JP2011198835A - Method of manufacturing tab tape - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method of manufacturing a TAB tape in which the TAB tape whose conductor pattern has high precision is stably manufactured by eliminating deviation and variance of etching which tends to occur as the TAB tape is widened.SOLUTION: The method of manufacturing the TAB tape includes a step of forming the conductor pattern on a conductor foil provided on a surface of a copper-clad film base material 1 in a shower etching process, wherein the copper clad film base material 1 having the conductor foil provided on the surface has its transfer direction changed to a downward direction by a first turn roll 9 after being transferred in a horizontal direction to be transferred to a second turn roll 10, which changes the transfer direction from the downward direction to an upward direction in a U-turn manner while the conductor film is subjected to the etching processing by the shower etching process below the second turn roll 10 to form the conductor pattern. A third turn roll 11 changes the transfer direction to a lateral direction thereafter.

Description

  The present invention relates to a method for manufacturing a TAB tape used as a main component of a mounting package such as a semiconductor device such as a liquid crystal driver IC mounted on a liquid crystal display panel.

The structure of the main part of this type of general TAB tape is as shown in FIG.
For example, a conductor pattern such as a copper foil is patterned on the surface of an insulating film substrate 101 made of polyimide or the like by a shower etching process or the like to form a conductor pattern 102 such as a wiring. The surface of the conductor pattern 102 is plated 103 made of a metal such as tin. A solder resist 104 is formed so as to cover the main part of the wiring.

The TAB tape generally has fine wiring as the main conductor pattern 102. On the surface of the inner lead portion connected to the fine wiring, as shown in FIG. 3B, for example, a liquid crystal driver IC is used. The semiconductor chip 105 is connected via bumps 106 and is set to exchange electrical signals between them. Further, the printed wiring board 1 is passed through an anisotropic conductive film 107 called ACF (Anisotropic Conductive Film).
08 and the liquid crystal display panel 109 are connected to each other, and an electrical signal is exchanged between them.

FIG. 4 is a diagram showing a main flow of a conventional general TAB tape manufacturing process. First, a copper-clad film substrate 201 is prepared by laminating a conductive foil 110 such as a copper foil on an insulating film substrate 101 (FIG. 4A).
A photosensitive resist 111 is applied on the surface of the conductor foil 110 in the copper-clad film substrate 201 (FIG. 4B). Or in the case of a dry film resist, the photosensitive resist 111 which consists of the dry film is bonded together.
Then, exposure to development of a desired pattern shape is performed to obtain a resist pattern 112 (FIG. 4C).
Subsequently, using the resist pattern 112 as an etching mask, the conductor foil 110 is patterned by a shower etching process to form the conductor pattern 102 (FIG. 4D). Thereafter, the resist pattern 112 is dissolved and removed (FIG. 4E).
Subsequently, plating 103 such as tin (Sn) plating is applied to the surface of the conductor pattern 102 (FIG. 4F). Then, a solder resist 104 is formed so as to cover a predetermined region such as the main part of the wiring in the conductor pattern 102 (FIG. 4G).

FIG. 5 is a diagram schematically showing a configuration of a main part of a conventional general TAB tape manufacturing apparatus.
A copper reel film substrate 201 in which a resist pattern 112 is formed on the surface of a conductive foil is wound around a reel for delivery 200 accommodated in the delivery section 202. The copper-clad film substrate 201 is delivered from the delivery reel 200 and is conveyed in a substantially horizontal direction via the first guide roller 205. Then, while being conveyed in the horizontal direction by the second guide roller 207 and the third guide roller 208, pattern processing is performed by a shower etching process with the etching solution 204 sprayed from the nozzle 203 to form the conductor pattern 102. Is done. The TAB tape on which the conductor pattern 102 is formed is wound around a take-up reel 211 accommodated in a take-up unit 210 via a post-processing device 209 and a fourth guide roller 206 (Patent Document 1). .

  By the way, as described above, fine wiring is generally formed on the TAB tape. However, the stability of mounting a semiconductor chip such as an IC chip is improved, the ACF mounting property is improved, and the stability of signal transmission / reception is improved. For the purpose of improving electrical reliability, various conductor patterns 102 including wiring are required to have high dimensional accuracy, which has been increasing in recent years.

  On the other hand, in order to achieve a reduction in manufacturing cost by improving the production efficiency, so-called multi-row production has been adopted in recent years, such as using a wide copper-clad insulating film substrate. It has become.

JP 2009-27108 A

However, in the case of multi-strip production, the copper-clad film substrate 201 (TAB tape) is becoming wider and more likely to bend in the width direction.
For this reason, for example, in the case where the etching solution is sprayed from above as shown in FIG. 6A, if the copper-clad film base material 201 is concavely bent downward, the etching solution 204 is made into copper during shower etching. In the case where the etching solution is sprayed from below as shown in FIG. 6B, the etching solution 204 tends to accumulate in the curved concave portion (substantially central portion in the width direction) of the tension film substrate 201. However, the copper-clad film base material 201 tends to stagnate at both ends in the width direction, causing variations in etching and reducing the dimensional accuracy of the conductor pattern 102.

  The present invention has been made in view of such problems, and the object thereof is to eliminate the unevenness and variation of etching that tend to occur as the TAB tape becomes wider, and to reduce the size of the conductor pattern. It is an object of the present invention to provide a method for producing a TAB tape that can stably produce a highly accurate TAB tape.

  The method for producing a TAB tape of the present invention is a method for producing a TAB tape comprising a step of forming a conductor pattern by a shower etching process on a conductor foil provided on an insulating film substrate, wherein the conductor foil comprises: After the insulating film substrate provided on the surface is transported in the lateral direction, the transport direction is changed downward by the first turn roll and transported to the second turn roll, and the second turn In the roll, the conveying direction is changed in a U-turn from the lower direction to the upper direction, and the conductor pattern is etched by a shower etching process at the lower part of the second turn roll. After the formation, the conveyance direction is changed in the lateral direction by a third turn roll.

  According to the present invention, it is possible to stably produce a TAB tape having a high dimensional accuracy of a conductor pattern by eliminating etching bias and variations that tend to occur as the TAB tape becomes wider. A method for manufacturing a TAB tape can be provided.

It is a figure which shows typically an example of the TAB tape manufacturing apparatus used in order to perform the manufacturing method of the TAB tape which concerns on embodiment of this invention. It is the figure which extracts and expands especially the 2nd turn roll vicinity in the TAB tape manufacturing apparatus shown in FIG. It is a figure (Drawing 3 (a)) showing composition of a principal part of a general TAB tape, and a figure (Drawing 3 (b)) showing an example in the state where the TAB tape was mounted. It is a figure which shows the main flows of the manufacturing process of the conventional common TAB tape. It is a figure which shows typically the structure of the principal part of the conventional common TAB tape manufacturing apparatus. In the shower etching process, when the etching solution is sprayed from above (FIG. 6A) and when the etching solution is sprayed from below (FIG. 6B), the insulating film substrate is curved. It is a figure which shows an example.

  Hereinafter, a TAB tape and a manufacturing method thereof according to embodiments of the present invention will be described with reference to the drawings.

  The TAB tape manufacturing method according to the embodiment of the present invention is performed by an inline TAB tape manufacturing apparatus as shown in FIG.

  The TAB tape manufacturing apparatus is wound with a copper-clad film substrate 1 formed by laminating a copper foil on a tape-like insulating film substrate made of a polyimide film, for example, with a resist pattern provided on the copper foil. The feeding roll 2, the feeding section 3 that accommodates it, the shower etching apparatus 4, the post-processing apparatus 5, and the winding section 6 are provided as main parts.

  The shower etching apparatus 4 includes a first guide roll 8, a first turn roll 9, a second turn roll 10, a third turn roll 11, and a nozzle 12.

  The first guide roll 8 guides the copper-clad film substrate 1 fed from the delivery unit 3 into the shower etching apparatus 4 in a substantially horizontal direction.

  The first turn roll 9 changes the conveyance direction of the copper-clad film substrate 1 from the horizontal direction to the downward direction (substantially vertically downward) and conveys it to the second turn roll 10.

  The 2nd turn roll 10 changes the conveyance direction of the copper clad film base material 1 from the downward direction to the upward direction (substantially vertically upward) like a U-turn. In addition, at the same time, etching selectively sprayed from the nozzle 12 to the conductor foil of the copper-clad film substrate 1 in the lower part of the second turn roll 10 and in contact with the second turn roll 10. By spraying the liquid 13, the conductor foil is etched by a shower etching process to form a conductor pattern.

  The third turn roll 11 changes the transport direction of the copper-clad film substrate 1 on which the conductor pattern is formed from the upper direction to the horizontal direction and sends it to the post-processing device 5.

  The post-processing device 5 performs a so-called post-processing after the conductor pattern is formed by a shower etching process.

  The take-up unit 6 accommodates a take-up reel 7 for taking up the TAB tape on which the conductor pattern is formed. The TAB tape on which the conductor pattern is formed through the shower etching apparatus 4 and the post-processing apparatus 5 is guided by the second guide roll 15 to reach the take-up reel 7 and is wound around the take-up reel 7. Is contained.

  With such a TAB tape manufacturing apparatus, the TAB tape manufacturing method according to the embodiment of the present invention is performed.

  After the copper-clad film substrate 1 having the resist pattern provided on the surface thereof is conveyed in the horizontal direction (or in the horizontal direction having a predetermined inclination), the first turn roll 9 is used to form the copper-clad film substrate 1. The conveying direction is changed vertically downward (or a downward direction having a predetermined inclination is also possible), and conveyed to the second turn roll 10.

  And in the 2nd turn roll 10, the conveyance direction of the copper clad film base material 1 is changed in the U-turn from the downward direction to the upward direction. In addition, at the same time, the lower part (substantially lower half) of the second turn roll 10 selectively with respect to the conductor foil of the copper-clad film substrate 1 in the part in contact with the second turn roll 10, By spraying the etching solution 13 sprayed from the nozzle 12, the conductor foil is etched to form a conductor pattern.

  At this time, a predetermined amount of tension is applied to the copper-clad film substrate 1 at the lower part of the second turn roll 10.

  As a numerical aspect of the magnitude of the tension, there is a difference depending on various factors such as the material and outer dimensions of the copper-clad film substrate 1, the required dimensional accuracy, the diameter and width of the second turn roll 10, and the like. However, according to the TAB tape manufacturing experiment based on the TAB tape manufacturing method according to the embodiment of the present invention conducted by the inventor of the present invention, a value in the range of 200 gf or more and 600 gf or less It turns out to be desirable. By setting in this way, it is possible to avoid excessive elongation of the copper-clad film substrate 1 due to the tension being applied, and to etch the lower part of the second turn roll 10. Generation | occurrence | production of the curvature of the width direction in the copper-clad film base material 1 of the part by which a process is performed can be prevented more reliably, and the flatness of the width direction can be ensured.

  The diameter of the second turn roll 10 is desirably 20 mm or more and 1000 mm or less. If this is less than 20 mm, there is a high possibility that the copper-clad film substrate 1 will be deformed. This is because the so-called liquid drainage of the etching solution 13 becomes worse.

  In addition to the second turn roll 10, the first turn roll 9 and the third turn roll 11 have a cross-sectional shape in the width direction in order to prevent bending in the width direction of the copper-clad film substrate 1, For example, it is desirable to make it straight rather than curved like a spindle type. For the same reason, the width of the first turn roll 9, the second turn roll 10, and the third turn roll 11 may be larger (wider) than the width of the copper-clad film substrate 1. desirable.

  In addition, as shown in FIG. 2, the droplets of the etching solution 13 may be scattered on the lower part of the second turn roll 10 (that is, the part on which tension is applied by the second turn roll 10). In order to prevent them from being attached, it is a desirable mode that the air blows (or deflectors) 14 a and 14 b are provided close to both sides of the second turn roll 10.

Moreover, as the etching solution 13 used in the shower etching process at this time, for example, a solution obtained by mixing ferric chloride and hydrochloric acid is preferable. Then, the etching solution 13 can be sprayed at a setting of a spray pressure of 0.2 MPa and a solution temperature of 30 ° C., for example. However, it is needless to say that the process conditions are not limited to these, and various thicknesses such as the thickness and material of the conductive foil to be patterned, the pitch of the conductive pattern to be formed, the line width rule, etc. It is desirable to select various process conditions and set values as appropriate according to the factors.

  After the conductor pattern is formed, the conveyance direction is changed again to the horizontal direction (or a horizontal direction having a predetermined inclination is also possible) by the third turn roll 11.

  Subsequently, the post-processing apparatus 5 performs so-called post-processing after the conductor pattern is formed. Then, the conductor pattern is formed through the shower etching device 4 and the post-processing device 5, the post-processing is also performed, and the copper-clad film substrate 1 in which the main part as the TAB tape is almost completed is the second guide roll 15. , Reaches the take-up reel 7, and is wound and accommodated on the take-up reel 7.

  In the conventional shower etching apparatus, the copper-clad film substrate 1 is transported in the horizontal direction, and pattern processing by the shower etching process is performed in this state, so that it has a laminated structure and has been increasingly widened in recent years. In many cases, the copper-clad film substrate 1 that is advanced is curved in the width direction when patterning is performed, and is warped as if it is a bowl.

  However, according to the method for manufacturing the TAB tape according to the embodiment of the present invention, the TAB tape is fed from the delivery roll 2 and is conveyed almost horizontally to the shower etching apparatus 4 through the first guide roll 8. The incoming copper-clad film substrate 1 is changed in direction downward through the first turn roll 9, proceeds upward through the second turn roll 10, and again in the horizontal direction by the third turn roll 11. And going to be transported. A predetermined mechanical tension is applied to the copper-clad film substrate 1 mainly by the second turn roll 10, the first turn roll 9 and the third turn roll 11 in the conveyance path. Become.

  Moreover, the surface of the second turn roll 10 is formed flat in the width direction, and coupled with the application of the above tension, the copper-clad film substrate 1 is positioned below the second turn roll 10 (almost). While being pressed against the surface of the lower half), along with the rotation of the second turn roll 10, the conveyance direction can be changed in a U-turn from downward to upward while rotating while maintaining a flat state in the width direction.

  Then, the etching solution 13 is sprayed from the nozzle 12 to the copper-clad film substrate 1 in a portion that reaches the lower part of the second turn roll 10 and is flat in the width direction. Perform pattern processing. The etching solution 13 sprayed on the surface of the copper-clad film substrate 1 during the pattern processing by this shower etching process etches the conductive foil on the surface of the copper-clad film substrate 1 and then performs the second turn When it flows down toward the lowest part of the roll 10 and reaches the vicinity of the lowermost part, it is detached from the surface of the copper-clad film substrate 1 and dropped. The so-called liquid drainage of the etching solution 13 at that time is very good by setting the diameter of the second turn roll 10 to an appropriate value as described above.

  Thus, according to the method for manufacturing the TAB tape according to the embodiment of the present invention, the copper-clad film substrate 1 is prevented from being bent into a bowl shape during pattern processing by the shower etching process. be able to. As a result, it is possible to stably manufacture a TAB tape with high dimensional accuracy of the conductor pattern.

The inventor actually produced a TAB tape by using the copper-clad film substrate 1 having a width of 158 mm by the method for producing a TAB tape according to the embodiment of the present invention as described above. The variation of the line width of the wiring pattern on the tape was 0.8 μm in standard deviation with respect to the entire width. For comparison with this, when a TAB tape having the same specifications was produced by a conventional TAB tape manufacturing method using a conventional general shower etching apparatus as shown in FIG. The variation was 1.0 μm at best. From these experimental results, it was confirmed that according to the present invention, an improvement in dimensional accuracy of at least 20% can actually be achieved.

DESCRIPTION OF SYMBOLS 1 Copper-clad film base material 2 Sending roll 3 Sending part 4 Shower etching apparatus 5 Post-processing apparatus 6 Winding part 7 Winding reel 8 1st guide roll 9 1st turn roll 10 2nd turn roll 11 1st 3 turn rolls 12 Nozzle 13 Etching solution 14 Air blow 15 Second guide roll

Claims (6)

A method for producing a TAB tape comprising a step of forming a conductor pattern by a shower etching process on a conductor foil provided on an insulating film substrate,
After the insulating film substrate provided with the conductive foil on the surface thereof is conveyed in the lateral direction, the conveying direction is changed downward by the first turn roll and sent to the second turn roll. In the second turn roll, the conveying direction is changed from the lower direction to the upper direction in a U-turn manner, and the conductor foil is etched by a shower etching process at the lower portion of the second turn roll. After forming a conductor pattern, a conveyance direction is changed to a horizontal direction with a 3rd turn roll, The manufacturing method of the TAB tape characterized by the above-mentioned. In the manufacturing method of the TAB tape of Claim 1,
The TAB tape manufacturing method, wherein widths of the first turn roll, the second turn roll, and the third turn roll are larger than a width of the insulating film substrate. In the manufacturing method of the TAB tape of Claim 1 or 2,
A method for producing a TAB tape, wherein a predetermined tension is applied to the insulating film substrate along at least the lower part of the second turn roll by the second turn roll. In the manufacturing method of the TAB tape as described in any one of Claims 1 thru | or 3,
A method for producing a TAB tape, wherein the etching process is performed while keeping the insulating film substrate flat in the width direction at least at a lower portion of the second turn roll. In the manufacturing method of the TAB tape as described in any one of Claims 1 thru | or 4,
The conductor pattern is etched by selectively spraying an etching solution on the portion of the conductor foil in contact with the second turn roll at the lower part of the second turn roll, and the conductor pattern is etched. A method for producing a TAB tape, wherein In the manufacturing method of the TAB tape as described in any one of Claims 1 thru | or 5,
A method for producing a TAB tape, wherein an air blow or a deflector for preventing the etching solution from landing on the upper side of the lower part of the second turn roll is provided in the vicinity of the second turn roll. .

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