JP2011205431A - Electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electronic component that is prevented from decreasing in electronic component characteristics by preventing an influence due to outgas.SOLUTION: The electronic component 2 includes a base having a first conductive portion, a vibration piece having a second conductive portion, an annular first member covered with a first conductive film and provided to one of the base and vibration piece, an annular second member covered with a second conductive film and provided to one of the base and vibration piece and provided inside a ring formed of the first member, an annular third member covered with a third conductive film and provided to the other one of the base and vibration piece opposite the first and second members, and a holding portion provided inside a ring formed of the second member and holding the base and vibration piece, wherein the first conductive film and third conductive film come into electric contact with each other, the second conductive film and third conductive film come into electric contact with each other, and the first conductive portion and second conductive portion are electrically connected to at least one of the first and second conductive films through the third conductive film.

Description

  The present invention relates to an electronic component.

  For example, in an electronic component including a functional piece such as a crystal resonator, an excitation electrode provided on the crystal resonator and a connection electrode for connecting to a drive circuit that drives the crystal resonator are in conductive contact with a conductive paste such as solder. It is fixed in a state (see, for example, Patent Document 1). When such a conductive paste is used, for example, when an impact such as a drop impact is applied, the connection portion between the crystal resonator and the connection electrode may be damaged, which is a factor of reducing connection reliability.

JP-A-11-261360

  Therefore, the bump electrode composed of the elastic core portion and the conductive film provided on the surface of the core portion is provided on the excitation electrode, and the bump electrode and the connection electrode are electrically conductively contacted through the adhesive. A component mounting structure is also conceivable. However, when such a bump electrode is employed, there is a possibility that the vibration characteristics of the crystal resonator are changed by the outgas generated from the adhesive, and the reliability is lowered.

  The present invention has been made in view of such circumstances, and an object of the present invention is to provide an electronic component capable of preventing the deterioration of the electronic component characteristics by preventing the influence of outgas.

  In order to solve the above problems, an electronic component of the present invention includes a base material having a first conductive part, a vibrating piece having a second conductive part, the first conductive part, and the second conductive part. And a member provided between the base material and the vibrating piece, and surrounded by the base material, the vibrating piece and the member, and provided on the base material. And a holding portion for holding the vibrating piece.

  According to the electronic component of the present invention, the holding portion is provided so as to be surrounded by the base material, the vibrating piece, and the member, so that it is possible to prevent the influence of outgas generated from the holding portion.

  The electronic component of the present invention is covered with a base material having a first conductive portion, a vibrating piece having a second conductive portion, and a first conductive film, and one of the base material and the vibrating piece. A ring-shaped first member provided on the substrate and a second conductive film, provided on one of the base member and the resonator element, and formed by the first member. An annular second member provided on the inner side and a third conductive film are covered, and the second member is provided on the other of the base member and the vibrating piece so as to face the first and second members. A ring-shaped third member; and a holding portion that is provided inside the ring formed by the second member and holds the base material and the resonator element, and includes the first conductive film and the first And the second conductive film is in conductive contact with the first conductive portion. Serial and a second conductive portion, characterized in that it is conductively connected via at least one and the third conductive film of the first and second conductive films.

  According to the electronic component of the present invention, since the holding portion is provided so as to be surrounded by the base material, the vibrating piece, the second member, and the third member, the influence of outgas generated from the holding portion can be prevented. Therefore, it is possible to prevent deterioration of the characteristics of the electronic component due to outgassing.

  In the electronic component of the present invention, it is preferable that the first, second, and third members include a resin portion. According to this configuration, since the first, second, and third members have elasticity, the load on the conductive portion can be reduced even when an impact is applied from the outside.

It is a figure which shows the cross-sectional structure of the crystal oscillator package which concerns on 1st Embodiment. It is a top view of FIG. It is the figure which looked at the quartz oscillator from the lower part. It is a figure which shows the AA 'line arrow cross-section structure in FIG. It is a figure which shows the formation process of a bump electrode and an adhesion part. It is a figure for demonstrating the mounting method of a crystal oscillator. It is a figure which shows the cross-sectional structure of the crystal oscillator package which concerns on 2nd Embodiment. It is a figure which shows the cross-sectional structure of the bump electrode which concerns on 2nd Embodiment, and an adhesion part.

  Embodiments of the present invention will be described below with reference to the drawings. In each drawing used for the following description, the scale of each member is appropriately changed to make each member a recognizable size.

(First embodiment)
First, the first embodiment will be described. FIG. 1 is a diagram illustrating a crystal resonator package which is an example of an electronic component according to the first embodiment. FIG. 1 is a diagram illustrating a cross-sectional configuration of a crystal resonator package, FIG. 2 is a plan view of FIG. 1, and FIG. 3 is a diagram of the crystal resonator viewed from below. FIGS. 4A and 4B are cross-sectional configuration diagrams corresponding to the arrows AA ′ in FIG. 3 and are diagrams for explaining the shape of the resin protrusions.

  The crystal resonator package (electronic component) 2 includes a crystal resonator 1 and a container (base material) 3 for sealing the crystal resonator 1 as shown in FIGS. As shown in FIGS. 1 to 3, the crystal resonator 1 includes a crystal piece (vibration piece) 11, a pair of excitation electrodes (second conductive portions) 12 and 13 that excite the crystal piece 11, and a bump electrode 14. And an adhesive portion (holding portion) 15.

  As will be described later in detail, the container 3 has connection electrodes (first conductive portions) 33 and 34 used for electrical connection with the crystal piece 11 and terminal electrodes when mounted on a circuit board (not shown). 35 and 36 are formed.

  The crystal piece 11 is a plate-like member having a substantially U shape in a plan view and having a tuning fork type planar shape in which two arm portions 22 and 23 extend in parallel in the same direction from the base portion 21. Each of the pair of excitation electrodes 12 and 13 is formed of a conductive material such as Al (aluminum) or Au (gold), and is formed on one surface of the crystal piece 11. The excitation electrode 12 is formed from the base portion 21 to the arm portion 22 on one surface of the crystal piece 11. The excitation electrode 13 is formed from the base 21 to the arm 23 on one surface of the crystal piece 11.

  The bump electrode 14 is formed on one surface of the base 21 and is provided in a state of being electrically connected to the excitation electrodes 12 and 13. As shown in FIGS. 1 and 3, the bump electrode 14 includes a protruding resin portion 24 and a pair of conductive films 25 and 26 formed on the surface of the resin portion 24.

  The conductive films 25 and 26 are formed by patterning after film formation by sputtering, for example. In the present embodiment, the Au / Cr layer formed by sputtering is patterned so as to be continuous with the excitation electrodes 12 and 13 and is electrically connected to the excitation electrodes 12 and 13. That is, the crystal resonator package 2 uses the bump electrode 14 as an electrical contact between the crystal piece 11 and the container 3.

  The conductive films 25 and 26 are made of, for example, Au (gold), TiW (titanium / tungsten), Cu (copper), Cr (chromium), Ni (nickel), Ti, W, NiV (nickel / vanadium), Al, You may form with metals and alloys, such as Pd (palladium) and lead-free solder, these single layers, or what laminated | stacked multiple types.

  As shown in FIG. 2, the resin portion 24 has a ring shape when viewed from the top, and the bump electrode 14 also has a ring shape. In addition, the resin portion 24 has a substantially semicircular cross section by melting the resin pattern after patterning a resin material by a photolithography technique or an etching technique as will be described later.

  Since the resin part 24 is covered with the conductive films 25 and 26 as described above, various resin materials can be used. For example, polyimide resin, acrylic resin, phenol resin, silicone resin, silicone-modified polyimide resin, epoxy resin, etc. It is made of a photosensitive insulating resin or a thermosetting insulating resin (in this embodiment, an epoxy resin is used).

  Further, a protruding adhesive portion 15 is provided on the inner side of the region surrounded by the resin portion 24 (bump electrode 14) on one surface of the base portion 21. As shown in FIG. 1, the adhesive portion 15 is elastically deformed by the resin portion 24 constituting the bump electrode 14 following the surface shapes of connection electrodes 33 and 34, which will be described later, so that the conductive films 25 and 26 are connected to the connection electrodes. The crystal piece 11 can be mounted (held) on the container body 31 in a state of being in conductive contact with 33 and 34. As shown in FIG. 1, the crystal unit 1 has a cantilever support structure in which a base 21 is supported by a container 3.

  Various materials can be used for the bonding portion 15 as long as the material exhibits adhesiveness at least on the surface. Specifically, in the present embodiment, the bonding portion 15 is made of the same material as the resin portion 24 (epoxy resin). Consists of. Thus, by comprising the resin part 24 and the adhesion part 15 from the same material, a photolithography process and an etching process can be performed on the same conditions, and a manufacturing process can be simplified. In addition, you may comprise the adhesion part 15 by forming separately the adhesive layer which has adhesiveness on the surface of resin which does not function as an adhesive material.

  Moreover, you may comprise the adhesion part 15 with the conductive adhesive mixed with resin and a conductive filler. In addition, as a conductive filler, metals, such as Au, Ag (silver), Cu, Ni, Al, can be used, for example. As the resin, a thermosetting insulating resin such as a polyimide resin, an acrylic resin, a silicone resin, or an epoxy resin can be used.

  By configuring the bonding portion 15 with a conductive adhesive, the bump electrode 14 and the bonding portion 15 can be used as electrical contacts between the crystal piece 11 and the container 3. Therefore, the reliability of connection can be improved as compared with the case where the bump electrode 14 is used as an electrical contact. In addition, it is preferable that the adhesion part 15 is Ag paste which mixed the epoxy resin and Ag in the point which improves the reliability of connection.

  As shown in FIG. 4A, the height h <b> 1 of the bonding portion 15 is set lower than the height h <b> 2 of the resin portion 24. As a result, the resin part 24 is elastically deformed as described above, and the conductive films 25 and 26 and the connection electrodes 33 and 34 are brought into close contact with each other, so that the adhesive part 15 can be reliably sealed.

  Further, as shown in FIG. 4B, the width B in the cross-sectional shape of the bonding portion 15 is set smaller than the width A in the cross-sectional shape of the resin portion 24. Thus, by designing the width B of the bonding portion 15 to be small, it is possible to easily obtain a shape in which the height h1 of the bonding portion described above is lower than the height h2 of the resin portion 24 in the manufacturing process described later.

The container 3 includes a container body 31 and a lid body 32 that covers the container body 31.
The container body 31 is formed in a substantially box shape, and is formed of an insulating material such as ceramics. Connection electrodes 33 and 34 are formed on the upper surface of the bottom of the container body 31. Terminal electrodes 35 and 36 for mounting on a circuit board (not shown) or the like are formed on the bottom surface of the bottom of the container body 31.

  Each of the connection electrodes 33 and 34 is configured, for example, by laminating an Au film on a Ni plating layer formed on a W film, and is connected to a terminal electrode via a wiring (not shown) formed on the container body 31. 35 and 36 are connected to each other. The lid 32 is formed of an insulating material such as ceramics, for example, similarly to the container body 31. The lid 32 is joined to the opening of the container main body 31 by brazing or the like, and seals the crystal unit 1 in a space formed between the lid 32 and the container main body 31.

  As described above, the crystal resonator package 2 according to the present embodiment uses the bump electrode 14 as an electrical contact, maintains a good conduction state by the bonding portion 15, and mounts the crystal resonator 1 on the container 3. Can do. Since the resin part 24 is covered with the conductive films 25 and 26, it is possible to prevent a problem that the outgas generated from the resin part 24 deteriorates the vibration characteristics of the crystal unit 1 (crystal piece 11).

  Further, as shown in FIG. 1, the adhesive portion 15 is in a state where the conductive films 25 and 26 are in close contact with each other as the resin portion 24 is elastically deformed following the surface shape of the connection electrodes 33 and 34. That is, the adhesive portion 15 is sealed by being surrounded by the bump electrode 14. Thereby, the malfunction that the outgas generated from the adhesion part 15 reduces the vibration characteristic of the crystal oscillator 1 (crystal piece 11) can be prevented.

  Thus, according to the crystal resonator package 2 according to the present embodiment, it is possible to prevent deterioration of the characteristics of the crystal resonator 1 due to outgas generated from the resin material, and it is possible to provide a highly reliable one. Moreover, since both the resin part 24 and the adhesive part 15 have elasticity, even when an external impact is applied, the addition of the bump electrode 14 and the connection electrodes 33 and 34 to the conduction part can be reduced. Excellent conduction reliability can be obtained. In addition, since the bump electrode can be manufactured by a photolithography technique, the electrode can be made smaller than the conventional conductive paste.

  As an embodiment of the electronic component manufacturing method of the present invention, a process of manufacturing the crystal unit package 2 (crystal unit 1) will be described. The present embodiment is characterized in the step of forming the bump electrode 14 and the bonding portion 15. Therefore, below, it demonstrates centering around the method of manufacturing the bump electrode 14 and the adhesion part 15. FIG.

  First, as shown in FIG. 5A, a photosensitive resin material 50 is applied to one surface of the crystal piece 11 by spin coating. Specifically, in the present embodiment, an epoxy resin having a function as an adhesive is applied in an adhesion process described later.

  Subsequently, exposure and development processes are performed. Specifically, as shown in FIG. 5B, openings corresponding to the first resin pattern P1 constituting the resin portion 24 and the second resin pattern P2 constituting the adhesive portion 15 are formed. The formed photomask M is used. In the photomask M, the width of the first opening H1 corresponding to the first resin pattern P1 is larger than the width of the second opening H2 corresponding to the second resin pattern P2. Note that the second opening H2 is disposed inside the region surrounded by the first opening H1.

  By performing exposure processing and development processing using such a photomask M, a first resin pattern P1 and a second resin pattern P2 are formed on the crystal piece 11, as shown in FIG. 5C. Is done. The width H11 in the cross-sectional shape of the first resin pattern P1 is larger than the width H12 in the cross-sectional shape of the second resin pattern P2.

  As described above, in the present embodiment, the first and second resin patterns P1 and P2 can be formed by the same photolithography process by being composed of the same photosensitive resin material. Thereby, the manufacturing process can be simplified. Further, since the first and second resin patterns P1 and P2 are formed by photolithography, a fine pattern can be formed.

  Subsequently, as shown in FIG. 5D, the first resin pattern P <b> 1 and the second resin pattern P <b> 2 are heated and melted to form a semicircular resin portion 24 and an adhesive portion 15. Various methods can be exemplified as the heating method. In this embodiment, for example, the crystal unit 1 is placed in a heating furnace to perform the heat treatment.

  At this time, as the first resin pattern P1 and the second resin pattern P2 are melted, the second resin pattern P2 having a small width H12 becomes lower in height than the first resin pattern P1 having a large width H11. . As a result, the resin part 24 and the adhesive part 15 having a height lower than that of the resin part 24 are formed on the crystal piece 11.

  After forming the resin portion 24 and the adhesive portion 15 in this manner, the excitation electrodes 12 and 13 are formed on the crystal piece 11. The excitation electrodes 12 and 13 are patterned into a desired shape after forming an Au / Cr layer by sputtering, for example. Specifically, the Au / Cr layer is patterned so that the resin portion 24 is covered and the adhesive portion 15 is exposed. Thereby, the conductive films 25 and 26 covering the excitation electrodes 12 and 13 and the resin portion 24 can be formed. As described above, in the present embodiment, the manufacturing process can be simplified by forming the conductive films 25 and 26 by a part of the excitation electrodes 12 and 13. Through the above steps, the crystal resonator 1 including the resin portion 24 and the bonding portion 15 at the connection portion of the excitation electrodes 12 and 13 can be manufactured.

  Next, a method for mounting the crystal unit 1 will be described with reference to FIG. Here, FIG. 6 is a cross-sectional view showing the bump electrode 14 when the crystal piece 11 is mounted on the container 3. First, the bump electrode 14 and the bonding portion 15 provided on the crystal piece 11 are brought into contact with and pressed against the connection electrodes 33 and 34 formed on the container body 31 (see FIGS. 6A and 6B). . The crystal unit 1 is mounted while heating.

  At this time, the resin portion 24 is elastically deformed to follow the shape of each of the connection electrodes 33 and 34. The conductive film 25 follows the surface shape of the connection electrode 33 along with the elastic deformation of the resin portion 24, and the conductive film 26 follows the surface shape of the connection electrode 34. As a result, the conductive film 25 and the connection electrode 33 and the conductive film 26 and the connection electrode 34 are in conductive contact with each other with a sufficient contact area. Further, the adhesive portion 15 having a height lower than that of the resin portion 24 contacts the connection electrodes 33 and 34. And the adhesion part 15 is hardened. Therefore, the bonding portion 15 bonds the bump electrode 14 and the connection electrodes 33 and 34 by elastic deformation of the resin portion 24, and changes the contact state between the conductive film 25 and the connection electrode 33, the conductive film 26 and the connection electrode 34. Can be held.

  As described above, the crystal blank 11 is mounted in the container main body 31. Thereafter, the container body 31 and the lid body 32 are joined to seal the crystal unit 1. In this way, the crystal resonator package 2 is formed. At this time, since the resin part 24 is covered with the conductive films 25 and 26, outgas generated from the resin part 24 is prevented from deteriorating the vibration characteristics of the crystal unit 1 (crystal piece 11). Further, the bonding portion 15 is surrounded by the bump electrode 14 so as to be sealed as shown in FIG. 6B, and the outgas generated from the bonding portion 15 is generated by the crystal resonator 1 (the crystal piece 11). It is prevented that the vibration characteristics are deteriorated.

  According to the crystal resonator package 2 formed as described above, the reliability of the crystal resonator 1 is improved by preventing the deterioration of the characteristics of the crystal resonator 1 caused by the outgas generated from the resin material. Further, when an impact such as a drop impact is applied to the connecting portion between the crystal piece 11 and the container body 31, the resin portion 24 is elastically deformed to absorb the impact.

(Second Embodiment)
Next, a second embodiment will be described. 7 and 8 are views showing a crystal resonator package as an example of an electronic component according to the second embodiment, and are views showing a cross-sectional configuration of the crystal resonator package. The crystal resonator package 2 according to the second embodiment is the first in that the container 3 and the crystal piece 11 are conductively connected via the first, second, and third bump electrodes 141, 142, 143. This is different from the embodiment. Note that detailed description of portions having the same configuration as in the first embodiment is omitted.

  Similar to the first embodiment, the first, second, and third bump electrodes 141, 142, and 143 are formed in an annular shape. As shown in FIG. 8, the first bump electrode (first member) 141 is provided on one surface of the crystal piece 11, and the second bump electrode is formed inside the ring formed by the first bump electrode 141. A (second member) 142 is provided. That is, the second bump electrode 142 is provided so as to be surrounded by the first bump electrode 141. The first bump electrode 141 is composed of a resin part 24 and first conductive films 251 and 261 that cover the resin part 24, and the second bump electrode 142 is a second part that covers the resin part 24 and the resin part 24. The conductive films 252 and 262 are formed.

  A third bump electrode (third member) 143 is provided on the upper surface of the bottom of the container body 31, and the third bump electrode 143 faces the first bump electrode 141 and the second bump electrode 142. Is provided. The third bump electrode 143 includes a resin portion 24 and third conductive films 253 and 263 that cover the resin portion 24.

  The first bump electrode 141, the second bump electrode 142, and the third bump electrode 143 are each formed in an annular shape in a plan view, and the second bump electrode 142, the third bump electrode 143, and the first bump electrode 143 are formed. The bump electrodes 141 are formed in order of increasing the diameter of the ring.

  As shown in FIG. 8, the third bump electrode 143 is provided between the first bump electrode 141 and the second bump electrode 142, and the third bump electrode 143 is connected to the first bump electrode 141. It is provided so as to fit between the second bump electrode 142. Thereby, the position of the crystal piece 11 with respect to the container main body 31 can be matched easily.

  Since the third bump electrode 143 is provided so as to fit between the first bump electrode 141 and the second bump electrode 142, the first bump electrode 141 and the third bump electrode 143 are electrically conductive. The second bump electrode 142 and the third bump electrode 143 are in conductive contact with each other. That is, the first conductive films 251 and 261 and the third conductive films 253 and 263 are in conductive contact, and the second conductive films 252 and 262 and the third conductive films 253 and 263 are in conductive contact. Further, the excitation electrodes 12 and 13 and the connection electrodes 33 and 34 are conductively connected through the first conductive films 251 and 261, the second conductive films 252 and 262, and the third conductive films 253 and 263. Yes. The excitation electrodes 12 and 13 and the connection electrodes 33 and 34 are connected via at least one of the third conductive films 253 and 263, the first conductive films 251 and 261, and the second conductive films 252 and 262. What is necessary is just to be conductively connected.

  The bonding portion 15 is provided inside the ring formed by the second bump electrode 142, and is surrounded by the container body 31, the base portion 21, the second bump electrode 142, and the third bump electrode 143. . Since the first bump electrode 141, the second bump electrode 142, and the third bump electrode 143 include a resin portion and have elasticity, the first bump electrode 141 and the third bump electrode 143 are connected to each other. At the time of contact, the first bump electrode 141 and the third bump electrode 143 are elastically deformed, and are in close contact with each other with a large contact area. Similarly, when the second bump electrode 142 and the third bump electrode 143 are in contact with each other, the second bump electrode 142 and the third bump electrode 143 are elastically deformed, and are in close contact with the contact area being increased. To do. Thereby, the adhesion part 15 can be more reliably sealed by the container main body 31, the base part 21, the second bump electrode 142, and the third bump electrode 143.

  As described above, according to the crystal unit package 2 according to the second embodiment, the crystal unit 1 is highly reliable by preventing the deterioration of the characteristics of the crystal unit 1 caused by the outgas generated from the bonding portion 15. Become.

  In addition, this invention is not limited to the said embodiment, A various change can be added in the range which does not deviate from the meaning of this invention. For example, in the above-described embodiment, an example in which the present invention is applied to a tuning fork type crystal resonator package has been described. However, the present invention can also be applied to electronic components such as an AT type crystal resonator package and a vibration type gyro sensor.

  In the above embodiment, only one bonding portion 15 is provided in the bump electrode 14 (second bump electrode 142) having an annular shape in plan view. However, the quartz resonator 1 can be formed by arranging a plurality of bonding portions 15. You may make it improve the adhesive strength to the main body 31 in. The bonding portion 15 includes the base material 3 and the crystal piece in a state where the bump electrode 14 and the crystal piece 11 are in close contact with each other via the bump electrode 14 (first, second, and third bump electrodes 141, 142, and 143). 11, the bonding portion 15 has a circular shape in plan view, but may have a rectangular shape in plan view. Moreover, you may form in a bowl shape. The bowl shape refers to a columnar shape in which the inner surface (bottom surface) in contact with the crystal piece 11 is a flat surface and the non-contact outer surface side is a curved surface. Specifically, the substantially bowl-like shape includes those having a substantially semicircular, almost semi-elliptical, and substantially trapezoidal cross section.

  In the above embodiment, the bump electrode 14 and the bonding portion 15 are provided on the crystal piece 11. However, the bump electrode 14 and the bonding portion 15 may be provided on the container body 31. Alternatively, one of the bump electrode 14 and the bonding portion 15 may be provided on the container 3 and the other may be provided on the crystal piece 11. In the above embodiment, the crystal piece 11 is provided with the first and second bump electrodes 141 and 142, and the container body 31 is provided with the third bump electrode 143. It is good also as a structure which provides the electrode 143 and provides the 1st and 2nd bump electrodes 141 and 142 in the container main body 31. FIG.

  DESCRIPTION OF SYMBOLS 1 ... Crystal oscillator, 2 ... Crystal oscillator package (electronic component), 3 ... Container (base material), 11 ... Crystal piece (vibration piece), 12, 13 ... Excitation electrode (2nd electroconductive part), 14 ... Bump electrode 141... First bump electrode (first member) 142... Second bump electrode (second member) 143... Third bump electrode (third member) 15. Holding part), 24 ... resin part, 25,26 ... conductive film, 251,261 ... first conductive film, 252,262 ... second conductive film, 253,263 ... third conductive film, 33,34 ... Connection electrode (first conductive portion), 35, 36... Terminal electrode, 50... Photosensitive resin material, P1... First resin pattern, P2.

Claims (3)

A base material having a first conductive portion;
A resonator element having a second conductive portion;
A member that is covered with a conductive film that is in conductive contact with the first conductive portion and the second conductive portion, and is provided between the base material and the vibrating piece;
A holding portion that is provided surrounded by the base material, the vibrating piece and the member, and holds the vibrating piece on the base material;
An electronic component comprising: A base material having a first conductive portion;
A resonator element having a second conductive portion;
An annular first member that is covered with a first conductive film and provided on one of the base material and the resonator element;
An annular second member that is covered with a second conductive film, provided on one of the base material and the resonator element, and provided inside a ring formed by the first member; ,
An annular third member that is covered with a third conductive film and that is provided on the other of the base member and the resonator element so as to face the first and second members;
A holding portion that is provided inside a ring formed by the second member and holds the base material and the vibrating piece;
With
The first conductive film and the third conductive film are in conductive contact, and the second conductive film and the third conductive film are in conductive contact.
The first conductive portion and the second conductive portion are conductively connected via at least one of the first and second conductive films and the third conductive film. Electronic components.   The electronic component according to claim 1, wherein each of the first, second, and third members includes a resin portion.

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