 51 is a flexible portion 57 that can be deformed by a change in internal pressure. A case member 101 is provided on the compliance substrate 53.

  The compliance substrate 53 and the case member 101 outside the reservoir unit 51 are formed with a functional liquid introduction port 58 that communicates with the introduction path 52 and supplies the functional liquid to the reservoir unit 51. Normally, when the functional liquid is supplied from the functional liquid introduction port 58 to the reservoir section 51, a pressure change occurs in the reservoir section 51 due to, for example, the flow of the functional liquid when the piezoelectric element 23 is driven or the surrounding heat. However, since the upper portion of the reservoir portion 51 is a flexible portion 57 sealed only by the sealing film 54, the flexible portion 57 is bent and deformed to absorb the pressure change. Therefore, the inside of the reservoir 51 is maintained at a constant pressure. The other portions are held at a sufficient strength by the fixing plate 55. The case member 101 is provided in a non-contact state on the flexible portion 57 so that the deformation of the flexible portion 57 is not impaired.

  A groove-shaped opening 60 extending in the Y-axis direction is formed at the center of the reservoir forming substrate 25 in the X-axis direction. Through the opening 60, the reservoir forming substrate 25 has a first sealing portion 61A for sealing the first piezoelectric element group 23A provided corresponding to the first pressure generating chamber group 36A, and a second pressure generating chamber group 36B. And a second sealing portion 61B for sealing the second piezoelectric element group 23B provided corresponding to the above. Although not shown in FIG. 4, the third sealing portion 61 </ b> C that seals the third piezoelectric element group 23 </ b> C provided corresponding to the third pressure generation chamber group 36 </ b> C by the opening 60, and the fourth pressure It is divided into a fourth sealing portion 61D for sealing the fourth piezoelectric element group 23D provided corresponding to the generation chamber group 36D. In the opening 60, a part of the flow path forming substrate 22 (partition wall 22K) is exposed.

  The opening 60 is divided into two openings 60 arranged in the X-axis direction by a wall portion 25A extending in the Y-axis direction. From each opening 60 to the region outside the X-axis, First and second sealing portions 61A and 61B for sealing the fourth piezoelectric element groups 23A to 23D with the diaphragm 24, and third and fourth sealing portions 61C and 61D are formed. The first sealing portion 61A seals the first piezoelectric element group 23A corresponding to the first pressure generating chamber group 36A with the diaphragm 24, and the second sealing portion 61B includes the second pressure generating chamber group. The second piezoelectric element group 23 </ b> B corresponding to 36 </ b> B is sealed between the diaphragm 24. The third sealing portion 61C seals the third piezoelectric element group 23C corresponding to the third pressure generation chamber group 36C with the diaphragm 24, and the fourth sealing portion 61D includes the fourth pressure generation chamber group. A fourth piezoelectric element group 23 </ b> D corresponding to 36 </ b> D is sealed between the diaphragm 24.

  In the reservoir forming substrate 25, a space that does not hinder the movement of the piezoelectric element 23 is secured in a region facing the piezoelectric element 23, and a piezoelectric element holding portion 62 that can seal this space is formed. . The piezoelectric element holding portion 62 is formed in each of the first and second sealing portions 61A and 61B and the third and fourth sealing portions 61C and 61D, and the first to fourth piezoelectric element groups 23A to 23A. It is formed in a size that covers 23D. Of the piezoelectric elements 23, at least the piezoelectric film 45 is sealed in the piezoelectric element holding portion 62.

  The reservoir forming substrate 25 functions as a sealing member for blocking the piezoelectric element 23 from the external environment and sealing the piezoelectric element 23. By sealing the piezoelectric element 23 with the reservoir forming substrate 25, it is possible to prevent the piezoelectric element 23 from being damaged by an external environment such as moisture. In the present embodiment, the inside of the piezoelectric element holding part 62 is only sealed, but the piezoelectric element holding part 62 is made, for example, by setting the space in the piezoelectric element holding part 62 to a vacuum, a nitrogen atmosphere or an argon atmosphere. The inside can be kept at a low humidity, and destruction of the piezoelectric element 23 can be prevented more reliably.

  Among the piezoelectric elements 23 sealed by the piezoelectric element holding part 62 of the first sealing part 61A, one end of the lead electrode 47 extends to the outside of the first sealing part 61A, and the opening 60 Is disposed on the flow path forming substrate 22 exposed in FIG. Of the piezoelectric elements 23 sealed by the piezoelectric element holding part 62 of the second sealing part 61B, the other end of the lead electrode 47 extends to the outside of the second sealing part 61B. It is disposed on the exposed flow path forming substrate 22. Of the piezoelectric elements 23 sealed by the piezoelectric element holding part 62 of the third sealing part 61C, one end of the lead electrode 47 extends to the outside of the third sealing part 61C, and the opening 60 Is disposed on the flow path forming substrate 22 exposed in FIG. Among the piezoelectric elements 23 sealed by the piezoelectric element holding part 62 of the fourth sealing part 61D, the other end of the lead electrode 47 extends to the outside of the fourth sealing part 61D. It is disposed on the exposed flow path forming substrate 22.

  An opening 102 formed along the Y-axis direction is formed at the center of the case member 101 in the X-axis direction. The opening 102 has a size including at least the opening region of the opening 60 formed in the reservoir forming substrate 25, and the holding region 103 of the driver IC 26 is formed in a cutout shape as shown in FIGS. ing.

  The driver IC 26 is a driver IC having, for example, a semiconductor integrated circuit (IC) including a circuit board and a drive circuit, and four driver ICs 26 are provided according to the first to fourth nozzle opening groups 31A to 31D. The piezoelectric element 23 is driven by a driver IC 26. Each driver IC 26 is flip-chip mounted on a predetermined region (mounting region) on one surface of the flexible substrate 27. As shown in FIGS. 4 and 5, the driver IC 26 is molded with resin 65 on the inner side surface 103 a of the holding region 103 of the opening 102 formed in the case member 101.

  As shown in FIG. 6, the flexible substrate 27 </ b> A includes an insulating film base material (flexible base material) 71 made of polyimide having a thickness of about 25 μm, for example. A first wiring pattern 72, a second wiring pattern 74, a ground wiring 76, and a terminal portion 73 made of a conductive material such as copper are formed on the main surface 71a of the film base 71 by a method such as electrolytic plating or etching by a printing method. Is formed by.

  A terminal row 73 </ b> A composed of a plurality of terminal portions 73 is formed at one end of the film base 71. The terminal row 73A is patterned so that the terminal portion 73 is connected to each of the plurality of piezoelectric elements 23 (lead electrodes 47) constituting the corresponding piezoelectric element group 230A. Each terminal portion 73 is formed in a state in which a plurality (for example, 720) are arranged in parallel in the Y-axis direction so as to face each of the plurality of piezoelectric elements 23 constituting the corresponding piezoelectric element group 230A. The first wiring pattern 72 includes a plurality of wirings 72a extending from the terminal portions 73 of the terminal row 73A, and the end of each wiring 72a opposite to the terminal portion 73 is the terminal portion 28 of the driver IC 26A. It is connected to the. The driver IC 26A is electrically connected to the piezoelectric element group 230A via the terminal row 73A by connecting each terminal portion 73 to the lead electrodes 47 of the plurality of piezoelectric elements 23 constituting the piezoelectric element group 230A. .

  As shown in FIG. 5, a resin 78 is disposed between the driver IC 26 </ b> A and the film base 71. Thereby, the connection strength between the film base 71 and the driver IC 26A is increased, and the connection state between each terminal portion 28 and each wiring 72a is secured. A ground wiring 76 and an input signal line 78 are connected to the terminal portion 29 of the driver IC 26A. The ground wiring 76 and the input signal line 78 extend to the end portion of the film base 71, and an external signal input portion 77 is formed at one end of the film base 71. An external signal input from the external signal input unit 77 is input to the driver IC 26 </ b> A via the input signal line 78.

  The flexible substrate 27A is bent along the bending line O. As a result, the driver IC 26A is mounted on the flexible substrate 27A on the right side of the bending line O (the region where the terminal row 73A is formed; hereinafter referred to as the connection portion 27b). Thus, regions on the left side of the bending line O (regions where the first wiring pattern 72, the second wiring pattern 74, and the ground wiring 76 are formed; hereinafter referred to as the rising portion 27a) can be raised.

  After the flexible substrate 27A is bent along the bending line O, the connecting portion 27b is inserted into the opening 60 (see FIG. 5). And the terminal part 73 provided in the connection part 27b and the lead electrode 47 of the piezoelectric element 23 are in direct contact, and conduction between the two is achieved. A resin 79 is disposed between the film base 71 and the flow path forming substrate 22 (specifically, the vibration plate 24). Thereby, the connection strength between the film base 71 and the flow path forming substrate 22 is increased, and the connection state between each terminal portion 73 and each lead electrode 47 is ensured.

  As shown in FIG. 5, the resin 65 is disposed between the flexible substrate 27 and the case member 101, and the driver IC 26 </ b> A provided on the flexible substrate 27 thereby holds the holding region of the case member 101. 103 is fixed to the inner side surface 103a of the main body 103 in a state perpendicular to the surface direction (XY plane) of the reservoir forming substrate 25.

  6 illustrates the configuration of the flexible substrate 27A, the configuration of the flexible substrate 27D is the same as that of the flexible substrate 27A. The flexible substrates 27B and 27C have the same configuration as the flexible substrate 27A except that the extending direction of the external signal input unit 77 is different.

  7A is a plan view showing a detailed structure of the terminal portion 73, and FIG. 7B is a cross-sectional view taken along the X-axis direction of FIG. 7A. FIG. 8A and FIG. 8B are explanatory diagrams of a method for forming the terminal portion 73.

  On the surface of the terminal portion 73, thick portions (hereinafter referred to as convex portions 81) and thin portions (hereinafter referred to as concave portions 82) are alternately arranged along the extending direction (X-axis direction) of the terminal portions 73. Is formed. Although not shown in FIG. 5, the terminal portion 73 is conductively connected to the lead electrode 47 by bringing the tip of the convex portion 81 into contact with the lead electrode 47, and the contact area between the terminal portion 73 and the lead electrode 47. Is smaller than when the surface of the terminal portion 73 is formed on a flat surface without the convex portion 81. Therefore, when the terminal portion 73 and the lead electrode 47 are pressed with a pressing tool, the pressing force per unit area increases, so that the terminal portion 73 and the lead electrode 47 can be reliably brought into contact with each other with a small pressing force. It has become.

  The width W1 in the X-axis direction of each protrusion 81 is equal to each other, and the width W2 in the X-axis direction of the recess 82 between the protrusions 81 is also equal to each other. In the present embodiment, both W1 and W2 are 30 μm, but the lengths of W1 and W2 are not limited to this. Although the five convex parts 81 are formed per terminal part, the number of the convex parts 81 is not limited to this. The convex portions 81 are arranged in the X-axis direction at a constant interval Wp (= W1 + W2).

  The uneven shape on the surface of the terminal portion 73 is formed by using a processing tool 90 as shown in FIG. The processing tool 90 has a plurality of convex portions 91 formed on the surface of a metal member such as SUS. Each convex portion 91 is arranged along the X-axis direction so as to face the terminal portion 73 of the flexible substrate. The width of each protrusion 91 in the X-axis direction is W2, and the width of the recess 92 between the protrusions 91 in the X-axis direction is W1. The depth D2 of the recess 92 in the Z direction is greater than the height D1 of the protrusion 81 formed in the terminal portion 73 in the Z direction. As shown in FIG. 8B, the processing tool 90 presses the convex portion 91 against the surface of the terminal portion 73 formed to have a uniform thickness by electrolytic plating or the like (press processing). A concave / convex shape composed of convex portions 81 and concave portions 82 is formed on the surface.

  9 to 12 are schematic views for explaining a part of the manufacturing process of the droplet discharge head (OLB mounting process). In the following description, the procedure for connecting the driver IC 26 and the piezoelectric element 23 will be mainly described. Of the droplet discharge head 1, the nozzle substrate 21, the flow path forming substrate 22, the reservoir forming substrate 25, the case member 101, the piezoelectric member, and the like. It is assumed that the manufacture, connection, and arrangement of the element 23 and the like have already been completed.

  The driver IC 26 and the piezoelectric element 23 are connected using a pressing device 200 shown in FIG. The pressing device 200 includes a bonding stage 202. The bonding stage 202 can be positioned in the XYθ axis direction by an XYθ axis stage (not shown). Above the bonding stage 202, a camera 204 that photographs the base 1A before mounting the flexible substrate, which is the connection component 210, is provided. A connecting component 210 is mounted on the bonding stage 202 with the lead electrode facing upward, and the camera 204 is installed with the optical axis vertically downward. As a result, the position of the connection component 210 on the bonding stage 202 (specifically, the lead electrode 47 of the connection component 210) can be recognized.

  A pressing tool 201 is provided adjacent to the bonding stage 202. The pressing tool 201 is movable in the X-axis direction and the Z-axis direction by an unillustrated XZ-axis stage. At the lower end of the pressing tool 201, means for vacuum-adsorbing the flexible substrate 27 and means for heating are provided. Reference numeral 201 </ b> A is a pressing surface 201 </ b> A that presses the terminal portion 73 of the flexible substrate 27 onto the lead electrode 47 of the connection component 210 while adsorbing the surface opposite to the mounting surface of the driver IC 26 of the flexible substrate 27. is there. The pressing tool 201 heats and cures the resin 79 disposed between the flexible substrate 27 and the connection component 210 while heating the flexible substrate 27 onto the connection component 210 by the pressing surface 201A. Below the pressing tool 201, a camera 203 that photographs the terminal portion 73 of the flexible substrate 27 is installed with the optical axis vertically upward. Thereby, the position of the pressing tool 201 on the XZ axis stage (specifically, the terminal portion 73 of the flexible substrate 27 attracted to the lower end portion of the pressing tool 201) can be recognized.

  Reference numeral 205 denotes a control device that comprehensively controls each component of the pressing device 200. The control device 205 detects the position of the terminal portion 73 of the flexible substrate 27 and the position of the lead electrode 47 of the connection component 210 based on images taken by the camera 203 and the camera 204. Based on the detected position, the movement amount of the XYθ axis stage and the movement amount of the XZ axis stage are calculated.

  First, as shown in FIG. 10, the control device 205 calculates the movement amount of the XYθ axis stage and the movement amount of the XZ axis stage based on images taken by the camera 203 and the camera 204. Then, the XYθ axis stage and the XZ axis stage are driven based on the calculated movement amount, and the terminal portion 73 of the flexible substrate 27 is moved onto the lead electrode 47 of the connection component 210. Then, the pressing tool 201 is lowered by the XZ axis stage, and the terminal portion 73 of the flexible substrate 27 is pressed onto the lead electrode 47 of the connection component 210.

  A resin 79 is disposed between the flexible substrate 27 and the connection component 210. The pressing tool 201 abuts the terminal portion 73 of the flexible substrate 27 and the lead electrode 47 of the connection component 210 while pushing away the resin 79. Then, the pressing surface 201A is heated in a state where the terminal portion 73 of the flexible substrate 27 and the lead electrode 47 of the connection component 210 are in contact with each other, and the resin 79 is cured.

  FIG. 11 and FIG. 12 are schematic views of a connection portion between the terminal portion 73 and the lead electrode 47. FIG. 11 is a schematic view when the width Wt of the pressing surface 201A in the X-axis direction is set regardless of the interval Wp between the convex portions 81 of the terminal portion 73, and FIG. 12 shows the width of the pressing surface 201A in the X-axis direction. FIG. 6 is a schematic diagram when Wt is set to a natural number multiple of the interval Wp between the convex portions 81 of the terminal portion 73.

  First, as shown in FIG. 11, a case is considered where the width Wt of the pressing surface 201A is not set to a natural number times the interval Wp of the convex portions 81 (Wr ≠ a × Wp; a is a natural number).

  As described above, the convex portion 81 is formed on the surface of the terminal portion 73. Therefore, when the flexible substrate 27 is pressed with the pressing tool 201, the tip of the convex portion 81 of the terminal portion 73 comes into contact with the lead electrode 47, and that portion becomes the pressing portion. Since only the convex portion 81 is in contact with the lead electrode 47, the area of the pressing portion is smaller than when the convex portion 81 is not provided. Therefore, the load applied by the pressing tool 201 per unit area of the pressing portion is larger than that when the convex portion 81 is not provided. As a result, it is possible to reliably connect the terminal portion 73 and the lead electrode 47 with a small load.

  However, when the plurality of convex portions 81 are provided on the surface of the terminal portion 73, the following problem occurs. That is, when the flexible substrate 27 is sucked by the pressing tool 201, it is difficult to accurately control the position of the pressing surface 201A of the pressing tool 201 and the position of the convex portion 81. Therefore, as shown in FIGS. 11A and 11B, the position of the pressing tool 201 may be slightly shifted in the arrangement direction of the convex portions 81. For example, when the pressing tool 201 is disposed at the position shown in FIG. 11A, the number of convex portions 81 pressed by the pressing tool 201 is one. Therefore, the area of the pressing part is the area of one convex part. Therefore, the load per unit area of the pressing portion is increased, and the convex portion 81 and the lead electrode 47 can be reliably connected by pushing the resin 79 away. On the other hand, when the pressing tool 201 is disposed at the position shown in FIG. 11B, the number of convex portions 81 pressed by the pressing tool 201 is two. Therefore, the area of the pressing portion is the area of two convex portions. Therefore, the load per unit area of the pressing portion is reduced, and there is a possibility that the convex portion 81 and the lead electrode 47 cannot be brought into contact by pushing the resin 79 away.

  On the other hand, as shown in FIG. 12, consider a case where the width Wt of the pressing surface 201A is set to a natural number times the interval Wp of the convex portions 81 (Wr = a × Wp; a is a natural number).

  In this case, for example, when the pressing tool 201 is arranged at the position of FIG. 12A, the number of convex portions 81 pressed by the pressing tool 201 is two. Therefore, the area of a press part is an area for two convex parts. Even when the pressing tool 201 is arranged at the position of FIG. 12B, the number of convex portions 81 pressed by the pressing tool 201 is two. Therefore, the area of the pressing part is the area of two convex parts. Therefore, when the width Wt of the pressing surface 201A of the pressing tool 201 is set to a natural number multiple of the interval Wp between the convex portions 81, even when the position of the pressing tool 201 is shifted in the arrangement direction of the convex portions 81, The number of convex portions 81 pressed by 201 does not change. Therefore, the load per unit area is constant regardless of the displacement of the pressing tool 201, and it is possible to always press with the same load. Therefore, there is less possibility of poor conduction.

  In the pressing tool 201 of this embodiment, the width Wt of the pressing surface 201A of the pressing tool 201 is set to a natural number times the interval Wp of the convex portions 81 as shown in FIG. In the droplet discharge head 1 in which the terminal portion 73 and the lead electrode 47 are pressed using the pressing tool 201, the length of the pressing portion between the terminal portion 73 and the lead electrode 47 in the X-axis direction is a convex portion. 81 has a connection structure that is a natural number multiple of the interval Wp in the X-axis direction. Therefore, even if the pressing portion between the terminal portion 73 and the lead electrode 47 is displaced in the extending direction of the terminal portion 73, the area of the pressing portion between the terminal portion 73 and the lead electrode 47 does not change. Therefore, the magnitude of the load per unit area of the pressing portion becomes constant, and the occurrence of poor conduction is suppressed. Thereby, the highly reliable droplet discharge head 1 is obtained.

[Modification 1]
9 and 10, only the pressing process between the terminal portion 73 and the lead electrode 47 is shown. An uneven shape is formed on the surface of the terminal portion 73 by the processing tool 90 shown in FIG. This uneven shape forming step may be incorporated into a part of the manufacturing process of the droplet discharge head as a step preceding the step of connecting the driver IC 26 and the piezoelectric element 23. That is, a processing device that processes the surface of the terminal portion 73 using the processing tool 90 may be incorporated as a part of the pressing device 200. According to this configuration, before pressing the terminal portion 73 against the lead electrode 47, the interval Wp between the convex portions 81 on the surface of the terminal portion 73 can be adjusted by the pressing tool 90.

  This configuration has the following advantages. For example, when the flexible substrate 27 having the terminal portion 73 having the convex portion 81 formed on the surface is purchased and the interval Wp of the convex portion 81 cannot be arbitrarily changed, the preset convex portion It is necessary to select the pressing tool 201 having a specific pressing surface 201A width Wt in accordance with the interval Wp of 81. However, when the interval Wp between the convex portions 81 can be adjusted using the processing tool 90, the interval Wp between the convex portions 81 may be adjusted according to the width Wt of the pressing surface 201A of the pressing tool 201. The range of choices expands.

[Modification 2]
In FIG. 12, the number of the convex portions 81 formed on the surface of the terminal portion 73 is m, and the length Wt of the pressing surface 201A of the pressing tool 201 in the X-axis direction is n of the interval Wp in the X-axis direction of the convex portions 81. When doubling (m and n are natural numbers), m is 5 and n is 2. However, the combination of m and n is not limited to this. It suffices for m and n to satisfy the relationship m> n. Thereby, even if the pressing position of the pressing tool 201 is slightly shifted, it is possible to reliably press the arrangement area of the convex portion 81.

[Modification 3]
In FIG. 7, the width W1 of the convex portion 81 in the X-axis direction is equal to the width W2 of the concave portion 82 in the X-axis direction. However, the widths W1 and W2 are not necessarily equal. For example, by making the width W1 of the convex portion in the X-axis direction smaller than the width W2 of the concave portion 82 in the X-axis direction, the load per unit area of the pressing portion can be further increased.

[Droplet discharge device-1]
FIG. 13 is a schematic perspective view of a first embodiment of a droplet discharge apparatus including the droplet discharge head 1. A droplet discharge device IJ in FIG. 13 discharges ink (functional liquid) for device manufacture from the droplet discharge head 1 and is used to form a color filter, a metal wiring, and the like.

  The droplet discharge device IJ includes a droplet discharge head 1, a drive shaft 4, a guide shaft 5, an external controller CT, a stage 7, a cleaning mechanism 8, a base 9, and a heater 6. . The droplet discharge head 1 is attached to a droplet discharge device IJ via a case member 101 in a carriage (not shown). The stage 7 supports the substrate P from which the functional liquid is discharged by the droplet discharge head 1, and includes a fixing mechanism (not shown) that fixes the substrate P at a reference position. The functional liquid is discharged from the nozzle opening of the droplet discharge head 1 onto the substrate P supported by the stage 7.

  A drive motor 2 is connected to the drive shaft 4. The drive motor 2 is composed of a stepping motor or the like. When a drive signal in the Y-axis direction is supplied from the external controller CT, the drive shaft 4 is rotated. When the drive shaft 4 rotates, the droplet discharge head 1 moves in the Y-axis direction. The guide shaft 5 is fixed so as not to move with respect to the base 9. The stage 7 includes a drive motor 3. The drive motor 3 is composed of a stepping motor or the like. When a drive signal in the X-axis direction is supplied from the external controller CT, the stage 7 is moved in the X-axis direction.

  The external controller CT supplies a voltage for controlling droplet ejection to the droplet ejection head 1. The external controller CT supplies a drive pulse signal for controlling the movement of the droplet discharge head 1 in the Y-axis direction to the drive motor 2 and moves the stage 7 in the X-axis direction to the drive motor 3. A drive pulse signal to be controlled is supplied.

The cleaning mechanism 8 cleans the droplet discharge head 1 and includes a drive motor (not shown). By driving the drive motor, the cleaning mechanism 8 moves in the X-axis direction along the guide shaft 5. The movement of the cleaning mechanism 8 is also controlled by the external controller CT. Here, the heater 6 is means for heat-treating the substrate P by lamp annealing, and evaporates and dries the solvent contained in the functional liquid applied on the substrate P. The power on and off of the heater 6 is also controlled by the external controller CT.
The droplet discharge device IJ discharges droplets onto the substrate P while relatively scanning the droplet discharge head 1 and the stage 7 that supports the substrate P.

  The functional liquid discharged from the droplet discharge head 1 includes a liquid crystal display device forming material for forming a liquid crystal display device, an organic EL forming material for forming an organic EL display device, and a wiring pattern of an electronic circuit. It includes a wiring pattern forming material for forming. Thereby, the droplet discharge apparatus IJ can manufacture each of the devices with the functional liquid discharged based on the droplet discharge method.

  As described above, the droplet discharge device IJ includes the highly reliable droplet discharge head 1 having excellent conduction reliability between the flexible substrate 27 and the piezoelectric element 23. Therefore, long-term reliability is ensured.

[Droplet discharge device-2]
FIG. 14 is a schematic perspective view of a second embodiment of the droplet discharge device including the droplet discharge head 1. A droplet discharge device 600 shown in FIG. 14 discharges ink for printing from the droplet discharge head 1 and is used for printing on a recording medium such as paper.

  The droplet discharge device 600 includes an apparatus main body 620, a tray 621 on which the recording paper P is placed, and a discharge port 622 for discharging the recording paper P, and an operation panel 670 on the upper surface of the apparatus main body 620. Yes. The operation panel 670 is composed of, for example, a liquid crystal display, an organic EL display, an LED lamp, and the like. A display unit (not shown) for displaying an error message and the like, and an operation unit (not shown) including various switches and the like. Z)). Inside the apparatus main body 620, there are mainly a printing apparatus 640 provided with a reciprocating head unit 630, a paper feeding apparatus 650 for feeding the recording paper P one by one to the printing apparatus 640, the printing apparatus 640 and the paper feeding apparatus. A control device 660 for controlling 650 is provided.

  Under the control of the control device 660, the paper feeding device 650 intermittently feeds the recording paper P one by one. The recording paper P that is intermittently fed passes near the lower portion of the head unit 630. At this time, the head unit 630 reciprocates in a direction substantially perpendicular to the feeding direction of the recording paper P, and printing on the recording paper P is performed. That is, the reciprocation of the head unit 630 and the intermittent feeding of the recording paper P are the main scanning and the sub-scanning in printing, and ink jet printing is performed.

  The printing apparatus 640 includes a head unit 630, a carriage motor 641 serving as a drive source for the head unit 630, and a reciprocating mechanism 642 that reciprocates the head unit 630 in response to the rotation of the carriage motor 641. . In the lower part of the head unit 630, a droplet discharge head 1 having a large number of nozzle openings 15, an ink cartridge 631 that supplies ink to the droplet discharge head 1, and the droplet discharge head 1 and the ink cartridge 631 are mounted. And a carriage 632. By using an ink cartridge 631 filled with ink of four colors of yellow, cyan, magenta, and black (black), full-color printing is possible. In this case, the head unit 630 is provided with the droplet discharge heads 1 corresponding to the respective colors.

  The reciprocating mechanism 642 includes a carriage guide shaft 643 whose both ends are supported by a frame (not shown), and a timing belt 644 extending in parallel with the carriage guide shaft 643. The carriage 632 is supported by the carriage guide shaft 643 so as to be able to reciprocate and is fixed to a part of the timing belt 644. When the timing belt 644 travels forward and backward through a pulley by the operation of the carriage motor 641, the head unit 630 reciprocates while being guided by the carriage guide shaft 643. During this reciprocation, ink is appropriately discharged from the droplet discharge head 1 and printing on the recording paper P is performed.

  The sheet feeding device 650 includes a sheet feeding motor 651 as a driving source and a sheet feeding roller 652 that rotates by the operation of the sheet feeding motor 651. The paper feed roller 652 is composed of a driven roller 652a and a drive roller 652b that are vertically opposed to each other with a feeding path (recording paper P) of the recording paper P interposed therebetween. The drive roller 652b is a paper feed motor 651. It is connected to. With such a configuration, the paper feed roller 652 can feed a large number of recording sheets P installed on the tray 621 one by one toward the printing apparatus 640. Instead of the tray 621, a configuration in which a paper feed cassette that stores the recording paper P can be detachably mounted may be employed.

  The control device 660 performs printing by controlling the printing device 640, the paper feeding device 650, and the like based on print data input from a host computer such as a personal computer or a digital camera.

  As described above, the droplet discharge device 600 includes the highly reliable droplet discharge head 1 having excellent conduction reliability between the flexible substrate 27 and the piezoelectric element 23. Therefore, long-term reliability is ensured.

DESCRIPTION OF SYMBOLS 1 ... Droplet discharge head, 22 ... Flow path formation board | substrate (1st board | substrate), 23 ... Piezoelectric element (drive element), 25 ... Reservoir formation board | substrate (2nd board | substrate), 26, 26A, 26B, 26C, 26D ... Driver IC (drive circuit part), 27, 27A, 27B, 27C, 27D ... flexible substrate, 47 ... lead electrode (electrode), 72a ... wiring, 73 ... terminal part, 81 ... convex part, 90 ... pressure tool, DESCRIPTION OF SYMBOLS 200 ... Pressing device, 201 ... Pressing tool, 201A ... Pressing surface, 600 ... Droplet ejection device, IJ ... Droplet ejection device, W1 ... Length of convex part in X axis direction, W2 ... X of concave part between convex parts Axial length, Wp: spacing of convex portions in X-axis direction, Wt: length of pressing surface in X-axis direction

Claims (10)

Including a step of pressing the terminal portion having a plurality of convex portions formed on the surface against the electrode with a pressing tool,
The plurality of convex portions are arranged at predetermined intervals in the extending direction of the terminal portion,
The lengths in the extending direction of the plurality of convex portions are equal to each other,
The pressing tool has a pressing surface that presses the terminal portion toward the electrode,
A length of the pressing surface in the extending direction is a natural number times the predetermined interval.   When the number of convex portions formed on the surface of the terminal portion is m and the length of the pressing surface in the extending direction is n times the predetermined interval (m and n are natural numbers), m The pressing method according to claim 1, wherein a relationship of> n is satisfied.   The pressing method according to claim 2, wherein a length of the convex portion in the extending direction is equal to or less than a length of the concave portion between the convex portions in the extending direction.   The method according to claim 3, further comprising: pressing the plurality of convex portions on the surface of the terminal portion using a processing tool before pressing the terminal portion against the electrode with the pressing tool. Pressing method. The terminal portion is formed on the surface of the flexible substrate,
The pressing surface of the pressing tool is a surface that contacts the surface opposite to the surface on which the terminal portion of the flexible substrate is formed and presses the surface toward the electrode,
The pressing method according to claim 1, wherein a length of the pressing surface in the extending direction is a natural number multiple of the predetermined interval. Including a pressing tool for pressing the terminal portion having a plurality of convex portions formed on the surface against the electrode;
The plurality of convex portions are arranged at predetermined intervals in the extending direction of the terminal portion,
The lengths in the extending direction of the plurality of convex portions are equal to each other,
The pressing tool has a pressing surface that presses the terminal portion toward the electrode,
A length of the pressing surface in the extending direction is a natural number multiple of the predetermined interval.   The pressing device according to claim 6, further comprising a processing tool that presses the plurality of convex portions on a surface of the terminal portion. A connection structure in which a terminal portion having a plurality of convex portions formed on the surface is pressed and connected to an electrode,
The plurality of convex portions are arranged at predetermined intervals in the extending direction of the terminal portion,
The lengths in the extending direction of the plurality of convex portions are equal to each other,
The connection structure according to claim 1, wherein a length of the pressing portion where the terminal portion and the electrode are pressed is a natural number multiple of the predetermined interval. A first substrate;
A driving element formed on the first substrate;
A second substrate provided on the drive element side of the first substrate;
A drive circuit unit for driving the drive element;
A flexible substrate on which wiring for connecting the driving element and the driving circuit unit is formed,
A terminal portion connected to the electrode of the driving element is formed at the end of the wiring,
A plurality of convex portions are formed on the surface of the terminal portion,
The plurality of convex portions are arranged at predetermined intervals in the extending direction of the terminal portion,
The lengths in the extending direction of the plurality of convex portions are equal to each other,
The droplet discharge head according to claim 1, wherein a length of the pressing portion where the terminal portion and the electrode are pressed is a natural number multiple of the predetermined interval.   A droplet discharge apparatus comprising the droplet discharge head according to claim 9.

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