JP2011192674A - Substrate holder, stage device and substrate sticking device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To surely maintain the adsorption power of a substrate holder. <P>SOLUTION: The substrate holder includes a holder body held on a stage for mounting a substrate, an adsorption part for adsorbing the substrate to the holder body, and a plurality of receiving parts disposed at mutually different positions for receiving the supply of the adsorption power to the adsorption part. The plurality of receiving parts receive the supply of the adsorption power to the adsorption part in a state that the holder body is arranged on the stage. Also, the stage device includes a stage where the substrate holder holding the substrate is held, and a plurality of supply parts for supplying the substrate adsorption power to the plurality of receiving parts provided on the mutually different positions of the substrate holder. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate holder, a stage device, and a substrate bonding apparatus.

In Patent Document 1, a first holder that holds a first wafer is held on a first table at the top of the apparatus so that the first wafer faces downward, and a second table at a lower part of the apparatus has a second A wafer superimposing apparatus that superimposes both wafers by holding a second holder for holding the wafer so that the second wafer faces upward is disclosed. Here, there is electrostatic adsorption as a method of holding the wafer by the first or second holder.
Japanese Patent Application Laid-Open No. 2005-251972

  When holding the wafer on the holder by electrostatic adsorption, the holder holding the wafer is transferred by the robot arm, transferred between the robot arm and the table, or received between the upper table and the lower table. It is necessary to reliably maintain the electrostatic chucking force of the substrate holder so that the wafer is not misaligned when passing.

  In order to solve the above problems, in the first aspect of the present invention, a holder main body that is held on a stage and on which a substrate is placed, and an adsorption portion that adsorbs the substrate to the holder main body are arranged at different positions. And a substrate holder including a plurality of receiving units that receive the suction force supplied to the suction unit.

  In the second aspect of the present invention, a stage on which a substrate holder that holds a substrate is held, and a plurality of supply units that supply the suction force of the substrate to a plurality of receiving units provided at different positions of the substrate holder, A stage apparatus is provided.

  In a third aspect of the present invention, a substrate bonding apparatus including the stage device is provided.

  It should be noted that the above summary of the invention does not enumerate all the necessary features of the present invention. In addition, a sub-combination of these feature groups can also be an invention.

1 is a plan view schematically showing the overall structure of a bonding apparatus 100. FIG. A structure of the stage device 140 is schematically shown. An operation of the stage apparatus 140 is schematically shown. It is the perspective view which looked at the upper board | substrate holder 124 from upper direction. It is the perspective view which looked at the upper board | substrate holder 124 from the downward direction. A cross section of upper substrate holder 124 is shown schematically. It is the perspective view which looked at the lower board | substrate holder 125 from upper direction. It is the perspective view which looked at the lower board | substrate holder 125 from the downward direction. The cross section of the lower substrate holder 125 is shown schematically. The supply mechanism of the electrostatic attraction power in the stage apparatus 140 is schematically shown. A process of delivering a substrate holder holding a substrate 122 to the stage device 140 is schematically shown. A process of delivering a substrate holder holding a substrate 122 to the stage device 140 is schematically shown. A process of delivering a substrate holder holding a substrate 122 to the stage device 140 is schematically shown. A process of delivering a substrate holder holding a substrate 122 to the stage device 140 is schematically shown. A process of delivering a substrate holder holding a substrate 122 to the stage device 140 is schematically shown. A process of delivering a substrate holder holding a substrate 122 to the stage device 140 is schematically shown. A process of delivering a substrate holder holding a substrate 122 to the stage device 140 is schematically shown. A process in which the robot arm 134 delivers the lower substrate holder 125 holding the substrate 122 to the lower stage 142 is schematically shown.

  Hereinafter, the present invention will be described through embodiments of the invention, but the following embodiments do not limit the invention according to the claims. In addition, not all the combinations of features described in the embodiments are essential for the solving means of the invention.

  FIG. 1 is a plan view schematically showing the overall structure of the bonding apparatus 100. The bonding apparatus 100 includes a housing 102, a normal temperature unit 104, a high temperature unit 106, and substrate cassettes 112, 114, and 116. The normal temperature part 104 and the high temperature part 106 are provided in the common housing 102.

  The substrate cassettes 112, 114, and 116 are detachably attached to the housing 102 outside the housing 102. The substrate cassettes 112, 114, and 116 accommodate the substrate 122 to be bonded in the bonding apparatus 100. Accordingly, a plurality of substrates 122 can be loaded into the bonding apparatus 100 at a time. In addition, the substrates 122 bonded in the bonding apparatus 100 can be collected at a time.

  The room temperature unit 104 includes a pre-aligner 126, a stage device 140, a substrate holder rack 128, a substrate removal unit 130, and a pair of robot arms 132 and 134, which are disposed inside the housing 102. The inside of the housing 102 is temperature-controlled so that the temperature is substantially the same as the room temperature of the environment where the bonding apparatus 100 is installed.

  The pre-aligner 126 provisionally aligns the positions of the individual substrates 122 so that the position of the substrates 122 is within the narrow adjustment range of the stage device 140 because of its high accuracy. Thereby, the positioning in the stage apparatus 140 can be ensured.

  The substrate holder rack 128 accommodates and waits for a plurality of upper substrate holders 124 and a plurality of lower substrate holders 125 (not shown). The substrate 122 is held by the upper substrate holder 124 or the lower substrate holder 125 by, for example, electrostatic adsorption.

  The stage device 140 includes an upper stage 141 and a lower stage 142. Further, a heat insulating wall 145 and a shutter 146 are provided so as to surround the stage device 140. The space surrounded by the heat insulating wall 145 and the shutter 146 is communicated with an air conditioner or the like, and the temperature is controlled, so that the alignment accuracy in the stage device 140 is maintained. The detailed structure and operation of the stage device 140 will be described later with reference to other drawings.

  In the stage apparatus 140, the lower stage 142 conveys the lower substrate holder 125 holding the substrate 122. In contrast, the upper stage 141 holds the upper substrate holder 124 and the substrate 122 in a fixed state. Further, in the stage device 140, the pair of substrates 122 can be sandwiched between the lower substrate holder 125 and the upper substrate holder 124 by raising the lower stage 142.

  The substrate removing unit 130 takes out the substrate 122 that is sandwiched and bonded between the upper substrate holder 124 and the lower substrate holder 125 that are carried out from the pressure unit 240 of the high temperature unit 106. The substrate 122 taken out from the substrate holder is returned to and stored in one of the substrate cassettes 112, 114, 116 by the robot arms 134, 132 and the lower stage 142. The upper substrate holder 124 and the lower substrate holder 125 from which the substrate 122 has been taken out are returned to the substrate holder rack 128 and stand by.

  Note that the substrate 122 loaded in the bonding apparatus 100 may be a single silicon wafer, compound semiconductor wafer, glass substrate, or the like, in which elements, circuits, terminals, and the like are formed. Further, the loaded substrate 122 may be a laminated substrate that is already formed by laminating a plurality of wafers.

  Of the pair of robot arms 132, 134, the robot arm 132 disposed on the side closer to the substrate cassettes 112, 114, 116 transports the substrate 122 between the substrate cassettes 112, 114, 116, the pre-aligner 126 and the stage apparatus 140. To do. The robot arm 132 also has a function of turning over one of the substrates 122 to be joined. Accordingly, the surfaces of the substrate 122 on which circuits, elements, terminals, and the like are formed can be opposed to each other.

  On the other hand, the robot arm 134 disposed on the side far from the substrate cassettes 112, 114, 116 is arranged between the stage device 140, the substrate holder rack 128, the substrate removing unit 130, and the air lock 220, the substrate 122, the upper substrate holder 124, and The lower substrate holder 125 is conveyed. The robot arm 134 is also responsible for loading and unloading the upper substrate holder 124 and the lower substrate holder 125 with respect to the substrate holder rack 128.

  The high temperature unit 106 includes a heat insulating wall 108, an air lock 220, a robot arm 230, and a plurality of pressure units 240. The heat insulating wall 108 surrounds the high temperature part 106, maintains a high internal temperature of the high temperature part 106, and blocks heat radiation to the outside of the high temperature part 106. Thereby, the influence which the heat of the high temperature part 106 has on the normal temperature part 104 can be suppressed.

  The robot arm 230 conveys the substrate 122, the upper substrate holder 124, and the lower substrate holder 125 between any one of the pressurizing units 240 and the air lock 220. The air lock 220 includes shutters 222 and 224 that open and close alternately on the normal temperature part 104 side and the high temperature part 106 side.

  When the substrate 122, the upper substrate holder 124 and the lower substrate holder 125 are carried into the high temperature unit 106 from the normal temperature unit 104, first, the shutter 222 on the normal temperature unit 104 side is opened, and the robot arm 134 is connected to the substrate 122 and the upper substrate holder 124. Then, the lower substrate holder 125 is carried into the air lock 220. Next, the shutter 222 on the normal temperature part 104 side is closed, and the shutter 224 on the high temperature part 106 side is opened.

  Subsequently, the robot arm 230 unloads the substrate 122, the upper substrate holder 124, and the lower substrate holder 125 from the air lock 220 and loads them into any of the pressurizing units 240. The pressurization unit 240 heats and pressurizes the substrate 122 carried into the pressurization unit 240 while being sandwiched between the upper substrate holder 124 and the lower substrate holder 125. Thereby, the substrate 122 is permanently bonded. Note that the pressing unit 240 may bond the substrate 122 by pressing the substrate 122 without heating.

  When the substrate 122, the upper substrate holder 124, and the lower substrate holder 125 are carried out from the high temperature unit 106 to the normal temperature unit 104, the above series of operations are executed in reverse order. Through a series of these operations, the substrate 122, the upper substrate holder 124, and the lower substrate holder 125 can be carried into or out of the high temperature unit 106 without leaking the internal atmosphere of the high temperature unit 106 to the normal temperature unit 104 side.

  Thus, in many areas in the bonding apparatus 100, the upper substrate holder 124 or the lower substrate holder 125 is transferred to the robot arms 134 and 230 and the lower stage 142 while holding the substrate 122. When the upper substrate holder 124 or the lower substrate holder 125 holding the substrate 122 is transported, the robot arms 134 and 230 attract and hold the upper substrate holder 124 or the lower substrate holder 125 by vacuum suction, electrostatic suction or the like. It's okay. Further, the upper substrate holder 124 or the lower substrate holder 125 attracts and holds the substrate 122 by electrostatic attraction.

  FIG. 2 schematically shows the structure of the stage apparatus 140. The stage device 140 includes an upper stage 141 and a lower stage 142 disposed inside the frame 310.

  The frame 310 includes a top plate 312 and a bottom plate 316 that are parallel to each other and a plurality of support columns 314 that couple the top plate 312 and the bottom plate 316. The top plate 312, the support column 314, and the bottom plate 316 are each formed of a highly rigid material and do not deform even when a reaction force relating to the operation of the internal mechanism is applied. In addition, when it integrates in the bonding apparatus 100, between the support | pillars 314 is sealed with the heat insulation wall 145. FIG.

  The upper stage 141 is fixed to the lower surface of the top plate 312. The upper stage 141 sucks the upper substrate holder 124 that holds the substrate 122 on the lower surface. The adsorption method may be vacuum adsorption or electrostatic adsorption. The substrate 122 is held on the lower surface of the upper substrate holder 124 by electrostatic attraction, and becomes one of alignment targets described later.

  The lower stage 142 is placed on the bottom plate 316 and is moved in the X direction while being guided by a guide rail 352 fixed to the bottom plate, and the Y stage moves on the X stage 354 in the Y direction. It has the stage 356 and the raising / lowering part 360 mounted on the Y stage 356. Thereby, the member mounted on the lower stage 142 can be moved in an arbitrary direction on the XY plane, and can also be moved in the Z direction.

  The elevating part 360 has a cylinder 362 and a piston 364. The piston 364 moves up and down in the Z direction in the cylinder 362 in response to an instruction from the outside. A lower substrate holder 125 is held on the piston 364. Further, another substrate 122 is held on the lower substrate holder 125. The substrate 122 is one of alignment targets to be described later.

  Each substrate 122 has an alignment mark M serving as an alignment reference on its surface (lower surface in the drawing). However, the alignment mark M is not necessarily a graphic or the like provided for that purpose, but may be a wiring, a bump, a scribe line, or the like formed on each substrate 122.

  The stage device 140 has a pair of microscopes 342 and 344. One microscope 342 is fixed to the lower surface of the top plate 312 with a predetermined distance from the upper stage 141.

  The other microscope 344 is mounted on the Y stage 356 together with the lifting unit 360. Thereby, the microscope 344 moves on the XY plane together with the elevating unit 360. When the lower stage 142 is in a stationary state, the microscope 344 and the elevating unit 360 have a known interval. Further, the distance between the center of the elevating unit 360 and the microscope 344 coincides with the distance between the center of the upper stage 141 and the microscope 342.

  When the stage device 140 is in the state shown in the drawing, the alignment mark M of the opposing substrate 122 can be observed using the microscopes 342 and 344. Therefore, for example, the accurate position of the substrate 122 held by the lower substrate holder 125 can be known from the image obtained by the microscope 342. Further, it is possible to know the exact position of the substrate 122 held by the upper substrate holder 124 from the image obtained by the microscope 344.

  FIG. 3 schematically shows the operation of the stage apparatus 140. When the lower stage 142 is moved in the −X direction by the same distance as the distance between the center of the elevating unit 360 and the center of the microscope 344, the substrate 122 held on the lower stage 142 via the lower substrate holder 125 becomes the upper substrate holder. It is conveyed directly below the substrate 122 held by the upper stage 141 via 124. At this time, the alignment marks M of both substrates 122 are located on one vertical line.

  Note that the stage device 140 is not limited to the bonding apparatus 100 but can be used for other purposes. Further, in the stage apparatus 140, the bonding apparatus 100 in which the pressing unit 240 is omitted can be formed by pressing and heating the bonded substrate 122.

  Hereinafter, a process of bonding the substrate 122 by the bonding apparatus 100 will be schematically described. By the robot arm 132, the substrates 122 accommodated in any of the substrate cassettes 112, 114, and 116 are loaded one by one into the pre-aligner 126 and pre-aligned. On the other hand, the robot arm 134 mounts one upper substrate holder 124 on the lower stage 142 and conveys it to the vicinity of the robot arm 132. The robot arm 132 mounts and holds the pre-aligned substrate 122 on the upper substrate holder 124.

  The lower stage 142 moves again to the robot arm 134 side. The robot arm 134 turns over the upper substrate holder 124 holding the substrate 122 and puts it on the push-up portion of the lower stage 142. The upper substrate holder 124 is moved closer to the upper stage 141 by raising the push-up portion, and is held on the upper stage 141 by vacuum suction or the like.

  The robot arm 134 mounts the lower substrate holder 125 on the lower stage 142 and conveys it to the vicinity of the robot arm 132. The robot arm 132 mounts and holds the pre-aligned substrate 122 on the lower substrate holder 125. The position of the substrate 122 held by the lower substrate holder 125 mounted on the lower stage 142 is moved relative to the substrate 122 held by the upper stage 141 via the upper substrate holder 124 by precisely moving the lower stage 142. In addition, both substrates are brought into contact with each other.

  The upper substrate holder 124 and the lower substrate holder 125 sandwiching the abutting substrate 122 are transferred to the air lock 220 by the robot arm 134. The substrate 122, the upper substrate holder 124, and the lower substrate holder 125 transferred to the air lock 220 are inserted into the pressure unit 240. By heating and pressurizing in the pressurizing unit 240, the substrates 122 are joined and integrated.

  Thereafter, the substrate 122, the upper substrate holder 124, and the lower substrate holder 125 are unloaded from the high temperature unit 106, and the substrate 122, the upper substrate holder 124, and the lower substrate holder 125 are separated in the substrate removing unit 130. The bonded substrate 122 is transferred to and stored in one of the substrate cassettes 112, 114, and 116. Thus, the substrate bonding process is completed.

  FIG. 4 is a perspective view of the upper substrate holder 124 as viewed from above. FIG. 5 is a perspective view of the same upper substrate holder 124 as viewed from below. FIG. 6 schematically shows a cross section of the upper substrate holder 124.

  The upper substrate holder 124 holds the substrate 122 on its lower surface. The upper substrate holder 124 includes an upper substrate holder main body 402, a permanent magnet 404, a groove 412, and an electrostatic adsorption unit 420. The outer shape of the upper substrate holder 124 has a disk shape whose diameter is slightly larger than that of the substrate 122.

  The upper substrate holder main body 402 may be formed of ceramics or the like. The upper substrate holder main body 402 has a substrate holding region for holding the substrate 122 on the lower surface thereof. The region has high flatness and adsorbs the substrate 122. An example of the method for adsorbing the substrate 122 is electrostatic adsorption. FIG. 5 shows the upper substrate holder 124 with the substrate 122 held in the substrate holding region.

  A plurality of permanent magnets 404 are arranged on the outer periphery of the substrate holding area. In FIG. 4, three pairs of permanent magnets 404 are arranged at intervals of 120 degrees on the outer periphery of the substrate holding path region. The permanent magnet 404 may be arranged such that the lower surface of the permanent magnet 404 is located in a plane common to the surface of the substrate 122 held by the upper substrate holder body 402.

  The electrostatic adsorption unit 420 electrostatically adsorbs the substrate 122 to the upper substrate holder main body 402. The electrostatic adsorption unit 420 is provided inside the upper substrate holder main body 402. The electrostatic adsorption unit 420 includes a back surface side terminal 406, a back surface side terminal 408, a placement side terminal 416, and a placement side terminal 418. The electrostatic adsorption unit 420 is an example of an adsorption unit.

  FIG. 6 is a diagram illustrating a connection relationship between the electrostatic attraction unit 420 and each terminal, and is not a diagram that limits a positional relationship between the terminals. FIG. 6 shows a bipolar electrostatic chuck 420. That is, the electrostatic attraction unit 420 is composed of two parts and is connected to a positive power source and a negative power source, respectively, and generates a potential difference between the upper substrate holder 124 and the substrate 122, so that the substrate 122 is moved to the upper substrate holder 124. Adsorb to. Further, the electrostatic adsorption may be a monopolar method.

  The back surface side terminal 406 and the back surface side terminal 408 are exposed on the back surface of the surface of the upper substrate holder main body 402 on which the substrate 122 is placed. The back-side terminal 406 is connected to the power supply unit of the lower stage 142 or the upper stage 141 and supplies power from the lower stage 142 or the upper stage 141 to the electrostatic adsorption unit 420. The back-side terminal 408 is connected to the power supply unit of the robot arm when the upper substrate holder 124 is transported by the transport robot arm with the side on which the substrate 122 is placed facing upward. Electric power is supplied to the adsorption unit 420. The back surface side terminal 406 and the back surface side terminal 408 are examples of a receiving unit. The back surface side terminal 406 is also an example of a second receiving portion.

  The placement side terminal 416 and the placement side terminal 418 are exposed on the surface of the upper substrate holder body 402 on the side where the substrate 122 is placed. The placement side terminal 416 is connected to the power supply unit of the lower stage 142 and supplies power from the lower stage 142 to the electrostatic attraction unit 420. The placement side terminal 418 is connected to the power supply unit of the robot arm when the upper substrate holder 124 and the lower substrate holder 125 sandwiching the abutted substrate 122 are transported together by the transport robot arm. Electric power is supplied from the arm to the electrostatic adsorption unit 420. The placement side terminal 416 and the placement side terminal 418 are examples of a receiving unit. The placement side terminal 416 is also an example of a first receiving portion.

  The robot arm 134 and the robot arm 230 can supply power to the upper substrate holder 124 and the lower substrate holder 125, respectively, when the upper substrate holder 124 and the lower substrate holder 125 sandwiching the abutted substrate 122 are transported together. It has a supply part. The power supply unit that supplies power to the upper substrate holder 124 may be a probe that is higher than the thickness of the lower substrate holder 125. The groove 412 of the upper substrate holder 124 is provided for the purpose of avoiding the power supply unit when only the upper substrate holder 124 is transported with the side on which the substrate 122 is placed facing upward by the robot arm.

  FIG. 7 is a perspective view of the lower substrate holder 125 as viewed from above. FIG. 8 is a perspective view of the same lower substrate holder 125 as viewed from below. FIG. 9 schematically shows a cross section of the lower substrate holder 125.

  The lower substrate holder 125 includes a lower substrate holder main body 422, an adsorber 424, a groove 426, a notch 428, and an electrostatic adsorption unit 440. The outer shape of the lower substrate holder 125 has a disk shape whose diameter is slightly larger than that of the substrate 122.

  The lower substrate holder main body 422 may be formed of ceramics or the like. The lower substrate holder main body 422 has a substrate holding region for holding the substrate 122. The region has high flatness and adsorbs the substrate 122. An example of the method for adsorbing the substrate 122 is electrostatic adsorption. FIG. 7 shows the lower substrate holder 125 with the substrate 122 held in the substrate holding region.

  The adsorbers 424 are made of a magnetic material, and a plurality of the adsorbers 424 are arranged outside the held substrate 122 on the surface holding the substrate 122. The adsorber 424 may be disposed in a depressed region formed in the lower substrate holder main body 422 so that the upper surface of the adsorber 424 is positioned in substantially the same plane as the plane that holds the substrate 122.

  In the bonding apparatus 100 of FIG. 1, in the stage apparatus 140, the upper substrate holder 124 and the lower substrate holder 125 each holding the substrate 122 are aligned and brought into contact with each other, and are brought into contact with each other in the pressure unit 240. Two substrates 122 are joined. For this reason, it is required to maintain the relative position of the unbonded substrate 122 while the stage device 140 is transported to the pressure unit 240. In response to such a request, the pair of substrates 122 is sandwiched from the lower substrate holder 125 and the upper substrate holder 124 by attracting the attractor 424 of the lower substrate holder 125 to the permanent magnet 404 of the upper substrate holder 124. , Can hold the relative position.

  The electrostatic adsorption unit 440 electrostatically adsorbs the substrate 122 to the lower substrate holder main body 422. The electrostatic adsorption unit 440 is provided inside the lower substrate holder main body 422. The electrostatic adsorption unit 440 includes a back surface side terminal 432 and a back surface side terminal 434. The electrostatic adsorption unit 440 is an example of an adsorption unit.

  FIG. 9 is a drawing showing the connection relationship between the electrostatic attraction unit 440 and each terminal, and is not a drawing that limits the positional relationship between the terminals. FIG. 9 shows a bipolar electrostatic chucking unit 440. That is, the electrostatic attraction unit 440 includes two parts, which are connected to a positive power source and a negative power source, respectively, to generate a potential difference between the lower substrate holder 125 and the substrate 122, so that the substrate 122 is moved to the lower substrate holder 125. Adsorb to. Further, the electrostatic adsorption may be a monopolar method.

  The back surface side terminal 432 and the back surface side terminal 434 are exposed on the back surface of the lower substrate holder body 422 on the surface on which the substrate 122 is placed. The back-side terminal 432 is connected to the power supply unit of the lower stage 142 and supplies power from the lower stage 142 to the electrostatic attraction unit 440. When the lower substrate holder 125 is transported by the transport robot arm, the back surface side terminal 434 is connected to the power supply unit of the robot arm and supplies power from the robot arm to the electrostatic adsorption unit 440. The back surface side terminal 432 and the back surface side terminal 434 are examples of a receiving unit. The back side terminal 432 is also an example of a second receiving portion.

  The groove 426 is provided for the purpose of avoiding a power supply unit that supplies power to the upper substrate holder 124 in the robot arm 134 and the robot arm 230. The notch 428 is provided for the purpose of avoiding a power supply unit that supplies power from the lower stage 142 to the upper substrate holder 124 when the lower substrate holder 125 is installed on the lower stage 142.

  FIG. 10 schematically shows a mechanism for supplying power for electrostatic attraction in the stage apparatus 140. The upper stage 141 has an upper suction plate 502 and a second supply portion 504. A lower suction plate 512, a push-up portion 514, a third supply portion 516, and a first supply portion 518 are provided on the lift unit 360 of the lower stage 142.

  The upper suction plate 502 sucks and holds the upper substrate holder 124. The adsorption method may be vacuum adsorption or electrostatic adsorption.

  The second supply portion 504 is connected to the rear surface side terminal 406 of the upper substrate holder 124 and supplies power from the upper stage 141 to the electrostatic attraction unit 420 of the upper substrate holder 124. The two second supply portions 504 are connected to a positive power source and a negative power source, respectively, and supply electric power to the two electrostatic suction units 420 to constitute a bipolar electrostatic suction mechanism.

  The second supply portion 504 is installed on the upper stage 141 so that it can be vertically expanded and contracted by a spring. In a state where the upper suction plate 502 is not sucking the upper substrate holder 124, the tip of the second supply portion 504 extends to a position lower than the lower surface of the upper suction plate 502 by a spring. As shown in FIG. 10, in a state where the upper suction plate 502 sucks the upper substrate holder 124, the second supply portion 504 contacts the back surface side terminal 406 of the upper substrate holder 124 and is pushed into the upper substrate holder 124. In this case, the distal end portion of the second supply portion 504 is in a state of being pressed against the back surface side terminal 406 of the upper substrate holder 124 by the elastic force of the spring, and can be reliably electrically connected to the back surface side terminal 406 and stable. Power can be supplied. A coil spring etc. can be illustrated as said spring.

  The lower suction plate 512 sucks and holds the lower substrate holder 125. The adsorption method may be vacuum adsorption or electrostatic adsorption. The lower suction plate 512 may be temporarily used to suck and hold the upper substrate holder 124 when the substrate 122 is placed on the upper substrate holder 124.

  The push-up portion 514 can move up and down with respect to the lifting and lowering portion 360 by driving the actuator. The push-up unit 514 holds the substrate 122 by electrostatic chucking, pushes up the upper substrate holder 124 temporarily placed on the push-up unit 514 with the substrate 122 facing downward, and causes the upper chuck 141 to suck the upper substrate 141. it can.

  The first supply portion 518 is connected to the placement side terminal 416 of the upper substrate holder 124 and supplies electric power from the lower stage 142 to the electrostatic attraction unit 420 of the upper substrate holder 124. The first supply portion 518 is provided integrally with the push-up portion 514 and can move up and down simultaneously with the push-up portion 514. Therefore, even when the push-up portion 514 is transporting the upper substrate holder 124 up and down, electric power can be supplied to the electrostatic chucking portion 420 of the upper substrate holder 124 without interruption, and the upper substrate holder 124 can stably hold the substrate 122. it can.

  The first supply portion 518 is installed on the push-up portion 514 so as to be vertically extendable by a spring. In the state where the upper substrate holder 124 holding the substrate 122 is placed on the push-up portion 514 with the substrate 122 facing downward, the first supply portion 518 is always placed on the placement-side terminal of the upper substrate holder 124 by the elastic force of the spring. It abuts on 416 and is installed so that electrical connection can be made steadily.

  The third supply portion 516 is installed on the push-up portion 514 so as to be vertically extendable and retractable by a spring, and can move up and down simultaneously with the push-up portion 514. The third supply portion 516 contacts the rear surface side terminal 406 of the upper substrate holder 124 by the elastic force of the spring in a state where the upper substrate holder 124 is placed on the push-up portion 514 with the surface on which the substrate 122 is placed facing upward. In contact therewith, power can be steadily supplied to the electrostatic chuck 420. In addition, the third supply portion 516 has a back surface side terminal 432 of the lower substrate holder 125 by the elastic force of the spring in a state where the lower substrate holder 125 is placed on the push-up portion 514 with the surface on which the substrate 122 is placed facing upward. The power can be steadily supplied to the electrostatic attraction unit 440.

  For convenience of explanation, FIG. 10 shows the second supply portion 504, the push-up portion 514, the third supply portion 516, and the first supply portion 518 symmetrically. This does not limit the position of these members. For example, the push-up portion 514 may be composed of three pieces, and may be arranged on the upper surface of the piston 364 on the circumference surrounding the lower suction plate 512 at 120 ° intervals.

  FIGS. 11 to 17 schematically show a process of delivering the upper substrate holder 124 and the lower substrate holder 125 holding the substrate 122 to the stage apparatus 140. Hereinafter, a process of delivering the substrate holder to the stage apparatus 140 will be described with reference to the drawings.

  FIG. 11 shows a situation before the substrate holder is mounted on the lower suction plate 512. The push-up portion 514 is lowered to the lowest position. The first supply portion 518 and the third supply portion 516 are freely extended upward by the elastic force of the spring.

  FIG. 12 shows a state where the upper substrate holder 124 is disposed on the lower suction plate 512 and the substrate 122 is held thereon. In this case, the third supply portion 516 comes into contact with the rear surface side terminal 406 of the upper substrate holder 124 to supply electric power to the electrostatic adsorption unit 420 and cause the upper substrate holder 124 to attract the substrate 122. The third supply portion 516 is pushed into the upper substrate holder 124, and its tip is pressed against the back-side terminal 406 by the elastic force of the spring, and can be reliably electrically connected to the back-side terminal 406 and stable. Power supply.

  FIG. 13 shows a state in which the upper substrate holder 124 holding the substrate 122 is reversed by the robot arm 134 and temporarily placed on the push-up portion 514, and the lower stage 142 is moved directly below the upper stage 141. In this case, the first supply portion 518 is connected to the placement side terminal 416 of the upper substrate holder 124 and supplies electric power from the lower stage 142 to the electrostatic adsorption unit 420 of the upper substrate holder 124. The first supply portion 518 is pushed into the upper substrate holder 124, and its tip is pressed against the placement side terminal 416 by the elastic force of the spring, and can be reliably electrically connected to the placement side terminal 416. Stable power supply.

  FIG. 14 shows a state where the upper substrate holder 124 temporarily placed on the push-up portion 514 is pushed up by the push-up portion 514 and delivered to the upper suction plate 502. In the process in which the upper substrate holder 124 is pushed up, that is, even when the upper substrate holder 124 is separated from the lower stage 142 and the upper stage 141, the first supply portion 518 is always connected to the placement side terminal 416 and the electrostatic adsorption unit Since electric power is supplied to 420, the substrate 122 held by the upper substrate holder 124 does not fall.

  When the upper substrate holder 124 is delivered to the upper suction plate 502 and arranged, first, the second supply portion 504 is brought into contact with the rear surface side terminal 406 of the upper substrate holder 124, and the electric power from the first supply portion 518 is obtained. The supply is stopped and the power supply from the second supply portion 504 is immediately started. As described above, the power supply source of the electrostatic attraction unit 420 of the upper substrate holder 124 can be instantaneously switched from the first supply portion 518 to the second supply portion 504. At the moment of switching, the electrostatic adsorption force to the substrate 122 can be maintained by the residual static electricity. Therefore, the substrate 122 can be prevented from dropping in the process of transferring the upper substrate holder 124 to the upper suction plate 502.

  In addition, the second supply portion 504 is brought into contact with the rear surface side terminal 406 of the upper substrate holder 124 and power supply from the second supply portion 504 is started, and then power supply from the first supply portion 518 is stopped. Also good. When the power supply source is switched in this way, power is supplied to the electrostatic chuck 420 without interruption. That is, the upper substrate holder 124 is temporarily placed on the push-up portion 514 and is held by the upper suction plate 502 on the upper stage 141 from at least one of the first supply portion 518 and the second supply portion 504. Receive power supply. Therefore, the electrostatic attraction force can be maintained and the substrate 122 can be prevented from falling. In this case, for the purpose of preventing the generation of current due to the voltage difference between the power supply sources, it is preferable to precisely control the voltages of the two power supply sources to be the same.

  FIG. 15 shows a state where the push-up portion 514 is lowered after the upper substrate holder 124 is sucked by the upper suction plate 502. The upper substrate holder 124 is supplied with electrostatic attraction power from the upper stage 141 by the second supply portion 504.

  As shown in FIG. 10, the lower substrate holder 125 is disposed on the lower suction plate 512 and the substrate 122 is held thereon. The lower stage 142 is moved precisely, and the position of the substrate 122 held by the lower substrate holder 125 is aligned with the substrate 122 held by the upper stage 141 via the upper substrate holder 124. In this case, the third supply portion 516 contacts the back surface side terminal 432 of the lower substrate holder 125 and supplies power to the electrostatic attraction unit 440 of the lower substrate holder 125.

  As shown in FIG. 16, the elevating unit 360 is raised to superimpose the substrates 122 held on the upper substrate holder 124 and the lower substrate holder 125, respectively. The first supply portion 518 steadily contacts the placement side terminal 416 of the upper substrate holder 124 by the elastic force of the spring again. The power supply from the second supply portion 504 is stopped, and the power supply from the first supply portion 518 is immediately started. When the two power supply sources are controlled to the same voltage, the power supply from the first supply part 518 may be started and then the power supply from the second supply part 504 may be stopped. .

  As shown in FIG. 17, the suction of the upper suction plate 502 is released, the elevating unit 360 is lowered, and the stacked substrate 122, upper substrate holder 124, and lower substrate holder 125 are held by the lower suction plate 512. In this case, the upper substrate holder 124 is supplied with power by the first supply portion 518, and the lower substrate holder 125 is supplied with power by the third supply portion 516.

  By attracting the attracting element 424 of the lower substrate holder 125 to the permanent magnet 404 of the upper substrate holder 124, the pair of substrates 122 is sandwiched from the lower substrate holder 125 and the upper substrate holder 124, and the relative position can be maintained. The upper substrate holder 124 and the lower substrate holder 125 sandwiching the abutting substrate 122 are transferred to the air lock 220 by the robot arm 134. The substrate 122, the upper substrate holder 124, and the lower substrate holder 125 transferred to the air lock 220 are inserted into the pressure unit 240. By heating and pressurizing in the pressurizing unit 240, the substrates 122 are joined and integrated.

  As described above, after the upper substrate holder 124 is temporarily placed on the push-up portion 514 (FIG. 13), the pair of substrates 122 is sandwiched between the lower substrate holder 125 and the upper substrate holder 124 (FIG. 17). The upper substrate holder 124 receives power from either the second supply portion 504 or the first supply portion 518. Since the switching of the power supply can be completed in an instant between the second supply portion 504 and the first supply portion 518, the held substrate 122 can be prevented from shifting and dropping. On the other hand, the lower substrate holder 125 is also placed on the lower suction plate 512 and holds the substrate 122 (FIG. 10) until the pair of substrates 122 are sandwiched between the lower substrate holder 125 and the upper substrate holder 124 (FIG. 10). 17), since the power is always supplied from the third supply portion 516, the held substrate 122 can be prevented from being displaced. By using such a power supply mechanism for electrostatic attraction, the relative position of the substrates 122 to be bonded can be accurately aligned and maintained.

  FIG. 18 is a plan view showing a state where the robot arm 134 delivers the lower substrate holder 125 holding the substrate 122 to the lower stage 142. The robot arm 134 has a fourth supply part 522 and a fifth supply part 524. The fourth supply portion 522 and the fifth supply portion 524 are disposed on the substrate holder placement side of the robot arm 134.

  The fourth supply portion 522 has a height lower than the thickness of the lower substrate holder 125 and is installed on the robot arm 134 so as to be vertically extendable and contracted by a spring. As shown in FIG. 18, when the robot arm 134 transports the lower substrate holder 125, the rear surface side terminal 434 of the lower substrate holder 125 is disposed at a position corresponding to the fourth supply portion 522, and the fifth supply is performed. A groove 426 is disposed at a position corresponding to the portion 524. The fourth supply portion 522 contacts the back surface side terminal 434 of the lower substrate holder 125 and supplies power from the robot arm 134 to the electrostatic attraction unit 440. In this case, the fifth supply portion 524 is accommodated in the groove 426 and is electrically insulated from the lower substrate holder 125. The fourth supply part 522 and the fifth supply part 524 are examples of supply parts.

  When the robot arm 134 transports the upper substrate holder 124 with the surface on which the substrate 122 is placed facing upward, the upper substrate holder 124 has a back surface side terminal 408 at a position corresponding to the fourth supply portion 522, and 5 has a groove 412 at a position corresponding to the supply portion 524. The fourth supply portion 522 contacts the back surface side terminal 408 of the upper substrate holder 124 and supplies power from the robot arm 134 to the electrostatic chuck 420. In this case, the fifth supply portion 524 is accommodated in the groove 412 and is electrically insulated from the upper substrate holder 124.

  The fifth supply portion 524 has a height higher than the thickness of the lower substrate holder 125, and is installed on the robot arm 134 so that it can be vertically expanded and contracted by a spring. When simultaneously transporting the upper substrate holder 124 and the lower substrate holder 125 sandwiching the substrate 122 with which the robot arm 134 abuts, the upper substrate holder 124 places the placement side terminal 418 at a position corresponding to the fifth supply portion 524. Have. The fifth supply portion 524 extends to the upper substrate holder 124 while being accommodated in the groove 426 of the lower substrate holder 125, contacts the placement side terminal 418 of the upper substrate holder 124, and electrostatically attracts from the robot arm 134. Power is supplied to the unit 420.

  As shown in FIG. 18, the lower stage 142 has three push-up parts 514. Among them, the third push portion 514 is provided with a third supply portion 516. A first supply portion 518 is provided adjacent to the third supply portion 516. As described above, the first supply portion 518 is installed integrally with the push-up portion 514 and can move up and down simultaneously with the push-up portion 514.

  When the lower substrate holder 125 is placed on the lower stage 142, the lower substrate holder 125 has a back-side terminal 432 at a position corresponding to the third supply portion 516 and a notch 428 at a position corresponding to the first supply portion 518. . The third supply portion 516 contacts the back surface side terminal 432 of the lower substrate holder 125 and supplies power to the electrostatic attraction unit 440. The first supply portion 518 is accommodated in the notch 428 and is electrically insulated from the lower substrate holder 125.

  As shown in FIG. 16 or FIG. 17, when the upper substrate holder 124 and the lower substrate holder 125 sandwiching the abutting substrate 122 are held by the lower stage 142 at the same time, the upper substrate holder 124 has the first supply portion 518. The mounting side terminal 416 is provided at a position corresponding to. The first supply portion 518 extends to the upper substrate holder 124 while being accommodated in the notch 428 of the lower substrate holder 125, abuts on the placement side terminal 416 of the upper substrate holder 124, and electrostatically flows from the lower stage 142. Electric power is supplied to the adsorption unit 420.

  When the robot arm 134 delivers the lower substrate holder 125 holding the substrate 122 to the lower stage 142, the fourth supply portion 522 of the robot arm 134 and the third supply portion 516 of the lower stage 142 are respectively connected to the lower substrate holder 125. It can be connected to the back side terminals 434 and 432. If the power supply from the lower stage 142 is started immediately after the power supply from the robot arm 134 is stopped, the lower substrate holder 125 is delivered to the lower stage 142 while maintaining the electrostatic adsorption force to the substrate 122. be able to. When the two power supply sources are controlled to the same voltage, the power supply from the robot arm 134 may be stopped after the power supply from the lower stage 142 is started.

  Further, when the robot arm 134 delivers the upper substrate holder 124 and the lower substrate holder 125 sandwiching the substrate 122 in contact with the lower stage 142, not only the lower substrate holder 125 but also the upper substrate holder 124. However, the power supply source can be switched instantaneously. In this case, the fifth supply portion 524 of the robot arm 134 and the first supply portion 518 of the lower stage 142 are connected to the placement side terminals 418 and 416 of the upper substrate holder 124, respectively. If the power supply from the lower stage 142 is started immediately after the power supply from the robot arm 134 is stopped, the electrostatic attraction force to the substrate 122 can be maintained. When the two power supply sources are controlled to the same voltage, the power supply from the robot arm 134 may be stopped after the power supply from the lower stage 142 is started.

  According to the above embodiment, the upper substrate holder 124 and the lower substrate holder 125 that hold the aligned substrate 122 can be reliably held by maintaining the electrostatic attraction force in the process of transporting and delivering. The upper substrate holder 124, the lower substrate holder 125, the stage device 140, and the bonding apparatus 100 including the stage device 140 can be provided.

  In the above embodiment, power is supplied to the upper substrate holder 124 or the lower substrate holder 125 through terminals provided on the substrate mounting side surface or the back surface of the substrate holder. You may carry out from the side surface of the holder 124 or the lower substrate holder 125. That is, a terminal as a receiving unit may be provided on the side surface of the upper substrate holder 124 or the lower substrate holder 125, and a supply unit that can supply power from the side surface of the substrate holder may be provided on the upper stage 141 or the lower stage 142.

  Further, the second supply portion 504 provided on the upper stage 141 may have a structure that can be expanded and contracted so as to reach the rear surface side terminal 406 of the upper substrate holder 124 mounted on the lower stage 142 (see FIG. 13). reference). In this case, since the power can be supplied from the second supply portion 504 from the state where the upper substrate holder 124 is placed on the lower stage 142, the first supply portion 518 can be omitted.

  In the above embodiment, the upper substrate holder 124 and the lower substrate holder 125 adsorb the substrate 122 by electrostatic adsorption, but the upper substrate holder 124 and the lower substrate holder 125 may adsorb the substrate 122 by vacuum adsorption. In this case, the suction part of the upper substrate holder 124 or the lower substrate holder 125 may be a vacuum suction space instead of the electrostatic suction part. The receiving part provided in the upper substrate holder 124 or the lower substrate holder 125 may be an opening in which a valve for maintaining a vacuum is provided instead of the terminal. The valve that can also receive the opening may be a check valve. The supply unit provided in the upper stage 141 or the lower stage 142 may be a suction opening of a vacuum pipe provided with a valve.

  In the substrate holding region of the upper substrate holder 124 or the lower substrate holder 125, a plurality of fine openings for vacuum suction of the substrate 122 are provided. A leak valve for releasing the suction is provided at a position where there is no hindrance to the conveyance in the upper substrate holder 124 or the lower substrate holder 125.

  For example, as shown in FIG. 12, when the substrate 122 is vacuum-sucked through the upper substrate holder 124 placed on the lower stage 142, the suction opening of the vacuum piping of the third supply portion 516 provided on the lower stage 142 is upper. This is achieved by contacting the opening corresponding to the rear surface side terminal 406 of the substrate holder 124 and drawing the vacuum suction gap of the upper substrate holder 124 to a vacuum.

  As shown in FIG. 13, the upper substrate holder 124 holding the substrate 122 is reversed by the robot arm 134, temporarily placed on the push-up portion 514, and the lower stage 142 is moved directly below the upper stage 141. In this case, the suction opening of the vacuum pipe of the first supply portion 518 comes into contact with the opening corresponding to the placement side terminal 416 of the upper substrate holder 124, and the vacuum suction gap of the upper substrate holder 124 from the lower stage 142. To vacuum.

  As shown in FIG. 14, the upper substrate holder 124 temporarily placed on the push-up portion 514 is pushed up by the push-up portion 514 and transferred to the upper suction plate 502. In this case, after the suction opening of the second supply portion 504 contacts the opening corresponding to the back-side terminal 406 and evacuation is started, the valve of the opening corresponding to the placement-side terminal 416 is closed, The supply portion 518 may stop the evacuation and the push-up portion 514 may be lowered. The same applies to the case of delivering another substrate holder.

  As mentioned above, although this invention was demonstrated using embodiment, the technical scope of this invention is not limited to the range as described in the said embodiment. It will be apparent to those skilled in the art that various modifications or improvements can be added to the above-described embodiment. It is apparent from the scope of the claims that the embodiments added with such changes or improvements can be included in the technical scope of the present invention.

  The order of execution of each process such as operations, procedures, steps, and stages in the apparatus, system, program, and method shown in the claims, the description, and the drawings is particularly “before” or “prior to”. It should be noted that the output can be realized in any order unless the output of the previous process is used in the subsequent process. Regarding the operation flow in the claims, the description, and the drawings, even if it is described using “first”, “next”, etc. for convenience, it means that it is essential to carry out in this order. It is not a thing.

  DESCRIPTION OF SYMBOLS 100 Bonding apparatus, 102 Case, 104 Normal temperature part, 106 High temperature part, 108 Heat insulation wall, 112 Substrate cassette, 114 Substrate cassette, 116 Substrate cassette, 122 Substrate, 124 Upper substrate holder, 125 Lower substrate holder, 126 Pre-aligner, 128 Substrate holder rack, 130 Substrate removal unit, 132 Robot arm, 134 Robot arm, 140 Stage device, 141 Upper stage, 142 Lower stage, 145 Heat insulation wall, 146 Shutter, 220 Air lock, 222 Shutter, 224 Shutter, 230 Robot arm, 240 Pressurizer, 310 Frame, 312 Top plate, 314 Column, 316 Bottom plate, 342 Microscope, 344 Microscope, 352 Guide rail, 354 X stage, 356 Y stage, 360 Lifting unit, 36 Cylinder, 364 Piston, 402 Upper substrate holder body, 404 Permanent magnet, 406 Back side terminal, 408 Back side terminal, 412 Groove, 416 Mounting side terminal, 418 Mounting side terminal, 420 Electrostatic adsorption part, 422 Lower substrate holder Main body 424 Adsorber 426 Groove 428 Notch 432 Back side terminal 434 Back side terminal 440 Electrostatic suction part 502 Upper suction plate 504 Second supply part 512 Lower suction plate 514 Push-up 516 3rd supply part, 518 1st supply part, 522 4th supply part, 524 5th supply part

Claims (15)

A holder body that is held on a stage and on which a substrate is placed;
An adsorbing part for adsorbing the substrate to the holder body;
A substrate holder provided with a plurality of receiving parts which are arranged at different positions and receive the suction force supplied to the suction part.   2. The substrate holder according to claim 1, wherein the plurality of receiving units receive supply of suction force to the suction unit in a state where the holder main body is disposed on the stage.   The plurality of receiving portions include a first receiving portion that receives supply of suction force to the suction portion in a state where the holder body is separated from the stage, and the suction portion in a state where the holder body is disposed on the stage. The substrate holder according to claim 1, further comprising a second receiving part that receives supply of the suction force to the part.   The first receiving portion is supplied with an attracting force from a mounting surface side on which the substrate is placed in the holder body, and the second receiving portion is a back surface side opposite to the mounting surface in the holder body. The substrate holder according to claim 3 which receives supply of adsorption power from.   5. The substrate according to claim 3, wherein the first receiving portion is exposed on a mounting surface on which the substrate is mounted, and the second receiving portion is exposed on a back surface opposite to the mounting surface. holder.   The substrate holder according to claim 1, wherein the adsorption force is an electrostatic force. A stage on which a substrate holder for holding the substrate is held;
A stage apparatus comprising: a plurality of supply units configured to supply a suction force of the substrate to a plurality of receiving units provided at different positions of the substrate holder.   The stage apparatus according to claim 7, wherein the plurality of supply units supply a substrate holding force to the plurality of receiving units in a state where the substrate holder is disposed on the stage.   The plurality of supply units are a state in which the substrate holder is disposed on the stage, and a first supply part that supplies an attractive force to any of the plurality of receiving units in a state where the substrate holder is separated from the stage The stage device according to claim 7, further comprising: a second supply portion that supplies an attractive force to any one of the plurality of receiving units. Comprising another stage disposed opposite the stage;
The first supply portion supplies an adsorption force from the other stage side to one receiving unit among the plurality of receiving units,
The stage device according to claim 9, wherein the second supply portion supplies an adsorption force from the stage side to another receiving unit among the plurality of receiving units.   A push-up unit for holding the substrate and pushing the substrate holder temporarily placed on the other stage so that the substrate faces the other stage is pushed up to the stage, and the substrate holder is temporarily placed on the other stage. 11. The stage apparatus according to claim 10, wherein the substrate holder is supplied with attraction force from at least one of the first supply portion and the second supply portion after being held by the stage.   The said supply part has a 3rd supply part which hold | maintains another board | substrate and supplies adsorption | suction force to the other board | substrate holder hold | maintained at the said other stage so that the said other board | substrate may face the said stage. Or the stage apparatus of 11.   The stage apparatus according to claim 11 or 12, wherein the first supply portion is disposed on the push-up portion.   The stage device according to claim 13, wherein the first supply unit disposed in the push-up portion has elasticity in the push-up direction.   A substrate bonding apparatus comprising the stage apparatus according to claim 7.

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