JP2011155173A - Method for forming film, substrate for forming film, method for forming circuit wiring, and substrate for forming circuit wiring - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for forming a film, capable of restraining a film of metal wiring, or the like, constituting circuit wiring from being peeled from a base material, a substrate for forming a film, a method for forming circuit wiring, and a substrate for forming circuit wiring. <P>SOLUTION: The method for forming film is used in forming a film on a film substrate and includes a temporary projection formation process of erecting and forming a temporary projection on a film formation surface of the film substrate; a lock projection formation process of erecting and forming on the film formation surface, a lock projection having a lock part that is brought into contact with the temporary projection from the side opposite to the film formation surface and covering a part of the temporary projection; a temporary projection removal process of removing the temporary projection; and a film-forming process of forming a film, in a region including at least a part of a region from which a part of the temporary projection covered with the lock part has been removed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a film forming method for forming a film on a substrate, a film forming substrate which is a base material for forming a film, a circuit wiring forming method for forming circuit wiring on a circuit board, and a base material for forming circuit wiring. The present invention relates to a circuit wiring forming substrate.

Conventionally, a functional film having a function has been formed on a base material, and an apparatus that performs a function by using the functional film has been used. In the circuit board, a circuit wiring film or the like is formed in a predetermined shape on a base material to form a circuit board having a predetermined function. A semiconductor device is mounted and used on such a circuit board. 2. Description of the Related Art In recent years, high performance and miniaturization of semiconductor devices are remarkable, and miniaturization and high performance of circuit boards on which semiconductor devices are mounted are required. For miniaturization, for example, ultra-small packaging called CSP (Chip Scale Package) is provided. A semiconductor unit manufactured by using the CSP technology can realize a high-density mounting because the mounting area can be made the same as the area of the semiconductor chip.
In a semiconductor unit, a semiconductor chip is mounted on a wiring board on which a wiring pattern is formed. As a method for mounting a semiconductor chip, there are known face-down mounting in which the active surface of the semiconductor chip is mounted toward the substrate side, and face-up mounting in which the active surface of the semiconductor chip is mounted on the front side. In face-down mounting, it is necessary to prepare a dedicated substrate in accordance with the electrode structure of the semiconductor chip, which tends to increase costs. In addition, extra processing such as forming bump electrodes for connection is required. In face-up mounting, it is necessary to connect the electrode terminals of the semiconductor chip and the wiring patterns of the wiring board one by one by wire bonding, and it becomes impossible to cope with an increase in the number of terminals. In wire bonding, a general-purpose substrate cannot be used because the length of the wire is limited. Further, a defect may occur due to mechanical stress when performing wire bonding.

  Japanese Patent Laid-Open No. 2004-228688 provides a face-up mounting by providing a slope extending from an active surface of a semiconductor chip to a substrate surface on which the chip is mounted, and leading to circuit wiring formed on the substrate surface from an electrode terminal on the active surface. By providing an organic insulating layer and forming a wiring pattern that connects the electrode terminals and circuit wiring on the insulating layer, mechanical stress when mounting electronic elements on a wiring board is reduced, and connection reliability is improved. An electronic element mounting method, an electronic device manufacturing method, a circuit board, and an electronic device capable of realizing a high mounting structure at low cost are disclosed.

JP 2006-147650 A

  However, semiconductor devices tend to increase the amount of heat generated in each part as their speed and miniaturization progress. In a device in which a semiconductor device is mounted using the method disclosed in Patent Document 1, the amount of deformation and the frequency of deformation of a metal wiring and an insulating slope are increased as the amount of heat generated by the semiconductor device increases. It tends to increase. Due to the fact that the thermal deformation due to heat generation varies depending on the material and is not uniform, a force that peels off the joint may act on the joint. In the method and circuit board disclosed in Patent Document 1, there is a problem that the connection strength between the metal wiring and the base material (organic insulating layer) is not always sufficient for these forces. When the joint between the metal wiring and the electrode terminal or the circuit wiring is peeled off, so-called disconnection occurs. When the metal wiring is peeled off from the base material (organic insulating layer), the strength of the metal wiring alone is small, so that the possibility of disconnection of the metal wiring itself increases.

  SUMMARY An advantage of some aspects of the invention is to solve at least a part of the problems described above, and the invention can be implemented as the following forms or application examples.

  Application Example 1 A film forming method according to this application example is a film forming method for forming a film on a film substrate, and a temporary protrusion forming step for forming a temporary protrusion on a film forming surface of the film substrate. And a latching protrusion that has a latching portion that contacts the temporary projection from the side opposite to the film forming surface and covers a part of the temporary projection, and is erected on the film forming surface. Forming the film in a region including at least a part of a region where a portion of the temporary protrusion covered by the engaging portion is removed; a protrusion forming step; a temporary protrusion removing step of removing the temporary protrusion; And a film forming step.

According to the film forming method according to this application example, the film is formed in a region including at least a part of the region from which the portion covered with the locking portion in the temporary protrusion is removed. As a result, the film has a portion where the opposite side of the film forming surface is covered with the locking portion. For this reason, since the movement of the film in the direction away from the film forming surface is restricted by the locking portion, the locking protrusion can prevent the film from peeling from the film forming surface of the film substrate.
A temporary protrusion is formed, a locking protrusion having a locking portion that contacts the temporary protrusion and covers a part of the temporary protrusion is formed, the temporary protrusion is removed, and a film is formed at the removed position. A locking projection having a locking portion that covers the portion can be easily formed.

  [Application Example 2] The film forming method according to the above application example further includes an underlayer forming step performed prior to the temporary protrusion forming step, and the underlayer forming step includes a material for forming the underlayer. It is preferable to have a material liquid material disposing step of disposing a base material liquid material on the film forming surface and a base layer semi-curing step of semi-curing the disposed base layer material liquid material.

According to this film forming method, the locking protrusion is formed on the base layer formed in the base layer forming step. By appropriately selecting the material of the underlayer, the connection strength of the locking projection to the film forming surface can be improved.
The semi-curing of the underlayer is a step of curing to such an extent that the underlayer material liquid does not flow. The member formed on the semi-cured base layer and the base layer are connected at the contact portion, but by curing (main curing) the semi-cured base layer, the member and the base layer Connection strength can be improved. Therefore, by forming the locking protrusions on the semi-cured base layer and curing (main curing) the base layer, it is possible to improve the connection strength and improve the peeling resistance of the locking protrusions.

  Application Example 3 It is preferable that the film forming method according to the application example further includes a locking protrusion curing step in which the locking protrusion is cured or semi-cured together with the base layer.

  According to this film forming method, the locking projection is cured together with the base layer. When the members connected at the portions that are in contact with each other are cured in the connected state, the peel resistance of the connection portion is improved. A base layer is formed on the film formation surface, and when the base layer is formed, the locking protrusions erected on the film formation surface are connected to the base layer on the film formation surface. It is erected. By hardening the locking protrusion and the base layer together, the connection strength between the locking protrusion and the base layer can be improved.

  Application Example 4 In the film forming method according to the application example, it is preferable that in the locking protrusion forming step, the locking protrusions made of the same material as the material constituting the base layer are formed.

  According to this film forming method, the locking projection and the base layer are formed using the same material. When the members made of the same material and not completely cured are cured in contact with each other, there is no clear boundary between the contact portions, and the components become substantially integrated. The locking protrusion and the underlayer made of the same material are cured together so as to be substantially integrated, and the peeling resistance strength of the locking protrusion can be improved.

  Application Example 5 In the film forming method according to the application example, in the temporary protrusion forming step, a temporary protrusion material functional liquid including a material for forming the temporary protrusion is disposed using an ink jet type droplet discharge device. It is preferable to contain.

  According to this film forming method, the temporary protrusion material functional liquid is disposed using an ink jet type ejection device. An ink jet type ejection apparatus can accurately arrange an arbitrary amount of liquid at an arbitrary position. For this reason, the temporary protrusion material functional liquid can be disposed at an appropriate position on the film forming surface with high positional accuracy. Moreover, the temporary protrusion of an appropriate size can be formed by disposing an appropriate amount of the temporary protrusion material functional liquid to be disposed with almost no excess or shortage.

  Application Example 6 In the film forming method according to the application example described above, in the temporary protrusion forming step, the temporary protrusion having liquid repellency with respect to a locking protrusion material functional liquid including a material for forming the locking protrusion. It is preferable to form.

  According to this film forming method, the locking protrusion material functional liquid is disposed so as to contact the temporary protrusion in order to form a locking portion or the like, but the temporary protrusion is liquid repellent with respect to the locking protrusion material functional liquid. Therefore, the connection strength of the contact portion can be reduced because the temporary projection and the locking projection material functional liquid are not easily compatible. Thereby, when removing a temporary protrusion in a temporary protrusion removal process, a temporary protrusion and a latching protrusion can be made easy to isolate | separate.

  Application Example 7 In the film forming method according to the application example described above, the locking protrusion forming step uses an ink jet droplet discharge device to apply a locking protrusion material functional liquid containing a material for forming the locking protrusion. It is preferable to include the step of arranging.

  According to this film forming method, the locking protrusion material functional liquid is disposed using an ink jet type discharge device. An ink jet type ejection apparatus can accurately arrange an arbitrary amount of liquid at an arbitrary position. For this reason, the locking protrusion material functional liquid can be disposed at an appropriate position on the film forming surface with high positional accuracy. In addition, by appropriately disposing the proper amount of the locking protrusion material functional liquid to be disposed, the locking protrusion having an appropriate size can be formed.

  Application Example 8 In the film forming method according to the application example described above, it is preferable that the temporary protrusions are arranged according to the shape of the film in the temporary protrusion forming step.

  According to this film forming method, the temporary protrusion is disposed according to the shape of the film, the locking protrusion having the locking portion that covers a part of the temporary protrusion is formed, and a part of the film is formed on the locking portion. It is formed at the position to be covered. By forming a part of the film at a position where the film is covered with the locking part, the locking projection has a function of suppressing the peeling of the film. By disposing the temporary protrusion at a position corresponding to the shape of the film, the function of suppressing the peeling of the locking protrusion can be appropriately exhibited.

  Application Example 9 In the film forming method according to the application example, it is preferable that in the locking protrusion forming step, the locking protrusions are connected to each other at positions along the shape of the film.

  According to this film forming method, the locking protrusions are formed in a continuous manner along the shape of the film, so that a region surrounded by the locking protrusions is formed in substantially the same shape as the film. When the film material is disposed in the film forming step, the locking projection functions like a bank, and the film material can be prevented from being wet and spread outside the region where the film is formed.

  Application Example 10 In the film forming method according to the application example, the film forming step includes a step of disposing a film material functional liquid including a material for forming the film by using an ink jet type droplet discharge device. Is preferred.

  According to this film forming method, the film material functional liquid is disposed by using an ink jet type ejection device. An ink jet type ejection apparatus can accurately arrange an arbitrary amount of liquid at an arbitrary position. For this reason, the film material functional liquid can be disposed at an appropriate position on the film forming surface with high positional accuracy. Further, an appropriate amount of the membrane material functional liquid to be arranged can be arranged almost without excess or deficiency.

  Application Example 11 A film forming substrate according to this application example is a film forming substrate for forming a film, and is erected on a film forming surface on which the film is disposed. A part of the film disposed on the surface is provided with a locking projection having a locking part that comes into contact from the opposite side of the film forming surface.

  According to the film forming substrate of this application example, the locking portion of the locking protrusion comes into contact with the film disposed on the film forming surface from the opposite side of the film forming surface. As a result, the movement of the film in the direction away from the film forming surface is restricted by the locking portion, and therefore the film can be prevented from peeling from the film forming surface of the film forming substrate by the locking protrusion. it can.

  Application Example 12 A film forming substrate according to the above application example includes a temporary protrusion forming step in which a temporary protrusion is formed upright on the film forming surface, and a side opposite to the film forming surface with respect to the temporary protrusion. A locking protrusion forming step of forming the locking protrusion having the locking portion that contacts and covers a part of the temporary protrusion by standing on the film forming surface, and temporary protrusion removal that removes the temporary protrusion It is preferable that the film is formed using a film forming method.

  According to the film forming substrate, the temporary protrusion is formed, the locking protrusion having the locking portion that contacts the temporary protrusion and covers a part of the temporary protrusion is formed, the temporary protrusion is removed, and the film is formed at the removed position. By forming, a locking projection having a locking portion that covers a part of the film can be easily formed.

  Application Example 13 The film formation substrate according to the application example further includes a base layer disposed on the film formation surface, and the locking protrusions are erected on the film formation surface through the base layer. It is preferable that the locking protrusion and the base layer are formed of the same material.

  According to this film forming substrate, the locking projection is formed on the base layer. By appropriately selecting the material of the underlayer, the connection strength of the locking projection to the film forming surface can be improved. Further, the locking projection and the base layer are formed using the same material. When the members made of the same material and not completely cured are cured in contact with each other, there is no clear boundary between the contact portions, and the components become substantially integrated. When the base layer and the locking projection are formed, the base layer made of the same material and the locking projection are cured together to be integrated, thereby improving the peeling strength of the locking projection.

  Application Example 14 In the film forming substrate according to the application example described above, it is preferable that the locking protrusions are formed to be connected to each other at positions along the shape of the film.

  According to this film forming substrate, the locking protrusions are formed in a continuous manner along the shape of the film, so that a region surrounded by the locking protrusions is formed in substantially the same shape as the film. When the film material is disposed in the process of forming the film, the locking protrusion functions like a bank, and the film material can be prevented from spreading out of the region where the film is formed.

  Application Example 15 A circuit wiring forming method according to this application example is a circuit wiring forming method for forming a circuit wiring on a circuit board, and a temporary protrusion is formed by standing a temporary projection on a circuit forming surface of the circuit board. A protrusion forming step, and a locking protrusion having a locking portion that comes into contact with the temporary protrusion from the side opposite to the circuit forming surface and covers a part of the temporary protrusion is formed to stand on the circuit forming surface. An area including at least a part of a region where the portion of the temporary protrusion covered by the engaging portion is removed, the step of forming the locking protrusion, the temporary protrusion removing step of removing the temporary protrusion, and the circuit And a wiring film forming step of forming a circuit wiring film constituting the wiring.

According to the circuit wiring forming method according to this application example, the circuit wiring film is formed in a region including at least a part of the region where the portion of the temporary protrusion covered by the locking portion is removed. As a result, the circuit wiring film has a portion where the opposite side of the circuit formation surface is covered with the locking portion. For this reason, since the movement of the circuit wiring film in the direction away from the circuit formation surface is restricted by the locking portion, the separation of the circuit wiring film from the circuit formation surface of the circuit board is suppressed by the locking protrusion. be able to.
A temporary protrusion is formed, a locking protrusion having a locking portion that contacts the temporary protrusion and covers a part of the temporary protrusion is formed, the temporary protrusion is removed, and a circuit wiring film is formed at the removed position. A locking projection having a locking portion that covers a part of the wiring film can be easily formed.

  Application Example 16 The circuit wiring forming method according to the application example further includes a base layer forming step that is performed prior to the temporary protrusion forming step, and the base layer forming step includes a material for forming the base layer. It is preferable to include a material liquid material arranging step for arranging the underlayer material liquid material on the circuit formation surface and a underlayer semi-curing step for semi-curing the arranged underlayer material liquid material.

According to this circuit wiring forming method, the locking protrusion is formed on the base layer formed in the base layer forming step. By appropriately selecting the material of the underlayer, it is possible to improve the connection strength of the locking protrusion to the circuit formation surface.
The semi-curing of the underlayer is a step of curing to such an extent that the underlayer material liquid does not flow. The member formed on the semi-cured base layer and the base layer are connected at the contact portion, but the semi-cured base layer is cured (main curing) to connect the member and the base layer. Strength can be improved. Therefore, by forming the locking protrusions on the semi-cured base layer and curing (main curing) the base layer, it is possible to improve the connection strength and improve the peeling resistance of the locking protrusions.

  Application Example 17 It is preferable that the circuit wiring forming method according to the application example further includes a locking protrusion curing step in which the locking protrusion is cured or semi-cured together with the base layer.

  According to this circuit wiring forming method, the locking projection is cured together with the base layer. When the members connected at the portions that are in contact with each other are cured in the connected state, the peel resistance of the connection portion is improved. A base layer is formed on the circuit forming surface, and when the base layer is formed, the locking protrusions erected on the circuit forming surface are connected to the base layer on the circuit forming surface. It is erected. By hardening the locking protrusion and the base layer together, the connection strength between the locking protrusion and the base layer can be improved.

  Application Example 18 In the circuit wiring forming method according to the application example described above, it is preferable that in the locking protrusion forming step, the locking protrusion made of the same material as that constituting the base layer is formed.

  According to this circuit wiring forming method, the locking protrusion and the base layer are formed using the same material. When the members made of the same material and not completely cured are cured in contact with each other, there is no clear boundary between the contact portions, and the components become substantially integrated. The locking protrusion and the underlayer made of the same material are cured together so as to be substantially integrated, and the peeling resistance strength of the locking protrusion can be improved.

  Application Example 19 In the circuit wiring forming method according to the application example, it is preferable that in the locking protrusion forming step, the locking protrusions are connected to each other at positions along the shape of the circuit wiring.

  According to this circuit wiring formation method, the locking projections are formed in a continuous manner along the shape of the circuit wiring, so that a region surrounded by the locking projections is formed in substantially the same shape as the circuit wiring. The When arranging the circuit wiring film material in the wiring film formation process, the locking projections function like a bank to prevent the circuit wiring film material from spreading out of the area where the circuit wiring film is formed. can do.

  Application Example 20 A circuit wiring forming substrate according to this application example is a circuit wiring forming substrate for forming circuit wiring, and a circuit forming surface on which a circuit wiring film constituting the circuit wiring is disposed. And a locking protrusion having a locking portion that contacts from a side opposite to the circuit forming surface is provided on a part of the circuit wiring film disposed on the circuit forming surface. .

  According to the circuit wiring forming substrate according to this application example, the locking portion of the locking protrusion comes into contact with the circuit wiring film disposed on the circuit forming surface from the opposite side of the circuit forming surface. Thereby, since the movement of the circuit wiring film in the direction away from the circuit formation surface is restricted by the locking portion, the separation of the circuit wiring film from the circuit formation surface can be suppressed by the locking protrusion. .

  Application Example 21 A circuit wiring forming substrate according to the application example described above includes a temporary protrusion forming step in which a temporary protrusion is formed upright on the circuit forming surface, and a side opposite to the circuit forming surface with respect to the temporary protrusion. A latching projection forming step of forming the latching projection having the latching portion to be in contact with each other and covering a part of the temporary projection by standing on the circuit forming surface, and a temporary projection for removing the temporary projection It is preferable that the substrate is formed by using a method for forming a circuit wiring forming substrate having a removing step.

  According to this circuit wiring forming substrate, the temporary protrusion is formed, the locking protrusion having the locking portion that contacts the temporary protrusion and covers a part of the temporary protrusion is formed, the temporary protrusion is removed, and the removed position is By forming the circuit wiring film, it is possible to easily form a locking protrusion having a locking portion that covers a part of the circuit wiring film.

  Application Example 22 The circuit wiring formation substrate according to the application example further includes a base layer disposed on the circuit formation surface, and the locking protrusion stands on the circuit formation surface via the base layer. It is preferable that the locking projection and the base layer are made of the same material.

  According to this circuit wiring forming substrate, the locking projections are formed on the base layer. By appropriately selecting the material of the underlayer, it is possible to improve the connection strength of the locking protrusion to the circuit formation surface. Further, the locking projection and the base layer are formed using the same material. When the members made of the same material and not completely cured are cured in contact with each other, there is no clear boundary between the contact portions, and the components become substantially integrated. When the base layer and the locking projection are formed, the base layer and the locking projection made of the same material are cured together so that they are substantially integrated to improve the peeling resistance of the locking projection.

  Application Example 23 In the circuit wiring formation substrate according to the application example described above, it is preferable that the locking protrusions are formed to be connected to each other at positions along the shape of the circuit wiring.

  According to this circuit wiring forming substrate, the locking projections are formed in a continuous manner along the shape of the circuit wiring, so that a region surrounded by the locking projections is formed in substantially the same shape as the circuit wiring. Is done. When the circuit wiring material is disposed in the process of forming the circuit wiring, the locking projection functions like a bank to prevent the circuit wiring material from spreading out of the area where the circuit wiring is formed. be able to.

(A) is a top view which shows schematic structure of the whole electronic device. (B) is a top view which shows arrangement | positioning of the connection wiring with which an electronic device is equipped, and a latching protrusion. (C) is sectional drawing which shows the cross-sectional shape of the connection wiring with which an electronic device is provided, and a latching protrusion. The flowchart which shows each process of a wiring formation process. (A), (b), (d), (f), and (h) is explanatory drawing which shows cross-sectional shapes, such as a wiring latching protrusion, in each process of a wiring formation process. (C), (e), (g), and (i) are explanatory drawings which show planar shapes, such as a wiring latching protrusion in each process of a wiring formation process. (A), (c), (e), and (g) is explanatory drawing which shows cross-sectional shapes, such as a film | membrane latching protrusion in each process of a wiring formation process. (B), (d), (f), and (h) is explanatory drawing which shows planar shapes, such as a film | membrane latching protrusion in each process of a wiring formation process.

  Hereinafter, a film forming method, a film forming substrate, a circuit wiring forming method, and a circuit wiring forming substrate will be described with reference to the drawings. In the present embodiment, a step of forming a circuit forming substrate constituting an electronic device formed by mounting a semiconductor device on a chip, and a connection wiring for connecting an electrode terminal of the semiconductor device and a circuit wiring formed on the substrate surface. An example will be described. In the drawings referred to in the following description, the vertical and horizontal scales of members or portions may be shown differently from actual ones for convenience of illustration.

<Electronic device>
First, the electronic device 1 will be described with reference to FIG. FIG. 1 is an explanatory diagram illustrating a schematic configuration of an electronic device. FIG. 1A is a plan view illustrating a schematic configuration of the entire electronic device, and FIG. 1B is a plan view illustrating the arrangement of connection wirings and locking protrusions included in the electronic device. ) Is a cross-sectional view showing the cross-sectional shape of the connection wiring and the locking protrusion provided in the electronic device.

  As shown in FIG. 1, the electronic device 1 includes a semiconductor device 10, a circuit forming substrate 20, a connection wiring 30, and a wiring sealing layer 40. The semiconductor device 10 is mounted on the circuit forming substrate 20, the circuit forming substrate 20 and the semiconductor device 10 are electrically connected by the connection wiring 30, and the connection wiring 30 is covered by the wiring sealing layer 40. . In order to make the components covered by the wiring sealing layer 40 easy to understand, in FIG. 1A, only the outer shape of the wiring sealing layer 40 is shown by a two-dot chain line, and FIG. Then, the wiring sealing layer 40 is omitted.

The semiconductor device 10 includes an electrode terminal 12 formed on the active surface 14, and the semiconductor device 10 is electrically connected to another element or the like via the electrode terminal 12. The semiconductor device 10 is a substantially square chip, and electrode terminals 12 are disposed along each side of the active surface 14.
The circuit forming substrate 20 includes a circuit board 21, a slope member 26, a wiring locking protrusion 32, a base layer 33, a film locking protrusion 42, and a base layer 43. The circuit forming substrate 20 corresponds to a film forming substrate or a circuit wiring forming substrate. The wiring locking protrusion 32 and the film locking protrusion 42 correspond to the locking protrusion.

The circuit board 21 includes a board body 22, and the board body 22 is a substantially rectangular multilayer board, and circuit terminals 23 and circuit wirings 24 are formed on the semiconductor mounting surface 221. The semiconductor device 10 is fixed to a substantially rectangular mounting region 222 set on the semiconductor mounting surface 221 of the substrate body 22 with the surface opposite to the active surface 14 in contact therewith. The circuit terminal 23 is disposed outside the mounting area 222 along the side of the mounting area 222.
A slope member 26 is formed around the fixed semiconductor device 10 in contact with the end face. One end of the slope 261 of the slope member 26 is in contact with the active face 14 and the other end is in contact with the semiconductor mounting face 221. ing. The row of electrode terminals 12 arranged along each side of the active surface 14 of the semiconductor device 10 and the row of circuit terminals 23 arranged along the side of the mounting region 222 sandwich the slope member 26. positioned.

  One end of the connection wiring 30 is connected to the electrode terminal 12, the other end is connected to the circuit terminal 23, and the electrode terminal 12 and the circuit terminal 23 are electrically connected. The connection wiring 30 is routed through the active surface 14, the connection portion between the active surface 14 and the inclined surface 261, the inclined surface 261, the connection portion between the inclined surface 261 and the semiconductor mounting surface 221, and the semiconductor mounting surface 221. The terminal 12 leads to the circuit terminal 23. The active surface 14, the inclined surface 261, and the semiconductor mounting surface 221 correspond to a film formation surface or a circuit formation surface. The connection wiring 30 corresponds to a film or circuit wiring.

A plurality of wiring locking protrusions 32 are disposed beside the connection wiring 30. The plurality of wiring locking protrusions 32 are arranged on both sides of the connection wiring 30 along the long side of the substantially rectangular shape in accordance with the shape of the connection wiring 30 having a long and substantially rectangular shape.
The wiring latching protrusion 32 has a substantially hemispherical shape placed on a plane, and as shown in FIG. 1C, a portion including a part of a corner where the spherical surface and the plane contact each other is omitted. The lacked portion is referred to as a locking space 323 (see FIG. 3F). The locking space 323 has a shape of a part of a hemisphere having a flat surface on the same plane as the wiring locking protrusion 32, and the wall surface of the wiring locking protrusion 32 constituting the locking space 323 is substantially spherical. It is. A portion of the wiring locking protrusion 32 that forms the locking space 323 is referred to as a locking portion 322, and the other portion is referred to as a base portion 321. A part of the connection wiring 30 enters the locking space 323. The wiring latching protrusion 32 is erected on the plane portion of the base portion 321 that is fixed to the active surface 14, the inclined surface 261, and the semiconductor mounting surface 221 through the base layer 33.

The wiring sealing layer 40 is disposed so as to cover the connection wiring 30 and the periphery of the connection wiring 30. The film locking protrusion 42 is disposed on the active surface 14, the inclined surface 261, the semiconductor mounting surface 221, etc., and is covered with the wiring sealing layer 40 as shown in FIG. The film locking protrusions 42 are disposed near the outer peripheral edge of the wiring sealing layer 40 along each side of the wiring sealing layer 40 having a substantially rectangular shape.
The membrane locking protrusion 42 has a substantially hemispherical shape placed on a plane, and two portions including a part of a corner where the spherical surface and the plane contact each other are omitted. The lacked portion is referred to as a locking space 423 (see FIG. 4E). The locking space 423 has a shape of a part of a hemisphere having a flat portion on the same plane as the film locking protrusion 42, and the wall surface of the film locking protrusion 42 constituting the locking space 423 is substantially spherical. It is. A portion of the film locking projection 42 that forms the locking space 423 is referred to as a locking portion 422, and the other portion is referred to as a base portion 421. A part of the wiring sealing layer 40 enters the locking space 423. The planar portion of the base portion 421 is fixed to the active surface 14, the inclined surface 261, and the semiconductor mounting surface 221 with the base layer 421 interposed therebetween, and is erected on the surface. The wiring sealing layer 40 corresponds to a film.

<Wiring formation process>
Next, a wiring formation process for forming the connection wiring 30 and the wiring sealing layer 40 that covers the connection wiring 30 will be described with reference to FIGS. 2, 3, and 4. FIG. 2 is a flowchart showing each process of the wiring forming process. FIG. 3 is an explanatory diagram showing the shape of the wiring locking projections and the like in each step of the wiring formation step, and FIG. 4 is an explanatory diagram showing the shape of the film locking projections and the like in each step of the wiring formation step. 3 (a), (b), (d), (f), and (h) are explanatory views showing the cross-sectional shapes of the wiring locking projections and the like in each step of the wiring forming step, and FIG. ), (E), (g), and (i) are explanatory views showing planar shapes such as wiring locking projections in each step of the wiring forming step. 4 (a), 4 (c), 4 (e), and 4 (g) are explanatory views showing the cross-sectional shapes of the film locking projections and the like in each step of the wiring forming process, and FIGS. ), (F), and (h) are explanatory views showing planar shapes of film locking projections and the like in each step of the wiring forming step.
3 (c), (e), (g), (i) and FIGS. 4 (b), (d), (f), (h) are explanatory diagrams showing the planar shape. 3A, 3B, 3D, 3F, 3H, 4C, 4E, 4E, 4E, 4E, 4E, 4E, 4E, 4E, 4E, 4E, 4E, 4E, 4E, and 4E, The same hatching as the hatching applied to each constituent member in (g) is applied to the same constituent member in the constituent members other than the base layer 33 and the base layer 43.

First, in step S21 of FIG. 2, as shown in FIG. 3A, the base layer functional liquid 33a containing the material of the base layer 33 is placed, so that the material of the base layer 33 is placed. FIG. 3A shows an example in which the base layer 33 is formed on the slope 261 of the slope member 26.
Next, in step S22 of FIG. 2, the base layer 33 is semi-cured. That is, the base layer functional liquid 33a thus arranged is semi-cured to form the semi-cured base layer 33. The underlayer 33 is referred to as the underlayer 33 in both a semi-cured state and a fully cured state.

Next, in step S23 of FIG. 2, as shown in FIGS. 3B and 3C, the temporary protrusion functional liquid 35a containing the material of the temporary protrusion 35 is disposed on the base layer 33, thereby temporarily setting the temporary protrusion. The material of the protrusion 35 is disposed.
The temporary protrusion functional liquid 35a is disposed by discharging droplets of the temporary protrusion functional liquid 35a and landing them at a predetermined position by using, for example, an ink jet type droplet discharge device. The droplet of the temporary protrusion functional liquid 35a that has landed on the base layer 33 has a substantially hemispherical shape.
By adjusting the amount of the temporary protrusion functional liquid 35a discharged at a time, that is, the size of the droplet, the size of the substantially hemispherical shape formed by the landed droplet is adjusted. By adjusting the viscosity of the temporary protrusion functional liquid 35a and the degree of wettability of the temporary protrusion functional liquid 35a with respect to the base layer 33, the substantially hemispherical shape is adjusted.

  Next, in step S24 of FIG. 2, the temporary protrusion 35 is semi-cured. That is, the temporary protrusion functional liquid 35a is semi-cured to form the semi-cured temporary protrusion 35. The temporary protrusion 35 is referred to as a temporary protrusion 35 in both a semi-cured state and a fully cured state.

Next, in step S25 of FIG. 2, as shown in FIGS. 3D and 3E, the wiring protrusion projection 32 is disposed by disposing the wiring protrusion functional liquid 32a containing the material of the wiring locking protrusion 32. Place the material. In order to increase the connection strength between the wiring locking projections 32 and the base layer 33, the material of the wiring locking projections 32 is preferably the same as the material of the base layer 33.
On the other hand, in order to suppress an increase in the connection strength between the wiring latching protrusion 32 and the temporary protrusion 35, a material having liquid repellency with respect to the wiring protrusion functional liquid 32a is selected as the material of the temporary protrusion 35.

  The wiring protrusion functional liquid 32a is arranged by discharging droplets of the wiring protrusion functional liquid 32a and landing on a predetermined position using, for example, an ink jet type liquid droplet discharge device. The predetermined position is a position on the base layer 33 and a part of the base layer 33 rides on the temporary protrusion 35. The droplets of the wiring protrusion functional liquid 32a that have landed on the base layer 33 and the temporary protrusions 35 have a substantially hemispherical shape in which a part of the temporary protrusions 35 is missing. Similar to the above-described temporary protrusion functional liquid 35a, by adjusting the amount of the wiring protrusion functional liquid 32a discharged at one time, that is, the size of the liquid droplet, the size of the substantially hemispherical shape formed by the landed liquid droplet can be reduced. adjust. By adjusting the viscosity of the wiring protrusion functional liquid 32a and the degree of wettability of the wiring protrusion functional liquid 32a with respect to the base layer 33, the substantially hemispherical shape is adjusted.

Next, in step S26 of FIG. 2, the wiring latching protrusion 32 is semi-cured. That is, the wiring protrusion functional liquid 32a is semi-cured to form the semi-cured wiring locking protrusion 32. The wiring latching protrusion 32 is expressed as the wiring latching protrusion 32 in both a semi-cured state and a fully cured state.
As described above, when the material of the wiring latching protrusion 32 is the same as that of the base layer 33, the wiring latching protrusion 32 is semi-cured to cure the semi-cured base layer 33 and to be fully cured. It can also be made into a state.

  Next, in step S27 of FIG. 2, the temporary protrusion 35 is removed. The temporary protrusion 35 is removed by washing the temporary protrusion 35 with a dissolvable liquid. By removing the temporary protrusions 35, as shown in FIGS. 3 (f) and 3 (g), the temporary protrusions that exist in the locking space 323 formed by being surrounded by the surface of the base layer 33 and the locking portions 322 are provided. A part of the protrusion 35 is removed, and the locking space 323 becomes a space.

Next, in step S <b> 28 of FIG. 2, the material constituting the connection wiring 30 is arranged by arranging a metal wiring functional liquid including the material of the metal wiring film constituting the connection wiring 30.
The metal wiring functional liquid is arranged by discharging droplets of the metal wiring functional liquid and landing on a predetermined position using, for example, an ink jet type liquid droplet discharge device. The predetermined position is a position where the shape of the connection wiring 30 is drawn with a droplet of the metal wiring functional liquid. The metal wiring functional liquid is a liquid material in which metal fine particles such as copper are dispersed, and enters the locking space 323 by slightly spreading from the landing position.

Next, in step S29 of FIG. 2, the connection wiring 30 is cured. That is, the metal wiring functional liquid is cured to form the cured connection wiring 30. Here, the connection wiring 30 may be semi-cured and finally cured in a later step. The connection wiring 30 is expressed as the connection wiring 30 in both a semi-cured state and a fully cured state.
By performing the step of curing the connection wiring 30, the connection wiring 30 is formed as shown in FIGS. 3 (h) and 3 (i). A portion of the metal wiring functional liquid that has entered the locking space 323 is also part of the connection wiring 30, and this portion is referred to as a locked portion 303. The locked portion 303 is located between the surface of the base layer 33 and the locking portion 322, and movement in a direction away from the base layer 33 is restricted by the locking portion 322.

Next, in step S30 of FIG. 2, the material of the underlayer 43 is arranged by disposing the underlayer functional liquid 43a containing the material of the underlayer 43 in a region including the position where the film locking protrusion 42 is formed. .
Next, in step S31, the underlayer 43 is semi-cured. That is, the underlying base layer functional liquid 43a is semi-cured to form the semi-cured base layer 43. The underlayer 43 is expressed as the underlayer 43 in both a semi-cured state and a fully cured state.

Next, in step S32, as shown in FIGS. 4A and 4B, the temporary protrusion functional liquid 45a containing the material of the temporary protrusion 45 is disposed on the base layer 43, so that the temporary protrusion 45 is formed. Arrange the material.
The temporary protrusion functional liquid 45a is arranged by discharging droplets of the temporary protrusion functional liquid 45a and landing them at a predetermined position using, for example, an ink jet type liquid droplet discharge device. The droplet of the temporary protrusion functional liquid 45a that has landed on the base layer 43 has a substantially hemispherical shape.
The size of the substantially hemispherical shape is adjusted by adjusting the amount of the temporary protrusion functional liquid 45a discharged at a time, that is, the size of the droplet. By adjusting the viscosity of the temporary protrusion functional liquid 45a and the degree of wettability of the temporary protrusion functional liquid 45a with respect to the base layer 43, the shape of the substantially hemispherical shape is adjusted.
As described with reference to FIG. 1, the film locking projection 42 includes two locking portions 422 that form the locking space 423. In order to form two locking portions 422 on one film locking protrusion 42, two substantially hemispherical temporary protrusion functional liquids 45a are provided corresponding to one film locking protrusion 42. To do. The two substantially hemispheres of the temporary protrusion functional liquid 45a are arranged at an interval corresponding to the size of the film locking protrusion 42.

  Next, in step S33 of FIG. 2, the temporary protrusion 45 is semi-cured. That is, the temporary protrusion functional liquid 45a is semi-cured to form the semi-cured temporary protrusion 45. The temporary protrusion 45 is referred to as a temporary protrusion 45 in both a semi-cured state and a fully cured state.

Next, in step S34, as shown in FIGS. 4C and 4D, the film protrusion functional liquid 42a containing the material of the film engagement protrusion 42 is disposed, so that the material of the film engagement protrusion 42 is changed. Deploy. In order to increase the connection strength between the film locking protrusions 42 and the base layer 43, the material of the film locking protrusions 42 is preferably the same as the material of the base layer 43.
On the other hand, in order to suppress an increase in the connection strength between the film locking protrusion 42 and the temporary protrusion 45, a material having liquid repellency with respect to the film protrusion functional liquid 42a is selected as the material of the temporary protrusion 45.

  The film protrusion functional liquid 42a is disposed by discharging droplets of the film protrusion functional liquid 42a and landing on a predetermined position using, for example, an ink jet type liquid droplet discharge device. The predetermined position is a position between the substantially hemispheres of the two temporary projections 45 on the base layer 43 and a part of each side of the hemisphere of the film projection functional liquid 42 a rides on the temporary projection 45. The droplet of the film projection functional liquid 42a that has landed on the base layer 43 and the temporary projection 45 has a substantially hemispherical shape in which a portion where the two temporary projections 45 exist is missing. Similar to the above-described temporary protrusion functional liquid 45a, by adjusting the amount of the film protrusion functional liquid 42a discharged at a time, that is, the size of the liquid droplet, the size of the substantially hemispherical shape formed by the landed liquid droplet can be reduced. adjust. By adjusting the viscosity of the film protrusion functional liquid 42a and the degree of wettability of the film protrusion functional liquid 42a with respect to the base layer 43, the substantially hemispherical shape is adjusted.

Next, in step S35 of FIG. 2, the film locking protrusion 42 is semi-cured. That is, the film protrusion functional liquid 42a is semi-cured to form a semi-cured film locking protrusion 42. The film-locking protrusion 42 is expressed as the film-locking protrusion 42 in both a semi-cured state and a fully-cured state.
As described above, when the material of the film locking protrusion 42 is the same as the material of the base layer 43, the film locking protrusion 42 is semi-cured to cure the semi-cured base layer 43 and to perform main curing. It can also be made into a state.

  Next, in step S36, the temporary protrusion 45 is removed. The temporary protrusion 45 is removed by washing the temporary protrusion 45 with a soluble liquid. By removing the temporary protrusion 45, as shown in FIGS. 4E and 4F, the temporary protrusion 45 exists in the locking space 423 formed by being surrounded by the surface of the base layer 43 and the locking portion 422. A part of the protrusion 45 is removed, and the locking space 423 becomes a space.

Next, in step S <b> 37 of FIG. 2, the material constituting the wiring sealing layer 40 is arranged by arranging the sealing layer functional liquid containing the material constituting the wiring sealing layer 40.
The sealing layer functional liquid is disposed by discharging droplets of the sealing layer functional liquid using, for example, an ink jet type liquid droplet discharging apparatus and landing the liquid on a predetermined position. The predetermined position is a position where the shape of the wiring sealing layer 40 is drawn with a droplet of the sealing layer functional liquid. The sealing layer functional liquid is, for example, a solution such as epoxy resin, and enters the locking space 423 by slightly spreading from the landing position.

Next, in step S38, the wiring sealing layer 40 is cured. That is, the sealing layer functional liquid is cured to form the cured wiring sealing layer 40. Here, the wiring sealing layer 40 may be semi-cured and may be finally cured in a subsequent process. The wiring sealing layer 40 is expressed as the wiring sealing layer 40 in a semi-cured state and a fully cured state.
By performing the step of curing the wiring sealing layer 40, the wiring sealing layer 40 is formed as shown in FIGS. 4 (g) and (h). A portion of the sealing layer functional liquid that has entered the locking space 423 is also part of the wiring sealing layer 40, and this portion is referred to as a locked portion 403. The locked portion 403 is located between the surface of the base layer 43 and the locking portion 422, and movement in a direction away from the base layer 43 is restricted by the locking portion 422.
Step S38 is performed, and the wiring forming process for forming the connection wiring 30 and the wiring sealing layer 40 covering the connection wiring 30 is completed.

Hereinafter, the effect by embodiment is described. According to the present embodiment, the following effects can be obtained.
(1) The locked portion 303, which is a part of the connection wiring 30, is located between the surface of the base layer 33 and the locking portion 322, and is moved away from the base layer 33 by the locking portion 322. Is restricted from moving. Thereby, it can suppress that the connection wiring 30 peels from the base layer 33. FIG.
The base layer 33 does not need to have characteristics such as a conduction function like the connection wiring 30, and the connection wiring 30 has a higher degree of freedom in selecting a material having high peel strength against the active surface 14, the slope 261, and the semiconductor mounting surface 221. Therefore, it is possible to form a film having a higher peel resistance against the active surface 14, the inclined surface 261, and the semiconductor mounting surface 221 than the connection wiring 30. Thereby, it can suppress that the connection wiring 30 peels from the active surface 14, the inclined surface 261, or the semiconductor mounting surface 221. FIG.

  (2) The temporary protrusion 35 is formed, the wiring protrusion functional liquid 32a is disposed so that a part thereof covers a part of the temporary protrusion 35, and the temporary protrusion 35 is removed to form the wiring locking protrusion 32. By removing the temporary protrusion 35, a locking space 323 of the wiring locking protrusion 32 is formed, and the locking portion 322 that restricts the movement of the locked portion 303 of the connection wiring 30 in the direction away from the base layer 33 is formed. It can be formed easily.

  (3) The temporary protrusion functional liquid 35a is arranged by discharging droplets of the temporary protrusion functional liquid 35a and landing on a predetermined position using, for example, an ink jet type liquid droplet discharge device. By ejecting the temporary protrusion functional liquid 35a as a droplet, a substantially hemispherical shape can be easily formed.

  (4) The temporary protrusion functional liquid 35a is arranged by discharging droplets of the temporary protrusion functional liquid 35a and landing on a predetermined position using, for example, an ink jet type liquid droplet discharge device. The ink jet type droplet discharge device can accurately arrange an arbitrary amount of the temporary protrusion functional liquid 35a at an arbitrary position. For this reason, the temporary protrusion functional liquid 35a can be disposed with high positional accuracy at an appropriate position where the temporary protrusion 35 is to be formed. In addition, the temporary protrusion functional liquid 35a having an appropriate arrangement amount to be disposed can be disposed almost without deficiency to form the temporary protrusion 35 having an appropriate size.

  (5) As the material of the temporary protrusion 35, a material having liquid repellency with respect to the wiring protrusion functional liquid 32a is selected. For this reason, since the wiring protrusion functional liquid 32a and the temporary protrusion 35 are not easily combined, the wiring protrusion functional liquid 32a is disposed so as to contact the temporary protrusion 35, but the connection strength of the contact portion can be reduced. . Thereby, in the process of removing the temporary protrusion 35, the temporary protrusion 35 and the wiring latching protrusion 32 can be easily separated.

  (6) The material of the wiring latching protrusion 32 can be the same as that of the base layer 33. By making the material of the wiring latching protrusion 32 and the material of the base layer 33 common, the wiring latching protrusion 32 and the base layer 33 can be cured substantially simultaneously. The connection strength between the wiring latching protrusion 32 and the base layer 33 can be increased by integrating the stop protrusion 32 and the base layer 33 substantially.

  (7) The wiring protrusion functional liquid 32 a containing the material of the wiring locking protrusion 32 is disposed on the semi-cured base layer 33. Compared with the case where the wiring protrusion functional liquid 32a is disposed on the base layer 33 that has been hardened by main-curing the base layer 33 after the wiring protrusion functional liquid 32a is disposed, the wiring locking protrusions 32 and the base layer are disposed. The connection strength with 33 can be improved.

  (8) The wiring protrusion functional liquid 32a is arranged by discharging droplets of the wiring protrusion functional liquid 32a and landing on a predetermined position using, for example, an ink jet type droplet discharge device. The ink jet type droplet discharge device can accurately arrange an arbitrary amount of the wiring protrusion functional liquid 32a at an arbitrary position. For this reason, the wiring protrusion functional liquid 32a can be disposed with high positional accuracy at an appropriate position where the wiring locking protrusion 32 is to be formed. Moreover, the wiring protrusion functional liquid 32a having an appropriate arrangement amount to be arranged can be arranged almost without excess and deficiency to form the wiring locking protrusion 32 having an appropriate size.

(9) The locked portion 403 constituting a part of the wiring sealing layer 40 is located between the surface of the base layer 43 and the locking portion 422, and the locking portion 422 removes the base layer 43 from the base layer 43. Movement in the direction of leaving is restricted. Thereby, it can suppress that the wiring sealing layer 40 peels from the base layer 43. FIG.
The base layer 43 does not need to have characteristics such as abrasion resistance like the wiring sealing layer 40, and the degree of freedom in selecting a material having high peel resistance against the active surface 14, the inclined surface 261, and the semiconductor mounting surface 221 is wiring. Since it is higher than the sealing layer 40, a film having a higher peel resistance against the active surface 14, the inclined surface 261, and the semiconductor mounting surface 221 than that of the wiring sealing layer 40 can be formed. Thereby, it can suppress that the wiring sealing layer 40 peels from the active surface 14, the inclined surface 261, or the semiconductor mounting surface 221. FIG.

  (10) The temporary protrusion 45 is formed, the film protrusion functional liquid 42a is disposed so that a part thereof covers a part of the temporary protrusion 45, and the temporary protrusion 45 is removed to form the film locking protrusion 42. By removing the temporary protrusion 45, a locking space 423 of the film locking protrusion 42 is formed, and a locking portion that restricts the movement of the locked portion 403 of the wiring sealing layer 40 in the direction away from the base layer 43. 422 can be formed easily.

  (11) The temporary protrusion functional liquid 45a is disposed by discharging droplets of the temporary protrusion functional liquid 45a and landing on a predetermined position using, for example, an ink jet type liquid droplet discharge device. By ejecting the temporary protrusion functional liquid 45a as a droplet, a substantially hemispherical shape can be easily formed.

  (12) The temporary protrusion functional liquid 45a is disposed by discharging droplets of the temporary protrusion functional liquid 45a and landing them at a predetermined position using, for example, an ink jet type droplet discharge device. The ink jet type droplet discharge device can accurately arrange an arbitrary amount of the temporary protrusion functional liquid 45a at an arbitrary position. For this reason, the temporary protrusion functional liquid 45a can be disposed with high positional accuracy at an appropriate position where the temporary protrusion 45 is to be formed. In addition, the temporary protrusion functional liquid 45a having an appropriate arrangement amount to be arranged can be arranged almost without excess and deficiency to form the temporary protrusion 45 having an appropriate size.

  (13) As the material of the temporary protrusion 45, a material having liquid repellency with respect to the film protrusion functional liquid 42a is selected. For this reason, since the film protrusion functional liquid 42a and the temporary protrusion 45 are not easily combined, the film protrusion functional liquid 42a is disposed so as to contact the temporary protrusion 45, but the connection strength of the contact portion can be reduced. . Thereby, in the process of removing the temporary protrusion 45, the temporary protrusion 45 and the film locking protrusion 42 can be easily separated.

  (14) The material of the film locking protrusions 42 can be the same as the material of the base layer 43. By making the material of the film locking projection 42 and the material of the base layer 43 common, the film locking protrusion 42 and the base layer 43 can be cured substantially simultaneously. It is possible to increase the connection strength between the film locking projection 42 and the base layer 43 by making the stop projection 42 and the base layer 43 substantially integral.

  (15) The film protrusion functional liquid 42 a containing the material of the film locking protrusion 42 is disposed on the semi-cured base layer 43. Compared with the case where the film protrusion functional liquid 42a is disposed on the base layer 43 that has been hardened by main curing the base layer 43 after the film protrusion functional liquid 42a is disposed, the film locking protrusion 42 and the base layer The connection strength with 43 can be improved.

  (16) The film protrusion functional liquid 42a is disposed by discharging droplets of the film protrusion functional liquid 42a and landing on a predetermined position using, for example, an ink jet type liquid droplet discharge device. The ink jet type droplet discharge device can accurately arrange an arbitrary amount of the film projection functional liquid 42a at an arbitrary position. For this reason, the film | membrane protrusion functional liquid 42a can be arrange | positioned with high positional accuracy in the appropriate position which should form the film | membrane latching protrusion 42. FIG. In addition, the proper amount of the film protrusion functional liquid 42a to be disposed can be disposed with almost no excess and deficiency to form the film locking protrusion 42 of an appropriate size.

  (17) The film locking protrusions 42 are disposed near the outer peripheral edge of the wiring sealing layer 40 along each side of the wiring sealing layer 40 having a substantially rectangular shape. By improving the peel resistance at the outer peripheral edge of each side of the wiring sealing layer 40 by the film locking protrusions 42, the peel resistance of the wiring sealing layer 40 can be improved efficiently.

  As mentioned above, although preferred embodiment was described referring an accompanying drawing, suitable embodiment is not restricted to the said embodiment. The embodiment can of course be modified in various ways without departing from the scope, and can also be implemented as follows.

  (Modification 1) In the above-described embodiment, the wiring locking projections 32 are arranged at intervals. However, like the wiring locking projections 32, the wiring locking projections 32 are arranged on the outer periphery of the film such as the connection wiring 30. The engaging protrusions to be connected may be arranged to be connected to each other. When the membrane material functional liquid containing the material for forming the film is disposed in order to form the film, the outflow of the membrane material functional liquid is performed by arranging the locking protrusions formed before the film is formed in a connected manner. Can be suppressed. Since it is possible to suppress outflow, it is easy to form a film with an appropriate shape even if it is a membrane material functional liquid that easily spreads and a membrane material functional liquid with low viscosity. A functional fluid or a membrane material functional fluid having a low viscosity can be employed as the membrane material functional fluid.

  (Modification 2) In the above-described embodiment, the temporary protrusion functional liquid 35a, the wiring protrusion functional liquid 32a, the metal wiring functional liquid, the temporary protrusion functional liquid 45a, and the film protrusion functional liquid 42a using the ink jet type droplet discharge device. However, it is not essential to use an ink jet type droplet discharge device to dispose these functional liquids. A droplet discharge device of a method different from the ink jet method may be used, and the functional liquid may be arranged using a device different from the droplet discharge device.

  (Modification 3) In the above-described embodiment, the wiring locking protrusions 32 are arranged along the sides of the connection wiring 30, and the film locking protrusions 42 are covered with the wiring sealing layer 40. Was formed. However, the fact that the locking projections corresponding to the circuit wiring film, such as the wiring locking projections 32, are arranged side by side on the circuit wiring film also corresponds to the non-conductive film such as the film locking projections 42. It is not essential that the locking projection is formed so as to be covered with the film. The locking protrusions may be arranged side by side with the film, or may be arranged in a state covered with the film.

  (Modification 4) In the above-described embodiment, the wire locking projection 32 includes one locking portion 322, and the film locking projection 42 includes two locking portions 422. The number of locking portions provided in the protrusion is not limited to one or two, and the number of locking portions provided in the locking protrusion may be any number.

  (Modification 5) In the embodiment described above, the locking space 323 and the locking space 423 are spaces in which the wall surface is formed of one spherical surface, but the wall surface of the space formed by the locking portion is a single spherical surface. It is not essential. As long as the wall surface of the space formed by the locking portion has a shape capable of forming a space in which a part of the film exists between the surface on which the locking protrusion is erected, such as a shape in which a plurality of spherical surfaces are connected. Any shape is acceptable.

  (Modification 6) In the above-described embodiment, step S26 is a step of semi-curing the wiring locking protrusion 32, and step S35 is a step of semi-hardening the film locking protrusion 42, but a step of forming a film. It is not essential that the step of curing the locking projection in the step of forming the circuit wiring is a step of semi-curing the locking projection. The locking protrusion may be fully cured. By performing the main curing in the step of forming the film, a separate step for the main curing is unnecessary, and an increase in the number of steps can be suppressed. In addition, the process time of the process which forms a film | membrane can be shortened by carrying out semi-hardening in the process of forming a film | membrane, and carrying out the main curing separately.

  (Modification 7) In the embodiment, the connection wiring 30 is a metal wiring made of a metal material, but it is not essential that the circuit wiring is a metal film. The circuit wiring may be made of any material as long as good conductivity is obtained.

  (Modification 8) In the embodiment described above, the circuit forming substrate 20 constituting the electronic device 1 in which the semiconductor device 10 is formed by chip mounting, and the circuit formed on the electrode terminal 12 and the circuit substrate 21 of the semiconductor device 10. The wiring forming process for forming the connection wiring 30 that connects the terminal 23 and the wiring sealing layer 40 that covers the connection wiring 30 has been described as an example. However, the circuit wiring to be formed is not limited to the connection wiring that connects the semiconductor device and the circuit board. The circuit wiring may be any circuit wiring formed on the circuit board, or a terminal connected to the circuit wiring. The circuit wiring forming substrate may be a circuit substrate other than the semiconductor mounting substrate. The film may be a film other than circuit wiring or a wiring sealing layer. Unlike the circuit board, the film forming substrate may be a substrate for forming a film different from the circuit wiring.

(Modification 9) In the above embodiment, the material of the temporary protrusion 35 is selected from materials having liquid repellency with respect to the wiring protrusion functional liquid 32a, and the material of the temporary protrusion 45 is the film protrusion functional liquid 42a. In order to form a temporary protrusion having liquid repellency with respect to the locking protrusion material function liquid including the material that forms the locking protrusion, a material having liquid repellency was selected. As a material, it is not essential to use a material having liquid repellency with respect to the locking projection material functional liquid. The temporary protrusion is made liquid repellent with respect to the locking protrusion material functional liquid by performing a process for the formed temporary protrusion so as to be liquid repellent with respect to the locking protrusion material functional liquid. May be.
By performing the process of treating the formed temporary protrusion so as to be liquid repellent with respect to the locking protrusion material functional liquid, the liquid protrusion with respect to the wiring protrusion functional liquid 32a is formed as the material of the temporary protrusion 35. As in the case of selecting the material having the property, in the step of removing the temporary protrusion 35, the temporary protrusion 35 and the wiring locking protrusion 32 can be easily separated.
Furthermore, it is not essential that the temporary protrusion has liquid repellency with respect to the locking protrusion material functional liquid. If the temporary protrusion can be easily removed after the locking protrusion is formed, the temporary protrusion may not be liquid repellent with respect to the locking protrusion material functional liquid.

  (Modification 10) In the embodiment described above, the step of forming the base layer 33 and the step of forming the base layer 43 are performed, but the base layer 43 is formed at the same time when the base layer 33 is formed. May be. In the case where there are a plurality of steps of forming a base layer as in the embodiment, the time required for the steps can be reduced by forming the base layers that can be formed at the same time in the same step.

  (Modification 11) In the above-described embodiment, the step of forming the temporary protrusion 35 and forming the wire locking protrusion 32 and the step of forming the temporary protrusion 45 and forming the film locking protrusion 42 are performed. However, the temporary protrusion 45 may be formed at the same time when the temporary protrusion 35 is formed, and the film locking protrusion 42 may be formed at the same time when the wiring locking protrusion 32 is formed. When there are a plurality of steps for forming the locking projections as in the above embodiment, the temporary projections and locking projections that can be formed simultaneously can be formed in the same step, thereby reducing the time required for the steps. it can.

  DESCRIPTION OF SYMBOLS 1 ... Electronic device, 10 ... Semiconductor device, 12 ... Electrode terminal, 14 ... Active surface, 20 ... Circuit board | substrate, 21 ... Circuit board, 23 ... Circuit terminal, 24 ... Circuit wiring, 26 ... Slope member, 30 ... Connection Wiring, 32 ... wiring locking protrusion, 32a ... wiring protrusion functional liquid, 33 ... base layer, 33a ... base layer functional liquid, 35 ... temporary protrusion, 35a ... temporary protrusion functional liquid, 40 ... wiring sealing layer, 42 ... film Locking protrusion, 42a ... membrane protrusion functional liquid, 43 ... base layer, 43a ... base layer functional liquid, 45 ... temporary protrusion, 45a ... temporary protrusion functional liquid, 221 ... semiconductor mounting surface, 261 ... slope, 303 ... locked 321 ... Base part, 322 ... Locking part, 323 ... Locking space, 403 ... Locked part, 421 ... Base part, 422 ... Locking part, 423 ... Locking space.

Claims (23)

A film forming method for forming a film on a film substrate,
A temporary protrusion forming step of standing and forming the temporary protrusion on the film forming surface of the film substrate; and
Locking protrusion formation in which a locking protrusion having a locking portion that contacts the temporary protrusion from the side opposite to the film forming surface and covers a part of the temporary protrusion is formed upright on the film forming surface Process,
A temporary protrusion removing step of removing the temporary protrusion;
A film forming step of forming the film in a region including at least a part of a region from which the portion covered with the locking portion in the temporary protrusion is removed. It further has a base layer forming step to be performed prior to the temporary projection forming step,
The underlayer forming step includes a material liquid material arranging step in which an underlayer material liquid containing a material for forming the underlayer is arranged on the film forming surface,
The film forming method according to claim 1, further comprising: an underlayer semi-curing step of semi-curing the disposed underlayer material liquid.   The film forming method according to claim 2, further comprising a locking protrusion curing step of curing or semi-curing the locking protrusion together with the base layer.   4. The film forming method according to claim 2, wherein, in the locking protrusion forming step, the locking protrusion made of the same material as that forming the base layer is formed. 5.   5. The temporary protrusion forming step includes a step of disposing a temporary protrusion material functional liquid including a material for forming the temporary protrusion using an ink jet type droplet discharge device. The film forming method according to claim 1.   6. The temporary protrusion forming step includes forming the temporary protrusion having liquid repellency with respect to a locking protrusion material functional liquid including a material for forming the locking protrusion. The film forming method according to claim 1.   The locking protrusion forming step includes a step of disposing a locking protrusion material functional liquid including a material for forming the locking protrusion by using an ink jet type droplet discharge device. The film forming method according to claim 6.   The film forming method according to claim 1, wherein, in the temporary protrusion forming step, the temporary protrusion is disposed according to a shape of the film.   The film formation according to any one of claims 1 to 8, wherein, in the locking protrusion forming step, the locking protrusions are formed to be connected to each other at a position along the shape of the film. Method.   10. The film forming step includes a step of disposing a film material functional liquid containing a material for forming the film using an ink jet type droplet discharge device. The film formation method as described in 2. above. A film forming substrate for forming a film,
A latch that is erected on a film formation surface on which the film is disposed and has a latch portion that contacts a part of the film disposed on the film formation surface from the opposite side of the film formation surface A film-forming substrate comprising a protrusion.   A temporary protrusion forming step in which the temporary protrusion is erected on the film forming surface; and the locking portion that contacts the temporary protrusion from a side opposite to the film forming surface and covers a part of the temporary protrusion. The locking projections are formed using a film forming method comprising: a locking projection forming step of standing and forming the locking projections on the film forming surface; and a temporary projection removing step of removing the temporary projections. The film forming substrate according to claim 11, wherein the film forming substrate is characterized in that:   A base layer disposed on the film forming surface; and the locking protrusion is erected on the film forming surface via the base layer, and the locking protrusion and the base layer are made of the same material. The film forming substrate according to claim 11, wherein the film forming substrate is formed of.   14. The film forming substrate according to claim 11, wherein the locking protrusions are connected to each other at positions along the shape of the film. A circuit wiring forming method for forming circuit wiring on a circuit board,
A temporary protrusion forming step of standing and forming the temporary protrusion on the circuit forming surface of the circuit board; and
Locking protrusion formation in which a locking protrusion having a locking portion that comes into contact with the temporary protrusion from the side opposite to the circuit forming surface and covers a part of the temporary protrusion is formed on the circuit forming surface. Process,
A temporary protrusion removing step of removing the temporary protrusion;
A wiring film forming step of forming a circuit wiring film constituting the circuit wiring in a region including at least a part of a region where the portion covered with the locking portion in the temporary protrusion is removed. A method of forming a circuit wiring. It further has a base layer forming step to be performed prior to the temporary projection forming step,
The underlayer forming step includes a material liquid body arranging step in which an underlayer material liquid containing a material for forming the underlayer is arranged on the circuit forming surface,
The method for forming a circuit wiring according to claim 15, further comprising: a base layer semi-curing step of semi-curing the disposed base layer material liquid.   The method of forming a circuit wiring according to claim 16, further comprising a locking protrusion curing step of curing or semi-curing the locking protrusion together with the base layer.   18. The circuit wiring forming method according to claim 16, wherein, in the locking protrusion forming step, the locking protrusion made of the same material as that of the base layer is formed.   The circuit according to any one of claims 15 to 18, wherein, in the locking protrusion forming step, the locking protrusions are formed to be connected to each other at positions along the shape of the circuit wiring. Wiring formation method. A circuit wiring forming substrate for forming circuit wiring,
The circuit wiring film constituting the circuit wiring is erected on a circuit forming surface on which the circuit wiring film is disposed, and a part of the circuit wiring film disposed on the circuit forming surface is formed on the side opposite to the circuit forming surface. A circuit wiring forming board comprising a locking projection having a locking portion in contact therewith.   A temporary protrusion forming step for forming the temporary protrusion on the circuit forming surface; and the locking portion that contacts the temporary protrusion from a side opposite to the circuit forming surface and covers a part of the temporary protrusion. Using a method for forming a circuit wiring forming substrate, comprising: a locking protrusion forming step of standingly forming the locking protrusion on the circuit forming surface; and a temporary protrusion removing step of removing the temporary protrusion. The circuit wiring forming substrate according to claim 20, wherein the circuit wiring forming substrate is formed.   It further comprises a base layer disposed on the circuit forming surface, and the locking protrusion is erected on the circuit forming surface through the base layer, and the locking protrusion and the base layer are made of the same material. The circuit wiring forming substrate according to claim 20 or 21, wherein the circuit wiring forming substrate is formed of   The circuit wiring formation substrate according to any one of claims 20 to 22, wherein the locking projections are formed to be connected to each other at positions along the shape of the circuit wiring.

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