JP2011150354A - Positive photosensitive resin composition and method of forming cured film using the same - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a positive photosensitive resin composition that is superior in sensitivity, film retention and storage stability and from which a cured film superior in heat resistance, adhesion, transmittance or the like is obtained by curing thereof, and to provide a method of forming the cured film using the same. <P>SOLUTION: The positive photosensitive resin composition contains: a resin which contains a specific acrylic-acid-type structural unit generating a carboxyl group upon dissociation of a dissociable group and a structural unit having a functional group capable of forming a covalent bond by reaction with a carboxyl group, is alkali-insoluble or hardly alkali-soluble, and becomes alkali-soluble upon dissociation of the acid-dissociable group; a compound having two or more epoxy groups in the molecule; and a compound which generates an acid upon irradiation with actinic rays having a wavelength of ≥300 nm. There is also provided the method of forming the cured film using the same. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a positive photosensitive resin composition and a cured film forming method using the same. More specifically, a positive photosensitive resin composition suitable for forming a flattening film, protective film or interlayer insulating film of electronic components such as a liquid crystal display element, an integrated circuit element, a solid-state imaging element, and an organic EL, and its use The present invention relates to a method for forming a cured film.

  Conventionally, in electronic parts such as liquid crystal display elements, integrated circuit elements, solid-state imaging elements, organic EL, etc., in general, a flattening film for imparting flatness to the surface of electronic parts, to prevent deterioration and damage of electronic parts A photosensitive resin composition is used when forming a protective film or an interlayer insulating film for maintaining insulation. For example, a TFT type liquid crystal display element is provided with a polarizing plate on a glass substrate, a transparent conductive circuit layer such as ITO and a thin film transistor (TFT) are formed, and covered with an interlayer insulating film to form a back plate, while on a glass substrate A polarizing plate is provided, and a pattern of a black matrix layer and a color filter layer is formed as necessary. Further, a transparent conductive circuit layer and an interlayer insulating film are sequentially formed as a top plate, and the back plate and the top plate are separated by a spacer. It is manufactured by enclosing the liquid crystal between both plates facing each other, but the photosensitive resin composition used when forming the interlayer insulating film in this is sensitivity, residual film rate, heat resistance, adhesion Excellent in transparency and transparency. Furthermore, the photosensitive resin composition is required to have excellent temporal stability during storage.

  As the photosensitive resin composition, for example, Patent Document 1 discloses (A) (a) an unsaturated carboxylic acid or unsaturated carboxylic acid anhydride, (b) a radical polymerizable compound having an epoxy group, and (c) other A resin soluble in an alkaline aqueous solution, which is a polymer of a radical polymerizable compound, and (B) a photosensitive resin composition containing a radiation-sensitive acid generating compound, Patent Document 2 discloses an alkali-soluble acrylic polymer binder, A photosensitive resin composition comprising a quinonediazide group-containing compound, a crosslinking agent, and a photoacid generator has been proposed. However, these methods are not satisfactory for producing a high-quality liquid crystal display element because the sensitivity, unexposed part residual film ratio, resolution, and temporal stability are not sufficient. Patent Document 3 discloses that a crosslinking agent, an acid generator, and itself is insoluble or hardly soluble in an alkaline aqueous solution, but has a protecting group that can be cleaved by the action of an acid, and the protecting group is cleaved. Has proposed a positive chemically amplified resist composition characterized by containing a resin that is soluble in an alkaline aqueous solution. However, adhesion and transmittance are not sufficient, and it is not satisfactory for producing a high-quality liquid crystal display element. Patent Document 4 proposes a radiation-sensitive resin composition characterized by containing an acetal structure and / or a ketal structure, a resin containing an epoxy group, and an acid generator. It was not a thing.

JP-A-5-165214 JP-A-10-153854 JP 2004-4669 A JP 2004-264623 A

  Accordingly, the object of the present invention is a positive photosensitive resin composition excellent in sensitivity, remaining film ratio, and storage stability, and a cured film forming method using the same, and is cured by heat resistance and adhesion. It is to provide a positive photosensitive resin composition and a cured film forming method using the same, from which a cured film having excellent transmittance and the like can be obtained.

As a result of intensive studies to solve the above problems, the present inventor has reached the present invention.
The present invention is as follows.

(1) (A) Containing a structural unit represented by the following general formula (1) and a structural unit having an epoxy group (excluding a monomer-derived unit represented by the following general formula (4)) A resin that is insoluble or hardly soluble in alkali and becomes alkali-soluble when the acid-dissociable group is dissociated, (B) a compound having two or more epoxy groups in the molecule (excluding A) And (C) a positive photosensitive resin composition comprising a compound that generates an acid upon irradiation with an actinic ray having a wavelength of 300 nm or more.

In general formula (1),
R ¹ represents a hydrogen atom, a methyl group, a halogen atom or a cyano group.

R ² and R ³ each independently represents a hydrogen atom, a linear or branched alkyl group. However, the case where R ² and R ³ are hydrogen atoms at the same time is excluded.

R ⁴ represents an optionally substituted linear, branched or cyclic alkyl group, or an aralkyl group.

R ² and R ⁴ may be linked to form a cyclic ether.

  In the formula, X represents a divalent linking group.

R ⁷ represents a hydrogen atom, a methyl group or a halogen atom.

R ¹¹ and R ¹² each independently represents a hydrogen atom or an alkyl group.

  n represents an integer of 1 to 10.

(2) The structural unit having an epoxy group in the component (A) is a monomer-derived unit represented by the following general formula (3) or (5), described in (1) above Positive photosensitive resin composition.

  In general formulas (3) and (5), X represents a divalent linking group.

R ⁷ represents a hydrogen atom, a methyl group or a halogen atom.

R ^{8 to} R ¹⁰ and R ^{13 to} R ¹⁵ each independently represent a hydrogen atom or an alkyl group.

  n represents an integer of 1 to 10.

(3) The positive photosensitive resin composition as described in (1) or (2) above, wherein the component (C) contains a compound containing an oxime sulfonate group represented by the following general formula (2): object.

In general formula (2),
R ⁵ represents a linear, branched or cyclic alkyl group which may be substituted, or an aryl group which may be substituted.

(4) The positive photosensitive resin composition as described in (1) or (2) above, wherein the component (C) contains a compound represented by the following general formula (2A).

In general formula (2A),
R ⁵ represents a linear, branched or cyclic alkyl group which may be substituted, or an aryl group which may be substituted.
X represents an alkyl group, an alkoxy group, or a halogen atom.
m represents an integer of 0 to 3. When m is 2 or 3, the plurality of X may be the same or different.

(5) The positive photosensitive resin composition as described in any one of (1) to (4) above, further comprising (D) an adhesion assistant.
(6) The step of applying the positive photosensitive resin composition according to any one of the above (1) to (5) on a substrate and drying to form a coating film, actinic rays having a wavelength of 300 nm or more through a mask A method of forming a cured film, comprising: a step of exposing the substrate using an alkali developer; a step of developing using an alkali developer to form a pattern; and a step of heat-treating the obtained pattern.

  (7) The method according to (6), further comprising a step of exposing the entire surface after the step of developing with an alkali developer and forming the pattern and before the step of heat-treating the obtained pattern. Cured film forming method.

  (8) A cured film obtained by the method according to (6) or (7) above.

The preferred embodiments of the present invention will be further described below.
(9) The positive type according to any one of (1) to (5) above, wherein the component (B) is contained in an amount of 1 to 50 parts by mass with respect to 100 parts by mass of the total amount of the component (A). Photosensitive resin composition.

  (10) Any of (1) to (5) and (9) above, wherein 0.1 to 10 parts by mass of component (C) is contained with respect to 100 parts by mass of the total amount of component (A). A positive photosensitive resin composition according to claim 1.

  (11) The component (D) is contained in an amount of 0.1 to 20 parts by mass with respect to 100 parts by mass of the total amount of the components (A). A positive photosensitive resin composition according to claim 1.

  According to the present invention, a positive photosensitive resin composition excellent in sensitivity, remaining film ratio, and storage stability and a cured film forming method using the same, and by curing, heat resistance, adhesion, transmittance, etc. A positive photosensitive resin composition and a cured film forming method using the same can be provided.

Hereinafter, the present invention will be described in detail.
In addition, in the description of the group (atomic group) in this specification, the description which does not describe substitution and non-substitution includes what has a substituent with what does not have a substituent. For example, the “alkyl group” includes not only an alkyl group having no substituent (unsubstituted alkyl group) but also an alkyl group having a substituent (substituted alkyl group).

(A) Resin Component The positive photosensitive resin composition of the present invention contains a structural unit represented by the following general formula (1) and a structural unit having a functional group capable of reacting with a carboxyl group to form a covalent bond. In addition, it contains a resin (also referred to as “component (A)”) that is insoluble or hardly soluble in alkali and becomes alkali-soluble when the acid-dissociable group is dissociated, but further contains other resins. May be. Here, the acid dissociable group represents a functional group capable of dissociating in the presence of an acid.

In general formula (1),
R ¹ represents a hydrogen atom, a methyl group, a halogen atom or a cyano group.
R ² and R ³ each independently represents a hydrogen atom, a linear or branched alkyl group. However, the case where R ² and R ³ are hydrogen atoms at the same time is excluded.
R ⁴ represents an optionally substituted linear, branched or cyclic alkyl group, or an aralkyl group.

R ² and R ⁴ may be linked to form a cyclic ether.

In the general formula (1), R ¹ is preferably a hydrogen atom or a methyl group.
R ² and R ³ are preferably a linear or branched alkyl group having 1 to 6 carbon atoms.

R ⁴ is preferably a linear, branched or cyclic alkyl group having 1 to 10 carbon atoms which may be substituted. Here, as a substituent, a C1-C5 alkoxy group or a halogen atom is preferable.
The aralkyl group as R ⁴ is preferably an aralkyl group having 7 to 10 carbon atoms.
When R ² and R ⁴ are linked to form a cyclic ether, it is preferable that R ² and R ⁴ are linked to form an alkylene chain having 2 to 5 carbon atoms.

  Examples of the radical polymerizable monomer used to form the structural unit represented by the general formula (1) include 1-alkoxyalkyl acrylate, 1-alkoxyalkyl methacrylate, 1- (haloalkoxy) alkyl acrylate, Examples include 1- (haloalkoxy) alkyl methacrylate, 1- (aralkyloxy) alkyl acrylate, 1- (aralkyloxy) alkyl methacrylate, tetrahydropyranyl acrylate, and tetrahydropyranyl methacrylate. Among these, 1-alkoxyalkyl acrylate, 1-alkoxyalkyl methacrylate, tetrahydropyranyl acrylate and tetrahydropyranyl methacrylate are preferable, and 1-alkoxyalkyl acrylate and 1-alkoxyalkyl methacrylate are particularly preferable.

  Specific examples of the radical polymerizable monomer used for forming the structural unit represented by the general formula (1) include 1-ethoxyethyl methacrylate, 1-ethoxyethyl acrylate, 1-methoxyethyl methacrylate, 1-methoxyethyl acrylate, 1-n-butoxyethyl methacrylate, 1-n-butoxyethyl acrylate, 1-isobutoxyethyl methacrylate, 1- (2-chloroethoxy) ethyl methacrylate, 1- (2-ethylhexyloxy) ethyl methacrylate 1-n-propoxyethyl methacrylate, 1-cyclohexyloxyethyl methacrylate, 1- (2-cyclohexylethoxy) ethyl methacrylate, 1-benzyloxyethyl methacrylate, and the like. It can be used in combination the above.

As the radical polymerizable monomer used for forming the structural unit represented by the general formula (1), a commercially available one may be used, or one synthesized by a known method may be used. For example, as shown below, it can be synthesized by reacting (meth) acrylic acid with vinyl ether in the presence of an acid catalyst.

Wherein, R ^1, R ³ and R ⁴ correspond to R ^1, R ³ and R ⁴ in the general formula (1), R ¹³ and R ^14, -CH (R ¹³⁾ as (R ^14), This corresponds to R ² in the general formula (1).
The photosensitive composition of the present invention is applied on a substrate and dried to form a coating film, exposed to light using an actinic ray through a mask, developed using an alkaline developer to form a pattern, necessary The cured film is formed through a process including a step of exposing the entire surface in accordance with the above and a step of heat-treating the obtained pattern, and is represented by the formula (1) in the component (A) in the step of the entire surface exposure or heat treatment. The acid dissociable group (—C (R ² ) (R ³ ) OR ⁴ ) is dissociated from the structural unit to form a carboxyl group in the side chain of the component (A).

  In the structural unit having a functional group capable of reacting with a carboxyl group contained in the component (A) of the present invention to form a covalent bond, the “functional group capable of reacting with a carboxyl to form a covalent bond” The functional group which reacts with the carboxyl group produced | generated to the side chain of (A) component like this by heat processing, and forms a covalent bond is meant.

As described above, the carboxyl group generated in the side chain of the component (A) and the “functional group capable of forming a covalent bond by reacting with the carboxyl group” in the component (A) form a covalent bond by heat treatment, By crosslinking, a good cured film is formed.
Examples of such a functional group that can react with a carboxyl group to form a covalent bond include an epoxy group and an oxetane group, and an epoxy group is particularly preferable.

As a structural unit having a functional group capable of forming a covalent bond by reacting with a carboxyl group, it is formed using a radical polymerizable monomer represented by any one of the following general formulas (3) to (5). A structural unit containing an epoxy group as a functional group is preferred. The molecular weight of the radical polymerizable monomer represented by any one of the general formulas (3) to (5) is preferably 100 to 500, and more preferably 120 to 200.

In General Formulas (3) to (5), X represents a divalent linking group, and examples thereof include organic groups such as —O—, —S—, —COO—, and —OCH ₂ COO—.
R ⁷ represents a hydrogen atom, a methyl group or a halogen atom, preferably a hydrogen atom or a methyl group.
R ^{8 to} R ¹⁵ each independently represents a hydrogen atom or an alkyl group. Preferably it represents a hydrogen atom or a methyl group.
n is an integer of 1-10.

  Specific examples of radical polymerizable monomers used to form a structural unit containing an epoxy group as a functional group capable of reacting with a carboxyl group to form a covalent bond include glycidyl acrylate, glycidyl methacrylate, 3,4-epoxybutyl acrylate, 3,4-epoxybutyl methacrylate, 4,5-epoxypentyl acrylate, 4,5-epoxypentyl methacrylate, 6,7-epoxyheptyl acrylate, 6,7 methacrylate -(Meth) acrylates such as epoxy heptyl; o-vinylbenzyl glycidyl ether, m-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, p-vinylbenzyl glycidyl ether, α-methyl-o-vinylbenzyl glycidyl ether, α-Methyl-m-vinylbenzylglycidyl Ether, vinylbenzyl glycidyl ethers such as α- methyl -p- vinylbenzyl glycidyl ether; p-vinylphenyl glycidyl ether, 3,4-epoxycyclohexylmethyl acrylate, 3,4-epoxycyclohexylmethyl methacrylate. Glycidyl acrylate, glycidyl methacrylate, p-vinylphenyl glycidyl ether, 3,4-epoxycyclohexylmethyl acrylate, and 3,4-epoxycyclohexylmethyl methacrylate are preferable, and glycidyl acrylate and glycidyl methacrylate are particularly preferable.

  In the specific example having an epoxy group as the functional group, a structural unit having an oxetane group as a functional group can be formed using a compound in which the epoxy group is replaced with an oxetane group.

  The radical polymerizable monomer used to form a structural unit having a functional group capable of reacting with a carboxyl group to form a covalent bond may be a commercially available one or one synthesized by a known method. May be.

The content of the structural unit represented by the general formula (1) is preferably from 10 to 90 mol%, more preferably from 20 to 50 mol%, in all repeating units constituting the resin of the component (A).
The content of the structural unit having a functional group capable of forming a covalent bond by reacting with a carboxyl group is preferably 5 to 50 mol%, and preferably 10 to 40 mol% in all repeating units constituting the resin of component (A). Is more preferable.

  In the component (A), if necessary, the constituent unit other than the constituent unit represented by the general formula (1) and the constituent unit having a functional group capable of forming a covalent bond by reacting with the carboxyl group is copolymerized. Can do.

  Examples of the structural unit other than the structural unit represented by the general formula (1) and the structural unit having a functional group capable of reacting with a carboxyl group to form a covalent bond include styrene, tert-butoxystyrene, methylstyrene, hydroxystyrene, α-methylstyrene, acetoxystyrene, α-methyl-acetoxystyrene, methoxystyrene, ethoxystyrene, chlorostyrene, methyl vinylbenzoate, ethyl vinylbenzoate, acrylic acid, methacrylic acid, methyl acrylate, methyl methacrylate, acrylic acid Ethyl, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, isopropyl acrylate, isopropyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, 2-hydroxyethyl acrylate, 2-hydroxy methacrylate Examples of the structural unit include ethyl, 2-hydroxypropyl acrylate, 2-hydroxypropyl methacrylate, benzyl acrylate, benzyl methacrylate, isobornyl acrylate, isobornyl methacrylate, glycidyl methacrylate, acrylonitrile, and the like. The above can be used in combination.

The total content of these structural units is preferably 90 mol% or less, more preferably 60 mol% or less in the total repeating units constituting the resin of component (A).
(A) The molecular weight of a component is a polystyrene conversion weight average molecular weight, Preferably it is 1,000-200,000, More preferably, it is the range of 2,000-50,000.
As the component (A), two or more kinds of resins containing different constitutional units can be mixed and used, or two or more kinds of resins comprising the same constitutional unit and having different compositions can be used in combination. it can.

  Various methods for synthesizing the component (A) are known. To give an example, at least a radical polymerizable monomer used to form the structural unit represented by the general formula (1) is given. Radical polymerization of a radical polymerizable monomer mixture containing a radical polymerizable monomer used to form a structural unit having a functional group capable of forming a covalent bond by reacting with a carboxyl group in an organic solvent. It can synthesize | combine by superposing | polymerizing using an initiator.

(B) Compound having two or more epoxy groups in the molecule Specific examples of the compound having two or more epoxy groups in the molecule (also referred to as “component (B)”) include bisphenol A type epoxy resins and bisphenols. Examples thereof include an F-type epoxy resin, a phenol novolac epoxy resin, a cresol novolac epoxy resin, and an aliphatic epoxy resin.

These are available as commercial products. For example, as bisphenol A type epoxy resin, JER827, JER828, JER834, JER1001, JER1002, JER1003, JER1055, JER1007, JER1009, JER1010 (above, manufactured by Japan Epoxy Resin Co., Ltd.), EPICLON860, EPICLON1050, EPICLON1051, EPICLON1051, EPICLON1051 , Dainippon Ink Chemical Co., Ltd.), etc., as bisphenol F type epoxy resin, JER806, JER807, JER4004, JER4005, JER4007, JER4010 (above, Japan Epoxy Resin Co., Ltd.), EPICLON830, EPICLON835 (above) , Manufactured by Dainippon Ink & Chemicals, Inc.), LCE-21, RE-602S (above Nippon Kayaku Co., Ltd.), etc., as phenol novolak type epoxy resins, JER152, JER154, JER157S70 (above, Japan Epoxy Resin Co., Ltd.), EPICLON N-740, EPICLON N-740, EPICLON N- 770, EPICLON N-775 (manufactured by Dainippon Ink Chemical Co., Ltd.), etc., as cresol novolak type epoxy resins, EPICLON N-660, EPICLON N-665, EPICLON N-670, EPICLON N-673, EPICLON N-680, EPICLON N-690, EPICLON N-695 (manufactured by Dainippon Ink & Chemicals, Inc.), EOCN-1020 (manufactured by Nippon Kayaku Co., Ltd.), etc. as aliphatic epoxy resins ADEKA ESIN EP-4080S, EP-4085S, EP-4088S (manufactured by ADEKA), Celoxide 2021P, Celoxide 2081, Celoxide 2083, Celoxide 2085, EHPE3150, EPOLEAD PB 3600, PB 4700 (above, Daicel Chemical Etc.). In addition,
ADEKA RESIN EP-4000S, EP-4003S, EP-4010S, EP-4011S (above, manufactured by ADEKA Corporation), NC-2000, NC-3000, NC-7300, XD-1000, EPPN-501, EPPN-502 (above, ADEKA Co., Ltd.) etc. are mentioned, It can use individually or in combination of 2 or more types.

  Among these, preferred are bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, and cresol novolac type epoxy resin. A bisphenol A type epoxy resin is particularly preferable.

  As for the content rate of (B) component, 1-50 mass parts is preferable with respect to 100 mass parts of total amounts of (A) component, More preferably, it is 5-30 mass parts.

  The component (B) is effective for improving the adhesion with a metal layer such as chromium, molybdenum, aluminum, tantalum, titanium, copper, cobalt, tungsten, and nickel. When these metal layers are formed by a sputtering method, the effect is remarkable.

(C) Compound that generates acid upon irradiation with actinic rays having a wavelength of 300 nm or longer As the compound that generates acid upon irradiation with actinic rays having a wavelength of 300 nm or longer, which is used in the present invention (also referred to as “component (C)”), It represents a compound that is sensitive to actinic rays having a wavelength of 300 nm or more and generates an acid, and is not limited by the structure. As the generated acid, a compound that generates an acid having a pKa of 3 or less is preferable, and a compound that generates a sulfonic acid is particularly preferable. These components (C) can be used alone or in combination of two or more.
(C) As a specific example of a component, the compound containing the oxime sulfonate group represented by General formula (2) is preferable.

In general formula (2),
R ⁵ represents a linear, branched, or cyclic alkyl group that may be substituted, or an aryl group that may be substituted.
As the alkyl group for R ^5, a linear or branched alkyl group having 1 to 10 carbon atoms is preferable. The alkyl group of R ⁵ is an alkoxy group having 1 to 10 carbon atoms or an alicyclic group (including a bridged alicyclic group such as a 7,7-dimethyl-2-oxonorbornyl group, preferably a bicycloalkyl group). Etc.).

The aryl group for R ⁵ is preferably an aryl group having 6 to 11 carbon atoms, and more preferably a phenyl group or a naphthyl group. The aryl group of R ⁵ may be substituted with an alkyl group having 1 to 5 carbon atoms, an alkoxy group, or a halogen atom.
The compound containing the oxime sulfonate group represented by the general formula (2) is more preferably a compound represented by the following general formula (2A).

In general formula (2A),
R ⁵ is the same as R ⁵ in formula (2).
X represents an alkyl group, an alkoxy group, or a halogen atom.
m represents an integer of 0 to 3. When m is 2 or 3, the plurality of X may be the same or different.
The alkyl group as X is preferably a linear or branched alkyl group having 1 to 4 carbon atoms.

The alkoxy group as X is preferably a linear or branched alkoxy group having 1 to 4 carbon atoms.
The halogen atom as X is preferably a chlorine atom or a fluorine atom.
m is preferably 0 or 1.
In particular, in the general formula (2A), a compound in which m is 1, X is a methyl group, and the substitution position of X is ortho is preferable.

Specific examples of the oxime sulfonate compound include, for example, the following compound (i), compound (ii), compound (iii), compound (iv), compound (v), etc., alone or in combination of two or more. Can be used. It can also be used in combination with other types of component (C).

  Compounds (i) to (v) can be obtained as commercial products.

(D) Adhesion aid The positive photosensitive resin composition of the present invention may further contain (D) an adhesion aid.
As the adhesion assistant (D) that can be used in the present invention, the adhesion between an insulating material and an inorganic material serving as a substrate, for example, a silicon compound such as silicon, silicon oxide, or silicon nitride, gold, copper, aluminum, or the like. It is a compound that improves. Specific examples include silane coupling agents and thiol compounds.
The silane coupling agent as the adhesion aid used in the present invention is intended to modify the interface, and any known silane coupling agent can be used without any particular limitation.

  Preferred silane coupling agents include, for example, γ-glycidoxypropyltrialkoxysilane, γ-glycidoxypropylalkyldialkoxysilane, γ-methacryloxypropyltrialkoxysilane, γ-methacryloxypropylalkyldialkoxysilane, Examples include γ-chloropropyltrialkoxysilane, γ-mercaptopropyltrialkoxysilane, β- (3,4-epoxycyclohexyl) ethyltrialkoxysilane, and vinyltrialkoxysilane.

γ-glycidoxypropyltrialkoxysilane and γ-methacryloxypropyltrialkoxysilane are more preferable, and γ-glycidoxypropyltrialkoxysilane is even more preferable.
These can be used alone or in combination of two or more. These are effective for improving the adhesion to the substrate and also for adjusting the taper angle with the substrate.

  In the positive photosensitive resin composition of the present invention, the mixing ratio of the component (A), the component (B), the component (C), and the component (D) is (B) with respect to 100 parts by mass of the component (A). 1-50 mass parts is preferable, and, as for a component, 5-30 mass parts is more preferable. Moreover, 0.1-10 mass parts is preferable, and, as for (C) component, 0.5-10 mass parts is more preferable. Moreover, (D) component is 20 mass parts or less, and 10 mass parts or less are more preferable.

<Other ingredients>
In addition to the components (A), (B), (C), and (D), the positive photosensitive resin composition of the present invention includes a basic compound, a surfactant, and an ultraviolet absorber as necessary. An agent, a sensitizer, a plasticizer, a thickener, an organic solvent, an adhesion promoter, an organic or inorganic precipitation inhibitor, and the like can be added.

<Basic compound>
The basic compound can be arbitrarily selected from those used in chemically amplified resists. Examples include aliphatic amines, aromatic amines, heterocyclic amines, quaternary ammonium hydroxides, carboxylic acid quaternary ammonium salts, and the like.

  Examples of the aliphatic amine include trimethylamine, diethylamine, triethylamine, di-n-propylamine, tri-n-propylamine, di-n-pentylamine, tri-n-pentylamine, diethanolamine, triethanolamine, and dicyclohexylamine. , Dicyclohexylmethylamine and the like.

  Examples of the aromatic amine include aniline, benzylamine, N, N-dimethylaniline, diphenylamine and the like.

Examples of the heterocyclic amine include pyridine, 2-methylpyridine, 4-methylpyridine, 2-ethylpyridine, 4-ethylpyridine, 2-phenylpyridine, 4-phenylpyridine, N-methyl-4-phenylpyridine, 4-dimethylaminopyridine, imidazole, benzimidazole, 4-methylimidazole, 2-phenylbenzimidazole, 2,4,5-triphenylimidazole, nicotine, nicotinic acid, nicotinamide, quinoline, 8-oxyquinoline, pyrazine, Pyrazole, pyridazine, purine, pyrrolidine, piperidine, piperazine, morpholine, 4-methylmorpholine, 1,5-diazabicyclo [4,3,0] -5-nonene, 1,8-diazabicyclo [5,3,0] -7 Undesen.

  Examples of the quaternary ammonium hydroxide include tetramethylammonium hydroxide, tetraethylammonium hydroxide, tetra-n-butylammonium hydroxide, and tetra-n-hexylammonium hydroxide.

  Examples of the carboxylic acid quaternary ammonium salt include tetramethylammonium acetate, tetramethylammonium benzoate, tetra-n-butylammonium acetate, and tetra-n-butylammonium benzoate.

  The mixing ratio of the basic compound is preferably 0.001 to 1 part by mass and more preferably 0.005 to 0.2 part by mass per 100 parts by mass of the component (A).

<Surfactant>
As the surfactant, any of anionic, cationic, nonionic or amphoteric can be used, but a preferred surfactant is a nonionic surfactant. Examples of nonionic surfactants include polyoxyethylene higher alkyl ethers, polyoxyethylene higher alkyl phenyl ethers, higher fatty acid diesters of polyoxyethylene glycol, silicone-based and fluorine-based surfactants. it can. The following trade names are KP (manufactured by Shin-Etsu Chemical Co., Ltd.), Polyflow (manufactured by Kyoeisha Chemical Co., Ltd.), F Top (manufactured by JEMCO), Mega Fuck (manufactured by Dainippon Ink and Chemicals), Florard (manufactured by Sumitomo 3M), Asahi Guard, Each series such as Surflon (manufactured by Asahi Glass) PolyFox (manufactured by OMNOVA) can be listed.

Surfactant can be used individually or in mixture of 2 or more types.
The compounding ratio of the surfactant is usually 10 parts by mass or less per 100 parts by mass of the component (A), preferably 0.01 to 10 parts by mass, and more preferably 0.01 to 1 part by mass.

<Plasticizer>
Examples of the plasticizer include dibutyl phthalate, dioctyl phthalate, didodecyl phthalate, polyethylene glycol, glycerin, dimethyl glycerin phthalate, dibutyl tartrate, dioctyl adipate, and triacetyl glycerin.

  The blending ratio of the plasticizer is preferably 20 parts by mass or less, more preferably 10 parts by mass or less per 100 parts by mass of the component (A).

<Solvent>
The positive photosensitive composition of the present invention is used as a solution by dissolving the above components in a solvent. As the solvent used in the positive photosensitive composition of the present invention, for example,
(A) Ethylene glycol monoalkyl ethers such as ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monopropyl ether, ethylene glycol monobutyl ether;
(A) Ethylene glycol dialkyl ethers such as ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dipropyl ether;
(C) Ethylene glycol monoalkyl ether acetates such as ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate;
(D) Propylene glycol monoalkyl ethers such as propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether;
(E) propylene glycol dialkyl ethers such as propylene glycol dimethyl ether, propylene glycol diethyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether;
(F) Propylene glycol monoalkyl ether acetates such as propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate;
(G) Diethylene glycol dialkyl ethers such as diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether;
(H) Diethylene glycol monoalkyl ether acetates such as diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl ether acetate;
(G) Dipropylene glycol monoalkyl ethers such as dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether;
(Co) dipropylene glycol dialkyl ethers such as dipropylene glycol dimethyl ether, dipropylene glycol diethyl ether, dipropylene glycol ethyl methyl ether;
(Sa) Dipropylene glycol monoalkyl ether acetates such as dipropylene glycol monomethyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl ether acetate;
(L) Lactic acid esters such as methyl lactate, ethyl lactate, n-propyl lactate, isopropyl lactate, n-butyl lactate, isobutyl lactate, n-amyl lactate, isoamyl lactate;
(S) n-butyl acetate, isobutyl acetate, n-amyl acetate, isoamyl acetate, n-hexyl acetate, 2-ethylhexyl acetate, ethyl propionate, n-propyl propionate, isopropyl propionate, n-butyl propionate, propionate Aliphatic carboxylic acid esters such as isobutyl acid, methyl butyrate, ethyl butyrate, ethyl butyrate, n-propyl butyrate, isopropyl butyrate, n-butyl butyrate, isobutyl butyrate;
(C) ethyl hydroxyacetate, ethyl 2-hydroxy-2-methylpropionate, ethyl 2-hydroxy-3-methylbutyrate, ethyl methoxyacetate, ethyl ethoxyacetate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, 3- Ethoxypropion methyl, 3-ethoxypropion ethyl, 3-methoxybutyl acetate, 3-methyl-3-methoxybutyl acetate, 3-methyl-3-methoxybutyl propionate, 3-methyl-3-methoxybutyl butyrate, aceto Other esters such as methyl acetate, ethyl acetoacetate, methyl pyruvate, ethyl pyruvate;
(So) ketones such as methyl ethyl ketone, methyl propyl ketone, methyl-n-butyl ketone, methyl isobutyl ketone, 2-heptanone, 3-heptanone, 4-heptanone, cyclohexanone;
(Ta) Amides such as N-methylformamide, N, N-dimethylformamide, N-methylacetamide, N, N-dimethylacetamide, N-methylpyrrolidone;
(H) Examples include lactones such as γ-butyrolactone.

  In addition, benzyl ethyl ether, dihexyl ether, ethylene glycol monophenyl ether acetate, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonal as necessary for these solvents. , Benzyl alcohol, anisole, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, ethylene carbonate, propylene carbonate and the like can also be added.

A solvent can be used individually or in mixture of 2 or more types.
The blending ratio of the solvent is usually 50 to 3,000 parts by weight, preferably 100 to 2,000 parts by weight, and more preferably 100 to 500 parts by weight per 100 parts by weight of the component (A).

  By using a positive photosensitive resin composition containing the component (A) and the component (B), a positive photosensitive resin composition excellent in sensitivity, remaining film ratio, and stability over time, and cured. By this, the positive photosensitive resin composition from which the cured film excellent in heat resistance, adhesiveness, transparency, etc. is obtained can be provided.

<Method for forming cured film>
Next, a method for forming a cured film using the positive photosensitive resin composition of the present invention will be described.
The positive photosensitive resin composition according to the present invention is applied on a substrate and heated to form a coating film on the substrate.

By irradiating the obtained coating film with an actinic ray having a wavelength of 300 nm or more, the component (C) is decomposed to generate an acid. Due to the catalytic action of the generated acid, the acid dissociable group in the structural unit represented by the general formula (1) contained in the component (A) is dissociated by a hydrolysis reaction, and a carboxyl group is generated. By developing this using an alkali developer, an exposed portion containing a resin having a carboxyl group that is easily dissolved in the alkali developer is removed, and a positive image is formed.
The reaction formula of this hydrolysis reaction is shown below.

In order to accelerate the hydrolysis reaction, post exposure bake (hereinafter referred to as PEB) can be performed as necessary. When the heating temperature becomes high, the generated carboxyl group causes a crosslinking reaction with the epoxy group, so that development cannot be performed.
Actually, when tert-butyl methacrylate is used in place of the repeating unit represented by the general formula (1), the activation energy of the acid dissociation reaction is high. Therefore, PEB at a high temperature is required to dissociate the acid dissociable group. There is a cross-linking reaction at the same time, and an image cannot be obtained.

On the other hand, the acid dissociable group represented by the general formula (1) of the present invention has a low activation energy for acid decomposition and is easily decomposed by an acid derived from an acid generator by exposure to generate a carboxyl group. The positive image can be formed by development.
In addition, by performing PEB at a relatively low temperature, decomposition of the acid dissociable group may be promoted without causing a crosslinking reaction.
The PEB temperature is preferably 130 ° C. or lower, more preferably 110 ° C. or lower, and particularly preferably 80 ° C. or lower.

Next, by heating the obtained positive image, the acid-dissociable group in the general formula (1) is thermally decomposed to generate a carboxyl group, and a cured film can be formed by crosslinking with an epoxy group. it can. This heating is preferably performed at a high temperature of 150 ° C. or more, more preferably 180 to 250 ° C., particularly preferably 200 to 250 ° C.
The heating time can be appropriately set depending on the heating temperature or the like, but is generally 10 to 90 minutes.

If a step of irradiating the entire surface with actinic rays is added before the heating step, the crosslinking reaction can be promoted by an acid generated by the irradiation of actinic rays.
Next, a method for forming a cured film using the positive photosensitive resin composition of the present invention will be specifically described.

  Preparation method of composition solution: (A) component, (B) component, (C) component and other compounding agents are mixed at a predetermined ratio and in an arbitrary method, and stirred and dissolved to prepare a composition solution. For example, each component can be dissolved in a solvent in advance to obtain a solution, and then mixed at a predetermined ratio to prepare a composition solution. The composition solution prepared as described above can be used after being filtered using a filter having a pore size of 0.2 μm or the like.

<Method for creating coating film>
A desired coating film can be formed by applying the composition solution to a predetermined substrate and removing the solvent by heating (hereinafter referred to as pre-baking). Examples of the substrate include a polarizing plate, a glass plate provided with a black matrix layer and a color filter layer as required, and a transparent conductive circuit layer in manufacturing a liquid crystal display element. The coating method on the substrate is not particularly limited, and for example, a spray method, a roll coating method, a spin coating method, or the like can be used.

  The heating conditions during pre-baking are such that the acid dissociable group in the repeating unit represented by the formula (1) in the (A) component in the unexposed area is dissociated and the (A) component is soluble in the alkali developer. However, it is preferably about 80 to 130 [deg.] C. for about 30 to 120 seconds, although it varies depending on the type and mixing ratio of each component.

<Pattern formation method>
After irradiating the substrate on which the coating film is provided with actinic rays through a mask having a predetermined pattern, heat treatment (PEB) is performed as necessary, and then the exposed portion is removed using a developer to form an image pattern. Form.

  For the emission of actinic rays, low-pressure mercury lamps, high-pressure mercury lamps, ultrahigh-pressure mercury lamps, chemical lamps, excimer laser generators, and the like can be used. . Moreover, irradiation light can also be adjusted through spectral filters, such as a long wavelength cut filter, a short wavelength cut filter, and a band pass filter, as needed.

  Examples of the developer include alkali metal hydroxides such as lithium hydroxide, sodium hydroxide, and potassium hydroxide; alkali metal carbonates such as sodium carbonate and potassium carbonate; alkali metals such as sodium bicarbonate and potassium bicarbonate Bicarbonates; ammonium hydroxides such as tetramethylammonium hydroxide, tetraethylammonium hydroxide and choline hydroxide; aqueous solutions such as sodium silicate and sodium metasilicate can be used. An aqueous solution obtained by adding an appropriate amount of a water-soluble organic solvent such as methanol or ethanol or a surfactant to the alkaline aqueous solution can also be used as a developer.

The pH of the developer is preferably 10.0 to 14.0.
The development time is usually 30 to 180 seconds, and the development method may be any of the liquid piling method, the dipping method, and the like. After the development, washing with running water is performed for 30 to 90 seconds, and a desired pattern can be formed.

<Crosslinking process>
For a pattern having an unexposed portion obtained by development, a heating device such as a hot plate or an oven is used to set the oven at a predetermined temperature, for example, 180 to 250 ° C. for a predetermined time, for example, 5 to 30 minutes on the hot plate. Then, by heat treatment for 30 to 90 minutes, the acid dissociable group in component (A) is eliminated, the carboxyl group is generated, and reacted with a functional group capable of reacting with the carboxyl group to form a covalent bond. By crosslinking, a protective film and an interlayer insulating film having excellent heat resistance, hardness and the like can be formed. In addition, when heat treatment is performed, the transparency can be improved by performing the heat treatment in a nitrogen atmosphere.
Prior to the heat treatment, it is preferable to generate an acid from the component (C) present in the unexposed portion by irradiating the patterned substrate with actinic rays.

Next, the present invention will be described more specifically with reference to examples. However, the present invention is not limited to these examples.
[Synthesis Example 1: Synthesis of A-1]
1-n-Butoxyethyl methacrylate 67.1 g (0.36 mol), glycidyl methacrylate 34.1 g (0.24 mol) and methyl isobutyl ketone 300 ml were charged into a 500 ml three-necked flask, and this was a radical polymerization initiator. Then, a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) was added and polymerized at 80 ° C. for 6 hours in a nitrogen stream. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, dissolved in propylene glycol monomethyl ether acetate, and heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to give polymer A-1 (1-n-butoxyethyl methacrylate / methacrylic acid). Glycidyl) was obtained as a propylene glycol monomethyl ether acetate solution.

  The constituent molar ratio of 1-n-butoxyethyl methacrylate units to glycidyl methacrylate units in the obtained polymer was about 60:40 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 8,000, and the molecular weight distribution (Mw / Mn) was 1.8.

[Synthesis Example 2: Synthesis of A-2]
47.5 g (0.3 mol) of 1-ethoxyethyl methacrylate, 25.6 g (0.18 mol) of glycidyl methacrylate, 21.2 g (0.12 mol) of benzyl methacrylate and 300 ml of methyl isobutyl ketone A cervical flask was charged, a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) was added as a radical polymerization initiator, and polymerization was performed at 80 ° C. for 6 hours in a nitrogen stream. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, dissolved in diethylene glycol dimethyl ether, and the heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to give polymer A-2 (1-ethoxyethyl methacrylate / glycidyl methacrylate / benzyl methacrylate). ) As a diethylene glycol dimethyl ether solution.

  The composition ratio of 1-ethoxyethyl methacrylate unit, glycidyl methacrylate unit and benzyl methacrylate unit of the obtained polymer was about 50:30:20 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 7000, and the molecular weight distribution (Mw / Mn) was 1.7.

[Synthesis Example 3: Synthesis of A-3]
79.3 g (0.36 mol) of 1-benzyloxyethyl methacrylate, 23.1 g (0.18 mol) of glycidyl acrylate, 7.8 g (0.06 mol) of 2-hydroxyethyl methacrylate and 300 ml of methyl isobutyl ketone Was added to a 500 ml three-necked flask, and a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) was added as a radical polymerization initiator, followed by polymerization at 80 ° C. for 6 hours under a nitrogen stream. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, dissolved in diethylene glycol ethyl methyl ether, and the heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to give polymer A-3 (1-benzyloxyethyl methacrylate / glycidyl acrylate / 2-hydroxyethyl methacrylate) was obtained as a diethylene glycol ethyl methyl ether solution.

  The composition ratio of 1-benzyloxyethyl methacrylate unit, glycidyl acrylate unit and 2-hydroxyethyl methacrylate unit of the obtained polymer was about 60:30:10 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 10,000, and the molecular weight distribution (Mw / Mn) was 1.8.

[Synthesis Example 4: Synthesis of A-4]
33.3 g (0.3 mol) of 1-ethoxyethyl acrylate, 25.6 g (0.18 mol) of glycidyl methacrylate, 21.2 g (0.12 mol) of benzyl methacrylate and 300 ml of methyl isobutyl ketone A cervical flask was charged, a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) was added as a radical polymerization initiator, and polymerization was performed at 80 ° C. for 6 hours in a nitrogen stream. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, dissolved in propylene glycol monomethyl ether acetate, and heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to give polymer A-4 (1-ethoxyethyl acrylate / glycidyl methacrylate / Benzyl methacrylate) was obtained as a propylene glycol monomethyl ether acetate solution.

  The composition ratio of 1-ethoxyethyl acrylate unit, glycidyl methacrylate unit and benzyl methacrylate unit of the obtained polymer was about 50:30:20 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 8,000, and the molecular weight distribution (Mw / Mn) was 1.7.

[Synthesis Example 5: Synthesis of A-5]
76.4 g (0.36 mol) of 1-cyclohexyloxyethyl methacrylate, 35.3 g (0.18 mol) of 3,4-epoxycyclohexylmethyl methacrylate (Daicel Chemicals Cyclomer M100), 2-hydroxyethyl methacrylate 7.8 g (0.06 mol) and 300 ml of methyl isobutyl ketone were charged into a 500 ml three-necked flask, and a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) was added as a radical polymerization initiator. Polymerization was performed at 80 ° C. for 6 hours under a nitrogen stream. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, dissolved in diethylene glycol dimethyl ether, and the heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to give polymer A-5 (1-cyclohexyloxyethyl methacrylate / 3,4-epoxycyclohexyl). Methyl methacrylate / 2-hydroxyethyl methacrylate) was obtained as a diethylene glycol dimethyl ether solution.

  The composition ratio of the obtained polymer 1-cyclohexyloxyethyl methacrylate unit, 3,4-epoxycyclohexylmethyl methacrylate unit and 2-hydroxyethyl methacrylate unit was about 60:30:10 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 6000, and the molecular weight distribution (Mw / Mn) was 1.8.

[Synthesis Example 6: Synthesis of A-6]
27.0 g (0.36 mol) of 2-tetrahydropyranyl methacrylate, 31.7 g (0.18 mol) of p-vinylphenylglycidyl ether, 7.8 g (0.06 mol) of 2-hydroxyethyl methacrylate and methyl Charge 300 ml of isobutyl ketone to a 500 ml three-necked flask, add a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) as a radical polymerization initiator, and polymerize at 80 ° C. for 6 hours under a nitrogen stream. I let you. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, dissolved in diethylene glycol ethyl methyl ether, and heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to give polymer A-6 (2-tetrahydropyranyl methacrylate / p-vinylphenyl methacrylate). Glycidyl ether / 2-hydroxyethyl methacrylate) was obtained as a diethylene glycol ethyl methyl ether solution.

  The constituent ratio of the 2-tetrahydropyranyl methacrylate unit, the p-vinylphenylglycidyl ether unit and the 2-hydroxyethyl methacrylate unit of the obtained polymer was about 60:30:10 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 7000, and the molecular weight distribution (Mw / Mn) was 1.8.

[Synthesis Example 7: Synthesis of A-7]
1-Ethoxyethyl methacrylate 38.0 g (0.24 mol), glycidyl methacrylate 21.3 g (0.15 mol), benzyl methacrylate 26.4 g (0.15 mol), methacrylic acid 5.2 g (0. 06 mol) and 300 ml of methyl isobutyl ketone were charged into a 500 ml three-necked flask, to which a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) was added as a radical polymerization initiator, Polymerization was carried out at 6 ° C. for 6 hours. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, then dissolved in a mixed solvent of propylene glycol monomethyl ether acetate and diethylene glycol ethyl methyl ether, and heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to obtain polymer A-7 (methacrylic acid 1 -Ethoxyethyl / glycidyl methacrylate / benzyl methacrylate / methacrylic acid) was obtained as a mixed solvent solution of propylene glycol monomethyl ether acetate and diethylene glycol ethyl methyl ether.

  The constituent ratio of 1-ethoxyethyl methacrylate unit, glycidyl methacrylate unit, benzyl methacrylate unit and methacrylic acid in the obtained polymer was about 40: 25: 25: 10 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 7000, and the molecular weight distribution (Mw / Mn) was 1.7.

[Synthesis Example 8: Synthesis of A-8]
47.5 g (0.3 mol) of 1-ethoxyethyl methacrylate, 33.2 g (0.18 mol) of 2- (3-oxacyclobutyl) butyl methacrylate, 21.2 g (0.12 mol) of benzyl methacrylate Then, 300 ml of methyl isobutyl ketone was charged into a 500 ml three-necked flask, to which a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) was added as a radical polymerization initiator, and the mixture was heated at 80 ° C. under nitrogen flow. Polymerized for hours. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, dissolved in propylene glycol monomethyl ether acetate, and heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to give polymer A-8 (1-ethoxyethyl methacrylate / methacrylic acid 2- (3-Oxacyclobutyl) butyl / benzyl methacrylate) was obtained as a propylene glycol monomethyl ether acetate solution.

  The composition ratio of 1-ethoxyethyl methacrylate unit, 2- (3-oxacyclobutyl) butyl methacrylate unit and benzyl methacrylate unit in the obtained polymer was about 50:30:20 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 8,000, and the molecular weight distribution (Mw / Mn) was 1.7.

[Synthesis Comparative Example 1: Synthesis of A′-9]
Three necks of 500 ml of 42.7 g (0.3 mol) of tert-butyl methacrylate, 21.3 g (0.15 mol) of glycidyl methacrylate, 26.4 g (0.15 mol) of benzyl methacrylate and 300 ml of methyl isobutyl ketone A flask was charged with a catalytic amount of 2,2′-azobis (methyl 2-methylpropionate) as a radical polymerization initiator, and polymerized at 80 ° C. for 6 hours under a nitrogen stream. After cooling the reaction solution, it was poured into a large amount of heptane to precipitate a polymer. The crystals were collected by filtration, dissolved in propylene glycol monomethyl ether acetate, and the heptane and methyl isobutyl ketone contained in the solution were distilled off under reduced pressure to give polymer A′-9 (tert-butyl methacrylate / glycidyl methacrylate / Benzyl methacrylate) was obtained as a propylene glycol monomethyl ether acetate solution.

  The composition ratio of the tert-butyl methacrylate unit, the glycidyl methacrylate unit and the benzyl methacrylate unit of the obtained polymer was about 50:25:25 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 7000, and the molecular weight distribution (Mw / Mn) was 1.7.

[Synthesis Comparative Example 2: Synthesis of A′-10]
72.1 g of poly-4-hydroxystyrene (Nippon Soda Co., Ltd. VP-8000), 16.4 g of ethyl vinyl ether and 300 ml of ethyl acetate were charged into a 500 ml three-necked flask, and a catalytic amount of para-toluenesulfonic acid was added thereto. The reaction was performed for 3 hours at room temperature under a nitrogen stream. After adding a small amount of triethylamine, wash with pure water. Propylene glycol monomethyl ether acetate is added to the ethyl acetate layer, and the ethyl acetate is distilled off under reduced pressure, whereby the polymer A′-11 (p-1-ethoxyethoxystyrene / p-hydroxystyrene) is converted into a propylene glycol monomethyl ether acetate solution. Obtained.

  The composition ratio of the p-1-ethoxyethoxystyrene unit and the p-hydroxystyrene unit of the obtained polymer was about 35:65 from NMR measurement. As a result of GPC measurement using polystyrene as a standard, the weight average molecular weight was about 9000, and the molecular weight distribution (Mw / Mn) was 1.2.

[Synthesis Comparative Example 3: Synthesis of A′-11]
A′-12 was synthesized according to Synthesis Example 1 of JP-A No. 2004-264623.

  A 3-neck flask was charged with 7 parts by weight of 2,2′-azobis (2,4-dimethylvaleronitrile) and 200 parts by weight of diethylene glycol ethyl methyl ether, followed by 40 parts by weight of 1- (cyclohexyloxy) ethyl methacrylate and 5 parts by weight of styrene. Then, 45 parts by weight of glycidyl methacrylate, 10 parts by weight of 2-hydroxyethyl methacrylate and 3 parts by weight of α-methylstyrene dimer were charged and purged with nitrogen, and then gently stirred. The temperature of the solution was raised to 70 ° C., and this temperature was maintained for 5 hours to obtain a polymer solution containing the copolymer (A′-12). As a result of GPC measurement using polystyrene as a standard, the polymer obtained had a weight average molecular weight of about 11,000 and a molecular weight distribution (Mw / Mn) of 1.9.

[Examples 1 to 9 and Comparative Examples 1 to 4]
(1) Preparation of Positive Type Photosensitive Resin Composition Solution After mixing the components shown in Table 1 below to make a uniform solution, the solution was filtered using a 0.2 μm polytetrafluoroethylene filter, and positive type A photosensitive resin composition solution was prepared.

(2) Evaluation of storage stability The viscosity of the positive photosensitive resin composition solution at 23 ° C. was measured using an E-type viscometer manufactured by Toki Sangyo Co., Ltd. The viscosity after storing the composition in a thermostatic layer at 23 ° C. for 1 month was measured. When the viscosity increase after storage for 1 month at room temperature is less than 5% with respect to the viscosity after preparation, the case of ◯ and 5% or more was evaluated as x. The results are shown in Table 2 below.

(3) Evaluation of sensitivity and remaining film ratio during development After a positive photosensitive resin composition solution is spin-coated on a silicon wafer having a silicon oxide film, the film thickness is pre-baked on a hot plate at 100 ° C. for 60 seconds. A 3 μm coating film was formed.
Next, using an i-line stepper (FPA-3000i5 + manufactured by Canon Inc.), exposure was performed through a predetermined mask. Then, after baking at 50 ° C. for 60 seconds, development was performed at 23 ° C. for 60 seconds with an alkali developer (2.38 mass% or 0.4% mass% tetramethylammonium hydroxide aqueous solution) shown in Table 2. Rinse with ultrapure water for 1 minute. By these operations, the optimum exposure dose (Eopt) when resolving 5 μm line and space at 1: 1 was defined as sensitivity.

  The film thickness of the unexposed area after development is measured, and the ratio to the film thickness after coating (the film thickness of the unexposed area after development ÷ film thickness after coating × 100 (%)) is obtained to determine the remaining film thickness during development. The film rate was evaluated.

  Table 2 shows the evaluation results of the sensitivity and the remaining film ratio during development.

(4) Heat resistance In the above (3), except that a transparent substrate (Corning 1737 manufactured by Corning) was used instead of the silicon wafer having a silicon oxide film, a coating film was formed in the same manner as in the above (3). Using an exposure apparatus (UX-1000SM manufactured by Ushio Electric Co., Ltd.), a predetermined mask was brought into close contact, and exposure was performed using ultraviolet rays having a light intensity at 365 nm of 18 mW / cm ² . Next, development was performed at 23 ° C. for 60 seconds using an alkaline developer (2.38 mass% or 0.4 mass% tetramethylammonium hydroxide aqueous solution) described in Table 2, followed by rinsing with ultrapure water for 10 seconds. did. By these operations, a pattern with a 10 m line and space of 1: 1 was created. The entire surface of the obtained pattern was further exposed for 100 seconds and heated in an oven at 220 ° C. for 1 hour to form a heat-cured film on the glass substrate.

The heat resistance was evaluated by measuring the rate of change in the bottom dimension before and after heat curing (1—bottom dimension of heat-cured film ÷ bottom dimension after development) × 100 (%). The case where this change rate was less than 5% was evaluated as ◯, and the case where it was 5% or more was evaluated as x.
The evaluation results of heat resistance are shown in Table 2.

(5) Transmittance and Adhesiveness A coating film was formed in the same manner as in (4) above, and the alkaline developer described in Table 2 (2.38% by mass or 0.4% by mass of tetramethyl) was not exposed. Development was performed at 23 ° C. for 60 seconds using an aqueous ammonium hydroxide solution, followed by ultrapure rinsing for 10 seconds. Next, using a proximity exposure apparatus (UX-1000SM manufactured by Ushio Electric Co., Ltd.), the entire surface was exposed for 100 seconds using ultraviolet rays having a light intensity at 365 nm of 18 mW / cm ² . Subsequently, the thermosetting film was formed on the glass substrate by heating at 220 degreeC for 1 hour in oven.

  The transmittance of the obtained heat cured film was measured at a wavelength of 400 to 800 nm using a spectrophotometer (U-3000: manufactured by Hitachi, Ltd.). The case where the minimum transmittance exceeded 95% was evaluated as ◯, the case where it was 90 to 95% was evaluated as Δ, and the case where it was less than 90% was evaluated as ×.

表１中に記載されている（Ａ）成分、（Ｂ）成分、（Ｃ）成分、（Ｄ）成分、塩基性化合物、溶剤及び界面活性剤は、下記の通りである。 Using a cutter on the heat-cured film, cuts were made at intervals of 1 mm vertically and horizontally, and a tape peeling test was performed using a scotch tape. The adhesion between the cured film and the substrate was evaluated from the area of the cured film transferred to the back surface of the tape. The case where the area was less than 1% was evaluated as ◯, the case where the area was less than 1 to 5%, and the case where the area was 5% or more as x.
The evaluation results of transmittance and adhesion are shown in Table 2.

The components (A), (B), (C), (D), basic compound, solvent and surfactant described in Table 1 are as follows.

(A) Component The numerical value on the right side of the structural unit represents the molar ratio of the structural unit.

(B) Component B1: JER1001 (made by Japan Epoxy Resin Co., Ltd.)
B2: JER834 (made by Japan Epoxy Resin Co., Ltd.)
B3: JER157S70 (Japan Epoxy Resin Co., Ltd.)
B4: JER154 (made by Japan Epoxy Resin Co., Ltd.).

(C) component

Component (D) D1: γ-glycidoxypropyltrimethoxysilane D2: β- (3,4-epoxycyclohexyl) ethyltrimethoxysilane D3: γ-methacryloxypropyltrimethoxysilane.

[Basic compounds]
E1: 4-dimethylaminopyridine E2: 1,5-diazabicyclo [4,3,0] -5-nonene.

〔solvent〕
F1: Propylene glycol monomethyl ether acetate F2: Diethylene glycol dimethyl ether F3: Diethylene glycol ethyl methyl ether.

[Surfactant]
G1: Fluorard F-430 (manufactured by 3M)
G2: Megafuck R-08 (Dainippon Ink Chemical Co., Ltd.)
G3: PolyFox PF-6320 (manufactured by OMNOVA).

  From Table 2, the positive photosensitive resin composition of the present invention is excellent in sensitivity, remaining film rate, storage stability, and cured to form a cured film having excellent heat resistance, adhesion, transmittance, and the like. It is clear to get.

Claims (8)

(A) Containing a structural unit represented by the following general formula (1) and a structural unit having an epoxy group (excluding a structural unit derived from a monomer represented by the following general formula (4)), an alkali A resin that is insoluble or hardly soluble in alkali and becomes alkali-soluble when an acid-dissociable group is dissociated, (B) a compound having two or more epoxy groups in the molecule (excluding A) and ( C) A positive photosensitive resin composition comprising a compound that generates an acid upon irradiation with an actinic ray having a wavelength of 300 nm or more.

In general formula (1),
R ¹ represents a hydrogen atom, a methyl group, a halogen atom or a cyano group.
R ² and R ³ each independently represents a hydrogen atom, a linear or branched alkyl group. However, the case where R ² and R ³ are hydrogen atoms at the same time is excluded.
R ⁴ represents an optionally substituted linear, branched or cyclic alkyl group, or an aralkyl group.
R ² and R ⁴ may be linked to form a cyclic ether.

In the formula, X represents a divalent linking group.
R ⁷ represents a hydrogen atom, a methyl group or a halogen atom.
R ¹¹ and R ¹² each independently represents a hydrogen atom or an alkyl group.
n represents an integer of 1 to 10. The positive photosensitive resin according to claim 1, wherein the structural unit having an epoxy group in the component (A) is a unit derived from a monomer represented by the following general formula (3) or (5). Resin composition.

In general formulas (3) and (5), X represents a divalent linking group.
R ⁷ represents a hydrogen atom, a methyl group or a halogen atom.
R ^{8 to} R ¹⁰ and R ^{13 to} R ¹⁵ each independently represent a hydrogen atom or an alkyl group.
n represents an integer of 1 to 10. The positive photosensitive resin composition according to claim 1 or 2, wherein the component (C) contains a compound containing an oxime sulfonate group represented by the following general formula (2).

In general formula (2),
R ⁵ represents a linear, branched or cyclic alkyl group which may be substituted, or an aryl group which may be substituted. (C) A component contains the compound represented by the following general formula (2A), The positive type photosensitive resin composition of Claim 1 or 2 characterized by the above-mentioned.

In general formula (2A),
R ⁵ represents a linear, branched or cyclic alkyl group which may be substituted, or an aryl group which may be substituted.
X represents an alkyl group, an alkoxy group, or a halogen atom.
m represents an integer of 0 to 3. When m is 2 or 3, the plurality of X may be the same or different.   The positive photosensitive resin composition according to claim 1, further comprising (D) an adhesion assistant.   The process of apply | coating and drying the positive photosensitive resin composition in any one of Claims 1-5 on a board | substrate, forming a coating film, and the process of exposing using an active ray with a wavelength of 300 nm or more through a mask A cured film forming method comprising: a step of developing using an alkali developer to form a pattern; and a step of heat-treating the obtained pattern.   The cured film formation according to claim 6, further comprising a step of exposing the entire surface after the step of developing with an alkali developer and forming the pattern and before the step of heat-treating the obtained pattern. Method.   A cured film obtained by the method according to claim 6.