JP2011159787A - Module and method of manufacturing the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To solve the problem that a conventional circuit module comprising a circuit board, an electronic component mounted on a wiring pattern provided to a surface layer of the circuit board, an insulating resin for sealing them, a conductive resin layer provided on the insulating resin and made of metal paste and the like can not have necessary shielding properties. <P>SOLUTION: A module 101 includes a substrate portion 103, an electronic component 104, a mold portion 102 sealing them, and a shield portion 112 covering upward inner layer wiring 107 exposed in a section thereof while having a first corner slope portion 110, downward inner layer wiring 109 exposed while having a second corner slope portion 111, and a surface of the mold portion 102 and composed of a metal film formed by sputtering, and the second corner slope portion 111 is made larger in size, area, etc., than the first corner slop portion 110 to enhance shielding characteristics on a back-electrode-108 side of the substrate portion 103 where the shield portion 112 is likely to be less in thickness. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a molded module used for a wireless LAN of a mobile phone or a personal computer, and a manufacturing method thereof.

  Hereinafter, a conventional module will be described with reference to FIG.

  FIG. 7 shows a cross-sectional view of a conventional module. In FIG. 7, a conventional circuit module 1 includes a circuit board 5 and electronic components 6 such as a semiconductor chip, a multilayer ceramic capacitor, and a square chip resistor, which are mounted on a wiring pattern 4 provided on the surface layer of the circuit board 5. And an insulating resin 2 for sealing the electronic component 6 and the like, and a conductive resin layer 3 made of a metal paste or the like provided on the insulating resin 2.

  And the ground layer 7 and a part built in the circuit board 5 are electrically connected to the conductive resin layer 3, and the conductive resin layer 3 serves as a shield.

  The following Patent Document 1 is known as such a module.

JP 2006-286915 A

  However, in the conventional circuit module 1, a sufficient shielding effect may not be obtained.

  In particular, since the conductive resin layer 3 is made of a conductive paste in which conductive powder is dispersed in an insulating resin, the ground layer 7 exposed on the side surface of the circuit board 5 (for example, the ground layer 7 is a copper foil or the like). Therefore, the contact resistance (or connection resistance) between the conductive resin layer 3 and the ground layer 7 is high, and the exposed surface of the ground layer 7 is easily affected by oxidation or the like.

  Further, since the thickness of the built-in ground layer 7 decreases as the circuit board 5 becomes thinner and finer, the exposed area of the ground layer 7 exposed on the side surface of the circuit board 5 decreases. The contact resistance (or connection resistance) between the layer 3 and the ground layer 7 increases.

  The present invention reduces or stabilizes the electrical connection between the ground layer and the metal film constituting the shield even when the internal wiring serving as the ground wiring is exposed on the cut surface of the circuit board. The purpose is to provide a corresponding module.

In order to achieve the above object, the module of the present invention includes an insulating layer in which an epoxy resin is impregnated in a core material, an upward inner layer wiring having a glossy surface facing upward, and a downward inner layer wiring having a glossy surface facing downward. A circuit board having a top surface wiring and a back surface wiring;
An electronic component mounted on the upper surface wiring, a mold portion for mold-sealing the electronic component on the substrate portion, the upward inner layer wiring exposed with a first sag portion in the cross section, a second portion And a metal film formed by sputtering covering the downward inner layer wiring exposed along with the sagging portion and the surface of the sealing portion, and a second sagging portion from the first sagging portion. A module with a larger part.

  With the above configuration, the module of the present invention is particularly thin on the lower side of the substrate portion (that is, the mother substrate side or the backside wiring side) where the shielding portion made of a metal film by sputtering is thin and the shielding performance is likely to deteriorate. By increasing the size of the second sagging portion (one or more of width, thickness, or area) of the first sagging portion, an internal wiring serving as a ground and a metal film serving as a shield portion The connection resistance between the two can be reduced, and the electrical connection reliability and shielding performance of the module can be improved.

(A) (B) is sectional drawing of the module in Example 1 of this invention both (A)-(E) is sectional drawing explaining an example of the manufacturing method of a module together (A) (B) is sectional drawing which partially enlarges and demonstrates a mode that the board | substrate part in which the electronic component was mounted is divided | segmented using a dicing apparatus. Cross-sectional photograph of the module created by the inventors using SEM (A)-(C) are partial enlarged photographs of FIG. (A)-(C) are schematic diagrams of FIGS. 5 (A)-(C), respectively. Sectional view of a conventional module

Example 1
Hereinafter, the module of Example 1 will be described with reference to the drawings. 1A and 1B are both cross-sectional views of a module according to the first embodiment of the present invention.

  1A and 1B, 101 is a module, 102 is a mold part, 103 is a substrate part, 104 is an electronic component, 105 is a solder part, 106 is a top surface wiring, 107 is an upward inner layer wiring, and 108 is a back surface wiring. 109 is a downward inner layer wiring, 110 is a first sagging portion, 111 is a second sagging portion, 112 is a shield portion, 113 is an insulating layer, 114 is a glossy surface, and 115 is a rough surface.

  FIG. 1A is a cross-sectional view of the module 101. As shown in FIG. 1A, the module 101 includes a substrate portion 103, a mold portion 102, and a shield portion 112 made of a metal film formed by sputtering to cover them.

  The substrate unit 103 includes an insulating layer 113 obtained by impregnating a core material (not shown) with an epoxy resin (not shown), one or more upper inner wirings 107, and one or more lower inner layers. The wiring 109, the upper surface wiring 106, and the back surface wiring 108 are provided.

  The upper surface wiring 106 is a wiring provided on the surface of the substrate unit 103 on the mold unit 102 side or the electronic component 104 side built in the mold unit 102, and the electronic component 104 is mounted via the solder unit 105. It corresponds to the part.

  The back surface wiring 108 is a portion of the substrate unit 103 that is not on the mold side, and is a wiring for mounting the module 101 on another circuit board (not shown) or a mother board (not shown). .

  The upward inner layer wiring 107 is one of the inner layer wirings built in the substrate unit 103, and the glossy surface 114 of the copper foil constituting the wiring is downward (that is, the back surface wiring 108 side). The rough surface 115 side of the upward inner layer wiring 107 is downward (that is, the mold portion 102 side, the electronic component 104 built in the mold portion 102 side, or the upper surface wiring 106 side).

  Both the lower inner layer wiring 109 and the upper inner layer wiring 107 are one of the inner layer wirings built in the substrate unit 103, and the glossy surface 114 of the copper foil constituting the wiring is upward (that is, the mold unit 102 side). Alternatively, the electronic component 104 side or the upper surface wiring 106 side built in the mold portion 102. Note that upward is a term for convenience and may be called a mold side. The rough surface 115 side of the upward inner layer wiring 107 is downward (that is, the back surface wiring 108 side. Note that the downward direction is a name for convenience and may be referred to as a side other than the mold side).

  Note that it is desirable to use a copper foil (sometimes referred to as a single-sided glossy copper foil) having a glossy surface 114 on one side and a rough surface 115 on the other side for both the downward inner layer wiring 109 and the upward inner layer wiring 107. . This is because the glossy surface 114 is excellent in pattern resolution during exposure, and the rough surface 115 side is excellent in adhesion to the insulating layer 113 side such as epoxy resin. For both the downward inner layer wiring 109 and the upward inner layer wiring 107, a commercially available one-sided glossy copper foil can be used. Moreover, in order to make the one surface of the commercially available copper foil the glossy surface 114 and the remaining surface to be the rough surface 115, it is useful to use a commercially available treatment solution or a commercially available roughening treatment solution.

  In FIG. 1 (A), the shield part 112 is a metal which becomes the shield part 112 on five surfaces of the module 101 (that is, a total of five surfaces including a ceiling surface and four side surfaces) using a sputtering apparatus (not shown). A thin film is formed. By using a sputtering apparatus, it is possible to reduce the thickness of the metal thin film (the film thickness is 10 μm or less, further 5 μm or less, further 2 μm or less) and further reduce the resistance of the metal film.

  In addition, the shield part 112 is connected to the upper inner layer wiring 107 and the lower inner layer wiring 109 serving as the ground (that is, the upper inner layer wiring 107 and the lower inner layer wiring 109 exposed in the cross section of the substrate part 103). By forming the first sag portion 110 and the second sag portion 111, the connection area between the upper inner layer wiring 107 or the lower inner layer wiring 109 and the shield portion 112 can be increased, and the resistance value of the shield portion 112 is increased. The effect of increasing the shield and further improving the shielding property can be obtained. This is because the film thickness on the side surface of the module 101 tends to be thinner than the film thickness on the ceiling surface of the module 101 when a metal thin film serving as the shield portion 112 is provided on the five surfaces of the module 101 by the sputtering apparatus. By forming the first sag portion 110 and the second sag portion 111, the connection area between the upper inner layer wiring 107 or the lower inner layer wiring 109 and the shield portion 112 can be increased, and the resistance value of the shield portion 112 is increased. The effect of increasing the shield and further improving the shielding property can be obtained.

  Further, by making the size (any one or more of area and thickness) of the second sag portion 111 larger than that of the first sag portion 110, the lower side of the substrate portion where the shielding performance is likely to be lowered (that is, the mother On the substrate side or backside wiring side, in particular, the first sag part becomes a ground by increasing the size (one or more of width, thickness, or area) of the second sag part. The connection resistance between the internal wiring and the metal film serving as the shield portion can be reduced, and the electrical connection reliability and shielding performance of the module can be improved.

  FIG. 1B is a cross-sectional view in which the vicinity of the first sag portion 110 and the second sag portion 111 in FIG. 1A is partially enlarged. As shown in FIG. 1B, a first sag portion 110 is formed on the glossy surface 114 side of the upper inner layer wiring, and a second sag portion 111 is formed on the glossy surface 114 side of the lower inner layer wiring 109. ing.

  The first sagging portion 110 may be omitted (or may be small), but the second sagging portion 111 is larger than a certain size (desirably 0.5 times or more and 10 times or less of the downward inner layer wiring 109). ) Is desirable. This is because the second sag portion 111 is enlarged (at least one of width, thickness, or area) on the lower side of the substrate portion where the shielding property is likely to deteriorate (that is, the mother substrate side or the backside wiring side). This is to reduce the connection resistance between the internal wiring serving as the ground and the metal film serving as the shield portion.

  The substrate portion 103 is made of glass fiber 119 (for example, glass woven fabric or glass nonwoven fabric) or aramid fiber (for example, aramid woven fabric or glass woven fabric) impregnated with an epoxy resin, and one or more layers of copper foil. A layered product is used so as to incorporate the. As such a substrate portion 103, a commercially available glass epoxy resin substrate (sometimes referred to as a glass epoxy substrate) may be used.

  In addition, as the insulating layer 113 used for the substrate portion 103, an aramid fiber (for example, an aramid woven fabric or glass) is used in addition to a material obtained by impregnating and curing glass fibers 119 (for example, a glass woven fabric or glass nonwoven fabric) with an epoxy resin. A fabric obtained by impregnating and curing a woven fabric) with an epoxy resin may be used.

  By using a material including a core material such as the insulating layer 113 and the glass fiber 119, the module 101 is provided at a lower portion of the module 101 (particularly, in a cross section on the insulating layer 113 side between the downward inner layer wiring 109 and the back surface wiring 108. This is because the growth of the groove can be controlled by the core material even when a groove (for example, the groove 121 in FIGS. 5 and 6 described later) is provided. The core material prevents the epoxy resin contained in the insulating layer 113 from being lost to the outside through the groove.

  The mold part 102 uses a sealing material made of an epoxy resin or the like to which an inorganic filler 120 for adjusting a thermal expansion coefficient or the like is added.

  As the copper foil constituting the upper surface wiring 106, the upper inner layer wiring 107, the lower inner layer wiring 109, the back surface wiring 108, etc., electrolytic copper or rolled copper is used. By selecting the thickness of the copper foil as 12 μm, 18 μm, 36 μm or the like, it becomes easy to form the exposed portions (further, the first sag portion 110 and the second sag portion 111) from the substrate portion 103.

  The metal thin film constituting the shield part 112 is mainly composed of copper, that is, the copper content is 70 wt%, preferably 90 wt%, and the thickness is preferably 0.1 μm or more and 5.0 μm or less. When the copper content is less than 90 wt% or when the thickness is less than 0.1 μm, the electrical resistance may increase. On the other hand, if the thickness exceeds 5.0 μm, it may be affected by residual stress during film formation.

  In addition, for the purpose of rust prevention of the metal thin film which comprises the shield part 112, addition of metal materials, such as Ni and Zn, or alloying is useful. It is also useful to make the shield portion 112 a plurality of metal layers. In this case, it is desirable to use a metal material such as Ni having excellent rust prevention properties for the outermost layer. The inner layer side is preferably made mainly of copper because it is useful for reducing the connection resistance between the substrate portion 103 and the exposed portion of the copper foil. Copper has a low electric resistance and excellent shielding properties (EMI and EMC). Further, by using titanium or the like on the inner layer side, adhesion with the substrate portion 103 (or the insulating layer 113) can be improved.

  As described above, the insulating layer 113 in which the core material is impregnated with the epoxy resin, the copper foil having the glossy surface 114 facing upward, the upward inner layer wiring 107, the glossy surface 114 facing downward, the downward inner layer wiring 109, and the upper surface wiring 106 And a back surface wiring 108, an electronic component 104 mounted on the top surface wiring 106, a mold portion 102 for mold-sealing the electronic component 104 on the substrate portion, A metal film formed by sputtering covering the upper inner layer wiring 107 exposed with the sagging portion 110, the lower inner layer wiring 109 exposed with the second sagging portion 111, and the surface of the sealing portion. The module 101 having the second sag portion 111 larger than the first sag portion 110 makes it possible to connect the metal film and the inner layer wiring serving as the ground. It can be a small, enhancing the shielding effect.

(Example 2)
Next, as a second embodiment, an example of a method for manufacturing the module 101 described in the first embodiment will be described with reference to FIGS.

  2A to 2E are cross-sectional views illustrating an example of a method for manufacturing the module 101. Reference numeral 116 denotes an arrow, and 117 denotes an adhesive layer. For example, it is useful to use a commercially available dicing tape. Reference numeral 118 denotes a dicing groove, which corresponds to a division groove formed by dicing.

  As indicated by an arrow 116 in FIG. 2A, the electronic component 104 is mounted on the substrate portion 103. Note that it is useful to mount a plurality of electronic components 104 on one large substrate portion 103 made of a glass epoxy resin substrate or the like and cut it later to form a plurality of modules 101 (not shown). Absent).

  FIG. 2B is a cross-sectional view illustrating a state in which the electronic component 104 is mounted on the substrate portion 103. The mounting method need not be limited to solder (not shown).

  FIG. 2C is a cross-sectional view showing a state where the mold part 102 is formed on the substrate part 103 on which the electronic component 104 is mounted. The mold part 102 can use a commercially available mold material (for example, an epoxy resin added with a ceramic filler 120 for adjusting a thermal expansion coefficient). In addition, it is useful to use a mold, a press, or a heating device (not shown) for the mold.

  Further, as shown in FIG. 2C, the sample obtained in this manner is fixed on the adhesive layer 117, so that division (or cutting) by a dicing apparatus (not shown) is facilitated.

  FIG. 2D is a cross-sectional view showing a state in which the sample created in FIG. 2C is divided (or cut) into predetermined dimensions by a dicing apparatus.

  FIG. 2E is a cross-sectional view illustrating a state in which a metal film to be the shield portion 112 is formed on the surface of the sample obtained in FIG. 2D using a sputtering apparatus (not shown). . In the state of FIGS. 2D to 2E, the individually divided (or cut) samples may be replaced with another adhesive layer 117.

  2A to 2E, the upper surface wiring 106 for mounting the electronic component 104, the back surface wiring 108, the upper inner layer wiring 107, the lower inner layer wiring 109, or the like, formed on the surface of the substrate portion 103. Solder resist and the like are not shown.

  As shown in FIG. 2, a plurality of electronic components 104 are mounted on a single substrate portion 103, and the whole is covered with a molding sealing material at one time to form one large sealing structure. It is useful to divide the sealing structure (for example, FIG. 2C) into a plurality of modules 101 by dividing (or cutting) it into a plurality of parts with a dicing apparatus or the like.

  Next, it will be described in more detail with reference to FIG. FIGS. 3A and 3B are cross-sectional views illustrating a state in which the substrate part 103 on which the electronic component 104 is mounted is divided using a dicing apparatus, in a partially enlarged manner. 3A shows a state before dicing, and FIG. 3B shows a state after dicing.

  As shown in FIG. 3A, the substrate portion 103 includes one or more upper inner wirings 107, one or more lower inner wirings 109, and a plurality of insulating layers 113 that connect these layers. Have. 3A and 3B, the upper surface wiring 106, the rear surface wiring 108, the solder resist 122, the via portion connecting the plurality of inner layers, and the like provided on the surface of the substrate portion 103 are not shown.

  In FIG. 3A, the upward inner layer wiring 107 has one or more layers with the glossy surface 114 facing the upper surface wiring 106 side (the upper surface wiring 106 is not shown) provided on the upper side of the substrate portion 103. However, the downward inner layer wiring 109 has one or more layers with the glossy surface 114 facing the back surface wiring 108 side (the back surface wiring 108 is not shown) provided on the lower side of the substrate portion 103. Built in.

  Next, as shown in FIG. 3B, a groove 121 is formed in the cross section on the insulating layer 113 side between the downward inner layer wiring 109 and the back surface wiring 108, so that the first sagging portion 110 The second sag portion 111 can be enlarged.

  FIG. 3B shows a state after dicing. As shown in FIG. 3A, a rotary blade (not shown) of the dicing apparatus is applied to the substrate portion 103 as shown by an arrow 116 to form a groove 121.

  In FIG. 3B, the first sag portion 110 is a sag portion generated on the glossy surface 114 of the upward inner layer wiring 107. Here, the sagging part is a part where a part of the copper foil becomes a sagging part (or a kind of burr part) with the rotation of the rotary blade of dicing.

  As shown in FIG. 3A, by providing the upper inner layer wiring 107 above the central portion of the substrate portion 103 (that is, on the upper surface wiring 106 side), a first sagging portion generated in the upper inner layer wiring 107 is obtained. 110 can be made larger than a sag portion (not shown) generated on the rough surface 115 side of the upward inner layer wiring 107. In this way, the first sag portion 110 provided on the glossy surface 114 side of the upward inner layer wiring 107 is made larger than the sag (not shown) provided on the rough surface 115 side, whereby the upward inner layer wiring 107. It is possible to increase the adhesion area between the cross section of the upper inner wiring 107 (including the first sagging part 110) and the shield part 112, while improving the adhesion between the insulating layer 113 and the insulating layer 113. it can.

  Further, as shown in FIG. 3B, the lower inner layer wiring 109 is provided below the central portion of the substrate portion 103 (that is, the back surface wiring 108 side), thereby generating the lower inner layer wiring 109 on the glossy surface 114 side. The sagging portion (not shown) generated on the rough surface 115 side of the lower inner layer wiring 109 and the sagging portion generated on the rough surface 115 side of the upper inner layer wiring 107 (see FIG. (Not shown) or larger than the first sag portion 110 provided on the glossy surface 114 side of the upward inner layer wiring 107. Thus, by making the second sagging portion 111 provided on the glossy surface 114 side of the downward inner layer wiring 109 larger than these sagging portions, the contact area between the lower inner layer wiring 109 and the shield portion 112 is increased. Can be bigger. This is because, when the shield part 112 is formed by sputtering, the metal film thickness is thinner on the lower side (that is, the wiring side) than the upper side (that is, the upper surface wiring 106 side or the mold part 102 side) of the substrate part 103, and the sheet This is useful for solving the problem of increasing resistance.

  As described above, the circuit board has at least the upward inner layer wiring 107 with the glossy surface 114 facing upward, the downward inner layer wiring 109 with the glossy surface 114 facing downward, the upper surface wiring 106, and the back surface wiring 108. (Or substrate part 103) mounting process for mounting electronic component 104, resin molding of electronic component 104 on the circuit board to form a mold structure, and dicing apparatus for molding structure A method of manufacturing the module 101, comprising: a cutting step of cutting into a plurality of parts using a metal film; and a metal film step of forming a metal film covering five surfaces of the cut product obtained in the cutting step by sputtering, In the cutting process, the first sag portion 110 is formed on the upper inner layer wiring, and the second sag portion 111 larger than the first sag portion is formed on the lower inner layer wiring. In the metal film process, the first sag portion 110 is formed. And upward inner wiring having a section 110, to a downward inner wiring having a second sagging portion, by forming the metal film at a time, it is possible to manufacture a highly shielding module 101.

(Example 3)
An example of the prototype by the inventors of the module 101 described in the first and second embodiments will be described using the third embodiment.

  FIG. 4 is an example of a cross-sectional photograph taken by the SEM (scanning electron microscope) of the module 101 created by the inventors. In FIG. 4, 119 is a glass fiber, 120 is a filler, 121 is a groove, and 122 is a solder resist. In FIG. 4, the top electrode, the back electrode, the electronic component 104, the mold part 102, and the like are not shown.

  As shown in FIG. 4, the module 101 includes an insulating layer 113 in which a core material (for example, glass fiber 119) is impregnated with an epoxy resin, a copper foil with a glossy surface 114 facing upward, an upward inner layer wiring 107, and a glossy surface 114. A circuit board having a downward inner layer wiring 109 facing downward, an upper surface wiring 106, and a back surface wiring 108, an electronic component 104 (not shown) mounted on the upper surface wiring 106, and the electronic component 104 A mold part 102 (not shown) for mold-sealing on the circuit board, the upward inner layer wiring 107 exposed with the first sag part 110 in the cross section, and a second sag part 111 A sputtered metal film covering the exposed lower inner layer wiring 109 and the surface of the sealing portion is provided.

  Then, a groove 121 is provided on the side surface of the insulating layer 113 constituting the module 101, and the second sag portion 111 is enlarged by filling the groove 121 with a part of the downward inner layer wiring 109. Furthermore, it is useful to make the second sag portion 111 larger than the first sag portion 110 by providing a plurality of grooves 121 in the cross section of the insulating layer 113 between the downward inner layer wiring 109 and the back surface wiring 108. It is. This is because when the metal film that becomes the shield portion 112 is formed by sputtering, the shield portion 112 becomes thinner and the sheet resistance of the shield portion 112 increases on the lower side (that is, the back surface wiring 108 side). This is because it becomes difficult to connect to the copper foil.

  In FIG. 4, it is desirable to provide a plurality of grooves 121 on the side surface (or dicing groove 118) of the substrate portion 103 (or insulating layer 113). Note that the term “plurality” includes a case where a part of one groove 121 is branched into a plurality of branches. Even if there is only one groove 121, it is easy to fill the groove 121 with a part of the copper foil and to improve the adhesion (or anchor effect) with the insulating layer if it is branched into a plurality of grooves. This is because an effect is obtained.

  The grooves 121 are preferably provided on the four side surfaces (or the surfaces facing the four dicing grooves 118) of the substrate portion 103, respectively. By doing so, it becomes easy to fill the groove 121 with a part of the copper foil on all the side surfaces of the module 101, and the effect of improving the adhesion (or anchor effect) with the insulating layer 113 can be obtained.

  The groove 121 is formed on the insulating layer 113 side, in particular, in the cross section on the insulating layer 113 side between the downward inner layer wiring 109 and the back surface wiring 108 (the back surface electrode is not shown). It is useful to do.

  It is useful to actively provide the groove 121 in the insulating layer 113 between the downward inner layer wiring 109 and the back surface wiring 108. Further, by filling this groove 121 with a part of the downward inner layer wiring 109 as the second sag part 111, the second sag part 111 can be enlarged, and the shield part 112 and the downward inner layer wiring 109 can be enlarged. Connection resistance can be reduced.

  Further, by using the groove 121 (that is, by filling or pushing a part of the copper foil constituting the downward inner layer wiring 109 into a part of the groove 121 at the time of dicing), the second sag portion 111 is formed. Can be increased more effectively.

  Needless to say, the use of the groove 121 makes it easier to make the second sag portion 111 larger than the first sag portion 110.

  Note that a part of the shield part 112 may enter the groove 121, but the groove 121 does not need to be filled with a metal film to be the shield part 112.

  In FIG. 4, the magnification is 200 times, and the H-type scale has a length of 100 μm.

  5A to 5C are partially enlarged photographs of FIG. 4, respectively. FIG. 5A is an enlarged view of a connecting portion between the upward inner layer wiring 107 shown in FIG. As shown in FIG. 5A, by providing the first sag portion 110 on the glossy surface 114 side of the upward inner layer wiring 107, the adhesion area between the upward inner layer wiring 107 and the metal film to be the shield portion 112. And the mutual adhesion strength and contact resistance can be reduced. Although a sagging portion (no number is given) may be provided on the rough surface 115 side of the upward inner layer wiring 107, it is desirable that the size of the sagging portion is suppressed to about the rough surface 115. This is because the first sag portion 110 uses the low adhesion between the glossy surface 114 side of the upward inner layer wiring 107 and the insulating layer 113 in contact with the glossy surface 114 side.

  FIG. 5B is an enlarged view of a connection portion between the downward inner layer wiring 109 shown in FIG. 4 and the shield portion 112. As shown in FIG. 5B, by providing the second sag portion 111 on the glossy surface 114 side of the downward inner layer wiring 109, the adhesion area between the upper inner wiring 107 and the metal film to be the shield portion 112 And the mutual adhesion strength and contact resistance can be reduced. Although a sagging portion (no number is given) may be provided on the rough surface 115 side of the downward inner layer wiring 109, the size of the sagging portion is desirably suppressed to about the rough surface 115. This is because the second sag portion 111 uses the low adhesion between the glossy surface 114 side of the upward inner layer wiring 107 and the insulating layer 113 in contact with the glossy surface 114 side.

  Also, it is useful to provide a groove 121 and fill a part of the groove 121 with a part of the downward inner layer wiring 109 as the second sag portion 111.

  As shown in FIG. 5B, the groove 121 uses a kind of cracks (or cracks), and further growth is suppressed by the glass fiber 119 incorporated in the insulating layer 113. Therefore, it does not affect the reliability.

  FIG. 5C is an enlarged view of the scale shown in FIG. 4, and the H-type scale is 100 μm. As shown in FIG. 5, the maximum length of the groove 121 is preferably 200 μm or less (preferably 100 μm or less), and the thickness (or height) of the groove 121 is preferably 50 μm or less (preferably 30 μm or less). When the maximum length of the groove 121 exceeds 200 μm or the thickness exceeds 50 μm, the suppression effect by the glass fiber 119 may be reduced.

  6A to 6C are schematic diagrams of FIGS. 5A to 5C, respectively.

  FIG. 6A is a schematic diagram of a connection portion between the upward inner layer wiring 107 and the shield portion 112 shown in FIG. As shown in FIG. 6A, by providing the first sag portion 110 on the glossy surface 114 side of the upward inner layer wiring 107, the adhesion area between the upward inner layer wiring 107 and the metal film serving as the shield portion 112. And the mutual adhesion strength and contact resistance can be reduced. Although a sagging portion (no number is given) may be provided on the rough surface 115 side of the upward inner layer wiring 107, it is desirable that the size of the sagging portion is suppressed to about the rough surface 115. This is because the first sag portion 110 uses the low adhesion between the glossy surface 114 side of the upward inner layer wiring 107 and the insulating layer 113 in contact with the glossy surface 114 side.

  FIG. 6B is a schematic diagram of a connection portion between the downward inner layer wiring 109 and the shield portion 112 shown in FIG. As shown in FIG. 6B, by providing the second sagging portion 111 on the glossy surface 114 side of the downward inner layer wiring 109, the adhesion area between the upper inner wiring 107 and the metal film to be the shield portion 112 And the mutual adhesion strength and contact resistance can be reduced. Although a sagging portion (no number is given) may be provided on the rough surface 115 side of the downward inner layer wiring 109, the size of the sagging portion is desirably suppressed to about the rough surface 115. This is because the second sag portion 111 uses the low adhesion between the glossy surface 114 side of the upward inner layer wiring 107 and the insulating layer 113 in contact with the glossy surface 114 side.

  Also, it is useful to provide a groove 121 and fill a part of the groove 121 with a part of the downward inner layer wiring 109 as the second sag portion 111.

  As shown in FIG. 6B, the groove 121 is a case where a kind of crack (or crack) is used, and the glass fiber 119 incorporated in the insulating layer 113 suppresses further growth. Therefore, it does not affect the reliability.

  FIG. 6C is an enlarged view of the scale shown in FIG. 5C, and the H-type scale indicates 100 μm. As shown by an arrow 116 in FIG. 6C, the maximum length of the groove 121 is 200 μm or less (preferably 100 μm or less), and the thickness (or height) of the groove 121 is 50 μm or less (preferably 30 μm or less). . When the maximum length of the groove 121 exceeds 200 μm or the thickness exceeds 50 μm, the suppression effect by the glass fiber 119 may be reduced.

  The module of the present invention and the manufacturing method thereof can improve the connection stability between the metal film formed by sputtering serving as the shield part and the downward inner layer wiring serving as the ground electrode of the module, and leakage noise from the substrate part can be reduced. By effectively reducing the module, the module is excellent in EMI and EMC characteristics, and it is possible to realize downsizing, high-density mounting, and narrow adjacent mounting of electronic devices.

DESCRIPTION OF SYMBOLS 101 Module 102 Mold part 103 Board | substrate part 104 Electronic component 105 Solder part 106 Upper surface wiring 107 Upward inner layer wiring 108 Back surface wiring 109 Downward inner layer wiring 110 1st sag part 111 2nd sag part 112 Shield part 113 Insulating layer 114 Glossy Surface 115 Rough surface 116 Arrow 117 Adhesive layer 118 Dicing groove 119 Glass fiber 120 Filler 121 Groove 122 Solder resist

Claims (3)

An insulating layer impregnated with an epoxy resin in a core material, a copper foil having a glossy surface facing upward upward inner layer wiring, a glossy surface facing downward downward inner layer wiring, a top surface wiring, and a back surface wiring; ,
Electronic components mounted on the upper surface wiring;
A mold part for mold-sealing the electronic component on the substrate part;
Sputtered metal that covers the upper inner layer wiring exposed with the first sagging portion in the cross section, the lower inner layer wiring exposed with the second sagging portion, and the surface of the sealing portion. A module having a membrane,
A module in which the second sag part is larger than the first sag part. 2. The module according to claim 1, wherein the first sag portion and the second sag portion are provided on the glossy surface of an inner layer wiring made of a copper foil having a glossy surface and a rough surface. at least,
Mounting process for mounting electronic components on a substrate portion having a copper foil with a glossy surface facing upwards, an upward inner layer wiring, a glossy surface facing downwards inner layer wiring, a top surface wiring, and a back surface wiring,
A sealing step of resin molding the electronic component on the substrate portion to form a mold structure;
A cutting step of cutting the mold structure into a plurality of pieces using a dicing apparatus;
A metal film step of forming a metal film covering five surfaces of the cut product obtained in the cutting step by sputtering; and
A method of manufacturing a module having
By the cutting step, a first sag portion is formed on the upward inner layer wiring, and a second sag portion is formed on the lower inner layer wiring that is larger than the first sag portion,
In the metal film step, a method of manufacturing a module in which the metal film is formed on the upward inner layer wiring having the first sagging portion and the downward inner layer wiring having the second sagging portion.