JP2011164292A - Optical wiring substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical routing substrate on which optical elements are easily mounted. <P>SOLUTION: The optical wiring substrate includes: a substrate 2; an optical waveguide 5 formed on the back face side of the substrate 2;a mirror 7 for light emitting element which is formed on the core 3 of the optical waveguide 5, transforms the optical path of the light incident from a surface light emitting element 6 mounted on the front face side of the substrate 2 by 90 degrees and allows the light incident on the core 3 of the optical waveguide 5; and a mirror 9 for light receiving element which is formed on the core 3 of the optical waveguide 5, transforms the optical path of the light emitted from the surface light emitting element 6 and propagating in the core 3 by 90 degrees toward the substrate 2 side and allows the light incident on the surface light receiving element 8 mounted on the front face side of the substrate 2; and an illumination light incident part 10 which is formed on the core 3 of the optical waveguide 5 and allows the illumination light L radiated from outside incident on the core 3 of the optical waveguide 5. The illumination light L is made incident on the core 3 via the illumination light incident part 10 and reflected on the mirror 7 for light emitting element and/or the mirror 9 for light receiving element, thus the mounted positions of the surface light emitting element 6 and/or the surface light receiving element 8 are visible. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an optical wiring board on which an optical element can be easily mounted.

  2. Description of the Related Art Conventionally, an optical wiring board is known in which electrical wiring is formed on the front surface side of the substrate and an optical waveguide is formed on the back surface side of the substrate. Two mirrors inclined at 45 degrees with respect to the optical axis of the core are formed in the core of the optical waveguide, and a surface light emitting element (for example, LD (Laser Diode)), a surface is formed on the substrate surface above both mirrors. A light receiving element (for example, PD (Photo Diode)) is mounted.

  In this optical wiring board, the light emitted from the surface light emitting element is transmitted through the substrate, and its optical path is changed by 90 degrees by a mirror below the surface light emitting element (hereinafter referred to as a light emitting element mirror), and becomes the core of the optical waveguide. Incident. The light incident on the core propagates through the core, the optical path is converted 90 degrees toward the substrate side by a mirror below the surface light receiving element (hereinafter referred to as a light receiving element mirror), passes through the substrate, and enters the surface light receiving element. To do.

  In addition, there exists patent document 1 as prior art document information relevant to invention of this application.

JP 2007-17559 A

  When mounting an optical element (surface light emitting element and surface light receiving element) on a conventional optical wiring board, first, illumination light is irradiated from above the light receiving element mirror (or light emitting element mirror). Then, the illumination light is reflected by the light-receiving element mirror (or light-emitting element mirror), propagates through the core, is reflected by the light-emitting element mirror (or light-receiving element mirror), and becomes a light-emitting element mirror (or light-receiving element mirror). It is emitted above the mirror. By confirming the emitted illumination light visually from above, the mounting position of the surface light emitting element (or surface light receiving element) can be visually confirmed.

  However, in this conventional optical wiring board, it is possible to visually recognize the mounting position of one optical element and mount it at the correct mounting position. However, after mounting one optical element, the mounted optical Since the element blocks the incidence of illumination light, there is a problem that the mounting position of the other optical element cannot be visually recognized.

  Therefore, at present, after mounting one optical element, the other optical element is aligned and mounted using the electrical wiring formed in advance on the substrate as a mark. Since the optical element is not mounted while visually recognizing, the mounting position of the optical element may naturally be shifted.

  In addition, for example, it is conceivable to mount the surface light emitting element first and visually check the mounting position of the surface light receiving element using the light emitted from the mounted surface light emitting element. Etc. and a complicated operation such as connecting a power source to the surface light emitting element via the lead wire is required, and the manufacturing is very laborious, resulting in an increase in manufacturing cost.

  SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an optical wiring board that solves the above-described problems, facilitates mounting of optical elements, and improves mounting accuracy.

  The present invention has been devised to achieve the above object, and includes a substrate, an optical waveguide formed on the back side of the substrate, having a core, and formed on the core of the optical waveguide, and on the surface of the substrate. A light-emitting element mirror incident on the core of the optical waveguide by converting the optical path of light incident from the surface-emitting element mounted on the side by 90 degrees, and the surface light emission formed on the core of the optical waveguide An optical wiring board comprising: a light receiving element mirror that converts an optical path of light emitted from an element and propagating through the core by 90 degrees to the substrate side and is incident on a surface light receiving element mounted on the surface side of the substrate And an illumination light incident portion that is formed on the core of the optical waveguide and that illuminates illumination light irradiated from the outside to the core of the optical waveguide, and the illumination light is transmitted through the illumination light incident portion to the core. Incident on the light emitting element By reflecting with over and / or mirror the light receiving element, an optical wiring board which enables viewing the mounting position of the surface-emitting device and / or the surface light receiving element.

  The illumination light incident part may be composed of an illumination light incident mirror formed on the core of the optical waveguide.

  The illumination light incident mirror is formed on the core between the light emitting element mirror and the light receiving element mirror, and the illumination light is transmitted on the core on the light emitting element mirror side and on the light receiving element mirror side. You may make it inject into both of the said cores.

  The illumination light incident mirror is formed by forming a reflective film made of metal on the surface of a V-groove obtained by cutting the core into a V shape from the opposite side of the substrate, and the height of the V-groove is It may be 5 to 95% of the height of the core.

  The illumination light incident mirror includes a V-groove in which the core is cut out in a V shape from the opposite side of the substrate. After mounting the surface light emitting element and the surface light receiving element both light elements, You may make it fill with resin which has a refractive index equivalent to the said core.

  The illumination light incident mirror is formed so that the illumination light irradiated from the outside is incident on the core on the light receiving element mirror side, and the illumination light incident mirror is formed in a width direction with the light emitting element mirror. And / or may be formed on the core at a position that does not overlap in the height direction.

  The illumination light incident mirror may be formed on the core on the opposite side of the light receiving element mirror from the light emitting element mirror.

  According to the present invention, even after one optical element is mounted, the mounting position of the other optical element can be visually recognized, and an optical wiring board in which the optical element can be easily mounted can be provided.

It is a figure which shows the optical wiring board which concerns on one embodiment of this invention, (a) is a sectional side view, (b) is the top view seen from the lower side. It is a sectional side view of the optical wiring board which concerns on one embodiment of this invention. It is a sectional side view of the optical wiring board which concerns on one embodiment of this invention. It is a sectional side view of the optical wiring board which concerns on one embodiment of this invention. It is the top view seen from the lower side of the optical wiring board which concerns on one embodiment of this invention. It is the top view seen from the lower side of the optical wiring board which concerns on one embodiment of this invention. It is a sectional side view of the optical wiring board which concerns on one embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings.

  1A and 1B are diagrams showing an optical wiring board according to the present embodiment, in which FIG. 1A is a side sectional view and FIG. 1B is a plan view seen from below.

  As shown in FIGS. 1A and 1B, the optical wiring substrate 1 is formed on the substrate 2 on which the electrical wiring 2a is formed and on the back side of the substrate 2 (lower side in FIG. 1A). An optical waveguide 5 including a core 3 and a clad 4 is mainly provided.

  In the core 3 of the optical waveguide 5, a light emitting element that converts the optical path of light incident from a surface light emitting element 6 such as an LD mounted on the surface side of the substrate 2 by 90 degrees and enters the core 3 of the optical waveguide 5. The optical path of the light emitted from the mirror 7 and the surface light emitting element 6 and propagating through the core 3 is converted 90 degrees to the substrate 2 side and is incident on the surface light receiving element 8 such as a PD mounted on the surface side of the substrate 2. A light receiving element mirror 9 is formed.

  The light emitting element mirror 7 has an inclined surface 7a inclined by 45 degrees with respect to the optical axis of the core 3, and a reflective film 7b made of metal is formed on the inclined surface 7a. The light receiving element mirror 9 has an inclined surface 9a inclined by 45 degrees with respect to the optical axis of the core 3, and a reflective film 9b made of metal is formed on the inclined surface 9a. In the present embodiment, the light emitting element mirror 7 is formed at one end of the core 3 (the left end in FIG. 1A), and the right end in the other end of the core 3 (FIG. 1A). ), A light receiving element mirror 9 was formed.

  As the substrate 2, a substrate made of a material (epoxy resin or the like) that is transparent to the light that enters and exits the optical elements 6 and 8 is used. As the substrate 2, for example, a flexible substrate can be used.

  Now, in the optical wiring substrate 1 according to the present embodiment, illumination as an illumination light incident part that makes the illumination light L emitted from the external light source 11 enter the core 3 of the optical waveguide 5 on the core 3 of the optical waveguide 5. A light incident mirror 10 is formed.

  The illumination light incident mirror 10 is formed in the core 3 between the light emitting element mirror 7 and the light receiving element mirror 9. In the present embodiment, the illumination light incident mirror 10 is formed in the central portion of the core 3 of the optical waveguide 5 in the longitudinal direction (left-right direction in FIG. 1A). The light source 11 is disposed on the substrate 2 side so as to face the irradiation light incident mirror 10.

  The illumination light incident mirror 10 has a V-shaped clad 4 and core 3 on the back side (the bottom side in FIG. 1A) from the opposite side of the substrate 2 by dicing or laser processing the optical waveguide 5. A reflective film 10b made of metal is formed on the surface of the V-groove 10a cut out in a V-shape that is vertically inverted in FIG. 1A, and then a resin is applied to the cut-out portion formed when the V-groove 10a is formed. (Thermosetting resin or photocuring resin) 12 is filled. Both slopes forming the V-groove 10a are formed so as to be inclined by 45 degrees with respect to the optical axis of the core 3, and the incident illumination light L is converted into the core 3 on the light emitting element mirror 7 side and the light receiving element mirror. The light is incident on both of the 9 side cores 3. Since there is the reflective film 10b, light does not enter the portion filled with the resin 12, so that the refractive index of the filled resin 12 may be any.

  The V groove 10a of the illumination light incident mirror 10 has a height from the surface of the core 3 opposite to the substrate 2 to the apex of the V groove 10a (hereinafter simply referred to as the height of the V groove 10a). It is formed to be 5 to 95% of the height. This is because if the height of the V-groove 10a is less than 5% of the height of the core 3, sufficient illumination light cannot be incident on the core 3, and the mounting positions of the optical elements 6 and 8 are visually confirmed. If it exceeds 95%, almost all of the light from the surface light emitting element 6 is reflected by the illumination light incident mirror 10 and is lost, and the light from the surface light emitting element 6 is lost. This is because it almost never reaches. The height of the V groove 10a may be set to such a height that the light from the surface light-emitting element 6 can be sufficiently received by the surface light-receiving element 8 (the electric output from the surface light-receiving element 8 can be sufficiently obtained). Actually, it is desirable that the upper limit value of the height of the V groove 10a is 50% or less of the height of the core 3, and preferably 10% or less of the height of the core 3.

  When mounting both optical elements 6 and 8 on the optical wiring board 1, first, the illumination light L is incident on the illumination light incident mirror 10 from the light source 11. Then, the illumination light L incident on the illumination light incident mirror 10 is reflected by the illumination light incident mirror 10 and is applied to both the core 3 on the light emitting element mirror 7 side and the core 3 on the light receiving element mirror 9 side. Incident. The illumination light L incident on the core 3 on the light emitting element mirror 7 side is reflected by the light emitting element mirror 7, passes through the substrate 2, and is emitted upward on the surface side of the substrate 2. The illumination light L incident on the core 3 on the light receiving element mirror 9 side is reflected by the light receiving element mirror 9, passes through the substrate 2, and is emitted upward on the surface side of the substrate 2.

  When the light emitted above the substrate 2 from both the optical element mirrors 7 and 9 is visually confirmed from the surface side of the substrate 2 (the upper side in FIG. 1A), the both optical element mirrors 7 and 9 are illuminated. It can be seen that the light L is reflected, and the positions of the mirrors 7 and 9 for both light elements can be confirmed. The two light elements 6 and 8 are sequentially mounted so that the light emitting part of the surface light emitting element 6 or the light receiving part of the surface light receiving element 8 is positioned substantially at the center of the mirrors 7 and 9 for both light elements.

  When mounting both optical elements 6, 8, it is desirable that the entire mirrors 7, 9 for both optical elements appear to shine, so that the illumination light L is easily diffused in the core 3. It is preferable to use light containing a large number of different lights (for example, white light, light emitted from an LED, LD light after passing through a mode scrambler, etc.).

  As described above, in the optical wiring substrate 1 according to the present embodiment, the illumination light incident mirror 10 that makes the illumination light L irradiated from the outside to the core 3 of the optical waveguide 5 enter the core 3 of the optical waveguide 5. And the illumination light L is incident on the core 3 via the illumination light incident mirror 10 and reflected by the light-emitting element mirror 7 and the light-receiving element mirror 9. The mounting position is visible.

  Thereby, even after one optical element 6 (or 8) is mounted, the mounting position of the other optical element 8 (or 6) can be visually recognized, and mounting of both optical elements 6 and 8 is facilitated. In addition, mounting accuracy is improved. become. As a result, work efficiency is improved, and as a result, manufacturing costs can be reduced.

  In the optical circuit board 1, the illumination light incident mirror 10 is formed on the core 3 between the light emitting element mirror 7 and the light receiving element mirror 9, and the illumination light L is transmitted to the core 3 on the light emitting element mirror 7 side. Since the light is incident on both the cores 3 on the light receiving element mirror 9 side, the mounting positions of the light elements 6 and 8 can be visually recognized without changing the position of the light source 11 on which the illumination light L is incident. Is possible. Therefore, working efficiency can be further improved.

  Next, another embodiment of the present invention will be described.

  In the optical wiring board 1 described above, the resin 12 is filled in the notched portion formed when the V-groove 10a of the illumination light incident mirror 10 is formed. However, as in the optical wiring board 21 shown in FIG. The resin may not be filled in the notched portion formed sometimes. In the optical wiring board 21, the illumination light L can be reflected by the difference in refractive index between the material constituting the core 3 and air, so that the reflective film can be omitted, and the optical wiring board 21 can be realized at a lower cost.

  The optical wiring board 31 shown in FIG. 3 has a resin 32 (thermosetting resin or optical resin having a refractive index equivalent to that of the core 3 in the V groove 10a after mounting both optical elements 6 and 8 in the optical wiring board 21 of FIG. Cured resin). According to the optical wiring board 31, light from the surface light emitting element 6 is not reflected by the irradiation light incident mirror 10, so that loss of light transmitted between the both optical elements 6 and 8 can be reduced. The reason for defining the refractive index of the resin 32 is that light also enters the resin-filled portion filled with the resin 32.

  In the optical wiring board 1 of FIG. 1, the upper limit of the height of the V groove 10 a is set to 95% or less of the height of the core 3 in consideration of the loss of light transmitted between the optical elements 6 and 8. Preferably, it is 50% or less, more preferably 10% or less. However, in the optical wiring board 31, the V-groove 10a is filled with the resin 32 after the optical elements 6 and 8 are mounted. There is no need to consider the loss of transmitted light, and the height of the V-groove 10a may be the same as or higher than the height of the core 3. As described above, the optical wiring board 31 is easy to manufacture because the accuracy of the height of the V-groove 10a is not required as compared with the optical wiring board 1 of FIG.

  4 forms an illumination light incident mirror 42 at one end (the left end in FIG. 4) of the core 3 of the optical waveguide 5 and the other end (the right end in FIG. 4). ), A light receiving element mirror 9 is formed, and a light emitting element mirror 43 is formed in the core 3 between the illumination light incident mirror 42 and the light receiving element mirror 9, and the illumination light incident mirror 42 emits light. It is formed on the core 3 opposite to the light receiving element mirror 9 with respect to the element mirror 43.

  The illumination light incident mirror 42 has an inclined surface 42a inclined by 45 degrees with respect to the optical axis of the core 3, and a reflective film 42b made of metal is formed on the inclined surface 42a. That is, the illumination light incident mirror 42 is the same as the light emitting element mirror 7 in the optical wiring board 1 of FIG.

  The light-emitting element mirror 43 is formed in the vicinity of one end of the core 3, and the surface of the V-groove 43 a in which the core 3 is notched in a V shape (vertically inverted V shape in FIG. 4) from the opposite side of the substrate 2. Then, a reflective film 43b made of metal is formed, and then a notch portion formed when the V-groove 43a is formed is filled with a resin 44 (thermosetting resin or photo-curing resin). That is, the light emitting element mirror 43 is the same as the illumination light incident mirror 10 in the optical wiring board 1 of FIG. 1, although the formation position in the longitudinal direction of the core 3 is different. Since the reflection film 43b is present, no light is incident on the resin-filled portion, so any refractive index of the filled resin 44 may be used.

  That is, the optical wiring board 41 causes the illumination light L to be incident on the light emitting element mirror 7 in the optical wiring board 1 of FIG. 1, and the surface light emitting element 6 is placed on the surface of the substrate 2 above the illumination light incident mirror 10. It is equivalent to what was implemented. The illumination light L passes through the portion of the core 3 where the light emitting element mirror 43 is not formed, but it is sufficient that the illumination light L having a minimum visible light quantity passes through. The height of the groove 43 a is preferably about 90% of the height of the core 3.

  When mounting both optical elements 6 and 8 on the optical wiring substrate 41, first, the illumination light L is incident on the illumination light incident mirror 42 from the substrate 2 side, reflected by the light emitting element mirror 43, and reflected on the substrate 2. The mounting position of the surface light emitting element 6 is confirmed by the illumination light L emitted upward, and the surface light emitting element 6 is mounted at the mounting position. Subsequently, the mounting position of the surface light receiving element 8 is confirmed by the illumination light L reflected from the light receiving element mirror 9 and emitted above the substrate 2 through the illumination light incident mirror 42, and the surface light receiving is detected at the mounting position. The element 8 is mounted.

  According to the optical wiring board 41, the mounting position of the other optical element 8 (or 6) can be visually recognized even after the mounting of one optical element 6 (or 8), similarly to the optical wiring board 1 of FIG. This makes it easy to mount both optical elements 6 and 8.

  An optical wiring substrate 51 shown in FIG. 5 is a plan view seen from the optical waveguide 5 side, and the illumination light incident mirror 52 is incident on the illumination light L irradiated from the outside to the core 3 on the light receiving element mirror 9 side. In addition, the illumination light incident mirror 52 is formed on the core 3 at a position that does not overlap the light emitting element mirror 7 in the width direction (vertical direction in FIG. 5). The illumination light incident mirror 52 is formed in the core 3 between the light emitting element mirror 7 and the light receiving element mirror 9.

  That is, the optical wiring board 51 is provided with a step in the core 3 in plan view, and the light emitting element mirror 7 is formed at the end of the narrower core 3 and at the end of the wider core 3. The light receiving element mirror 9 is formed, and the illumination light incident mirror 52 is formed at the step portion of the core 3.

  The optical wiring board 61 shown in FIG. 6 is a plan view seen from the optical waveguide 5 side and has basically the same configuration as the optical wiring board 51 of FIG. It is formed on the core 3 opposite to the light receiving element mirror 9 than the mirror 7 for light.

  That is, the optical wiring board 61 is provided with a step in the core 3 in plan view, and the illumination light incident mirror 62 is formed at the end of the narrower core 3 and the end of the wider core 3 is formed. The light receiving element mirror 9 is formed on the core 3, and the light emitting element mirror 7 is formed on the stepped portion of the core 3.

  Although not shown in FIGS. 5 and 6, the illumination light incident mirrors 52 and 62 have a slope inclined by 45 degrees with respect to the optical axis of the core 3, and a reflective film made of metal is provided on the slope. Is formed.

  When mounting both optical elements 6 and 8 on the optical wiring boards 51 and 61, first, the illumination light L is incident on the light receiving element mirror 9 from the substrate 2 side (the back side of the paper), and the light emitting element mirror 7 The mounting position of the surface light emitting element 6 is confirmed by the illumination light L reflected and emitted above the substrate 2, and the surface light emitting element 6 is mounted at the mounting position. Thereafter, the illumination light L enters the illumination light incident mirrors 52 and 62 from the substrate 2 side, is reflected by the light-receiving element mirror 9, and is mounted on the surface light-receiving element 8 by the illumination light L emitted above the substrate 2. The surface light receiving element 8 is mounted at the mounting position.

  5 and 6, the illumination light incident mirrors 52 and 62 are formed at positions that do not overlap with the light emitting element mirror 7 in the width direction. The light is not reflected by the illumination light incident mirrors 52 and 62 and no loss occurs.

  When manufacturing the optical wiring boards 51 and 61, for example, a mold having a protrusion having the same shape as the core 3 is prepared, and the clad 4 having a recess having the same shape as the core 3 is formed using the mold. After forming the reflective film made of metal at a predetermined place, forming each mirror 7, 9, 52, 62, filling the concave portion with the resin to be the core 3, and solidifying the core 3 Further, a clad 4 is further formed above the optical waveguide 5 to form the optical waveguide 5, and the formed optical waveguide 5 is bonded to the substrate 2.

  The optical wiring board 71 shown in FIG. 7 is a side view, and the illumination light incident mirror 72 is formed so that the illumination light L irradiated from the outside is incident on the core 3 on the light receiving element mirror 9 side, and The illumination light incident mirror 72 is formed on the core 3 at a position not overlapping the light emitting element mirror 7 in the height direction (vertical direction in FIG. 7). The illumination light incident mirror 72 has a slope 72a inclined by 45 degrees with respect to the optical axis of the core 3, and a reflective film 72b made of metal is formed on the slope 72a. The optical wiring board 71 is manufactured using a mold in the same manner as the optical wiring boards 51 and 61.

  In other words, the optical wiring board 71 is provided with a step projecting downward in the core 3 in a side sectional view, and the light emitting element mirror 7 is formed at the end of the core 3 having a lower height, and the higher one. The light receiving element mirror 9 is formed at the end of the core 3, and the illumination light incident mirror 72 is formed at the step portion of the core 3.

  When mounting both optical elements 6 and 8 on the optical wiring board 71, first, the illumination light L is incident on the light receiving element mirror 9 from the substrate 2 side, reflected by the light emitting element mirror 7, and above the substrate 2. The mounting position of the surface light emitting element 6 is confirmed by the illumination light L emitted to the surface, and the surface light emitting element 6 is mounted at the mounting position. Thereafter, the illumination light L is incident on the illumination light incident mirror 72 from the substrate 2 side, and the mounting position of the surface light receiving element 8 is confirmed by the illumination light L reflected from the light receiving element mirror 9 and emitted above the substrate 2. Then, the surface light receiving element 8 is mounted at the mounting position.

  According to the optical wiring board 71, the illumination light incident mirror 72 is formed at a position that does not overlap the light emitting element mirror 7 in the height direction, and therefore, similar to the optical wiring boards 51 and 61 of FIGS. The light from the surface light emitting element 6 is not reflected by the illumination light incident mirror 72 and no loss occurs.

  In the optical wiring board 71, the illumination light incident mirror 72 is formed in the core 3 between the light emitting element mirror 7 and the light receiving element mirror 9, but in the same manner as the optical wiring board 61 in FIG. The light incident mirror 72 may be formed on the core 3 on the opposite side of the light receiving element mirror 9 from the light emitting element mirror 7.

  5 and 6, the illumination light incident mirrors 52 and 62 are formed on the core 3 at a position that does not overlap the light emitting element mirror 7 in the width direction, and the optical wiring substrate of FIG. In 71, the illumination light incident mirror 72 is formed on the core 3 at a position not overlapping the light emitting element mirror 7 in the height direction. However, the illumination light incident mirror is formed in the width direction and height with the light emitting element mirror 7. You may make it form in the core 3 of the position which does not overlap in a direction.

  The present invention is not limited to the above-described embodiment, and it is needless to say that various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 Optical wiring board 2 Substrate 3 Core 4 Clad 5 Optical waveguide 6 Surface light emitting element 7 Light emitting element mirror 8 Surface light receiving element 9 Light receiving element mirror 10 Illumination light incident mirror (illumination light incident part)
11 Light source L Illumination light

Claims (7)

A substrate,
An optical waveguide formed on the back side of the substrate and having a core;
A light-emitting element mirror that is formed in the core of the optical waveguide and converts a light path of light incident from a surface light-emitting element mounted on the surface side of the substrate by 90 degrees and is incident on the core of the optical waveguide; ,
An optical path formed on the core of the optical waveguide, converted from the light emitted from the surface light emitting element and propagating through the core, is converted by 90 degrees to the substrate side, and incident on the surface light receiving element mounted on the surface side of the substrate In an optical wiring board provided with a mirror for a light receiving element,
An illumination light incident portion that is formed on the core of the optical waveguide and that illuminates illumination light irradiated from the outside to the core of the optical waveguide;
Mounting the surface light-emitting element and / or the surface light-receiving element by causing the illumination light to enter the core through the illumination light incident portion and reflect the light by the light-emitting element mirror and / or the light-receiving element mirror. An optical wiring board characterized in that the position is visible.   The optical wiring board according to claim 1, wherein the illumination light incident part is composed of an illumination light incident mirror formed on the core of the optical waveguide.   The illumination light incident mirror is formed on the core between the light emitting element mirror and the light receiving element mirror, and the illumination light is transmitted on the core on the light emitting element mirror side and on the light receiving element mirror side. The optical wiring board according to claim 2, wherein the optical wiring board is incident on both of the cores. The illumination light incident mirror is formed by forming a reflective film made of metal on the surface of a V-groove obtained by cutting the core into a V shape from the opposite side of the substrate.
The optical wiring board according to claim 3, wherein a height of the V groove from a surface of the core opposite to the substrate to a vertex of the V groove is 5 to 95% of a height of the core. The illumination light incident mirror comprises a V-groove in which the core is cut out in a V shape from the opposite side of the substrate,
4. The optical wiring board according to claim 3, wherein after the surface light emitting element and the surface light receiving element are both mounted, the V groove is filled with a resin having a refractive index equivalent to that of the core. The illumination light incident mirror is formed so that the illumination light irradiated from the outside is incident on the core on the light receiving element mirror side,
The optical wiring board according to claim 2, wherein the illumination light incident mirror is formed on the core at a position that does not overlap the light emitting element mirror in the width direction and / or the height direction.   The optical wiring board according to claim 6, wherein the illumination light incident mirror is formed on the core on the opposite side of the light receiving element mirror from the light emitting element mirror.

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