JP2011216831A - Boil cooling device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To secure sufficient natural convection wind to improve cooling capacity without using forced air cooling by a fan, in a boil cooling device for cooling a heating element by boil and condensation of a cooling medium.SOLUTION: This boil cooling device includes: a cooling tank 6 filled with a cooling medium 5 to be boiled and evaporated by absorbing heat of a control substrate 4 mounted in a communication instrument 1; and a radiator 7 for cooling and liquefying the cooling medium 5 boiled and evaporated in the cooling medium tank 6. Here, the radiator 7 is formed of a hollow cooling medium duct 8 having an annular passage cross section for running the cooling medium 5, and the cooling medium flowing through the hollow cooling medium duct 8 is cooled by rising air generated by chimney effect in an inner peripheral side space part 13 of the hollow cooling medium duct 8, whereby cooling capacity can be improved by securing sufficient natural convection wind.

Description

  The present invention relates to a boiling cooling device that cools a heating element by boiling and condensing refrigerant.

  In recent years, in order to reduce the size and performance of electronic devices, the amount of heat generated by high-speed processing of semiconductor components and the high-density mounting on control boards have progressed, and the amount of heat generated from electronic devices has increased dramatically. ing. In addition, in order to respond to global communication demands, communication devices equipped with high heat-generating parts such as semiconductor parts are increasingly installed on top of steel towers built outdoors such as forests away from urban areas. A cooling device mounted on such an outdoor-installed communication device is required to improve durability in order to reduce the maintenance work as well as to improve the cooling performance to cope with an increase in heat generation. In response to such a demand, a boiling cooling device is known that cools the vaporized refrigerant by natural convection instead of forced air cooling by a fan (for example, Patent Document 1).

  Hereinafter, a conventional boiling cooling apparatus will be described with reference to FIG.

  As shown in FIG. 15, the boiling cooling apparatus 101 includes a heating element 102 that is used in an electric circuit or the like and generates heat when driven, and a refrigerant that encloses the refrigerant that absorbs the heat of the heating element 102 and vaporizes it. A tank 103 and a radiator 104 planted above the refrigerant tank 103 are provided. The radiator 104 is configured by arranging a plurality of radiating cylinders 105 made of a hollow cylinder having a flat cross section at a predetermined interval in parallel, and these radiating cylinders 105 are closed at the upper end and are connected to the refrigerant tank 103 at the lower end. Since the openings are opened, the refrigerant that has been boiled and evaporated by the heat of the heating element 102 rises and is introduced into the heat radiating cylinder 105. The heat radiating cylinder 105 receives heat from the refrigerant vapor and dissipates the heat into the atmosphere. The refrigerant that has been deprived of heat is liquefied, dropped inside the heat radiating cylinder 105, and returned to the refrigerant tank 103. Since the radiating cylinder 105 is planted in a vertical state so that the flat surfaces are set to face each other in parallel at a predetermined interval, the air receiving heat from the outer peripheral surface of each radiating cylinder 105 rises at a high temperature. In addition, heat is released to the atmosphere by efficient natural convection.

JP-A-8-31996

  In such a conventional boiling cooling device, a radiator tube having a flat cross section is arranged in parallel so as to face each other at a predetermined interval, and heat is radiated from both sides to the air between the radiator tubes to raise the temperature of the air. Although natural convection is promoted, there is a limit to the temperature rise of air because it only dissipates heat from two directions, and it is difficult to secure a temperature difference to obtain the necessary natural convection air. Since the refrigerant tank is installed in this area, it resists air flow and obstructs natural convection, so that sufficient natural convection air cannot be secured against an increase in the amount of heat generated, resulting in insufficient cooling capacity. There was a problem.

  Therefore, the present invention solves the above-described conventional problems, and provides a boiling cooling device that can secure sufficient natural convection air and improve cooling capacity without using forced air cooling by a fan. Objective.

  In order to achieve this object, the present invention is attached to an electronic device having a heating element that generates a large amount of heat when driven, and encloses a refrigerant that evaporates and absorbs the heat of the heating element. A refrigerant tank, and a radiator that cools and liquefies the refrigerant that has boiled and evaporated in the refrigerant tank, and the radiator includes a hollow refrigerant pipe having an annular channel cross section through which the refrigerant flows. The refrigerant flowing in the hollow refrigerant pipe is cooled by the rising airflow generated by the chimney effect in the inner circumferential space, thereby achieving the intended purpose.

  According to the present invention, the refrigerant flowing in the hollow refrigerant pipe is cooled by the ascending air flow generated by the chimney effect in the inner circumferential space of the hollow refrigerant pipe having an annular channel cross section through which the refrigerant flows. Without using forced air cooling by a fan, it is possible to obtain an effect of ensuring sufficient natural convection air by the chimney effect and improving the cooling capacity.

The block diagram which shows the installation state of the communication apparatus of Embodiment 1 of this invention The perspective view which shows the communication apparatus and boiling cooling device of Embodiment 1 The block diagram which shows the schematic cross section of the communication apparatus of the same Embodiment 1, and a boiling cooling device The block diagram which shows the flow-path cross section of the hollow refrigerant | coolant pipe line of Embodiment 1 ((a) The block diagram which shows the flow-path cross section in case the flow-path cross-sectional shape is annular | circular shape, (b) The flow-path cross-sectional shape is a rectangular ring shape Configuration diagram showing the cross section of the flow path in the case of The graph which shows the relationship between the equivalent diameter dimension of the inner peripheral side space part of the Embodiment 1, and the wind speed of the updraft produced by the chimney effect in the inner peripheral side space part The block diagram which shows the flow-path cross section of the hollow refrigerant pipe of the Embodiment 1 ((a) The block diagram which shows the flow-path cross section at the time of providing a narrow groove in a refrigerant flow path internal peripheral surface, (b) Refrigerant flow path Configuration diagram showing a channel cross section when a narrow groove is provided on the outer peripheral surface, (c) Configuration diagram showing a channel cross section when a radiating fin is provided on the inner circumferential space side, (d) Heat radiation on the outer circumference side Configuration diagram showing the cross section of the flow path when fins are provided) The block diagram which shows the cross section of the hollow refrigerant | coolant pipeline of Embodiment 1 ((a) The block diagram which shows the flow path cross section at the time of dividing | segmenting a refrigerant flow path into plurality in the flow direction of a refrigerant | coolant, (b) Configuration diagram showing a longitudinal section when a current plate is formed so that the refrigerant flows uniformly in each) Partial front schematic view of the hollow refrigerant conduit of the first embodiment ((a) schematic partial front view when a spiral flow path forming plate is provided in the hollow refrigerant conduit, (b) in the hollow refrigerant conduit (Partial front schematic diagram when a stair-shaped channel forming plate is provided) The block diagram which shows the communication apparatus and boiling cooling device of Embodiment 1 Schematic configuration diagram of a boiling cooling device according to a second embodiment of the present invention ((a) Configuration diagram showing a longitudinal section of the boiling cooling device, (b) Configuration diagram showing an upper surface of the boiling cooling device) The schematic block diagram of the boiling cooling device of Embodiment 3 of this invention ((a) The block diagram which shows the longitudinal cross-section of a boiling cooling device, (b) The block diagram which shows the upper surface of a boiling cooling device) The block diagram which shows the hollow refrigerant pipe of Embodiment 4 of this invention ((a) The block diagram which shows the boiling cooling device at the time of providing a circular hole in a hollow refrigerant pipe, (b) In a hollow refrigerant pipe Configuration diagram showing a boil cooling device with a rectangular hole) The block diagram which shows the communication apparatus and boiling cooling device of Embodiment 5 of this invention The block diagram which shows the communication apparatus and boiling cooling device of Embodiment 6 of this invention Schematic configuration diagram of a conventional boiling cooling device

  The boiling cooling device according to claim 1 of the present invention is attached to an electronic device having a heating element that generates a large amount of heat when driven and encloses a refrigerant that absorbs the heat of the heating element and evaporates in a boiling state. A tank, and a radiator that cools and liquefies the refrigerant that has boiled and evaporated in the refrigerant tank, the radiator including a hollow refrigerant pipe having an annular channel cross section through which the refrigerant flows, and the inside of the hollow refrigerant pipe The refrigerant flowing through the hollow refrigerant pipe is cooled by an updraft generated by the chimney effect in the circumferential space.

  As a result, the chimney effect, that is, the refrigerant that has boiled and evaporated by absorbing the heat of the heating element in the refrigerant tank flows through the annular channel of the hollow refrigerant channel, and the inner periphery of the hollow refrigerant channel via the inner peripheral wall surface of the annular channel. By radiating heat to the side space, the air temperature in the inner space increases and a temperature difference with the air outside the hollow refrigerant pipe is generated. As the high-temperature air in the section rises and is replaced with the low-temperature air outside the hollow refrigerant pipe, an updraft is generated, so that sufficient natural convection air can be obtained and the cooling capacity can be improved.

  The hollow refrigerant pipe is provided with a refrigerant inlet into which refrigerant flows in and a refrigerant outlet through which refrigerant flows out at both ends of the hollow refrigerant pipe, respectively, so that the refrigerant inlet is located above the refrigerant outlet. The refrigerant condensed and liquefied by flowing through the hollow refrigerant pipe quickly moves downward due to the difference in specific gravity with the gas-phase refrigerant and flows out from the refrigerant outlet. A decrease in cooling performance can be suppressed.

  And a refrigerant vapor pipe communicating with the refrigerant tank and the refrigerant inlet, and a refrigerant liquid pipe communicating with the refrigerant tank and the refrigerant outlet, the refrigerant vapor pipe and the refrigerant liquid pipe being connected to the inner peripheral side of the hollow refrigerant pipe If it is configured to be arranged on the outer peripheral side of the hollow refrigerant pipe so as not to hinder the rising airflow generated in the space, it is possible to suppress a decrease in cooling performance due to a decrease in natural convection due to an increase in air resistance. it can.

  Further, if the cross-sectional area of the refrigerant vapor pipe is made larger than the cross-sectional area of the refrigerant liquid pipe, the pressure loss of the refrigerant vapor pipe through which the gas phase refrigerant having a large specific volume flows and the liquid having a small specific volume are obtained. The difference in pressure loss of the refrigerant liquid pipe through which the phase refrigerant flows can be reduced, and stable refrigerant circulation can be promoted to improve the cooling capacity.

  Moreover, if the cross-sectional shape of the hollow refrigerant pipe is formed in an annular shape, the ventilation resistance of the inner circumferential space of the hollow refrigerant pipe can be reduced, and the deterioration of the cooling performance due to the reduction of natural convection air is suppressed. can do.

  Further, if the cross-sectional shape of the hollow refrigerant pipe is formed in a rectangular ring shape, the heat transfer area within a predetermined effective space volume can be increased, and the amount of heat released to the inner space of the hollow refrigerant pipe is increased. Therefore, the natural convection wind due to the chimney effect increases and the cooling capacity can be improved.

  Further, if the refrigerant flow path in the hollow refrigerant pipe is divided in the flow direction, there is no movement of refrigerant between the divided flow paths, and refrigerant drift in the refrigerant flow path cross-sectional direction can be suppressed.

  And if it is set as the structure which forms a baffle plate so that a refrigerant | coolant may flow uniformly to each of the divided | segmented refrigerant | coolant flow path, the uniform heat dissipation from a refrigerant | coolant will be attained and the chimney effect can be improved more.

  In addition, if the refrigerant flow path in the hollow refrigerant pipe is formed in a spiral shape, the refrigerant flows along the spiral path, so that the refrigerant flow rate is not uniform in the cross-sectional direction of the hollow refrigerant pipe. A decrease in cooling capacity can be suppressed.

  In addition, if the refrigerant flow path of the hollow refrigerant pipe is formed in a staircase shape, the refrigerant flows along the stair path, so that the cooling capacity by non-uniform refrigerant flow rate in the cross-sectional direction of the flow path of the hollow refrigerant pipe Can be suppressed.

  Moreover, if it is set as the structure which forms a thin groove | channel in the internal peripheral surface of the refrigerant flow path of a hollow refrigerant pipe line, heat transfer with a refrigerant | coolant and a hollow refrigerant pipe inner wall surface can be accelerated | stimulated, and cooling capacity can be improved.

  Moreover, if it is set as the structure which forms a narrow groove in the outer peripheral surface of the refrigerant flow path of a hollow refrigerant pipe line, heat transfer with a refrigerant | coolant and a hollow refrigerant pipe outer wall surface can be accelerated | stimulated, and cooling capacity can be improved.

  In addition, if the structure is such that the radiating fins are formed in the inner circumferential space portion of the hollow refrigerant pipe, the heat transfer between the wall surface facing the inner circumferential space portion and the air in the inner circumferential space portion is promoted for cooling. Ability can be improved.

  Further, if the configuration is such that the radiating fins are formed on the outer peripheral side of the hollow refrigerant pipe, the heat transfer between the hollow refrigerant pipe outer peripheral side wall surface and the air around the hollow refrigerant pipe is promoted to improve the cooling capacity. Can do.

  Also, if the equivalent diameter of the inner circumferential space of the hollow refrigerant pipe is set to 10 mm or more, the wind speed of the updraft generated by the chimney effect is increased to increase the heat radiation amount, thereby improving the cooling capacity. Can do.

  Furthermore, if the equivalent diameter of the inner circumferential space of the hollow refrigerant pipe is set to be less than 40 millimeters, the air flow generated by the chimney effect is increased to increase the heat dissipation and improve the cooling capacity. Can do.

  Further, if the hollow refrigerant pipe is arranged so that the air flow direction in the inner circumferential space of the hollow refrigerant pipe is substantially vertical, the rising air flow generated by the chimney effect is generated in the inner circumferential space. It is possible to suppress an increase in ventilation resistance when passing through the section and suppress a decrease in cooling performance.

  Further, if a plurality of hollow refrigerant pipelines are provided, and the plurality of hollow refrigerant pipelines are arranged side by side so that inner space portions of the plurality of hollow refrigerant pipelines do not overlap each other, Since it is possible to provide a plurality of these hollow refrigerant pipes without disturbing each other the rising airflow generated in the side space, the cooling capacity can be effectively increased without the influence of mutual interference. Can do.

  Moreover, if it is set as the structure which arrange | positions a some hollow refrigerant | coolant pipe line at intervals, the outer peripheral surface of each of a some hollow refrigerant | coolant pipe | tube can be made to act as a thermal radiation surface, and a cooling capability can be improved.

  Moreover, if it is set as the structure which arrange | positions several hollow refrigerant pipes in linear form, it becomes possible to comprise a boiling cooling device thinly and can improve installation property.

  Further, if the plurality of hollow refrigerant pipes are arranged in a ring shape, the air inside the ring of the plurality of hollow refrigerant pipes arranged in the ring shape radiates heat from the annular inner peripheral side wall surface of the hollow refrigerant pipe line. As a result, the temperature rises and a gentle chimney effect is generated, so that the natural convection wind increases and the cooling capacity can be improved.

  In addition, a refrigerant inlet into which a refrigerant flows and a refrigerant outlet from which a refrigerant flows out are provided in each of the plurality of hollow refrigerant pipes, and the vertical positions of the refrigerant inlets are arranged to be the same, If the configuration in which the vertical positions of the refrigerant outlets are also arranged to be the same, the head difference of the plurality of hollow refrigerant pipes is made equal to reduce the variation in the refrigerant flow rate in the plurality of hollow refrigerant pipes, It is possible to suppress a decrease in cooling capacity due to the non-uniform refrigerant flow rate.

  In addition, if a plurality of refrigerant vapor pipes that respectively connect the refrigerant inlets and the refrigerant tanks of the plurality of hollow refrigerant pipes are provided and the lengths of the plurality of refrigerant vapor pipes are the same, Since the lengths of the gas-phase refrigerant paths leading to the plurality of hollow refrigerant pipes are equal, the variation in the refrigerant flow rate in the plurality of hollow refrigerant pipes is reduced, and the deterioration of the cooling capacity due to the uneven refrigerant flow rate is suppressed. be able to.

  Further, if a plurality of refrigerant liquid pipes that respectively connect the refrigerant outlets and the refrigerant tanks of the plurality of hollow refrigerant pipe lines are provided and the lengths of the plurality of refrigerant liquid pipes are the same, a plurality of hollow liquid pipes are provided. Since the length of the liquid-phase refrigerant path from the refrigerant pipe to the refrigerant tank is the same, variation in refrigerant flow in multiple hollow refrigerant pipes is reduced, and the decline in cooling capacity due to uneven refrigerant flow is suppressed. can do.

  A plurality of refrigerant vapor pipes that respectively connect the refrigerant inlets of the plurality of hollow refrigerant pipes and the refrigerant tank; and a plurality of refrigerant liquids that respectively connect the refrigerant outlets of the plurality of hollow refrigerant pipes and the refrigerant tank. If the total length of the refrigerant vapor pipe and the refrigerant liquid pipe connected to the hollow refrigerant pipe is the same, the air from the refrigerant tank to the plurality of hollow refrigerant pipes is provided. The total length of the two-phase refrigerant path and the liquid-phase refrigerant path from the plurality of hollow refrigerant pipes to the refrigerant tank are equal to each other. A decrease in cooling capacity due to the homogenization can be suppressed.

  In addition, a vapor header that connects refrigerant inlets of the plurality of hollow refrigerant pipes and a liquid header that connects refrigerant outlets of the plurality of hollow refrigerant pipes are provided, and the vapor header and the refrigerant tank are connected to the refrigerant vapor pipe. If the liquid header and the refrigerant tank are communicated with each other by a refrigerant liquid pipe, the refrigerant is pressure-equalized in the vapor header and the liquid header, and the variation in the refrigerant flow rate in the plurality of hollow refrigerant pipes is achieved. It is possible to reduce the cooling capacity due to non-uniform refrigerant flow rate.

  In addition, if the connection portion between the steam header and the refrigerant vapor pipe and the connection portion between the liquid header and the refrigerant liquid pipe are configured to face each other in the arrangement direction of the plurality of hollow refrigerant pipes, the vapor header flows into the vapor header. After that, the lengths of the respective refrigerant paths from the inside of each hollow refrigerant pipe to the outflow from the liquid header are equal, so that the variation in the refrigerant flow rate in each refrigerant path is reduced and the refrigerant flow is made non-uniform. A decrease in cooling capacity can be suppressed.

  Further, if the hollow refrigerant pipe is formed by a plurality of hollow pipes, the contact area between the wall surface facing the inner circumferential space and the air in the inner circumferential space increases, and the inner wall of the hollow refrigerant pipe and the hollow The contact area with the refrigerant flowing in the refrigerant pipe increases, and ambient air can be taken in from the middle of the inner space, so heat transfer can be further promoted to improve the cooling capacity. .

  Further, if the hollow refrigerant pipe has a plurality of circular holes, the contact area between the wall surface facing the inner circumferential space and the air in the inner circumferential space increases, and the hollow refrigerant pipe The contact area between the inner wall and the refrigerant flowing in the hollow refrigerant pipe is increased, and ambient air can be taken in from the middle of the inner space, so heat transfer is further promoted to improve the cooling capacity. be able to.

  Further, if the hollow refrigerant pipe is provided with a plurality of rectangular holes, the contact area between the wall surface facing the inner circumferential space and the air in the inner circumferential space increases, and the hollow refrigerant pipe The contact area between the inner wall and the refrigerant flowing in the hollow refrigerant pipe is increased, and it is possible to take in the surrounding air from the middle of the inner space with a simple structure, further enhancing heat transfer and cooling capacity. Can be improved.

  In addition, if the structure is provided with an introduction tube that introduces air from the surroundings into the hollow refrigerant pipe, air from the surroundings can be easily introduced into the inner circumferential space of the hollow refrigerant pipe, and sufficient natural convection wind is obtained. Cooling capacity can be improved.

  Moreover, if it is set as the structure provided with the air quantity adjustment cylinder which adjusts the air which flows in into a hollow refrigerant pipe from the circumference, the air quantity from which the air from the circumference flows into the inner peripheral side space part of a hollow refrigerant pipe will be adjusted. It is possible to prevent the temperature of the communication device from being cooled to a predetermined temperature or higher, and improve the reliability of the boiling cooling device.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

(Embodiment 1)
As shown in FIG. 1, a cellular phone communication device 1, which is one of representative electronic devices, is installed together with an antenna 3 on an upper part of a steel tower 2 built in a suburb of remote areas or in a mountainous forest. The communication device 1 constructs a telephone communication network by performing transmission / reception with a mobile phone which is a terminal through an antenna 3 by radio and relaying a call and communication between the terminals.

  As shown in FIGS. 2 and 3, a control board 4 on which high heat-generating components such as semiconductor components and integrated circuits are mounted at high density is mounted as a heat generator inside the communication device 1. A refrigerant tank 6 in which a refrigerant 5 is sealed is attached to the back side of the substrate 4 in a close contact state. Above the refrigerant tank 6, a radiator 7 for radiating the heat of the refrigerant 5 to the outside is provided, and the radiator 7 has a chimney-like shape having a circular channel cross section through which the refrigerant 5 flows. It consists of a hollow refrigerant pipe 8. The hollow refrigerant pipe 8 is formed so that the flow direction of the refrigerant 5 flowing through the annular channel cross section is the vertical direction.

  In addition, a refrigerant inlet 9 for allowing the refrigerant 5 to flow in is opened on the upper side surface of the hollow refrigerant pipe 8, and a refrigerant outlet 10 through which the refrigerant 5 flows out on the lower side face of the hollow refrigerant pipe 8. Has been established. The refrigerant inlet 9 is connected to the upper part of the refrigerant tank 6 through the refrigerant vapor pipe 11, and the refrigerant outlet 10 is connected to the lower part of the refrigerant tank 6 through the refrigerant liquid pipe 12.

  Here, when the communication device 1 is driven, semiconductor components and integrated circuits mounted on the control board 4 generate heat and generate a large amount of heat. The generated heat is transmitted from the back side of the control board 4 to the inside of the refrigerant tank 6 to heat the refrigerant 5 in the refrigerant tank 6. The refrigerant 5 that has absorbed the heat generated in the control board 4 is boiled and vaporized into a gas state, and flows into the hollow refrigerant pipe 8 from the refrigerant inlet 9 through the refrigerant vapor pipe 11 connected to the upper part of the refrigerant tank 6.

  The gas-phase refrigerant 5 that has flowed into the hollow refrigerant pipe 8 flows through the channel having an annular cross section and radiates heat to the air outside the channel. In particular, since the refrigerant 5 is radiated from the entire surface in the inner circumferential side space 13 of the annular cross-section channel of the hollow refrigerant pipe 8, the air temperature in the inner circumferential side space 13 is around the hollow refrigerant pipe 8. As compared with the air, the density rises and a density difference occurs. Due to this density difference, the air in the inner circumferential side space portion 13 rises, and an updraft 14 due to the so-called chimney effect is generated.

  The refrigerant 5 flowing in the hollow refrigerant pipe 8 is cooled and liquefied by the rising air flow 14. The liquefied refrigerant 5 moves downward in the hollow refrigerant pipe 8 due to its own weight, returns from the refrigerant outlet 10 to the refrigerant tank 6 through the refrigerant liquid pipe 12. The liquid-phase refrigerant 5 that has returned to the refrigerant tank 6 again absorbs heat generated in the control board 4 and evaporates, and flows into the hollow refrigerant pipe 8 from the refrigerant inlet 9 through the refrigerant vapor pipe 11. It is cooled by outside air and liquefied. By repeating such a change in the gas-liquid state of the refrigerant 5, the boiling cooling device 15 operates, and the heat generated by the control board 4 is dissipated to the outside air and processed.

  Here, since the refrigerant inlet 9 is opened above the refrigerant outlet 10, the liquid-phase refrigerant condensed and liquefied in the hollow refrigerant pipe 8 is promptly caused by the difference in specific gravity from the gas-phase refrigerant. The refrigerant moves downward, the refrigerant liquid is prevented from staying, and smooth refrigerant circulation is performed. Also, in the refrigerant tank 6, the connection part of the refrigerant vapor pipe 11 is located above the connection part with the refrigerant liquid pipe 12, so that the gas-phase refrigerant boiled and vaporized by the heat of the control board 4 moves upward without stagnation. The refrigerant flows out of the refrigerant vapor pipe 11 and can smoothly circulate the refrigerant.

  Moreover, since both the refrigerant | coolant vapor pipe | tube 11 and the refrigerant | coolant liquid pipe | tube 12 are provided in the outer peripheral side of the hollow refrigerant pipe line 8, the updraft 14 generate | occur | produced in the inner peripheral side space part 13 is not prevented, and is enough Natural convection winds can be secured. Furthermore, since the flow path cross-sectional area of the refrigerant vapor pipe 11 through which the gas phase refrigerant having a large specific volume flows is larger than the flow path cross-sectional area of the refrigerant liquid pipe 12 through which the liquid phase refrigerant having a small specific volume flows, The pressure loss difference between the refrigerant vapor pipe 11 and the refrigerant liquid pipe is reduced, and stable refrigerant circulation is promoted.

  Further, the chimney-shaped hollow refrigerant pipe 8 is arranged so that the flow direction of the refrigerant 5 flowing through the annular channel cross section is a vertical direction, so that the ascending air flow 14 in the inner circumferential side space portion 13 is reduced. Similarly, since the flow direction is also set to the vertical direction, the rising air flow 14 generated by the chimney effect rises straight, and an increase in ventilation resistance in the inner circumferential space 13 can be suppressed.

  Further, the cross-sectional shape of the flow path of the hollow refrigerant pipe 8 is not limited to the annular shape as shown in FIG. 4A, but can be formed into a rectangular shape as shown in FIG. 4B. When the cross-sectional shape of the flow path of the hollow refrigerant pipe 8 is formed in an annular shape, the ventilation resistance when the ascending air flow 14 passes through the inner circumferential space 13 is reduced, and sufficient natural convection air can be secured. it can. On the other hand, when the cross-sectional shape of the hollow refrigerant pipe 8 is formed in a rectangular ring shape, it becomes easy to increase the heat transfer area facing the inner circumferential space 13 and release to the inner circumferential space 13. The amount of heat can be increased to increase the natural convection wind due to the chimney effect.

  Moreover, it is preferable to set the internal diameter dimension 16 of the inner peripheral side space part 13 shown with an arrow in Fig.4 (a) in the range of 10 millimeters or more and less than 40 millimeters. FIG. 5 shows a relationship between the inner diameter dimension 16 of the inner circumferential space 13 and the wind speed of the ascending air flow 14 generated by the chimney effect in the inner circumferential space 13.

  As apparent from the graph of FIG. 5, when the inner diameter dimension 16 is less than 10 millimeters, the draft resistance during circulation of the updraft 14 increases and the wind speed of the natural convection decreases, and conversely, when the inner diameter dimension 16 is 40 millimeters or more. Further, since heat is not sufficiently released to the central portion of the inner circumferential space 13 and the air temperature does not rise, the amount of natural convection air tends to decrease. As described above, the inner diameter dimension 16 of the inner circumferential side space portion 13 is preferably set to be not less than 10 millimeters and less than 40 millimeters because the chimney effect cannot be sufficiently obtained even if it is too small or too large.

  In addition, when the cross-sectional shape of the flow path of the hollow refrigerant pipe 8 is rectangular, the inner circumferential space 13 is also rectangular. In this case, the equivalent circle diameter is determined from the rectangular dimension of the inner circumferential space 13. The circle equivalent diameter may be calculated and applied as the inner diameter dimension 16.

  Further, the hollow refrigerant pipe 8 is provided with a narrow groove 17 on the inner peripheral surface of the refrigerant channel as shown in FIG. 6A, or the narrow groove 17 is provided on the outer peripheral surface of the refrigerant channel as shown in FIG. It is good also as a structure which provided the radiation fin 18 in the inner peripheral side space part 13 side as shown in FIG.6 (c), or provided the radiation fin 18 in the outer peripheral side as shown in FIG.6 (d).

  As shown in FIG. 6 (a), when the narrow groove 17 is formed on the inner peripheral surface side of the refrigerant flow path of the hollow refrigerant pipe 8, heat transfer between the refrigerant 5 and the inner wall surface of the hollow refrigerant pipe 8 is promoted. As a result, the heat dissipation increases. 6B, when the narrow groove 17 is formed on the outer peripheral surface side of the refrigerant flow path of the hollow refrigerant pipe 8, heat transfer between the refrigerant 5 and the outer wall surface of the hollow refrigerant pipe 8 is achieved. Will be promoted and the amount of heat release will increase.

  Furthermore, as shown in FIG. 6C, when the radiation fin 18 is formed on the inner circumferential side space 13 side of the hollow refrigerant pipe 8, the wall surface and the inner circumferential side space facing the inner circumferential side space 13. Heat transfer with the air in the portion 13 is promoted, and the heat dissipation amount increases. In addition, when the radiating fins 18 are formed on the outer peripheral side of the hollow refrigerant pipe 8 as shown in FIG. 6D, the outer peripheral side wall surface of the hollow refrigerant pipe 8 and the air around the hollow refrigerant pipe Heat transfer is promoted and the amount of heat release increases.

  6 (a) and 6 (c) in which heat transfer with the inner wall surface of the hollow refrigerant pipe 8 is promoted when heat is radiated utilizing the chimney effect of the inner circumferential side space portion 13 is preferred.

  Further, as shown in FIG. 7A, a flow path dividing plate 19 may be provided in the hollow refrigerant pipe 8 so that the hollow refrigerant pipe 8 is divided into a plurality of flow paths in the flow direction of the refrigerant 5. By doing so, there is no movement of the refrigerant between the flow paths divided by the flow path dividing plate 19, and it is possible to suppress the drift of the refrigerant 5 in the direction of the cross section of the refrigerant flow path of the hollow refrigerant pipe 8.

  Further, as shown in FIG. 7B, a rectifying plate 20 is provided in the vicinity of the refrigerant inlet 9 of the hollow refrigerant pipe 8 so that the refrigerant 5 flows uniformly in each of the flow paths divided by the flow path dividing plate 19. It is good. When the rectifying plate 20 is provided in this manner, more uniform heat dissipation from the refrigerant 5 to the inner circumferential space 13 is possible, so that the chimney effect is enhanced and natural convection air can be increased.

  Also, a configuration in which the spiral flow path forming plate 21 shown in FIG. 8A and the stepped flow path forming plate 22 shown in FIG. 8B are provided in the annular refrigerant flow path in the hollow refrigerant pipe 8. It is good. When the spiral flow path forming plate 21 shown in FIG. 8A is provided, the refrigerant flow path in the hollow refrigerant pipe 8 is formed in a spiral shape. As a result, the refrigerant 5 flows and the non-uniformity of the refrigerant flow rate in the cross-sectional direction of the refrigerant flow path of the hollow refrigerant pipe 8 is suppressed, and the residence time of the refrigerant 5 in the hollow refrigerant pipe 8 is lengthened. The amount of heat dissipation increases.

  Further, when the stepped flow path forming plate 22 shown in FIG. 8B is provided, the refrigerant flow path in the hollow refrigerant pipe 8 is formed in a stepped shape. As the refrigerant 5 flows along the refrigerant flow path, the non-uniform refrigerant flow rate in the cross-sectional direction of the refrigerant flow path of the hollow refrigerant pipe 8 is suppressed, and the residence time of the refrigerant 5 in the hollow refrigerant pipe 8 is increased. The amount of heat released to 13 will increase.

  Further, as shown in FIG. 9, the hollow refrigerant pipe 8 may be formed by a plurality of hollow pipes. If it does in this way, the surface area of the wall surface which faces the inner peripheral side space part 13 of the hollow refrigerant pipe line 8 will increase, and a contact area with the air which flows through the inner peripheral side space part 13 will increase. In addition, since the refrigerant 5 flows through the plurality of hollow tubes forming the hollow refrigerant pipe 8, the contact area between the refrigerant 5 and the inner wall of the flow path of the hollow refrigerant pipe 8 is increased. Here, the heat exchange amount is proportional to the temperature difference between the low temperature side fluid and the high temperature side fluid and the area contributing to heat exchange. Thereby, the heat exchange efficiency can be improved and the cooling capacity can be improved.

  Furthermore, since the surrounding air can be taken into the inner space 13 through the gaps of the plurality of hollow tubes, the temperature difference between the temperature of the surrounding air and the temperature of the refrigerant 5 can be kept large, Transmission can be further promoted to improve cooling capacity.

(Embodiment 2)
Next, a second embodiment of the present invention will be described. The same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIGS. 10 (a) and 10 (b), the boiling cooling device 15 includes a plurality of hollow refrigerant pipes 8 having the same length and spaced apart from each other in an annular shape when viewed from above and below. It is arranged. In addition, the plurality of hollow refrigerant pipes 8 are arranged with the height in the vertical direction aligned such that the flow direction of the ascending air flow 14 generated in each inner circumferential space 13 is in the vertical direction. .

  Refrigerant inlets 9 into which the refrigerant 5 flows are respectively opened at the upper side surfaces of the plurality of hollow refrigerant pipes 8, and the refrigerant outlets from which the refrigerant 5 flows out at the lower side surfaces of the plurality of hollow refrigerant pipes 8. 10 are established each. Each of the refrigerant inlets 9 is provided at the same height in the vertical direction, and each of the refrigerant outlets 10 is also provided at the same height in the vertical direction.

  A refrigerant tank 6 attached to the back side of the control substrate 4 that is a heating element is provided at a central portion on the inner peripheral side of the hollow refrigerant pipes 8 arranged in an annular shape when viewed from the vertical direction. The tank 6 is installed so as to be positioned below the hollow refrigerant pipe 8 in the vertical direction.

  A refrigerant vapor pipe 11 is connected to each of the refrigerant inlets 9 of the plurality of hollow refrigerant pipes 8, and the opposite ends of the refrigerant vapor pipes 11 are connected to the upper part of the refrigerant tank 6. Yes. Similarly, a refrigerant liquid pipe 12 is connected to each of the refrigerant outlets 10 of the plurality of hollow refrigerant pipes 8, and the opposite end side of these refrigerant liquid pipes 12 is connected to the lower part of each refrigerant tank 6. It has become. Each of the refrigerant vapor pipes 11 communicating with each of the refrigerant inlet 9 of the hollow refrigerant pipe 8 and the upper part of the refrigerant tank 6 has the same flow path length. Similarly, the refrigerant of the hollow refrigerant pipe 8 The refrigerant liquid pipes 12 communicating with each of the outlets 10 and the lower part of the refrigerant tank 6 all have the same flow path length.

  Here, when the communication device 1 is driven, semiconductor components and integrated circuits mounted on the control board 4 generate heat and generate a large amount of heat. The generated heat is transmitted from the back side of the control board 4 to the inside of the refrigerant tank 6 to heat the refrigerant 5 in the refrigerant tank 6. The refrigerant 5 that has absorbed the heat generated in the control board 4 is boiled and vaporized into a gas state, passes through each of the plurality of refrigerant vapor pipes 11 connected to the upper part of the refrigerant tank 6, and passes through a plurality of hollows from the refrigerant inlet 9. It flows into the refrigerant pipe 8.

  The gas-phase refrigerant 5 that has flowed into each of the plurality of hollow refrigerant pipes 8 arranged in an annular shape flows through each of the annular cross-section channels and radiates heat to the air outside the channels. As in the first embodiment, the inner circumferential space 13 of the annular cross-section flow path of each hollow refrigerant pipe 8 receives heat from the entire surface of the refrigerant 5, and therefore air in the inner circumferential space 13. The temperature rises compared to the air around the hollow refrigerant pipe 8 and a density difference is generated, and the air in the inner circumferential side space portion 13 rises due to this density difference, and a rising air flow 14 is generated by a so-called chimney effect. .

  The plurality of hollow refrigerant pipes 8 are arranged side by side in an annular shape so that the inner circumferential space portions 13 do not overlap each other, and the air flow direction in the inner circumferential space portion 13 is vertical. Therefore, each of the ascending airflows 14 generated by the chimney effect rises straight, and the chimney effect is exhibited to the maximum without affecting each other's airflow.

  Since the plurality of hollow refrigerant pipes 8 are annularly arranged with a space between each other, all the outer peripheral surfaces of the hollow refrigerant pipes 8 act as heat radiation surfaces, and the hollow refrigerant pipe 8 Sufficient heat dissipation can also be performed for the air on the outer peripheral side of the. Furthermore, since the air on the inner circumferential side of the hollow refrigerant pipe 8 receives heat from the wall surface on the inner circumferential side of the plurality of hollow refrigerant pipes 8 from the entire circumferential direction, the outer circumferential side of the hollow refrigerant pipe 8 The temperature rises as compared with the air and a gentle chimney effect is generated to increase the natural convection wind.

  In this way, the refrigerant 5 flowing through the hollow refrigerant pipe 8 is cooled and liquefied by the ascending airflow 14 or the air on the annular inner peripheral side. The liquefied refrigerant 5 moves downward in the hollow refrigerant pipe 8 by its own weight and returns to the refrigerant tank 6 from the refrigerant outlet 10 through the refrigerant liquid pipe 12.

  Here, the refrigerant inlets 9 of the plurality of hollow refrigerant pipes 8 are all opened at the same height in the vertical direction, and similarly, the refrigerant outlets 10 of the plurality of hollow refrigerant pipes 8 are all the same in the vertical direction. Therefore, the head difference in each of the hollow refrigerant pipes 8 is equal, and the variation in the flow rate of the refrigerant flowing through each of the plurality of hollow refrigerant pipes 8 is reduced.

  In addition, since the refrigerant vapor pipes 11 respectively connecting the refrigerant inlets 9 and the refrigerant tanks 6 of the plurality of hollow refrigerant pipes 8 have the same length, they flow through the refrigerant vapor pipes 11. The pressure loss of the gas-phase refrigerant becomes uniform, and the variation in the refrigerant flow rate in the gas-phase refrigerant path is reduced. Similarly, since the refrigerant liquid pipes 12 communicating with the refrigerant outlets 10 of the plurality of hollow refrigerant pipes 8 and the refrigerant tank 6 are all configured to have the same length, the liquid phase flowing through each refrigerant liquid pipe 12 The pressure loss of the refrigerant is also made uniform, and the variation in the refrigerant flow rate in the liquid phase refrigerant path is also reduced.

  That is, the total flow path length of each path from the refrigerant tank 6 through the refrigerant vapor pipe 11 through the hollow refrigerant pipe 8 and back to the refrigerant tank 6 through the refrigerant liquid pipe 12 is the same. Variations in the flow rate of the refrigerant flowing through the hollow refrigerant pipe 8 are reduced, and a decrease in cooling capacity due to non-uniform refrigerant flow rate can be suppressed.

  The liquid-phase refrigerant 5 returned to the refrigerant tank 6 again absorbs heat generated in the control board 4 and evaporates, flows into the plurality of hollow refrigerant pipes 8 through the refrigerant vapor pipes 11, and again flows into the outside air. Cools and liquefies. By repeating such a change in the gas-liquid state of the refrigerant 5, the boiling cooling device 15 operates, and the heat generated by the control board 4 is dissipated to the outside air and processed.

(Embodiment 3)
Next, a third embodiment of the present invention will be described. The same parts as those in the first embodiment and the second embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 11 (a) and FIG. 11 (b), in this boiling cooling device 15, a plurality of hollow refrigerant conduits 8 having the same length are arranged in a straight line when viewed from above and below, The plurality of hollow refrigerant pipes 8 are arranged with the installation height in the vertical direction aligned such that the flow direction of the ascending air flow 14 generated in each inner peripheral space 13 is the vertical direction. . Thus, by arranging the plurality of hollow refrigerant pipes 8 in a straight line, the boiling cooling device 15 is configured to be thin to improve the installation property.

  In addition, refrigerant inlets 9 into which the refrigerant 5 flows are respectively opened on the upper side surfaces of the plurality of hollow refrigerant pipes 8, and cylindrical vapor headers 23 connecting the refrigerant inlets 9 are arranged. Has been. Further, refrigerant outlets 10 through which the refrigerant 5 flows out are respectively opened on the lower side surfaces of the plurality of hollow refrigerant pipes 8, and a cylindrical liquid header 24 that connects each of the refrigerant outlets 10 is provided. Yes.

  Below the plurality of hollow refrigerant pipes 8 connected and fixed by the vapor header 23 and the liquid header 24, a refrigerant tank 6 attached to the back side of the control board 4 as a heating element is disposed. The steam header 23 is connected to the upper part of the refrigerant tank 6 by the steam pipe 11, and the liquid header 24 and the lower part of the refrigerant tank 6 are connected to the upper part of the refrigerant tank 6 by the refrigerant liquid pipe 12.

  In addition, a steam header inlet 25 which is a connection portion between the refrigerant vapor pipe 11 and the vapor header 23 and a liquid header outlet 26 which is a connection portion between the refrigerant liquid pipe 12 and the liquid header 24 are arranged in the arrangement direction of the plurality of hollow refrigerant pipes 8. Are arranged so as to face each other.

  Here, when the communication device 1 is driven, semiconductor components and integrated circuits mounted on the control board 4 generate heat and generate a large amount of heat. The generated heat is transmitted from the back side of the control board 4 to the inside of the refrigerant tank 6 to heat the refrigerant 5 in the refrigerant tank 6. The refrigerant 5 that has absorbed the heat generated in the control board 4 is boiled and vaporized into a gas state, and flows into the vapor header 23 through the refrigerant vapor pipe 11 connected to the upper part of the refrigerant tank 6.

  In the internal space of the steam header 23, the refrigerant 5 is equalized and flows into each of the plurality of hollow refrigerant pipes 8 connected to the vapor header 23 through the refrigerant inlet 9. As a result, the refrigerant pressure on the refrigerant inflow side of the plurality of hollow refrigerant pipes 8 becomes equal, so that the refrigerant flow rate with respect to the plurality of hollow refrigerant pipes 8 is made uniform.

  The refrigerant 5 in the gas phase state that has flowed into the plurality of hollow refrigerant pipes 8 is caused by the chimney effect in the inner circumferential side space 13 of the annular cross-section flow path of each hollow refrigerant pipe 8 as in the first embodiment. It is cooled and liquefied effectively by the generated ascending airflow 14, moves downward in the hollow refrigerant pipe 8 by its own weight, and flows into the liquid header 24 from the refrigerant outlet 10.

  The liquid-phase refrigerant 5 that has flowed through the plurality of hollow refrigerant pipes 8 merges in the liquid header 24 and is equalized and flows to the refrigerant liquid pipe 12. Since the refrigerant pressure on the refrigerant outflow side to the hollow refrigerant pipes 8 becomes equal, the refrigerant flow rate is made uniform for the plurality of hollow refrigerant pipes 8.

  The liquid-phase refrigerant 5 merged in the liquid header 24 returns to the refrigerant tank 6 through the refrigerant liquid pipe 12, is boiled and evaporated again by the heat generated in the control board 4, passes through the refrigerant vapor pipe 11, and passes from the vapor header 23. The liquid is distributed to the plurality of hollow refrigerant pipes 8 and cooled again with the outside air to be liquefied. By repeating such a change in the gas-liquid state of the refrigerant 5, the boiling cooling device 15 operates, and the heat generated by the control board 4 is dissipated to the outside air and processed.

  Here, since the steam header inlet 25 and the liquid header outlet 26 are arranged so as to be opposed to each other in the arrangement direction of the plurality of hollow refrigerant pipes 8, the plurality of hollow header inlets 25 and the liquid header outlets 26 flow into the steam header 23. Since the lengths of the respective refrigerant paths that pass through each of the refrigerant pipes 8, merge at the liquid header 24, and flow into the refrigerant liquid pipe 12 are equal, the flow rates of the refrigerant flowing through the plurality of refrigerant paths Variations can be reduced, and a decrease in cooling capacity due to non-uniform refrigerant flow can be suppressed.

(Embodiment 4)
Next, a fourth embodiment of the present invention will be described. The same parts as those in the first to third embodiments are denoted by the same reference numerals and detailed description thereof is omitted.

  As shown in FIGS. 12 (a) and 12 (b), the boiling cooling device 15 includes a plurality of holes 27 penetrating the inner peripheral side and the outer peripheral side of the hollow refrigerant pipe 8, and the holes 27 allow The surface area of the wall surface facing the inner circumferential space 13 of the hollow refrigerant pipe 8 is increased, and the contact area with the air flowing through the inner circumferential space 13 is increased. In addition, the contact area between the refrigerant 5 and the inner wall of the hollow refrigerant pipe 8 is increased by the plurality of holes 27. Thereby, the heat exchange efficiency can be improved and the cooling capacity can be improved.

  Furthermore, since the surrounding air can be taken into the inner circumferential space 13 from the plurality of holes 27, the temperature difference between the temperature of the surrounding air and the temperature of the refrigerant 5 can be kept large, and the heat transfer can be further increased. It can be promoted to improve the cooling capacity.

  Furthermore, the variation of the refrigerant flow flowing in the hollow refrigerant pipe 8 is reduced, and the deterioration of the cooling capacity due to the uneven refrigerant flow rate can be suppressed.

  Here, if the hole 27 is a circular hole 27 as shown in FIG. 12A, the refrigerant 5 flows along the circular outline in the hollow refrigerant pipe 8, so the flow of the refrigerant 5 is reduced. Since there is no significant hindrance, a decrease in cooling capacity due to non-uniform refrigerant flow can be suppressed.

  If the rectangular hole 27 as shown in FIG. 12B is used, the hollow refrigerant pipe 8 can be easily manufactured, and the rectangular holes 27 are arranged in a staggered manner to greatly hinder the flow of the refrigerant 5. Therefore, it is possible to suppress a decrease in the cooling capacity due to the non-uniform refrigerant flow rate.

(Embodiment 5)
Next, a fifth embodiment of the present invention will be described. The same parts as those in the first to fourth embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 13, the boiling cooling device 15 causes the ambient air to flow vertically below the hollow refrigerant pipe 8 so that the ambient air can easily flow into the inner space 13. An introduction cylinder 28 to be introduced is provided, and the introduction cylinder 28 has a trapezoidal columnar cross section in which the outer diameter gradually decreases from vertically downward to vertically upward. The material of the introduction tube 28 is, for example, resin or metal, and it is desirable that the material has excellent weather resistance.

  As a result, the rising airflow generated in the inner circumferential side space 13 reduces the inflow resistance of air flowing in from the vertically lower side of the inner circumferential side space 13, so that the surrounding air enters the inner circumferential side space 13. Cooling capacity can be improved by facilitating inflow and increasing the amount of natural convection.

(Embodiment 6)
Next, a sixth embodiment of the present invention will be described. The same parts as those in the first to fifth embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  As shown in FIG. 14, the boiling cooling device 15 includes an air amount adjusting cylinder 29 that can adjust the amount of air flowing into the inner circumferential side space portion 13, and the air amount adjusting cylinder 29 is provided inside. A variable cross-sectional area mechanism such as a solenoid valve or a temperature-sensitive metal valve is provided so that the cross-sectional area of the flow path can be changed. When the temperature difference between the temperature of the ambient air and the temperature of the refrigerant 5 exceeds a predetermined value, the variable cross-sectional area mechanism narrows the cross-sectional area of the flow path in the air amount adjustment cylinder 29 to reduce the inner peripheral space portion. It is possible to reduce the air volume of the air flowing into the air flow 13, prevent the temperature of the communication device 1 from being cooled to a predetermined temperature or higher, and improve the reliability of the boiling cooling device. The material of the air amount adjusting cylinder 29 is, for example, resin or metal, and is preferably a material having excellent weather resistance.

  Here, preferably, the cross-sectional area variable mechanism gradually starts to narrow the flow passage cross-sectional area of the air amount adjusting cylinder 29 when the ambient air temperature falls below 10 ° C., and when the ambient air temperature falls below −40 ° C. It is preferable to drive so that the flow passage cross-sectional area of the air amount adjusting cylinder 29 is 10% or less. If the variable cross-sectional area mechanism is a solenoid valve, it can be controlled with an easy configuration. If the cross-sectional area variable mechanism is a temperature-sensitive metal valve, the configuration is simplified and the size of the air amount adjusting cylinder 29 can be prevented without requiring external power.

  The boiling cooling device according to the present invention can secure sufficient natural convection air by the chimney effect and improve the cooling capacity without using forced air cooling by a fan. Maintenance parts such as the above are unnecessary, and high heat generation such as semiconductor parts installed in communication equipment and power supply equipment installed in places where maintenance work is difficult, such as high places such as the top of steel towers and mountains far from urban areas It is useful as a boiling cooling device for cooling parts.

DESCRIPTION OF SYMBOLS 1 Communication apparatus 2 Steel tower 3 Antenna 4 Control board 5 Refrigerant 6 Refrigerant tank 7 Radiator 8 Hollow refrigerant pipe 9 Refrigerant inlet 10 Refrigerant outlet 11 Refrigerant vapor pipe 12 Refrigerant liquid pipe 13 Inner peripheral side space part 14 Upstream air flow 15 Boiling Cooling device 16 Inner diameter 17 Narrow groove 18 Radiation fin 19 Flow dividing plate 20 Rectifying plate 21 Spiral flow path forming plate 22 Staircase flow path forming plate 23 Steam header 24 Liquid header 25 Steam header inlet 26 Liquid header outlet 27 Hole 28 Introduction cylinder 29 Air quantity adjustment cylinder

Claims (32)

A refrigerant tank that is attached to an electronic device having a heating element that generates a large amount of heat as it is driven, encloses a refrigerant that absorbs the heat of the heating element and vaporizes, and cools the refrigerant that has boiled and evaporated in the refrigerant tank. A radiator to be liquefied, and the radiator includes a hollow refrigerant pipe having an annular channel cross-section through which a refrigerant flows, and by an ascending airflow generated by a chimney effect in an inner circumferential space portion of the hollow refrigerant pipe, A boiling cooling device for cooling a refrigerant flowing in the hollow refrigerant pipe. A refrigerant inlet through which refrigerant flows in and a refrigerant outlet through which refrigerant flows out are provided at both ends of the hollow refrigerant pipe, respectively, and the hollow refrigerant pipe is provided so that the refrigerant inlet is located above the refrigerant outlet. The boiling cooling device according to claim 1, wherein: A refrigerant vapor pipe communicating with the refrigerant tank and the refrigerant inlet; and a refrigerant liquid pipe communicating between the refrigerant tank and the refrigerant outlet; the refrigerant vapor pipe and the refrigerant liquid pipe being connected to the inner circumferential space of the hollow refrigerant pipe The boiling cooling device according to claim 2, wherein the boiling cooling device is provided on an outer peripheral side of the hollow refrigerant pipe so as not to disturb an updraft generated in the pipe. 4. The boiling cooling device according to claim 3, wherein the cross-sectional area of the refrigerant vapor pipe is larger than the cross-sectional area of the refrigerant liquid pipe. The boiling cooling device according to any one of claims 1 to 4, wherein the cross-sectional shape of the hollow refrigerant pipe is formed in an annular shape. The boiling cooling device according to any one of claims 1 to 4, wherein a cross-sectional shape of the hollow refrigerant pipe is formed in a rectangular ring shape. The boiling cooling device according to any one of claims 1 to 6, wherein the refrigerant flow path in the hollow refrigerant pipe is divided in the flow direction. The boil cooling device according to claim 7, wherein a baffle plate is provided so that the refrigerant flows uniformly in each of the divided refrigerant flow paths. The boiling cooling device according to any one of claims 1 to 6, wherein the refrigerant flow path in the hollow refrigerant pipe is formed in a spiral shape. The boiling cooling device according to any one of claims 1 to 6, wherein the refrigerant flow path of the hollow refrigerant pipe is formed in a step shape. The boiling cooling device according to any one of claims 1 to 10, wherein a narrow groove is formed on an inner peripheral surface of the refrigerant flow path of the hollow refrigerant pipe. The boiling cooling device according to any one of claims 1 to 11, wherein a narrow groove is formed on an outer peripheral surface of the refrigerant flow path of the hollow refrigerant pipe. The boiling cooling device according to any one of claims 1 to 12, wherein a heat radiating fin is provided in an inner circumferential space portion of the hollow refrigerant pipe. The boiling cooling device according to any one of claims 1 to 13, wherein a radiation fin is provided on an outer peripheral side of the hollow refrigerant pipe. The boiling cooling device according to any one of claims 1 to 14, wherein an equivalent diameter of the inner circumferential space portion of the hollow refrigerant pipe is 10 millimeters or more. The boiling cooling device according to claim 15, wherein the equivalent diameter of the inner circumferential space portion of the hollow refrigerant pipe is less than 40 millimeters. The boiling cooling according to any one of claims 1 to 16, wherein the hollow refrigerant pipe is provided so that an air flow direction in an inner circumferential space of the hollow refrigerant pipe is a substantially vertical direction. apparatus. 18. The structure according to claim 1, wherein a plurality of hollow refrigerant pipes are provided so that inner circumferential spaces of the plurality of hollow refrigerant pipes do not overlap each other. Boiling cooler. The boiling cooling apparatus according to claim 18, wherein a plurality of hollow refrigerant pipes are provided at intervals. The boiling cooling device according to claim 18, wherein a plurality of hollow refrigerant pipes are provided in a straight line. The boiling cooling device according to claim 18, wherein a plurality of hollow refrigerant pipes are provided in an annular shape. A refrigerant inflow port through which refrigerant flows in and a refrigerant outflow port through which refrigerant flows out are provided in each of the plurality of hollow refrigerant pipes, and the refrigerant inflow port is configured to have the same vertical position. The boiling cooling device according to claim 18, wherein the vertical position of each is also the same. 23. Boiling according to claim 22, wherein a plurality of refrigerant vapor pipes respectively connecting the refrigerant inlets and the refrigerant tanks of the plurality of hollow refrigerant pipe lines are provided, and the lengths of the plurality of refrigerant vapor pipes are the same. Cooling system. 23. Boiling according to claim 22, wherein a plurality of refrigerant liquid pipes respectively connecting the refrigerant outlets of the plurality of hollow refrigerant pipe lines and the refrigerant tank are provided, and the lengths of the plurality of refrigerant liquid pipes are the same. Cooling system. A plurality of refrigerant vapor pipes that respectively connect the refrigerant inlets of the plurality of hollow refrigerant pipes and the refrigerant tank; and a plurality of refrigerant liquid pipes that respectively connect the refrigerant outlets of the plurality of hollow refrigerant pipes and the refrigerant tank. 23. The boiling cooling apparatus according to claim 22, wherein the total length of the refrigerant vapor pipe and the refrigerant liquid pipe provided and connected to the hollow refrigerant pipe is the same. A vapor header that connects refrigerant inlets of the plurality of hollow refrigerant pipes and a liquid header that connects refrigerant outlets of the plurality of hollow refrigerant pipes are provided, and the vapor header and the refrigerant tank communicate with each other through the refrigerant vapor pipe. The boiling cooling apparatus according to claim 22, wherein the liquid header and the refrigerant tank are communicated with each other through a refrigerant liquid pipe. 27. The connecting portion between the vapor header and the refrigerant vapor pipe and the connecting portion between the liquid header and the refrigerant liquid pipe are configured so as to face each other in the arrangement direction of the plurality of hollow refrigerant pipes. The boiling cooling apparatus according to 1. The boiling cooling apparatus according to any one of claims 1 to 6, wherein the hollow refrigerant pipe is formed by a plurality of hollow pipes. The boiling cooling device according to any one of claims 1 to 6, wherein the hollow refrigerant pipe has a plurality of circular holes. The boiling cooling device according to any one of claims 1 to 6, wherein the hollow refrigerant pipe is provided with a plurality of rectangular holes. The boiling cooling device according to any one of claims 1 to 27, further comprising an introduction tube that introduces air from the surroundings into the hollow refrigerant pipe. 28. The boiling cooling device according to any one of claims 1 to 27, further comprising an air amount adjusting cylinder that adjusts an air amount flowing from the surroundings into the hollow refrigerant pipe.

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