JP2011169976A - Radiation-sensitive resin composition, interlayer insulating film and method for forming the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiation-sensitive resin composition which has high radiation sensitivity and can be baked by heating at a low temperature in a short period of time so that it is suitably used in the formation of an interlayer insulating film of a flexible display. <P>SOLUTION: The radiation-sensitive resin composition for forming an interlayer insulating film contains [A] an alkali-soluble resin of a copolymer formed by copolymerizing a monomer containing (a1) unsaturated carboxylic acid and/or unsaturated carboxylic anhydride, and (a2) an epoxy group-containing unsaturated compound, [B] a 1,2-quinonediazide compound, and [C] a compound including two or more mercapto groups in one molecule. The compound including two or more mercapto groups in one molecule as the component [C] is preferably a compound represented by formula (1), wherein R<SP>1</SP>is methylene, 2-10C alkylene or alkylmethylene; Y is a single bond, -CO- or -O-CO-* (provided that a bond to which "*" is attached bonds to R<SP>1</SP>); n is an integer of 2-10; and X is a 2-70C n-valent hydrocarbon group which may have one or more ether bonds, or in the case of n=3, X is a group represented by formula (2), wherein three symbols R<SP>2</SP>are each independently methylene or 2-6C alkylene; and three marks "*" are each a bond. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a radiation-sensitive resin composition suitably used for forming an interlayer insulating film of a flexible display, an interlayer insulating film formed from the composition, and a method for forming the same.

  In recent years, flexible displays such as liquid crystal electronic paper have become widespread due to improvements in convenience such as weight reduction and size reduction. As a substrate for such a flexible display, a plastic substrate such as polycarbonate or polyethylene terephthalate has been studied instead of a glass substrate. However, these plastics have a problem that they are slightly expanded and contracted when heated, thereby impeding the function as a display, and improvement in heat resistance is an urgent need. On the other hand, in order to reduce the thermal stress applied to the plastic substrate, it has been studied to lower the temperature of the flexible display manufacturing process. One of the processes requiring the highest temperature in manufacturing a flexible display is a process of baking an interlayer insulating film by heating, and a reduction in the heating process is required.

  At present, as a material for forming an interlayer insulating film, a material having a small number of steps for obtaining a required pattern shape and having a high surface hardness is preferable. Therefore, a radiation sensitive resin composition is widely used. Yes. As such a radiation sensitive resin composition, for example, JP-A No. 2001-354822 discloses a sensitivity containing a copolymer composed of an unsaturated carboxylic acid and / or an anhydride thereof, an epoxy group-containing unsaturated compound, and the like. A radiation resin composition is disclosed, and a surface hardness as an interlayer insulating film is obtained by a cleavage reaction between a carboxyl group and an epoxy group. However, a heating process at a high temperature of 200 ° C. or higher is required to increase the surface hardness to a level that is actually required commercially as an interlayer insulating film. Considering the heat resistance of the plastic substrate, the temperature in the heating step is preferably 180 ° C. or lower. However, when heating is performed at a high temperature of 200 ° C. or higher, the substrate may be deformed.

  JP-A-2008-77067 discloses a copolymer comprising an unsaturated carboxylic acid and / or an anhydride thereof, an epoxy group-containing unsaturated compound, a polymerizable compound having an ethylenically unsaturated bond, and photopolymerization initiation. A negative radiation-sensitive resin composition for forming a spacer of a liquid crystal display device containing an agent and a thiol compound having two or more mercapto groups in one molecule is disclosed. However, although the radiation sensitive resin composition of the said literature is excellent in terms of radiation sensitivity, adhesion to the substrate, etc., it is not intended for firing by low temperature heating to cope with a plastic substrate.

  In view of the above circumstances, Japanese Unexamined Patent Application Publication No. 2009-4394 discloses a flexible display that is excellent in terms of solvent resistance, specific resistance, semiconductor mobility, etc. by firing a low-temperature curable polyimide precursor at 180 ° C. or lower. It is disclosed that a gate insulating film can be obtained. However, since the coating liquid containing the polyimide precursor of the above document is a chemical curing system and does not have pattern forming ability by exposure and development, fine pattern formation is impossible. In addition, in the formation of an insulating film using such a coating liquid containing a polyimide precursor, there is an inconvenience that it takes 1 hour or longer before the cured film is heated and baked. Therefore, it can be heated and fired at a low temperature and in a short time so as to be suitably used for manufacturing an insulating film for flexible displays, and has a radiation sensitivity capable of simple film formation and fine pattern formation. There is a strong demand for the development of a resin composition having the same.

  Moreover, in the device manufacturing process of a flexible display, it may be necessary to form a laminate by coating the upper layer of the interlayer insulating film. Therefore, in addition to having a high relative dielectric constant, the interlayer insulating film is required to have excellent solvent resistance against the solvent used when forming a laminate by coating.

JP 2001-354822 A JP 2008-77067 A JP 2009-4394 A

  The present invention has been made based on the above circumstances, and its purpose is that it can be heated and fired at a low temperature in a short time, has high radiation sensitivity, and is an interlayer insulating film of a flexible display. It is providing the radiation sensitive resin composition used suitably for formation. Another object of the present invention is to provide a radiation sensitive resin composition capable of forming an interlayer insulating film excellent in solvent resistance and relative dielectric constant.

The present invention made to solve the above problems
[A] an alkali-soluble resin of a copolymer obtained by copolymerizing a monomer containing (a1) an unsaturated carboxylic acid and / or an unsaturated carboxylic acid anhydride, and (a2) an epoxy group-containing unsaturated compound,
[B] A radiation-sensitive resin composition for forming an interlayer insulating film containing a 1,2-quinonediazide compound, and [C] a compound having two or more mercapto groups in one molecule.

  The resin composition is a compound having two or more mercapto groups in one molecule of the [C] component in addition to the alkali-soluble resin of the [A] component and the 1,2-quinonediazide compound of the [B] component. By containing a cross-linking agent, it is possible to form an interlayer insulating film with high radiation sensitivity, low temperature and short time heating and baking, and excellent in solvent resistance and relative dielectric constant. Can be suitably used as a material for forming an interlayer insulating film of a flexible display.

  The compound having two or more mercapto groups in one molecule of the [C] component in the radiation-sensitive resin composition is preferably a compound represented by the following formula (1). In addition, typically, an esterified product of mercaptocarboxylic acid and a polyhydric alcohol can be used as the compound represented by the formula (1). By using the compound represented by the following formula (1) as the component [C], high curability in the heating step of the radiation sensitive resin composition can be obtained.

（式（１）中、Ｒ^１はメチレン基、炭素数２〜１０のアルキレン基又はアルキルメチレン基であり、Ｙは単結合、−ＣＯ−又は−Ｏ−ＣＯ−^＊（ただし、「＊」を付した結合手がＲ^１と結合する。）であり、ｎは２〜１０の整数であり、Ｘは１個又は複数個のエーテル結合を有していてもよい炭素数２〜７０のｎ価の炭化水素基、又はｎが３の場合式（２）で示される基である。式（２）中、３つのＲ^２は、各々独立に、メチレン基又は炭素数２〜６のアルキレン基であり、３つの「＊」は、それぞれ結合手であることを表す。）

(In the formula (1), R ¹ is a methylene group, an alkylene group having 2 to 10 carbon atoms or an alkylmethylene group, and Y is a single bond, —CO— or —O—CO— ^* (where “*” is The bond is attached to R ¹ ), n is an integer of 2 to 10, and X is an n valence having 2 to 70 carbon atoms which may have one or more ether bonds. Or a group represented by formula (2) when n is 3. In formula (2), three R ^{2 s} are each independently a methylene group or an alkylene group having 2 to 6 carbon atoms. Yes, and three “*” represent bonds.)

  It is preferable that the said radiation sensitive resin composition further contains the compound shown by [D] following formula (3). By using the compound represented by the following formula (3) as the component [D], higher curability in the heating step of the radiation-sensitive resin composition can be obtained.

（式（３）中、Ｚ^１、Ｚ^２、Ｚ^３及びＲ^３は、各々独立に、水素原子又は置換基を有していてもよい炭素数１〜２０の直鎖状、分岐状又は環状の炭化水素基を示し、Ｚ^２とＺ^３は互いに連結して環を形成してもよい。）

(In formula (3), Z ¹ , Z ² , Z ³ and R ³ are each independently a linear, branched or cyclic group having 1 to 20 carbon atoms which may have a hydrogen atom or a substituent. And Z ² and Z ³ may be linked to each other to form a ring.)

In addition, the method of forming the interlayer insulating film of the present invention,
(1) The process of forming the coating film of the said radiation sensitive resin composition on a board | substrate,
(2) A step of irradiating at least a part of the coating film formed in step (1),
(3) A step of developing the coating film irradiated with radiation in the step (2), and (4) a step of baking the coating film developed in the step (3) by heating.
Here, “firing” means heating until the surface hardness required for the interlayer insulating film is obtained.

  When the interlayer insulating film is formed by the above-described process using the radiation-sensitive resin composition, a pattern is formed by exposure / development using radiation sensitivity, so that a fine and fine pattern is easily formed. be able to. Moreover, the interlayer insulation film which has sufficient surface hardness can be formed by the low temperature and short time heating by exposure and image development using the said radiation sensitive resin composition.

  The firing temperature in step (4) in the method for forming an interlayer insulating film is preferably 180 ° C. or lower. In addition to the ability to form fine patterns utilizing radiation sensitivity, the method can be used for the formation of an interlayer insulating film on a plastic substrate of a flexible display by being capable of firing at such a low temperature. Preferably used.

  As described above, the radiation-sensitive resin composition for forming an interlayer insulating film of the present invention has a high radiation sensitivity and can form an interlayer insulating film having a high surface hardness by heating at a low temperature for a short time. It is possible to form an interlayer insulating film excellent in solvent resistance and relative dielectric constant. Therefore, the said radiation sensitive resin composition can be used suitably as a formation material of the interlayer insulation film of a flexible display.

  The radiation-sensitive resin composition for forming an interlayer insulating film according to the present invention comprises at least two [A] component alkali-soluble resins, [B] component 1,2-quinonediazide compound, and [C] component in one molecule. A compound having a mercapto group (crosslinking agent) and other optional components. Hereinafter, each component will be described.

Component [A] Component [A] is a copolymer obtained by copolymerizing a monomer containing (a1) an unsaturated carboxylic acid and / or an unsaturated carboxylic acid anhydride and (a2) an epoxy group-containing unsaturated compound. This is a coalescent alkali-soluble resin (hereinafter, this copolymer is referred to as “copolymer [A]”). Copolymer [A] can be produced by radical polymerization of a monomer containing compound (a1) and compound (a2) in the presence of a polymerization initiator in a solvent. In the production of the copolymer [A], it is preferable to radically polymerize unsaturated compounds other than the above (a1) and (a2) as the compound (a3) together with the compound (a1) and the compound (a2). The copolymer [A] is preferably a structural unit derived from the compound (a1) based on the total of structural units derived from the compounds (a1) and (a2) (and any compound (a3)). 5 to 40% by mass, particularly preferably 5 to 25% by mass. By setting the proportion of the structural unit derived from the compound (a1) in the copolymer [A] to 5 to 40% by mass, the solubility of the copolymer in an alkaline aqueous solution is optimized, and radiation sensitivity and development are also achieved. A radiation-sensitive resin composition having excellent properties can be obtained.

  The compound (a1) is an unsaturated carboxylic acid and / or an unsaturated carboxylic acid anhydride having radical polymerizability. Specific examples of the compound (a1) include monocarboxylic acid, dicarboxylic acid, anhydride of dicarboxylic acid, mono [(meth) acryloyloxyalkyl] ester of polyvalent carboxylic acid, polymer having a carboxyl group and a hydroxyl group at both ends. And mono (meth) acrylates, polycyclic compounds having a carboxyl group, and anhydrides thereof.

Specific examples of these compounds (a1) include
As monocarboxylic acid, acrylic acid, methacrylic acid, crotonic acid, etc .;
As dicarboxylic acid, maleic acid, fumaric acid, citraconic acid, mesaconic acid, itaconic acid and the like;
As anhydrides of dicarboxylic acids, anhydrides of the compounds exemplified as the above dicarboxylic acids, etc .;
As mono [(meth) acryloyloxyalkyl] esters of polyvalent carboxylic acids, succinic acid mono [2- (meth) acryloyloxyethyl], phthalic acid mono [2- (meth) acryloyloxyethyl] and the like;
As a mono (meth) acrylate of a polymer having a carboxyl group and a hydroxyl group at both ends, ω-carboxypolycaprolactone mono (meth) acrylate and the like;
As the polycyclic compound having a carboxyl group and its anhydride, 5-carboxybicyclo [2.2.1] hept-2-ene, 5,6-dicarboxybicyclo [2.2.1] hept-2-ene 5-carboxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-carboxy-5-ethylbicyclo [2.2.1] hept-2-ene, 5-carboxy-6-methyl Bicyclo [2.2.1] hept-2-ene, 5-carboxy-6-ethylbicyclo [2.2.1] hept-2-ene, 5,6-dicarboxybicyclo [2.2.1] hept -2-ene anhydride and the like can be mentioned.

  Among these compounds (a1), monocarboxylic acid and dicarboxylic acid anhydrides are preferably used. In particular, acrylic acid, methacrylic acid, and maleic anhydride are preferably used from the viewpoint of copolymerization reactivity, solubility in an aqueous alkali solution, and availability. These compounds (a1) are used individually or in combination of 2 or more types.

  The copolymer [A] is preferably a structural unit derived from the compound (a2) based on the total of structural units derived from the compounds (a1) and (a2) (and any compound (a3)). Is contained in an amount of 10 to 80% by mass, particularly preferably 30 to 80% by mass. By setting the proportion of the structural unit derived from the compound (a2) in the copolymer [A] to 10 to 80% by mass, an interlayer insulating film having excellent solvent resistance and alkali resistance can be formed. Become.

  The compound (a2) is an epoxy group-containing unsaturated compound having radical polymerizability. Examples of the epoxy group include an oxiranyl group (1,2-epoxy structure) and an oxetanyl group (1,3-epoxy structure).

  Specific examples of the unsaturated compound having an oxiranyl group include glycidyl acrylate, glycidyl methacrylate, glycidyl α-ethyl acrylate, glycidyl α-n-propyl acrylate, glycidyl α-n-butyl acrylate, acrylic acid-3. , 4-epoxybutyl, methacrylic acid-3,4-epoxybutyl, acrylic acid-6,7-epoxyheptyl, methacrylic acid-6,7-epoxyheptyl, α-ethylacrylic acid-6,7-epoxyheptyl, o -Vinyl benzyl glycidyl ether, m-vinyl benzyl glycidyl ether, p-vinyl benzyl glycidyl ether, 3, 4- epoxy cyclohexyl methacrylate, etc. are mentioned. Among these epoxy group-containing unsaturated compounds having an oxiranyl group, glycidyl methacrylate, methacrylic acid-6,7-epoxyheptyl, o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, 3,4-epoxycyclohexyl methacrylate and the like are preferably used from the viewpoint of improving the copolymerization reactivity and the curability of the resin composition.

  Specific examples of the unsaturated compound having an oxetanyl group include 3- (acryloyloxymethyl) oxetane, 3- (acryloyloxymethyl) -2-methyloxetane, 3- (acryloyloxymethyl) -3-ethyloxetane, 3- (Acryloyloxymethyl) -2-trifluoromethyloxetane, 3- (acryloyloxymethyl) -2-pentafluoroethyloxetane, 3- (acryloyloxymethyl) -2-phenyloxetane, 3- (acryloyloxymethyl) -2 , 2-Difluorooxetane, 3- (acryloyloxymethyl) -2,2,4-trifluorooxetane, 3- (acryloyloxymethyl) -2,2,4,4-tetrafluorooxetane, 3- (2-acryloyl) Oxyethyl) oxetane, 3- 2-acryloyloxyethyl) -2-ethyloxetane, 3- (2-acryloyloxyethyl) -3-ethyloxetane, 3- (2-acryloyloxyethyl) -2-trifluoromethyloxetane, 3- (2-acryloyl) Oxyethyl) -2-pentafluoroethyloxetane, 3- (2-acryloyloxyethyl) -2-phenyloxetane, 3- (2-acryloyloxyethyl) -2,2-difluorooxetane, 3- (2-acryloyloxy) Ethyl) -2,2,4-trifluorooxetane, 3- (2-acryloyloxyethyl) -2,2,4,4-tetrafluorooxetane and other acrylic acid esters;

  3- (methacryloyloxymethyl) oxetane, 3- (methacryloyloxymethyl) -2-methyloxetane, 3- (methacryloyloxymethyl) -3-ethyloxetane, 3- (methacryloyloxymethyl) -2-trifluoromethyloxetane, 3- (methacryloyloxymethyl) -2-pentafluoroethyloxetane, 3- (methacryloyloxymethyl) -2-phenyloxetane, 3- (methacryloyloxymethyl) -2,2-difluorooxetane, 3- (methacryloyloxymethyl) -2,2,4-trifluorooxetane, 3- (methacryloyloxymethyl) -2,2,4,4-tetrafluorooxetane, 3- (2-methacryloyloxyethyl) oxetane, 3- (2-methacryloyloxyethyl) 2-ethyloxetane, 3- (2-methacryloyloxyethyl) -3-ethyloxetane, 3- (2-methacryloyloxyethyl) -2-trifluoromethyloxetane, 3- (2-methacryloyloxyethyl) -2- Pentafluoroethyloxetane, 3- (2-methacryloyloxyethyl) -2-phenyloxetane, 3- (2-methacryloyloxyethyl) -2,2-difluorooxetane, 3- (2-methacryloyloxyethyl) -2,2 , 4-trifluorooxetane, and methacrylic acid esters such as 3- (2-methacryloyloxyethyl) -2,2,4,4-tetrafluorooxetane. These compounds (a2) are used alone or in combination of two or more.

  The copolymer [A] used in the present invention is a total of the structural units derived from the compounds (a1) and (a2) and the compound (a3) derived from the compound (a3) which is an optional component. May be contained, preferably 1 to 50% by mass, particularly preferably 5 to 50% by mass. By setting the proportion of this structural unit to 1 to 50% by mass, it is possible to obtain a radiation sensitive resin composition excellent in both developability with respect to an alkaline aqueous solution and solvent resistance of an interlayer insulating film to be formed.

  The compound (a3) is not particularly limited as long as it is an unsaturated compound other than the above-mentioned compounds (a1) and (a2) and has radical polymerizability. Examples of the compound (a3) include methacrylic acid chain alkyl ester, methacrylic acid cyclic alkyl ester, methacrylic acid ester having hydroxyl group, acrylic acid cyclic alkyl ester, methacrylic acid aryl ester, acrylic acid aryl ester, unsaturated dicarboxylic acid diester. , Bicyclounsaturated compound, maleimide compound, unsaturated aromatic compound, conjugated diene, tetrahydrofuran skeleton, furan skeleton, tetrahydropyran skeleton, pyran skeleton, unsaturated compound having a skeleton represented by the following formula (4), Examples thereof include phenolic hydroxyl group-containing unsaturated compounds represented by 5) and other unsaturated compounds.

（式（４）中、Ｒ^４は水素原子又はメチル基であり、ｍは１以上の整数である。）

(In Formula (4), R ⁴ is a hydrogen atom or a methyl group, and m is an integer of 1 or more.)

（式（５）中、Ｒ^５は水素原子又は炭素数１〜４のアルキル基であり、Ｒ^６〜Ｒ^１０は同一もしくは異なり、水素原子、ヒドロキシル基又は炭素数１〜４のアルキル基であり、Ｂは単結合、−ＣＯＯ−、又は−ＣＯＮＨ−であり、ｐは０〜３の整数である、但し、Ｒ^６〜Ｒ^１０の少なくとも１つはヒドロキシル基である。）

(In the formula (5), R ⁵ is a hydrogen atom or an alkyl group having 1 to 4 carbon atoms, and R ^{6 to} R ¹⁰ are the same or different, and are a hydrogen atom, a hydroxyl group, or an alkyl group having 1 to 4 carbon atoms. , B is a single bond, —COO—, or —CONH—, and p is an integer of 0 to 3, provided that at least one of R ^{6 to} R ¹⁰ is a hydroxyl group.

Specific examples of the compound (a3) include
As methacrylic acid chain alkyl ester, methyl methacrylate, ethyl methacrylate, n-butyl methacrylate, sec-butyl methacrylate, t-butyl methacrylate, 2-ethylhexyl methacrylate, isodecyl methacrylate, n-lauryl methacrylate, tridecyl methacrylate, n-stearyl Methacrylate etc .;
As cyclic alkyl esters of methacrylic acid, cyclohexyl methacrylate, 2-methylcyclohexyl methacrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate, tricyclo [5.2.1.0 ^2,6 ] decane. -8-yloxyethyl methacrylate, isobornyl methacrylate, etc .;
As a methacrylic acid ester having a hydroxyl group, hydroxymethyl methacrylate, 2-hydroxyethyl methacrylate, 3-hydroxypropyl methacrylate, 4-hydroxybutyl methacrylate, diethylene glycol monomethacrylate, 2,3-dihydroxypropyl methacrylate, 2-methacryloxyethylglycoside, 4-hydroxyphenyl methacrylate and the like;
As cyclic alkyl ester of acrylic acid, cyclohexyl acrylate, 2-methylcyclohexyl acrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl acrylate, tricyclo [5.2.1.0 ^2,6 ] decane -8-yloxyethyl acrylate, isobornyl acrylate and the like;
Methacrylic acid aryl esters such as phenyl methacrylate and benzyl methacrylate;

As acrylic acid aryl ester, phenyl acrylate, benzyl acrylate, etc .;
As unsaturated dicarboxylic acid diesters, diethyl maleate, diethyl fumarate, diethyl itaconate, etc .;
Bicyclo [2.2.1] hept-2-ene, 5-methylbicyclo [2.2.1] hept-2-ene, 5-ethylbicyclo [2.2.1] hept- as bicyclo unsaturated compounds 2-ene, 5-methoxybicyclo [2.2.1] hept-2-ene, 5-ethoxybicyclo [2.2.1] hept-2-ene, 5,6-dimethoxybicyclo [2.2.1] ] Hept-2-ene, 5,6-diethoxybicyclo [2.2.1] hept-2-ene, 5-t-butoxycarbonylbicyclo [2.2.1] hept-2-ene, 5-cyclohexyl Oxycarbonylbicyclo [2.2.1] hept-2-ene, 5-phenoxycarbonylbicyclo [2.2.1] hept-2-ene, 5,6-di (t-butoxycarbonyl) bicyclo [2.2 .1] Hept-2-ene 5,6-di (cyclohexyloxycarbonyl) bicyclo [2.2.1] hept-2-ene, 5- (2′-hydroxyethyl) bicyclo [2.2.1] hept-2-ene, 5,6 -Dihydroxybicyclo [2.2.1] hept-2-ene, 5,6-di (hydroxymethyl) bicyclo [2.2.1] hept-2-ene, 5,6-di (2'-hydroxyethyl) ) Bicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-methylbicyclo [2.2.1] hept-2-ene, 5-hydroxy-5-ethylbicyclo [2.2.1] ] Hept-2-ene, 5-hydroxymethyl-5-methylbicyclo [2.2.1] hept-2-ene and the like;

As maleimide compounds, N-phenylmaleimide, N-cyclohexylmaleimide, N-benzylmaleimide, N- (4-hydroxyphenyl) maleimide, N- (4-hydroxybenzyl) maleimide, N-succinimidyl-3-maleimidobenzoate, N- Succinimidyl-4-maleimidobutyrate, N-succinimidyl-6-maleimidocaproate, N-succinimidyl-3-maleimidopropionate, N- (9-acridinyl) maleimide and the like;
Examples of unsaturated aromatic compounds include styrene, α-methylstyrene, m-methylstyrene, p-methylstyrene, vinyltoluene, p-methoxystyrene, and the like;
As conjugated dienes, 1,3-butadiene, isoprene, 2,3-dimethyl-1,3-butadiene and the like;
Examples of unsaturated compounds containing a tetrahydrofuran skeleton include tetrahydrofurfuryl (meth) acrylate, 2-methacryloyloxy-propionic acid tetrahydrofurfuryl ester, 3- (meth) acryloyloxytetrahydrofuran-2-one, and the like;
As unsaturated compounds containing a furan skeleton, 2-methyl-5- (3-furyl) -1-penten-3-one, furfuryl (meth) acrylate, 1-furan-2-butyl-3-en-2- ON, 1-furan-2-butyl-3-methoxy-3-en-2-one, 6- (2-furyl) -2-methyl-1-hexen-3-one, 6-furan-2-yl- Hex-1-en-3-one, acrylic acid-2-furan-2-yl-1-methyl-ethyl ester, 6- (2-furyl) -6-methyl-1-hepten-3-one, and the like;

Unsaturated compounds containing a tetrahydropyran skeleton include (tetrahydropyran-2-yl) methyl methacrylate, 2,6-dimethyl-8- (tetrahydropyran-2-yloxy) -oct-1-en-3-one, 2 -Methacrylic acid tetrahydropyran-2-yl ester, 1- (tetrahydropyran-2-oxy) -butyl-3-en-2-one, etc .;
As an unsaturated compound containing a pyran skeleton, 4- (1,4-dioxa-5-oxo-6-heptenyl) -6-methyl-2-pyran, 4- (1,5-dioxa-6-oxo-7) -Octenyl) -6-methyl-2-pyran and the like;
Examples of the unsaturated compound containing a skeleton represented by the above formula (4) include polyethylene glycol (n = 2 to 10) mono (meth) acrylate, polypropylene glycol (n = 2 to 10) mono (meth) acrylate, and the like. It is done.

  Examples of the phenolic hydroxyl group-containing unsaturated compound represented by the above formula (5) include compounds represented by the following formulas (6) to (10) according to the definitions of B and m.

（式（６）中、ｑは１から３の整数であり、Ｒ^５、Ｒ^６、Ｒ^７、Ｒ^８、Ｒ^９及びＲ^１０の定義は上記式（５）における定義と同じである。）

(In formula (6), q is an integer of 1 to 3, and the definitions of R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ and R ¹⁰ are the same as those in formula (5) above.)

（式（７）中、Ｒ^５、Ｒ^６、Ｒ^７、Ｒ^８、Ｒ^９及びＲ^１０の定義は上記式（５）における定義と同じである。）

(In formula (7), the definitions of R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ and R ¹⁰ are the same as those in formula (5) above.)

（式（８）中、ｒは１から３の整数であり、Ｒ^５、Ｒ^６、Ｒ^７、Ｒ^８、Ｒ^９及びＲ^１０の定義は上記式（５）における定義と同じである。）

(In the formula (8), r is an integer of 1 to 3, and the definitions of R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ and R ¹⁰ are the same as those in the above formula (5).)

（式（９）中、Ｒ^５、Ｒ^６、Ｒ^７、Ｒ^８、Ｒ^９及びＲ^１０の定義は上記式（５）における定義と同じである。）

(In formula (9), the definitions of R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ and R ¹⁰ are the same as those in formula (5) above.)

（式（１０）中、Ｒ^５、Ｒ^６、Ｒ^７、Ｒ^８、Ｒ^９及びＲ^１０の定義は上記式（５）における定義と同じである。）

(In formula (10), the definitions of R ⁵ , R ⁶ , R ⁷ , R ⁸ , R ⁹ and R ¹⁰ are the same as those in formula (5) above.)

  Examples of other unsaturated compounds include acrylonitrile, methacrylonitrile, vinyl chloride, vinylidene chloride, acrylamide, methacrylamide, and vinyl acetate.

Among examples of these compounds (a3), methacrylic acid chain alkyl ester, methacrylic acid cyclic alkyl ester, maleimide compound, tetrahydrofuran skeleton, furan skeleton, tetrahydropyran skeleton, pyran skeleton, skeleton represented by the above formula (4) An unsaturated compound having a phenol, a phenolic hydroxyl group-containing unsaturated compound represented by the above formula (5), an unsaturated aromatic compound, and a cyclic alkyl ester of acrylic acid are preferably used. Among these, styrene, t-butyl methacrylate, n-lauryl methacrylate, tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate, p-methoxystyrene, 2-methylcyclohexyl acrylate, N- Phenylmaleimide, N-cyclohexylmaleimide, tetrahydrofurfuryl (meth) acrylate, polyethylene glycol (n = 2 to 10) mono (meth) acrylate, 3- (meth) acryloyloxytetrahydrofuran-2-one, 4-hydroxybenzyl (meth) ) Acrylate, 4-hydroxyphenyl (meth) acrylate, o-hydroxystyrene, p-hydroxystyrene, α-methyl-p-hydroxystyrene are preferable from the viewpoint of copolymerization reactivity and solubility in an aqueous alkali solution. . These compounds (a3) are used individually or in combination of 2 or more types.

Preferable specific examples of each component of the copolymer [A] include methacrylic acid / tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate / 2-methylcyclohexyl acrylate / glycidyl methacrylate / N- (3,5-dimethyl-4-hydroxybenzyl) methacrylamide, methacrylic acid / tetrahydrofurfuryl methacrylate / glycidyl methacrylate / N-cyclohexylmaleimide / n-lauryl methacrylate / α-methyl-p-hydroxystyrene, styrene / Methacrylic acid / Glycidyl methacrylate / (3-Ethyloxetane-3-yl) methacrylate / Tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate, Methacrylic acid / Tricyclo [5.2.1. 0 ^2,6] decane-8-Irumeta Relate / 2-methylcyclohexyl acrylate / glycidyl methacrylate / styrene.

The polystyrene-converted weight average molecular weight (hereinafter referred to as “Mw”) by GPC (gel permeation chromatography) of the copolymer [A] is preferably 2 × 10 ³ to 1 × 10 ⁵ , more preferably 5 × 10. ^{3 to} 5 × 10 ⁴ . Increasing the radiation sensitivity and developability (characteristic for accurately forming a desired pattern shape) of the radiation-sensitive resin composition by setting the Mw of the copolymer [A] to 2 × 10 ³ to 1 × 10 ⁵ Can do.

  Further, the molecular weight distribution “Mw / Mn” of the copolymer [A] (where “Mn” is the polystyrene-equivalent number average molecular weight of the copolymer [A] measured by gel permeation chromatography). Preferably it is 5.0 or less, More preferably, it is 3.0 or less. By making Mw / Mn of the copolymer [A] 5.0 or less, the developability of the obtained interlayer insulating film can be improved. The radiation-sensitive resin composition containing the copolymer [A] can easily form a desired pattern shape without causing development residue during development.

  Examples of the solvent used in the polymerization reaction for producing the copolymer [A] include alcohols, ethers, glycol ethers, ethylene glycol alkyl ether acetates, diethylene glycol alkyl ethers, propylene glycol monoalkyl ethers, and propylene glycol monoalkyls. Examples include ether acetate, propylene glycol monoalkyl ether propionate, aromatic hydrocarbons, ketones, and other esters.

These solvents include
Examples of alcohols include methanol, ethanol, benzyl alcohol, 2-phenylethyl alcohol, and 3-phenyl-1-propanol;
Ethers such as tetrahydrofuran;
Examples of glycol ethers include ethylene glycol monomethyl ether and ethylene glycol monoethyl ether;
Examples of ethylene glycol alkyl ether acetate include methyl cellosolve acetate, ethyl cellosolve acetate, ethylene glycol monobutyl ether acetate, and ethylene glycol monoethyl ether acetate;
Examples of the diethylene glycol alkyl ether include diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether and the like;
Examples of propylene glycol monoalkyl ethers include propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether;

As propylene glycol monoalkyl ether acetate, for example, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate and the like;
As propylene glycol monoalkyl ether propionate, for example, propylene monoglycol methyl ether propionate, propylene glycol monoethyl ether propionate, propylene glycol monopropyl ether propionate, propylene glycol monobutyl ether propionate, etc .;
Examples of aromatic hydrocarbons include toluene and xylene;
Examples of ketones include methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, etc .;

  Examples of other esters include methyl acetate, ethyl acetate, propyl acetate, butyl acetate, ethyl 2-hydroxypropionate, methyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-2-methylpropionate, hydroxyacetic acid Methyl, ethyl hydroxyacetate, butyl hydroxyacetate, methyl lactate, ethyl lactate, propyl lactate, butyl lactate, methyl 3-hydroxypropionate, ethyl 3-hydroxypropionate, propyl 3-hydroxypropionate, butyl 3-hydroxypropionate, Methyl 2-hydroxy-3-methylbutanoate, methyl methoxyacetate, ethyl methoxyacetate, propyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, propyl ethoxyacetate, butyl ethoxyacetate, Methyl poxyacetate, ethyl propoxyacetate, propylpropoxyacetate, butyl propoxyacetate, methyl butoxyacetate, ethyl butoxyacetate, propylbutoxyacetate, butylbutoxyacetate, methyl 2-methoxypropionate, ethyl 2-methoxypropionate, 2-methoxypropionate Propyl acid, butyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, propyl 2-ethoxypropionate, butyl 2-ethoxypropionate, methyl 2-butoxypropionate, 2-butoxypropionic acid Ethyl, propyl 2-butoxypropionate, butyl 2-butoxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, propyl 3-methoxypropionate, 3-metho Butyl cypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, propyl 3-ethoxypropionate, butyl 3-ethoxypropionate, methyl 3-propoxypropionate, ethyl 3-propoxypropionate, 3-propoxy Examples thereof include propyl propionate, butyl 3-propoxypropionate, methyl 3-butoxypropionate, ethyl 3-butoxypropionate, propyl 3-butoxypropionate, and butyl 3-butoxypropionate.

  Among these solvents, ethylene glycol alkyl ether acetate, diethylene glycol alkyl ether, propylene glycol monoalkyl ether, and propylene glycol alkyl ether acetate are preferable, and in particular, diethylene glycol dimethyl ether, diethylene glycol ethyl methyl ether, propylene glycol monomethyl ether, and propylene glycol monomethyl ether acetate. Is preferred.

As the polymerization initiator used in the polymerization reaction for producing the copolymer [A], those generally known as radical polymerization initiators can be used. Examples of the radical polymerization initiator include 2,2′-azobisisobutyronitrile, 2,2′-azobis- (2,4-dimethylvaleronitrile), 2,2′-azobis- (4-methoxy-2). , 4-dimethylvaleronitrile) and other azo compounds;
And organic peroxides such as benzoyl peroxide, lauroyl peroxide, t-butylperoxypivalate, 1,1′-bis- (t-butylperoxy) cyclohexane; and hydrogen peroxide.
When a peroxide is used as the radical polymerization initiator, the peroxide may be used together with a reducing agent to form a redox initiator.

In the polymerization reaction for producing the copolymer [A], a molecular weight modifier can be used to adjust the molecular weight. Specific examples of molecular weight regulators include
Halogenated hydrocarbons such as chloroform and carbon tetrabromide;
mercaptans such as n-hexyl mercaptan, n-octyl mercaptan, n-dodecyl mercaptan, t-dodecyl mercaptan, thioglycolic acid;
Xanthogens such as dimethylxanthogen sulfide and diisopropylxanthogen disulfide;
Examples include terpinolene and α-methylstyrene dimer.

[B] Component [B] component used for the radiation sensitive resin composition of this invention is a 1, 2- quinonediazide compound which generate | occur | produces carboxylic acid by irradiation of a radiation. As the 1,2-quinonediazide compound, a condensate of a phenolic compound or an alcoholic compound (hereinafter referred to as “mother nucleus”) and 1,2-naphthoquinonediazidesulfonic acid halide can be used.

  Examples of the mother nucleus include trihydroxybenzophenone, tetrahydroxybenzophenone, pentahydroxybenzophenone, hexahydroxybenzophenone, (polyhydroxyphenyl) alkane, and other mother nuclei.

As these mother cores,
Examples of trihydroxybenzophenone include 2,3,4-trihydroxybenzophenone and 2,4,6-trihydroxybenzophenone;
Examples of tetrahydroxybenzophenone include 2,2 ′, 4,4′-tetrahydroxybenzophenone, 2,3,4,3′-tetrahydroxybenzophenone, 2,3,4,4′-tetrahydroxybenzophenone, 2,3, 4,2′-tetrahydroxy-4′-methylbenzophenone, 2,3,4,4′-tetrahydroxy-3′-methoxybenzophenone, etc .;
Examples of pentahydroxybenzophenone include 2,3,4,2 ′, 6′-pentahydroxybenzophenone and the like;
Examples of hexahydroxybenzophenone include 2,4,6,3 ′, 4 ′, 5′-hexahydroxybenzophenone, 3,4,5,3 ′, 4 ′, 5′-hexahydroxybenzophenone and the like;

  Examples of (polyhydroxyphenyl) alkanes include bis (2,4-dihydroxyphenyl) methane, bis (p-hydroxyphenyl) methane, tris (p-hydroxyphenyl) methane, 1,1,1-tris (p-hydroxyphenyl). ) Ethane, bis (2,3,4-trihydroxyphenyl) methane, 2,2-bis (2,3,4-trihydroxyphenyl) propane, 1,1,3-tris (2,5-dimethyl-4) -Hydroxyphenyl) -3-phenylpropane, 4,4 '-[1- [4- [1- [4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol, bis (2,5-dimethyl- 4-hydroxyphenyl) -2-hydroxyphenylmethane, 3,3,3 ′, 3′-tetramethyl-1,1′-spirobiin Down -5,6,7,5 ', 6', 7'-hexanol, 2,2,4-trimethyl -7,2 ', 4'-trihydroxy flavan like;

  As other mother nucleus, for example, 2-methyl-2- (2,4-dihydroxyphenyl) -4- (4-hydroxyphenyl) -7-hydroxychroman, 1- [1- (3- {1- (4- Hydroxyphenyl) -1-methylethyl} -4,6-dihydroxyphenyl) -1-methylethyl] -3- (1- (3- {1- (4-hydroxyphenyl) -1-methylethyl} -4, 6-dihydroxyphenyl) -1-methylethyl) benzene and 4,6-bis {1- (4-hydroxyphenyl) -1-methylethyl} -1,3-dihydroxybenzene.

  Among these mother nuclei, 2,3,4,4′-tetrahydroxybenzophenone, 1,1,1-tri (p-hydroxyphenyl) ethane, 4,4 ′-[1- [4- [1- [ 4-hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol is preferred.

  The 1,2-naphthoquinone diazide sulfonic acid halide is preferably 1,2-naphthoquinone diazide sulfonic acid chloride. Specific examples of 1,2-naphthoquinone diazide sulfonic acid chloride include 1,2-naphthoquinone diazide-4-sulfonic acid chloride and 1,2-naphthoquinone diazide-5-sulfonic acid chloride. Among these, it is particularly preferable to use 1,2-naphthoquinonediazide-5-sulfonic acid chloride.

  In the condensation reaction of the phenolic compound or alcoholic compound (mother nucleus) and 1,2-naphthoquinonediazidesulfonic acid halide, preferably 30 to 85 moles relative to the number of OH groups in the phenolic compound or alcoholic compound. %, More preferably 1,2-naphthoquinonediazidesulfonic acid halide corresponding to 50 to 70 mol% can be used. The condensation reaction can be carried out by a known method.

  Examples of the 1,2-quinonediazide compound include 1,2-naphthoquinonediazidesulfonic acid amides in which the ester bond of the mother nucleus exemplified above is changed to an amide bond, for example, 2,3,4-triaminobenzophenone-1,2. -Naphthoquinonediazide-4-sulfonic acid amide etc. are also used suitably.

  These [B] components can be used individually or in combination of 2 or more types. The use ratio of the [B] component in the radiation-sensitive resin composition is preferably 5 to 100 parts by mass, more preferably 10 to 50 parts by mass with respect to 100 parts by mass of the alkali-soluble resin of the [A] component. is there. When the proportion of the component [B] used is 5 to 100 parts by mass, the difference in solubility between the irradiated portion and the unirradiated portion with respect to the alkaline aqueous solution serving as the developer is large, the patterning performance is improved, and the obtained interlayer insulation The solvent resistance of the film is also good.

[C] component [C] component used for the radiation sensitive resin composition of this invention is a compound which has a 2 or more mercapto group in 1 molecule. The compound of the component [C] is not particularly limited as long as it has two or more mercapto groups in one molecule, but is preferably a compound represented by the following formula (1).

（式中、Ｒ^１はメチレン基、炭素数２〜１０のアルキレン基又はアルキルメチレン基であり、Ｙは単結合、−ＣＯ−又は−Ｏ−ＣＯ−^＊（ただし、「＊」を付した結合手がＲ^１と結合する。）であり、ｎは２〜１０の整数であり、Ｘは１個又は複数個のエーテル結合を有していてもよい炭素数２〜７０のｎ価の炭化水素基、又はｎが３の場合下記式（２）で示される基である。）

(In the formula, R ¹ represents a methylene group, an alkylene group having 2 to 10 carbon atoms, or an alkylmethylene group, and Y represents a single bond, —CO— or —O—CO— ^* (wherein “*” represents a bond). The hand is bonded to R ¹ ), n is an integer of 2 to 10, and X is an n-valent hydrocarbon having 2 to 70 carbon atoms which may have one or more ether bonds. Group or a group represented by the following formula (2) when n is 3.)

（式中、３つのＲ^２は、各々独立に、メチレン基又は炭素数２〜６のアルキレン基であり、３つの「＊」は、それぞれ結合手であることを表す。）

(In the formula, three R ^{2 s} are each independently a methylene group or an alkylene group having 2 to 6 carbon atoms, and three “*” represent a bond.)

  As the compound represented by the above formula (1), typically, an esterified product of mercaptocarboxylic acid and a polyhydric alcohol can be used. By using such an esterified product, a radiation-sensitive resin composition having high curability can be obtained. As the mercaptocarboxylic acid constituting the esterified product, for example, thioglycolic acid, 3-mercaptopropionic acid, 3-mercaptobutanoic acid, 3-mercaptopentanoic acid and the like can be used. Examples of the polyhydric alcohol constituting the esterified product include ethylene glycol, propylene glycol, trimethylolpropane, pentaerythritol, tetraethylene glycol, dipentaerythritol, 1,4-butanediol, and pentaerythritol. .

  Preferred specific examples of the compound represented by the above formula (1) include trimethylolpropane tris (3-mercaptopropionate), pentaerythritol tetrakis (3-mercaptopropionate), tetraethylene glycol bis (3-mercapto). Propionate), dipentaerythritol hexakis (3-mercaptopropionate), pentaerythritol tetrakis (thioglycolate), 1,4-bis (3-mercaptobutyryloxy) butane, pentaerythritol tetrakis (3-mercapto) Butyrate), pentaerythritol tetrakis (3-mercaptopentylate), 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) ) -Trion etc. Door can be.

  As the compound having two or more mercapto groups in one molecule of the component [C], a compound represented by the following formula (11) or formula (12) can also be used.

（式（１１）において、Ｒ^１１は、メチレン基又は炭素数２〜２０のアルキレン基であり、Ｒ^１２はメチレン基又は炭素数２〜６の直鎖もしくは分岐アルキレン基であり、ｓは１〜２０の整数を表わす。式（１２）において、Ｒは、同一もしくは異なり、−Ｈ、−ＯＨ又は式（１３）で表わされる基である。式（１３）において、Ｒ^１３はメチレン基又は炭素数２〜６の直鎖もしくは分岐アルキレン基である。但し、式（１２）における４つのＲの少なくとも１つは式（１３）で表わされる基である。）

(In Formula (11), R ¹¹ is a methylene group or an alkylene group having 2 to 20 carbon atoms, R ¹² is a methylene group or a linear or branched alkylene group having 2 to 6 carbon atoms, and s is 1 to 1) And represents an integer of 20. In Formula (12), R is the same or different and is —H, —OH or a group represented by Formula (13) In Formula (13), R ¹³ represents a methylene group or a carbon number. 2 to 6 linear or branched alkylene groups, provided that at least one of the four Rs in formula (12) is a group represented by formula (13).

  The compound having two or more mercapto groups in one molecule of the component [C] can be used alone or in admixture of two or more. The amount of the compound having two or more mercapto groups in one molecule of the component [C] is preferably 0.1 to 60 parts by mass, more preferably 100 parts by mass of the alkali-soluble resin of the component [A]. 1 to 50 parts by mass. By using a radiation sensitive resin composition in which the amount of component [C] used is 0.1 to 60 parts by mass, an interlayer insulating film having sufficient surface hardness can be obtained in a short heating time of 1 hour or less. it can.

Other optional components The radiation-sensitive resin composition of the present invention contains the above-mentioned components [A], [B] and [C] as essential components. A crosslinking aid, [E] a polymerizable compound having at least one ethylenically unsaturated double bond, an epoxy resin other than [F] copolymer [A], [G] surfactant, [H] adhesion An auxiliary agent, [I] thermosensitive acid generator can be contained.

  [D] The crosslinking auxiliary agent of the component is an imidazole ring-containing compound represented by the following formula (3).

（式（３）中、Ｚ^１、Ｚ^２、Ｚ^３及びＲ^３は、各々独立に、水素原子又は置換基を有していてもよい炭素数１〜２０の直鎖状、分岐状又は環状の炭化水素基を示し、Ｚ^２とＺ^３は互いに連結して環を形成してもよい。）

(In formula (3), Z ¹ , Z ² , Z ³ and R ³ are each independently a linear, branched or cyclic group having 1 to 20 carbon atoms which may have a hydrogen atom or a substituent. And Z ² and Z ³ may be linked to each other to form a ring.)

As a specific example of the hydrocarbon group in the formula (3),
Methyl group, ethyl group, n-propyl group, i-propyl group, n-butyl group, i-butyl group, sec-butyl group, t-butyl group, n-pentyl group, n-hexyl group, n-heptyl group N-octyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, n-hexadecyl group, n-heptadecyl group An alkyl group having 1 to 20 carbon atoms such as n-octadecyl group, n-nonadecyl group, n-eicosyl group;
A cycloalkyl group having 3 to 20 carbon atoms such as a cyclopentyl group, a cyclobutyl group, a cyclopentyl group, and a cyclohexyl group;
Aryl groups having 6 to 20 carbon atoms such as phenyl group, toluyl group, benzyl group, methylbenzyl group, xylyl group, mesityl group, naphthyl group, anthryl group;
Examples thereof include a bridged alicyclic hydrocarbon group having 6 to 20 carbon atoms such as a norbornyl group, a tricyclodecanyl group, a tetracyclododecyl group, an adamantyl group, a methyladamantyl group, an ethyladamantyl group, and a butyladamantyl group.

The hydrocarbon group may be substituted. Specific examples of the substituent include
A hydroxyl group;
Carboxyl group;
Hydroxymethyl group, 1-hydroxyethyl group, 2-hydroxyethyl group, 1-hydroxypropyl group, 2-hydroxypropyl group, 3-hydroxypropyl group, 1-hydroxybutyl group, 2-hydroxybutyl group, 3-hydroxybutyl A hydroxyalkyl group having 1 to 4 carbon atoms such as a 4-hydroxybutyl group;
C1-C4 alkoxyl such as methoxyl group, ethoxyl group, n-propoxyl group, i-propoxyl group, n-butoxyl group, 2-methylpropoxyl group, 1-methylpropoxyl group, t-butoxyl group, etc. Group;
A cyano group;
A cyanoalkyl group having 2 to 5 carbon atoms such as a cyanomethyl group, a 2-cyanoethyl group, a 3-cyanopropyl group, a 4-cyanobutyl group;
An alkoxycarbonyl group having 2 to 5 carbon atoms such as a methoxycarbonyl group, an ethoxycarbonyl group, or a t-butoxycarbonyl group;
An alkoxycarbonylalkoxyl group having 3 to 6 carbon atoms such as a methoxycarbonylmethoxyl group, an ethoxycarbonylmethoxyl group, a t-butoxycarbonylmethoxyl group;
Halogen atoms such as fluorine and chlorine;
Examples thereof include fluoroalkyl groups such as a fluoromethyl group, a trifluoromethyl group, and a pentafluoroethyl group.

In the above formula (3), Z ² and Z ³ may be connected to each other to form a cyclic structure, preferably an aromatic ring, or a saturated or unsaturated nitrogen-containing heterocyclic ring having 2 to 20 carbon atoms. . As this nitrogen-containing heterocyclic ring, for example, a benzimidazole ring may be formed as in the following formula (14).

（式（１４）中、Ｗは、互いに独立に、置換基を有していてもよい炭素数１〜２０の直鎖状、分岐状又は環状の炭化水素基を示す。式中の点線は、上記式（３）におけるイミダゾリル環中の、Ｚ^２とＺ^３が結合している炭素原子間の結合、すなわちＺ^２、Ｚ^３および２つのＮに囲まれている炭素−炭素二重結合を示すものである。）

(In the formula (14), W represents a linear, branched or cyclic hydrocarbon group having 1 to 20 carbon atoms which may have a substituent, independently of each other. In the imidazolyl ring in the above formula (3), a bond between carbon atoms to which Z ² and Z ³ are bonded, that is, a carbon-carbon double bond surrounded by Z ² , Z ³ and two N atoms is shown. )

In addition, as a hydrocarbon group of W of Formula (14), the thing similar to the hydrocarbon group in the said Formula (3) can be mentioned. By using a compound in which Z ² and Z ³ are linked to each other to form a benzimidazole ring, a radiation-sensitive resin composition having high curability can be obtained.

  Particularly preferable examples of the compound [D] include 2-phenylbenzimidazole, 2-methylimidazole, and 2-methylbenzimidazole. The imidazole ring-containing compound as the component [D] can be used alone or in admixture of two or more. A typical use amount when using the imidazole ring-containing compound of the [D] component which is an optional component is 0.01 to 10 parts by mass with respect to 100 parts by mass of the alkali-soluble resin of the [A] component. By making the usage-amount of the [D] component in a radiation sensitive resin composition 0.01-10 mass parts, the interlayer insulation film which has still higher surface hardness can be obtained.

  As the polymerizable compound having at least one ethylenically unsaturated double bond as the component [E], for example, monofunctional (meth) acrylate, bifunctional (meth) acrylate, trifunctional or higher (meth) acrylate is preferably used. Can be used.

  Examples of the monofunctional (meth) acrylate include 2-hydroxyethyl (meth) acrylate, carbitol (meth) acrylate, isobornyl (meth) acrylate, 3-methoxybutyl (meth) acrylate, and 2- (meth) acryloyloxyethyl- Examples include 2-hydroxypropyl phthalate. Examples of commercial products of these monofunctional (meth) acrylates include Aronix M-101, M-111, M-114 (above, manufactured by Toagosei Co., Ltd.), KAYARAD TC-110S, TC-120S. (Nippon Kayaku Co., Ltd.), Biscote 158, 2311 (Osaka Organic Chemical Co., Ltd.) and the like.

  Examples of the bifunctional (meth) acrylate include ethylene glycol di (meth) acrylate, 1,6-hexanediol di (meth) acrylate, 1,9-nonanediol di (meth) acrylate, polypropylene glycol di (meth) acrylate, Examples include tetraethylene glycol di (meth) acrylate, bisphenoxyethanol full orange acrylate, and bisphenoxyethanol full orange acrylate. As a commercial item of these bifunctional (meth) acrylates, for example, Aronix M-210, M-240, M-6200 (manufactured by Toagosei Co., Ltd.), KAYARAD HDDA, HX-220, R -604 (manufactured by Nippon Kayaku Co., Ltd.), Viscoat 260, 312, and 335HP (manufactured by Osaka Organic Chemical Industries, Ltd.).

  Examples of the tri- or more functional (meth) acrylate include trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, tri ((meth) acryloyloxyethyl) phosphate, pentaerythritol tetra (meth) acrylate, di Examples include pentaerythritol penta (meth) acrylate and dipentaerythritol hexa (meth) acrylate. Commercially available products of these tri- or higher functional (meth) acrylates include, for example, Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, and M- 8060 (above, manufactured by Toagosei Co., Ltd.), KAYARAD TMPTA, DPHA, DPCA-20, DPCA-30, DPCA-60, DPCA-60, DPCA-120 (above, Nippon Kayaku Co., Ltd.), Biscoat 295, 300, 360, GPT, 3PA, 400 (above, manufactured by Osaka Organic Chemical Industry Co., Ltd.).

  Of these meth (acrylates), trifunctional or higher functional (meth) acrylates are preferably used from the viewpoint of improving the curability of the radiation-sensitive resin composition. Among these, trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, and dipentaerythritol hexa (meth) acrylate are particularly preferable. These monofunctional, bifunctional, or trifunctional or higher (meth) acrylates are used alone or in combination.

  The proportion of the [E] component used in the radiation-sensitive resin composition is preferably 50 parts by mass or less, more preferably 30 parts by mass or less with respect to 100 parts by mass of the copolymer [A]. By containing the component [E] at such a ratio, the curability of the radiation-sensitive resin composition can be improved, and the occurrence of film roughness in the coating film forming step on the substrate can be suppressed. It becomes possible.

  The epoxy resin other than the copolymer [A] as the component [F] is not particularly limited as long as it does not adversely affect the compatibility with each component contained in the radiation-sensitive resin composition. Examples of such epoxy resins are preferably bisphenol A type epoxy resins, phenol novolac type epoxy resins, cresol novolac type epoxy resins, cycloaliphatic epoxy resins, glycidyl ester type epoxy resins, glycidyl amine type epoxy resins, heterocyclic rings. Examples thereof include a resin obtained by (co) polymerizing a formula epoxy resin and glycidyl methacrylate. Of these, bisphenol A type epoxy resins, cresol novolac type epoxy resins, glycidyl ester type epoxy resins and the like are particularly preferable.

  The use ratio of the [F] component in the radiation-sensitive resin composition is preferably 30 parts by mass or less with respect to 100 parts by mass of the copolymer [A]. By using the [F] component at such a ratio, the curability of the radiation sensitive resin composition can be further improved. The copolymer [A] can also be referred to as an “epoxy resin”, but differs from the [F] component in that it has alkali solubility. [F] component is alkali-insoluble.

  In the radiation-sensitive resin composition, a surfactant can be used as the [G] component in order to further improve the coating property at the time of coating film formation. Examples of the surfactant that can be suitably used include a fluorine-based surfactant, a silicone-based surfactant, and a nonionic surfactant.

  Examples of fluorosurfactants include 1,1,2,2-tetrafluorooctyl (1,1,2,2-tetrafluoropropyl) ether, 1,1,2,2-tetrafluorooctyl hexyl ether, Octaethylene glycol di (1,1,2,2-tetrafluorobutyl) ether, hexaethylene glycol (1,1,2,2,3,3-hexafluoropentyl) ether, octapropylene glycol di (1,1,1) 2,2-tetrafluorobutyl) ether, hexapropylene glycol di (1,1,2,2,3,3-hexafluoropentyl) ether and other fluoroethers; sodium perfluorododecylsulfonate; 1,1,2 , 2,8,8,9,9,10,10-decafluorododecane, 1,1,2,2,3,3-hexaph Fluoroalkanes such as orodecane; sodium fluoroalkylbenzenesulfonates; fluoroalkyloxyethylene ethers; fluoroalkylammonium iodides; fluoroalkylpolyoxyethylene ethers; perfluoroalkylpolyoxyethanols; perfluoroalkylalkoxylates And fluorine-based alkyl esters.

  Commercially available products of these fluorosurfactants include BM-1000, BM-1100 (manufactured by BM Chemie), MegaFack F142D, F172, F173, F183, F178, F191, F191, and F471. (Above, Dainippon Ink & Chemicals, Inc.), Florard FC-170C, FC-171, FC-430, FC-431 (above, Sumitomo 3M Limited), Surflon S-112, S-113 S-131, S-141, S-145, S-382, SC-101, SC-102, SC-103, SC-104, SC-105, SC-106 (Manufactured by Asahi Glass Co., Ltd.), Ftop EF301, 303, 352 (manufactured by Shin-Akita Kasei Co., Ltd.) and the like.

  Specific examples of the silicone-based surfactant include commercially available product names such as DC3PA, DC7PA, FS-1265, SF-8428, SH11PA, SH21PA, SH28PA, SH29PA, SH30PA, SH-190, SH-193, SZ. -6032 (above, manufactured by Toray Dow Corning Silicone Co., Ltd.), TSF-4440, TSF-4300, TSF-4445, TSF-4446, TSF-4460, TSF-4442 (above, manufactured by GE Toshiba Silicone Co., Ltd.) And the like.

  Nonionic surfactants include, for example, polyoxyethylene alkyl ethers such as polyoxyethylene lauryl ether, polyoxyethylene stearyl ether, and polyoxyethylene oleyl ether; polyoxyethylene octyl phenyl ether, polyoxyethylene nonyl phenyl ether, and the like. Polyoxyethylene aryl ethers; polyoxyethylene dialkyl esters such as polyoxyethylene dilaurate and polyoxyethylene distearate; (meth) acrylic acid copolymers and the like. As a typical commercially available nonionic surfactant, Polyflow No. 57, 95 (manufactured by Kyoeisha Chemical Co., Ltd.). These surfactants can be used alone or in combination of two or more.

  In the radiation-sensitive resin composition, the surfactant of the [G] component is preferably used in an amount of 5 parts by mass or less, more preferably 2 parts by mass or less with respect to 100 parts by mass of the copolymer [A]. [G] By making the usage-amount of surfactant into 5 mass parts or less, the film run-off at the time of forming a coating film on a board | substrate can be suppressed.

  In the radiation sensitive resin composition of this invention, in order to improve adhesiveness with a board | substrate, the adhesion adjuvant which is [H] component can be used. As such an adhesion assistant, a functional silane coupling agent is preferably used. Examples of functional silane coupling agents include silane coupling agents having reactive substituents such as carboxyl groups, methacryloyl groups, isocyanate groups, and epoxy groups (preferably oxiranyl groups). Specific examples of functional silane coupling agents include trimethoxysilylbenzoic acid, γ-methacryloxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ-glycidoxy Examples thereof include propyltrimethoxysilane and β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane. In the radiation-sensitive resin composition, such an adhesion assistant is preferably 1 part by mass or more and 20 parts by mass or less, more preferably 3 parts by mass or more and 15 parts by mass with respect to 100 parts by mass of the copolymer [A]. Used in the following amounts. By adjusting the amount of the adhesion aid to 1 part by mass or more and 20 parts by mass or less, the adhesion between the formed interlayer insulating film and the substrate is improved.

  The heat-sensitive acid generator of the component [I] is defined as a compound that can release an acidic active substance that acts as a catalyst when curing the component [A] by applying heat. By using such a compound of [I] component, the curing reaction of the [A] component in the heating step after development of the radiation-sensitive composition is further promoted, and an interlayer insulating film excellent in surface hardness and heat resistance is obtained. Can be formed.

  The thermosensitive acid generator of component [I] includes ionic compounds and nonionic compounds. As the ionic compound, those containing no heavy metal or halogen ion are preferable. Examples of ionic thermosensitive acid generators include triphenylsulfonium, 1-dimethylthionaphthalene, 1-dimethylthio-4-hydroxynaphthalene, 1-dimethylthio-4,7-dihydroxynaphthalene, 4-hydroxyphenyldimethylsulfonium, Benzyl-4-hydroxyphenylmethylsulfonium, 2-methylbenzyl-4-hydroxyphenylmethylsulfonium, 2-methylbenzyl-4-acetylphenylmethylsulfonium, 2-methylbenzyl-4-benzoyloxyphenylmethylsulfonium, and these methanesulfones And acid salts, trifluoromethane sulfonate, camphor sulfonate, p-toluene sulfonate, hexafluorophosphonate, and the like. Examples of commercially available benzylsulfonium salts include SI-60, SI-80, SI-100, SI-110, SI-145, SI-150, SI-80L, SI-100L, SI-110L, SI -145L, SI-150L, SI-160L, SI-180L (manufactured by Sanshin Chemical Industry Co., Ltd.) and the like.

  Examples of nonionic thermosensitive acid generators include halogen-containing compounds, diazomethane compounds, sulfone compounds, sulfonic acid ester compounds, carboxylic acid ester compounds, phosphoric acid ester compounds, sulfonimide compounds, sulfone benzotriazole compounds, and the like. Can be mentioned.

  Examples of halogen-containing compounds include haloalkyl group-containing hydrocarbon compounds, haloalkyl group-containing heterocyclic compounds, and the like. Examples of preferred halogen-containing compounds include 1,1-bis (4-chlorophenyl) -2,2,2-trichloroethane, 2-phenyl-4,6-bis (trichloromethyl) -s-triazine, 2-naphthyl- Examples include 4,6-bis (trichloromethyl) -s-triazine.

  Examples of diazomethane compounds include bis (trifluoromethylsulfonyl) diazomethane, bis (cyclohexylsulfonyl) diazomethane, bis (phenylsulfonyl) diazomethane, bis (p-tolylsulfonyl) diazomethane, bis (2,4-xylylsulfonyl) diazomethane Bis (p-chlorophenylsulfonyl) diazomethane, methylsulfonyl-p-toluenesulfonyldiazomethane, cyclohexylsulfonyl (1,1-dimethylethylsulfonyl) diazomethane, bis (1,1-dimethylethylsulfonyl) diazomethane, phenylsulfonyl (benzoyl) diazomethane Etc.

  Examples of the sulfone compound include β-ketosulfone compounds, β-sulfonylsulfone compounds, diaryldisulfone compounds, and the like. Examples of preferable sulfone compounds include 4-trisphenacyl sulfone, mesitylphenacyl sulfone, bis (phenylsulfonyl) methane, 4-chlorophenyl-4-methylphenyl disulfone compound, and the like.

  Examples of the sulfonate compound include alkyl sulfonate, haloalkyl sulfonate, aryl sulfonate, imino sulfonate, and the like. Examples of preferred sulfonic acid ester compounds include benzoin tosylate, pyrogallol trimesylate, nitrobenzyl-9,10-diethoxyanthracene-2-sulfonate, 2,6-dinitrobenzylbenzenesulfonate, and the like. Examples of commercially available products of iminosulfonate include PAI-101 (manufactured by Midori Chemical Co., Ltd.), PAI-106 (manufactured by Midori Chemical Co., Ltd.), and CGI-1311 (manufactured by Ciba Specialty Chemicals Co., Ltd.).

  Examples of the carboxylic acid ester compound include carboxylic acid o-nitrobenzyl ester.

  Examples of the sulfonimide compound include N- (trifluoromethylsulfonyloxy) succinimide (trade name “SI-105” (manufactured by Midori Chemical Co., Ltd.)), N- (camphorsulfonyloxy) succinimide (trade name “SI-”). 106 "(manufactured by Midori Chemical Co., Ltd.)), N- (4-methylphenylsulfonyloxy) succinimide (trade name" SI-101 "(manufactured by Midori Chemical Co., Ltd.)), N- (2-trifluoromethylphenyl) Sulfonyloxy) succinimide, N- (4-fluorophenylsulfonyloxy) succinimide, N- (trifluoromethylsulfonyloxy) phthalimide, N- (camphorsulfonyloxy) phthalimide, N- (2-trifluoromethylphenylsulfonyloxy) phthalimide N- (2-fluoropheny Sulfonyloxy) phthalimide, N- (trifluoromethylsulfonyloxy) diphenylmaleimide (trade name “PI-105” (manufactured by Midori Chemical Co., Ltd.)), N- (camphorsulfonyloxy) diphenylmaleimide, 4-methylphenylsulfonyloxy ) Diphenylmaleimide, N- (2-trifluoromethylphenylsulfonyloxy) diphenylmaleimide, N- (4-fluorophenylsulfonyloxy) diphenylmaleimide, N- (4-fluorophenylsulfonyloxy) diphenylmaleimide, N- (phenylsulfonyl) Oxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide (trade name “NDI-100” (manufactured by Midori Chemical Co., Ltd.)), N- (4-methylphenylsulfonyloxy) ) Bishik [2.2.1] Hept-5-ene-2,3-dicarboxylimide (trade name “NDI-101” (manufactured by Midori Chemical Co., Ltd.)), N- (trifluoromethanesulfonyloxy) bicyclo [2. 2.1] Hept-5-ene-2,3-dicarboxylimide (trade name “NDI-105” (manufactured by Midori Chemical Co., Ltd.)), N- (nonafluorobutanesulfonyloxy) bicyclo [2.2. 1] Hept-5-ene-2,3-dicarboxylimide (trade name “NDI-109” (manufactured by Midori Chemical Co., Ltd.)), N- (camphorsulfonyloxy) bicyclo [2.2.1] hept- 5-ene-2,3-dicarboxylimide (trade name “NDI-106” (manufactured by Midori Chemical Co., Ltd.)), N- (camphorsulfonyloxy) -7-oxabicyclo [2.2.1] hept- 5- Ene-2,3-dicarboxylimide, N- (trifluoromethylsulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (4- Methylphenylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (4-methylphenylsulfonyloxy) -7-oxabicyclo [2.2.1] hept -5-ene-2,3-dicarboxylimide, N- (2-trifluoromethylphenylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- ( 2-trifluoromethylphenylsulfonyloxy) -7-oxabicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (4- (Luorophenylsulfonyloxy) bicyclo [2.2.1] hept-5-ene-2,3-dicarboxylimide, N- (4-fluorophenylsulfonyloxy) -7-oxabicyclo [2.2.1] Hept-5-ene-2,3-dicarboxylimide, N- (trifluoromethylsulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboxylimide, N- ( Camphorsulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboxylimide, N- (4-methylphenylsulfonyloxy) bicyclo [2.2.1] heptane-5 6-oxy-2,3-dicarboxylimide, N- (2-trifluoromethylphenylsulfonyloxy) bicyclo [2.2.1] heptane- , 6-oxy-2,3-dicarboxylic imide, N-(4-fluorophenyl sulfonyloxy) bicyclo [2.2.1] heptane-5,6-oxy-2,3-dicarboxylic imide,

  N- (trifluoromethylsulfonyloxy) naphthyl dicarboxylimide (trade name “NAI-105” (manufactured by Midori Chemical Co., Ltd.)), N- (camphorsulfonyloxy) naphthyl dicarboxylimide (trade name “NAI-106”) (Manufactured by Midori Chemical Co., Ltd.)), N- (4-methylphenylsulfonyloxy) naphthyl dicarboxylimide (trade name “NAI-101” (manufactured by Midori Chemical Co., Ltd.)), N- (phenylsulfonyloxy) naphthyl Dicarboxylimide (trade name “NAI-100” (manufactured by Midori Chemical Co., Ltd.)), N- (2-trifluoromethylphenylsulfonyloxy) naphthyl dicarboxylimide, N- (4-fluorophenylsulfonyloxy) naphthyldi Carboxylimide, N- (pentafluoroethylsulfonyloxy ) Naphthyl dicarboxylimide, N- (heptafluoropropylsulfonyloxy) naphthyl dicarboxylimide, N- (nonafluorobutylsulfonyloxy) naphthyl dicarboxylimide (trade name “NAI-109” (manufactured by Midori Chemical Co., Ltd.)) N- (ethylsulfonyloxy) naphthyl dicarboximide, N- (propylsulfonyloxy) naphthyl dicarboximide, N- (butylsulfonyloxy) naphthyl dicarboximide (trade name “NAI-1004” (Midori Chemical Co., Ltd.) Manufactured)), N- (pentylsulfonyloxy) naphthyl dicarboxylimide, N- (hexylsulfonyloxy) naphthyl dicarboxylimide, N- (heptylsulfonyloxy) naphthyl dicarboxylimide, N- (octyl) Ruhoniruokishi) naphthyl dicarboxyl imides, such as N- (nonyl sulfonyloxy) naphthyl dicarboxylic imide.

  Other examples of heat sensitive acid generators include 1- (4-n-butoxynaphthalen-1-yl) tetrahydrothiophenium trifluoromethanesulfonate, 1- (4,7-dibutoxy-1-naphthalenyl) tetrahydrothiophene. And tetrahydrothiophenium salts such as nitrotrifluoromethanesulfonate.

  Among the heat-sensitive acid generators mentioned so far, benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate, 1- (4,7-dibutoxy-1-naphthalenyl) is used from the viewpoint of the catalytic action of the curing reaction of the component [A]. ) Tetrahydrothiophenium trifluoromethanesulfonate, N- (trifluoromethylsulfonyloxy) naphthyl dicarboxylimide is particularly preferred.

  As the thermosensitive acid generator of component [I], one kind may be used alone, or two or more kinds may be mixed and used. The amount when the component [I] is used is preferably 0.1 parts by mass to 10 parts by mass, more preferably 1 part by mass to 5 parts by mass with respect to 100 parts by mass of the component [A]. An interlayer insulating film having a high surface hardness while optimizing the radiation sensitivity of the positive radiation-sensitive composition and maintaining transparency by adjusting the amount of the component [I] to be 0.1 to 10 parts by mass Can be formed.

Radiation-sensitive resin composition The radiation-sensitive resin composition of the present invention uniformly mixes the above-mentioned [A], [B] and [C] components and optional components ([D] to [I] components). It is prepared by. Usually, the radiation-sensitive resin composition is preferably used after being dissolved in an appropriate solvent and stored in a solution state. For example, the radiation-sensitive resin composition in a solution state can be prepared by mixing the [A], [B] and [C] components and the optional components in a solvent in a predetermined ratio.

  As the solvent used for the preparation of the radiation sensitive resin composition, the above [A], [B] and [C] components, and optional components ([D] to [I] components) are uniformly dissolved. And as long as it does not react with each component, it is not particularly limited. As such a solvent, the thing similar to the solvent illustrated as a solvent which can be used in order to manufacture copolymer [A] can be mentioned.

  Among such solvents, alcohols, glycol ethers, ethylene glycol alkyl ether acetates, esters, and diethylene glycol alkyl ethers from the standpoints of solubility of each component, non-reactivity with each component, ease of film formation, etc. Is preferably used. Among these solvents, benzyl alcohol, 2-phenylethyl alcohol, 3-phenyl-1-propanol, ethylene glycol monobutyl ether acetate, diethylene glycol monoethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dimethyl ether, propylene glycol monomethyl ether , Propylene glycol monomethyl ether acetate, methyl 2- or 3-methoxypropionate, or ethyl 2- or 3-ethoxypropionate can be particularly preferably used.

  Furthermore, in order to improve the in-plane uniformity of the film thickness of the coating film to be formed, a high boiling point solvent can be used in combination with the solvent. Examples of the high boiling point solvent that can be used in combination include N-methylformamide, N, N-dimethylformamide, N-methylformanilide, N-methylacetamide, N, N-dimethylacetamide, N-methylpyrrolidone, dimethylsulfoxide, and benzylethyl ether. , Dihexyl ether, acetonyl acetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, phenyl Examples include cellosolve acetate. Of these high boiling solvents, N-methylpyrrolidone, γ-butyrolactone, and N, N-dimethylacetamide are preferred.

  When a high boiling point solvent is used in combination as a solvent for the radiation-sensitive resin composition, the amount used is 50% by mass or less, preferably 40% by mass or less, more preferably 30% by mass or less, based on the total amount of the solvent. Can do. By setting the use ratio of the high boiling point solvent to 50% by mass or less, it is possible to improve the film thickness uniformity of the coating film and at the same time suppress the decrease in radiation sensitivity.

  When preparing the radiation-sensitive resin composition in a solution state, components other than the solvent in the solution (that is, the total amount of the copolymers [A], [B] and [C], and other optional components) The ratio of can be arbitrarily set according to the purpose of use and the desired film thickness, but is preferably 5 to 50% by mass, more preferably 10 to 40% by mass, and still more preferably 15 to 35% by mass. is there. The solution of the radiation sensitive resin composition thus prepared can be used after being filtered using a Millipore filter having a pore size of about 0.2 μm.

Formation of Interlayer Insulating Film Next, a method for forming the interlayer insulating film of the present invention using the above radiation sensitive resin composition will be described. The method includes the following steps in the order described below.
(1) The process of forming the coating film of the radiation sensitive resin composition of this invention on a board | substrate,
(2) A step of irradiating at least a part of the coating film formed in step (1),
(3) A step of developing the coating film irradiated with radiation in step (2), and (4) a step of baking the coating film developed in step (3) by heating.

(1) Step of forming a coating film of a radiation sensitive resin composition on a substrate In the step (1), a solution of the radiation sensitive resin composition of the present invention is applied to the substrate surface, preferably prebaked. By removing the solvent, a coating film of the radiation sensitive resin composition is formed. Examples of the substrate that can be used include a glass substrate, a silicon wafer, a plastic substrate, and a substrate on which various metals are formed. Examples of the plastic substrate include resin substrates made of plastics such as polyethylene terephthalate (PET), polybutylene terephthalate, polyethersulfone, polycarbonate, and polyimide.

  The method for applying the composition solution is not particularly limited. For example, an appropriate method such as a spray method, a roll coating method, a spin coating method (spin coating method), a slit die coating method, a bar coating method, or an ink jet method is adopted. can do. Among these coating methods, spin coating, bar coating, and slit die coating are preferable. The pre-baking conditions vary depending on the type of each component, the use ratio, and the like, but can be, for example, 60 to 90 ° C. for 30 seconds to 10 minutes. The film thickness of the coating film to be formed is preferably 0.1 to 8 μm, more preferably 0.1 to 6 μm, and further preferably 0.1 to 4 μm as a value after pre-baking.

(2) Step of irradiating at least a part of the coating film In the step (2), the formed coating film is irradiated with radiation through a mask having a predetermined pattern. Examples of the radiation used at this time include ultraviolet rays, far ultraviolet rays, X-rays, and charged particle beams.

Examples of the ultraviolet rays include g-line (wavelength 436 nm), i-line (wavelength 365 nm), and the like. Examples of the far ultraviolet light include a KrF excimer laser. Examples of X-rays include synchrotron radiation. Examples of the charged particle beam include an electron beam. Among these radiations, ultraviolet rays are preferable, and among the ultraviolet rays, radiation containing g-line and / or i-line is particularly preferable. The exposure amount is preferably 30 to 1,500 J / m ² .

(3) Development step (3) In the development step, the coating film irradiated with radiation in the step (2) is developed to remove the irradiated portion and form a desired pattern. it can. Examples of the developer used for the development processing include sodium hydroxide, potassium hydroxide, sodium carbonate, sodium silicate, sodium metasilicate, ammonia, ethylamine, n-propylamine, diethylamine, diethylaminoethanol, di-n-propylamine. , Triethylamine, methyldiethylamine, dimethylethanolamine, triethanolamine, tetramethylammonium hydroxide, tetraethylammonium hydroxide, pyrrole, piperidine, 1,8-diazabicyclo [5,4,0] -7-undecene, 1,5- An aqueous solution of an alkali (basic compound) such as diazabicyclo [4,3,0] -5-nonane can be used. In addition, an aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent or surfactant such as methanol or ethanol to the aqueous alkali solution described above, or an alkaline aqueous solution containing a small amount of various organic solvents for dissolving the radiation-sensitive resin composition, Can be used as Furthermore, as a developing method, for example, an appropriate method such as a liquid filling method, a dipping method, a rocking dipping method, a shower method, or the like can be used. Although development time changes with compositions of a radiation sensitive resin composition, it can be made into 30 to 120 second, for example.
After this development step, the patterned thin film is rinsed by running water washing, and subsequently irradiated with a high-pressure mercury lamp or the like on the entire surface (post-exposure), thereby remaining in the thin film 1,2- It is preferable to perform a decomposition treatment of the quinonediazide compound.

(4) Heating step Next, in the (4) heating step, the thin film is cured by heating and baking (post-baking) the thin film using a heating device such as a hot plate or an oven. The exposure amount in the post-exposure is preferably about 2,000 to 5,000 J / m ² . Moreover, the firing temperature in this heating step is preferably 120 to 180 ° C, particularly preferably 120 to 150 ° C. The heating time varies depending on the type of heating equipment, but for example, it can be 5 to 40 minutes when heat treatment is performed on a hot plate, and 30 to 80 minutes when heat treatment is performed in an oven, Particularly preferably, it is within 30 minutes when heat treatment is performed on a hot plate, and within 60 minutes when heat treatment is performed in an oven. In this way, a patterned thin film corresponding to the target interlayer insulating film can be formed on the surface of the substrate.

  As described above, the interlayer insulating film of the present invention formed by heating at a low temperature for a short time has sufficient surface hardness as well as solvent resistance and relative dielectric constant, as will be apparent from examples described later. The rate is excellent. Therefore, this interlayer insulating film is suitably used as an interlayer insulating film for flexible displays.

  EXAMPLES Hereinafter, although a synthesis example and an Example demonstrate this invention further in detail, this invention is not limited to these Examples.

Hereinafter, the weight average molecular weight (Mw) and the number average molecular weight (Mn) of the copolymer were measured by gel permeation chromatography (GPC) under the following conditions.
Measuring device: “HLC8220 system” (manufactured by Tosoh Corporation)
Separation column: TSKgelGMH _HR- N (manufactured by Tosoh Corporation) connected in series Column temperature: 40 ° C
Elution solvent: Tetrahydrofuran (Wako Pure Chemical Industries, Ltd.)
Flow rate: 1.0 mL / min Sample concentration: 1.0% by mass
Sample injection amount: 100 μm
Detector: Differential refractometer Standard material: Monodispersed polystyrene The solution viscosity of the radiation-sensitive resin composition was measured at 30 ° C. using an E-type viscometer (manufactured by Tokyo Keiki Co., Ltd.).

Example of copolymer synthesis [Synthesis Example 1]
A flask equipped with a condenser and a stirrer was charged with 7 parts by mass of 2,2′-azobis (2,4-dimethylvaleronitrile) and 200 parts by mass of diethylene glycol ethyl methyl ether. Subsequently, 16 parts by weight of methacrylic acid, 16 parts by weight of tricyclo [5.2.1.0 ^2,6 ] decan-8-yl methacrylate, 20 parts by weight of 2-methylcyclohexyl acrylate, 40 parts by weight of glycidyl methacrylate, 10 parts by weight of styrene Was added, and after the atmosphere was replaced with nitrogen, stirring was started gently. The temperature of the solution was raised to 70 ° C., and this temperature was maintained for 4 hours to obtain a polymer solution containing the copolymer [A-1]. This copolymer [A-1] had a polystyrene-reduced weight average molecular weight (Mw) of 8,000 and a molecular weight distribution (Mw / Mn) of 2.3. Further, the solid content concentration of the polymer solution obtained here (the ratio of the mass of the copolymer contained in the polymer solution to the total weight of the polymer solution; the same applies hereinafter) is 34.4% by mass. Met.

[Synthesis Example 2]
A flask equipped with a condenser and a stirrer was charged with 8 parts by mass of 2,2′-azobis (2,4-dimethylvaleronitrile) and 220 parts by mass of diethylene glycol ethyl methyl ether. Subsequently, 11 parts by weight of methacrylic acid, 12 parts by weight of tetrahydrofurfuryl methacrylate, 40 parts by weight of glycidyl methacrylate, 15 parts by weight of N-cyclohexylmaleimide, 10 parts by weight of n-lauryl methacrylate, 10 parts by weight of α-methyl-p-hydroxystyrene After charging and replacing with nitrogen, stirring was started gently. The temperature of the solution was raised to 70 ° C., and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer [A-2]. The copolymer [A-2] had a polystyrene equivalent weight average molecular weight (Mw) of 8,000 and a molecular weight distribution (Mw / Mn) of 2.3. Moreover, the solid content concentration of the polymer solution obtained here was 31.9 mass%.

[Comparative Synthesis Example 1]
A flask equipped with a condenser and a stirrer was charged with 18 parts by mass of 2,2-bis (3-amino-4-methylphenyl) hexafluoropropane under a nitrogen stream and dissolved in 75 parts by mass of N-methyl-2-pyrrolidone. Then, 9.5 parts by mass of 1,2,3,4-cyclobutanetetracarboxylic anhydride was added, and this was stirred at room temperature for 8 hours to carry out a polymerization reaction. The obtained polyamic acid solution was diluted to 10% by mass with N-methyl-2-pyrrolidone. To this solution, 26 parts by mass of acetic anhydride and 16 parts by mass of pyridine were added as an imidization catalyst, reacted at room temperature for 30 minutes, and then reacted at 40 ° C. for 90 minutes to obtain a polyimide solution. This solution was poured into a mixed solution of a large amount of methanol and water, and the resulting white precipitate was filtered and dried to obtain a white polyimide [P-1] powder. This polyimide powder was dissolved in propylene glycol monomethyl ether to obtain a solution containing polyimide [P-1].

<Preparation of resin composition>
[Example 1]
A solution containing the copolymer [A-1] of Synthesis Example 1 as the [A] component was added in an amount corresponding to 100 parts by mass (solid content) of the copolymer, and 4,4 ′-[ 1- [4- [1- [4-Hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol (1.0 mol) and 1,2-naphthoquinonediazide-5-sulfonic acid chloride (2.0 mol) And 30 parts by mass of pentaerythritol tetrakis (3-mercaptopropionate) (C-1) as a [C] component (crosslinking agent) and a solid content. After adding diethylene glycol ethyl methyl ether as a solvent so that the concentration becomes 30% by mass, the radiation sensitive resin composition (S-1) is prepared by filtering through a membrane filter having a diameter of 0.2 μm. It was.

[Example 2]
A solution containing the copolymer [A-1] of Synthesis Example 1 as the [A] component was added in an amount corresponding to 100 parts by mass (solid content) of the copolymer, and 4,4 ′-[ 1- [4- [1- [4-Hydroxyphenyl] -1-methylethyl] phenyl] ethylidene] bisphenol (1.0 mol) and 1,2-naphthoquinonediazide-5-sulfonic acid chloride (2.0 mol) 30 parts by mass of the condensate (B-1) and 30 parts by mass of pentaerythritol tetrakis (3-mercaptopropionate) (C-1) as the [C] component (crosslinking agent) and the [D] component (crosslinking) After adding 0.5 parts by mass of 2-phenylbenzimidazole (D-1) as an auxiliary agent, and further adding diethylene glycol ethyl methyl ether as a solvent so that the solid content concentration becomes 30% by mass, A radiation sensitive resin composition (S-2) was prepared by filtering with a membrane filter having a diameter of 0.2 μm.

[Example 3]
Except that the copolymer [A-2] was used instead of the copolymer [A-1], each component was blended in the same manner as in Example 2 to prepare a radiation-sensitive resin composition (S-3). did.

[Example 4]
[C] Each component was blended in the same manner as in Example 2 except that trimethylolpropane tris (3-mercaptopropionate) (C-2) was used instead of compound (C-1) as component [C]. A radiation sensitive resin composition (S-4) was prepared.

[Example 5]
[C] Each component was blended in the same manner as in Example 2 except that dipentaerythritol hexakis (3-mercaptopropionate) (C-3) was used instead of compound (C-1) as component [C]. Then, a radiation sensitive resin composition (S-5) was prepared.

[Example 6]
[D] Each component was blended in the same manner as in Example 2 except that 2-methylimidazole (D-2) was used in place of the compound (D-1) as the component (D-1), and the radiation-sensitive resin composition ( S-6) was prepared.

[Example 7]
[D] Each component was blended in the same manner as in Example 2 except that 2-methylbenzimidazole (D-3) was used in place of the compound (D-1) as a component, and a radiation-sensitive resin composition. (S-7) was prepared.

[Example 8]
[C] Instead of compound (C-1) as component, 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H ) -Trione (C-4) was used except that each component was blended in the same manner as in Example 2 to prepare a radiation sensitive resin composition (S-8).

[Example 9]
[C] Each component was blended in the same manner as in Example 2 except that pentaerythritol tetrakis (3-mercaptobutyrate) (C-5) was used instead of compound (C-1) as the component (C-1). A radiation resin composition (S-9) was prepared.

[Example 10]
[C] Each component was blended in the same manner as in Example 2 except that pentaerythritol tetrakis (3-mercaptopentylate) (C-6) was used instead of compound (C-1) as the component (C-1). A radiation resin composition (S-10) was prepared.

[Example 11]
[C] Each component was blended in the same manner as in Example 2 except that tetraethylene glycol bis (3-mercaptopropionate) (C-7) was used instead of compound (C-1) as the component [C]. A radiation sensitive resin composition (S-11) was prepared.

[Example 12]
[C] Each component was blended in the same manner as in Example 2 except that pentaerythritol tetrakis (thioglycolate) (C-8) was used in place of the compound (C-1) as the component (C-1). A resin composition (S-12) was prepared.

[Example 13]
[C] Each component was prepared in the same manner as in Example 2 except that 1,4-bis (3-mercaptobutyryloxy) butane (C-9) was used in place of the compound (C-1). The radiation sensitive resin composition (S-13) was prepared by blending.

[Example 14]
Each component was blended in the same manner as in Example 9 except that benzyl-4-hydroxyphenylmethylsulfonium hexafluorophosphate (I-1) was used as the component [I], and the radiation-sensitive resin composition (S- 14) was prepared.

[Example 15]
Each component was blended in the same manner as in Example 9 except that 1- (4,7-dibutoxy-1-naphthalenyl) tetrahydrothiophenium trifluoromethanesulfonate (I-2) was used as the component [I]. A radiation sensitive resin composition (S-15) was prepared.

[Example 16]
[I] Each component was blended in the same manner as in Example 9 except that N- (trifluoromethylsulfonyloxy) naphthyl dicarboxylimide (I-3) was used as the component, and the radiation-sensitive resin composition ( S-16) was prepared.

[Comparative Example 1]
Each component was mix | blended like Example 1 except not using the [C] component, and the radiation sensitive resin composition (s-1) was prepared.

[Comparative Examples 2 and 3]
As a composition (s-2) of these comparative examples, a solution containing the polyimide [P-1] obtained in Comparative Synthesis Example 1 was prepared.

[Reference Example 1]
For this reference example, the same radiation sensitive resin composition (S-2) as in Example 2 was prepared.

In Table 1, the abbreviations of the components indicate the following compounds.
C-1: Pentaerythritol tetrakis (3-mercaptopropionate)
C-2: Trimethylolpropane tris (3-mercaptopropionate)
C-3: Dipentaerythritol hexakis (3-mercaptopropionate)
C-4: 1,3,5-tris (3-mercaptobutyloxyethyl) -1,3,5-triazine-2,4,6 (1H, 3H, 5H) -trione C-5: pentaerythritol tetrakis ( 3-mercaptobutyrate)
C-6: Pentaerythritol tetrakis (3-mercaptopentylate)
C-7: Tetraethylene glycol bis (3-mercaptopropionate)
C-8: Pentaerythritol tetrakis (thioglycolate)
C-9: 1,4-bis (3-mercaptobutyryloxy) butane D-1: 2-phenylbenzimidazole D-2: 2-methylimidazole D-3: 2-methylbenzimidazole I-1: benzyl- 4-hydroxyphenylmethylsulfonium hexafluorophosphate I-2: 1- (4,7-dibutoxy-1-naphthalenyl) tetrahydrothiophenium trifluoromethanesulfonate I-3: N- (trifluoromethylsulfonyloxy) naphthyl dicarboxyl Imido (“NAI-105” manufactured by Midori Chemical Co., Ltd.)

<Characteristic evaluation as interlayer insulation film>
Using the resin composition prepared as described above, various characteristics as an interlayer insulating film were evaluated as follows.

[Evaluation of radiation sensitivity]
Except for Example 16, after applying any of the above compositions (S-1) to (S-15) and (s-1) to (s-2) on a silicon substrate using a spinner, 90 A film having a thickness of 3.0 μm was formed by prebaking on a hot plate at 2 ° C. for 2 minutes. The obtained coating film was irradiated with a predetermined amount of ultraviolet rays by a mercury lamp through a pattern mask having a line and space pattern having a width of 10 μm. Next, using a developer composed of a 2.38% by mass aqueous solution of tetramethylammonium hydroxide, development processing was carried out at 25 ° C. for 60 seconds, followed by washing with ultrapure water for 1 minute. At this time, the minimum ultraviolet irradiation amount capable of forming a line and space pattern having a width of 10 μm was measured. When this value is less than 800 J / m ² , it can be said that the sensitivity is good. This value is shown in Table 1 as radiation sensitivity.

  In Example 16, a PET film (Teijin Tetron film O3, thickness 188 μm) was used instead of the silicon substrate, and a coating film was formed by a bar coater using the composition (S-16). Pre-baking was performed in a clean oven at 90 ° C. for 2 minutes to form a coating film having a thickness of 3.0 μm. Subsequent evaluation was performed in the same manner as in Examples 1 to 15 except for evaluation of voltage holding ratio.

[Evaluation of solvent resistance]
After applying any of the above compositions (S-1) to (S-16) and (s-1) to (s-2) on a silicon substrate using a spinner, hot at 90 ° C. for 2 minutes Pre-baked on the plate to form a coating film having a thickness of 3.0 μm. The obtained coating film was irradiated with ultraviolet rays with a mercury lamp so that the cumulative irradiation amount was 3,000 J / m ² . The silicon substrate was then heated on a hot plate for Examples 1-16 and Comparative Examples 1-2 at 150 ° C. for 30 minutes, for Comparative Example 3 at 150 ° C. for 60 minutes, and About the reference example 1, the coating film was heat-processed by heating at 220 degreeC for 30 minutes, and the film thickness (T1) of the obtained cured film was measured. And after immersing the silicon substrate in which this cured film was formed in dimethyl sulfoxide temperature-controlled at 70 degreeC for 20 minutes, the film thickness (t1) of the said cured film was measured, and the film thickness change rate by immersion {(T1-T1) / T1} × 100 [%] was calculated. It can be said that the solvent resistance is excellent when the absolute value of this value is less than 5%. The results are shown in Table 1.

[Evaluation of relative permittivity]
After applying any of the above compositions (S-1) to (S-16) and (s-1) to (s-2) on a silicon substrate using a spinner, hot at 90 ° C. for 2 minutes Pre-baked on the plate to form a coating film having a thickness of 3.0 μm. Using an MPA-600FA exposure machine manufactured by Canon Inc., the coating film obtained was exposed so that the cumulative irradiation amount was 9,000 J / m ^2, and this substrate was placed in a clean oven at 150 ° C. for 30 minutes. A cured film was formed on the SUS substrate by heating. A dielectric constant measurement sample was prepared by forming a Pt / Pd electrode pattern on the cured film by vapor deposition. With respect to the substrate having this electrode pattern, the relative dielectric constant was measured by the CV method at a frequency of 10 kHz using an HP16451B electrode and HP4284A Precision LCR meter manufactured by Yokogawa-Hewlett-Packard Co., Ltd. When this value is 3.9 or less, it can be said that the dielectric constant is good. The measurement results are shown in Table 1.

[Evaluation of pencil hardness (surface hardness)]
About the board | substrate which has the cured film formed in said [solvent resistance evaluation], the pencil hardness (surface hardness) of the cured film was measured by the 8.4.1 pencil scratch test of JISK-5400-1990. When this value is 3H or larger, it can be said that the surface hardness as the interlayer insulating film is good, and the resin composition used for forming the cured film has sufficient curability.

  From the results shown in Table 1, the radiation-sensitive resin compositions prepared in Examples 1 to 16 have a high radiation sensitivity, and obtain a cured film having a high surface hardness by low-temperature and short-time heating. It was found that the cured film had excellent solvent resistance and relative dielectric constant. On the other hand, in Comparative Example 1 in which the [C] component was not used, sufficient curability was not exhibited by heating at a low temperature for a short time, and the solvent resistance and relative dielectric constant of the cured film were inferior. In Comparative Examples 2 and 3 using a polyimide solution, pattern formation by exposure and development was not possible, and sufficient curability was not exhibited by heating at a low temperature for a short time, and the solvent resistance of the cured film was poor. . In addition, the evaluation result of various characteristics in Example 2 was equivalent to the evaluation result obtained in Reference Example 1 in which the heating temperature and time were increased using the same radiation-sensitive resin composition as in Example 2. That is, it was found that by using the radiation sensitive resin composition of the present invention, an interlayer insulating film satisfying various properties such as required surface hardness can be formed at a lower temperature and in a shorter time than before.

  The radiation-sensitive resin composition of the present invention can form an interlayer insulating film by heating at a low temperature for a short time, and can form an interlayer insulating film having excellent solvent resistance and relative dielectric constant. It can be suitably used as a material for forming an interlayer insulating film of a flexible display.

Claims (7)

[A] an alkali-soluble resin of a copolymer obtained by copolymerizing a monomer containing (a1) an unsaturated carboxylic acid and / or an unsaturated carboxylic acid anhydride, and (a2) an epoxy group-containing unsaturated compound,
[B] A radiation-sensitive resin composition for forming an interlayer insulating film, comprising a 1,2-quinonediazide compound, and [C] a compound having two or more mercapto groups in one molecule. The radiation-sensitive resin composition according to claim 1, wherein the compound having two or more mercapto groups in one molecule of the component [C] is a compound represented by the following formula (1).

(In the formula (1), R ¹ is a methylene group, an alkylene group having 2 to 10 carbon atoms or an alkylmethylene group, and Y is a single bond, —CO— or —O—CO— ^* (where “*” is The bond is attached to R ¹ ), n is an integer of 2 to 10, and X is an n valence having 2 to 70 carbon atoms which may have one or more ether bonds. Or a group represented by formula (2) when n is 3. In formula (2), three R ^{2 s} are each independently a methylene group or an alkylene group having 2 to 6 carbon atoms. Yes, and three “*” represent bonds.)   The radiation-sensitive resin composition according to claim 2, wherein the compound represented by formula (1) of the component [C] is an esterified product of mercaptocarboxylic acid and a polyhydric alcohol. [D] The radiation sensitive resin composition according to claim 1, 2 or 3, further comprising a compound represented by the following formula (3).

(In formula (3), Z ¹ , Z ² , Z ³ and R ³ are each independently a linear, branched or cyclic group having 1 to 20 carbon atoms which may have a hydrogen atom or a substituent. And Z ² and Z ³ may be linked to each other to form a ring.) (1) The process of forming the coating film of the radiation sensitive resin composition of any one of Claims 1-4 on a board | substrate,
(2) A step of irradiating at least a part of the coating film formed in step (1),
(3) A method for forming an interlayer insulating film, comprising: a step of developing the coating film irradiated with radiation in step (2); and (4) a step of baking the coating film developed in step (3) by heating.   The method according to claim 5, wherein the firing temperature in step (4) is 180 ° C or lower.   The interlayer insulation film formed from the radiation sensitive resin composition of any one of Claims 1-4.