JP2005258199A - Method of manufacturing patterning substrate and liquid crystal display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a patterning substrate superior in display quality and a liquid crystal display device provided with the patterning substrate. <P>SOLUTION: Color layers 52R, 52G, and 52B as pattern parts are formed on a substrate. Then color layers 52R, 52G, and 52B are hardened and have surfaces flattened while applying a pressure or load equal to or higher than an atmospheric pressure. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a patterning substrate manufacturing method and a liquid crystal display device including the patterning substrate.

  In recent years, a liquid crystal display device has been used as a monitor for displaying data including a lot of information such as a portable television and a computer. A liquid crystal display device generally includes an array substrate, a counter substrate, a liquid crystal layer sandwiched between the substrates, and a color filter formed on one of the array substrate and the counter substrate. ing. The color filter has red, green, and blue colored layers.

When forming a color filter, first, a red colored layer is formed by applying, patterning, and baking a red resist. Then, the same process is repeated and the green colored layer and the blue colored layer are formed sequentially (for example, refer patent document 1).
JP 2000-1111724 A

When the color filter is formed as described above, the peripheral portions of the adjacent colored layers overlap with each other, and a step portion is formed. Further, unevenness is formed on the surface of the colored layer due to the conditions such as exposure, development, and baking when forming the colored layer, and contraction, melting, and the like depending on the material itself. For this reason, the surface of the substrate on which the color filter is formed is not flat. In addition, the gap of the liquid crystal layer and the liquid crystal alignment change due to the stepped portion of the colored layer and the unevenness of the colored layer surface. As a result, light leakage occurs in the stepped portion and the uneven portion, causing a decrease in contrast and a decrease in viewing angle.
From the above, it is important to flatten the substrate surface by eliminating the color filter stepped portion and the surface uneven portion formed on the substrate.
The present invention has been made in view of the above points, and an object of the present invention is to provide a patterning substrate manufacturing method having excellent display quality and a liquid crystal display device including the patterning substrate.

  In order to solve the above problems, a patterning substrate manufacturing method according to an aspect of the present invention forms a pattern portion on a substrate, cures the pattern portion while applying a pressure or a load of atmospheric pressure or higher to the pattern portion, The surface of the pattern portion is flattened.

  In addition, a liquid crystal display device including a patterning substrate according to another aspect of the present invention includes an array substrate, a counter substrate disposed opposite to the array substrate with a predetermined gap, and the array substrate and the counter substrate. A liquid crystal layer sandwiched therebetween, wherein at least one of the array substrate and the counter substrate forms a pattern portion on the substrate, and the pattern portion is subjected to a pressure or load higher than atmospheric pressure on the pattern portion. Is hardened and the surface of the pattern portion is flattened.

  According to the present invention, it is possible to provide a patterning substrate manufacturing method with excellent display quality and a liquid crystal display device including the patterning substrate.

Hereinafter, a liquid crystal display device and a method for manufacturing the same according to a first embodiment of the present invention will be described in detail with reference to the drawings.
As shown in FIGS. 1 and 2, the liquid crystal display device includes an array substrate 1, a counter substrate 2 as a patterning substrate disposed opposite to the array substrate with a predetermined gap, and between the array substrate and the counter substrate. And a liquid crystal layer 3 sandwiched between the two. The array substrate 1 and the counter substrate 2 have a rectangular display region R1 positioned at the center and a frame-shaped non-display region R2 positioned along the periphery of the display region. In this embodiment, an XGA (eXtended Graphics Array) array substrate 1 will be described as an example.

  The array substrate 1 includes a glass substrate 11 as a transparent insulating substrate. A plurality of signal lines 20 and a plurality of scanning lines 21 are arranged in a matrix on the glass substrate 11. On the glass substrate 11, a plurality of stripe-shaped auxiliary capacitance lines 22 constituting the auxiliary capacitance element 30 are formed and extend in parallel with the scanning lines 21. At each intersection of the signal line 20 and the scanning line 21, a thin film transistor (hereinafter referred to as TFT) 12 as a switching element is provided.

  As shown in FIG. 3, the TFT 12 includes, as a channel layer, a semiconductor film 13 made of amorphous silicon (a-Si) or polysilicon (P-Si), and a gate electrode formed by extending a part of the scanning line 21. 16. In the present embodiment, the semiconductor film 13 and a later-described auxiliary capacitance electrode 14 are formed of P-Si.

  More specifically, in the display region R1, the auxiliary capacitance electrode 14 constituting the semiconductor film 13 and the auxiliary capacitance element 30 is formed on the glass substrate 11, and the gate is formed on the glass substrate including the semiconductor film and the auxiliary capacitance electrode. An insulating film 15 is formed. A scanning line 21, the gate insulating film 15, and the auxiliary capacitance line 22 are disposed on the gate insulating film 15. The auxiliary capacitance electrode 14 and the auxiliary capacitance line 22 are disposed to face each other with the gate insulating film 15 interposed therebetween. An interlayer insulating film 17 is formed on the gate insulating film 15 including the scanning line 21, the gate electrode 16, and the auxiliary capacitance line 22.

  A signal line 20 and a contact wiring 23 are formed on the interlayer insulating film 17. The signal line 20 and the contact wiring 23 are respectively connected to the source region and the drain region of the semiconductor film 13 through contact holes formed in the interlayer insulating film 17. Further, the contact wiring 23 is connected to the auxiliary capacitance electrode 14 through the gate insulating film 15 and the interlayer insulating film 17. Here, the auxiliary capacitance line 22 is formed except for a connection portion between the auxiliary capacitance electrode 14 and the contact wiring 23.

  As shown in FIGS. 1 to 3, in the display region R <b> 1, a transparent interlayer insulating film 24 is formed so as to overlap the interlayer insulating film 17, the signal line 20, and the contact wiring 23. On the interlayer insulating film 24, a pixel electrode 27 is formed of a transparent conductive film such as ITO (indium tin oxide). Each pixel electrode 27 is connected to the contact wiring 23 through a contact hole 26 formed in the interlayer insulating film 24. The peripheral edge of the pixel electrode 27 overlaps the signal line 20 and the auxiliary capacitance line 22. For this reason, the signal line 20 and the auxiliary capacitance line 22 have a light shielding function as a black matrix. Each pixel electrode 27 is electrically connected in parallel to the auxiliary capacitance electrode 14.

  A columnar spacer 28 is formed on the pixel electrode 27. Although not all illustrated, a plurality of columnar spacers 28 are formed at a desired density. An alignment film 29 is formed on the interlayer insulating film 24 and the pixel electrode 27.

  On the other hand, in the non-display region R2, a rectangular frame-shaped light shielding portion 31 is formed on the interlayer insulating film 17, and this light shielding portion extends along the periphery of the colored layer of the display region R1. Here, the light shielding portion 31 contributes to the shielding of light leaking from the peripheral portion of the display region R1 or the inside of the bezel 80 described later.

  The counter substrate 2 includes a glass substrate 41 as a transparent insulating substrate. A plurality of striped black matrix layers 51 are formed on the glass substrate 41. In the display region R1, on the glass substrate 41 and the black matrix layer 51, red colored layers 52R, green colored layers 52G, and blue colored layers 52B are alternately arranged as pattern portions, and the color filter 50 is formed. More specifically, the colored layers 52R, 52G, and 52B are each formed in a stripe shape, and these peripheral portions are disposed so as to overlap the black matrix layer 51. On the colored layers 52R, 52G, and 52B, a counter electrode 42 formed of a transparent conductive film such as ITO is formed. An alignment film 43 is formed on the counter electrode 52.

  The array substrate 1 and the counter substrate 2 are joined to each other by, for example, a thermosetting sealing material 60 disposed at the peripheral edge of both substrates, and are arranged to face each other with a predetermined gap by a plurality of columnar spacers 28. Yes. A liquid crystal layer 3 is formed in a region surrounded by the array substrate 1, the counter substrate 2, and the sealing material 60. A liquid crystal injection port (not shown) is provided in a part of the sealing material 60, and the liquid crystal injection port is sealed with a sealing material (not shown).

  A polarizing plate 71 is disposed on the outer surface of the array substrate 1. A polarizing plate 72 is disposed on the outer surface of the counter substrate 2. A frame-like bezel 80 is disposed on the outer surface side of the counter substrate 2 and outside the display region R1. A backlight 90 is disposed on the outer surface side of the array substrate 1. The backlight 90 includes a light guide plate 91 disposed to face the array substrate 1, a light source 92 disposed to face one side edge of the light guide plate, and a reflection plate 93.

Next, a more detailed configuration of the liquid crystal display device will be described together with its manufacturing method.
First, a mother glass (not shown) is prepared as a transparent insulating substrate having a size larger than that of the array substrate 1. In this embodiment, a mother glass (not shown) has regions for forming four array substrates 1. Thereafter, four array substrates 1 are formed at the same time. Here, the manufacturing method will be described on behalf of one array substrate.

  On the prepared mother glass, the TFT 12, the signal line 20, the scanning line 21, the auxiliary capacitance line 22, and the like are formed by a normal manufacturing process such as repeated film formation and patterning. Next, an interlayer insulating film 24 is formed on the mother glass so as to overlap the display region R1, and then fired. Thereafter, a contact hole 26 is formed in a part of the interlayer insulating film 24 that overlaps each TFT 12.

  Subsequently, ITO is deposited on the mother glass by sputtering, for example, and patterned to form a plurality of pixel electrodes 27 connected to the contact wirings 23 through the contact holes 26, respectively. Thereafter, a black resist, for example, is applied as a light-shielding material on the interlayer insulating film 17, the interlayer insulating film 24, and the pixel electrode 27 with a spinner and dried.

  Next, a photomask is placed opposite to the black resist applied to the array substrate 1, and ultraviolet rays are irradiated through the photomask to expose the black resist. Subsequently, the exposed black resist is developed and baked. Thereby, the columnar spacer 28 and the light shielding part 31 are simultaneously formed of the same material.

  Next, after an alignment film material is applied on the array substrate 1 overlapping the display region R1, an alignment film 29 is formed by performing an alignment process (rubbing). Thereby, four array substrates 1 are formed on one mother glass.

  On the other hand, in the manufacturing method of the counter substrate 2 as the patterning substrate, first, as shown in FIG. 4, a mother glass 40 is prepared as a transparent insulating substrate having a size larger than that of the counter substrate 2. In this embodiment, the mother glass 40 has regions for forming four counter substrates 2. Thereafter, four counter substrates 2 are formed at the same time, and here, a manufacturing method thereof will be described on behalf of one counter substrate.

  A striped black matrix layer 51 is formed on the mother glass 40. Next, an ultraviolet curable acrylic resin resist (hereinafter referred to as a red resist) in which a red pigment is dispersed on the entire surface of the mother glass 40 including the black matrix layer is applied with, for example, a spinner. Next, a pattern is exposed on the red resist using a predetermined photomask.

At the time of exposure, the red resist is irradiated with ultraviolet rays with a wavelength of 365 nm and an exposure amount of 100 mJ / cm ² . In addition, the photomask used here has a stripe-shaped pattern in which ultraviolet rays are irradiated to a portion to be colored red.

  Next, the exposed red resist is developed with a 1% aqueous solution of KOH for 20 seconds. Thereafter, the mother glass 40 is placed on a hot plate heated to about 200 ° C., and the red resist is temporarily baked for 1 minute. Thereby, a red colored layer 52R that is not completely cured is formed. In this manner, the colored layer 52R is formed in the display region R1 by using the photolithography method.

  Thereafter, similarly to the colored layer 52R, the colored layer 52G and the colored layer 52B that are not completely cured are sequentially formed in the display region R1 by using the photolithography method. In this embodiment, the colored layers 52R, 52G, and 52B are formed with a thickness of approximately 3.0 μm.

  As shown in FIG. 5, in the state in which the colored layers 52R, 52G, and 52B are formed as described above, for example, from the thinnest portion of the colored layer 52R, that is, the central portion in the width direction of the colored layer 52R, The height to the top of the step where the colored layer 52G overlaps was 0.3 μm. That is, the peripheral portions of the adjacent colored layer 52R and the colored layer 52G overlap each other, and a stepped portion A that rises by about 0.3 μm is formed.

  Next, as shown in FIG. 6, the colored layers 52 </ b> R, 52 </ b> G, and 52 </ b> B are pressed and flattened by the manufacturing apparatus 100 in a state where they are formed on the mother glass 40. Here, the manufacturing apparatus 100 includes a pressing jig 110 and a surface plate 120 having a flat pressing surface as a pressing member. The surface plate 120 is larger in size than the mother glass 40, and the pressing surface is made of Teflon. The pressing jig 110 is disposed on the lower stage 111, the upper stage 112, the lower stage and the upper stage, respectively, and determines the position where the lower plate and the upper stage face each other, and the metal plate 113 facing each other. And a support member 114 that supports the lower stage and the upper stage.

  When pressurizing using the manufacturing apparatus 100, the mother glass 40 is disposed on the metal plate 113 on the lower stage 111, and then the pressing surface of the surface plate 120 is made to face the mother glass, and the surface plate is used as a colored layer. 52R, 52G, and 52B are arranged in contact with each other. In this embodiment, ten mother glasses 40 on which colored layers 52R, 52G, and 52B that are not completely cured are formed are prepared. On the metal plate 113 on the lower stage 111, the mother glass 40 and the surface plate 120 are prepared. 10 are alternately stacked and arranged. Thereafter, the metal plate 113 on the upper stage 112 is brought into contact with the uppermost surface plate 120.

  Next, the colored layers 52R, 52G, and 52B on the ten mother glasses 40 are simultaneously pressed on the upper stage 112 while applying a load of 0.02 MPa or more as a pressure or load equal to or higher than atmospheric pressure. With the load applied, the manufacturing apparatus 100 is conveyed into an oven heated to 220 ° C. Thereby, the colored layers 52R, 52G, and 52B of the mother glass 40 are baked and cured at 220 ° C. for 30 minutes. Thereafter, the mother glass 40 is taken out of the oven and the manufacturing apparatus 100.

  As shown in FIG. 7, when the colored layers 52R, 52G, and 52B are formed by the above-described steps, the maximum value of the width from the central portion of the colored layer 52R to the top of the step where the colored layer 52R and the colored layer 52G overlap is as follows. It was only 0.05 μm. That is, the maximum height of the stepped portion A is 0.05 μm. As a result, the colored layers 52R, 52G, and 52B having a planarized surface are formed.

  Thereafter, ITO is deposited by sputtering, and the counter electrode 42 is formed so as to overlap the colored layers 52R, 52G, and 52B. Subsequently, after an alignment film material made of, for example, polyimide is applied on the counter substrate 2 overlapping the display region R1, an alignment film 43 is formed by performing an alignment process (rubbing). Thereby, four counter substrates 2 are formed on one mother glass 40.

  Next, the mother glass 40 on which the array substrate 1 is formed and the mother glass 40 on which the counter substrate 2 is formed are arranged so that a predetermined gap is held by the plurality of columnar spacers 28 and the array substrate and the counter substrate are opposed to each other. . Then, the mother glasses are bonded to each other by the sealing material 60 disposed at the peripheral portions of the array substrate 1 and the counter substrate 2 facing each other. Subsequently, the two mother glasses bonded together are divided along the peripheral edge e of the array substrate 1 and the counter substrate. As a result, four sets of empty liquid crystal cells are obtained.

  Next, for example, a nematic liquid crystal material is injected between both substrates of each empty liquid crystal cell through a liquid crystal injection port (not shown) formed in the sealing material 60 by vacuum injection. Thereafter, the liquid crystal inlet is sealed with a sealing material such as an ultraviolet curable resin. Thereby, the liquid crystal is sealed in the region surrounded by the array substrate 1, the counter substrate 2, and the sealing material 60, and the liquid crystal layer 3 is formed. Here, the array substrate 1 and the counter substrate 2 are arranged to face each other so that the twist angle of the liquid crystal molecules in the liquid crystal layer 3 is 90 °. Thereby, a liquid crystal cell is completed.

  Next, polarizing plates 71 and 72 are sequentially attached to the outer surfaces of the array substrate 1 and the counter substrate 2 of the liquid crystal cell, and the bezel 80, the backlight 90, a drive circuit (not shown), and the like are assembled into a mounting module. Here, the contrast in the front direction of the display screen in the state assembled in the module was 500. Thus, a TN (twisted nematic) type liquid crystal display device is completed.

  According to the liquid crystal display device and the method for manufacturing the liquid crystal display device configured as described above, when forming the colored layers 52R, 52G, and 52B, the colored layer is formed as a pattern portion that is not completely cured on the mother glass 40. After the formation, the surface of the colored layer is flattened by curing the colored layer while applying a load at a pressure of 0.02 MPa. More specifically, when the colored layer is cured, the surface plate is disposed so as to face and contact the colored layer, and then the colored layer is heated and cured while applying a load to the surface plate. For this reason, the surface of the colored layers 52R, 52G, and 52B can be planarized. As a result, a liquid crystal display device having a high contrast and a wide viewing angle can be obtained.

  Further, when the colored layers 52R, 52G, and 52B are cured, the mother glass 40 and the surface plate 120 on which the colored layers that are not completely cured are alternately stacked, and then a load is applied to the uppermost surface plate. The colored layers on the plurality of mother glasses are simultaneously cured. Thereby, since the colored layers 52R, 52G, and 52B on the plurality of mother glasses 40 can be planarized at the same time, the manufacturing time can be shortened.

  The colored layers 52R, 52G, and 52B are formed with a flat surface using the manufacturing apparatus 100. For this reason, compared with the case where the surface of the colored layers 52R, 52G, and 52B is planarized using a polishing apparatus, the number of manufacturing steps is reduced, and the colored layer can be easily formed without using a polishing liquid or the like.

  Here, even when the colored layers 52R, 52G, and 52B are flattened without being heated and then the flattened colored layers are heated (main firing), the colored layers 52R, 52G, and 52B are formed. The stepped portion A can be improved to some extent. However, since shrinkage, melting, or the like depending on the material confidence occurs due to heating, there is a possibility that irregularities may be formed on the surfaces of the colored layers 52R, 52G, and 52B. For this reason, when forming the colored layers 52R, 52G, and 52B, it is desirable to form (harden) the colored layer by heating it while planarizing the surface of the colored layer.

  Furthermore, the inventors of the present application investigated the change in the contrast between the stepped portion A and the front direction when the colored layers 52R, 52G, and 52B were formed by changing the pressure above atmospheric pressure or the applied pressure as a load. .

  As shown in FIGS. 8 and 9, the colored layers 52R, 52G, and 52B were formed without applying pressure (pressing force 0), and the pressing force was 0.005 MPa, 0.02 MPa, 0.04 MPa, and 0. .08 MPa was formed. As can be seen from the figure, as the pressing force is increased, the maximum value of the stepped portion A where the colored layer 52R and the colored layer 52G overlap is reduced, and is improved to 1/6 to 1/4 when formed without applying pressure. It was done. In addition, the contrast increased as the pressing force was increased, and the contrast was improved by 1.25 times that when the pressure was not applied. Furthermore, it was found that even when the colored layers 52R, 52G, and 52B were formed by increasing the pressure to 0.24 MPa, the maximum value of the stepped portion A was lowered and the contrast was increased. Here, if the applied pressure exceeds 0.24 MPa, the colored layers 52R, 52G, and 52B are spread and formed.

  From the above, if the applied pressure when forming the colored layers 52R, 52G, and 52B is 0.005 MPa or more, preferably 0.005 MPa to 0.24 MPa, the surface of the colored layer can be flattened, and sufficient contrast is obtained. can get.

  The height of the stepped portion A is measured by using a contact step meter to measure the height of nine points in the surface of each counter substrate 2 of the mother glass 40 on which the cured colored layers 52R, 52G, and 52B are formed. This was done by measuring.

Next, a liquid crystal display device and a method for manufacturing the same according to a second embodiment of the present invention will be described in detail.
When forming a colored layer on the mother glass 40, as a pattern portion that is not completely cured, a colored layer 52R having a thickness of 2.5 μm, a colored layer 52G having a thickness of 2.7 μm, and a colored portion having a thickness of 2.8 μm Layers 52B are formed sequentially. Here, a stepped portion A is formed where the colored layers overlap. Then, while pressing the pressing surface of the surface plate 120 on the mother glass 40, the surface plate is placed in contact with the colored layers 52R, 52G, and 52B.

  Here, the surface plate 120 will be described. As shown in FIG. 10, the surface plate 120 has a fixed pattern 121 formed on the pressing surface (surface) and a cutout portion 122 formed on the peripheral edge. In this embodiment, the pattern 121 of the surface plate 120 has a stripe shape corresponding to each colored layer (colored layers 52R, 52G, 52B) of each counter substrate 2 formed on the mother glass 40. Yes. More specifically, the pattern 121 has a stripe shape having a different depth for each color, and the depth of the portion corresponding to the colored layer 52G is 0 (μm). The depth is 0.2 μm, and the depth corresponding to the colored layer 52B is 0.3 μm. Therefore, in the pattern 121, the portion corresponding to the colored layer 52B is formed deepest, and the portion corresponding to the colored layer 52G is formed deeper than the portion corresponding to the colored layer 52R.

  When the surface plate 120 is placed in contact with the colored layers 52R, 52G, and 52B, for example, the alignment mark 44 (FIG. 4) formed on the periphery of the mother glass 40 is visually observed from the cutout portion 122 of the surface plate by a camera. Position them while aligning them. Thereby, as shown in FIG. 11, the pattern corresponding to each colored layer is arrange | positioned facing each corresponding colored layer.

  Subsequently, the mother glass 40 and the surface plate 120 are alternately stacked and arranged while performing alignment using the alignment marks 44 and the cutout portions 122. Then, using the manufacturing apparatus 100 described above, the colored layer 52R on the ten mother glasses 40 while applying a load with a pressure of 0.1 MPa or more on the upper stage 112 described above, for example, 52G and 52B are pressed simultaneously.

  Next, the manufacturing apparatus 100 is transported into an oven heated to 220 ° C. with a load applied. The colored layers 52R, 52G, and 52B of the mother glass 40 conveyed into the oven are heated and cured as main firing at 220 ° C. for 30 minutes. Thereafter, the manufacturing apparatus 100 is taken out from the oven, and each mother glass 40 is taken out from the manufacturing apparatus.

  As a result, as shown in FIG. 12, a colored layer 52R with a thickness of 2.5 μm, a colored layer 52G with a thickness of 2.7 μm, and a colored layer 52B with a thickness of 2.8 μm are formed. For this reason, the thickness of each colored layer is different, the colored layer 52B is the highest, and the colored layer 52G is formed higher than the colored layer 52R. Further, the stepped portion A is removed by polishing, and the surfaces of the colored layers 52R, 52G, and 52B are flattened.

  Thereafter, the counter substrate 2 on which the colored layers 52R, 52G, and 52B are formed is assembled into a module. Here, when the contrast in the front direction of the display screen was measured in the state assembled in the module, it was 500. Thus, a TN (twisted nematic) type liquid crystal display device is completed.

  According to the liquid crystal display device and the method for manufacturing the liquid crystal display device configured as described above, when forming the colored layers 52R, 52G, and 52B, the pattern portions that are not completely cured on the mother glass 40 are provided for each color. After the colored layers having different heights are formed, the colored layer is heated and cured while applying a load to the surface plate 120 having the pattern 121 on the pressing surface at a pressure of 0.1 MPa. For this reason, the colored layer 52B is the highest, and the colored layer 16B, the colored layer 16G, and the colored layer 16R are sequentially formed lower in order. The surface of each colored layer is flattened. As a result, a liquid crystal display device having a high contrast and a wide viewing angle can be obtained.

  Here, the inventors of the present application investigated the height of the stepped portion A of the colored layers 52R, 52G, and 52B. Using a contact-type step gauge, nine heights in the surface of each counter substrate 2 of the prepared mother glass 40 are measured. Thereby, the level difference part A can be measured, and as a result of measurement, there was no undesired level difference.

Next, a liquid crystal display device and a method for manufacturing the same according to a third embodiment of the present invention will be described in detail.
When forming a plurality of columnar spacers 28 and light-shielding portions 31 as pattern portions on a mother glass that forms the array substrate 1 as a patterning substrate, on the interlayer insulating film 17, the interlayer insulating film 24, and the pixel electrode 27, As a light-shielding material, for example, a black resist is applied to a film thickness of 4.8 μm with a spinner. Thereafter, the black resist is dried.

  Next, a photomask is placed opposite to the black resist applied to the array substrate 1, and ultraviolet rays are irradiated through the photomask to expose the black resist. Here, the photomask has a pattern facing the region where the columnar spacers 28 and the light shielding portions 31 are formed. Subsequently, the exposed black resist is developed and then baked. As a result, a plurality of columnar spacers 28 and light shielding portions 31 that are not completely cured are formed.

  Thereafter, using the above-described manufacturing apparatus 100, the flat pressing surface of the surface plate 120 is brought into contact with the plurality of columnar spacers 28, and a plurality of columnar spacers and The light shielding part 31 is heated and cured. Thereby, the plurality of columnar spacers 28 and the light shielding portion 31 are simultaneously formed of the same material. The plurality of columnar spacers 28 are formed with a uniform height, and the average value of the height is 4.8 μm. That is, a liquid crystal display device having a liquid crystal layer 3 gap of 4.8 μm is obtained.

  According to the liquid crystal display device configured as described above and the method of manufacturing the liquid crystal display device, when forming the columnar spacer 28, after forming the columnar spacer as a pattern portion that is not completely cured on the mother glass, These columnar spacers are cured while applying a pressure or load higher than atmospheric pressure. More specifically, the columnar spacer is heated and cured while applying a load to the surface plate 120 with a pressure of 0.005 MPa. The columnar spacers 28 are formed at a uniform height, and the gap (layer thickness) of the liquid crystal layer 3 is uniform. As a result, a liquid crystal display device having a high contrast and a wide viewing angle can be obtained.

Further, the inventors of the present application investigated the average value of the gap of the liquid crystal layer 3 and the change of 3σ when the columnar spacer 28 was formed by changing the pressure above atmospheric pressure or the applied pressure as a load.
As shown in FIG. 13 and FIG. 14, the columnar spacer 28 was formed without applying pressure (pressing force 0), and the pressing force was formed at 0.005 MPa, 0.02 MPa, 0.04 MPa, and 0.08 MPa. . As can be seen from the figure, as the pressing force is increased, the average height of the columnar spacers 28, that is, the average value of the gap of the liquid crystal layer 3 decreases. Further, as the applied pressure was increased, 3σ was reduced, which was improved to about ½ of that formed without applying pressure. Further, even when the columnar spacer 28 was formed by increasing the applied pressure to 0.2 MPa, the columnar spacer was formed at a uniform height, and 3σ was also slight.

  From the above, if the applied pressure when forming the columnar spacer 28 is 0.005 MPa or more, preferably 0.005 MPa to 0.2 MPa, the gap of the liquid crystal layer 3 can be made uniform and sufficient contrast can be obtained.

  The average value and 3σ of the gap of the liquid crystal layer 3 are obtained by the following method. First, a mother glass having a plurality of hardened columnar spacers 28 is prepared. Next, the height of the columnar spacers 28 is measured at nine points in each surface of the array substrate 1 of the prepared mother glass using a contact step meter.

  When four array substrates 1 are formed on the mother glass, the height of the columnar spacers 28 is measured at 36 points on the mother glass. Thereby, the average value of the gap of the liquid crystal layer 3 is obtained as the average value of the height of the columnar spacers 28. Further, 3σ is calculated from the height of these columnar spacers 28. That is, 3σ indicates the unevenness of the gap of the liquid crystal layer 3, and the smaller 3σ means that the unevenness of the gap of the liquid crystal layer is eliminated.

Next, a liquid crystal display device and a method for manufacturing the same according to a fourth embodiment of the present invention will be described in detail.
As shown in FIG. 15, the array substrate 1 as a patterning substrate includes a glass substrate 11 as a transparent insulating substrate. On the glass substrate 11, the TFT 12, the interlayer insulating film 17, various wirings, and the like are formed as in the above-described embodiment. In the display region R1, on the interlayer insulating film 17 including the signal line 20 and the contact wiring 23 (FIG. 3), a colored layer 52R, a colored layer 52G, and a colored layer 52B are alternately arranged as a pattern portion. A color filter 50 is formed. More specifically, the colored layers 52R, 52G, and 52B are each formed in a stripe shape, and these peripheral portions are disposed so as to overlap the signal lines. Here, the surfaces of the colored layers 52R, 52G, and 52B are formed flat.

  A plurality of pixel electrodes 27 formed of a transparent conductive film such as ITO is provided on the colored layers 52R, 52G, and 52B. Each pixel electrode 27 is connected to the contact wiring 23 through a contact hole formed in each colored layer. More specifically, the pixel electrode 27 is connected to the TFT 12 via the contact wiring 23 described above. A plurality of columnar spacers 28 are disposed on the pixel electrode 27. An alignment film 29 is formed on the colored layers 52R, 52G, and 52B and the pixel electrode 27. Here, the colored layers 52R, 52G, and 52B are formed by using the same manufacturing method as in the first embodiment.

  The counter substrate 2 includes a glass substrate 41 as a transparent insulating substrate. On the glass substrate 41, a counter electrode 42 formed of a transparent conductive film such as ITO is formed. An alignment film 43 is formed on the counter electrode 42 in the display region R1.

  The array substrate 1 and the counter substrate 2 are bonded to each other by a sealing material 60. A liquid crystal layer 3 is formed in a region surrounded by the array substrate 1, the counter substrate 2, and the sealing material 60. Further, polarizing plates 71 and 72, a bezel 80, and a backlight 90 are provided to constitute a liquid crystal display device.

According to the liquid crystal display device and the method for manufacturing the liquid crystal display device configured as described above, when the colored layers 52R, 52G, and 52B are formed, the surface plate 120 is opposed to the colored layer that is not completely cured, and contact is made. Then, the colored layer is heated and cured while applying a load to the surface plate. For this reason, the surface of the colored layers 52R, 52G, and 52B can be planarized. As a result, a liquid crystal display device having a high contrast and a wide viewing angle can be obtained.
In the second, third, and fourth embodiments described above, other configurations are the same as those of the first embodiment described above, and the same portions are denoted by the same reference numerals and detailed description thereof will be given. Was omitted. In the embodiment described above, the method for manufacturing the patterning substrate is as described in the method for manufacturing the liquid crystal display device described above.

  The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention. For example, the stripe-like shape formed on the surface plate 120 has the deepest portion corresponding to the colored layer 52B and the deeper portion corresponding to the colored layer 52G than the portion corresponding to the colored layer 52R. The depth corresponding to 52B may be the deepest, and the depth corresponding to the colored layer 52R may be the same as the depth corresponding to the colored layer 52R. In this case, the colored layer 52B is formed highest, and the colored layer 52R and the colored layer 52G are formed at the same height.

  As the pattern portion, the interlayer insulating film 24 may be planarized by the method described above. Thereby, the surface of the interlayer insulating film 24 can be planarized. Further, when an overcoat film (o / c) is formed on the colored layer, the overcoat film may be planarized by the method described above. Here, the overcoat film is provided in order to prevent leakage to the liquid crystal layer due to melting of the colored layers 52R, 52G, and 52B.

  When the liquid crystal display device is a transflective type, a gap adjusting part is formed of a material such as a transparent resin in the reflecting part in order to adjust the gap of the liquid crystal layer 3, and this gap adjusting part is flattened by the above-described method. May be. Thereby, the surfaces of the transmission part and the reflection part can be flattened, and the gap of the liquid crystal layer 3 can be adjusted between the transmission part and the reflection part.

  The pressing surface of the surface plate 120 is not limited to Teflon, even when it is composed of a metal plate, a metal plate laminated with Teflon, a glass substrate, a silicon substrate, a ceramic surface plate, silicon rubber, and a Teflon sheet. The same effects as those of the above-described embodiment can be obtained. In addition, it is effective even when the surface plate 120 is made of resin. The pressing surface of the surface plate 120 is preferably one that is easily peeled off from the material constituting the pattern portion such as the colored layer.

  When the pattern portion is flattened, the plurality of mother glasses on which the pattern portions are formed are processed at the same time, but the mother glasses may be processed one by one. As described above, even when only the pattern portion formed on one mother glass is flattened, it can be satisfactorily flattened as in the above-described embodiment.

  It suffices if a pattern portion is formed on at least one of the array substrate 1 and the counter substrate 2 as a patterning substrate.

1 is a cross-sectional view of a liquid crystal display device according to a first embodiment of the present invention. The top view which showed schematically the wiring structure of the array board | substrate shown in FIG. The top view which expanded and showed a part of array substrate shown in FIG. 1 and FIG. The top view which showed the state in which four counter substrates were formed on the mother glass in the manufacturing method of a patterning substrate. Sectional drawing which showed the structure in the manufacturing process of the opposing board | substrate shown in FIG. Sectional drawing which showed the pressurization process in the manufacturing process of the opposing board | substrate shown in FIG. FIG. 2 is an enlarged schematic cross-sectional view of a part of the counter substrate shown in FIG. 1. The figure which showed each change of the level | step difference and contrast of a color filter with respect to the applied pressure in the pressurization process shown in FIG. The figure which showed each change of the level | step difference and contrast of a color filter with respect to the applied pressure in the pressurization process shown in FIG. The top view of the surface plate shown in FIG. Sectional drawing which showed the pressurization process which concerns on the 2nd Embodiment of this invention. The schematic sectional drawing to which a part of counter substrate which concerns on the 2nd Embodiment of this invention was expanded. In the pressurization process concerning the 3rd Embodiment of this invention, the figure which showed each change of the average value of the column-shaped spacer with respect to applied pressure, and its dispersion | variation. The figure which showed each change of the average value of the height of the columnar spacer with respect to applied pressure, and each variation in the pressurization process which concerns on the 3rd Embodiment of this invention. Sectional drawing of the liquid crystal display device which concerns on the 4th Embodiment of this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Array substrate, 2 ... Opposite substrate, 3 ... Liquid crystal layer, 11 ... Glass substrate, 12 ... TFT, 17 ... Interlayer insulation film, 20 ... Signal line, 21 ... Scan line, 24 ... Interlayer insulation film, 26 ... Contact hole 27 ... Pixel electrode, 28 ... Columnar spacer, 31 ... Light-shielding part, 40 ... Mother glass, 41 ... Glass substrate, 42 ... Counter electrode, 44 ... Alignment mark, 50 ... Color filter, 51 ... Black matrix layer, 52R, 52G , 52B ... colored layer, 100 ... manufacturing apparatus, 110 ... pressure jig, 111 ... lower stage, 112 ... upper stage, 113 ... metal plate, 114 ... support member, 120 ... surface plate, 121 ... pattern, 122 ... cutout Part, R1... Display area.

Claims (10)

  A patterning substrate manufacturing method, comprising: forming a pattern portion on a substrate; curing the pattern portion while applying a pressure or a load higher than atmospheric pressure to the pattern portion; and planarizing a surface of the pattern portion.   The method for manufacturing a patterning substrate according to claim 1, wherein when the pattern portion is cured, the surface of the pattern portion is pressed with a pressure or a load equal to or higher than atmospheric pressure by a pressing member. The pressing member has a pressing surface on which a certain pattern is formed,
The method for manufacturing a patterning substrate according to claim 2, wherein when the pattern portion is cured, the pressing surface is pressed in contact with the pattern portion. Forming a color filter formed by arranging a plurality of stripe-shaped colored layers as a pattern portion on the substrate;
The pressing member has a pressing surface on which a striped pattern corresponding to each colored layer is formed,
The method for manufacturing a patterning substrate according to claim 2, wherein when the pattern portion is cured, the pressing surface is pressed in contact with the pattern portion. The colored layer has red, green, and blue colored layers,
The pattern of the pressing surface corresponds to the colored layer of each color, and the portion corresponding to the blue colored layer is formed deepest,
The method for manufacturing a patterning substrate according to claim 4, wherein when the colored layers of the respective colors are cured, the blue colored layer is formed highest. Forming a plurality of columnar spacers constituting the pattern portion on the substrate;
3. The method of manufacturing a patterning substrate according to claim 2, wherein when the pattern portion is cured, the plurality of columnar spacers are pressed by the pressing member to make the heights of the columnar spacers uniform.   When the pattern portion is cured, the substrate on which the pattern portion is formed and a pressing member are alternately stacked, and the stacked uppermost pressing member is pressed by applying a pressure or load higher than atmospheric pressure. The manufacturing method of the patterning board | substrate of Claim 2.   The patterning substrate manufacturing method according to claim 1, wherein when the pattern portion is cured, the pattern portion is heated and cured. An array substrate, a counter substrate disposed opposite to the array substrate with a predetermined gap, and a liquid crystal layer sandwiched between the array substrate and the counter substrate,
At least one of the array substrate and the counter substrate forms a pattern portion on the substrate, cures the pattern portion while applying a pressure or a load higher than atmospheric pressure to the pattern portion, and planarizes the surface of the pattern portion. A liquid crystal display device characterized by being formed.   The liquid crystal display device according to claim 9, wherein the pattern portion is formed on the array substrate.

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