JP2011184561A5 - - Google Patents
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- JP2011184561A5 JP2011184561A5 JP2010051159A JP2010051159A JP2011184561A5 JP 2011184561 A5 JP2011184561 A5 JP 2011184561A5 JP 2010051159 A JP2010051159 A JP 2010051159A JP 2010051159 A JP2010051159 A JP 2010051159A JP 2011184561 A5 JP2011184561 A5 JP 2011184561A5
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- carbon atoms
- alkali metal
- formula
- following general
- compound represented
- Prior art date
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Claims (1)
(式中、R1は、炭素数1〜50の炭化水素基、Mは、アルカリ金属を示す。)
で表される化合物、又は下記の一般式(II)
(式中、R 2 、R3は、それぞれ独立に、炭素数1〜30の二価の炭化水素基、Xは、炭素数1〜3のアルキレン基もしくは酸素原子を示し、Mは、アルカリ金属を示す。)
で表される化合物である請求項2に記載の水溶性シリコン加工液。 The alkali metal salt of sulfonic acid is represented by the following general formula (I)
(In the formula, R 1 represents a hydrocarbon group having 1 to 50 carbon atoms, and M represents an alkali metal.)
Or a compound represented by the following general formula (II)
(Wherein R 2 and R 3 are each independently a divalent hydrocarbon group having 1 to 30 carbon atoms, X is an alkylene group having 1 to 3 carbon atoms or an oxygen atom, and M is an alkali metal) Is shown.)
The water-soluble silicon processing liquid according to claim 2, which is a compound represented by the formula:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010051159A JP5508904B2 (en) | 2010-03-08 | 2010-03-08 | Water-soluble silicon processing fluid |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010051159A JP5508904B2 (en) | 2010-03-08 | 2010-03-08 | Water-soluble silicon processing fluid |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011184561A JP2011184561A (en) | 2011-09-22 |
JP2011184561A5 true JP2011184561A5 (en) | 2013-03-14 |
JP5508904B2 JP5508904B2 (en) | 2014-06-04 |
Family
ID=44791222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010051159A Active JP5508904B2 (en) | 2010-03-08 | 2010-03-08 | Water-soluble silicon processing fluid |
Country Status (1)
Country | Link |
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JP (1) | JP5508904B2 (en) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3121187B2 (en) * | 1993-10-18 | 2000-12-25 | ユシロ化学工業株式会社 | Water-soluble processing oil for magnesium alloy |
JP3949200B2 (en) * | 1996-08-12 | 2007-07-25 | エヌ・エス ルブリカンツ株式会社 | Cutting oil for cutting with a wire saw, cutting oil composition, and method of cutting an article using the same |
JPH1053789A (en) * | 1996-08-12 | 1998-02-24 | Nippei Toyama Corp | Water-base working fluid composition for wire cutter |
JP4497767B2 (en) * | 2001-09-06 | 2010-07-07 | ユシロ化学工業株式会社 | Water-soluble machining fluid composition for fixed abrasive wire saw |
US8580656B2 (en) * | 2008-07-14 | 2013-11-12 | Air Products And Chemicals, Inc. | Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor |
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2010
- 2010-03-08 JP JP2010051159A patent/JP5508904B2/en active Active
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