JP2011190372A - Addition-curable silicone resin composition for light-emitting diode - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an addition-curable silicone resin composition for LED, having high resistance relative to thermal shock and hardly generating a crack even under a severe temperature cycle. <P>SOLUTION: The addition-curable silicone resin composition for the light-emitting diode includes at least (A) 100 pts.mass of liquid-like or solid organo-polysiloxane having a viscosity at 25°C of 0.1 Pas or higher represented by the average composition formula (1): R<SB>n</SB>(C<SB>6</SB>H<SB>5</SB>)<SB>m</SB>SiO<SB>(4-n-m)/2</SB>(1), (B) linear organo hydrogen polysiloxane represented by the average composition formula (2): R<SP>1</SP><SB>a</SB>H<SB>b</SB>SiO<SB>(4-a-b)/2</SB>(2) and having at least two hydrogen atoms bonded to silicon atoms in one molecule, with 5 mol% or more of the total of all R<SP>1</SP>s and Hs bonded to the silicon atoms being the phenyl group, and having a viscosity at 25°C of 1,000 mPas or lower in an amount that the number of the hydrogen atoms bonded to silicon atoms becomes 0.3-10 number per total number of one of the alkenyl groups bonded to the silicon atoms in the component (A), (C) 1-100 pts.mass of an organic silicone compound having one alkenyl group and one hydrogen atom bonded to silicon atoms in one molecule based on 100 pts.mass of the total of the component (A) and the component (B), and (D) a catalytic amount of an addition reaction catalyst. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an addition-curable silicone resin composition for light-emitting diodes (LEDs), and in particular, the cured product is transparent, suitable for protecting light-emitting diode elements, changing / adjusting wavelengths, or constituting materials for lenses, and for high / low temperature cycles. The present invention relates to an addition-curable silicone resin material that can provide a cured product having good crack resistance even under conditions.

  It is known that when the LED is energized / lighted, a rapid temperature rise occurs and the LED element receives a thermal shock. Therefore, the LED element is subjected to a severe temperature cycle by repeatedly turning on and off the LED element.

Epoxy resin is generally used as a sealing material for LED elements. Since the elastic modulus of the epoxy resin is high, the bonding wire may be broken due to stress due to the temperature cycle, or the epoxy resin may be cracked. Moreover, due to the stress that the epoxy resin gives to the LED chip, there is a concern that the light emission efficiency is lowered due to the collapse of the crystal structure of the semiconductor material.
As a countermeasure, a method of using room temperature curable silicone rubber as a buffer material and sealing the outside with an epoxy resin has been established as a standard method. However, in this method, since the epoxy resin does not adhere to the silicone resin, it is known that peeling occurs at the interface between the epoxy resin and the silicone rubber due to the temperature cycle, and the light extraction efficiency is extremely lowered with time. Yes.

It has been proposed to use a silicone resin as a material to replace the epoxy resin (see, for example, Patent Documents 1, 2, and 3). Silicone resins are superior in heat resistance, weather resistance, and discoloration resistance compared to epoxy resins, and are particularly superior in transparency, optical properties, etc. compared to other organic materials such as epoxy resins. In recent years, examples of use mainly of blue LEDs and white LEDs are increasing.
However, although these silicone resins have a lower elastic modulus than epoxy resins, their mechanical properties such as bending strength are also low, so the problem is that cracks are likely to occur due to the thermal shock that occurs when the LED is energized and lit. Have.

Japanese Patent Laid-Open No. 11-1619 JP 2002-265787 A JP 2004-186168 A

  The present invention has been made in view of the above circumstances, and is an addition-curable silicone for LED that has high transparency, has high resistance to thermal shock, hardly cracks even under severe temperature cycles, and does not cause peeling. It aims at providing a resin composition.

In order to solve the above problems, the present invention provides at least
(A) 100 parts by mass of a liquid or solid organopolysiloxane having a viscosity at 25 ° C. of 0.1 Pas or more, represented by the following average composition formula (1):
_{R n (C 6 H 5)} m SiO (4-n-m) / 2 (1)
(In the formula, R is a substituted or unsubstituted monovalent hydrocarbon group, alkoxy group or hydroxyl group excluding a phenyl group, 0.1 to 80 mol% of the total R is an alkenyl group, and n and m are 1 ≦ n + m. <2, a positive number satisfying 0.2 ≦ m / (n + m) ≦ 0.95)
(B) represented by the following average composition formula (2), which has at least two hydrogen atoms bonded to silicon atoms in one molecule, and 5 mol% or more of the total of all R ¹ and H bonded to silicon atoms is Linear organohydrogenpolysiloxane which is a phenyl group and has a viscosity of 1000 mPas or less at 25 ° C. The total number of alkenyl groups bonded to silicon atoms in the component (A) is the number of hydrogen atoms bonded to silicon atoms. A quantity of 0.3 to 10 per number,
R ¹ _a H _b SiO _{(4-ab) / 2} (2)
(Wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated hydrocarbon group, a and b are 0.7 ≦ a ≦ 2.1 and 0.01 ≦ b ≦ 1.0. And a positive number satisfying 0.8 ≦ a + b ≦ 2.6)
(C) an organosilicon compound having one alkenyl group and one silicon-bonded hydrogen atom in one molecule, 1 to 100 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (B);
(D) addition reaction catalyst catalyst amount,
An addition-curable silicone resin composition for light-emitting diodes is provided.

  Such an addition-curable silicone resin composition of the present invention has high transparency because of its excellent resistance to discoloration, and has high resistance to thermal shock. However, cracks and peeling are unlikely to occur.

  As described above, the addition-curable silicone resin composition of the present invention has high thermal shock resistance of the cured product, so that it is difficult for cracks and peeling to occur and is excellent in high transparency. Therefore, it is useful as a material for a light emitting diode element.

It is sectional drawing which shows typically an example of the light-emitting semiconductor device with which the addition-curable silicone resin composition of this invention is used suitably.

Hereinafter, the present invention will be described in more detail.
As described above, the conventionally used sealing materials for LED elements have the problem that cracks are likely to occur due to thermal shocks that occur particularly during energization / lighting of the LED, and severe temperature cycling is required. There has been a demand for a sealing material that does not easily crack or peel off.

  Therefore, as a result of intensive studies to solve the above problems, the present inventor used a compound having one alkenyl group and one silicon atom-bonded hydrogen atom in one molecule to increase the distance between crosslinks. As a result, the inventors have found that the above-described problems can be achieved, and have completed an addition-curable silicone resin composition suitable as an LED element material.

That is, the addition-curable silicone resin composition for light-emitting diodes of the present invention is at least
(A) 100 parts by mass of a liquid or solid organopolysiloxane having a viscosity at 25 ° C. of 0.1 Pas or more, represented by the following average composition formula (1):
_{R n (C 6 H 5)} m SiO (4-n-m) / 2 (1)
(In the formula, R is a substituted or unsubstituted monovalent hydrocarbon group, alkoxy group or hydroxyl group excluding a phenyl group, 0.1 to 80 mol% of the total R is an alkenyl group, and n and m are 1 ≦ n + m. <2, a positive number satisfying 0.2 ≦ m / (n + m) ≦ 0.95)
(B) represented by the following average composition formula (2), which has at least two hydrogen atoms bonded to silicon atoms in one molecule, and 5 mol% or more of the total of all R ¹ and H bonded to silicon atoms is Linear organohydrogenpolysiloxane which is a phenyl group and has a viscosity of 1000 mPas or less at 25 ° C. The total number of alkenyl groups bonded to silicon atoms in the component (A) is the number of hydrogen atoms bonded to silicon atoms. A quantity of 0.3 to 10 per number,
R ¹ _a H _b SiO _{(4-ab) / 2} (2)
(Wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated hydrocarbon group, a and b are 0.7 ≦ a ≦ 2.1 and 0.01 ≦ b ≦ 1.0. And a positive number satisfying 0.8 ≦ a + b ≦ 2.6)
(C) an organosilicon compound having one alkenyl group and one silicon-bonded hydrogen atom in one molecule, 1 to 100 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (B);
(D) addition reaction catalyst catalyst amount,
It is characterized by containing.

Hereinafter, each component of the present invention will be described in detail.
<(A) component>
The component (A) used in the present invention is a liquid or solid organopolysiloxane having a viscosity at 25 ° C. represented by the following average composition formula (1) of 0.1 Pas or more.
_{R n (C 6 H 5)} m SiO (4-n-m) / 2 (1)
(In the formula, R is a substituted or unsubstituted monovalent hydrocarbon group, alkoxy group or hydroxyl group excluding a phenyl group, 0.1 to 80 mol% of the total R is an alkenyl group, and n and m are 1 ≦ n + m. <2, a positive number satisfying 0.2 ≦ m / (n + m) ≦ 0.95)

As is understood from the fact that 1 ≦ n + m <2 in the average composition formula (1), this organopolysiloxane has RSiO _3/2 units, (C ₆ H ₅ ) SiO _3/2 units, SiO ₂ in the molecule. _It has a branched or three-dimensional network structure containing one or more of _two units.
Here, in the formula (1), C ₆ H ₅ is a phenyl group, R is a substituted or unsubstituted monovalent hydrocarbon group, alkoxy group or hydroxyl group excluding the phenyl group, preferably having 1 to 20 carbon atoms. And particularly preferably an unsubstituted or substituted monovalent hydrocarbon group, alkoxy group or hydroxyl group of 1 to 10, and specific examples of such a hydrocarbon group include a methyl group, an ethyl group, a propyl group, and a butyl group. Alkyl groups such as pentyl group, hexyl group, cyclohexyl group and heptyl group; aryl groups other than phenyl group such as tolyl group, xylyl group and naphthyl group; aralkyl groups such as benzyl group and phenethyl group; vinyl group and allyl group Unsaturated hydrocarbon groups such as alkenyl groups such as butenyl, pentenyl, hexenyl and heptenyl; chloromethyl, 3-chloropropyl, , 3,3-trifluoropropyl group and the like, and the alkoxy group includes an unsubstituted alkoxy group such as a methoxy group, an ethoxy group, a propoxy group, a phenoxy group, a methoxyethoxy group, Examples include alkoxy-substituted alkoxy groups such as ethoxyethoxy group.

In the present invention, it is necessary that 0.1 to 80 mol%, preferably 0.5 to 50 mol%, of these total Rs are alkenyl groups. If the alkenyl group content is less than 0.1 mol%, the required hardness of the silicone resin cannot be obtained, and if it exceeds 80 mol%, the silicone resin becomes brittle because there are too many crosslinking points. N and m are 1 ≦ n + m <2, preferably 1.2 ≦ n + m <1.9, 0.2 ≦ m / (n + m) ≦ 0.95, preferably 0.25 ≦ m / (n + m) ≦. Although it is a positive number satisfying 0.90, even if n + m is smaller than 1, even if it is 2 or more, necessary hardness and strength cannot be obtained. Further, even if the phenyl group content is less than this, the hardness and strength required for the silicone resin cannot be obtained. As the alkenyl group, a vinyl group is preferable.
Further, the viscosity at 25 ° C. of the component (A) needs to be 0.1 Pas or more, and when it is less than 0.1 Pas, workability is lowered and the strength of the cured product is also insufficient.

<(B) component>
The organohydrogenpolysiloxane of component (B) has at least two hydrogen atoms bonded to silicon atoms in one molecule represented by the following average composition formula (2), and all R ¹ bonded to silicon atoms: A linear organohydrogenpolysiloxane in which 5 mol% or more of the total of H is a phenyl group and the viscosity at 25 ° C. is 1000 mPas or less, usually 0.5 to 1000 mPas, preferably 1 to 500 mPas.
R ¹ _a H _b SiO _{(4-ab) / 2} (2)
(Wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated hydrocarbon group, a and b are 0.7 ≦ a ≦ 2.1 and 0.01 ≦ b ≦ 1.0. And a positive number satisfying 0.8 ≦ a + b ≦ 2.6)

In the formula (2), R ¹ is preferably a substituted or unsubstituted monovalent hydrocarbon group having 1 to 12 carbon atoms, particularly preferably about 1 to 10 carbon atoms, excluding an aliphatic unsaturated hydrocarbon group. Specific examples of such hydrocarbon groups include methyl groups, ethyl groups, propyl groups, butyl groups, pentyl groups, hexyl groups, cyclohexyl groups, and heptyl groups; alkyl groups such as phenyl groups, tolyl groups, and xylyl groups. Groups, aryl groups such as naphthyl group; aralkyl groups such as benzyl group and phenethyl group; halogenated alkyl groups such as chloromethyl group, 3-chloropropyl group and 3,3,3-trifluoropropyl group. A and b are 0.7 ≦ a ≦ 2.1, preferably 1.0 ≦ a ≦ 1.8, 0.01 ≦ b ≦ 1.0, preferably 0.02 ≦ b ≦ 1.0, More preferably 0.10 ≦ b ≦ 1.0 and 0.8 ≦ a + b ≦ 2.6, preferably 1.01 ≦ a + b ≦ 2.4, more preferably 1.6 ≦ a + b ≦ 2.2. If it is a positive number and b is less than 0.01, sufficient hardness as a silicone resin cannot be obtained.

This organohydrogenpolysiloxane has a linear molecular structure. From the viewpoint of compatibility with the component (A), physical properties of the cured product, etc., R ¹ and H (hydrogen atom) bonded to a silicon atom Of these, those having 5% by mole or more, preferably 10 to 50% by mole, of a phenyl group are suitably used. In the case where R ¹ is other than a phenyl group, a methyl group is preferable.
The blending amount of the organohydrogenpolysiloxane of component (B) is such that the number of hydrogen atoms bonded to silicon atoms is 0.3 to 1 per total number of alkenyl groups bonded to silicon atoms in component (A). It is preferable that 10 is mixed. If it is less than 0.3, the curing becomes sweet, and if it exceeds 10, the cured product becomes too brittle. Preferably it is 0.5-5.

<(C) component>
Component (C) is an organosilicon compound having one alkenyl group and one silicon-bonded hydrogen atom in one molecule. Examples of such alkenyl groups include vinyl, allyl, butenyl, and pentenyl groups. Hexenyl group, heptenyl group and the like.
The component (C) used in the present invention acts as a chain length extending material. As a result, it has high resistance to thermal shock, and crack growth is avoided even under severe temperature cycles. The alkenyl group and silicon-bonded hydrogen atom in component (C) may be located at either the molecular end or in the middle of the molecule. Further, the alkenyl group may be bonded directly to the silicon atom or may be bonded via another organic group.

It is important that such a component (C) has only one alkenyl group and only one silicon-bonded hydrogen atom in one molecule, and its structure is not limited. It may be either a shape or a ring. Specific examples include the following (in the following compounds, y ≧ 0, x ≧ 0).

The viscosity of component (C) at 25 ° C. is not particularly limited, but is preferably 10000 mPas or less, more preferably 1 to 1000 mPas.
The blending amount of the component (C) is 1 to 100 parts by weight, preferably 5 to 80 parts by weight, particularly preferably 100 parts by weight in total of the components (A) and (B). Is 5 to 50 parts by mass. This is because if the content of the component (C) is less than 1 part by mass, the crack resistance is not effective, and if it exceeds 100 parts by mass, the strength of the cured product tends to be weakened.

<(D) component>
The addition reaction catalyst of component (D) serves as a catalyst for crosslinking by addition reaction of component (A), component (B) and component (C). Highly efficient catalysts such as reaction products with polyhydric alcohols, olefin complexes of chloroplatinic acid, coordination compounds of chloroplatinic acid and vinylsiloxane, platinum-based catalysts such as platinum black, palladium-based catalysts, rhodium-based catalysts, etc. From this aspect, a platinum catalyst is usually used. Particularly in this application, low chlorine catalysts that do not corrode metals are preferable because they are used for the production of sealed LEDs in the electronics field. Among them, divinyltetramethyldisiloxane and divinyldiphenyl that do not contain a chlorine component are preferred. Those modified with dimethyldisiloxane or the like are preferable. These addition reaction catalysts may be used alone or in combination of two or more.

  In addition, the compounding quantity of this addition reaction catalyst can be made into the effective quantity (catalyst quantity) which acts as a catalyst, Preferably it is 1-1000 ppm with respect to the total amount of (A)-(C) component. If it is 1 ppm or more, curing proceeds at an appropriate speed, and if it is 1000 ppm or less, the workable time does not become too short, and the cured product is not easily yellowed, which is economical. Most preferably, it is 5-100 ppm.

<Arbitrary ingredients>
In the composition of the present invention, as the optional components other than the above components (A) to (D), for example, all conventionally known control agent compounds which are compounds having a curing inhibitory effect on the addition reaction catalyst are used. Can be used. Such compounds include phosphorus-containing compounds such as triphenylphosphine, nitrogen-containing compounds such as tributylamine, tetramethylethylenediamine, and benzotriazole, sulfur-containing compounds, acetylenic compounds, compounds containing two or more alkenyl groups, hydroper Examples include oxy compounds and maleic acid derivatives. Since the degree of the curing delay effect by the control agent compound varies greatly depending on the chemical structure of the control agent compound, it is preferable to adjust the addition amount of the control agent compound to an optimum amount for each of the control agent compounds to be used. In an amount that does not hinder the curing, and is usually 0.5 parts by mass or less, preferably 0.01 to 0.3 parts by mass with respect to 100 parts by mass of component (A). Used in quantity.

  Moreover, you may contain the adhesion imparting agent for improving the adhesiveness in this composition. Examples of the adhesion-imparting agent include silane coupling agents and hydrolysis condensates thereof. As silane coupling agents, epoxy group-containing silane coupling agents, (meth) acrylic group-containing silane coupling agents, isocyanate group-containing silane coupling agents, isocyanurate group-containing silane coupling agents, amino group-containing silane coupling agents , And known ones such as a mercapto group-containing silane coupling agent are exemplified, and preferably 0.1 to 20 parts by mass, preferably 0.3 to 100 parts by mass with respect to the total of 100 parts by mass of component (A) and component (B). 10 parts by mass.

EXAMPLES Hereinafter, although an Example and a comparative example are shown and this invention is demonstrated concretely, this invention is not restrict | limited to the following Example etc.
[Example 1]
Average unit formula: (PhSiO _3/2 ) _0.55 [(CH ₂ ═CH) MeSiO _2/2 ] _0.2 (Me ₂ SiO) _0.25 Branched organopolysiloxane [property = solid (25 ° C.), silicon atom-bonded vinyl group content in silicon atom-bonded all organic groups = 14 mol%, silicon atom-bonded phenyl group content in silicon atom-bonded all organic groups = 38 mol%, standard styrene conversion Weight average molecular weight of 3,000] 90 parts by mass, a hydrogen gas generation amount having 10 mol% of phenyl groups with respect to the total of hydrogen atoms, phenyl groups and methyl groups bonded to silicon atoms is 200 ml / g, and the viscosity is 20 mPas 18 parts by mass of organohydrogenpolysiloxane, 10 parts by mass of a compound having a viscosity of 20 mPas represented by the following formula (C-1) as component (C), chloroplatinic acid / 1,3-divinyltetramethyldisiloxane complex as a platinum atom content of 0.06 parts by mass of toluene, 0.05 part by mass of ethynylcyclohexanol, and γ-glycidoxypropyltrimethoxysilane 3 A silicone composition (a) was prepared by uniformly mixing parts by mass. When the silicone composition (a) was cured by heating at 150 ° C. for 4 hours, the hardness was 64 in Shore D.

HMe ₂ SiO (Ph ₂ SiO) ₁ CH ₂ CH ₂ SiMePhOSiMePhVi (C-1)

[Example 2]
80 parts by mass of a methyl phenylvinylsiloxy group-blocked diphenylsiloxane copolymer having a main chain composed only of diphenylsiloxane units and a viscosity of 0.4 Pas, (PhSiO _3/2 ) _0.75 [(CH ₂ ═CH) Me ₂ SiO _2/2 ] Branched organopolysiloxane represented by _0.25 [property = solid (25 ° C.), silicon atom-bonded vinyl group content = 20 mol%, silicon in silicon atom-bonded all organic groups Content ratio of atom-bonded phenyl group = 50 mol%, weight average molecular weight in terms of standard styrene = 1600] 20 parts by mass, 30 mol% of phenyl group based on the total of hydrogen atom bonded to silicon atom, phenyl group and methyl group 32 parts by mass of an organohydrogenpolysiloxane having a hydrogen gas generation amount of 140 ml / g and a viscosity of 20 mPas, Examples 20 parts by mass of the compound of formula (C-1) used in the above, 0.5 parts by mass of toluene solution containing 1% by mass of chloroplatinic acid / 1,3-divinyltetramethyldisiloxane complex as platinum atom content, ethynylcyclo A silicone composition (b) was prepared by uniformly mixing 0.05 part by mass of hexanol and 3 parts by mass of γ-glycidoxypropyltrimethoxysilane. When the silicone composition (b) was cured by heating at 150 ° C. for 4 hours, the hardness was 50 in Shore D.

[Comparative Example 1]
Composition (c) was prepared according to Example 1 except that formula (C-1) was not used. When the silicone composition (c) was cured by heating at 150 ° C. for 4 hours, the hardness was 69 in Shore D.

[Comparative Example 2]
Composition (d) was prepared according to Example 2 except that formula (C-1) was not used. This silicone composition (d) was cured by heating at 150 ° C. for 4 hours. As a result, the hardness was 60 in Shore D.

The evaluation methods in the silicone compositions (a) to (d) prepared in the above examples and comparative examples were performed as follows.
[Evaluation methods]
As the light emitting semiconductor package light emitting element, a light emitting semiconductor device as shown in FIG. 1 having a light emitting layer made of InGaN and mounting an LED chip having a main light emission peak of 470 nm was used. Here, 1 is a housing, 2 is a light emitting element, 3 and 4 are lead electrodes, 5 is a die bond material, 6 is a gold wire, and 7 is a sealing resin. The curing conditions for the sealing resin 7 are 150 ° C. and 4 hours.

Moisture resistance and infrared reflow test method 10 light-emitting semiconductor devices were placed in a constant temperature and humidity chamber at 85 ° C and 85% for 24 hours, and then passed through an infrared reflow device (260 ° C) three times to observe changes in appearance. did. The results are shown in Table 1. In addition, the thing by which the crack of resin and the peeling from an LED package were confirmed was counted as NG.

As shown in Table 1, in Examples 1 and 2, the NG number is 0, the crack resistance is good even under high temperature / low temperature cycle conditions, no peeling occurs, and the light extraction effect is high. I understand. Moreover, such a silicone resin was also excellent in high transparency.
On the other hand, in Comparative Examples 1 and 2, peeling occurred from more than half of the resin cracks and LED packages. Thereby, when a conventional thing is used as a sealing material, it turns out that productivity of LED will worsen.

  From the above, since the addition-curable silicone resin composition of the present invention has high resistance to thermal shock, it is difficult to generate cracks and has high light extraction efficiency, and is subjected to severe temperature cycles. It proved to be useful for LEDs.

  The present invention is not limited to the above embodiment. The above-described embodiment is an exemplification, and the present invention has substantially the same configuration as the technical idea described in the claims of the present invention, and any device that exhibits the same function and effect is the present invention. It is included in the technical scope of the invention.

DESCRIPTION OF SYMBOLS 1 ... Housing | casing 2 ... Light emitting element 3, 4 ... Lead electrode 5 ... Die-bonding material,
6 ... gold wire, 7 ... sealing resin.

Claims (1)

at least,
(A) 100 parts by mass of a liquid or solid organopolysiloxane having a viscosity at 25 ° C. of 0.1 Pas or more, represented by the following average composition formula (1):
_{R n (C 6 H 5)} m SiO (4-n-m) / 2 (1)
(In the formula, R is a substituted or unsubstituted monovalent hydrocarbon group, alkoxy group or hydroxyl group excluding a phenyl group, 0.1 to 80 mol% of the total R is an alkenyl group, and n and m are 1 ≦ n + m. <2, a positive number satisfying 0.2 ≦ m / (n + m) ≦ 0.95)
(B) represented by the following average composition formula (2), which has at least two hydrogen atoms bonded to silicon atoms in one molecule, and 5 mol% or more of the total of all R ¹ and H bonded to silicon atoms is Linear organohydrogenpolysiloxane which is a phenyl group and has a viscosity of 1000 mPas or less at 25 ° C. The total number of alkenyl groups bonded to silicon atoms in the component (A) is the number of hydrogen atoms bonded to silicon atoms. A quantity of 0.3 to 10 per number,
R ¹ _a H _b SiO _{(4-ab) / 2} (2)
(Wherein R ¹ is a substituted or unsubstituted monovalent hydrocarbon group excluding an aliphatic unsaturated hydrocarbon group, a and b are 0.7 ≦ a ≦ 2.1 and 0.01 ≦ b ≦ 1.0. And a positive number satisfying 0.8 ≦ a + b ≦ 2.6)
(C) an organosilicon compound having one alkenyl group and one silicon-bonded hydrogen atom in one molecule, 1 to 100 parts by mass with respect to 100 parts by mass in total of the component (A) and the component (B);
(D) addition reaction catalyst catalyst amount,
An addition-curable silicone resin composition for light-emitting diodes, comprising:

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