JP2011195911A - Electroforming mold and method of producing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an electroforming mold which is produced according to a photolithography, is excellent in the fineness and aspect ratio and has an inclination part formed at a photoresist portion to be formed in an external shape, and to provide a method of producing the electroforming mold.SOLUTION: The electroforming mold 1 comprises: a substrate 2 that transmits ultraviolet rays; a conductive film 3 that has electric conductivity on a surface of the substrate and has UV-ray transmissibility; and a first photoresist layer that is formed on the upper surface of the conductive film and has a first through-hole inclined toward the upper surface of the first photoresist layer 4 from the upper surface of the conductive film.

Description

  The present invention relates to an electroforming mold used for producing an electroformed body by electroplating and a method for producing the same.

  According to the electroforming method, it is possible to manufacture a member having very high transferability by using a member called an electromold that is precisely processed. In particular, in recent years, it has been proposed to manufacture an electroforming mold by the LIGA (Lithographie Galvanoforming Abforming) method, which uses a photosensitive material by a silicon process to process the electroforming mold, and to manufacture parts and molds having a minute shape. (For example, refer to Patent Document 1).

  In the production of an electroforming mold by the LIGA method, an exposure method using X-rays and an exposure method using ultraviolet rays are performed. However, an exposure method using ultraviolet rays that can be handled by equipment used in ordinary photolithography is widely used.

  When producing an electroforming mold by photolithography, it is necessary to impart conductivity to the substrate in order to pass an electric current during electroforming. In general, a flat metal plate, silicon with a metal film, glass, or resin is used as a substrate. In either case, the substrate is not transmissive to ultraviolet rays and has reflectivity. For this reason, when a photomask for forming a pattern is placed on a substrate coated with a photoresist and exposed to light, irradiation from ultraviolet rays from an oblique direction causes reflection from the substrate. It was difficult to produce an electroforming mold having resist through-holes, and only an electroforming mold having an opening perpendicular to the substrate could be produced.

Japanese Patent Laid-Open No. 11-15126

  The present invention has been made in view of the above circumstances, and has an electroformed wall that is excellent in fineness and at the same time has an angle with respect to a substrate in an electroforming mold using a photoresist produced by exposure to ultraviolet rays. An object is to provide an electroforming mold and a method for manufacturing the same.

The present invention employs the following means in order to solve the above problems.
An electroforming mold according to the present invention includes a substrate that is permeable to ultraviolet rays, a conductive film that is formed on a surface of the substrate, has conductivity, and is transmissive to ultraviolet rays, and the conductive film includes: The first through hole formed on a surface opposite to the surface in contact with the substrate and penetrating to a surface opposite to the surface in contact with the substrate, and inclined with respect to a vertical direction of the surface of the substrate. And a first photoresist layer having a side surface on the through-hole side.

  This electroforming mold has a through hole formed by a hardened photoresist wall having an inclination with respect to the substrate, is transparent to ultraviolet rays formed on the substrate, and is electrically passed through a conductive film. By conducting the electroforming by conducting electricity, an electroformed body can be formed in the through hole, and therefore, an electroformed body having an inclined cross section with respect to the substrate can be provided.

  In addition, the electroforming mold according to the present invention is characterized in that it spreads from the substrate side toward the opening side of the first through hole.

  In the electroforming mold according to the present invention, a second photoresist layer is formed on a surface of the first photoresist layer opposite to a surface in contact with the conductive film, and the second photoresist layer includes the first photoresist layer. It has the 2nd through-hole penetrated to one through-hole, It is characterized by the above-mentioned.

  Further, in the electroforming mold according to the present invention, the second photoresist layer is configured by a side surface on the second through-hole side having an inclination with respect to a vertical direction of the surface of the substrate, The inclination angle of the side surface of the resist layer on the first through-hole side is different from the inclination angle of the side surface of the second through-hole of the second photoresist layer.

  The electroforming mold has a through hole formed by a hardened first photoresist wall having an inclination with respect to the substrate and a through hole formed by a hardened second photoresist wall having a different inclination angle. The electroformed body can be formed in the through-hole by performing electroforming by transmitting electric conduction through the conductive film and having transparency to the formed ultraviolet rays. An electroformed body having a cross section having a plurality of inclination angles can be provided.

  The electroforming mold according to the present invention is characterized in that a side surface on the second through hole side of the second photoresist layer is a side surface perpendicular to the substrate surface.

The electroforming mold according to the present invention is characterized in that the through holes of the first through hole and the second through hole are formed in a substantially circular shape in a plan view or a substantially rectangular shape in a plan view.
The method for producing an electroforming mold according to the present invention includes a conductive film forming step of forming a conductive film having conductivity on a surface of a substrate that transmits ultraviolet rays and having transparency to ultraviolet rays, A first photoresist layer forming step of forming a first photoresist layer on a surface opposite to the surface in contact with the substrate; and a photomask on a surface of the first photoresist layer opposite to the surface in contact with the conductive film. A first exposure step of irradiating and irradiating with ultraviolet rays while being inclined from a vertical direction of the surface of the substrate, developing the first photoresist layer, and forming a first photoresist layer on the first photoresist layer. And a through-hole forming step for forming one through-hole.

  In this method of manufacturing an electroforming mold, after forming a film having conductivity on one surface of a substrate such as glass or resin that transmits ultraviolet rays, and transmitting ultraviolet rays, a photoresist to be used as an electroforming mold is formed. A photomask on which a desired pattern was drawn was placed, and the photomask was tilted with respect to the thickness direction of the photoresist by irradiating ultraviolet rays at an appropriate angle with respect to the photomask. By exposing and removing the unexposed portions by development, the cross section of the opening of the cured photoresist can be inclined, so that the substrate is provided with a conductive layer and has an inclination with respect to the substrate. An electroforming mold having an outer cross section can be provided.

  Further, the electroforming method according to the present invention includes a conductive film forming step of forming a conductive film having conductivity on a surface of a substrate that transmits ultraviolet rays and having transparency to ultraviolet rays, and the conductive film. A first photoresist layer forming step of forming a first photoresist layer on a surface opposite to the surface in contact with the substrate; and a photo resist on a surface opposite to the surface in contact with the conductive film of the first photoresist layer. A mask is disposed, and a first exposure step in which exposure is performed by irradiating with ultraviolet rays while being inclined from a direction perpendicular to the surface of the substrate, and a surface opposite to the surface in contact with the conductive film of the first photoresist layer. A second photoresist forming step for forming a second photoresist layer; a photomask is disposed on a surface of the second photoresist layer opposite to the surface in contact with the first photoresist layer; And exposure A second exposure step; developing the first photoresist layer and the second photoresist layer to form a first through hole in the first photoresist layer; and the second photoresist. And a through hole forming step of forming a second through hole in the layer.

  In this method of manufacturing an electroforming mold, a conductive film is formed on one surface of a substrate that transmits ultraviolet light, such as glass and resin, and a film that is transparent to ultraviolet light is formed. A resist layer is formed, and a photomask on which a desired pattern is drawn is placed on the resist layer. By irradiating the photomask with ultraviolet rays at an appropriate angle, the photomask is inclined with respect to the thickness direction of the photoresist. After a second photoresist layer is formed on this surface, a photomask on which a desired pattern is drawn is placed, and exposure is performed by irradiating with ultraviolet rays. By removing unnecessary portions by development, it is possible to provide an electroforming mold having a conductive layer on the substrate and having an outer cross section having a plurality of inclinations with respect to the substrate.

  Further, in the electroforming method according to the present invention, in the first exposure step, the light shielding portion of the photomask is substantially circular in plan view, and the substrate is rotated about the center of the light shielding portion. It is characterized by irradiating with ultraviolet rays.

  Further, in the electroforming method according to the present invention, in the first exposure step, the light-shielding portion of the photomask is substantially square in plan view, and ultraviolet rays are irradiated toward each side of the light-shielding portion. Features.

  In the electroforming method according to the present invention, in the second exposure step, exposure is performed by irradiating ultraviolet rays at an angle different from that of the first exposure step from a direction perpendicular to the surface of the substrate. It is characterized by that.

  In the electroforming method according to the present invention, in the second exposure step, the light-shielding portion of the photomask is substantially circular in plan view, and the substrate is rotated about the center of the light-shielding portion. It is characterized by.

  In the electroforming method according to the present invention, in the second exposure step, the light-shielding portion of the photomask is substantially square in plan view, and exposure is performed with ultraviolet rays toward each side of the light-shielding portion. It is characterized by.

  The electroforming method according to the present invention is characterized in that in the second exposure step, exposure is performed by irradiating ultraviolet rays perpendicularly to the substrate surface.

  According to the present invention, it is possible to provide an electroforming mold that can form an electroformed body having a high resolution and having an outer shape that is inclined in a direction perpendicular to the substrate.

It is a figure which shows the cross section of the electroforming mold which concerns on the 1st Embodiment of this invention. It is explanatory drawing which shows the process of forming the film | membrane which has electroconductivity and the transmittance | permeability with respect to an ultraviolet-ray, and the process of coating a photoresist among the manufacturing methods of the electroforming mold concerning the 1st Embodiment of this invention. . It is explanatory drawing which shows the exposure process which irradiates an ultraviolet-ray from the direction which has photomask arrangement | positioning and inclines with respect to a board | substrate among the manufacturing methods of the electroforming mold concerning the 1st Embodiment of this invention. It is explanatory drawing which shows the member after an exposure process, and the image development process among the manufacturing methods of the electroforming mold concerning the 1st Embodiment of this invention. It is explanatory drawing which shows the example of the method of manufacturing an electrocast body using the electroforming mold concerning the 1st Embodiment of this invention. It is a figure which shows the cross section of the electroformed member produced using the electroforming mold concerning the 2nd Embodiment of this invention. FIG. 5 shows a step of forming a film having conductivity and transparency to ultraviolet light and a step of forming a first photoresist layer in the method for manufacturing an electroforming mold according to the second embodiment of the present invention. It is explanatory drawing. It is a figure which shows the 1st exposure process which irradiates an ultraviolet-ray from the direction which has photomask arrangement | positioning and inclines with respect to a board | substrate in the manufacturing method of the electroforming mold concerning the 2nd Embodiment of this invention. It is explanatory drawing which shows the process of forming a 2nd photoresist layer among the manufacturing methods of the electroforming mold which concerns on the 2nd Embodiment of this invention. It is a figure which shows a 2nd exposure process in the manufacturing method of the electroforming mold which concerns on the 2nd Embodiment of this invention. It is a figure which shows the exposure state after a 2nd exposure process, and the state after image development in the manufacturing method of the electroforming mold concerning the 2nd Embodiment of this invention. It is explanatory drawing which shows the example of the method of manufacturing an electrocast body using the electroforming mold which concerns on the 2nd Embodiment of this invention. It is a figure which shows the cross section of the electroformed member produced using the electroforming mold concerning the 3rd Embodiment of this invention. FIG. 4 shows a step of forming a film having conductivity and transparency to ultraviolet light and a step of forming a first photoresist layer in the method for manufacturing an electroforming mold according to the third embodiment of the present invention. It is explanatory drawing. It is a figure which shows the 1st exposure process of irradiating an ultraviolet-ray from the direction which has photomask arrangement | positioning and inclines with respect to a board | substrate in the manufacturing method of the electroforming mold which concerns on the 3rd Embodiment of this invention. It is explanatory drawing which shows the process of forming the exposure state after a 1st exposure process, and a 2nd photoresist layer in the manufacturing method which concerns on the 3rd Embodiment of this invention. It is a figure which shows a 2nd exposure process in the manufacturing method of the electroforming mold which concerns on the 3rd Embodiment of this invention. It is a figure which shows the exposure state after a 2nd exposure process, and the state after image development in the manufacturing method of the electroforming mold which concerns on the 3rd Embodiment of this invention. It is explanatory drawing which shows the example of the method of manufacturing an electrocast body using the electroforming mold which concerns on the 3rd Embodiment of this invention. It is explanatory drawing which shows the example made into the electroformed member after forming an electroformed body using the electroforming mold which concerns on the 3rd Embodiment of this invention. It is a figure which shows the cross section of the electroformed member produced using the electroforming mold which concerns on the 4th Embodiment of this invention. It is a figure which shows the pattern of the example of the photomask used in the manufacturing method of the electroforming mold which concerns on the 4th Embodiment of this invention, and the direction which gives an inclination. It is a figure which shows the exposure state after a 1st exposure process in the manufacturing method of the electroforming mold which concerns on the 4th Embodiment of this invention. It is explanatory drawing which shows the process of forming a 2nd photoresist layer among the manufacturing methods of the electroforming mold which concerns on the 4th Embodiment of this invention. It is a figure which shows the 1st exposure process of irradiating an ultraviolet-ray from the direction which has photomask arrangement | positioning and inclines with respect to a board | substrate in the manufacturing method of the electroforming mold which concerns on the 4th Embodiment of this invention. It is a figure which shows the exposure state after a 2nd exposure process, and the state after image development in the manufacturing method of the electroforming mold which concerns on the 4th Embodiment of this invention. It is a figure which shows the cross section of the electroformed member produced using the electroforming mold which concerns on the 4th Embodiment of this invention.

A first embodiment according to the present invention will be described with reference to FIGS.
FIG. 1 is a view showing a cross section of an electroforming mold according to a first embodiment of the present invention.

  The electroforming mold 1 of the present embodiment includes a substrate 2 that is transparent to ultraviolet rays, a conductive film 3 that is conductive on the surface of the substrate and is transparent to ultraviolet rays, and a conductive film substrate. The first through-hole formed on a surface opposite to the surface in contact with the first through-hole penetrating to a surface opposite to the surface in contact with the substrate and having an inclination with respect to a vertical direction of the surface of the substrate And a first photoresist layer 4 having a side surface.

  The substrate 2 is made of, for example, glass such as soda glass, non-alkali glass, or inorganic glass. In addition, if a photoresist layer that uses an aqueous developer is used as a photoresist layer, which will be described later, a highly light-transmitting resin such as acrylic or polycarbonate can be used. It can also be formed of a transparent ceramic such as quartz or sapphire.

  For the conductive film 3, for example, an ITO film made of indium oxide and tin oxide, or a transparent conductive film such as indium oxide is used.

  For the first photoresist layer 4, an epoxy-based chemically amplified negative type photoresist can be used. In addition, acrylic negative type photoresists, dry film photoresists, and the like can also be used. Further, a photoresist other than the chemically amplified type can also be used.

The inclination of the first through hole spreads from the substrate side toward the opening side of the first through hole.
Hereinafter, a method for manufacturing the electroforming mold according to the present embodiment will be described with reference to FIGS.

  FIG. 2A is a diagram showing a conductive film forming step of forming a conductive film having conductivity on the first surface of a substrate that transmits ultraviolet rays and having transparency to ultraviolet rays.

  The substrate 5 is made of, for example, glass such as soda glass, non-alkali glass, or inorganic glass. It can also be formed of a transparent plastic such as acrylic or polycarbonate, or a transparent ceramic such as quartz or sapphire.

  In this step, the conductive film 6 is formed on the substrate 5. As the conductive film 6, for example, an ITO film made of indium oxide and tin oxide, or a transparent conductive film such as indium oxide is used. The conductive film 6 is formed by a sputtering method or the like. The conductive film 6 is formed with a thickness of 100 to 10 μm. In the case of 100 mm or less, the necessary conductivity cannot be obtained. On the other hand, when the thickness is 10 mm or more, there arises a problem that the transmittance is lowered. Furthermore, it is preferably formed with a thickness of several hundred to several thousand Å. Note that this step is not necessary when a glass substrate with an ITO film bonded in advance is used.

  In this step, when soda glass is used for the substrate 5 and an ITO film is formed as the conductive film 6 with a thickness of 1000 mm, the transmittance of ultraviolet rays is 65% including the substrate 5 and the conductive film 6. The surface electrical resistance is 13Ω / □. Further, when an alkali-free glass is used as the substrate 5 and an ITO film is formed as the conductive film 6 with a thickness of 1000 mm, the transmittance of ultraviolet rays is 75% including the substrate 5 and the conductive film 6. The surface electrical resistance is 13Ω / □. In addition, the transmittance | permeability of ultraviolet rays and surface electrical resistance can be adjusted with the material and film thickness of the board | substrate 5 and the electrically conductive film 6, and the area which performs electroforming.

  FIG. 2B is a diagram showing a first photoresist layer forming process for forming a first photoresist layer on the surface of the conductive film opposite to the surface in contact with the substrate. In this step, for example, an epoxy-based chemically amplified negative photoresist is coated by spin coating. Thereafter, the first photoresist layer 7 having a thickness of about 50 μm to 2 mm is formed by evaporating the solvent component by heating. Note that when a chemically amplified photoresist is not used, heating is not necessary.

  FIG. 3 shows a first exposure step in which a photomask is disposed on the surface of the first photoresist layer opposite to the surface in contact with the conductive film, and the exposure is performed by irradiating with ultraviolet rays inclined from the vertical direction of the surface of the substrate. FIG.

  The photomask 8 used in this step includes an ultraviolet transmitting part 9 and an ultraviolet light shielding part 10. The ultraviolet light shielding part 10 is drawn with a pattern on the first photoresist layer side of an electroformed body formed by an electroforming mold.

  A photomask 8 on which this pattern is drawn is disposed on the surface of the first photoresist layer opposite to the surface in contact with the conductive film. Further, the first photoresist layer is irradiated with ultraviolet rays 11 so as to be inclined at an angle C from the vertical direction of the substrate 5. At this time, the refractive indexes of the ultraviolet light transmitting portion 9 and the first photoresist layer 7 are considered so as to be inclined at an angle C from the vertical direction of the substrate 5.

  In FIG. 3, the photomask 8 is irradiated with ultraviolet rays 11 at an angle A from the vertical direction of the substrate. At this time, it is assumed that the ultraviolet rays 11 have parallelism necessary for irradiating the entire photomask 8. Next, the ultraviolet rays 11 incident at an angle A are transmitted through the ultraviolet transmissive portion 9 at an angle B from the vertical direction with respect to the substrate 5 due to the refractive index of the ultraviolet transmissive portion 9. As a result, the ultraviolet rays 11 incident on the first photoresist layer 7 at an angle B are transmitted with an angle C inclined from the vertical direction of the substrate 5 due to the refractive index of the first photoresist layer 7. At this time, the portion of the first photoresist layer 9 where the ultraviolet light shielding portion 10 is disposed is not exposed. Thereafter, the ultraviolet rays 11 pass through the conductive film 6 and the substrate 5.

  Here, the ultraviolet rays 11 that pass through the first photoresist layer 7 are irradiated from each direction that is inclined at an angle C from the vertical direction of the substrate 5. At this time, for example, when the substrate 5 is irradiated while being rotated, irradiation can be performed from all directions. Further, it is possible to irradiate only from an arbitrary direction such as one direction, two directions, or three directions.

  FIG. 4 is a diagram showing a through hole forming step of developing the first photoresist layer to form a first through hole in the first photoresist layer.

  FIG. 4A is a diagram illustrating a process of forming the exposed portion 12 and the unexposed portion 13 in the first photoresist layer 7. Here, in the first exposure step, in addition to the irradiation direction performed in FIG. 3, the exposure is performed from at least two directions opposite to the irradiation direction.

  In the case of using an epoxy-based chemically amplified negative type photoresist, the layer exposed portion 12 and the unexposed portion 13 can be formed by heating the entire member in order to amplify curing by exposure.

  FIG. 4B is a diagram showing a step of developing to form the first through hole. The member formed in FIG. 4A is immersed in the developer. Thereby, the photoresist unexposed portion 13 is removed, and the first through hole 15 including the inclined side surface 14 that extends from the surface opposite to the surface in contact with the substrate of the conductive film 6 toward the opening of the first through hole is formed. The electroforming mold 16 is produced.

FIG. 5 is a view showing an example in which an electroformed body 17 is produced using the produced electroforming mold 16.
At the time of electroforming, the electroforming mold 16 is immersed in an electroforming liquid for performing electroforming of a target material, and conduction is made by the conductive film 6 to conduct electricity. As a result, the electroformed body 17 is formed in the through-hole 15 and, if necessary, after the polishing or the like, the electroformed member 18 can be obtained by processing.

  The cross section in the thickness direction of the electroformed member 18 thus produced has an inclination with respect to the upper and lower surfaces.

A second embodiment according to the present invention will be described with reference to FIGS.
FIGS. 6A and 6B are views showing an upper surface and a cross section of an electroformed member 19 having a cylindrical shape having a tapered portion manufactured using the electroforming mold according to the present embodiment.

  Next, a method for manufacturing an electroforming mold according to this embodiment for producing the electroformed member 19 will be described. Note that detailed description of the same steps as those in the first embodiment is omitted.

  FIG. 7A is a diagram showing a conductive film forming step of forming a conductive film 21 having conductivity on the first surface of the substrate 20 that transmits ultraviolet light and having transparency to ultraviolet light.

  FIG. 7B is a diagram showing a first photoresist layer forming step of forming the first photoresist layer 22 on the surface opposite to the surface in contact with the substrate of the conductive film. In this step, for example, an epoxy-based chemically amplified negative photoresist is coated by spin coating. Thereafter, the first photoresist layer 7 having a thickness of about 50 μm to 2 mm is formed by evaporating the solvent component by heating.

  FIG. 8 shows the first exposure process. In the first exposure step, the photomask 23 is tightly fixed to the surface of the first photoresist layer 22. Further, in consideration of the refractive index of the ultraviolet transmitting part 24 and the first photoresist layer 22 so that the angle is G with respect to the vertical direction of the glass substrate 20 while rotating around the central axis H, Irradiate ultraviolet rays 26 having sufficient parallelism. Further, the exposure is performed except for the portion shielded by the ultraviolet light shielding unit 25. Next, the entire member is heated in order to amplify curing by exposure. Thereby, the exposed portion 27 and the unexposed portion 28 are formed in the photoresist layer.

  FIG. 9 is a diagram illustrating a second photoresist formation process for forming a second photoresist layer on the surface of the first photoresist layer opposite to the surface in contact with the conductive film.

  In the step of forming the second photoresist layer shown in FIG. 9, an epoxy-type chemically amplified negative photoresist is coated by spin coating, and then the solvent component is evaporated by heating to a thickness of about 50 μm to 2 mm. A photoresist layer 29 is formed. As the second photoresist layer 29, an epoxy-type chemically amplified negative photoresist can be used as in the first photoresist layer 27. In addition, acrylic negative type photoresists, dry film photoresists, and the like can also be used. Further, a photoresist other than the chemically amplified type can also be used.

  FIG. 10 is a diagram illustrating a second exposure process in which a photomask is arranged on the surface of the second photoresist layer opposite to the surface in contact with the first photoresist layer, and irradiation is performed by irradiating ultraviolet rays.

  In the second exposure step shown in FIG. 10, the pattern on the substrate side and the pattern on the photomask side are aligned using the photomask 23 used in the first exposure step. That is, the first photoresist layer 27 is aligned so that the pattern on the surface opposite to the surface in contact with the conductive film matches the pattern of the ultraviolet light shielding portion 25 of the photomask. Thereafter, exposure is performed from the vertical direction of the glass substrate 20.

  FIG. 11 shows development of the first photoresist layer and the second photoresist layer to form a first through hole in the first photoresist layer, and a second through hole in the second photoresist layer. It is the figure which showed the through-hole formation process which forms.

  As shown in FIG. 11A, each photoresist layer includes an exposed portion 27 of the first photoresist layer, a portion 31 of the first photoresist layer that has been exposed twice, and a second photoresist layer. The exposed portion 30, the unexposed portion 28 of the first photoresist layer, and the unexposed portion 32 of the second photoresist layer.

  FIG. 11B shows a process of developing to form a through hole. As shown in FIG. 11B, by removing the unexposed portion 28 of the first photoresist layer and the unexposed portion 32 of the second photoresist layer, which are unnecessary portions, the first having an inclined side surface. An electroforming mold 36 having a through hole 35 made of a through hole 33 and a second through hole 34 having a vertical wall is produced.

FIG. 12 is a view showing an example in which an electroformed body 37 is produced using the produced electroforming mold 36.
At the time of electroforming, the electroforming mold 36 is immersed in an electroforming liquid for performing electroforming of a target material, and conduction is made by conducting through the transparent conductive film 21. Thereby, the electroformed body 37 is formed in the through hole 35, and the electroformed member 38 can be obtained after polishing / post-processing of the electroformed surface or the like as required.

  The cross section in the thickness direction of the electroformed member 38 manufactured in this way has an inclined side surface at an angle G with respect to the vertical direction of the upper and lower surfaces, and has a vertical wall on the upper side. Further, the cross section in the plane direction of the substrate is circular as shown in FIG.

  A third embodiment according to the present invention will be described with reference to FIGS. In addition, the detailed description is abbreviate | omitted about the part which performs the process similar to 1st Embodiment and 2nd Embodiment.

  FIGS. 13A and 13B are views showing an upper surface and a cross section of an electroformed member having a tapered hole manufactured using the electroforming mold according to the present embodiment.

  Next, the manufacturing process of the electroforming mold according to this embodiment for producing the electroformed member 39 will be described with reference to FIGS.

  FIG. 14A is a diagram showing a conductive film forming step of forming a conductive film 41 having conductivity on the first surface of the substrate 40 that transmits ultraviolet rays and having transparency to ultraviolet rays.

  FIG. 14B is a diagram showing a first photoresist layer forming step of forming the first photoresist layer 42 on the surface opposite to the surface in contact with the substrate of the conductive film. In this step, for example, an epoxy-based chemically amplified negative photoresist is coated by spin coating. Thereafter, the first photoresist layer 47 having a thickness of about 50 μm to 2 mm is formed by evaporating the solvent component by heating.

  FIG. 15 shows the first exposure process. In the first exposure step, the photomask 43 is closely fixed to the exposed surface of the first photoresist layer 42. Further, while rotating around the central axis I, the ultraviolet light transmitting portion 44 and the first photoresist layer 42 so that the angle is G with respect to the vertical direction of the glass substrate 40 as in the second embodiment. In consideration of the refractive index, the ultraviolet ray 46 having sufficient parallelism is irradiated. The difference from the second embodiment is that two ultraviolet light shielding portions 45 are not disposed in the center in the photomask, but two. Further, the exposure is performed except for the portion shielded by the ultraviolet light shielding unit 45. Next, the entire member is heated in order to amplify curing by exposure. Note that when a chemically amplified photoresist is not used, heating is not necessary.

  FIG. 16A is a view showing an exposed portion 47 and an unexposed portion 48 formed in the first photoresist layer. As shown in FIG. 16A, an exposed portion 47 and an unexposed portion 48 are formed in the first photoresist layer.

  FIG. 16B is a diagram showing a second photoresist forming step of forming a second photoresist layer on the surface of the first photoresist layer opposite to the surface in contact with the conductive film. In the step of forming the second photoresist layer 49 shown in FIG. 16B, for example, an epoxy-type chemically amplified negative photoresist is coated by spin coating, and then the solvent component is evaporated by heating. A photoresist layer 49 having a thickness of about 50 μm to 2 mm is formed.

  FIG. 17 is a diagram illustrating a second exposure process in which a photomask is disposed on the surface of the second photoresist layer opposite to the surface in contact with the first photoresist layer, and exposure with ultraviolet rays is performed.

  In the second exposure step shown in FIG. 17, the photomask 50 is used to align the pattern on the substrate side and the pattern on the photomask side. Thereafter, exposure is performed from the vertical direction of the glass substrate 40.

  As shown in FIG. 18A, each photoresist layer includes an exposed portion 47 of the first photoresist layer, a portion 55 of the first photoresist layer that has been exposed twice, and a second photoresist layer. The exposed portion 54, the unexposed portion 48 of the first photoresist layer, and the unexposed portion 56 of the second photoresist layer.

  FIG. 18B shows a process of developing to form a through hole. As shown in FIG. 18B, at least one side wall is inclined by removing the unexposed portion 48 of the first photoresist layer and the unexposed portion 56 of the second photoresist layer, which are unnecessary portions. An electroforming mold 60 having a through hole 59 made of a first through hole made of a side surface and a second through hole made of a vertical wall is produced.

  In FIG. 18B, each photoresist layer is formed at the center of the substrate 40. Further, in the first through hole of the first photoresist layer, the side wall on the center side is inclined, and the side wall on the opposite side is vertical. Further, the second through hole of the second photoresist layer is perpendicular to the substrate 40. Further, in the first through hole and the second through hole, the side surface opposite to the center side can be formed in substantially the same plane. In addition, the shape of each through-hole can form a desired shape by adjustment by alignment of a photomask.

FIG. 19 is a view showing an example in which an electroformed body 61 is produced using the produced electroforming mold 60.
At the time of electroforming, the electroforming mold 60 is immersed in an electroforming liquid for performing electroforming of a target material, and conduction is made through the transparent conductive film 41 to conduct electricity. As a result, the electroformed body 60 is formed in the through hole 59. In addition, if necessary, the electroformed member 61 can be obtained by processing after polishing or the like. FIG. 20 is a top view and a cross-sectional view of the produced electroformed member 61.

The cross section in the thickness direction of the electroformed member 61 manufactured in this way has a tapered portion inclined at an angle G with respect to the vertical direction of the upper and lower surfaces, and a hole having a vertical portion at the top. Furthermore, in the cross section in the substrate parallel direction, as shown in FIG.
A fourth embodiment according to the present invention will be described with reference to FIGS. In addition, the detailed description is abbreviate | omitted about the part which performs the process similar to 1st Embodiment, 2nd Embodiment, and 3rd Embodiment.

  FIGS. 21A and 21B are views showing an upper surface and a cross-sectional view of an electroformed member having a tapered surface and a vertical surface manufactured by using the electroforming mold according to the present embodiment.

  Next, the manufacturing process of the electroforming mold according to this embodiment for producing the electroformed member 63 will be described with reference to FIGS.

  FIG. 22 shows a schematic view of a photomask in the first exposure. Of the photomask 64, the pattern of the ultraviolet light shielding portion 66 is substantially square.

  A conductive film forming step of forming a conductive film having conductivity on the surface of the substrate that transmits ultraviolet light and transmitting ultraviolet light; and a first photo on the surface opposite to the surface in contact with the substrate of the conductive film. The first photoresist layer forming step for forming the resist layer is the same as in the first embodiment.

  Next, the first exposure process will be described. The photomask 64 is set on the surface of the first photoresist layer 69 opposite to the surface in contact with the conductive film. Next, exposure by ultraviolet rays is performed toward each square side of the ultraviolet ray shielding portion 66 of the photomask 64. That is, the exposure is sequentially performed in a state inclined from the direction perpendicular to the substrate from a direction parallel to or perpendicular to each side of the ultraviolet light shielding unit 66. In FIG. 22, irradiation is performed from four directions of W, X, Y, and Z.

  FIG. 23 is a view showing an exposure state after the first exposure step. FIG. 23A is a top view, and FIG. 23B is a cross-sectional view. As shown in FIG. 23, at the same time as the first exposed portion 71 of the first photoresist layer, which is an exposed portion inclined along the rectangular side of the ultraviolet light shielding portion 66, is formed with an inclination, the first portion 71 is formed. A vertically exposed portion 70 of the photoresist layer is also formed.

  FIG. 24 is a step of forming the second photoresist layer on the surface opposite to the surface in contact with the conductive film of the first photoresist layer, as in the second embodiment.

  FIG. 25 is a diagram showing a second photomask 74 used in the second exposure process. This is a normal photomask having an ultraviolet transmitting part 75 and an ultraviolet light shielding part 76.

  In the second exposure process, the same process as that of the second embodiment is performed using the second photomask 74. That is, after aligning the pattern on the substrate side and the pattern on the photomask side, the substrate 67 is exposed by irradiating ultraviolet rays from the vertical direction.

  In FIG. 26, the first photoresist layer and the second photoresist layer are developed to form a first through hole in the first photoresist layer, and the second through hole is formed in the second photoresist layer. It is the figure which showed the through-hole formation process which forms.

  As shown in FIG. 26 (a), each photoresist layer includes an exposed portion 70 of the first photoresist layer, a portion 75 of the first photoresist layer exposed twice, and a second photoresist layer. The exposed portion 74, the unexposed portion 72 of the first photoresist layer, and the unexposed portion 76 of the second photoresist layer are obtained.

  FIG. 26B shows a process of developing to form a through hole. As shown in FIG. 26B, the unexposed portion 72 of the first photoresist layer and the unexposed portion 76 of the second photoresist layer, which are unnecessary portions, are removed to form the inclined side surface 77. In addition, the electroforming mold 80 having the through hole 79 including the second through hole constituted by the first through hole and the vertical wall 78 is manufactured. In the present embodiment, a plane parallel to the substrate is formed between the inclined side surface 77 and the vertical wall 78.

FIG. 27 is a view showing an example in which an electroformed body 81 is produced using the produced electroforming mold 80.
At the time of electroforming, the electroforming mold 80 is immersed in an electroforming liquid for performing electroforming of a target material, and conduction is made by conducting through the transparent conductive film 68. Thereby, the electroformed body 81 is formed in the through hole 79. Moreover, if necessary, after electropolishing, the electroformed member 82 shown in FIG. 27B can be obtained.

  The cross section in the thickness direction of the electroformed member 82 thus produced has a tapered portion and a hole having a vertical portion on the upper and lower surfaces. Further, in the cross section in the substrate parallel direction, the first photoresist layer 69 has a substantially square shape. By making this portion a substantially square shape, the direction perpendicular to the ridgeline formed by the inclined portion and the vertical portion is obtained. The electroforming can have a flat inclined surface.

  In the present embodiment, the shape of the photomask light shielding portion 76 of the second photomask 74 is substantially rectangular. However, when exposure is performed in a direction perpendicular to the substrate, the vertical exposure is performed by the second exposure process. Therefore, any shape can be applied.

  In the second to fourth embodiments, the second photoresist layer is irradiated with ultraviolet rays from the vertical direction of the substrate. However, like the first photoresist layer, the second photoresist layer is inclined from the vertical direction of the substrate. And can be irradiated with ultraviolet rays. In this case, the second photoresist layer also has a through-hole constituted by inclined side surfaces. Further, in this case, the first through hole of the first photoresist layer can be formed with an inclination angle different from the inclination angle of the second through hole of the second photoresist layer.

  In the first to fourth embodiments, negative type photoresists are used for the first photoresist layer and the second photoresist layer. However, positive type photoresists can also be used. In that case, the inclination of the through hole is opposite to that of the first to fourth embodiments. That is, in the electroforming mold, the through hole is configured with an inclined side surface that becomes narrower from the upper surface of the conductive film toward the upper surface of the photoresist layer.

  As described above, according to the electroforming mold and the manufacturing method thereof according to the present invention, the photoresist portion that determines the outer shape of the electroforming mold can be provided with an inclination, so by using this electroforming mold, An electroformed part having excellent fineness and having an inclined portion can be produced.

1, 16, 36, 60, 80 Electroforming mold 2, 5, 20, 40, 67 Glass substrate 3, 6, 21, 41, 68 Transparent conductive film 4 Cured photoresist 7 Photoresist layers 8, 23, 43, 64 Photomask 9, 24, 44, 51, 65, 75 Photomask transmission part 10, 25, 45, 52, 66, 76 Photomask light shielding part 11, 26, 46, 53 Ultraviolet light 12 Photoresist layer exposure part 13 Photoresist layer Unexposed portions 14, 33, 57, 77 Inclined side surfaces 15, 35, 59, 79 Through holes 17, 37, 61, 81 Electroformed bodies 18, 19, 38, 39, 62, 63, 82 Electroformed members 22, 42 69 First photoresist layer 27, 47 First photoresist layer exposed portions 28, 48, 72 First photoresist layer unexposed portions 29, 49, 73 Second photoresist layer 3 0, 54, 74 Second photoresist exposed portions 31, 55, 75 Portions of the first photoresist exposed twice 32, 56, 76 Second photoresist unexposed portions 34, 58, 78 Vertical walls 50, 74 Second photomask 70 Portion of vertically exposed portion of first photoresist layer 71 Portion of exposed portion of first photoresist layer with inclination

Claims (15)

A substrate that is transparent to ultraviolet light;
A conductive film formed on the surface of the substrate, having conductivity and being permeable to ultraviolet rays;
The conductive film is formed on a surface opposite to the surface in contact with the substrate, has a first through hole penetrating to a surface opposite to the surface in contact with the substrate, and is inclined with respect to a vertical direction of the surface of the substrate. A first photoresist layer having a side surface on the first through-hole side,
An electric mold comprising:   The electroforming mold according to claim 1, wherein the first through hole extends from the substrate side toward an opening side of the first through hole. A second photoresist layer is formed on the surface of the first photoresist layer opposite to the surface in contact with the conductive film;
3. The electroforming mold according to claim 1, wherein the second photoresist layer has a second through hole that penetrates to the first through hole. 4. The second photoresist layer is constituted by a side surface on the second through-hole side having an inclination with respect to a vertical direction of the surface of the substrate.
The inclination angle of the side surface of the first photoresist layer on the first through hole side is different from the inclination angle of the side surface of the second through hole of the second photoresist layer. Item 4. The electroforming mold according to item 3.   4. The electroforming mold according to claim 3, wherein a side surface of the second photoresist layer on the second through hole side is a side surface perpendicular to the substrate surface.   6. The electroforming mold according to claim 1, wherein the first through hole and the second through hole are formed in a substantially circular shape in a plan view or a substantially rectangular shape in a plan view.   The electroforming mold according to claim 1, wherein the conductive film is a transparent conductive film containing indium oxide. A conductive film forming step of forming a conductive film having conductivity on a surface of a substrate that transmits ultraviolet rays and having transparency to ultraviolet rays; and
A first photoresist layer forming step of forming a first photoresist layer on a surface of the conductive film opposite to a surface in contact with the substrate;
A first exposure step in which a photomask is disposed on a surface of the first photoresist layer opposite to the surface in contact with the conductive film, and is irradiated with ultraviolet rays while being inclined from a direction perpendicular to the surface of the substrate; ,
A through hole forming step of developing the first photoresist layer to form a first through hole in the first photoresist layer;
A method for producing an electroforming mold, comprising: A conductive film forming step of forming a conductive film having conductivity on a surface of a substrate that transmits ultraviolet rays and having transparency to ultraviolet rays; and
A first photoresist layer forming step of forming a first photoresist layer on a surface of the conductive film opposite to a surface in contact with the substrate;
A first exposure step in which a photomask is disposed on a surface of the first photoresist layer opposite to the surface in contact with the conductive film, and is irradiated with ultraviolet rays while being inclined from a direction perpendicular to the surface of the substrate; ,
A second photoresist forming step of forming a second photoresist layer on a surface of the first photoresist layer opposite to the surface in contact with the conductive film;
A second exposure step of disposing a photomask on the surface of the second photoresist layer opposite to the surface in contact with the first photoresist layer, irradiating with ultraviolet rays, and performing exposure;
The first photoresist layer and the second photoresist layer are developed to form a first through hole in the first photoresist layer, and a second through hole is formed in the second photoresist layer. A through-hole forming step for forming
A method for producing an electroforming mold, comprising:   9. The first exposure step, wherein the light shielding portion of the photomask is substantially circular in a plan view, and the substrate is rotated around the center of the light shielding portion to irradiate ultraviolet rays. The manufacturing method of the electroforming mold of Claim 9.   10. The light emitting device according to claim 8, wherein, in the first exposure step, the light shielding portion of the photomask is substantially square in a plan view, and ultraviolet rays are irradiated toward each side of the light shielding portion. A method for producing an electroforming mold.   12. The exposure according to claim 9, wherein in the second exposure step, exposure is performed by irradiating ultraviolet rays at an angle different from that of the first exposure step from a direction perpendicular to the surface of the substrate. The method for producing an electroforming mold according to one item.   The electroforming mold according to claim 12, wherein, in the second exposure step, the light shielding portion of the photomask is substantially circular in a plan view, and the substrate is rotated around the center of the light shielding portion. Production method.   The electroforming mold according to claim 12, wherein, in the second exposure step, the light-shielding portion of the photomask has a substantially square shape in plan view, and exposure is performed with ultraviolet rays toward each side of the light-shielding portion. Production method.   The method for producing an electroforming mold according to any one of claims 9 to 11, wherein in the second exposure step, exposure is performed by irradiating ultraviolet rays perpendicularly to the substrate surface.

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