JP2011184561A5 - - Google Patents

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JP2011184561A5
JP2011184561A5 JP2010051159A JP2010051159A JP2011184561A5 JP 2011184561 A5 JP2011184561 A5 JP 2011184561A5 JP 2010051159 A JP2010051159 A JP 2010051159A JP 2010051159 A JP2010051159 A JP 2010051159A JP 2011184561 A5 JP2011184561 A5 JP 2011184561A5
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carbon atoms
alkali metal
formula
following general
compound represented
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JP2010051159A
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Japanese (ja)
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JP2011184561A (en
JP5508904B2 (en
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Claims (1)

スルホン酸のアルカリ金属塩が、下記の一般式(I)
Figure 2011184561

(式中、R1は、炭素数1〜50の炭化水素基、Mは、アルカリ金属を示す。)
で表される化合物、又は下記の一般式(II)
Figure 2011184561

(式中、R 2 、R3は、それぞれ独立に、炭素数1〜30の二価の炭化水素基、Xは、炭素数1〜3のアルキレン基もしくは酸素原子を示し、Mは、アルカリ金属を示す。)
で表される化合物である請求項2に記載の水溶性シリコン加工液。
The alkali metal salt of sulfonic acid is represented by the following general formula (I)
Figure 2011184561

(In the formula, R 1 represents a hydrocarbon group having 1 to 50 carbon atoms, and M represents an alkali metal.)
Or a compound represented by the following general formula (II)
Figure 2011184561

(Wherein R 2 and R 3 are each independently a divalent hydrocarbon group having 1 to 30 carbon atoms, X is an alkylene group having 1 to 3 carbon atoms or an oxygen atom, and M is an alkali metal) Is shown.)
The water-soluble silicon processing liquid according to claim 2, which is a compound represented by the formula:
JP2010051159A 2010-03-08 2010-03-08 Water-soluble silicon processing fluid Active JP5508904B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010051159A JP5508904B2 (en) 2010-03-08 2010-03-08 Water-soluble silicon processing fluid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010051159A JP5508904B2 (en) 2010-03-08 2010-03-08 Water-soluble silicon processing fluid

Publications (3)

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JP2011184561A JP2011184561A (en) 2011-09-22
JP2011184561A5 true JP2011184561A5 (en) 2013-03-14
JP5508904B2 JP5508904B2 (en) 2014-06-04

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JP2010051159A Active JP5508904B2 (en) 2010-03-08 2010-03-08 Water-soluble silicon processing fluid

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Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3121187B2 (en) * 1993-10-18 2000-12-25 ユシロ化学工業株式会社 Water-soluble processing oil for magnesium alloy
JP3949200B2 (en) * 1996-08-12 2007-07-25 エヌ・エス ルブリカンツ株式会社 Cutting oil for cutting with a wire saw, cutting oil composition, and method of cutting an article using the same
JPH1053789A (en) * 1996-08-12 1998-02-24 Nippei Toyama Corp Water-base working fluid composition for wire cutter
JP4497767B2 (en) * 2001-09-06 2010-07-07 ユシロ化学工業株式会社 Water-soluble machining fluid composition for fixed abrasive wire saw
US8580656B2 (en) * 2008-07-14 2013-11-12 Air Products And Chemicals, Inc. Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor

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