JP2011159754A - Electronic component protective cover and protective structure for the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To prevent intrusion of dust and impurities from between a lead cover covering a lead and a circuit board. <P>SOLUTION: An electronic component protective cover includes a protective cover 11 having an electronic component 1 mounted on a circuit board 4, and a cylindrical lead cover 12 covering a lead 3 of the electronic component 1. A bellow 14 is provided to the lead cover 12 in order to configure the lead cover 12 to be freely telescopic. The lead cover 12 is expanded/contracted so as to prevent generation of a gap against the circuit board 4 and to prevent intrusion of dust and impurities into the protective cover 11. A body cover 13 is provided so as to cover a body 2 of the electronic component 1, thereby also protecting the body 2 of the electronic component 1. The protective cover 11 has insulation properties, and the electronic component 1 is insulated from the outside. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

  The present invention relates to an electronic component protective cover including a cylindrical lead cover portion that covers a lead of an electronic component mounted on a circuit board, and a protective structure thereof.

  Conventionally, in order to maintain insulation between an electronic component erected on a substrate and a radiating plate erected in contact with the electronic component in order to dissipate heat generated from the electronic component. In addition, an electronic component insulation structure (for example, Patent Document 1) in which a tube is covered with the electronic component has been proposed.

JP 2000-182840 A

  In the electronic component insulation structure, insulation can be maintained by covering the electronic component with a tube, but dust, dust, impurities, etc. enter the gap between the lower end of the tube and the substrate and lead the electronic component. If they adhere to each other, there is a possibility that the terminals are short-circuited.

  The present invention has been made paying attention to each of the above problems, and provides a protective structure for an electronic component that can prevent intrusion of dust, dirt, and impurities from between a lead cover portion covering a lead and a circuit board. Its purpose is to provide.

  In order to achieve the above object, the protective cover of the present invention is a protective cover provided with a cylindrical lead cover portion that covers leads of electronic components mounted on a circuit board, and the lead cover portion is extendable. .

  In the protective cover, the lead cover part has elasticity.

  In the protective cover, the lead cover portion has a bellows portion.

  The protective cover includes a main body cover portion that covers at least a part of the main body of the electronic component.

  Further, the above protective cover has an insulating property.

  The electronic component protection structure of the present invention uses the protective cover according to any one of claims 1 to 3, and the electronic component mounted on the circuit board and the lead cover portion that covers the lead of the electronic component With.

  In the electronic component protection structure, the end portion of the lead cover portion is elastically brought into contact with the circuit board.

  The electronic component protection structure includes a main body cover portion that covers at least a part of the main body of the electronic component, and the main body cover portion is provided integrally with the lead cover portion.

  In the electronic component protection structure, a heat sink is provided on the circuit board, the main body cover portion is insulative, and the main body cover portion is interposed between the heat sink and the main body of the electronic component.

  In the electronic component protection structure, a heat sink is provided on the circuit board, the main body cover portion is cylindrical, the protective cover is attached to the electronic component, the protective cover, the electronic component, and the heat sink. Were fixed by fixing means.

  In the protective structure for electronic parts, the fixing means is a clamping means.

  In the electronic component protection structure, the lead cover portion is bonded to the circuit board.

  According to the protective cover of the electronic component and the protective structure of the present invention, the lead cover part is expanded and contracted to prevent a gap between the circuit board and the short circuit between the terminals due to adhesion of dust, dirt, impurities, etc. Can be prevented.

  In the protective cover for the electronic component, the gap between the circuit board and the circuit board can be prevented by expanding and contracting the lead cover portion.

  Further, since the lead cover part has elasticity, the lead cover part can be expanded and contracted.

  Further, since the lead cover part has the bellows part, the lead cover part can be expanded and contracted.

  Further, the main body of the electronic component can be protected by the main body cover portion.

  Moreover, since it has insulation, insulation from the outside can be achieved by a protective cover.

  In the electronic component protection structure, the lead of the electronic component mounted on the circuit board can be protected by the lead cover portion.

  Further, since the end portion of the lead cover portion elastically contacts the circuit board, it is possible to effectively prevent a gap from being formed with the circuit board.

  In addition, since the main body cover portion that covers at least a portion of the main body of the electronic component is provided and the main body cover portion is provided integrally with the lead cover portion, a portion of the main body can be protected in addition to the leads.

  In addition, since the circuit board is provided with a heat sink, the main body cover portion is insulative, and the main body cover portion is interposed between the heat sink and the main body of the electronic component, thereby ensuring insulation between the heat sink and the main body. be able to.

  Further, the electronic component can be protected by the protective cover, and the electronic component equipped with the protective cover can be fixed to the heat sink, and the heat generated from the electronic component can be radiated from the heat sink.

  Further, since the fixing means is the clamping means, the protective cover, the electronic component, and the heat sink can be clamped and fixed.

  Further, by adhering the lead cover part to the circuit board, it is possible to reliably prevent the generation of a gap.

It is a side view which shows Example 1 of this invention, FIG. 1 (A) is an exploded side view, FIG.1 (B) is a side view of a protection structure. It is drawing which shows Example 2 of this invention, FIG. 2 (A) is a side view, FIG.2 (B) is a front view. It is a side view of the protective cover before attachment same as the above. It is drawing which shows Example 3 of this invention, FIG. 4 (A) is a side view, FIG.4 (B) is a front view. It is a side view of the protective cover before attachment same as the above. It is drawing which shows Example 4 of this invention, FIG. 4 (A) is a side view, FIG.4 (B) is a front view. It is a front view which shows Example 5 of this invention. It is a front view of the state which decomposed | disassembled the protective cover before attachment same as the above. It is a front view of the protective cover which shows Example 6 of this invention, FIG. 9 (A) shows before use and FIG. 9 (B) shows a use condition. FIG. 10A is a side view and FIG. 10B is a front view. It is a front view of the protective cover which shows Example 7 of this invention, FIG. 10 (A) shows before use and FIG. 10 (B) shows a use condition.

  Hereinafter, preferred embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a protective structure for an electronic component proposed in the first embodiment. As shown in the figure, reference numeral 1 denotes an electronic component such as a semiconductor element, and a plurality of leads 3 made of a conductive member are arranged in parallel at a lower portion of a main body 2 serving as a heat source. Further, the electronic component 1 is mounted on the circuit board 4 by inserting the lead 3 into the through hole 5 of the circuit board 4 and soldering the lead 3 by a soldering portion (not shown).

  The main body 2 is provided with a heat radiating terminal 7. Further, the circuit board 4 is provided with a heat sink 8, and the heat sink 8 is made of a copper plate or the like having excellent thermal conductivity. The heat of the main body 2 is transmitted from the heat radiating terminal 7 to the heat sink 8. Is released to the outside.

  Reference numeral 11 denotes a protective cover that covers the electronic component 1. The protective cover 11 has a rectangular tube shape, and a lead cover portion 12 that covers the lead terminal 3 and a main body cover portion 13 that covers the main body 2 are integrated. Have. The lead cover portion 12 has a bellows portion 14 in which peaks and valleys are alternately formed on almost the entire length thereof, and has a structure that can be expanded and contracted by the bellows portion 14. In addition, the main body cover portion 13 is larger than the main body 2 and a gap is formed between the main body cover portion 13 and the main body 2 in the mounted state. Similarly, the lead cover portion 12 is larger than the lead 3 and in the mounted state, A gap is formed between the cover portion 12 and the lead 3, and the electronic component 1 on the circuit board 4 is accommodated in the protective cover 11. Furthermore, the protective cover 11 is made of a material having electrical insulation, a material having high thermal conductivity, a material having heat insulation and high thermal conductivity, and is exemplified by silicone resin, depending on use conditions. . The protective cover 11 is formed longer than the use state, and has an elastic restoring force that tends to extend after contraction. In addition, the lead cover part 12 may be formed from a shape memory material, for example, a shape memory resin, and the lead cover part 12 may be configured to extend at a temperature in use from a temperature before use.

  Reference numeral 15 denotes a clamp as a sandwiching member, which has a spring property by forming a spring material or the like into a substantially U shape, and the protective cover 11 is covered by the clamp 15 in a state where the protective cover 11 is covered on the electronic component 1. The electronic component 1 covered with 11 and the heat sink 8 are clamped and fixed.

  Then, the electronic component 1 is covered with a protective cover 11, the lower end of the protective cover 11 is brought into contact with the circuit board 4, and is further pressed against the circuit board 4, whereby the bellows portion 14 is contracted. Thus, no gap is generated between the lower end of the lead cover portion 12 and the circuit board 4, and entry of dust, dirt, and impurities from between the lead cover portion 12 and the circuit board 4 can be prevented. it can. In this embodiment, the end portion of the lead cover portion 12 and the circuit board 4 are bonded. In each of the following embodiments, the end portion of the lead cover portion 12 and the circuit board 4 may be bonded. As described above, since the end portion of the lead cover portion 12 and the circuit board 4 can be reliably closed, it is not necessary to fill the molding material between the protective cover 11 and the electronic component 1.

  The electronic component 1 and the heat sink 8 are clamped and fixed by the clamp 15 with the protective cover 11 mounted as described above. As a result, the main body 2 of the electronic component 1 is in close contact with the heat sink via the main body cover portion 13. Further, by bringing the upper end of the protective cover 11 into contact with the clamp 15, it is possible to reliably prevent the protective cover 11 from being displaced upward even when the elastic restoring force of the bellows portion 14 is applied.

  As described above, in this embodiment, the protective cover 11 includes the cylindrical lead cover portion 12 that covers the leads 3 of the electronic component 1 mounted on the circuit board 4, and the lead cover portion 12 is extendable. By expanding and contracting the lead cover portion 12, it is possible to prevent the gap between the circuit board 4 and the circuit board 4.

  In the present embodiment, the lead cover portion 12 has elasticity, so that the lead cover portion 12 can be expanded and contracted.

  Further, in the present embodiment, since the lead cover portion 12 has the bellows portion 14, the lead cover portion 12 can be expanded and contracted by the bellows portion 14.

  In the present embodiment, since the main body cover portion 13 that covers at least a part of the main body 2 of the electronic component 1 is provided, at least a part of the main body 2 of the electronic component 1 can be protected.

  Further, in this embodiment, since the protective cover 11 has an insulating property, the electronic component 1 can be insulated from the outside.

  Further, in this embodiment, since the protective cover 11 is used and the electronic component 1 mounted on the circuit board 4 and the lead cover portion 12 covering the leads 3 of the electronic component 1 are provided, the electronic components mounted on the circuit board 4 are provided. The lead 3 of the component 1 can be protected by the lead cover portion 12.

  Further, in the present embodiment, since the end portion of the lead cover portion 12 is elastically contacted with the circuit board 4, it is possible to effectively prevent a gap between the lead cover portion 12 and the circuit board 4. .

  Further, in this embodiment, the main body cover portion 13 that covers at least a part of the main body 2 of the electronic component 1 is provided, and the main body cover portion 13 is provided integrally with the lead cover portion 12. Some can be protected.

  In the present embodiment, the circuit board 4 is provided with the heat sink 8, the main body cover portion 13 has an insulating property, and the main body cover portion 13 is interposed between the heat sink 8 and the main body 2 of the electronic component 1. Insulation between 8 and the main body 2 can be ensured.

  In this embodiment, the circuit board 4 is provided with a heat sink 8, the main body cover portion 13 is cylindrical, the protective cover 11 is attached to the electronic component 1, and the protective cover 11, the electronic component 1, and the heat sink 8 are fixed. Since the electronic component 1 is protected by the protective cover 11, the electronic component 1 with the protective cover 11 attached thereto is fixed to the heat sink 8 and the heat generated from the electronic component 1 is dissipated from the heat sink 8. Can do.

  In this embodiment, since the fixing means is the clamp 15 as the clamping means, the protective cover 11, the electronic component 1, and the heat sink 8 can be clamped and fixed.

  In this embodiment, since the lead cover portion 12 is bonded to the circuit board 4, the generation of a gap between the lead cover portion 12 and the circuit board 4 can be reliably prevented by bonding the lead cover portion 12 to the circuit board 4. Can do.

  2 to 3 show a second embodiment of the present invention, in which the same parts as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In this example, the protective cover 11 integrally includes a lead cover portion 12 and a main body cover portion 13A that covers a part of the main body 2, and has an insulating property and a high thermal conductivity.

  Further, the main body cover portion 13A is integrally provided with a sheet portion 21 disposed between the heat sink 8 and the main body 2 and a connecting portion 22 for connecting the sheet portion 21 and the lead cover portion 12 to each other. The portion 22 has an insertion hole 23 through which the lead 3 is inserted.

  FIG. 3 shows the protective cover 11 before installation. As shown in FIG. 2, the lead cover portion 12 is sandwiched between the circuit board 4 and the main body 2 so that the lead cover portion 12 is attached in a contracted state. The lower end of the lead cover portion 12 is elastically in contact with the upper surface of the circuit board 4 due to the elastic restoring force.

  The main body 2 of the electronic component 1 is fixed to the heat sink 8 by a clamp 24 that is a fixing means. The clamp 24 includes a substantially L-shaped presser portion 24A and a mounting portion 24B provided integrally with the presser portion 24A. The mounting portion 24B is fixed to the heat sink 8 with screws 25, so that the holding portion 24A presses and fixes the main body 2 to the heat sink 8.

  As described above, in this embodiment as well, the lead cover portion 12 can be expanded and contracted similarly to the above-described embodiment, so that the generation of a gap between the circuit board 4 can be prevented by expanding and contracting the lead cover portion 12. In this example, the sheet portion 21 of the main body cover portion 12 can insulate the main body 2 from the heat sink 8, and the heat of the main body 2 can be transferred to the heat sink 8 by the sheet portion 21 having high thermal conductivity. Can escape.

  FIGS. 4-5 shows Example 3 of this invention, attaches | subjects the same code | symbol to the same part as said each Example, and abbreviate | omits the detailed description and explains in full detail.

  In this example, the protective cover 11 includes a lead cover portion 12, and the lower end of the lead cover portion 12 is in contact with the upper surface of the circuit board 4 step by step. In this case, it is preferable that the upper end of the lead cover portion 12 is bonded to the main body 2 and the lower end of the lead cover portion 12 is bonded to the circuit board 4, and the upper end and the lower end of the lead cover portion may be bonded in each embodiment. .

  In addition, the main body 2 has an insulating property, and the main body 2 is fixed to the heat sink 8 by screwing a screw 26 inserted through the main body 8 into the heat sink 8 in a state where the main body 2 is in contact with the heat sink 8. Yes. In this case, the screw 26 is a fixing means.

  As described above, in this embodiment as well, the lead cover portion 12 can be expanded and contracted similarly to the above-described embodiment, so that the generation of a gap between the circuit board 4 can be prevented by expanding and contracting the lead cover portion 12. In addition, the protective cover 11 formed of the lead cover portion 12 can be sandwiched between the main body 2 and the circuit board 4 in this way, thereby preventing a gap from being generated.

  FIG. 6 shows a fourth embodiment of the present invention, in which the same parts as those in the above-described embodiments are denoted by the same reference numerals, and detailed description thereof is omitted.

  In this example, similarly to the third embodiment, the protective cover 11 includes a lead cover portion 12S, and the lead 3 at the center of the plurality of leads 3, 3, 3 is covered with the lead cover portion 12S. The lead cover portion 12S covers a single lead 3, and the lead cover portion 12 covers a plurality of leads 3.

  As described above, in the present embodiment as well, the lead cover portion 12S can be expanded and contracted similarly to the above-described embodiment. Therefore, the generation of a gap between the circuit board 4 can be prevented by expanding and contracting the lead cover portion 12S. In addition, by covering the lead 3 between the leads 3 and 3 with the protective cover 11 as described above, a short circuit between the leads 3 and 3 can be prevented.

  FIGS. 7-8 shows Example 5 of this invention, attaches | subjects the same code | symbol to the same part as said each Example, and abbreviate | omits the detailed description.

  In this example, a plurality of protective covers 11, 11 are used, and these protective covers 11, 11 are composed of lead cover portions 12, 12 S, and the central lead among the plurality of leads 3 arranged by the protective cover 11 shown in the fourth embodiment. 3 and a plurality of leads 3, 3 and 3 are covered with the protective cover 11, and the lead cover portions 12 and 12S of the protective covers 11 and 11 have a double structure.

  Further, it is preferable that the upper ends of the lead cover portions 12 and 12S are bonded to the main body 2, and the lower ends of the lead cover portions 12 and 12S are bonded to the circuit board 4. In each embodiment, the upper ends and lower ends of the lead cover portions are bonded. May be.

  As described above, in this embodiment as well, the lead cover portion 12 can be expanded and contracted similarly to the above-described embodiment, so that the generation of a gap between the circuit board 4 can be prevented by expanding and contracting the lead cover portion 12. Further, the dust cover effect is improved by the double structure of the lead cover portions 12 and 12S of the protective covers 11 and 11 as described above.

  FIGS. 9-10 shows Example 6 of this invention, attaches | subjects the same code | symbol to the same part as said each Example, the detailed description is abbreviate | omitted and explained in full detail.

  In this example, the lead cover part 12 is formed from a stretchable material, the lead cover part 12 is formed longer than the use state, and no bellows part is provided.

  Then, the lead cover part 12 before use in FIG. 9A is sandwiched between the main body 2 and the circuit board 4 and contracted, so that the lead cover portion 12 is used as shown in FIG. 9B and FIG. The cover portion 12 can be contracted to prevent a gap with the circuit board 4 from being generated.

  Thus, also in this embodiment, since the lead cover portion 12 can be expanded and contracted, the same operations and effects as the above-described embodiments are achieved.

  FIG. 11 shows a seventh embodiment of the present invention, in which the same reference numerals are given to the same portions as those in the above-described embodiments, and detailed description thereof is omitted.

  In this example, the lead cover portion 12 is formed from a material having elasticity, and the lead cover portion 12 is formed shorter than the use state, and no bellows portion is provided.

  Then, the lead 3 is covered with the lead cover portion 12 before use in FIG. 11A, and the lead cover portion 3 is pulled as shown in FIG. 11B, whereby the lower end of the lead cover portion 12 and the circuit board 4 are pulled. The gap is closed and the lower end of the lead cover part 3 is bonded to the circuit board 4. Note that the usage state of the lead cover portion 12 is the same as that of FIG.

  Thus, also in this embodiment, since the lead cover portion 12 can be expanded and contracted, the same operations and effects as the above-described embodiments are achieved.

  The present invention is not limited to this embodiment, and various modifications can be made within the scope of the gist of the present invention. For example, the protective cover may be an oval shape or the like other than the square shape. Moreover, although the bellows part which has a trough and a mountain alternately was shown in the Example, a bellows part may be a waveform.

DESCRIPTION OF SYMBOLS 1 Electronic component 2 Main body 3 Lead 4 Circuit board 8 Heat sink 11 Protective cover 12, 12S Lead cover part 13 Main body cover part 14 Bellows part 15 Clamp (clamping means / fixing means)
24 Clamp (Clamping / fixing)
26 Screws (fixing means)

Claims (12)

An electronic component protective cover comprising a cylindrical lead cover portion covering a lead of an electronic component mounted on a circuit board, wherein the lead cover portion is extendable. The protective cover for an electronic component according to claim 1, wherein the lead cover portion has elasticity. The protective cover for electronic parts according to claim 2, wherein the lead cover part has a bellows part. The electronic component protective cover according to claim 1, further comprising a main body cover portion that covers at least a part of the main body of the electronic component. It has insulation, The protective cover of the electronic component of any one of Claims 1-4 characterized by the above-mentioned. An electronic component comprising the electronic component mounted on the circuit board using the protective cover according to any one of claims 1 to 3, and the lead cover portion covering a lead of the electronic component. Protection structure. The electronic component protection structure according to claim 6, wherein an end portion of the lead cover portion is elastically contacted with the circuit board. 8. The protection structure for an electronic component according to claim 6, further comprising a main body cover portion that covers at least a part of the main body of the electronic component, and the main body cover portion is provided integrally with the lead cover portion. 9. The electronic component according to claim 8, wherein a heat sink is provided on the circuit board, the main body cover portion is insulative, and the main body cover portion is interposed between the heat sink and the main body of the electronic component. Protection structure. A heat sink is provided on the circuit board, the main body cover portion is cylindrical, the protective cover is attached to the electronic component, and the protective cover, the electronic component, and the heat sink are fixed by a fixing means. The protective structure for an electronic component according to claim 8. 11. The protection structure for an electronic component according to claim 10, wherein the fixing means is a clamping means. The protection structure for an electronic component according to claim 6, wherein the lead cover portion is bonded to the circuit board.

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