JP2011146599A - Substrate holding case, substrate processing method, and substrate processing apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a substrate processing method capable of quickly collecting glass fragments when a glass substrate is broken in a chamber. <P>SOLUTION: The substrate processing method of performing surface processing on the glass substrate arranged in the chamber is characterized in that: the glass substrate 10 stored in a recessed substrate holding case 20 having an opening on the top is carried into the chamber; and the surface processing is performed on the glass substrate 10 while being stored in the substrate holding case 20. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a substrate holding case, and more particularly to a substrate processing method and a substrate processing apparatus using the substrate holding case.

  In the manufacturing process used in the manufacturing technology of the liquid crystal display device, a number of steps of forming a thin film on the surface of the glass substrate and a patterning process for making the thin film into a predetermined pattern are performed. In the film forming process, film forming processes such as sputtering, vapor deposition, and vapor deposition (CVD) are performed. For example, in the vapor deposition (CVD) method, first, a glass substrate is placed in a chamber and depressurized to a constant pressure. A thin film is formed on the surface of the glass substrate by depositing reaction products by supplying necessary reaction energy (heat, plasma, etc.) while flowing a gas as a raw material in the chamber. Note that the inside of the chamber is constantly maintained at a constant pressure because the source gas is introduced and exhausted by the exhaust device. Patent Document 1 and the like are disclosed as prior documents relating to the manufacturing technology of this type of liquid crystal display device.

Japanese Patent Laid-Open No. 10-133186

  By the way, the glass substrate used for the film-forming process mentioned above is manufactured through various processing processes (for example, a cutting / chamfering process, a heat treatment / polishing process, etc.). Therefore, a crack (scratch) such as a chip or a crack may occur in the peripheral portion of the glass substrate or a surface portion other than the peripheral portion during various treatments or during handling. When a glass substrate in which such a crack has occurred is subjected to the above-described film formation process, the glass substrate may break from the crack as a starting point due to a temperature change received during the film formation process.

  When the glass substrate breaks, the fragments are scattered into the chamber. Therefore, in this case, the apparatus must be stopped and the chamber must be maintained (collection / cleaning of glass fragments, etc.). However, in order to perform the maintenance of the chamber, it is necessary to lower the temperature of the chamber and to open the interior of the chamber to the atmosphere. Since the film forming apparatus cannot be operated during such maintenance, the throughput of the film forming process is also greatly reduced.

  This invention is made | formed in view of this point, The main objective is to provide the substrate processing method which can collect | recover glass fragments quickly, when a glass substrate is broken in a chamber. Another object is to provide a substrate processing apparatus and a substrate holding case capable of preferably realizing such a substrate processing method.

The substrate processing method according to the present invention is a method of performing a predetermined surface treatment on a glass substrate disposed in a chamber. In this substrate processing method, the glass substrate is transported into the chamber in a state where the glass substrate is accommodated in a concave substrate holding case having an upper opening, and the glass substrate is subjected to a surface treatment while being accommodated in the substrate retaining case. Features.
In a preferred embodiment disclosed herein, the surface treatment is a surface treatment using plasma.
In a preferred embodiment disclosed herein, the glass substrate is a glass substrate for a flat panel display (for example, a liquid crystal panel).

The present invention also provides a substrate holding case capable of preferably realizing the substrate processing method. That is, the substrate holding case is a concave substrate holding case used for transporting the glass substrate into the chamber. The substrate holding case is opened on the upper side, and the case bottom surface on which the glass substrate is placed and the case bottom surface are cut. A case wall surface that rises from the bottom surface of the case so as to surround the glass substrate, and the case bottom surface is for lifting the glass substrate placed on the bottom surface of the case. A substrate holding portion is formed.
In a preferred aspect disclosed herein, the substrate holding portion has a through hole into which a lift pin is movably inserted.
In a preferable aspect disclosed herein, the lift pin is embedded in the bottom surface of the case in a state of being inserted into the through hole.
In a preferred aspect disclosed herein, the lift pin includes a shaft portion and a head portion having an outer shape larger than the shaft portion, and the through hole is provided with a step that engages with the head portion. ing.
In a preferred embodiment disclosed herein, the upper surface of the case wall surface and the upper surface of the glass substrate are located on the same plane.

Moreover, this invention provides the substrate processing apparatus which can implement | achieve the said substrate processing method preferably. That is, this substrate processing apparatus performs a surface treatment on a glass substrate disposed in a chamber using plasma, and includes a chamber, a lower electrode disposed in the chamber, and an upper portion facing the lower electrode. An electrode and a concave substrate holding case attached to the upper surface of the lower electrode and accommodating a glass substrate therein are provided.
In a preferred embodiment disclosed herein, the substrate holding case is detachably attached to the lower electrode.
In a preferred embodiment disclosed herein, a recess for accommodating the substrate holding case is formed on the upper surface of the lower electrode.
In a preferred embodiment disclosed herein, the glass substrate is a glass substrate for a flat panel display (for example, a liquid crystal panel).

  According to the substrate processing method of the present invention, the glass substrate is transported into the chamber in a state in which the glass substrate is accommodated in the concave substrate holding case having an upper opening, and the surface of the glass substrate is accommodated in the substrate retaining case. Since the treatment is performed, even if the glass substrate is broken during the conveyance of the glass substrate or during the surface treatment, the fragments are not scattered in the chamber but are confined in the substrate holding case. Therefore, it is possible to collect glass fragments simply by taking out the substrate holding case, and it is not necessary to perform chamber maintenance (such as glass fragment collection / cleaning). Therefore, the substrate processing apparatus can be operated efficiently, and a decrease in throughput caused by stopping the apparatus during the maintenance of the chamber can be suppressed.

It is a perspective view showing typically the composition of the substrate holding case concerning one embodiment of the present invention. It is sectional drawing which shows typically the structure of the board | substrate holding case which concerns on one Embodiment of this invention. It is sectional drawing which shows typically the structure of the board | substrate holding case which concerns on one Embodiment of this invention. (A)-(c) is sectional drawing which shows typically the process of taking out a glass substrate from the substrate holding case which concerns on one Embodiment of this invention. It is sectional drawing which shows typically the structure of the substrate processing apparatus which concerns on one Embodiment of this invention. (A)-(c) is sectional drawing which shows typically the process of accommodating a glass substrate in the substrate holding case which concerns on one Embodiment of this invention. (A)-(c) is sectional drawing which shows typically the process of attaching the substrate holding case which concerns on one Embodiment of this invention to a lower electrode. (A) And (b) is sectional drawing which shows typically the structure of the board | substrate holding case which concerns on one Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following drawings, components having substantially the same function are denoted by the same reference numerals for the sake of brevity. Note that the dimensional relationship (length, width, thickness, etc.) in each drawing does not reflect the actual dimensional relationship.

  1 and 2 show an example of the substrate holding case 20 according to the present embodiment. FIG. 1 is a perspective view schematically showing the configuration of the substrate holding case 20, and FIG. 2 is a schematic sectional view showing the side configuration of the substrate holding case 20.

  The substrate processing method according to the present embodiment is a method of performing a surface treatment on a glass substrate disposed in a chamber. In this substrate processing method, as shown in FIG. 1, the glass substrate 10 is accommodated in a concave substrate holding case 20 opened upward. Then, as shown in FIG. 2, the glass substrate 10 is transferred into the chamber together with the substrate holding case 20, and the glass substrate 10 is subjected to a surface treatment 94 in a state of being accommodated in the substrate holding case 20. The surface treatment 94 applied to the glass substrate 10 is not particularly limited, and a typical surface treatment technique such as thin film formation (film formation) treatment or dry etching treatment can be appropriately employed. In this embodiment, a film forming process (plasma CVD) using plasma is performed on the glass substrate 10.

  Furthermore, the substrate holding case 20 according to the present embodiment will be described. As shown in FIG. 1, the substrate holding case 20 includes a case bottom surface 26 on which the glass substrate 10 is placed, and a wall surface 22 rising from the case bottom surface 26. An opening 24 is provided above the case bottom 26, and the glass substrate 10 is placed on the case bottom 26 via the opening 24. From the opening 24, the upper surface (surface to be processed of the glass substrate) 12 of the glass substrate 10 can be exposed.

  The case wall surface 22 is a surface that rises substantially vertically from the case bottom surface 26, and is disposed so as to surround the glass substrate 10 with respect to the glass substrate 10 placed on the case bottom surface 26. The case wall surface 22 of the present embodiment has a square shape when viewed from above, and the glass substrate 10 is disposed at the center thereof. Thus, by surrounding the glass substrate 10 with the case wall surface 22, even if the glass substrate 10 is broken, the fragments are not scattered around and are confined in the substrate holding case 20. The material constituting the substrate holding case 20 is preferably a material that is not easily cracked and has relatively heat resistance, such as a relatively light metal such as aluminum, or a relatively light material such as Teflon. Examples thereof include a resin material having heat resistance at a high temperature.

  Further, other features of the substrate holding case 20 of the present embodiment will be described. In the configuration of the present embodiment, as shown in FIG. 2, the upper surface 22 a of the case wall surface 22 and the upper surface 12 of the glass substrate 10 are on the same plane (or substantially) in a state where the glass substrate 10 is accommodated in the substrate holding case 20. In the same plane). In other words, the height of the case wall surface 22 (height from the case bottom surface 26) and the thickness (plate thickness) of the glass substrate 10 are substantially the same size.

  Here, when the case wall surface 22 is made higher than the upper surface 12 of the glass substrate 10, a peripheral surface (edge) portion of the upper surface 12 of the glass substrate 10 is hidden by the case wall surface 22, so that a uniform surface treatment can be performed on the glass substrate 10. There are cases where it is impossible. Therefore, from the viewpoint of performing a uniform surface treatment, the case wall surface 22 is preferably formed so as not to exceed the upper surface 12 of the glass substrate 10. On the other hand, if the case wall surface 22 is made too lower than the upper surface 12 of the glass substrate 10, there is a possibility that glass fragments jump over the case wall surface 22 and scatter around. Therefore, it is preferable that the case wall surface 22 is formed so as not to be too lower than the upper surface 12 of the glass substrate 10 from the viewpoint of preventing scattering of glass fragments. For example, as shown in FIG. 3, the height difference h between the case wall surface 22 and the upper surface 12 of the glass substrate 10 is preferably formed to be ½ or less of the thickness of the glass substrate 10. According to the technique disclosed herein, it is usually appropriate that the upper surface 22a of the case wall surface 22 and the upper surface 12 of the glass substrate 10 are located on substantially the same plane. Thereby, a uniform surface treatment can be applied to the glass substrate 10 while preventing scattering of glass fragments.

  In the configuration of the present embodiment, the case bottom surface 26 is formed with a substrate holding portion 30 for lifting the glass substrate 10 placed on the case bottom surface 26. The substrate holding portion 30 is used when the glass substrate 10 is accommodated in the substrate holding case 20. Further, the substrate holding portion 30 is used when taking out the glass substrate 10 from the substrate holding case 20. In this embodiment, the substrate holding portion 30 has a through hole 32 into which a lift pin is inserted. As shown in FIG. 4A, the through-hole 32 has an inner diameter that is slightly larger than the outer diameter of the lift pin 34, and is formed so that the lift pin 34 can be inserted (moved) freely from below. Yes. As shown in FIG. 1, the through-holes 32 of the present embodiment are provided at a plurality of locations on the case bottom surface 26 (in this example, five locations at the center and peripheral corners of the case bottom surface 26). A lift pin 34 is inserted from below. In addition, as a material which comprises the lift pin 34, in order to prevent the generation | occurrence | production of the defect by electrostatic breakdown, it is preferable to use the material which the surface shows insulation at least. For example, an insulating material such as ceramic or a metal base material such as Al (aluminum) or SUS (stainless steel) coated with an insulating material can be used.

  4A to 4C are cross-sectional views for explaining a process of taking out the glass substrate 10 from the substrate holding case 20 using the lift pins 34 of the present embodiment.

  When taking out the glass substrate 10 from the substrate holding case 20, first, as shown in FIG. 4A, the lift pins 34 are inserted into the through holes 32 of the case bottom surface 26 from below, as shown in FIG. 4B. Further, the tip 36 of the lift pin is brought into contact with the lower surface 14 of the glass substrate 10. Then, as shown in FIG. 4C, while supporting the glass substrate 10 from below with the tip 36 of the lift pin 34, the lift pin 34 protrudes from the case bottom surface 26 and is lifted to lift the glass substrate 10 to a predetermined position. And the glass substrate 10 is taken out from the substrate holding case 20 by delivering the glass substrate 10 lifted to a predetermined position to an appropriate conveying means (not shown). In addition, when accommodating the glass substrate 10 in the board | substrate holding | maintenance case 20, it is good to carry out in the reverse procedure to the description mentioned above.

  Subsequently, the substrate processing apparatus 100 according to the present embodiment will be described. FIG. 5 is a diagram schematically showing the configuration of the substrate processing apparatus 100. The substrate processing apparatus 100 is an apparatus that performs a surface treatment (here, a film forming process) on the glass substrate 10 disposed in the chamber 90 using plasma. The substrate processing apparatus 100 of this embodiment includes a chamber 90, a lower electrode 60 disposed in the chamber 90, an upper electrode 70 facing the lower electrode 60, and a concave substrate attached to the upper surface 62 of the lower electrode 60. The holding case 20 is comprised.

  The substrate holding case 20 is detachably attached to the lower electrode 60. That is, the substrate holding case 20 is transported into the chamber 90 in a state where the glass substrate 10 is accommodated therein, and is set at a predetermined position of the lower electrode 60. The substrate holding case 20 is removed from a predetermined position of the lower electrode 60 after the surface treatment is completed, and is transported to the outside of the chamber 90 with the glass substrate 10 accommodated therein. In this embodiment, a recess 64 is provided on the upper surface 62 of the lower electrode 60, and the substrate holding case 20 is accommodated in the recess 64. A lift pin 84 for lifting the substrate holding case 20 is attached to the bottom surface 68 of the recess 64. In addition, the glass substrate 10 of this embodiment is a glass substrate (for example, array substrate) for liquid crystal panels.

  A substrate processing apparatus 100 shown in FIG. 5 is a parallel plate type plasma film forming apparatus, and an upper electrode 70 and a lower electrode 60 are arranged in a chamber 90 to face each other. In this example, the upper electrode 70 is connected to a high frequency power source, while the lower electrode 60 is connected to the ground. A source gas introduction port 92 is disposed in the chamber 90. The source gas introduced into the chamber is appropriately selected according to the type of thin film formed on the glass substrate 10. The source gas may include a carrier gas such as hydrogen gas or nitrogen gas.

  During the operation of the substrate processing apparatus (film forming apparatus) 100, a source gas is introduced from the introduction port 92 between the lower electrode 60 and the upper electrode 70, and a high frequency is introduced between the lower electrode 60 and the upper electrode 70. A voltage is applied to form a plasma. Note that the inside of the chamber 90 is constantly maintained at a constant pressure because it is exhausted by an exhaust device (not shown) while the source gas is introduced.

  When surface treatment is performed on the glass substrate 10 using the substrate processing apparatus (film forming apparatus) 100, the glass substrate 10 is first accommodated in the substrate holding case 20 outside the chamber 90. That is, as shown in FIG. 6A, the glass substrate 10 is transported to above the substrate holding case 20 using an appropriate transport means (not shown). Next, as shown in FIG. 6B, the lift pins 34 are inserted into the through holes 32 of the case bottom surface 26 from below, and the tip 36 of the lift pins is brought into contact with the lower surface 14 of the glass substrate 10. Then, the lift pin 34 is lowered while the glass substrate 10 is supported from below by the tip 36 of the lift pin 34, and the lift pin 34 is inserted into the case bottom surface 26 as shown in FIG. 6C. Thereby, only the glass substrate 10 is placed on the case bottom surface 26, and the glass substrate 10 is accommodated in the substrate holding case 20.

  After the glass substrate 10 is accommodated in the substrate holding case 20 in this way, the glass substrate 10 is then transferred into the chamber 90 together with the substrate holding case 20, and the substrate holding case 20 is placed on the lower electrode 60. Specifically, as shown in FIG. 7A, the substrate holding case 20 is transported to above the lower electrode 60 using an appropriate transport means (not shown). Next, as shown in FIG. 7B, the lift pins 84 on the bottom surface of the recess 64 are raised, and the tips of the lift pins 84 are brought into contact with the lower surface of the substrate holding case 20. Then, the lift pin 84 is lowered while supporting the substrate holding case 20 from below with the tip of the lift pin 84, and the lift pin 84 is immersed in the bottom surface of the recess 64 as shown in FIG. As a result, only the substrate holding case 20 is placed on the bottom surface of the recess 64, and the substrate holding case 20 is attached to the lower electrode 60.

  When the substrate holding case 20 is attached to the lower electrode 60 in this way, the substrate processing apparatus (film forming apparatus) 100 is operated to perform the film forming process on the glass substrate 10. The film forming process is performed in a state where the glass substrate 10 is accommodated in the substrate holding case 20. When the film forming process is completed, the substrate holding case 20 is removed from the lower electrode 60, and the glass substrate 10 is transferred to the outside of the chamber 90 together with the substrate holding case 20. The step of removing the substrate holding case 20 from the lower electrode 60 may be performed in the reverse order to the above description. In this way, a film forming process can be performed on the glass substrate.

  According to the configuration of the present embodiment, the glass substrate 10 is transferred into the chamber 90 in a state in which the glass substrate 10 is accommodated in the concave substrate holding case 20 having an upper opening, and the glass substrate is accommodated in the substrate holding case 20. 10 is subjected to the surface treatment, even if the glass substrate 10 is broken during the conveyance of the glass substrate 10 or during the surface treatment as shown in FIGS. And is confined within the substrate holding case 10. Therefore, it is possible to collect glass fragments simply by taking out the substrate holding case 20, and maintenance of the chamber 90 (collection / cleaning of glass fragments, etc.) need not be performed. Therefore, the substrate processing apparatus 100 can be operated efficiently, and a decrease in the throughput of the surface treatment process caused by stopping the substrate processing apparatus 100 during the maintenance of the chamber 90 can be suppressed.

  Further, in the configuration of the present embodiment, the substrate holding case 20 is provided on the case bottom surface 26 on which the glass substrate 10 is placed and the glass substrate 10 placed on the case bottom surface 26 as shown in FIGS. 1 and 2. On the other hand, a case wall surface 22 rising from the case bottom surface 26 is provided so as to surround the periphery of the glass substrate 10. And the upper surface 22a of the case wall surface 22 and the upper surface 12 of the glass substrate 10 are located on the same plane. In this case, uniform surface treatment can be performed on the upper surface 12 of the glass substrate 10 while preventing the glass fragments from being scattered by the case wall surface 22.

  Further, in the configuration of the present embodiment, as shown in FIGS. 4A to 4C, a substrate holding portion 30 (for lifting the glass substrate 10 placed on the case bottom surface 26 is provided on the case bottom surface 26. A through hole 32) into which the lift pin 34 is movably inserted is formed. By using the substrate holding portion 30, the operation of housing the glass substrate 10 in the substrate holding case 20 and the operation of removing the glass substrate 10 from the substrate holding case 20 can be performed stably. Therefore, it is possible to prevent the occurrence of defects during such work and suppress the decrease in yield.

  Furthermore, in the configuration of the present embodiment, as shown in FIG. 1, the case bottom surface 26 has a plurality of through holes 32 into which the lift pins 34 are inserted (at the central portion and the peripheral corner portions of the case bottom surface 26). The lift pins 34 provided and inserted into the respective through holes 32 are arranged so as to support the central portion and the peripheral corner portions of the glass substrate 10. In this case, when the glass substrate 10 is lifted by the lift pins 34, it is possible to suppress the glass substrate 10 from being greatly bent, and it is possible to more effectively prevent the occurrence of defects during such work.

  In addition, a large and thin glass substrate is mentioned as a preferable application target of the technique disclosed here. For example, a glass substrate having a thickness of 40 inches or more and 1.0 mm or less is preferably exemplified. Such a large and thin glass substrate is very easy to break, and even if a slight deflection occurs during transportation, it may break, so the technical value by adopting the configuration of the present invention Is expensive. Although it does not specifically limit, when the size of the glass substrate 10 of this embodiment is illustrated, it will be about 730 mm x 920 mm x thickness 0.7mm.

  As mentioned above, although this invention was demonstrated by suitable embodiment, such description is not a limitation matter and of course various modifications are possible.

  For example, the glass substrate 10 of the present embodiment is a glass substrate for a liquid crystal panel, but the glass substrate 10 may be an array substrate on which a thin film transistor (TFT) is manufactured, or a color filter (CF) is formed. A CF substrate may be used. In addition, it is not limited to the glass substrate 10 for a liquid crystal panel, but may be a thin glass substrate for manufacturing a PDP, an organic EL panel, other flat panel displays or electronic devices.

  In the present embodiment, the film forming process using plasma is performed on the glass substrate 10, but the present invention is not limited to this. For example, the film forming process using sputtering may be used, and the film forming process may be performed by an evaporation method. It may be a membrane treatment. Furthermore, it is not limited to the above-described film forming process, and for example, a surface process such as an etching process (such as dry etching using plasma) may be used. The method of the present invention can be widely applied to various surface treatment techniques applied to a glass substrate in a chamber.

  Furthermore, the configuration of the substrate holding case 20 is not limited to that described above, and can be changed to other forms. With reference to FIGS. 8A and 8B, a modified example of the substrate holding case 20 of the present embodiment will be described. FIGS. 8A and 8B show a cross-sectional configuration of a through hole 132 formed in the case bottom surface 126 and a lift pin 134 inserted into the through hole 132.

  In the example shown in FIG. 8A, the lift pin 134 is embedded in the case bottom surface 126 while being inserted into the through hole 132. Then, as shown in FIG. 8B, another lift pin 135 is inserted from below the through hole 132 and the lift pin 134 embedded in the case bottom surface 126 is pushed upward, so that the lift pin 134 protrudes from the case bottom surface 126. It is supposed to be. If this structure is used, since the through-hole 132 is always closed by the lift pins 134 and 135, it is possible to prevent the fragments from flowing out of the case through the through-hole 132 when the glass substrate is broken.

  In the example shown in FIG. 8A, the lift pin 134 includes a shaft portion 134b and a head portion 134a having a larger outer shape than the shaft portion 134b. The through hole 132 is provided with a step 132 a that engages with the head 134 a of the lift pin 134. With this configuration, when the glass substrate is broken, even if the broken piece enters a slight gap between the through hole 132 and the head part 134a of the lift pin 134, the glass piece is further increased by the step 132a of the through hole 132. Intrusion is prevented. Therefore, it is possible to more effectively prevent the glass fragments from flowing out of the case.

  According to the present invention, it is possible to provide a substrate processing method capable of quickly collecting glass fragments when a glass substrate is broken in a chamber.

DESCRIPTION OF SYMBOLS 10 Glass substrate 12 Upper surface 14 Lower surface 20 Substrate holding case 22 Case wall surface 22a Upper surface 24 Opening part 26 Case bottom surface 30 Substrate holding part 32 Through-hole 34 Lift pin 36 Tip 60 Lower electrode 62 Upper surface 64 Recess 68 Bottom surface 70 Upper electrode 84 Lift pin 90 Chamber 92 Source gas inlet 100 Substrate processing equipment

Claims (12)

A substrate processing method for performing a surface treatment on a glass substrate disposed in a chamber,
The substrate is transported into a chamber in a state in which the glass substrate is accommodated in a concave substrate holding case having an upper opening, and the glass substrate is subjected to a surface treatment in a state of being accommodated in the substrate holding case. Processing method.   The substrate processing method according to claim 1, wherein the surface treatment is a surface treatment using plasma.   The substrate processing method according to claim 1, wherein the glass substrate is a glass substrate for a flat panel display. A concave substrate holding case used for transporting a glass substrate into a chamber,
The bottom of the case where the top is opened and the glass substrate is placed,
With respect to the glass substrate placed on the bottom surface of the case, a case wall surface rising from the bottom surface of the case so as to surround the glass substrate,
A substrate holding case in which a substrate holding portion for lifting a glass substrate placed on the bottom surface of the case is formed on the bottom surface of the case.   The board | substrate holding case of Claim 4 which has a through-hole in which a lift pin is inserted as said board | substrate holding | maintenance part.   The substrate holding case according to claim 5, wherein the lift pin is embedded in the bottom surface of the case while being inserted into the through hole. The lift pin is composed of a shaft portion and a head having a larger outer shape than the shaft portion,
The substrate holding case according to claim 6, wherein the through hole is provided with a step that engages with the head.   The substrate holding case according to claim 4, wherein an upper surface of the case wall surface and an upper surface of the glass substrate are located on the same plane. A substrate processing apparatus for performing surface treatment using a plasma on a glass substrate disposed in a chamber,
A chamber;
A lower electrode disposed in the chamber;
An upper electrode facing the lower electrode;
A substrate processing apparatus comprising: a concave substrate holding case attached to the upper surface of the lower electrode and accommodating a glass substrate therein.   The substrate processing apparatus according to claim 9, wherein the substrate holding case is detachably attached to the lower electrode.   11. The substrate processing apparatus according to claim 9, wherein a recess for accommodating the substrate holding case is formed on an upper surface of the lower electrode.   The substrate processing apparatus according to claim 9, wherein the glass substrate is a glass substrate for a flat panel display.

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