JP2011173806A - Phosphorus-containing diamine compound and flame-retardant polyimide - Google Patents
Phosphorus-containing diamine compound and flame-retardant polyimide Download PDFInfo
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- JP2011173806A JP2011173806A JP2010037320A JP2010037320A JP2011173806A JP 2011173806 A JP2011173806 A JP 2011173806A JP 2010037320 A JP2010037320 A JP 2010037320A JP 2010037320 A JP2010037320 A JP 2010037320A JP 2011173806 A JP2011173806 A JP 2011173806A
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- phosphorus
- formula
- general formula
- carbon atoms
- Prior art date
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- Granted
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- 229910052698 phosphorus Inorganic materials 0.000 title claims abstract description 109
- 239000011574 phosphorus Substances 0.000 title claims abstract description 109
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 105
- -1 diamine compound Chemical class 0.000 title claims abstract description 70
- 229920001721 polyimide Polymers 0.000 title claims abstract description 50
- 239000004642 Polyimide Substances 0.000 title claims abstract description 42
- 239000003063 flame retardant Substances 0.000 title abstract description 11
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title abstract description 10
- 125000003545 alkoxy group Chemical group 0.000 claims abstract description 27
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 27
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims abstract description 27
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 27
- 150000004985 diamines Chemical class 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 41
- 125000004432 carbon atom Chemical group C* 0.000 claims description 35
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 claims description 29
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 26
- 239000002904 solvent Substances 0.000 claims description 25
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 claims description 21
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 claims description 20
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 claims description 18
- 238000004519 manufacturing process Methods 0.000 claims description 18
- WEVYAHXRMPXWCK-UHFFFAOYSA-N Acetonitrile Chemical compound CC#N WEVYAHXRMPXWCK-UHFFFAOYSA-N 0.000 claims description 15
- 125000003118 aryl group Chemical group 0.000 claims description 15
- 125000006158 tetracarboxylic acid group Chemical group 0.000 claims description 15
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 claims description 14
- 125000001931 aliphatic group Chemical group 0.000 claims description 13
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 13
- 125000002723 alicyclic group Chemical group 0.000 claims description 9
- 150000002009 diols Chemical class 0.000 claims description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 8
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 claims description 8
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 239000003153 chemical reaction reagent Substances 0.000 claims description 6
- MVPPADPHJFYWMZ-UHFFFAOYSA-N chlorobenzene Chemical compound ClC1=CC=CC=C1 MVPPADPHJFYWMZ-UHFFFAOYSA-N 0.000 claims description 6
- 229910052763 palladium Inorganic materials 0.000 claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 4
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims description 4
- 229910052742 iron Inorganic materials 0.000 claims description 4
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 claims description 4
- 239000011135 tin Substances 0.000 claims description 4
- 229910052718 tin Inorganic materials 0.000 claims description 4
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 claims description 4
- 229910052725 zinc Inorganic materials 0.000 claims description 4
- 239000011701 zinc Substances 0.000 claims description 4
- 229910052794 bromium Inorganic materials 0.000 claims description 2
- 229910052801 chlorine Inorganic materials 0.000 claims description 2
- 238000006722 reduction reaction Methods 0.000 claims 2
- 229920005575 poly(amic acid) Polymers 0.000 abstract description 25
- 239000002243 precursor Substances 0.000 abstract description 6
- 230000018044 dehydration Effects 0.000 abstract description 2
- 238000006297 dehydration reaction Methods 0.000 abstract description 2
- 230000001747 exhibiting effect Effects 0.000 abstract description 2
- 230000000379 polymerizing effect Effects 0.000 abstract description 2
- 238000006243 chemical reaction Methods 0.000 description 21
- 150000001875 compounds Chemical class 0.000 description 20
- 239000000243 solution Substances 0.000 description 17
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 14
- IAZDPXIOMUYVGZ-UHFFFAOYSA-N Dimethylsulphoxide Chemical compound CS(C)=O IAZDPXIOMUYVGZ-UHFFFAOYSA-N 0.000 description 12
- 239000000203 mixture Substances 0.000 description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 11
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 238000005033 Fourier transform infrared spectroscopy Methods 0.000 description 9
- 238000005160 1H NMR spectroscopy Methods 0.000 description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 8
- YNQLUTRBYVCPMQ-UHFFFAOYSA-N Ethylbenzene Chemical compound CCC1=CC=CC=C1 YNQLUTRBYVCPMQ-UHFFFAOYSA-N 0.000 description 8
- SLAMLWHELXOEJZ-UHFFFAOYSA-N 2-nitrobenzoic acid Chemical compound OC(=O)C1=CC=CC=C1[N+]([O-])=O SLAMLWHELXOEJZ-UHFFFAOYSA-N 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 239000000047 product Substances 0.000 description 7
- RDOXTESZEPMUJZ-UHFFFAOYSA-N anisole Chemical compound COC1=CC=CC=C1 RDOXTESZEPMUJZ-UHFFFAOYSA-N 0.000 description 6
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 6
- 239000000843 powder Substances 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 5
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000009903 catalytic hydrogenation reaction Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 5
- 229910052739 hydrogen Inorganic materials 0.000 description 5
- 239000001257 hydrogen Substances 0.000 description 5
- 229920000647 polyepoxide Polymers 0.000 description 5
- 238000003786 synthesis reaction Methods 0.000 description 5
- 239000008096 xylene Substances 0.000 description 5
- RELMFMZEBKVZJC-UHFFFAOYSA-N 1,2,3-trichlorobenzene Chemical compound ClC1=CC=CC(Cl)=C1Cl RELMFMZEBKVZJC-UHFFFAOYSA-N 0.000 description 4
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 4
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- FXHOOIRPVKKKFG-UHFFFAOYSA-N N,N-Dimethylacetamide Chemical compound CN(C)C(C)=O FXHOOIRPVKKKFG-UHFFFAOYSA-N 0.000 description 4
- 238000005481 NMR spectroscopy Methods 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 4
- 239000003054 catalyst Substances 0.000 description 4
- 229940117389 dichlorobenzene Drugs 0.000 description 4
- 238000001035 drying Methods 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 4
- 239000002798 polar solvent Substances 0.000 description 4
- 239000012264 purified product Substances 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 229910052723 transition metal Inorganic materials 0.000 description 4
- 150000003624 transition metals Chemical class 0.000 description 4
- LLOXZCFOAUCDAE-UHFFFAOYSA-N 2-diphenylphosphorylbenzene-1,4-diol Chemical compound OC1=CC=C(O)C(P(=O)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 LLOXZCFOAUCDAE-UHFFFAOYSA-N 0.000 description 3
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 3
- WFDIJRYMOXRFFG-UHFFFAOYSA-N Acetic anhydride Chemical compound CC(=O)OC(C)=O WFDIJRYMOXRFFG-UHFFFAOYSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000862 absorption spectrum Methods 0.000 description 3
- 150000001334 alicyclic compounds Chemical class 0.000 description 3
- 125000003342 alkenyl group Chemical group 0.000 description 3
- 125000000304 alkynyl group Chemical group 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000012043 crude product Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 3
- 238000001914 filtration Methods 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 3
- UZKWTJUDCOPSNM-UHFFFAOYSA-N methoxybenzene Substances CCCCOC=C UZKWTJUDCOPSNM-UHFFFAOYSA-N 0.000 description 3
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000009719 polyimide resin Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 125000001424 substituent group Chemical group 0.000 description 3
- YFNKIDBQEZZDLK-UHFFFAOYSA-N triglyme Chemical compound COCCOCCOCCOC YFNKIDBQEZZDLK-UHFFFAOYSA-N 0.000 description 3
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- BSKHPKMHTQYZBB-UHFFFAOYSA-N 2-methylpyridine Chemical compound CC1=CC=CC=N1 BSKHPKMHTQYZBB-UHFFFAOYSA-N 0.000 description 2
- NXTNASSYJUXJDV-UHFFFAOYSA-N 3-nitrobenzoyl chloride Chemical compound [O-][N+](=O)C1=CC=CC(C(Cl)=O)=C1 NXTNASSYJUXJDV-UHFFFAOYSA-N 0.000 description 2
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical compound NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 2
- SKDHHIUENRGTHK-UHFFFAOYSA-N 4-nitrobenzoyl chloride Chemical compound [O-][N+](=O)C1=CC=C(C(Cl)=O)C=C1 SKDHHIUENRGTHK-UHFFFAOYSA-N 0.000 description 2
- YGYCECQIOXZODZ-UHFFFAOYSA-N 4415-87-6 Chemical compound O=C1OC(=O)C2C1C1C(=O)OC(=O)C12 YGYCECQIOXZODZ-UHFFFAOYSA-N 0.000 description 2
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 2
- QQGYZOYWNCKGEK-UHFFFAOYSA-N 5-[(1,3-dioxo-2-benzofuran-5-yl)oxy]-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(OC=2C=C3C(=O)OC(C3=CC=2)=O)=C1 QQGYZOYWNCKGEK-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- CIWBSHSKHKDKBQ-JLAZNSOCSA-N Ascorbic acid Chemical compound OC[C@H](O)[C@H]1OC(=O)C(O)=C1O CIWBSHSKHKDKBQ-JLAZNSOCSA-N 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 2
- LWBIQFKEKJTQAG-UHFFFAOYSA-N C(=O)(O)C=1C=C(OCC(C)(C2=CC=CC=C2)C2=CC=CC=C2)C=CC1C(=O)O Chemical compound C(=O)(O)C=1C=C(OCC(C)(C2=CC=CC=C2)C2=CC=CC=C2)C=CC1C(=O)O LWBIQFKEKJTQAG-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QOSSAOTZNIDXMA-UHFFFAOYSA-N Dicylcohexylcarbodiimide Chemical compound C1CCCCC1N=C=NC1CCCCC1 QOSSAOTZNIDXMA-UHFFFAOYSA-N 0.000 description 2
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 150000007824 aliphatic compounds Chemical class 0.000 description 2
- 150000003973 alkyl amines Chemical class 0.000 description 2
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- DMVOXQPQNTYEKQ-UHFFFAOYSA-N biphenyl-4-amine Chemical group C1=CC(N)=CC=C1C1=CC=CC=C1 DMVOXQPQNTYEKQ-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000000470 constituent Substances 0.000 description 2
- 125000006159 dianhydride group Chemical group 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical group C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
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- 239000004210 ether based solvent Substances 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 150000004820 halides Chemical class 0.000 description 2
- 125000005843 halogen group Chemical group 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000012442 inert solvent Substances 0.000 description 2
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 2
- 239000000347 magnesium hydroxide Substances 0.000 description 2
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- 125000000956 methoxy group Chemical group [H]C([H])([H])O* 0.000 description 2
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- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
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- 239000010948 rhodium Substances 0.000 description 2
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 2
- 239000000523 sample Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- FYSNRJHAOHDILO-UHFFFAOYSA-N thionyl chloride Chemical compound ClS(Cl)=O FYSNRJHAOHDILO-UHFFFAOYSA-N 0.000 description 2
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- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- 239000002966 varnish Substances 0.000 description 2
- NAWXUBYGYWOOIX-SFHVURJKSA-N (2s)-2-[[4-[2-(2,4-diaminoquinazolin-6-yl)ethyl]benzoyl]amino]-4-methylidenepentanedioic acid Chemical compound C1=CC2=NC(N)=NC(N)=C2C=C1CCC1=CC=C(C(=O)N[C@@H](CC(=C)C(O)=O)C(O)=O)C=C1 NAWXUBYGYWOOIX-SFHVURJKSA-N 0.000 description 1
- DDCJHFYXAPQYLA-UHFFFAOYSA-N (3-chlorophenyl)-phenylmethanol Chemical compound C=1C=CC(Cl)=CC=1C(O)C1=CC=CC=C1 DDCJHFYXAPQYLA-UHFFFAOYSA-N 0.000 description 1
- OLQWMCSSZKNOLQ-ZXZARUISSA-N (3s)-3-[(3r)-2,5-dioxooxolan-3-yl]oxolane-2,5-dione Chemical compound O=C1OC(=O)C[C@H]1[C@@H]1C(=O)OC(=O)C1 OLQWMCSSZKNOLQ-ZXZARUISSA-N 0.000 description 1
- AVQQQNCBBIEMEU-UHFFFAOYSA-N 1,1,3,3-tetramethylurea Chemical compound CN(C)C(=O)N(C)C AVQQQNCBBIEMEU-UHFFFAOYSA-N 0.000 description 1
- HIKAFGPYNTXIGG-UHFFFAOYSA-N 2,6-dimethyl-4-nitrobenzoic acid Chemical compound CC1=CC([N+]([O-])=O)=CC(C)=C1C(O)=O HIKAFGPYNTXIGG-UHFFFAOYSA-N 0.000 description 1
- XXXOBNJIIZQSPT-UHFFFAOYSA-N 2-methyl-4-nitrobenzoic acid Chemical compound CC1=CC([N+]([O-])=O)=CC=C1C(O)=O XXXOBNJIIZQSPT-UHFFFAOYSA-N 0.000 description 1
- BWWHTIHDQBHTHP-UHFFFAOYSA-N 2-nitrobenzoyl chloride Chemical compound [O-][N+](=O)C1=CC=CC=C1C(Cl)=O BWWHTIHDQBHTHP-UHFFFAOYSA-N 0.000 description 1
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Landscapes
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Abstract
Description
本発明は、リン含有ジアミン化合物、リン含有ジニトロ化合物、ならびにそれらを使用して製造される難燃性のポリイミド、およびその前駆体であるポリアミド酸に関する。 TECHNICAL FIELD The present invention relates to a phosphorus-containing diamine compound, a phosphorus-containing dinitro compound, a flame-retardant polyimide produced using the same, and a polyamic acid that is a precursor thereof.
一般にポリイミドは、難燃性、耐熱性、機械特性、電気特性等に優れている為、フレキシブルプリント配線板の基板材料、配線や半導体素子の保護膜、耐熱性接着剤、層間絶縁材料等として広く使用されている。 Generally, polyimide is excellent in flame retardancy, heat resistance, mechanical properties, electrical properties, etc., so it is widely used as a substrate material for flexible printed wiring boards, protective films for wiring and semiconductor elements, heat resistant adhesives, interlayer insulation materials, etc. in use.
近年、電気・電子機器等の軽薄短小化のニーズに応えるべく、電気・電子機器等に使用されるポリイミドの薄膜化が望まれている。しかしながら、ポリイミドの薄膜化に伴ってポリイミドの難燃性は低下する傾向がある。また、近年電子機器内の使用部品および素子、ＣＰＵの高性能化に伴って、その発熱量が著しく増加し、機器内の平均温度も上昇する傾向にあり、より高度な難燃技術が望まれている。一方、環境問題の観点から電気・電子製品に要求される難燃性を付与する際にも、自然環境や人体に対する安全性を考慮した、より安全性の高い手段が求められている。 In recent years, it has been desired to reduce the thickness of polyimide used in electrical / electronic devices and the like in order to meet the needs for reduction in thickness and size of electrical / electronic devices. However, the flame retardancy of polyimide tends to decrease with decreasing polyimide film thickness. Also, in recent years, with the increase in performance of components and elements used in electronic devices and CPUs, the amount of generated heat has increased remarkably and the average temperature in the device has also increased, and a more advanced flame retardant technology is desired. ing. On the other hand, in order to impart flame retardancy required for electric and electronic products from the viewpoint of environmental problems, there is a demand for safer means in consideration of safety to the natural environment and the human body.
ポリイミドに難燃性を付与する技術としては、シロキサン変性されたポリイミドに水酸化マグネシウムなどの金属水和物を混合する方法が提案されている（例えば、特許文献１参照）。しかしながらこの方法では、別途水酸化マグネシウムにリン酸系界面活性剤による表面処理を施さなければならず、工程が煩雑になる。加えてこの方法では、ベースポリマーに使用するジアミン成分として、分子内に水酸基を２個以上有するジアミンが推奨されているが、このようなジアミンは容易に入手できるとは言えないものもある。 As a technique for imparting flame retardancy to polyimide, a method of mixing a metal hydrate such as magnesium hydroxide with siloxane-modified polyimide has been proposed (for example, see Patent Document 1). However, in this method, magnesium hydroxide must be separately subjected to a surface treatment with a phosphoric acid surfactant, and the process becomes complicated. In addition, in this method, a diamine having two or more hydroxyl groups in the molecule is recommended as a diamine component to be used for the base polymer, but such a diamine cannot be said to be easily available.
また、シリコンユニットを含有する特定のポリイミド樹脂とリン元素を含有する特定のエポキシ樹脂とを使用することで難燃性を発現させる方法が提案されている（例えば、特許文献２参照）。この方法では、リン化合物とエポキシ樹脂とを反応させ、目的とするリン含有エポキシ樹脂が得られるが、エポキシ樹脂としての機能を有するためには、好ましくは２つのエポキシ基が残るように反応を行わなければならず、リン含有率の上限値は５重量％に過ぎない。シリコンユニットを導入したポリイミド樹脂は燃え易い性質を持つために、この方法で得られるポリイミド樹脂組成物に十分な難燃性を付与するためには、リン含有するとはいえ、元来耐熱性の低いエポキシ樹脂を多く混合しなければならない。 Moreover, the method of making a flame retardance express by using the specific polyimide resin containing a silicon unit and the specific epoxy resin containing a phosphorus element is proposed (for example, refer patent document 2). In this method, a phosphorus compound and an epoxy resin are reacted to obtain a target phosphorus-containing epoxy resin, but in order to have a function as an epoxy resin, the reaction is preferably performed so that two epoxy groups remain. The upper limit of the phosphorus content is only 5% by weight. Since the polyimide resin into which the silicon unit is introduced has a property of easily burning, in order to impart sufficient flame retardancy to the polyimide resin composition obtained by this method, although it contains phosphorus, it originally has low heat resistance. A lot of epoxy resin must be mixed.
さらには、樹脂組成物に難燃性を付与する方法としては、樹脂組成物にリン系難燃剤を添加し、ポリマーと物理的に混合する方法が知られている（例えば、非特許文献１）。しかしながら、かかる技術で難燃性を発現させるためには、リン化合物を大量に添加する必要があるが、そのように大量に添加されたリン化合物は、ポリマーの機械的特性を低下させたり、環境へのリーキングが懸念されたりとの問題があった。 Furthermore, as a method for imparting flame retardancy to a resin composition, a method is known in which a phosphorus-based flame retardant is added to a resin composition and physically mixed with a polymer (for example, Non-Patent Document 1). . However, it is necessary to add a large amount of phosphorus compound in order to develop flame retardancy with such a technique. However, such a large amount of phosphorus compound added may deteriorate the mechanical properties of the polymer or reduce the environment. There was a problem that there was concern about leaking.
本発明は、リン含有ジアミン化合物、ならびにそれらを原料として製造され、優れた難燃特性を発揮するポリイミドおよびその前駆体であるポリアミド酸を提供するものである。 The present invention provides a phosphorus-containing diamine compound, a polyimide produced using them as a raw material, and exhibiting excellent flame retardancy and a polyamic acid that is a precursor thereof.
本発明者等は、特定の構造を有するリン含有ジアミン化合物を合成し、それを用いて製造されるポリイミドが、従来のポリイミドの性質を損なうことなくさらに優れた難燃性を有することを見出し、本発明を完成させた。すなわち、本発明は、下記一般式（Ｉ）： The present inventors have synthesized a phosphorus-containing diamine compound having a specific structure, and found that the polyimide produced using the compound has further excellent flame retardancy without impairing the properties of conventional polyimide, The present invention has been completed. That is, the present invention provides the following general formula (I):
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジアミン化合物および下記一般式（II）：
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
And a phosphorus-containing diamine compound represented by the following general formula (II):
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジニトロ化合物に関する。
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
The phosphorus containing dinitro compound represented by these.
さらに本発明は、これらのリン含有ジアミン化合物を用いて製造される下記一般式（III）： Further, the present invention provides the following general formula (III) produced using these phosphorus-containing diamine compounds:
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよく、そしてＡは、四価の芳香族基、脂環式基または脂肪族基である）
で表わされる反復単位を有するリン含有ポリイミドに関する。
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group having 1 to 6 carbon atoms or an alkoxyl group, and A is a tetravalent aromatic group, an alicyclic group. Group or aliphatic group)
The phosphorus-containing polyimide which has a repeating unit represented by these.
本発明のリン含有ジアミン化合物は、難燃性のポリイミドの原料として有用である。またこのリン含有ジアミン化合物を用いて製造された難燃性ポリイミドは、難燃性を有する耐熱性接着剤、難燃性を有する電子回路基板の絶縁材料として有用である。 The phosphorus-containing diamine compound of the present invention is useful as a raw material for flame-retardant polyimide. In addition, the flame-retardant polyimide produced using this phosphorus-containing diamine compound is useful as a heat-resistant adhesive having flame retardancy and an insulating material for an electronic circuit board having flame retardancy.
以下に本発明の実施の形態について詳細に説明する。 Hereinafter, embodiments of the present invention will be described in detail.
「リン含有ジニトロ化合物とその製造方法」
本発明のリン含有ジニトロ化合物は、一般式（II）：
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表される化合物である。一般式（II）のリン含有ジニトロ化合物は、これを用いて得られるポリイミドの難燃性の観点から、そのベンゼン環上の水素原子が置換されていないもの、あるいは１〜４個のメチル基またはメトキシ基で置換されているものが好適である。
"Phosphorus-containing dinitro compounds and their production methods"
The phosphorus-containing dinitro compound of the present invention has the general formula (II):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
It is a compound represented by these. The phosphorus-containing dinitro compound of the general formula (II) is one in which a hydrogen atom on the benzene ring is not substituted, or 1 to 4 methyl groups, Those substituted with a methoxy group are preferred.
本発明のリン含有ジニトロ化合物の製法は特に限定されず、公知のいずれかの方法で製造することができる。好ましくは、下記一般式（１）： The manufacturing method of the phosphorus containing dinitro compound of this invention is not specifically limited, It can manufacture by any well-known method. Preferably, the following general formula (1):
（式中、ベンゼン環上の水素原子は、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表されるニトロ安息香酸と、下記一般式（２）：
(In the formula, the hydrogen atom on the benzene ring may be substituted with an alkyl or alkoxyl group having 1 to 6 carbon atoms)
Nitrobenzoic acid represented by the following general formula (2):
（式中、ベンゼン環上の水素原子は、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表されるリン含有ジオールとをエステル化反応に付すことにより、下記一般式（II）：
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表されるリン含有ジニトロ化合物を製造することができる。
(In the formula, the hydrogen atom on the benzene ring may be substituted with an alkyl or alkoxyl group having 1 to 6 carbon atoms)
Is subjected to an esterification reaction with a phosphorus-containing diol represented by the following general formula (II):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
The phosphorus containing dinitro compound represented by these can be manufactured.
上記エステル化反応の際適用できる方法として、例えば、一般式（１）のニトロ安息香酸のカルボキシル基と一般式（２）のリン含有ジオールのヒドロキシ基とを高温で直接脱水縮合させるか、ジシクロヘキシルカルボジイミド等の脱水試薬を用いて脱水縮合させる方法；あるいは一般式（２）のリン含有ジオールをジアセテート誘導体とし、これを一般式（１）のニトロ安息香酸と高温で反応させ、脱酢酸してエステル化する方法（エステル交換法）；または一般式（１）のニトロ安息香酸をハロゲン化誘導体とし、これを一般式（２）のリン含有ジオールと塩基の存在下で反応させる方法（酸ハライド法）などが挙げられる。上述の方法の中でもエステル交換法や酸ハライド法が経済性、反応性の点で好適である。 As a method applicable in the esterification reaction, for example, the carboxyl group of the nitrobenzoic acid of the general formula (1) and the hydroxy group of the phosphorus-containing diol of the general formula (2) are directly dehydrated and condensed at a high temperature, or dicyclohexylcarbodiimide is used. Dehydration condensation using a dehydrating reagent such as: a phosphorus-containing diol of general formula (2) is converted to a diacetate derivative, this is reacted with nitrobenzoic acid of general formula (1) at high temperature, deaceticated and esterified Or a method of reacting a nitrobenzoic acid of general formula (1) with a halogenated derivative in the presence of a phosphorus-containing diol of general formula (2) in the presence of a base (acid halide method) Etc. Among the above-mentioned methods, the transesterification method and the acid halide method are preferable from the viewpoints of economy and reactivity.
例えば、本発明のリン含有ジニトロ化合物は、下記一般式（１ａ）： For example, the phosphorus-containing dinitro compound of the present invention has the following general formula (1a):
（式中、Ｘは、ＣｌまたはＢｒであり、ベンゼン環上の水素原子は、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるニトロ安息香酸ハライドと下記一般式（２）：
(Wherein X is Cl or Br, and the hydrogen atom on the benzene ring may be substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
Nitrobenzoic acid halide represented by the following general formula (2):
（式中、ベンゼン環上の水素原子は、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジオールとを、溶媒中、塩基の存在下で反応させることにより得ることができる。
(In the formula, the hydrogen atom on the benzene ring may be substituted with an alkyl or alkoxyl group having 1 to 6 carbon atoms)
Can be obtained by reacting in a solvent in the presence of a base.
上記反応は、−２０〜１５０℃、好ましくは−１０〜８０℃、より好ましくは０〜５０℃の温度で、１分〜２４時間、好ましくは５分〜２０時間、より好ましくは１０分〜１６時間反応することによって行うことができる。 The above reaction is carried out at a temperature of -20 to 150 ° C, preferably -10 to 80 ° C, more preferably 0 to 50 ° C for 1 minute to 24 hours, preferably 5 minutes to 20 hours, more preferably 10 minutes to 16 hours. This can be done by reacting for a time.
上記反応には、溶媒を使用してもよい。使用する溶媒は、反応に不活性な溶媒であれば特に限定されず、所望する反応温度に応じて適宜選択される。単独で、又は２種類以上の溶媒を任意の割合で混合して用いてもよい。例えば、トルエン、キシレン、エチルベンゼン、アニソール、モノクロロベンゼン、ジクロロベンゼン、トリクロロベンゼンのような芳香族炭化水素溶媒、テトラヒドロフラン（ＴＨＦ）、ジグリム、トリグリムのようなエーテル系溶媒、アセトニトリル、Ｎ，Ｎ−ジメチルホルムアミド（ＤＭＦ）、Ｎ，Ｎ−ジメチルアセトアミド、Ｎ−メチル−２−ピロリドン（ＮＭＰ）、ジメチルスルホキシド（ＤＭＳＯ）のような非プロトン性極性溶媒などが使用できる。テトラヒドロフラン、アセトニトリル、モノクロロベンゼン、トルエンおよびＮ，Ｎ−ジメチルホルムアミド（ＤＭＦ）の使用が好ましい。溶媒の使用量は、一般式（２）のリン含有ジオールに対して５０〜１０００重量％、好ましくは１００〜５００重量％である。 A solvent may be used for the above reaction. The solvent to be used is not particularly limited as long as it is an inert solvent for the reaction, and is appropriately selected according to the desired reaction temperature. You may use individually or in mixture of 2 or more types of solvents in arbitrary ratios. For example, aromatic hydrocarbon solvents such as toluene, xylene, ethylbenzene, anisole, monochlorobenzene, dichlorobenzene and trichlorobenzene, ether solvents such as tetrahydrofuran (THF), diglyme and triglyme, acetonitrile, N, N-dimethylformamide Aprotic polar solvents such as (DMF), N, N-dimethylacetamide, N-methyl-2-pyrrolidone (NMP), and dimethyl sulfoxide (DMSO) can be used. Preference is given to using tetrahydrofuran, acetonitrile, monochlorobenzene, toluene and N, N-dimethylformamide (DMF). The usage-amount of a solvent is 50 to 1000 weight% with respect to the phosphorus containing diol of General formula (2), Preferably it is 100 to 500 weight%.
上記反応には、塩基を使用してもよい。使用する塩基は、所望する反応温度に応じて適宜選択される。単独で、又は２種類以上の塩基を任意の割合で混合して用いてもよい。例えば、トリメチルアミン、トリエチルアミン、ピリジンのような三級アミンが使用できる。塩基の使用量は、一般式（２）のリン含有ジオールに対して５０〜１０００モル％、好ましくは７５〜５００モル％、さらに好ましくは１００〜３００モル％である。 A base may be used for the above reaction. The base to be used is appropriately selected according to the desired reaction temperature. You may use individually or in mixture of 2 or more types in arbitrary ratios. For example, tertiary amines such as trimethylamine, triethylamine, and pyridine can be used. The usage-amount of a base is 50-1000 mol% with respect to the phosphorus containing diol of General formula (2), Preferably it is 75-500 mol%, More preferably, it is 100-300 mol%.
上記反応の終了後、析出した固体を濾別することによって、一般式（II）のリン含有ジニトロ化合物の粗生成物を得ることができる。 After completion of the reaction, the precipitated solid is filtered off to obtain a crude product of the phosphorus-containing dinitro compound of the general formula (II).
得られた粗生成物は、精製してもよい。精製方法は特に限定されないが、再結晶法により行うのが好ましい。例えば、酢酸のような極性溶媒、または極性溶媒と水の任意の割合の混合溶媒を、粗生成物に対して５０〜１０００重量％、好ましくは１００〜５００重量％使用し、２０〜１１５℃、好ましくは５０〜１００℃の温度に加熱することにより、一般式（II）のリン含有ジニトロ化合物を一旦溶解させ、次いで、これを温度降下させることにより、また必要であれば、貧溶媒を添加することにより、結晶を析出させる。この結晶を濾別し、減圧下又は常圧下にて４０〜２００℃、好ましくは８０〜１５０℃の温度で乾燥させることにより、本発明のリン含有ジニトロ化合物を得ることができる。 The obtained crude product may be purified. The purification method is not particularly limited, but is preferably performed by a recrystallization method. For example, a polar solvent such as acetic acid, or a mixed solvent of an arbitrary ratio of polar solvent and water is used in an amount of 50 to 1000% by weight, preferably 100 to 500% by weight, based on the crude product, 20 to 115 ° C., Preferably, the phosphorus-containing dinitro compound of the general formula (II) is once dissolved by heating to a temperature of 50 to 100 ° C., then the temperature is lowered, and if necessary, a poor solvent is added. As a result, crystals are precipitated. The phosphorus-containing dinitro compound of the present invention can be obtained by filtering the crystals and drying them at a temperature of 40 to 200 ° C., preferably 80 to 150 ° C. under reduced pressure or normal pressure.
上記のリン含有ジニトロ化合物の製造方法をはじめとする、本明細書に記載の各製造方法において使用する原料、試薬、溶媒等は、市販されているか、または市販されているものから公知の方法に従い容易に調製することができる。例えば、式（１ａ）のニトロ安息香酸ハライド（ｏ−ニトロ安息香酸クロリド、ｍ−ニトロ安息香酸クロリド、ｐ−ニトロ安息香酸クロリドなど）は、和光純薬工業（株）などの供給業者から入手することができる。あるいは、一般式（１ａ）のニトロ安息香酸ハライドは、同様に供給業者から入手することができる一般式（１）のニトロ安息香酸（ｏ−ニトロ安息香酸、ｍ−ニトロ安息香酸、ｐ−ニトロ安息香酸、２−メチル−４−ニトロ安息香酸、３−メチル−４−ニトロ安息香酸、２，６−ジメチル−４−ニトロ安息香酸、３−メトキシ−４−ニトロ安息香酸、４，５−ジメトキシ−２−ニトロ安息香酸など）の遊離のカルボン酸を、公知の方法（例えば、塩化チオニル、塩化スルフリルのようなハロゲン化試薬を用いる方法）に従ってハロゲン化することにより得てもよい。 The raw materials, reagents, solvents, etc. used in each of the production methods described in this specification, including the production method of the phosphorus-containing dinitro compound described above, are commercially available or according to known methods from those that are commercially available. It can be easily prepared. For example, a nitrobenzoic acid halide of formula (1a) (o-nitrobenzoic acid chloride, m-nitrobenzoic acid chloride, p-nitrobenzoic acid chloride, etc.) is obtained from a supplier such as Wako Pure Chemical Industries, Ltd. be able to. Alternatively, the nitrobenzoic acid halide of the general formula (1a) can be obtained from the supplier in the same way as the nitrobenzoic acid of the general formula (1) (o-nitrobenzoic acid, m-nitrobenzoic acid, p-nitrobenzoic acid). Acid, 2-methyl-4-nitrobenzoic acid, 3-methyl-4-nitrobenzoic acid, 2,6-dimethyl-4-nitrobenzoic acid, 3-methoxy-4-nitrobenzoic acid, 4,5-dimethoxy- A free carboxylic acid such as 2-nitrobenzoic acid may be obtained by halogenation according to a known method (for example, a method using a halogenating reagent such as thionyl chloride or sulfuryl chloride).
同様に、一般式（２）のリン含有ジオール（２−（ジフェニルホスフィニル）ヒドロキノンなど）は、北興化学工業（株）などの供給業者から入手することができる。あるいは、一般式（２）のリン含有ジオールは、公知の方法（例えば、特開平５−２１４０７０号公報参照）に従って調製することもできる。 Similarly, phosphorus-containing diols of general formula (2) (such as 2- (diphenylphosphinyl) hydroquinone) can be obtained from suppliers such as Hokuko Chemical Co., Ltd. Alternatively, the phosphorus-containing diol of the general formula (2) can be prepared according to a known method (for example, see JP-A No. 5-214070).
「リン含有ジアミン化合物およびその製造方法」
本発明のリン含有ジアミン化合物は、一般式（Ｉ）：
"Phosphorus-containing diamine compound and method for producing the same"
The phosphorus-containing diamine compound of the present invention has the general formula (I):
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基または炭素数１〜６のアルコキシル基で置換されていてもよい）
で表される化合物である。一般式（Ｉ）のリン含有ジアミンは、これを用いて得られるポリイミドの難燃性の観点から、そのベンゼン環上の水素原子が置換されていないもの、あるいは１〜４個のメチル基またはメトキシ基で置換されているものが好適である。
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group having 1 to 6 carbon atoms or an alkoxyl group having 1 to 6 carbon atoms)
It is a compound represented by these. From the viewpoint of flame retardancy of the polyimide obtained by using the phosphorus-containing diamine of the general formula (I), a hydrogen atom on the benzene ring is not substituted, or 1 to 4 methyl groups or methoxy Those substituted with groups are preferred.
本発明のリン含有ジアミン化合物の製法は特に限定されず、公知のいずれかの方法で製造することができる。好ましくは、一般式（II）：
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジニトロ化合物を還元することにより製造することができる。
The manufacturing method of the phosphorus containing diamine compound of this invention is not specifically limited, It can manufacture by any well-known method. Preferably, general formula (II):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
It can manufacture by reduce | restoring the phosphorus containing dinitro compound represented by these.
本発明の一般式（II）のリン含有ジニトロ化合物の還元は、適切な還元剤および／または還元触媒を添加して実施すればよい。適切な還元剤および／または還元触媒は、例えば、水素；水素化アルミニウムリチウム、水素化ホウ素ナトリウム、水素化ジイソブチルアルミニウムなどの金属ヒドリド試薬；鉄、スズ、亜鉛などの金属末またはそれらの塩；ヒドラジン、ギ酸、Ｌ−アスコルビン酸などの有機物；白金、パラジウム、ロジウム、ニッケル、銅などの遷移金属などである。パラジウム、鉄、亜鉛およびスズからなる群より選ばれる少なくとも一種の金属試薬を用いるのが好ましい。そのような還元の具体的態様としては、遷移金属触媒および水素（もしくは水素源）の存在下に還元を行う接触水素化法や、酸性溶液中で鉄、スズ、亜鉛などの金属末を用いることにより還元を行う方法を挙げることができる。以下に、接触水素化法による還元について説明する。 The reduction of the phosphorus-containing dinitro compound of the general formula (II) of the present invention may be carried out by adding an appropriate reducing agent and / or reduction catalyst. Suitable reducing agents and / or reduction catalysts are, for example, hydrogen; metal hydride reagents such as lithium aluminum hydride, sodium borohydride, diisobutylaluminum hydride; metal powders such as iron, tin, zinc or their salts; hydrazine Organic substances such as formic acid and L-ascorbic acid; transition metals such as platinum, palladium, rhodium, nickel and copper. It is preferable to use at least one metal reagent selected from the group consisting of palladium, iron, zinc and tin. Specific examples of such reduction include catalytic hydrogenation in which reduction is performed in the presence of a transition metal catalyst and hydrogen (or a hydrogen source), and the use of a metal powder such as iron, tin, or zinc in an acidic solution. The method of performing reduction can be mentioned. Below, the reduction | restoration by a catalytic hydrogenation method is demonstrated.
本発明のリン含有ジニトロ化合物の接触水素化法による還元で用いる遷移金属触媒としては、白金、パラジウム、ロジウム、ニッケル、銅などの遷移金属を、炭素（活性炭）、アルミナ、シリカ、炭酸カルシウムなどの担体に担持させたもの、具体的には、パラジウムが５〜２０％程度担持されたパラジウム炭を挙げることができる。 As the transition metal catalyst used in the reduction of the phosphorus-containing dinitro compound of the present invention by the catalytic hydrogenation method, transition metals such as platinum, palladium, rhodium, nickel and copper are used, such as carbon (activated carbon), alumina, silica and calcium carbonate. One supported on a carrier, specifically, palladium charcoal on which about 5 to 20% palladium is supported can be mentioned.
本発明のリン含有ジニトロ化合物の接触水素化法による還元は、２０〜２００℃、好ましくは３０〜１５０℃、より好ましくは４０〜１００℃の温度で、１分〜２４時間、好ましくは５分〜２０時間、より好ましくは１０分〜１６時間反応することによって行うことができる。 The reduction by the catalytic hydrogenation method of the phosphorus-containing dinitro compound of the present invention is 20 to 200 ° C., preferably 30 to 150 ° C., more preferably 40 to 100 ° C., for 1 minute to 24 hours, preferably 5 minutes to The reaction can be carried out by reacting for 20 hours, more preferably 10 minutes to 16 hours.
本発明のリン含有ジニトロ化合物の接触水素化法による還元には、溶媒を使用してもよい。使用する溶媒は、反応に不活性な溶媒であれば特に限定されず、所望する反応温度に応じて適宜選択される。単独で、又は２種類以上の溶媒を任意の割合で混合して用いてもよい。例えば、トルエン、キシレン、エチルベンゼン、アニソール、モノクロロベンゼン、ジクロロベンゼン、トリクロロベンゼンのような芳香族炭化水素溶媒、テトラヒドロフラン（ＴＨＦ）、ジグリム、トリグリムのようなエーテル系溶媒、Ｎ，Ｎ−ジメチルホルムアミド（ＤＭＦ）、Ｎ，Ｎ−ジメチルアセトアミド、Ｎ−メチル−２−ピロリドン（ＮＭＰ）、ジメチルスルホキシド（ＤＭＳＯ）のような非プロトン性極性溶媒などが使用できる。溶媒の使用量は、リン含有ジニトロ化合物に対して５０〜１０００重量％、好ましくは１００〜５００重量％である。 A solvent may be used for the reduction of the phosphorus-containing dinitro compound of the present invention by the catalytic hydrogenation method. The solvent to be used is not particularly limited as long as it is an inert solvent for the reaction, and is appropriately selected according to the desired reaction temperature. You may use individually or in mixture of 2 or more types of solvents in arbitrary ratios. For example, aromatic hydrocarbon solvents such as toluene, xylene, ethylbenzene, anisole, monochlorobenzene, dichlorobenzene and trichlorobenzene, ether solvents such as tetrahydrofuran (THF), diglyme and triglyme, N, N-dimethylformamide (DMF) ), Aprotic polar solvents such as N, N-dimethylacetamide, N-methyl-2-pyrrolidone (NMP), dimethyl sulfoxide (DMSO), and the like. The usage-amount of a solvent is 50 to 1000 weight% with respect to a phosphorus containing dinitro compound, Preferably it is 100 to 500 weight%.
「リン含有ポリアミド酸およびその製造方法」
本発明のリン含有ポリイミド前駆体（すなわち、リン含有ポリアミド酸）は、下記一般式（IV）：
“Phosphorus-containing polyamic acid and method for producing the same”
The phosphorus-containing polyimide precursor (that is, phosphorus-containing polyamic acid) of the present invention has the following general formula (IV):
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよく、そしてＡは、四価の芳香族基、脂環式基または脂肪族基である）
で表わされる反復単位を有するものである。
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group having 1 to 6 carbon atoms or an alkoxyl group, and A is a tetravalent aromatic group, an alicyclic group. Group or aliphatic group)
It has a repeating unit represented by
本発明のリン含有ポリアミド酸の製造は、上記の方法で得られた一般式（Ｉ）のリン含有ジアミン化合物を含むジアミン成分と、下記一般式（３）： The production of the phosphorus-containing polyamic acid of the present invention comprises a diamine component containing the phosphorus-containing diamine compound of the general formula (I) obtained by the above method, and the following general formula (3):
（式中、Ａは、四価の芳香族基、脂環式基または脂肪族基である）で表わされるテトラカルボン酸二無水物成分とを公知の方法で重合することによって製造できる。通常、重合反応は溶媒中で５〜８０重量％、好ましくは１０〜５０重量％の溶質濃度で行われる。反応終了後、反応溶液は、そのままリン含有ポリアミド酸溶液（ワニス）として、続くイミド化反応で使用することができる。また、反応溶液からリン含有ポリアミド酸を単離し、次いで適切な溶媒に再溶解し、リン含有ポリアミド酸溶液を調製してもよい。 (Wherein A is a tetravalent aromatic group, alicyclic group or aliphatic group) and can be produced by polymerizing with a known method a tetracarboxylic dianhydride component. Usually, the polymerization reaction is carried out in a solvent at a solute concentration of 5 to 80% by weight, preferably 10 to 50% by weight. After completion of the reaction, the reaction solution can be used as it is as a phosphorus-containing polyamic acid solution (varnish) in the subsequent imidization reaction. Alternatively, the phosphorus-containing polyamic acid solution may be prepared by isolating the phosphorus-containing polyamic acid from the reaction solution and then re-dissolving it in an appropriate solvent.
一般式（３）のテトラカルボン酸二無水物成分は、芳香族テトラカルボン酸二無水物、脂肪族テトラカルボン酸二無水物又は脂環式テトラカルボン酸二無水物であってよく、したがってＡの四価の芳香族基、脂環式基または脂肪族基の例としては、炭素数６〜１４の単環式若しくは縮合多環式芳香族化合物（例えば、ベンゼン、インデン、ナフタレン、フルオレン）の四価の基、炭素数２〜１２の脂肪族化合物（例えば、炭素数２〜１２のアルカン、アルケン又はアルキン）の四価の基又は炭素数３〜１０の脂環式化合物（例えば、炭素数３〜１０のシクロアルカン又はシクロアルケン）の四価の基、あるいは同一であっても異なっていてもよい、２つ以上の前記縮合多環式芳香族化合物、脂肪族化合物又は脂環式化合物が、直接もしくは架橋員（ここで架橋員とは、−Ｏ−、−ＣＯ−、−ＣＯＯ−、−ＯＣＯ−、−ＳＯ２−、−Ｓ−、−ＣＨ２−、−Ｃ（ＣＨ３）２−、−Ｃ（ＣＦ３）２−、−Ｓｉ（ＣＨ３）２−、−Ｓｉ（Ｃ６Ｈ５）２−および−ＰＯ−からなる群から選択される）により相互に連結されたものの四価の基（例えば、ビフェニル−３，３’，４，４’−テトライル、ジフェニルエーテル−３，３’，４，４’−テトライル、ジフェニルエーテル−２，３’，３，４’−テトライル、ベンゾフェノン−３，３’，４，４’−テトライル）を挙げることができる。これらの芳香族テトラカルボン酸二無水物、脂肪族テトラカルボン酸二無水物又は脂環式テトラカルボン酸二無水物は、炭素数１〜６のアルキル基、アルケニル基、アルキニル基若しくはアルコキシル基、またはハロゲン原子から選択される１つ以上の置換基を有していてもよい。 The tetracarboxylic dianhydride component of general formula (3) may be an aromatic tetracarboxylic dianhydride, an aliphatic tetracarboxylic dianhydride or an alicyclic tetracarboxylic dianhydride, and therefore Examples of the tetravalent aromatic group, alicyclic group or aliphatic group include four monocyclic or condensed polycyclic aromatic compounds having 6 to 14 carbon atoms (for example, benzene, indene, naphthalene, fluorene). A valent group, a tetravalent group of an aliphatic compound having 2 to 12 carbon atoms (for example, an alkane, alkene or alkyne having 2 to 12 carbon atoms) or an alicyclic compound having 3 to 10 carbon atoms (for example, 3 carbon atoms) 10 cycloalkanes or cycloalkenes), or two or more of the fused polycyclic aromatic compounds, aliphatic compounds or alicyclic compounds, which may be the same or different, Direct or rack In The bridge member, -O-membered (here -, - CO -, - COO -, - OCO -, - SO 2 -, - S -, - CH 2 -, - C (CH 3) 2 -, - C A tetravalent group of those linked to each other by (CF 3 ) 2 —, —Si (CH 3 ) 2 —, —Si (C 6 H 5 ) 2 — and —PO—) For example, biphenyl-3,3 ′, 4,4′-tetrayl, diphenylether-3,3 ′, 4,4′-tetrayl, diphenylether-2,3 ′, 3,4′-tetrayl, benzophenone-3,3 ′ , 4,4′-tetrayl). These aromatic tetracarboxylic dianhydrides, aliphatic tetracarboxylic dianhydrides or alicyclic tetracarboxylic dianhydrides are alkyl groups having 1 to 6 carbon atoms, alkenyl groups, alkynyl groups or alkoxyl groups, or It may have one or more substituents selected from halogen atoms.
ここで用いられる芳香族テトラカルボン酸二無水物の具体例としては、ピロメリット酸二無水物、３，３’，４，４’−ベンゾフェノンテトラカルボン酸二無水物、３，３’，４，４’−ビフェニルスルホンテトラカルボン酸二無水物、１，４，５，８，−ナフタレンテトラカルボン酸二無水物、２，３，６，７−ナフタレンテトラカルボン酸二無水物、３，３’，４，４’−ビフェニルエーテルテトラカルボン酸二無水物、３，３’，４，４’−ジメチルジフェニルシランテトラカルボン酸二無水物、３，３’，４，４’−テトラフェニルシランテトラカルボン酸二無水物、４，４’−ビス（３，４−ジカルボキシフェノキシ）ジフェニルスルフィド二無水物、４，４’−ビス（３，４−ジカルボキシフェノキシ）ジフェニルスルホン二無水物、４，４’−ビス（３，４−ジカルボキシフェノキシ）ジフェニルプロパン二無水物、４，４’−（ヘキサフルオロイソプロピリデン）ビス（フタル酸）二無水物、３，３’，４，４’−ビフェニルテトラカルボン酸二無水物、ビス（フタル酸）フェニルホスフィンオキサイド二無水物、ｐ−フェニレン−ビス（トリフェニルフタル酸）二無水物、ｍ−フェニレン−ビス（トリフェニルフタル酸）二無水物、ビス（トリフェニルフタル酸）−４，４’−ジフェニルメタン二無水物等を挙げることができる。またこれらの芳香族環上の水素原子は、炭素数１〜６のアルキル基、アルケニル基、アルキニル基若しくはアルコキシル基、またはハロゲン原子から選択される１つ以上の置換基で置換されていてもよい。 Specific examples of the aromatic tetracarboxylic dianhydride used here include pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4, 4′-biphenylsulfonetetracarboxylic dianhydride, 1,4,5,8, -naphthalenetetracarboxylic dianhydride, 2,3,6,7-naphthalenetetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyl ether tetracarboxylic dianhydride, 3,3 ′, 4,4′-dimethyldiphenylsilane tetracarboxylic dianhydride, 3,3 ′, 4,4′-tetraphenylsilane tetracarboxylic acid Dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenyl sulfide dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenylsulfone 4,4′-bis (3,4-dicarboxyphenoxy) diphenylpropane dianhydride, 4,4 ′-(hexafluoroisopropylidene) bis (phthalic acid) dianhydride, 3,3 ′, 4 4'-biphenyltetracarboxylic dianhydride, bis (phthalic acid) phenylphosphine oxide dianhydride, p-phenylene-bis (triphenylphthalic acid) dianhydride, m-phenylene-bis (triphenylphthalic acid) Anhydride, bis (triphenylphthalic acid) -4,4'-diphenylmethane dianhydride, etc. can be mentioned. Moreover, the hydrogen atom on these aromatic rings may be substituted with one or more substituents selected from an alkyl group having 1 to 6 carbon atoms, an alkenyl group, an alkynyl group or an alkoxyl group, or a halogen atom. .
脂肪族または脂環式テトラカルボン酸二無水物の例としては、１，２，３，４−ブタンテトラカルボン酸二無水物、１，２，３，４−シクロブタンテトラカルボン酸二無水物、１，２，３，４−シクロペンタンテトラカルボン酸二無水物、１，２，４，５−シクロヘキサンテトラカルボン酸二無水物、ビシクロ［２．２．２］オクト−７−エン−２，３，５，６−テトラカルボン酸二無水物などが挙げられる。 Examples of aliphatic or alicyclic tetracarboxylic dianhydrides include 1,2,3,4-butanetetracarboxylic dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, 1 , 2,3,4-cyclopentanetetracarboxylic dianhydride, 1,2,4,5-cyclohexanetetracarboxylic dianhydride, bicyclo [2.2.2] oct-7-ene-2,3 Examples include 5,6-tetracarboxylic dianhydride.
入手の容易さを考慮に入れると、具体的にピロメリット酸二無水物、３，３’，４，４’−ベンゾフェノンテトラカルボン酸二無水物、３，３’，４，４’−ビフェニルエーテルテトラカルボン酸二無水物、３，３’，４，４’−ビフェニルテトラカルボン酸二無水物、３，３’，４，４’−ビフェニルスルホンテトラカルボン酸二無水物、４，４’−ビス（３，４−ジカルボキシフェノキシ）ジフェニルプロパン二無水物、４，４’−ビス（ヘキサフルオロイソプロピリデン）ビス（フタル酸）二無水物、３，３’，４，４’−ビフェニルテトラカルボン酸二無水物、１，２，３，４−シクロブタンテトラカルボン酸二無水物などの使用が好ましい。 In view of availability, specifically pyromellitic dianhydride, 3,3 ′, 4,4′-benzophenone tetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyl ether Tetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic dianhydride, 3,3 ′, 4,4′-biphenylsulfonetetracarboxylic dianhydride, 4,4′-bis (3,4-dicarboxyphenoxy) diphenylpropane dianhydride, 4,4′-bis (hexafluoroisopropylidene) bis (phthalic acid) dianhydride, 3,3 ′, 4,4′-biphenyltetracarboxylic acid Use of dianhydride, 1,2,3,4-cyclobutanetetracarboxylic dianhydride, etc. is preferred.
さらに、リンの含有量を増加させる目的で、公知のリン含有テトラカルボン酸二無水物を使用してもよい。具体的には、特開２００９−２２１３０９号公報記載の化合物（例えば、後述の実施例７参照）が挙げられる。または本出願人による特願２００９−２７６０６６に記載の化合物を使用することもできる。 Furthermore, for the purpose of increasing the phosphorus content, a known phosphorus-containing tetracarboxylic dianhydride may be used. Specific examples include compounds described in JP-A-2009-221309 (for example, see Example 7 described later). Alternatively, compounds described in Japanese Patent Application No. 2009-276066 by the present applicant can also be used.
本発明のリン含有ポリアミド酸、およびリン含有ポリイミドとは、一般式（IV）で表される反復単位のみからなるリン含有ポリアミド酸、および一般式（III）で表される反復単位のみからなるリン含有ポリイミドのみを意味するものではなく、それぞれかかる繰り返し単位を主要構成単位とするが、それ以外の任意の構成単位を含むものであってもよいことを意味する。したがって、本発明のリン含有ポリイミドの目的や、その前駆体であるリン含有ポリアミド酸の反応性を損なわない範囲で、リン含有ポリアミド酸の製造の際に、ジアミン成分として、一般式（Ｉ）のリン含有ジアミン化合物以外の任意のジアミン化合物を、部分的に使用することができる。 The phosphorus-containing polyamic acid and phosphorus-containing polyimide of the present invention are a phosphorus-containing polyamic acid consisting only of repeating units represented by the general formula (IV) and a phosphorus consisting only of repeating units represented by the general formula (III). It does not mean only the contained polyimide, but each such repeating unit is a main constituent unit, but it means that it may contain any other constituent unit. Accordingly, the purpose of the phosphorus-containing polyimide of the present invention and the reactivity of the phosphorus-containing polyamic acid that is the precursor thereof are not impaired, and in the production of the phosphorus-containing polyamic acid, as the diamine component, the general formula (I) Any diamine compound other than the phosphorus-containing diamine compound can be partially used.
任意のジアミン化合物は、式：Ｈ２Ｎ−Ｂ−ＮＨ２（式中、Ｂは、２価の芳香族基または脂肪族基である）で表わされる芳香族または脂肪族ジアミン化合物であればよく、特に制限は無い。上記のようなテトラカルボン酸二無水物を単独又は２種類以上混合して使用してもよい。 Any diamine compound may be an aromatic or aliphatic diamine compound represented by the formula: H 2 N—B—NH 2 (wherein B is a divalent aromatic group or aliphatic group). There is no particular limitation. You may use the above tetracarboxylic dianhydrides individually or in mixture of 2 or more types.
２価の芳香族基または脂肪族基の例としては、炭素数６〜１４の単環式もしくは縮合多環式芳香族化合物の２価の基（フェニレン、インデニレン、ナフチレン、フルオレニレン等）、炭素数２〜１２の鎖式化合物の２価の基（アルキレン、アルケニレンもしくはアルキニレン基等）、または炭素数４〜１０の脂環式化合物の２価の基（シクロアルキレン、シクロアルケニレン、ビシクロアルキレン、ビシクロアルケニレンもしくはトリシクロアルキレン等）、あるいは同一であっても異なっていてもよい、２つ以上の前記２価の基が、直接もしくは架橋員（ここで架橋員は、前記と同義である）により相互に連結されたものを挙げることができる。これらの芳香族基または脂肪族基は、炭素数１〜４のアルキル、ハロアルキル、アルケニル、アルキニルもしくはアルコキシ基、またはヒドロキシ基から選択される１つ以上の置換基で置換されていてもよい。 Examples of the divalent aromatic group or aliphatic group include divalent groups (phenylene, indenylene, naphthylene, fluorenylene, etc.) of monocyclic or condensed polycyclic aromatic compounds having 6 to 14 carbon atoms, carbon number 2-12 divalent groups of chain compounds (alkylene, alkenylene or alkynylene groups, etc.) or divalent groups of alicyclic compounds having 4-10 carbon atoms (cycloalkylene, cycloalkenylene, bicycloalkylene, bicycloalkenylene) Or two or more divalent groups, which may be the same or different, may be mutually or directly by a bridging member (wherein the bridging member is as defined above). The concatenation can be mentioned. These aromatic groups or aliphatic groups may be substituted with one or more substituents selected from an alkyl, haloalkyl, alkenyl, alkynyl or alkoxy group having 1 to 4 carbon atoms, or a hydroxy group.
そのようなジアミン成分としては、４，４’−ジアミノジフェニルエーテル、３，４’−ジアミノジフェニルエーテル、１，４−ビス（４−アミノフェノキシ）ベンゼン、１，４−ビス（３−アミノフェノキシ）ベンゼン、１，３−ビス（４−アミノフェノキシ）ベンゼン、１，３−ビス（３−アミノフェノキシ）ベンゼン、２，２−ビス［４−（４−アミノフェノキシ）フェニル］プロパン、４，４’−ビス（４−アミノフェノキシ）ビフェニル、４，４’−ビス（３−アミノフェノキシ）ビフェニル、ビス［４−（４−アミノフェノキシ）フェニル］スルホン、ビス［４−（３−アミノフェノキシ）フェニル］スルホン、９，９−ビス（４−アミノフェニル）フルオレン、１，６−ジアミノヘキサン、１，３−ビス（アミノメチル）シクロヘキサン、１，４−ビス（アミノメチル）シクロヘキサン、１，４−ジアミノシクロヘキサン、４，４’−ジアミノジシクロヘキシルメタン、イソホロンジアミン等が挙げられる。本発明の目的である、優れた難燃特性を有するリン含有ポリイミドを提供するためには、本発明のリン含有ポリアミド酸の製造に用いるジアミン成分中、一般式（Ｉ）のリン含有ジアミン化合物を３０モル％以上使用することが好ましく、５０モル％以上使用することがより好ましい。 Examples of such a diamine component include 4,4′-diaminodiphenyl ether, 3,4′-diaminodiphenyl ether, 1,4-bis (4-aminophenoxy) benzene, 1,4-bis (3-aminophenoxy) benzene, 1,3-bis (4-aminophenoxy) benzene, 1,3-bis (3-aminophenoxy) benzene, 2,2-bis [4- (4-aminophenoxy) phenyl] propane, 4,4′-bis (4-aminophenoxy) biphenyl, 4,4′-bis (3-aminophenoxy) biphenyl, bis [4- (4-aminophenoxy) phenyl] sulfone, bis [4- (3-aminophenoxy) phenyl] sulfone, 9,9-bis (4-aminophenyl) fluorene, 1,6-diaminohexane, 1,3-bis (aminomethyl) cycl Hexane, 1,4-bis (aminomethyl) cyclohexane, 1,4-diaminocyclohexane, 4,4'-diaminodicyclohexylmethane, isophoronediamine, and the like. In order to provide a phosphorus-containing polyimide having excellent flame retardancy, which is an object of the present invention, a phosphorus-containing diamine compound of the general formula (I) is used in the diamine component used in the production of the phosphorus-containing polyamic acid of the present invention. It is preferable to use 30 mol% or more, and it is more preferable to use 50 mol% or more.
さらに下記一般式（４）： Furthermore, the following general formula (4):
（式中、ｎは０〜２０の整数の混合値であり、Ｒ１はメチル、イソプロピル、フェニル、ビニル基を示し、Ｒ２は、炭素数１〜７の炭化水素の二価の基、例えばトリメチレン、テトラメチレン、フェニレンなどを示す）で表されるシロキサンジアミンを、ジアミン成分の１〜５０モル％の範囲で用いて共重合させてもよい。 (In the formula, n is an integer mixed value of 0 to 20, R 1 represents a methyl, isopropyl, phenyl, or vinyl group, and R 2 represents a divalent group of a hydrocarbon having 1 to 7 carbon atoms, for example, A siloxane diamine represented by (trimethylene, tetramethylene, phenylene, etc.) may be copolymerized in the range of 1 to 50 mol% of the diamine component.
さらに分子量を調整する目的でモノアミン化合物やジカルボン酸無水物を添加してもよい。使用されるモノアミン化合物として、アニリン、４−アミノフェノール、３−アミノフェノール、４−アミノビフェニル、４−フェノキシアニリン、３−アミノフェニルアセチレン、４−アミノフェニルアセチレンなどであり、ジカルボン酸無水物として、マレイン酸無水物、無水フタル酸、４−フェニルエチニル無水フタル酸、４−エチニル無水フタル酸、トリメリト酸などである。モノアミン化合物やジカルボン酸無水物の添加量は、目的とするリン含有ポリイミドの分子量によって異なるが、通常は使用するすべての酸二無水物とジアミン化合物とのモル数の差の１．０〜数倍のモル数であり、好ましくは１．５〜４．０倍である。酸二無水物が多い場合にはモノアミン化合物、ジアミン化合物が多い場合にはジカルボン酸無水物を加える。 Further, a monoamine compound or a dicarboxylic acid anhydride may be added for the purpose of adjusting the molecular weight. Examples of the monoamine compound used include aniline, 4-aminophenol, 3-aminophenol, 4-aminobiphenyl, 4-phenoxyaniline, 3-aminophenylacetylene, 4-aminophenylacetylene, and the like as dicarboxylic acid anhydrides. Maleic anhydride, phthalic anhydride, 4-phenylethynyl phthalic anhydride, 4-ethynyl phthalic anhydride, trimellitic acid and the like. The amount of monoamine compound or dicarboxylic anhydride added varies depending on the molecular weight of the target phosphorus-containing polyimide, but is usually 1.0 to several times the difference in moles between all acid dianhydrides and diamine compounds used. The number of moles is preferably 1.5 to 4.0 times. When there are many acid dianhydrides, a monoamine compound is added, and when there are many diamine compounds, a dicarboxylic acid anhydride is added.
本発明のリン含有ポリアミド酸の製造に使用される溶媒は、反応に不活性な溶媒なら特に限定されず、例えば、Ｎ，Ｎ−ジメチルホルムアミド、Ｎ，Ｎ−ジメチルアセトアミド、Ｎ−メチル−２−ピロリドン、ジメチルスルホキシド、テトラメチルウレア、テトラヒドロフランなどを単独又は混合形態で使用することができる。特に好ましいのは、Ｎ，Ｎ−ジメチルアセトアミド、Ｎ−メチル−２−ピロリドンである。またこれらの溶媒にトルエン、キシレン、エチルベンゼン、アニソール、モノクロロベンゼン、ジクロロベンゼン、トリクロロベンゼン、ジグリム、トリグリム等の溶媒を任意の割合で混合して用いてもよい。これらの溶媒はまた、単離したリン含有ポリアミド酸の再溶解によりリン含有ポリアミド酸溶液を調製する際に使用してもよい。 The solvent used in the production of the phosphorus-containing polyamic acid of the present invention is not particularly limited as long as it is inert to the reaction. For example, N, N-dimethylformamide, N, N-dimethylacetamide, N-methyl-2- Pyrrolidone, dimethyl sulfoxide, tetramethylurea, tetrahydrofuran and the like can be used alone or in a mixed form. Particularly preferred are N, N-dimethylacetamide and N-methyl-2-pyrrolidone. Further, these solvents may be used by mixing solvents such as toluene, xylene, ethylbenzene, anisole, monochlorobenzene, dichlorobenzene, trichlorobenzene, diglyme and triglyme in an arbitrary ratio. These solvents may also be used in preparing phosphorus-containing polyamic acid solutions by redissolving the isolated phosphorus-containing polyamic acid.
「リン含有ポリイミドおよびその製造方法」
本発明のリン含有ポリイミドは、一般式（III）：
“Phosphorus-containing polyimide and its production method”
The phosphorus-containing polyimide of the present invention has the general formula (III):
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよく、そしてＡは、四価の芳香族基、脂環式基または脂肪族基である）
で表わされる反復単位を有するものである。
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group having 1 to 6 carbon atoms or an alkoxyl group, and A is a tetravalent aromatic group, an alicyclic group. Group or aliphatic group)
It has a repeating unit represented by
本発明のリン含有ポリイミドの製造は、上記のようにして得られた本発明のリン含有ポリアミド酸を公知の方法によって脱水することによって製造される。例えば、リン含有ポリアミド酸溶液を、ガラス板、銅、アルミ、またはステンレス等の金属箔、あるいはポリエチレンテレフタレート（ＰＥＴ）、ポリエチレンナフタレート（ＰＥＮ）、ポリフェニレンサルファイド（ＰＰＳ）、ポリイミド、シリコン樹脂、またフッ素樹脂等の樹脂フィルムなどの基材上に、乾燥後の厚みが０．１〜２５０μｍ、より好ましくは１．０〜１００μｍになるように塗布し、４０〜５００℃、より好ましくは７０〜３５０℃で１分〜５時間、より好ましくは３分〜３時間乾燥させることによって、リン含有ポリイミドを得ることができる。得られたポリイミドは、基材から剥がしてフィルム形態として、またはそのまま積層体として使用することができる。 The phosphorus-containing polyimide of the present invention is manufactured by dehydrating the phosphorus-containing polyamic acid of the present invention obtained as described above by a known method. For example, a phosphorus-containing polyamic acid solution can be obtained by using a glass plate, a metal foil such as copper, aluminum, or stainless steel, or polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyimide, silicon resin, or fluorine. It is applied on a substrate such as a resin film such as a resin so that the thickness after drying is 0.1 to 250 μm, more preferably 1.0 to 100 μm, and 40 to 500 ° C., more preferably 70 to 350 ° C. The phosphorus-containing polyimide can be obtained by drying for 1 minute to 5 hours, more preferably 3 minutes to 3 hours. The obtained polyimide can be peeled off from the substrate and used as a film or as a laminate.
また、リン含有ポリアミド酸溶液に、トルエン、キシレン、エチルベンゼン、モノクロロベンゼン、ジクロロベンゼン、トリクロロベンゼンのような水と共沸する溶媒を加え、１００〜３００℃、より好ましくは１５０〜２５０℃で加熱を行い、イミド化に伴い発生する水を系外に排出し熱イミド化を行うことにより、リン含有ポリイミドを得ることもできる。この時、ピリジン、ピコリン、イミダゾールのような含窒素複素環化合物やトリエチルアミンのようなトリ低級アルキルアミンなどを用いてもよい。あるいは、無水酢酸、トリフルオロ無水酢酸、Ｎ，Ｎ−ジシクロヘキシルカルボジイミドのような脱水剤とピリジン、ピコリン、イミダゾールのような含窒素複素環化合物やトリエチルアミンのようなトリ低級アルキルアミンなどとを加え、０〜２００℃で１〜２４時間脱水することによって化学イミド化を行うことにより、リン含有ポリイミドを得てもよい。上記のように熱的あるいは化学的にイミド化が終了した溶液を、水、メタノール、エタノール、イソプロパノール、アセトン、トルエン、キシレンのような単独溶媒あるいはこれらの混合溶液に注入し、結晶を析出させ濾別し、乾燥、粉砕して粉状の形態として得ることができる。得られたポリイミドは、そのまま射出成型や圧縮成型に用いることができる。また別途、溶媒に溶解させ、ワニスとして使用することもでき、それを前述の基材上に塗布し、乾燥させフィルム形態として得ることもできる。 In addition, a solvent azeotropic with water such as toluene, xylene, ethylbenzene, monochlorobenzene, dichlorobenzene, and trichlorobenzene is added to the phosphorus-containing polyamic acid solution and heated at 100 to 300 ° C, more preferably 150 to 250 ° C. A phosphorus-containing polyimide can be obtained by discharging water generated with imidization out of the system and performing thermal imidization. At this time, a nitrogen-containing heterocyclic compound such as pyridine, picoline or imidazole, or a tri-lower alkylamine such as triethylamine may be used. Alternatively, a dehydrating agent such as acetic anhydride, trifluoroacetic anhydride, N, N-dicyclohexylcarbodiimide and a nitrogen-containing heterocyclic compound such as pyridine, picoline or imidazole, or a tri-lower alkylamine such as triethylamine are added. Phosphorus-containing polyimide may be obtained by performing chemical imidation by dehydrating at ~ 200 ° C for 1 to 24 hours. The solution that has been imidized thermally or chemically as described above is poured into a single solvent such as water, methanol, ethanol, isopropanol, acetone, toluene, xylene or a mixed solution thereof to precipitate crystals and filter. Separately, it can be dried and pulverized to obtain a powder form. The obtained polyimide can be used for injection molding or compression molding as it is. Separately, it can be dissolved in a solvent and used as a varnish, or it can be applied on the aforementioned substrate and dried to obtain a film form.
以下に本発明の様態を明らかにするために、実施例と比較例とを示すが、本発明はここに示す実施例のみに限定されるわけではない。 In order to clarify the mode of the present invention, examples and comparative examples are shown below, but the present invention is not limited to the examples shown here.
実施例で得られた化合物の溶液粘度、純度、融点またはガラス転移温度、ＮＭＲおよび赤外線吸収スペクトルの測定方法は以下の通りである。 The methods for measuring the solution viscosity, purity, melting point or glass transition temperature, NMR and infrared absorption spectrum of the compounds obtained in the examples are as follows.
溶液粘度：Ｂ型粘度計（東京計器（株）製）を用いて、２５℃の温度で測定した。 Solution viscosity: measured using a B-type viscometer (manufactured by Tokyo Keiki Co., Ltd.) at a temperature of 25 ° C.
純度：ＨＰＬＣ（（株）島津製作所製）およびカラム（東ソー（株）製 TSKgel ODS-80TM）を用いて測定を行った。サンプル溶液は、アセトニトリル／水の混合液に試料を溶解もしくは分散させた後、溶液を６０℃で１５分間加熱することで調製した。溶離液は、アセトニトリル／水／リン酸系を用い、純度は面積百分率により算出した。 Purity: Measurement was performed using HPLC (manufactured by Shimadzu Corporation) and column (TSKgel ODS-80TM manufactured by Tosoh Corporation). The sample solution was prepared by dissolving or dispersing the sample in an acetonitrile / water mixture and then heating the solution at 60 ° C. for 15 minutes. The eluent used was an acetonitrile / water / phosphoric acid system, and the purity was calculated by area percentage.
融点またはガラス転移温度：示差走査熱量計（（株）島津製作所製 ＤＳＣ−６０）にて、毎分１０℃で４０〜４００℃まで昇温し、測定を行った。解析ソフトによりＤＳＣ曲線の外挿点から融点またはガラス転移温度を算出した。 Melting point or glass transition temperature: Using a differential scanning calorimeter (DSC-60, manufactured by Shimadzu Corporation), the temperature was raised to 40 to 400 ° C. at 10 ° C. per minute and measured. The melting point or glass transition temperature was calculated from the extrapolation point of the DSC curve by analysis software.
ＮＭＲ：化合物と重ＤＭＳＯ（Cambrige Isotope Laboratories, Inc.製 DMSO-d6 0.05％TMS含有）とを混合した溶液を調製し、ＮＭＲ（日本電子（株）製 ＪＮＭ−ＡＬ４００）にて、１Ｈ−ＮＭＲ測定を行った。 NMR: A solution in which a compound and heavy DMSO (containing DMSO-d 6 0.05% TMS manufactured by Cambrige Isotope Laboratories, Inc.) was mixed was prepared, and 1 H- was obtained using NMR (JNM-AL400 manufactured by JEOL Ltd.). NMR measurement was performed.
赤外線吸収スペクトル：ＩＲ測定装置（（株）パーキンエルマー製Spectrum 100 FT-IR Spectrometer）を用い、ＫＢｒ法にて赤外吸収スペクトルを測定した。 Infrared absorption spectrum: Using an IR measuring apparatus (Spectrum 100 FT-IR Spectrometer manufactured by PerkinElmer Co., Ltd.), an infrared absorption spectrum was measured by the KBr method.
難燃性の評価：フィルムを２００ｍｍ×５０ｍｍの大きさに切り、試験片とした。試験片を円筒状に巻き、クランプに垂直に固定し、サンプル下部にバーナーで３秒間接炎を２回行い、燃焼時間が１０秒以内のものを○、１０秒以上のものを×とした。 Evaluation of flame retardancy: The film was cut into a size of 200 mm × 50 mm to obtain a test piece. The test piece was wound in a cylindrical shape, fixed vertically to the clamp, and subjected to indirect flame twice for 3 seconds with a burner at the bottom of the sample.
実施例１
式（５）：
で表わされるリン含有ジニトロ化合物の合成
攪拌機、温度計、窒素導入管および冷却管を備えた四つ口フラスコに、２−（ジフェニルホスフィニル）ヒドロキノン（北興化学工業（株）製）１４．０ｇ（０．０４５mol）、ＴＨＦ１００ｇおよびトリエチルアミン（和光純薬工業（株）製）９．６ｇ（０．１００mol）を仕込み、窒素気流下、攪拌しながら５℃まで冷却した。フラスコ内の温度を１０℃以下に保ちながら、あらかじめ調整しておいたｐ−ニトロ安息香酸クロリド／ＴＨＦ溶液（５０．４wt％）５２．０ｇ（０．０９５mol）を滴下した。滴下終了後、室温で３時間攪拌した。反応終了後、析出している固体を濾別し、ＴＨＦで洗浄することで、目的物を純度９８．１％で得た。さらに酢酸から再結晶することで、精製物２５．６ｇを収率９３．５％、純度９９．６％、融点２２２℃で得た。精製物の１Ｈ−ＮＭＲを図１に、ＦＴ−ＩＲチャートを図２に示す。
Example 1
Formula (5):
Synthesis of a phosphorus-containing dinitro compound represented by the formula: 2- (diphenylphosphinyl) hydroquinone (manufactured by Hokuko Chemical Co., Ltd.) 14.0 g (0.045 mol), THF 100 g and triethylamine (manufactured by Wako Pure Chemical Industries, Ltd.) 9.6 g (0.100 mol) were charged and cooled to 5 ° C. with stirring in a nitrogen stream. While maintaining the temperature in the flask at 10 ° C. or lower, 52.0 g (0.095 mol) of p-nitrobenzoic acid chloride / THF solution (50.4 wt%) prepared in advance was added dropwise. After completion of dropping, the mixture was stirred at room temperature for 3 hours. After completion of the reaction, the precipitated solid was separated by filtration and washed with THF to obtain the desired product with a purity of 98.1%. Furthermore, 25.6 g of purified product was obtained by recrystallization from acetic acid at a yield of 93.5%, a purity of 99.6%, and a melting point of 222 ° C. FIG. 1 shows the 1 H-NMR of the purified product, and FIG. 2 shows the FT-IR chart.
実施例２
式（６）：
で表わされるリン含有ジアミン化合物の合成
攪拌機、温度計、気体導入管を備えたオートクレーブ（耐圧硝子工業（株）製）に、実施例１で合成したリン含有ジニトロ化合物２０．８ｇ（０．０３４mol）と、パラジウム／カーボン粉末（エヌ・イー ケムキャット（株）製：ＡＥＲ−Ｔｙｐｅ）２．７８ｇおよびＤＭＦ２６０ｇを加え、０．４ＭＰａの水素加圧下、５０℃で５時間攪拌した。反応終了後、パラジウム／カーボン粉末を濾別し、母液を水１Ｌ中に滴下した。析出した固体を濾別し、水で洗浄することで、目的物１５．５ｇを収率８３．１％、純度９８．６％、融点２８５℃で得た。目的物の１Ｈ−ＮＭＲを図３に、ＦＴ−ＩＲチャートを図４に示す。
Example 2
Formula (6):
20.8 g (0.034 mol) of the phosphorus-containing dinitro compound synthesized in Example 1 in an autoclave (manufactured by Pressure Glass Industrial Co., Ltd.) equipped with a synthetic stirrer, a thermometer, and a gas introduction tube Then, 2.78 g of palladium / carbon powder (manufactured by N.E. Chemcat Co., Ltd .: AER-Type) and 260 g of DMF were added, and the mixture was stirred at 50 ° C. for 5 hours under a hydrogen pressure of 0.4 MPa. After completion of the reaction, the palladium / carbon powder was filtered off, and the mother liquor was dropped into 1 L of water. The precipitated solid was separated by filtration and washed with water to obtain 15.5 g of the desired product at a yield of 83.1%, a purity of 98.6%, and a melting point of 285 ° C. The 1 H-NMR of the target product is shown in FIG. 3, and the FT-IR chart is shown in FIG.
実施例３
式（７）：
で表わされるリン含有ジニトロ化合物の合成
攪拌機、温度計、窒素導入管および冷却管を備えた四つ口フラスコに、２−（ジフェニルホスフィニル）ヒドロキノン（北興化学工業（株）製）１４．０ｇ（０．０４５mol）、ＴＨＦ６７．４ｇおよびトリエチルアミン（和光純薬工業（株）製）１５．０ｇ（０．１４８mol）を仕込み、窒素気流下、攪拌しながら５℃まで冷却した。フラスコ内の温度を１０℃以下に保ちながら、あらかじめ調整しておいたｍ−ニトロ安息香酸クロリド／ＴＨＦ溶液（５５．２ｗｔ％）３３．５ｇ（０．０９５mol）を滴下した。滴下終了後、室温で１６時間攪拌した。反応終了後、析出している固体を濾別し、ＴＨＦで洗浄することで、目的物を純度９８．８％で得た。さらに酢酸/水混合溶媒で加熱洗浄することで、精製物１８．６ｇを収率６７．９％、純度９９．５％、融点１８８℃で得た。精製物の１Ｈ−ＮＭＲを図５に、ＦＴ−ＩＲチャートを図６に示す。
Example 3
Formula (7):
Synthesis of a phosphorus-containing dinitro compound represented by the formula: 2- (diphenylphosphinyl) hydroquinone (manufactured by Hokuko Chemical Co., Ltd.) 14.0 g (0.045 mol), 67.4 g of THF, and 15.0 g (0.148 mol) of triethylamine (manufactured by Wako Pure Chemical Industries, Ltd.) were charged and cooled to 5 ° C. with stirring in a nitrogen stream. While maintaining the temperature in the flask at 10 ° C. or less, 33.5 g (0.095 mol) of m-nitrobenzoic acid chloride / THF solution (55.2 wt%) prepared in advance was added dropwise. After completion of dropping, the mixture was stirred at room temperature for 16 hours. After completion of the reaction, the precipitated solid was filtered off and washed with THF to obtain the desired product with a purity of 98.8%. Further, 18.6 g of a purified product was obtained with a yield of 67.9%, a purity of 99.5%, and a melting point of 188 ° C. by washing with an acetic acid / water mixed solvent. FIG. 5 shows the 1 H-NMR of the purified product, and FIG. 6 shows the FT-IR chart.
実施例４
式（８）：
で表わされるリン含有ジアミン化合物の合成
攪拌機、温度計、気体導入管を備えたオートクレーブ（耐圧硝子工業（株）製）に、実施例３で合成したリン含有ジニトロ化合物１８．３ｇ（０．０３０ｍｏｌ）と、パラジウム/カーボン粉末（エヌ・イー ケムキャット（株）製：ＡＥＲ−Ｔｙｐｅ）１．８３ｇおよびＤＭＦ１１０ｇを加え、０．４ＭＰａの水素加圧下、５０℃で１８時間攪拌した。反応終了後、固体を濾別し、母液を水１Ｌ中に滴下した。析出した固体を濾別し、水で洗浄することで、目的物１４．７ｇを収率８９．４％、純度９８．５％、融点１１５．７℃（分解）で得た。目的物の１Ｈ−ＮＭＲを図７に、ＦＴ−ＩＲチャートを図８に示す。
Example 4
Formula (8):
18.3 g (0.030 mol) of the phosphorus-containing dinitro compound synthesized in Example 3 in an autoclave (manufactured by Pressure Glass Industrial Co., Ltd.) equipped with a synthesis stirrer, a thermometer, and a gas introduction tube Then, 1.83 g of palladium / carbon powder (manufactured by N.E. Chemcat Co., Ltd .: AER-Type) and 110 g of DMF were added, and the mixture was stirred at 50 ° C. for 18 hours under a hydrogen pressure of 0.4 MPa. After completion of the reaction, the solid was filtered off and the mother liquor was added dropwise to 1 L of water. The precipitated solid was filtered off and washed with water to obtain 14.7 g of the desired product at a yield of 89.4%, a purity of 98.5%, and a melting point of 115.7 ° C. (decomposition). FIG. 7 shows the 1 H-NMR of the target product, and FIG. 8 shows the FT-IR chart.
実施例５
式（９）：
で表わされる繰り返し単位を有するリン含有ポリイミドの合成
温度計、窒素導入管を備えた四つ口フラスコに、ピロメリット酸二無水物（ＰＭＤＡ）（ダイセル化学工業（株）製）２．１８１２g（０．０１mol）、実施例２で合成したリン含有ジアミン化合物５．４８５３ｇ（０．０１mol）、ＮＭＰ３１．２ｇを仕込み、窒素気流下、室温で１２時間撹拌を行い、リン含有ポリアミド酸を合成した。反応溶液（溶質濃度２０％、粘度（Ｂ型粘度計：東京計器（株）製）３，０００ｍＰａ・ｓ）をそのまま、ポリアミド酸溶液として使用した。得られたリン含有ポリアミド酸溶液をガラス板上に、乾燥後の厚みが２５μｍになるように塗布を行い、９０℃、１３０℃、１８０℃各温度１０分間乾燥を行い、含リンポリイミド／ＰＥＴフィルム積層体を得た。得られたフィルムをＰＥＴフィルムから剥がし、金属枠に固定し２００℃、２５０℃の各温度で６０分間熱処理を行い、リン含有ポリイミドフィルムを得た。
Example 5
Formula (9):
In a four-necked flask equipped with a synthesis thermometer of a phosphorus-containing polyimide having a repeating unit represented by formula (1) and a nitrogen introduction tube, pyromellitic dianhydride (PMDA) (manufactured by Daicel Chemical Industries, Ltd.), 2.812 g (0 .01 mol), 5.4853 g (0.01 mol) of the phosphorus-containing diamine compound synthesized in Example 2, and 31.2 g of NMP were charged, and the mixture was stirred at room temperature for 12 hours in a nitrogen stream to synthesize phosphorus-containing polyamic acid. The reaction solution (solute concentration 20%, viscosity (B-type viscometer: manufactured by Tokyo Keiki Co., Ltd.) 3,000 mPa · s) was used as it was as the polyamic acid solution. The obtained phosphorus-containing polyamic acid solution was coated on a glass plate so that the thickness after drying was 25 μm, dried at 90 ° C., 130 ° C., and 180 ° C. for 10 minutes, and then a phosphorus-containing polyimide / PET film A laminate was obtained. The obtained film was peeled off from the PET film, fixed to a metal frame, and heat-treated at 200 ° C. and 250 ° C. for 60 minutes to obtain a phosphorus-containing polyimide film.
実施例６
式（１０）：
で表わされる繰り返し単位を有するリン含有ポリイミドの合成
テトラカルボン酸二無水物を４，４’−オキシジフタル酸無水物（４−ＯＤＰＡ；マナック（株）製）３．１０２１ｇ（０．０１mol）に変更する以外は実施例５と同様の操作を行い、リン含有ポリイミドフィルムを得た。
Example 6
Formula (10):
The tetracarboxylic dianhydride of a phosphorus-containing polyimide having a repeating unit represented by the following formula is changed to 3.1021 g (0.01 mol) of 4,4′-oxydiphthalic anhydride (4-ODPA; Manac Co., Ltd.) Except for the above, the same operation as in Example 5 was performed to obtain a phosphorus-containing polyimide film.
実施例７
式（１１）：
で表わされる繰り返し単位を有するリン含有ポリイミドの合成
テトラカルボン酸二無水物を式（１２）：
で表わされるリン含有テトラカルボン酸二無水物（ＴＡＰＱ：マナック（株）製；特開２００９−２２１３０９号公報の実施例１参照）６．７２４９ｇ（０．０１mol）に変更する以外は実施例５と同様の操作を行い、リン含有ポリイミドフィルムを得た。
Example 7
Formula (11):
A synthetic tetracarboxylic dianhydride of a phosphorus-containing polyimide having a repeating unit represented by formula (12):
A phosphorus-containing tetracarboxylic dianhydride represented by the formula (TAPQ: manufactured by Manac Co., Ltd .; see Example 1 of JP2009-221309) and 6.7249 g (0.01 mol) The same operation was performed to obtain a phosphorus-containing polyimide film.
比較例１
式（１３）：
で表わされる繰り返し単位を有するポリイミドの合成
テトラカルボン酸二無水物を４，４’−オキシジフタル酸無水物（４−ＯＤＰＡ）３．１０２１ｇ（０．０１mol）に変更し、ジアミンを４，４’−オキシジアニリン（４−ＯＤＡ）（和歌山精化工業（株）製）２．００２４ｇ（０．０１mol）に変更する以外は実施例５と同様の操作を行い、ポリイミドフィルムを得た。
Comparative Example 1
Formula (13):
Synthesis of polyimide having a repeating unit represented by the following formula: Tetracarboxylic dianhydride was changed to 3.1021 g (0.01 mol) of 4,4′-oxydiphthalic anhydride (4-ODPA), and diamine was changed to 4,4′- Except having changed to 2.0024 g (0.01 mol) of oxydianiline (4-ODA) (manufactured by Wakayama Seika Kogyo Co., Ltd.), the same operation as in Example 5 was performed to obtain a polyimide film.
難燃性評価
実施例５、６および７、ならびに比較例１で得られたポリイミドの評価を行った。結果を表１に示す。
Evaluation of Flame Retardancy The polyimides obtained in Examples 5, 6 and 7 and Comparative Example 1 were evaluated. The results are shown in Table 1.
本発明のリン含有ジアミン化合物を用いて製造したリン含有ポリイミドは、従来のポリイミドと同等の物性と共に、優れた難燃特性を示し、薄膜になっても良好な耐熱性を示すので、電気・電子機器等の軽薄短小化のニーズに応えることが可能である。また、本発明の難燃性のリン含有ポリイミドの使用は、更なる難燃剤の添加を回避または減量することができるため、自然環境や人体により安全性の高い難燃化技術である。 The phosphorus-containing polyimide produced using the phosphorus-containing diamine compound of the present invention exhibits excellent flame resistance and physical properties equivalent to those of conventional polyimides. It is possible to meet the need for lighter, thinner and smaller devices. Further, the use of the flame-retardant phosphorus-containing polyimide of the present invention is a flame-retarding technique that is safer in the natural environment and the human body because it can avoid or reduce the addition of further flame retardants.
Claims (9)
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジアミン化合物。 The following general formula (I):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
The phosphorus containing diamine compound represented by these.
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジニトロ化合物。 The following general formula (II):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
A phosphorus-containing dinitro compound represented by:
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジアミン化合物の製造方法であって、下記一般式（II）：
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジニトロ化合物を還元反応に付すことを特徴とする方法。 The following general formula (I):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
A phosphorus-containing diamine compound represented by the following general formula (II):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
A method comprising subjecting a phosphorus-containing dinitro compound represented by the formula to a reduction reaction.
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジニトロ化合物の製造方法であって、下記一般式（１ａ）：
（式中、Ｘは、ＣｌまたはＢｒであり、ベンゼン環上の水素原子は、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるニトロ安息香酸ハライドと、下記一般式（２）：
（式中、ベンゼン環上の水素原子は、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジオールとを、溶媒中、塩基の存在下で反応させることを特徴とする方法。 The following general formula (II):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
A method for producing a phosphorus-containing dinitro compound represented by the following general formula (1a):
(Wherein X is Cl or Br, and the hydrogen atom on the benzene ring may be substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
A nitrobenzoic acid halide represented by the following general formula (2):
(In the formula, the hydrogen atom on the benzene ring may be substituted with an alkyl or alkoxyl group having 1 to 6 carbon atoms)
A process comprising reacting a phosphorus-containing diol represented by formula (I) in a solvent in the presence of a base.
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよく、そしてＡは、四価の芳香族基、脂環式基または脂肪族基である）
で表わされる反復単位を有するリン含有ポリイミド。 The following general formula (III):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group having 1 to 6 carbon atoms or an alkoxyl group, and A is a tetravalent aromatic group, an alicyclic group. Group or aliphatic group)
A phosphorus-containing polyimide having a repeating unit represented by:
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよく、そしてＡは、四価の芳香族基、脂環式基または脂肪族基である）
で表わされる反復単位を有するリン含有ポリイミドの製造方法であって、下記一般式（Ｉ）：
（式中、ベンゼン環上の水素原子は、各々独立して、炭素数１〜６のアルキル基またはアルコキシル基で置換されていてもよい）
で表わされるリン含有ジアミン化合物を含むジアミン成分と、下記一般式（３）：
（式中、Ａは、四価の芳香族基、脂環式基または脂肪族基である）で表されるテトラカルボン酸二無水物成分とを反応させることを特徴とする方法。 The following general formula (III):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group having 1 to 6 carbon atoms or an alkoxyl group, and A is a tetravalent aromatic group, an alicyclic group. Group or aliphatic group)
A process for producing a phosphorus-containing polyimide having a repeating unit represented by the following general formula (I):
(In the formula, each hydrogen atom on the benzene ring may be independently substituted with an alkyl group or alkoxyl group having 1 to 6 carbon atoms)
A diamine component containing a phosphorus-containing diamine compound represented by the following general formula (3):
(Wherein A is a tetravalent aromatic group, alicyclic group or aliphatic group), and a tetracarboxylic dianhydride component represented by the method is reacted.
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| CN111363150A (en) * | 2020-04-22 | 2020-07-03 | 中国地质大学（北京） | Flame-retardant transparent polyimide film and preparation method and application thereof |
| CN116731473A (en) * | 2023-07-13 | 2023-09-12 | 广州银塑阻燃新材料股份有限公司 | Flame-retardant composite master batch based on fiber reinforcement and preparation method thereof |
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