JP2011165885A5 - Substrate bonding method and substrate bonding apparatus - Google Patents

Claims (30)

A dehumidifying step of dehumidifying a substrate holder for holding and transporting at least one of a plurality of semiconductor substrates stacked and bonded together;
And holding the semiconductor substrate by the substrate holder after the dehumidifying step.
A substrate bonding method having: The substrate bonding method according to claim 1, wherein in the dehumidifying stage, the substrate holder is accommodated in a storage space dehumidified by the dehumidifying unit in the holder rack. The substrate holder is housed in a shelf in the holder rack in a state of being housed in a housing case,
The storage case is formed with an intake hole communicating the internal space of the storage case and the external space,
In the dehumidifying step, when the storage case is placed on the shelf, the dehumidifying gas is dehumidified by delivering a dehumidifying gas to the inner space through a vent connected to the air intake hole. The board | substrate bonding method as described in 2. The dehumidifying stage is
Detecting whether the substrate holder is stored in the storage case;
Delivering the gas into the interior space when it is detected that the substrate holder is accommodated in the accommodation space;
The substrate bonding method according to claim 3, further comprising: The dehumidifying stage is
A determination step of determining whether the gas has filled the interior space;
Adjusting the amount of gas delivered when it is determined that the gas fills the interior space;
The substrate bonding method according to claim 4, comprising The substrate bonding method according to claim 5, wherein the adjusting step adjusts a delivery amount of the gas according to a leakage amount of the gas from the internal space. The substrate bonding method according to any one of claims 3 to 6, wherein the adjustment step controls the temperature of the gas by a temperature control unit. The substrate bonding method according to claim 7, wherein in the adjusting step, the temperature control unit controls the temperature of the gas such that the temperature of the inner space becomes equal to the room temperature of the installation environment of the holder rack. The gas is dry N ₂ The substrate bonding method according to any one of claims 3 to 8, wherein The substrate bonding method according to claim 4, wherein the dehumidifying step adjusts an internal pressure of the internal space. The substrate bonding method according to claim 10, wherein the dehumidifying step is adjusted so that the internal pressure of the internal space is higher than that of the outside. The substrate bonding method according to claim 3, wherein the dehumidifying step dehumidifies the internal space when the substrate holder is stored in the storage case. The substrate bonding method according to claim 3, wherein in the dehumidifying step, a temperature control unit adjusts a temperature of the internal space. The substrate bonding method according to claim 2, wherein the dehumidifying step dehumidifies when the substrate holder is stored in the holder rack. The substrate bonding method according to any one of claims 2 to 14, further comprising a mounting step of mounting the holder rack to another device via a mounting and demounting portion of the holder rack. The substrate bonding method according to claim 15, wherein the storage space is not dehumidified when being mounted to the other device by the mounting and demounting portion. An alignment unit for aligning and overlapping at least one semiconductor substrate held by the substrate holder and another semiconductor substrate;
A bonding portion for bonding the stacked semiconductor substrate to the other semiconductor substrate while the semiconductor substrate is held by the substrate holder;
A dehumidifying unit for dehumidifying the substrate holder;
Equipped with
The dehumidifying part is a substrate bonding apparatus that dehumidifies the substrate holder before the semiconductor substrate is held by the substrate holder. The holder rack having a housing case for housing the substrate holder and the dehumidifying part for dehumidifying the internal space of the housing case is internally provided, or the holder rack is mounted via the attaching / detaching part Substrate bonding equipment. The holder rack has a shelf on which the storage case is placed;
The storage case is formed with an intake hole communicating the internal space of the storage case with the external space,
19. The substrate bonding apparatus according to claim 18, wherein a ventilating portion for delivering gas for dehumidification to the internal space is connected to the suction hole when the storage case is placed on the shelf. . A detection unit that detects whether or not the substrate holder is stored in the storage case;
A delivery unit for delivering the gas into the internal space when it is detected that the substrate holder is accommodated in the accommodation space;
20. The substrate bonding apparatus according to claim 19, comprising: It has a detection part which detects whether the gas filled the interior space,
21. The substrate bonding apparatus according to claim 20, wherein the delivery unit adjusts the delivery amount of the gas when it is detected that the gas fills the internal space. It has a measurement part which measures the amount of leaks of the above-mentioned gas from the above-mentioned internal space,
22. The substrate bonding apparatus according to claim 21, wherein the delivery unit adjusts the delivery amount of the gas according to the leakage amount of the gas. The substrate bonding apparatus according to any one of claims 19 to 22, further comprising a temperature control unit configured to control the temperature of the gas. The substrate bonding apparatus according to claim 23, wherein the temperature control unit controls the temperature of the gas such that the temperature of the internal space becomes equal to the room temperature of the installation environment of the bonding apparatus. The gas is dry N ₂ The substrate bonding apparatus according to any one of claims 19 to 14, which is 21. The substrate bonding apparatus according to claim 20, further comprising: an adjusting unit configured to adjust an internal pressure of the internal space. The substrate bonding apparatus according to claim 26, wherein the adjustment unit adjusts the internal pressure of the internal space to be higher than that of the outside. 20. The substrate bonding apparatus according to claim 19, wherein the dehumidifying part dehumidifies the internal space when the substrate holder is stored in the storage case. The substrate bonding apparatus of any one of Claims 19-22 which have a temperature control part which adjusts the temperature of the said internal space. The substrate bonding apparatus according to claim 18, wherein the dehumidifying part dehumidifies when the substrate holder is accommodated in the holder rack.