JP2011153252A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2011153252A5 JP2011153252A5 JP2010016719A JP2010016719A JP2011153252A5 JP 2011153252 A5 JP2011153252 A5 JP 2011153252A5 JP 2010016719 A JP2010016719 A JP 2010016719A JP 2010016719 A JP2010016719 A JP 2010016719A JP 2011153252 A5 JP2011153252 A5 JP 2011153252A5
- Authority
- JP
- Japan
- Prior art keywords
- silicone rubber
- bond strength
- tensile shear
- shear bond
- oil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Description
［引張りせん断接着強さ］
熱伝導性シリコーンゴム組成物の引張りせん断接着強さをＪＩＳ Ｋ ６８５０：1999「接着剤−剛性被着材の引張りせん断接着強さ試験方法」で規定の方法に従い測定した。
すなわち、１００ｍｍ×２０ｍｍ×１.６ｍｍのアルミニウム製被着材を用いて、シリコーンゴム組成物からなる接着層が１０ｍｍ×２０ｍｍ×１ｍｍとなるように調整し、これを１５０℃で１時間加熱して前記組成物を硬化してなる試験片を作製した。この試験片の引張りせん断接着強さを引張り速度５０ｍｍ／分で測定した。また、その際の、接着材の破壊の様式をＪＩＳ Ｋ ６８６６：1999「接着剤−主要破壊様式の名称」に従い、観察した。
また、この試験片を８５℃／８５％ＲＨの雰囲気下で２５０時間静置した後、上記と同様に引張りせん断接着強さの測定、および破壊の様式を観察した。
[Tensile shear bond strength]
The tensile shear bond strength of the thermally conductive silicone rubber composition was measured according to the method specified in JIS K 6850: 1999 “Testing method for tensile shear bond strength of adhesive-rigid substrate ”.
That is, using an aluminum adherend of 100 mm × 20 mm × 1.6 mm, an adhesive layer made of a silicone rubber composition is adjusted to 10 mm × 20 mm × 1 mm, and this is heated at 150 ° C. for 1 hour. A test piece formed by curing the composition was prepared. The tensile shear bond strength of this test piece was measured at a pulling speed of 50 mm / min. In this case, the mode of destruction of the adhesive was observed in accordance with JIS K 6866: 1999 “Adhesive—Name of the main mode of fracture”.
Further, this test piece was allowed to stand for 250 hours in an atmosphere of 85 ° C./85% RH, and thereafter the tensile shear bond strength was measured and the mode of fracture was observed in the same manner as described above.
［滲み出し量（オイルブリード量）］
熱伝導性シリコーンゴム組成物の硬化途上のオイル成分の滲み出し（オイルブリード）を図１に示した試験体で評価した。すなわち、すりガラス板Ａ上に熱伝導性シリコーンゴム組成物を０.１ｃｃ載せ、他のすりガラス板Ｃで該組成物の厚さが１ｍｍとなるように挟みこみ、試験体を作製した。この試験体を室温で２時間で静置した後、１５０℃の熱風循環式オーブンで１時間加熱することにより、該組成物を硬化させた。得られたシリコーンゴムＢの周囲からガラス板上に滲みだしたオイル分Ｄの滲みだし幅ａを測定し、その面積を求めた。
[Bleed amount (oil bleed amount)]
The oil component bleeding (oil bleed) during curing of the thermally conductive silicone rubber composition was evaluated using the test specimen shown in FIG. That is, 0.1 cc of the thermally conductive silicone rubber composition was placed on the ground glass plate A and sandwiched with another ground glass plate C so that the thickness of the composition was 1 mm, to prepare a test specimen. The specimen was allowed to stand at room temperature for 2 hours, and then the composition was cured by heating in a hot air circulation oven at 150 ° C. for 1 hour. The oozing width a of the oil component D oozing out from the periphery of the obtained silicone rubber B onto the glass plate was measured, and the area was determined.
Ａ すりガラス
Ｂ シリコーンゴム
Ｃ すりガラス
Ｄ オイル分
ａ オイルの滲み出し幅
A Ground glass B Silicone rubber C Ground glass D Oil content a Oil oozing width
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010016719A JP5534837B2 (en) | 2010-01-28 | 2010-01-28 | Thermally conductive silicone rubber composition |
| CN201180006026.1A CN102725355B (en) | 2010-01-28 | 2011-01-20 | Thermally conductive silicone rubber composition |
| KR1020127022420A KR101758799B1 (en) | 2010-01-28 | 2011-01-20 | Thermally conductive silicone rubber composition |
| EP11704094.9A EP2528974B1 (en) | 2010-01-28 | 2011-01-20 | Thermally conductive silicone rubber composition |
| US13/574,830 US20120292558A1 (en) | 2010-01-28 | 2011-01-20 | Thermally Conductive Silicone Rubber Composition |
| PCT/JP2011/051538 WO2011093353A2 (en) | 2010-01-28 | 2011-01-20 | Thermally conductive silicone rubber composition |
| TW100103162A TWI513770B (en) | 2010-01-28 | 2011-01-27 | Thermally conductive silicone rubber composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010016719A JP5534837B2 (en) | 2010-01-28 | 2010-01-28 | Thermally conductive silicone rubber composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011153252A JP2011153252A (en) | 2011-08-11 |
| JP2011153252A5 true JP2011153252A5 (en) | 2013-02-28 |
| JP5534837B2 JP5534837B2 (en) | 2014-07-02 |
Family
ID=44278962
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010016719A Active JP5534837B2 (en) | 2010-01-28 | 2010-01-28 | Thermally conductive silicone rubber composition |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20120292558A1 (en) |
| EP (1) | EP2528974B1 (en) |
| JP (1) | JP5534837B2 (en) |
| KR (1) | KR101758799B1 (en) |
| CN (1) | CN102725355B (en) |
| TW (1) | TWI513770B (en) |
| WO (1) | WO2011093353A2 (en) |
Families Citing this family (29)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2784128B1 (en) * | 2011-11-25 | 2016-05-25 | LG Chem, Ltd. | Curable composition |
| JP5664563B2 (en) * | 2012-01-23 | 2015-02-04 | 信越化学工業株式会社 | Thermally conductive silicone composition and cured product thereof |
| JP5922463B2 (en) | 2012-03-30 | 2016-05-24 | 東レ・ダウコーニング株式会社 | Curable silicone composition, cured product thereof, and optical semiconductor device |
| JP6065780B2 (en) * | 2012-08-30 | 2017-01-25 | 信越化学工業株式会社 | Conductive circuit drawing ink composition, conductive circuit forming method, and conductive circuit formed thereby |
| KR101911690B1 (en) * | 2012-12-07 | 2018-10-25 | 다우 코닝 도레이 캄파니 리미티드 | Curable silicone composition and optical semiconductor device |
| JP6339761B2 (en) | 2012-12-17 | 2018-06-06 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone composition and thermally conductive member |
| CN103275492A (en) * | 2013-06-28 | 2013-09-04 | 惠州市粤泰翔科技有限公司 | Heat-conducting silica gel accelerating heat conduction of electrons and electric appliances, and preparation method of heat-conducting silica gel |
| CN104672907A (en) * | 2013-11-30 | 2015-06-03 | 招远市东晟橡胶制品有限公司 | Silicon rubber composition |
| KR102141722B1 (en) | 2014-02-13 | 2020-08-05 | 도레이첨단소재 주식회사 | Adhesive composition for thermally conductive sheet and thermally conductive sheet therefrom |
| JP6257436B2 (en) * | 2014-04-25 | 2018-01-10 | 住友理工株式会社 | Silicone rubber composition and crosslinked silicone rubber |
| KR101630769B1 (en) * | 2014-06-24 | 2016-06-16 | 매그나칩 반도체 유한회사 | Heat releasing semiconductor package and method for manufacturing the same |
| JP6264250B2 (en) * | 2014-09-30 | 2018-01-24 | 信越化学工業株式会社 | Method for producing silicone rubber particles to be blended in synthetic resin composition |
| JP6260519B2 (en) * | 2014-11-25 | 2018-01-17 | 信越化学工業株式会社 | Method for storing and curing one-component addition-curable silicone composition |
| CN104497585A (en) * | 2014-12-17 | 2015-04-08 | 苏州锦腾电子科技有限公司 | High-thermal-conductivity silicone rubber and preparation method thereof |
| CN104497583A (en) * | 2014-12-17 | 2015-04-08 | 苏州锦腾电子科技有限公司 | Silicone rubber with high thermal conductivity and high wear-resisting property and preparation method of silicone rubber |
| JP6524879B2 (en) * | 2015-10-13 | 2019-06-05 | 信越化学工業株式会社 | Addition one-part curing type heat conductive silicone grease composition |
| CN105331116A (en) * | 2015-11-17 | 2016-02-17 | 镇江高美新材料有限公司 | One-component heating-cured liquid silicone rubber and preparation method thereof |
| CN105860540A (en) * | 2016-05-11 | 2016-08-17 | 强新正品（苏州）环保材料科技有限公司 | Manufacturing method of enhanced heat-conductive silica gel |
| JP6620703B2 (en) * | 2016-08-16 | 2019-12-18 | 信越化学工業株式会社 | Thermally conductive silicone resin composition and method for curing the same |
| JP6870258B2 (en) | 2016-09-23 | 2021-05-12 | 日亜化学工業株式会社 | Conductive adhesives and conductive materials |
| KR101864534B1 (en) * | 2017-03-31 | 2018-06-04 | 주식회사 케이씨씨 | Heat-releasing gel type silicone rubber composition |
| JP6896579B2 (en) * | 2017-09-27 | 2021-06-30 | 株式会社東芝 | Structure, wiring board, base material for wiring board and copper-clad laminate |
| CN108015938A (en) * | 2017-12-18 | 2018-05-11 | 无锡海特信成高分子科技有限公司 | A kind of High thermal-conductive silicone grease technological process |
| CN112334542B (en) * | 2018-06-27 | 2023-02-21 | 美国陶氏有机硅公司 | Thermal gap filler and its application in battery management system |
| JP2020132739A (en) * | 2019-02-18 | 2020-08-31 | 信越化学工業株式会社 | Die-bonding silicone resin composition, cured product, and light-emitting diode element |
| CN115637050A (en) * | 2021-07-20 | 2023-01-24 | 中蓝晨光化工研究设计院有限公司 | Heat-conducting siloxane composition |
| KR20240047480A (en) * | 2021-09-30 | 2024-04-12 | 와커 헤미 아게 | Thermally conductive silicone compositions and methods of making gap fillers using the compositions |
| CN116023786B (en) * | 2021-10-27 | 2024-04-12 | 山东东岳有机硅材料股份有限公司 | Self-repairing mixed silicon rubber and preparation and self-repairing method thereof |
| CN115612446B (en) * | 2022-10-27 | 2024-01-26 | 江西蓝星星火有机硅有限公司 | Heat-conducting addition type organic silicon composition for encapsulation |
Family Cites Families (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS56117810A (en) | 1980-02-19 | 1981-09-16 | Nippon Steel Corp | Changing method for thickness of traveling sheet during hot rolling work |
| JP2882823B2 (en) * | 1989-11-15 | 1999-04-12 | 東レ・ダウコーニング・シリコーン株式会社 | adhesive |
| US6387451B1 (en) * | 1994-12-06 | 2002-05-14 | Dow Corning Limited | Curable coating compositions |
| FR2755127B1 (en) | 1996-10-29 | 1998-11-27 | Vetrotex France Sa | SIZED GLASS WIRES FOR THE REINFORCEMENT OF POLYMERIC MATERIALS |
| US6114429A (en) * | 1997-08-06 | 2000-09-05 | Shin-Etsu Chemical Co., Ltd. | Thermally conductive silicone composition |
| US6136758A (en) * | 1998-08-17 | 2000-10-24 | Shin-Etsu Chemical Co., Ltd. | Aluminum nitride powder and thermally conductive grease composition using the same |
| JP3948642B2 (en) * | 1998-08-21 | 2007-07-25 | 信越化学工業株式会社 | Thermally conductive grease composition and semiconductor device using the same |
| JP4646496B2 (en) * | 2003-02-13 | 2011-03-09 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone composition |
| JP4597508B2 (en) | 2003-12-10 | 2010-12-15 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | Silicone adhesive for bonding semiconductor pellet and semiconductor pellet mounting member |
| JP4828146B2 (en) * | 2005-03-30 | 2011-11-30 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone rubber composition |
| WO2007032481A1 (en) * | 2005-09-15 | 2007-03-22 | Nihon Handa Co., Ltd. | Thermosetting silicone rubber composition, electronic component and electronic device |
| US20070219312A1 (en) * | 2006-03-17 | 2007-09-20 | Jennifer Lynn David | Silicone adhesive composition and method for preparing the same |
| JP2010016719A (en) | 2008-07-04 | 2010-01-21 | Sanyo Electric Co Ltd | Communication control apparatus, and receiver mounted with the same |
| JP6014299B2 (en) * | 2008-09-01 | 2016-10-25 | 東レ・ダウコーニング株式会社 | Thermally conductive silicone composition and semiconductor device |
| JP5640021B2 (en) * | 2009-03-12 | 2014-12-10 | ダウ コーニング コーポレーションＤｏｗ Ｃｏｒｎｉｎｇ Ｃｏｒｐｏｒａｔｉｏｎ | Thermal interface materials and methods for their preparation and use |
-
2010
- 2010-01-28 JP JP2010016719A patent/JP5534837B2/en active Active
-
2011
- 2011-01-20 WO PCT/JP2011/051538 patent/WO2011093353A2/en active Application Filing
- 2011-01-20 CN CN201180006026.1A patent/CN102725355B/en active Active
- 2011-01-20 US US13/574,830 patent/US20120292558A1/en not_active Abandoned
- 2011-01-20 EP EP11704094.9A patent/EP2528974B1/en active Active
- 2011-01-20 KR KR1020127022420A patent/KR101758799B1/en active IP Right Grant
- 2011-01-27 TW TW100103162A patent/TWI513770B/en active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2011153252A5 (en) | ||
| JP2019123884A5 (en) | ||
| JP2016033215A5 (en) | ||
| JP2016135878A5 (en) | ||
| MY181765A (en) | Heat-resistant adhesive sheet for semiconductor testing | |
| JP2012524159A5 (en) | ||
| JP2015025125A5 (en) | ||
| BR112013016672A2 (en) | cross-linking method and an associated device | |
| JP2015523307A5 (en) | ||
| MY160364A (en) | Adhesive tape for manufacturing electronic components | |
| WO2008152956A1 (en) | Photocurable pressure-sensitive adhesive composition | |
| JP2015147828A5 (en) | ||
| RU2013106740A (en) | SUBSTRATE | |
| RU2014102784A (en) | SOUND-ABSORBING PANEL AND METHOD FOR ITS ASSEMBLY | |
| JP2008156383A5 (en) | ||
| EP2431963A3 (en) | Adhesive Label and Apparatus for Producing the same | |
| JP2015160955A5 (en) | ||
| JP2012184410A5 (en) | ||
| JP2009149913A5 (en) | ||
| JP2017099467A5 (en) | ||
| CN106463486B (en) | Thermal diffusion sheet | |
| BR112016024360A2 (en) | thin glass manufacturing process | |
| EP2439720A3 (en) | Adhesive label and method of producing the same | |
| JP2012188555A5 (en) | Semiconductor sealing resin composition, semiconductor device, and method of manufacturing semiconductor device | |
| CN104017507B (en) | The adhesive technology method of U-shaped slide rail phenolic aldehyde-Derlin glued membrane |