JP2011171030A - Method of manufacturing thermal fuse with resistor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a thermal fuse with a resistor capable of preventing an occurrence of a crack in a location where a lead conductor and a fuse element are connected or in a location where a fuse element membrane electrode and the fuse element are connected or in the fuse element itself during conveyance to a next process or during a sealing process. <P>SOLUTION: The method of manufacturing the thermal fuse with the resistor includes the steps of: fixing an other surface of an insulating substrate 4 onto a support substrate 8 and also fixing a pair of lead conductors 6 onto the support substrate 8 in parallel with the insulating substrate 4; electrically connecting the fuse element membrane electrode 3 to the lead conductors 6 by arranging the fuse element 7 to bridge between the fuse element membrane electrode 3 of the insulating substrate 4 and the pair of lead conductors 6 fixed onto the support substrate 8; and sealing a portion of the insulating substrate 4 on the support substrate 8 and the pair of lead conductors 6 on the support substrate 8 with an insulating seal 9. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to a method of manufacturing a thermal fuse with resistance, which is a protective element of an electric / electronic device.

  As a conventional thermal fuse with a resistor, there is one using a ceramic substrate in which a membrane resistor and a lead conductor membrane electrode and a fuse element membrane electrode are arranged in an electrically connected state on both sides of the membrane resistor. The lead conductor film electrode is fixed in a state where the lead conductor is electrically connected, and a pair of lead conductors are respectively arranged on both sides of the fuse element film electrode. The pair of lead conductors and the fuse element film electrodes are provided in a state where the fuse elements are straddled, and the pair of lead conductors and the fuse element film electrodes are electrically connected. The entire ceramic substrate including this fuse element is applied and sealed with resin (see Patent Document 1).

JP 2007-87783 A

In the manufacturing process of the conventional thermal fuse with resistance, first, a pair of lead conductors are arranged on both sides of the fuse element film electrode of the ceramic substrate. Next, by disposing the fuse element in a state straddling the pair of lead conductors, the fuse element is connected between the pair of lead conductors and the fuse element film electrode. Thereafter, the ceramic substrate is conveyed to the next step.
As the speed is increased during the conveyance, the lead conductor vibrates more strongly. This vibration is concentrated on the location where the lead conductor and the fuse element are connected, the location where the fuse element membrane electrode and the fuse element are connected, or the fuse element itself. May occur.
In addition, in the manufacturing process of this resistance thermal fuse, there is a process of coating and sealing the entire ceramic substrate with a resin. In this step, the ceramic substrate is also lifted by lifting the pair of lead conductors. In this lifted state, the entire ceramic substrate is coated with resin and sealed. However, the lead conductor vibrates more strongly as the speed is increased in the lifting. Therefore, even in this case, the vibration is concentratedly applied to the location where the lead conductor and the fuse element are connected, the location where the fuse element membrane electrode and the fuse element are connected, or the fuse element itself, and the location where the connection is made. There is a risk of cracking in the element itself.
When this crack occurs, the resistance value of the fuse element changes and the operating temperature of the temperature-equipped thermal fuse differs from the set temperature.

  The invention of the present application prevents cracks from being generated at the location where the lead conductor and the fuse element are connected, the location where the fuse element membrane electrode and the fuse element are connected, or the fuse element itself during transport to the next process or sealing process. It is an object of the present invention to provide a method for manufacturing a thermal fuse with resistance that can be used.

In the first aspect of the present invention, the membrane resistor (1), the lead conductor membrane electrode (2) and the fuse element membrane electrode (3) electrically connected to the membrane resistor (1) are arranged on one side. An insulating substrate (4), a lead conductor (5) electrically connected to the lead conductor film electrode (2), and a pair of lead conductors (on both sides of the fuse element film electrode (3)) 6), the fuse element film electrode (3) and the lead conductor (6), and the fuse element film electrode (3) and the pair of lead conductors (6) are electrically connected to each other. A method of manufacturing a thermal fuse with resistance comprising an element (7),
The other side of the insulating substrate (4) is fixed on the supporting substrate (8), and the pair of lead conductors (6) are fixed on the supporting substrate (8) in parallel with the insulating substrate (4). And a process of
The fuse element (7) is disposed across the fuse element film electrode (3) and the pair of lead conductors (6) of the insulating substrate (4) fixed on the support substrate (8). Electrically connecting the fuse element film electrode (3) and the pair of lead conductors (6);
Sealing the insulating substrate (4) on the support substrate (8) and the pair of lead conductors (6) on the support substrate (8) with an insulating sealing material (9). It is characterized by.

The invention according to claim 2 is provided with a pair of membrane electrodes (13) on the support substrate (8),
The lead conductor (6) electrically connected to the fuse element film electrode (3) is fixed to each film electrode (13) by soldering.

  The invention described in claim 3 is characterized in that the lead conductor (6) electrically connected to the fuse element film electrode (3) is fixed on the support substrate (8) with an adhesive.

  According to the first aspect of the present invention, when the lead conductor vibrates in the transporting or sealing process to the next process by fixing the lead conductor connected to the fuse element on the support substrate, the lead The vibration of the conductor can be suppressed at the fixed portion between the lead conductor and the support substrate. For this reason, it is possible to prevent a load from concentrating on the location where the lead conductor and the fuse element are connected, the location where the fuse element membrane electrode and the fuse element are connected, or the fuse element itself due to vibration from the lead conductor. it can.

  According to the second aspect of the present invention, since the lead conductor is fixed to the membrane electrode of the support substrate by soldering, it is supported as in the case of welding the lead conductor to the membrane electrode of the support substrate by spot welding or the like. There is no risk of the substrate being deformed.

  According to the third aspect of the present invention, since the lead conductor is fixed to the support substrate with an adhesive, thermal stress is not applied to the support substrate as in the case of fixing by soldering or welding.

(A) is a partially cutaway plan view showing an example of a temperature fuse with resistance manufactured by the method of manufacturing a temperature fuse with resistance of the present invention, and (b) is a temperature with resistance shown in (a). It is side surface sectional drawing of a fuse. (A) is a top view of the insulated substrate of the thermal fuse with a resistance shown by FIG. 1, (b) is a back side top view of the insulated substrate of (a). It is a top view of the support substrate of the thermal fuse with a resistance shown by FIG. (A) It is a manufacturing method of the thermal fuse with a resistance which is 1st Embodiment of this invention, Comprising: It is a top view of the thermal fuse with a resistance before providing a fuse element, (b) was shown by (a). It is the figure which showed the temperature fuse with resistance from a pair of lead conductor side. (A) is the manufacturing method of the resistance temperature fuse which is 1st Embodiment of this invention, Comprising: It is a top view of the resistance temperature fuse after providing a fuse element, (b) is shown by (a). FIG. 3 is a view showing a thermal fuse with resistance from a pair of lead conductors. (A) is the manufacturing method of the thermal fuse with a resistance which is 1st Embodiment of this invention, Comprising: It is a top view of the thermal fuse with a resistance after flux-applying to the outer surface of the fuse element of FIG. 5, (b) It is the figure which showed the thermal fuse with a resistance shown by (a) from a pair of lead conductor side. FIG. 7A is a plan view of a thermal fuse with resistance according to the first embodiment of the present invention, which is a method for manufacturing a thermal fuse with resistance, after an insulating sealing material is provided on the thermal fuse with resistance of FIG. (B) is a back side plan view of the thermal fuse with resistance shown in (a), and (c) is a diagram showing the thermal fuse with resistance shown in (a) from a pair of lead conductors. (D) is a side view of the thermal fuse with resistance shown in (a), and (e) is a partial sectional view of the thermal fuse with resistance shown in (d). It is a top view which shows another example in the manufacturing method of the thermal fuse with a resistance of this invention. (A) is a partially cutaway plan view showing a temperature fuse with resistance manufactured by the method of manufacturing a temperature fuse with resistance according to the second embodiment of the present invention, and (b) is shown in (a). It is a top view which shows the surface side of the insulation board | substrate of the thermal fuse with a resistance which it was, (c) is a back side top view which shows the back side of the insulation board | substrate shown by (b).

  A preferred embodiment of a method for manufacturing a thermal fuse with resistance according to the present invention will be described below with reference to the drawings.

  As shown in FIGS. 1A and 1B and FIGS. 2A and 2B, the thermal resistor with resistance manufactured by the method of manufacturing a thermal fuse with resistance according to the first embodiment of the present invention has a film resistance. 1, a lead conductor membrane electrode 2 and a fuse element membrane electrode 3 electrically connected to the membrane resistor 1 are provided with an insulating substrate 4 disposed on one side (front surface). A lead conductor 5 is electrically connected to the lead conductor film electrode 2 of the insulating substrate 4 via the film electrode 10, and a pair of lead conductors 6 are arranged on both sides of the fuse element film electrode 3 of the insulating substrate 4. ing. The other one surface (back surface) of the insulating substrate 4 is fixed on the support substrate 8, and the lead conductor 5 electrically connected to the lead conductor film electrode 2 in parallel with the insulating substrate 4 and the fuse element film electrode 3. A pair of lead conductors 6 electrically connected to each other are fixed on one side (surface) of the support substrate 8. A fuse element 7 is disposed across the fuse element film electrode 3 and the pair of lead conductors 6 to electrically connect the fuse element film electrode 3 and the pair of lead conductors 6. A flux 11 is applied to the outer surface of the fuse element 7. Further, on the support substrate 8, the insulating substrate 4, the lead conductors 5 and 6, the fuse element 7 and the flux 11 applied to the fuse element 7 are covered and sealed with an insulating sealing material 9.

  1 (a) and 1 (b), the operation mechanism of the thermal fuse with resistance is such that power is supplied to the electronic / electrical equipment through the lead conductor 6 and the fuse element 7, and an abnormality occurs in the electronic / electrical equipment. In this case, a current is passed through the membrane resistor 1 through the lead conductor 5 to cause the membrane resistor 1 to generate heat and the generated heat is blown to cut off the power supply. This fuse with a resistor can be used in various fields. For example, it is incorporated in a battery pack of a lithium ion secondary battery together with an IC control circuit for supplying a current to the lead conductor 5 when an abnormality is detected, thereby overcharging the secondary battery. It can be used to stop charging or discharging during overdischarge.

  1A and 1B has a configuration in which the fuse element 7 and the pair of lead conductors 6 are directly connected to each other, so that the planar dimension of the insulating substrate 4 can be reduced, and the insulating substrate can be reduced. The heat capacity of 4 can be reduced. Accordingly, the energization heat generation rate of the membrane resistor 1 can be increased, the fusing of the fuse element 7 can be speeded up, and the operation speed can be increased.

  The insulating substrate 4 shown in FIGS. 2 (a) and 2 (b) is a good thermal conductive ceramic substrate having a thickness of 0.3 to 0.4 mm. A film resistor 1 and leads are formed on the surface of the substrate 4. A conductor film electrode 2 and a fuse element film electrode 3 are arranged. The film resistor 1 is disposed in the middle portion of the insulating substrate 4, the lead conductor film electrode 2 is disposed on one end side of the insulating substrate 4 (upper side in FIG. 2A), and the fuse element film electrode 3 is disposed on the insulating substrate 4. Is disposed on the other end side (lower side of FIG. 2A). The membrane resistor 1 is electrically connected in a state where one end side thereof is superimposed and joined to the lead conductor membrane electrode 2, and the other end side is electrically connected in a state where the other end side is superimposed and joined to the fuse element membrane electrode 3. This film resistor 1 is provided by printing and baking of a resistance paste, for example, ruthenium oxide paste. The lead conductor film electrode 2 and the fuse element film electrode 3 are provided by printing and baking a conductive paste, for example, a silver paste. The lead conductor film electrode 2 is provided not only from the front surface of the insulating substrate 4 but also from the front surface to the back surface thereof. The fuse element membrane electrode 3 has a substantially T-shape including a fuse element connection portion 3a joined to the intermediate portion 7a of the fuse element 7 by welding or the like, and a membrane resistance connection portion 3b joined to the membrane resistor 1 in an overlapping manner. Is formed. The fuse element connection portion 3a is formed so as to protrude from the membrane resistance connection portion 3b in the direction opposite to the membrane resistance 1. The fuse element connecting portion 3a is formed narrower than the membrane resistor 1 and the membrane resistor connecting portion 3b in order to increase the energization heat generation rate. A protective film 12 (for example, a glass baking film) for protecting the film resistance 1 is provided on the film resistance 1.

  The lead conductor 5 electrically connected to the lead conductor membrane electrode 2 via the membrane electrode 10 has a flat shape, for example, Sn plating on copper, iron having higher thermal resistance than copper, iron alloys such as iron alloys, nickel or the like Is used. The pair of lead conductors 6 electrically connected to the fuse element film electrode 3 via the fuse element 7 has a flat shape, and for example, Sn plated copper or the like is used. When the lead conductor 5 is made of iron such as iron or iron alloy having a high thermal resistance or nickel plated with Sn or the like, the generated heat to melt the fuse element 7 of the film resistance 1 is transmitted through the lead conductor 5. Therefore, the fuse element 7 can be blown out quickly.

  As shown in FIGS. 2A and 5, the fuse element 7 has an intermediate portion 7a joined to the fuse element connection portion 3a of the fuse element film electrode 3 by welding or the like, and both end portions 7b are paired with each other. The lead conductor 6 is joined by welding or the like. The fuse element 7 is preferably a fusible alloy having a high bending rigidity composition. The flux 11 of FIG. 6 applied to the outer surface of the fuse element 7 is composed mainly of rosin, and the flux 11 has a melting point lower than that of the fuse element 7. The flux 11 can be applied by heating and melting the flux 11 and applying and solidifying the molten flux.

  The support substrate 8 shown in FIGS. 1, 3, 4, and 5 to 7 is a glass epoxy substrate having a thickness of around 0.1 mm and higher thermal resistance than the ceramic insulating substrate 4. By making the thermal resistance of the support substrate 8 higher than the thermal resistance of the insulating substrate 4, the generated heat to melt the fuse element 7 of the film resistance 1 of the insulating substrate 4 is prevented from leaking along the support substrate 8. Therefore, the fuse element 7 can be blown quickly.

  As for the surface of the support substrate 8, the membrane electrode 10 is provided by etching copper foil on one end side (upper side in FIG. 3), and the pair of membrane electrodes 13 is etched on the other end side (lower side in FIG. 3). Is provided. The pair of membrane electrodes 13 are provided with a predetermined gap between the membrane electrodes 13 where the fuse element membrane electrode 3 of the insulating substrate 4 can be arranged.

  As shown in FIG. 7, the insulating sealing material 9 is supported so as to surround the insulating substrate 4 and the protective sheet 9 a (for example, a ceramic sheet or a glass cloth sheet) disposed in contact with the flux 11 on the supporting substrate 8. A curable resin (epoxy resin) 9 b is disposed on the periphery of the substrate 8 and seals the gap between the protective sheet 9 a and the support substrate 8. As the curable resin 9b, a room temperature curable resin that is cured at a temperature lower than the melting point of the fuse element 7 is used.

  Next, a method of manufacturing the resistance-equipped thermal fuse shown in FIG. 1, which is the first embodiment of the present invention, will be described with reference to FIGS. 4, 5, 6, and 7. FIG.

  FIG. 4A shows a plan view of a thermal fuse with resistance in the process of fixing the insulating substrate 4 and the lead conductors 5 and 6 on the support substrate 8 in a juxtaposed state, and FIG. It is the figure which showed the temperature fuse with a resistance shown by a) from a pair of lead conductor 6 side. The back surface of the insulating substrate 4 is fixed on the support substrate 8. Specifically, the lead conductor film electrode 2 existing on the back surface of the insulating substrate 4 is fixed to the film electrode 10 on the support substrate 8 by soldering or welding. Along with the fixing of the insulating substrate 4, the tip end portion of the lead conductor 5 electrically connected to the lead conductor membrane electrode 2 is fixed to the membrane electrode 10 on one end side of the support substrate 8 by soldering or welding. On the other hand, the tip ends of the pair of lead conductors 6 are fixed to each of the membrane electrodes 13 positioned on both sides of the fuse element membrane electrode 3 of the insulating substrate 4 on the other end side of the support substrate 8 by soldering or welding. However, if the tip portions of the lead conductors 5 and 6 are welded to the membrane electrodes 10 and 13 of the support substrate 8 by spot welding or the like, the support substrate 8 may be deformed, so the membrane electrodes 10 and 13 and the lead conductors 5 and 6 It is preferable to perform bonding with the soldering.

  FIG. 5A shows a fuse element film electrode 3 and a pair of lead conductors 6 of the insulating substrate 4 fixed on the support substrate 8 and a pair of the fuse conductors 7 and a pair of fuse element film electrodes 3. The top view of the thermal fuse with a resistance in the process of electrically connecting with the lead conductor 6 is shown. FIG. 5B is a view showing the thermal fuse with resistance shown in FIG. 5A from the pair of lead conductors 6 side. Specifically, the intermediate portion 7a of the fuse element 7 is joined to the fuse element connecting portion 3a of the fuse element film electrode 3 of the insulating substrate 4 by welding or the like, and both end portions 7b of the fuse element 7 are connected to the lead conductors 6 respectively. Join to the tip by welding.

  The resistance thermal fuse shown in FIGS. 5A and 5B proceeds to the next step with the surface of the support substrate 8 to which the insulating substrate 4 and the lead conductors 5 and 6 are fixed facing upward. Be transported. In this case, since the lead conductor 6 connected to the fuse element 7 is fixed on the support substrate 8, when the lead conductor 6 vibrates during conveyance to the next process, the vibration of the lead conductor 6 is reduced. And the support substrate 8 can be suppressed. For this reason, when vibration is transmitted from the lead conductor 6, a load concentrates on the portion where the lead conductor 6 and the fuse element 7 are connected, the portion where the fuse element membrane electrode 3 and the fuse element 7 are connected, or the fuse element 7 itself, and cracks. Can be prevented from occurring.

  FIG. 6A shows a plan view of a thermal fuse with resistance in the step of applying a flux 11 to the fuse element 7 arranged across the fuse element film electrode 3 of the insulating substrate 4 and the pair of lead conductors 6. FIG. 6B is a diagram showing the resistance temperature fuse shown in FIG. 6A from the pair of lead conductors 6 side. As shown in FIGS. 6A and 6B, the flux 11 is applied so as to cover the fuse element 7 and not reach the support substrate 8.

  In the thermal fuse with resistance shown in FIGS. 6A and 6B, after the flux 11 is applied, the surface of the support substrate 8 to which the insulating substrate 4 and the lead conductors 5 and 6 are fixed is directed upward. It is conveyed to the next process in the state. Since the lead conductor 6 connected to the fuse element 7 is fixed on the support substrate 8 in this temperature-provided fuse, when the lead conductor 6 vibrates during conveyance to the next process, the vibration of the lead conductor 6 occurs. Can be suppressed by the fixing portion between the lead conductor 6 and the support substrate 8. For this reason, when vibration is transmitted from the lead conductor 6, a load concentrates on the portion where the lead conductor 6 and the fuse element 7 are connected, the portion where the fuse element membrane electrode 3 and the fuse element 7 are connected, or the fuse element 7 itself, and cracks. Can be prevented from occurring.

FIG. 7A shows a process of sealing the insulating substrate 4 on the support substrate 8 and the pair of lead conductors 6 on the support substrate 8 with an insulating sealing material 9 after applying the flux 11 to the fuse element 7. The top view of the thermal fuse with a resistance in is shown. 7B is a plan view of the back side of the thermal fuse with resistance shown in FIG. 7A, and FIG. 7C is a pair of lead conductors with the thermal fuse with resistance shown in FIG. 7A. It is the figure shown from 6 side. FIG. 7 (d) is a side view of the thermal fuse with resistance shown in FIG. 7 (a), and FIG. 7 (e) is a partial sectional view of FIG. 7 (d). Here, the insulating sealing material 9 includes a protective sheet 9a (for example, a ceramic sheet or a glass cloth sheet) and a curable resin (epoxy resin) 9b. First, a curable resin 9b is dropped onto the periphery of the surface of the support substrate 8, and the curable resin 9b surrounds the insulating substrate 4 on the support substrate 8 and the lead conductors 5 and 6 on the support substrate 8. To do. The dropping application of the curable resin 9b is continued until the length of the curable resin 9b in the thickness direction becomes larger than the distance from the surface of the support substrate 8 to the surface of the flux 11. Next, a protective sheet 9a is placed on the upper end surface of the curable resin 9b, and the protective sheet 9a is pressed toward the support substrate 8 until the back surface contacts the surface of the flux 11, and the protective sheet 9a and the support substrate are pressed. 8 is sealed by sealing with a curable resin 9b.
In this sealing step, only one side of the support substrate 8 (the surface to which the insulating substrate 4 and the lead conductors 5 and 6 are fixed) is sealed with the insulating sealing material 9, so that the substrate can be sealed as in the prior art. The lead conductor 6 does not vibrate strongly as compared with a sealing process in which the entire substrate is applied with resin and sealed. Even when the lead conductor 6 vibrates in the sealing process, the lead conductor 6 connected to the fuse element 7 is fixed on the support substrate 8, so that the vibration of the lead conductor 6 is detected by the lead conductor 6 and the support substrate 8. It can be suppressed at the fixed part. For this reason, it is possible to prevent a load from concentrating on the place where the lead conductor 6 and the fuse element 7 are connected, the place where the fuse element film electrode 3 and the fuse element 7 are connected, or the fuse element 7 itself and cracking.

  FIG. 8 shows another embodiment of the method for manufacturing a thermal resistor with resistance according to the present invention, which is manufactured in the process of fixing the insulating substrate 4 and the lead conductors 5 and 6 on the support substrate 8 in a juxtaposed manner. An example plan view is shown. The thermal fuse with resistance of FIG. 8 differs from the thermal fuse with resistance of FIG. 4A in the arrangement configuration of the insulating substrate 4 and the lead conductors 5 and 6 on the support substrate 8. As shown in FIG. 8, the insulating substrate 4 is supported on the support substrate 8 in a state where the fuse element connecting portion 3 a of the fuse element film electrode 3 is directed to one side in the width direction (left-right direction in FIG. 8). Stick on top. Along with the fixing of the insulating substrate 4, a pair of lead conductors 6 are arranged and fixed on one end side and the other end side of the support substrate 8, respectively, and in parallel with the lead conductor 6 arranged on the other end side of the support substrate 8. Then, the lead conductor 5 is disposed and fixed to the other end side of the support substrate 8.

  FIG. 9A shows a plan view of an example of a thermal resistor with resistance manufactured by the method for manufacturing a thermal fuse with resistance according to the second embodiment of the present invention. In the insulating substrate 4 used in the second embodiment, the lead conductor film electrode 2 is provided only on one side where the film resistor 1 and the fuse element film electrode 3 are provided, and the other side on the opposite side. This is different from the insulating substrate 4 used in the first embodiment in that it is not provided in FIG. 9, and the other configuration is the same (see FIGS. 9B and 9C). Further, the support substrate 8 used in the second embodiment is different from the support substrate 8 used in the first embodiment in that no membrane electrode is provided, and the other configuration is the same.

  The thermal fuse with resistance of FIG. 9A is manufactured as follows. First, the insulating substrate 4, the lead conductor 5 electrically connected to the lead conductor film electrode 2, and the lead conductor 6 electrically connected to the fuse element film electrode 3 are bonded together on the support substrate 8. Fix with agent. Subsequently, the lead conductor film electrode 2 and the lead conductor 5 are electrically connected by disposing a highly conductive metal connection portion M such as copper across the lead conductor film electrode 2 and the lead conductor 5. Thereafter, the fuse element 7 is disposed across the fuse element film electrode 3 and the pair of lead conductors 6 of the insulating substrate 4 fixed on the support substrate 8, and the fuse element film electrode 3 and the pair of lead conductors 6 Electrically connect. The subsequent steps are the same as those in the first embodiment (see FIGS. 5, 6, and 7). The insulating substrate 4 and the lead conductors 5 and 6 may be arranged on the support substrate 8 as shown in FIG.

  In addition, although the insulation sealing thing 9 used for the manufacturing method of the thermal fuse with a resistance of the above-mentioned embodiment is the structure provided with the protection sheet 9a and curable resin (epoxy resin) 9b, this invention is to this. It is not limited. The insulating sealing material of the present invention may be anything that protects the insulating substrate on the supporting substrate and the lead conductor portion on the supporting substrate. For example, the insulating sealing material is dimensioned to cover the insulating substrate and the lead conductor portion. An insulating case may be used.

DESCRIPTION OF SYMBOLS 1 Membrane resistance 2 Membrane electrode for lead conductor 3 Membrane electrode for fuse element 4 Insulating substrate 5 Lead conductor 6 Lead conductor 7 Fuse element 8 Support substrate 9 Insulating sealing material 13 Membrane electrode

Claims (3)

An insulating substrate (4) having a membrane resistor (1), a lead conductor membrane electrode (2) and a fuse element membrane electrode (3) electrically connected to the membrane resistor (1) disposed on one side; A lead conductor (5) electrically connected to the lead conductor film electrode (2), a pair of lead conductors (6) disposed on both sides of the fuse element film electrode (3), and the fuse element film A fuse element (7) disposed across the electrode (3) and the pair of lead conductors (6) and electrically connecting the fuse element film electrode (3) and the pair of lead conductors (6). A method of manufacturing a thermal fuse with resistance,
The other side of the insulating substrate (4) is fixed on the supporting substrate (8), and the pair of lead conductors (6) are fixed on the supporting substrate (8) in parallel with the insulating substrate (4). And a process of
The fuse element (7) is disposed across the fuse element film electrode (3) and the pair of lead conductors (6) of the insulating substrate (4) fixed on the support substrate (8). Electrically connecting the fuse element film electrode (3) and the pair of lead conductors (6);
Sealing the insulating substrate (4) on the support substrate (8) and the pair of lead conductors (6) on the support substrate (8) with an insulating sealing material (9). A method of manufacturing a thermal fuse with a resistance. A pair of membrane electrodes (13) is provided on the support substrate (8),
The resistance thermal fuse according to claim 1, wherein the lead conductor (6) electrically connected to the fuse element film electrode (3) is fixed to each film electrode (13) by soldering. Manufacturing method.   The resistance thermal fuse according to claim 1, wherein the lead conductor (6) electrically connected to the fuse element film electrode (3) is fixed on the support substrate (8) with an adhesive. Manufacturing method.

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