JP2000182840A - Insulating structure of electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an inexpensive insulating structure which is easy to mount a bracket for fixing a tube, an electronic component and a heat sink and is capable of preventing the tubes from tearing, when the tube for insulating an electronic component and a heat sink is in touch with a corner of the electronic component. SOLUTION: In an insulating structure, an electronic component 2 is covered with a tube 4 to keep insulation between the electronic component 2 mounted upright on a board 1 and a heat sink 3 which is mounted upright in the vicinity of the electronic component 2 for radiating heat from the electronic component 2. While a sheet material 6 is fitted to corners 2b and 2c of the electronic component 2, the electronic component 2 is covered with the tube 4 for keeping insulated state of the electronic component 2 and the heat sink 3. A bracket 5 with a visible substantially U-shaped side face is pushed and fixed straddled over the sides of the tube 4, the electronic component 2 and the heat sink 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a semiconductor device, comprising the steps of: providing an electronic component standing on a substrate and a heat radiating plate standing near the electronic component to radiate heat generated from the electronic component; The present invention relates to an insulation structure of an electronic component that maintains insulation.

[0002]

2. Description of the Related Art Generally, insulation is maintained between an electronic component standing on a substrate and a heat radiating plate standing near the electronic component to radiate heat generated from the electronic component. In order to achieve this, the electronic components are covered with a tube, and then these electronic components and the heat sink are fixed with brackets. Therefore, conventionally, when the bracket is attached, a jig for expanding the bracket is used, or the electronic component is sandwiched between the brackets from the lateral direction.

[0003] However, there has been a problem that the tube is broken by hitting the corner of the electronic component by being pinched by the bracket. In addition, since a jig is conventionally used to extend the bracket, there is a problem that the work is difficult to perform and the workability varies. Further, in the case where the bracket is sandwiched from the side of the electronic component, screws and the like for fixing the bracket are required, so that the number of components is increased, and the electronic component has a sharp portion in the horizontal direction. Therefore, there is a problem that the tube hits the sharp part and is torn by the pinching of the bracket from the lateral direction.

Japanese Utility Model Publication No. 60-3573 discloses that
Electrical equipment windings are described. This is shown in FIG.
As shown in (b), a plurality of insulating spacers 102 are interposed between the winding layers of the winding 101. However,
In this case, since there is an edge at a corner of the spacer 102, there is a problem that the winding may be damaged by the edge. Moreover, there is a problem that the number of the spacers 102 is large, and the work of interposing the spacers 102 between the winding layers of the winding 101 is very troublesome.

[0005]

SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and in order to maintain insulation between an electronic component and a heat sink, a tube which covers the electronic component is broken by hitting a corner of the electronic component. It is another object of the present invention to provide an electronic component insulating structure in which the mounting operation of a bracket for fixing the tube and the electronic component to the heat sink is simple, and the cost is not increased.

[0006]

According to a first aspect of the present invention, there is provided an electronic component installed on a substrate, and an electronic component for radiating heat generated from the electronic component. An electronic component insulating structure in which a tube is placed on the electronic component in order to maintain insulation between the electronic component and a heat sink erected in a vicinity of the component, wherein a sheet abuts on a corner of the electronic component. The electronic component and the heat sink are kept insulated from each other by covering the tube in a state where the material is provided.

According to a second aspect of the present invention, a substantially U-shaped bracket in a side view is sandwiched between the tube, the electronic component, and the heat sink from above the tube covering the electronic component. It is characterized by being attached and fixed. The invention according to a third aspect is characterized in that the sheet material is made of a synthetic resin-made flat plate having elasticity. The invention according to claim 4 is characterized in that the electronic component has at least one or more corners on the surface thereof, and the sheet material is in contact with each of these corners.

[0008]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an embodiment of an electronic component insulating structure according to the present invention. 1A and 1B show an insulating structure of an electronic component according to an embodiment of the present invention. FIG. 1A is a front view of the electronic component in an exploded state, FIG. FIG. 3 is an enlarged front view showing a state immediately before the tube of the main part of the insulating structure of the electronic component according to the embodiment is put on.

The insulation structure of the electronic component of the present embodiment is shown in FIG.
(A) As shown in (b), an I which is erected on the substrate 1 and has a step 2a and two upper and lower corners 2b, 2c are formed.
C, an electronic component 2, a heat radiating plate 3 erected near the electronic component 2 to radiate heat generated from the electronic component 2, and insulation between the electronic component 2 and the heat radiating plate 3. Square tube 4 placed on electronic component 2 to maintain
And a substantially U-shaped bracket 5 that is placed over the tube 4 placed on the electronic component 2 so as to straddle the tube 4, the electronic component 2, and the heat sink 3.

In this embodiment, the electronic component 2 is made of a sheet material 6 made of an elastic flat plate made of an insulator such as a synthetic resin.
After being arranged so as to come into contact with each of the corners 2b, 2c, as shown in FIG. 2, this electronic component 2 is covered with a sheet material 6 with a tube 4, and then a bracket 5 is sandwiched and fixed. Like that. In the electronic component insulation structure of the present embodiment, the sheet material 6 is applied to the corners 2 b and 2 c of the electronic component 2.
Since the tube 4 is arranged so as to be in contact with the electronic component 2, the tube 4 does not directly contact the corners 2 b and 2 c of the electronic component 2. Can be prevented.

In addition, the mounting work of the bracket 5 for fixing the tube 4 and the electronic component 2 to the heat sink 3 is simple. Furthermore, since only the sheet member 6 is added, the cost can be reduced and the cost can be reduced. It should be noted that the type and shape of the electronic component 2 are not limited to those described above, and it is needless to say that other types of electronic components and electronic components having other shapes with corners can be applied.

[0012]

As described above, according to the first aspect of the present invention, the tube is covered with the sheet material in contact with the corners of the electronic component. Does not directly contact the corners of the electronic component, thereby preventing the tube from being broken. Further, since only a sheet material is added, the cost can be reduced and the cost can be reduced.

According to the second aspect of the present invention, a bracket having a substantially U-shape in side view is sandwiched from above the tube covering the electronic component while straddling the tube, the electronic component, and the heat sink. The fixing work is easy because the bracket is fixed. In addition, even if the tube is sandwiched between the brackets, since the sheet material is provided in contact with the corners of the electronic component, the tube is not broken by the tightening force of the bracket.

According to the third aspect of the present invention, since the sheet member is made of a flat plate having elasticity of a synthetic resin, it can be purchased or produced at low cost. In addition, since the sheet material has elasticity, when the tube is covered, the sheet material is deformed according to the shape of the electronic component, so that there is no obstacle in covering the tube.

According to the fourth aspect of the invention, even if the electronic component has at least one or more corners on its surface, the sheet material can contact each of these corners. The shape of the electronic component is not limited, and the present invention can be applied to various types of electronic components, and can prevent a tube put on the electronic component from being broken.

[Brief description of the drawings]

FIGS. 1A and 1B show an insulating structure of an electronic component according to an embodiment of the present invention, wherein FIG. 1A is a front view in an exploded state, and FIG. 1B is a side view in an exploded state.

FIG. 2 is a front view of the electronic component according to the embodiment in an assembled state of an insulating structure;

FIG. 3 is an enlarged front view showing a state immediately before a tube of a main part of the insulating structure of the electronic component according to the embodiment is covered;

4A and 4B show a conventional electric device winding, in which FIG. 4A is a partial cross-sectional view, and FIG. 4B is a perspective view of a spacer used for the winding.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Electronic component 2b, 2c Corner 3 Heat sink 4 Tube 5 Bracket 6 Sheet material

Claims (4)

[Claims] In order to maintain insulation between an electronic component erected on a substrate and a radiator plate erected near the electronic component to radiate heat generated from the electronic component, An insulating structure of an electronic component in which a tube is put on the electronic component, wherein the tube is covered with a sheet material in contact with a corner of the electronic component, and the electronic component and the heat radiation are covered. An insulating structure for an electronic component, wherein an insulating state with a board is maintained. 2. A bracket having a substantially U-shape in a side view and being fixed from above the tube over the electronic component in a state of straddling the tube, the electronic component, and the heat sink. The insulating structure for an electronic component according to claim 1. 3. The insulating structure for an electronic component according to claim 1, wherein the sheet material is formed of a flat plate having elasticity made of a synthetic resin. 4. The electronic component according to claim 1, wherein the surface of the electronic component has at least one or more corners on the surface thereof, and the sheet material contacts each of the corners. An insulating structure for an electronic component according to any one of the above.