JP2011186323A - Liquid crystal display device and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem involved in a conventional liquid crystal display device using a liquid crystal panel, in particular, using a liquid crystal panel of configuration of sticking thin resin substrates or the like together that, stress generated by the expansion or shrinkage of a liquid crystal material is generated when an operating temperature becomes a high temperature or a low temperature, and a substrate material for use and a wall surface structure material for use cannot follow the stress, and phenomena such as the peeling of the adhesion part of a wall surface structure and a substrate and bubble generation from the liquid crystal material occur as a result. <P>SOLUTION: In a non-display area formed at the outer periphery of the display area of the liquid crystal panel, an inter-substrate non-adhesion area where the wall surface structure for keeping a substrate interval is bonded only to one substrate is provided. Even if the stress generated by the expansion or shrinkage of the liquid crystal material by a temperature change is generated, the swelling and depression of the substrate in the area are generated to release the stress. Thus, the liquid crystal display device including the liquid crystal panel having excellent display performance even if the temperature change is generated is obtained. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a liquid crystal display device and a method for manufacturing the same.

  A liquid crystal display device (cholesteric liquid crystal display device) using a liquid crystal composition (cholesteric liquid crystal) in which a cholesteric phase is formed is thinner and lighter than other conventional liquid crystal display devices and is semipermanent in a state in which no power is supplied. Because it has a memory notation function that continues to display images, it has excellent low power consumption performance, and can be applied to the display section of electronic paper and e-books, as well as various electronic terminal devices such as mobile devices. Development is underway.

  A liquid crystal panel of such a cholesteric liquid crystal display device having a memory function usually uses a columnar spacer or a wall structure that holds a transparent substrate such as a glass substrate or a resin substrate with a predetermined gap (cell gap interval). The gap is filled with a liquid crystal material having predetermined characteristics.

  FIG. 6 is a schematic cross-sectional view for explaining an outline of a liquid crystal panel manufacturing process of a liquid crystal display device using such a conventional cholesteric liquid crystal. As shown in FIG. 6A, the liquid crystal panel 100 of the liquid crystal display device has, for example, a lower substrate 101 on which a transparent conductive film pattern of a scanning electrode pattern is formed on a resin substrate such as a thin polycarbonate substrate. A wall structure 102 having a predetermined height and pattern shape is formed using a positive acrylic photoresist by photolithography. As shown in the figure, the wall surface structure 102 occupies a central portion in the lower substrate 101, performs liquid crystal display such as a matrix, does not perform liquid crystal display on the outer periphery, and mainly introduces liquid crystal. -It is formed in the non-display area 104 used for applications such as distribution between substrates.

  Next, after spraying granular spacers having a diameter corresponding to a cell gap (not shown) on the surface of the lower substrate 101, as shown in FIG. A sealing material 105 having an inlet at a location for sealing the injected liquid crystal is formed.

  Then, as shown in FIG. 6 (3), a transparent conductive film pattern of a data electrode pattern arranged on the lower substrate 101 and a resin substrate such as a thin polycarbonate substrate so as to be orthogonal to the scanning electrodes. By bonding the upper substrate 106 formed with, and pressurizing and heating it, the wall structure 102 and the sealing material 107 formed of resist are cured, and the two substrates are bonded and fixed.

  Normally, the formed wall structure 102 pattern has a formation area density of, for example, about 10 to 20% in the display region 103 and a non-display region 104 so as not to collapse the cell gap formed between both substrates. It becomes about 10% or less.

  As shown in FIG. 6 (4), the liquid crystal 108 is injected from a liquid crystal injection port (not shown), and then the injection port is sealed to complete the liquid crystal panel 100 of the liquid crystal display device. As shown in this cross-sectional view, there is a display area 103 occupying most of the center, a non-display area 104 on the outer periphery, and a sealing material area 107 on the outer periphery, and both substrates are fixed with a cell gap.

  FIG. 7 is a schematic plan view for explaining the planar shape of the liquid crystal panel 100 of the liquid crystal display device. As is clear from this, the non-display area 104 surrounds the outer periphery of the display area 103 occupying most of the center, the sealing material area 107 surrounds the outer periphery thereof, and the liquid crystal injection port 109 is in a partial area thereof. The gap between the upper substrate and the lower substrate is fixed by the wall structure 102 in the display region 103 and the non-display region 104 on the outer periphery thereof, and the outer periphery thereof is fixed by the sealing material region 107. A section taken along a line AB in the figure corresponds to the sectional view shown in FIG.

WO2007 / 007394 JP 2009-271207 A

  However, in the liquid crystal panel of the liquid crystal display device formed in this way, the linear expansion coefficient of the cured photoresist forming the wall structure 102 is smaller than that of the material of the liquid crystal 108, and the cell gap with respect to the temperature change. The following of the internal space is poor.

  As a result, for example, when the liquid crystal panel of the liquid crystal display device is in a high temperature state, the wall structure bonded to the substrate is peeled off, or the sealing material region or the sealing portion of the liquid crystal inlet is broken. On the other hand, in a low temperature state, a tensile stress is generated on the liquid crystal, and a failure such as generation of bubbles from the liquid crystal material occurs, which significantly deteriorates the display performance of the liquid crystal display device.

The liquid crystal display device of the present invention is
A pair of substrates;
A display area comprising a set of pixels defined by electrodes on the pair of substrates;
A non-display area in the outer peripheral area of the display area where the pixels do not exist;
A liquid crystal sealing region between the pair of substrates in an outer peripheral region of the non-display region;
A first wall structure that fixes the pair of substrates in the display area;
A second wall surface structure that does not fix the pair of substrates in the non-display area;
And a sealing material structure that seals and fixes the pair of substrates in the sealing region.

Also,
The manufacturing method of the liquid crystal display device of the present invention includes:
Forming a first electrode for defining the pixel in a display region which is a set of pixels on a surface of the first substrate of a pair of a first substrate and a second substrate;
A first wall surface structure is formed in the display area on the surface of the first substrate, and a wall surface height of the first wall structure is formed in a non-display area where the pixels are not present in an outer peripheral area of the display area. Forming a second wall structure having a lower wall height;
In the liquid crystal sealing region in the outer peripheral region of the non-display region on the surface of the first substrate, the pair of second members having a sealing material height at least equal to or higher than the wall surface height of the first wall surface structure. Forming a sealing material structure for sealing and fixing between the first substrate and the second substrate, and forming a first bonding substrate;
Forming, on the second substrate surface, a second electrode for defining the pixel in a display area which is a set of pixels;
The display area on the surface of the second substrate, the non-display area in which the pixels are not present in the outer peripheral area of the display area, and the liquid crystal sealing area in the outer peripheral area of the non-display area. Forming an insulating film on the surface and forming a second bonding substrate;
A step of bonding the first bonding substrate and the second bonding substrate together.

  In a liquid crystal display device using a liquid crystal panel according to a conventional method, even when the liquid crystal panel has a structure in which a thin resin substrate or the like is particularly bonded, the use temperature becomes high or low, so that the liquid crystal material expands or Stress due to shrinkage occurs, and the substrate material used and the wall structure material cannot follow this stress. As a result, peeling of the bonding part between the wall structure and the substrate, generation of bubbles from the liquid crystal material, etc. A phenomenon occurs. In the apparatus and manufacturing method of the present invention, the place where the stress can be effectively absorbed, that is, the wall structure is provided with a region where one substrate is not bonded, thereby suppressing the occurrence of peeling and bubbles even if the temperature changes. A liquid crystal display device having a liquid crystal panel with good display performance and a manufacturing method thereof can be obtained.

Cross-sectional schematic diagram for explaining the production process of the embodiment of the present invention (No. 1) Cross-sectional schematic diagram for explaining the production process of the embodiment of the present invention (No. 2) Cross-sectional schematic diagram illustrating the shape of the wall surface structure used in the examples of the present invention Cross-sectional schematic diagram illustrating the shapes of the non-display area and the sealing material area of the present invention The figure explaining the stress release in the non-display area | region and sealing material area | region of this invention Cross-sectional schematic diagram explaining the manufacturing process of a conventional liquid crystal panel Plane schematic diagram illustrating the configuration of a conventional liquid crystal panel

  Embodiments of the present invention will be described below with reference to the accompanying drawings.

Example 1
1 and 2 are schematic cross-sectional views for each process for explaining a process for manufacturing a liquid crystal panel of the liquid crystal display device of the present invention. FIG. 1 shows, for example, a manufacturing process of a lower substrate, which is a substrate on which scan electrodes are formed, and FIG. A liquid crystal display according to the present invention, in which a manufacturing process of an upper substrate on which a data electrode arranged so as to be orthogonal to the scanning electrode is formed, and the upper substrate and the lower substrate are bonded together. 3 shows a process for manufacturing a liquid crystal panel of the apparatus.

  1 and 2, the substrate 1 shown in FIGS. 1 (1-1) and 2 (2-1) is a 100 μm thick PC (polycarbonate) or PET (polyethylene terephthalate) substrate. As the transparent conductive film 2, an IZO (indium / zinc / oxide) transparent conductive film having a thickness of 0.15 μm was deposited. Next, as shown in FIG. 1 (1-2) and FIG. 2 (2-2), for example, a positive resist was applied to a film thickness of 2.0 μm to form a resist film 3.

  Then, using a predetermined mask and photolithography technique, the scan electrode forming resist pattern 4 shown in FIG. 1 (1-4) is formed on the lower substrate, and the upper substrate is shown in FIG. 2 (2-4). Then, a resist pattern 13 for forming the data electrode in an array orthogonal to the scanning electrode is formed, and then, using this as a mask, as shown in FIGS. 1 (1-4) and 2 (2-4), transparent conductive The film 2 is etched, the resist pattern 4 is peeled off as shown in FIG. 1 (1-5), and the scanning electrode 5 is peeled off. Similarly, the resist pattern 13 is peeled off as shown in FIG. 1 (2-5). Thus, the data electrode 14 is formed. And although not shown in figure, the alignment film was formed on both board | substrates, and after this alignment film was baked, it rubbed so that it might become substantially perpendicular | vertical. As shown in FIGS. 1 (1-5) and 2 (2-5), the central region where the scan electrodes and the data electrodes are formed is a region where display cells are formed. The peripheral non-display area 7 does not directly contribute to the liquid crystal display, but there is an area necessary for bonding the two substrates and maintaining the distance between them and introducing the liquid crystal.

  On the other hand, for the lower substrate, as shown in FIG. 1 (1-6), on the substrate surface, the distance between the two bonded substrates is maintained, the two are fixed together, the display cell gap is maintained, and the liquid crystal in the cell is properly A wall structure resist film 8 that forms a wall structure for filling is formed. For example, a positive acrylic photoresist (product name SS-9902) was used as the resist material, and the film thickness was adjusted to 5 μm after patterning.

  Then, as shown in FIG. 1 (1-7), exposure is performed using a predetermined photomask 9, and development processing is performed as shown in FIG. 1 (1-8). Get.

  As for the shape of the wall surface structure 10, for example, a collective structure based on a cross-shaped wall surface structure 18 as shown in FIG. 3 is applied. FIG. 3 is a plan view of a portion where the wall structure 10 formed on the lower substrate is viewed from the upper surface side in FIG. 1 (1-8). In this case, the cross-shaped wall structure 17 is shown in FIG. A region surrounded by 相当 corresponds to one pixel region, and a broken line indicates a (scan) electrode edge (there is an electrode in the pixel portion) 18. At this time, the pixel pitch was 145 μm, while the interelectrode gap was 15 μm. In addition, the formation area density of the wall surface structure 10 is the same as about 10% in both the display area 6 and the non-display area 7.

And as shown to FIG. 1 (1-9), the wall surface structure low profile process which makes the height of the wall surface structure 10 only of the non-display area | region 7 low was performed. Specifically, the wall surface structure 10 having only the non-display area 7 is heated and cured by a CO ₂ laser (so-called laser annealing method), so that the height of the wall surface structure is about 3 μm. The height was reduced to a level (height difference indicated by G in the figure = gap). The method for reducing the height is not limited to this method, and can be realized by, for example, a method of physically pressing a corresponding portion while heating it (so-called heating press method). The wall structure 10 in the display area 6 is not cured. This curing process is performed by an adhesion curing process after the two substrates are bonded, which is performed in a subsequent process.

  Next, as shown in FIG. 1 (1-10), a sealing material in which a glass fiber having a diameter of 4.5 μm is mixed and dispersed in a UV curing / heating combined type resin at a predetermined portion of the peripheral portion of the substrate. 12 was formed as shown in the figure, and a liquid crystal injection port was provided at the end of the substrate. In addition, spacers 11 were dispersed on the substrate surface mainly including the display region 6 in which the wall structure 10 was formed. Specifically, a plastic spacer made of divinylbenzene having a diameter of 4.5 μm was used. As described above, the film thickness of the scanning electrode 5 is 0.15 μm of the transparent conductive film 2 and the diameter of the spacer 11 is 4.5 μm. In this figure, the spacer 11 is shown in such a manner that the thickness of the scanning electrode 5 is ignored. This also applies to FIG. 2B described later.

  In FIG. 2, as shown in FIG. 2A, on the substrate shown in FIG. 1 (1-10) (the completed substrate structure of the lower substrate), the substrate (2-5) shown in FIG. The completed substrate structure of the upper substrate is inverted and aligned, and is pressed and heated as indicated by P in the figure, and the two substrates are bonded together by the wall structure 10 and the sealing material 12, and the wall structure Adhesion curing with the upper substrate and the sealing material are cured.

  As a result, as shown in FIG. 2 (b), in the surface region 6, the gap is maintained by the spacer 11, and the upper and lower substrates are bonded by the wall structure 10, and the outer edge portions of the both substrates are substantially the same as the spacer 11. In the non-display area 7, the upper and lower substrates are not bonded, and a certain gap can be maintained so that the two are not in close contact with each other. Thus, the liquid crystal panel 16 having a configuration in which the liquid crystal panels 16 are not fixed to each other is realized.

  Therefore, referring to the plan view of the liquid crystal panel 100 of the liquid crystal display device of FIG. 7, the display region 103 is a bonding region between the two substrates by the wall structure, and the sealing material region 107 is the sealing material 107. The adhesion area of both substrates having a non-adhesion portion), and the non-display area 104 in the middle area thereof, was the non-adhesion area of both substrates.

  Although not shown, using both the substrate configurations, the inside of the cell was evacuated, the substrate end including the liquid crystal inlet was immersed in green cholesteric liquid crystal, and the atmosphere was released to inject liquid crystal into the cell. After that, the liquid crystal injection port was sealed with UV curable resin, and the liquid crystal panel of the liquid crystal display device was completed.

  This liquid crystal panel was left in the atmosphere at −10 ° C. for 24 hours, but no bubbles were generated in the liquid crystal panel. Further, even when left at 50 ° C. for 24 hours, no peeling of the wall structure or destruction of the sealing portion was observed.

(Example 2)
The above-described characteristic configuration of the present invention of the liquid crystal panel of the present liquid crystal display device was realized by a method different from that of the first embodiment.

  FIG. 4 is an enlarged view of a main part in a schematic cross-sectional view of the liquid crystal panel 16 of the liquid crystal display device of the present invention. FIG. 4A is a schematic cross-sectional view showing the simplified liquid crystal panel 16 of the liquid crystal display device of the present invention shown in the first embodiment. In this case, the liquid crystal 19 has been injected. As can be seen from FIG. 4 (2) in which a part thereof is enlarged, in Example 1, the height of the wall surface structure 10 in the display region 6 (= cell gap due to dispersed spacer diameter of 4.5 μm) is the sealing material. The height of the region 15 (= the height due to the glass fiber diameter of 4.5 μm mixed in the sealing material) is substantially the same, and the height of the wall structure 10 in the non-display region 7 (= low profile by laser irradiation, 3 μm) The front and rear) are lower than those to avoid adhesion between the substrates.

  In order to make the adhesion between the substrates more reliable, in Example 2, as in Example 1, “as shown in FIG. 1 (1-10), UV curing / In the section of “Forming sealing material 12 in which glass fiber having a diameter of 4.5 μm is mixed and dispersed in a heat combined type resin as shown in the figure”, the diameter of the UV cured / heat combined type resin is 8. A sealing material 12 ”in which 0 μm glass fiber was mixed and dispersed was used. Except for this point, liquid crystal panels were manufactured in the same process as in Example 1.

  As a result, as shown in FIG. 4 (3), the height of the sealing material region 15 is higher than the height of the wall surface structure 10 in the display region 6 (= the gap of the cells due to the dispersed spacer diameter of 4.5 μm). (= Height due to the glass fiber diameter of 8.0 μm mixed in the sealing material) is high, and the height of the wall surface structure 10 (shown as a solid line in the figure) in the non-display area 7 (= low profile due to laser irradiation) The effect of avoiding adhesion between substrates is further increased.

  Then, as in Example 1, the inside of the cell was evacuated, the substrate end including the liquid crystal inlet was immersed in green cholesteric liquid crystal, and the atmosphere was released to inject liquid crystal 19 into the cell. After that, the liquid crystal injection port was sealed with UV curable resin, and the liquid crystal panel of the liquid crystal display device was completed.

This liquid crystal panel was left in the atmosphere at −15 ° C. for 24 hours, but it was found that no bubbles were generated in the liquid crystal panel. Further, even when left at 50 ° C. for 24 hours, no peeling of the wall structure or destruction of the sealing portion was observed.
(Example 3)
The characteristic configuration of the present invention was realized by another method different from the first or second embodiment.

  In Example 3, the wall structure 10 is not formed in the non-display area 7 in the steps after FIG. 1 (1-7), and as a result, the non-display area is shown in FIG. 1 (1-10). 7 has a flat structure in which nothing is formed. Further, regarding the formation of the sealing material in FIG. 1 (1-10), the wall structure 10 in the display region 6 is formed by mixing glass fibers having a diameter of 8.0 μm as in the second embodiment. It was higher than the height of.

  On the other hand, the wall surface structure 10 of the non-display area 7 is formed on the upper substrate side, and this substrate is formed by the same process and material as in the first embodiment after the process of FIG. 2 (2-5). A wall structure resist film was formed on the surface, and the thickness was similarly adjusted to 5 μm after patterning. Exposure is performed using a predetermined photomask so that a wall structure only in the non-display area is formed, and development processing is performed to obtain a wall structure in the non-display area. Then, in order to reduce the height of the wall structure in the non-display region, the entire upper substrate was cured by baking at 150 ° C. for 1 hour to reduce the height to about 3 μm.

  The liquid crystal panel of the liquid crystal display device produced through these steps is similar in structure to that shown in FIG. 4 (2), but the wall surface structure 10 (indicated by a broken line in the figure) in the non-display area 6 is the upper side. The structure is formed on the substrate and does not adhere to the lower substrate. The effect of avoiding the adhesion between the substrates is considered to be the same as in Example 2.

  Similarly to Example 1, the inside of the cell was evacuated, the substrate end including the liquid crystal inlet was immersed in green cholesteric liquid crystal, and the atmosphere was released to inject liquid crystal 19 into the cell. Thereafter, the liquid crystal injection port was sealed with a UV curable resin to complete the liquid crystal panel of the liquid crystal display device.

  This liquid crystal panel was left in the atmosphere at −15 ° C. for 24 hours in the same manner as in Example 2. It was found that no bubbles were generated in the liquid crystal panel. Further, even when left at 50 ° C. for 24 hours, no peeling of the wall structure or destruction of the sealing portion was observed.

  In the manufacturing process of Example 3, since the wall structure of the display area and the non-display area is formed on different substrates, the wall structure of the non-display area is reduced in height, or conversely, There is a feature that the degree of freedom of the manufacturing process for increasing the height of the wall structure in the display area is increased. For example, in order to reduce the height, it is possible to cope with baking of the entire substrate instead of laser curing treatment (so-called laser annealing method) or heating press method for partial areas, and display areas and non-display areas as required The material can be formed by changing the material of the wall structure (for example, other kinds of novolac resist materials, inorganic materials, metal materials, etc.).

(Comparative example)
As a comparative example, it was manufactured and evaluated with the configuration of a conventional liquid crystal panel using substantially the same process as in Example 1.

  That is, in the comparative example, the wall structure 10 in the non-display area 7 is not reduced in height in the process of FIG. 1 (1-9), and the spacer 11 and the seal are sealed in FIG. 1 (1-10). The stop material 12 is formed, and then the process proceeds to the process of FIG. 2A to perform a bonding process of the lower substrate and the upper substrate in this state. In FIG. In the liquid crystal panel 16, the resist material of all the wall structures 10 in the display area 6 and the non-display area 7 is bonded and cured to the upper and lower substrates.

  And like Example 1, the inside of a cell was made into a vacuum state, the substrate edge part containing a liquid-crystal injection hole was immersed in the green cholesteric liquid crystal, and the liquid crystal was inject | poured in the cell by air-releasing. After that, the liquid crystal injection port was sealed with UV curable resin, and the liquid crystal panel of the liquid crystal display device was completed.

  When this liquid crystal panel was left in the atmosphere at room temperature for 24 hours, bubbles were observed in the cells at a rate of approximately 20% of all the cells of the liquid crystal panel. Moreover, when left at 50 ° C. for 24 hours, peeling of some wall structures and destruction of the sealing portion were observed.

  These phenomena will be examined from the results of Examples 1 to 3 and the comparative example. FIG. 5 is a schematic cross-sectional view of the liquid crystal panel of the liquid crystal display device of the present invention, FIG. 5 (1) is an overall view, and FIGS. 5 (2) and 5 (3) are partially enlarged views centering on a non-display area. FIG. 5 (2) shows the state of force generation in the outward bulging direction in the non-display area of the liquid crystal panel when the temperature rises from the steady state at the time of manufacturing the liquid crystal panel. ) Schematically represents the state of force generation in the inward dent direction in the non-display area of the liquid crystal panel when the temperature drops from the steady state at the time of fabrication.

  Usually, when a liquid crystal panel is completed, two thin polycarbonate substrates, for example, 100 μm level, that maintain the space constituting the cells in the display area are made of a wall structure using acrylic photoresist as described above. The gap between both substrates is forcibly maintained at regular intervals across the entire panel surface, and the gap between the substrate surface, including the cell level of the display panel, is uneven, such as dents and protrusions. Degradation of the display screen due to conversion is suppressed. The fixing of both substrates by the wall surface structure is performed over the entire region including the display portion and the non-display portion in the conventional panel configuration method using a particularly thin substrate (see FIG. 6 (4)). The encapsulated liquid crystal material can be moved to some extent including between cells by means of the shape of the wall structure and the injection path.

By the way, the linear expansion coefficient of the cured photoresist of the liquid crystal material and the wall structure material is
Linear expansion coefficient of liquid crystal material> The linear expansion coefficient of the cured photoresist material and that of the liquid crystal material are large. The structure of the liquid crystal and the wall structure / substrate, which is in an equilibrium state suitable for liquid crystal display when the liquid crystal panel is manufactured, expands as the operating temperature of the liquid crystal panel further increases, causing the liquid crystal material to expand and compressive stress. Work. This expansion force extends to the entire internal space consisting of a wall structure and a resin substrate, which is a hardened and fixed photoresist material, but the internal space at the individual cell unit level is a small space divided by the wall structure, Both the wall structure and the substrate are poor in following the expansion of the liquid crystal material. For this reason, it is considered that this expansion force concentrates on the part where the hardened and fixed wall structure and the substrate are bonded, particularly where the bonding strength is weak, and causes the peeling of the bonded part. In some cases, the sealing portion for the liquid crystal or the sealing portion of the liquid crystal inlet may be damaged.

  On the other hand, when the operating environment temperature is lower than when the liquid crystal panel is completed, a shrinking force is applied to the liquid crystal material. Tensile stress is generated and evaporation of moisture or the like mixed in a small amount in the liquid crystal material or the substrate results in a phenomenon that bubbles are generated in the cell, and the display performance of the liquid crystal display device is significantly deteriorated.

  In the comparative example, the above situation occurred, and in particular, a phenomenon such as generation of bubbles occurred at room temperature for 24 hours. This is often the final process of the liquid crystal panel, the bonding process between the two substrates, the liquid crystal encapsulation and the inlet sealing process, etc., when the working temperature is higher than the room temperature. However, it can be considered that the temperature is lower than that at the time when the liquid crystal panel is completed.

  On the other hand, in the case of the liquid crystal panel in which the wall structure in the non-display region is in a non-adhered state with the substrate in the configuration of the present invention, the liquid crystal material expands in the same manner as described above when the temperature rises. However, in the case of the configuration of the present invention, a portion having high expansion followability, that is, a non-adhesive region of the wall structure is provided for the expansion force to induce stress therein to prevent the panel from being destroyed. In the structure of the present invention, the space of the non-adhesive region (although it is a non-display region in this embodiment) of the wall structure, that is, from the end of the wall structure to which the display region is adhered to the end of the sealing region The space formed by the two substrates can be made arbitrarily large depending on the design, and the expanded force of the liquid crystal material in each small internal space separated by the wall structure of the display area is due to the internal distribution of the liquid crystal panel. As shown by the arrow E in the temperature rise state example in FIG. 5B, the expansion force of the liquid crystal is greatly relieved by the occurrence of the outward expansion of the thin resin substrate. It can be considered that panel destruction can be prevented.

  In addition, when the temperature is lowered, as described above, a tensile stress is applied to the liquid crystal material as described above. In this embodiment, it is a non-display area), and here, as shown by the arrow S in the example of the temperature drop state in FIG. It can be considered that the contraction force of the liquid crystal can be greatly relieved and the generation of bubbles can be prevented.

  As for the space volume of the stress relief region, generally, for example, a sufficient capacity necessary and sufficient for stress relief is required. In our experiment, in the panel display area of 125 × 125 mm, a sufficient effect is obtained when the non-display area outside the display area has a vertical width δx = 2.5 mm and a horizontal width δy = 3.5 mm. Obtained. Of course, it is not limited to this depending on various panel manufacturing conditions. As a more effective expansion of the space volume in the stress release region, it can be said that the method of increasing the height of the sealing material shown in Examples 2 and 3 higher than that of the wall structure.

  In this embodiment, it is described that a non-adhesive region of the wall surface structure is provided as a place to release stress due to expansion / contraction of the liquid crystal material, and the specific location is a non-display region in order to prevent deterioration of the liquid crystal display function The non-display area is described as the outer peripheral area of the display area. Of course, the non-adhesion area | region of a wall surface structure is not restricted to it. Depending on the display area configuration method of the panel, the display area may be provided in a part of the display area or inside the display area.

  Also, it goes without saying that the specific manufacturing method is not limited to the methods given in the examples.

DESCRIPTION OF SYMBOLS 1 Substrate 2 Transparent conductive film 3 Resist film 4, 13 Resist pattern 5 Scan electrode 6, 103 Display area 7, 104 Non-display area 8 Resist film for wall structure 9 Photomask 10, 102 Wall structure 11 Spacer 12, 105 Sealing Stop material 14 Data electrode 15, 107 Sealing material region 16, 100 Liquid crystal panel 17 Cross-shaped wall structure 18 Inter-scan electrode gap 19, 108 Liquid crystal 101 Lower substrate 106 Upper substrate 109 Liquid crystal inlet

Claims (6)

A pair of substrates;
A display area comprising a set of pixels defined by electrodes on the pair of substrates;
A non-display area in the outer peripheral area of the display area where the pixels do not exist;
A liquid crystal sealing region between the pair of substrates in an outer peripheral region of the non-display region;
A first wall structure that fixes the pair of substrates in the display area;
A second wall surface structure that does not fix the pair of substrates in the non-display area;
A liquid crystal display device comprising: a sealing material structure that seals and fixes between the pair of substrates in the sealing region.   The liquid crystal display device according to claim 1, wherein a wall surface height of the second wall surface structure is lower than a wall surface height of the first wall surface structure.   3. The liquid crystal display device according to claim 1, wherein a sealing material height of the sealing material structure is at least equal to or higher than a wall surface height of the first wall surface structure. Forming a first electrode for defining the pixel in a display region which is a set of pixels on a surface of the first substrate of a pair of a first substrate and a second substrate;
A first wall surface structure is formed in the display area on the surface of the first substrate, and a wall surface height of the first wall structure is formed in a non-display area where the pixels are not present in an outer peripheral area of the display area. Forming a second wall structure having a lower wall height;
In the liquid crystal sealing region in the outer peripheral region of the non-display region on the surface of the first substrate, the pair of second members having a sealing material height at least equal to or higher than the wall surface height of the first wall surface structure. Forming a sealing material structure for sealing and fixing between the first substrate and the second substrate, and forming a first bonding substrate;
Forming, on the second substrate surface, a second electrode for defining the pixel in a display area which is a set of pixels;
The display area on the surface of the second substrate, the non-display area in which the pixels are not present in the outer peripheral area of the display area, and the liquid crystal sealing area in the outer peripheral area of the non-display area. Forming an insulating film on the surface and forming a second bonding substrate;
A method of manufacturing a liquid crystal display device, comprising: bonding the first bonding substrate and the second bonding substrate.   5. The method of manufacturing a liquid crystal display device according to claim 4, wherein the second wall surface structure is formed on the surface of the second substrate instead of being formed on the surface of the first substrate.   6. The liquid crystal display according to claim 4, wherein the step of forming the second wall surface structure having a wall surface height lower than the wall surface height of the first wall surface structure is a laser annealing method or a heat press method. Device manufacturing method.