JP2011146532A - Housing - Google Patents

Housing Download PDF

Info

Publication number
JP2011146532A
JP2011146532A JP2010006085A JP2010006085A JP2011146532A JP 2011146532 A JP2011146532 A JP 2011146532A JP 2010006085 A JP2010006085 A JP 2010006085A JP 2010006085 A JP2010006085 A JP 2010006085A JP 2011146532 A JP2011146532 A JP 2011146532A
Authority
JP
Japan
Prior art keywords
housing
cover
side wall
bottom housing
wall portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2010006085A
Other languages
Japanese (ja)
Inventor
Masahiro Yoshida
昌弘 吉田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toppan Inc
Original Assignee
Toppan Printing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toppan Printing Co Ltd filed Critical Toppan Printing Co Ltd
Priority to JP2010006085A priority Critical patent/JP2011146532A/en
Publication of JP2011146532A publication Critical patent/JP2011146532A/en
Pending legal-status Critical Current

Links

Images

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a housing which is lightweight, has thermal conductivity, conductivity and electric field blocking properties, and is superior in capability of absorbing vibration. <P>SOLUTION: The housing 1 includes a metallic cover 10 and a resin-made bottom housing 20. The cover 10 has a rectangular first plane portion 11, sidewall portions 12a to 12c connected to outer peripheral edges of the first plane portion 11, and claws 13a to 13c. The bottom housing 20 has a second plane portion, and sidewall portions 22a to 22c erected vertically from outer peripheral edges of the second plane portion. In the sidewall portions 22a to 22c, cuts 23a and 23c into which the claws 13a and 13c are inserted when the cover 10 is fitted to the bottom housing 20, and slits 24a to 24c into which the claws 13a to 13c are inserted when the cover 10 and bottom housing 20 are relatively slid, are formed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、例えばソリッドステートドライブ（以下、「ＳＳＤ」という）のような電子部品を収容するための筐体に関する。   The present invention relates to a housing for housing an electronic component such as a solid state drive (hereinafter referred to as “SSD”).

例えばＳＳＤのような電子部品は、底板と天板及び側壁からなる中空状の扁平な直方体形状を有する筐体の内部に収容され、筐体ごとパーソナルコンピュータ（以下、「パソコン」という）等の本体内部の所定位置に取り付けられる。この筐体としては、一般に、アルミダイキャスト成形品、アルミニウムの板金加工品又はＡＢＳ樹脂のみの成形品が用いられることが多い。   For example, an electronic component such as an SSD is housed inside a hollow flat rectangular parallelepiped shape made up of a bottom plate, a top plate, and a side wall, and a main body such as a personal computer (hereinafter referred to as a “PC”) together with the housing. It is attached at a predetermined position inside. In general, an aluminum die cast molded product, an aluminum sheet metal processed product, or a molded product made of only an ABS resin is often used as the casing.

特開２００８−１５６７０２号公報JP 2008-156702 A

しかし、アルミダイキャスト成形で筐体を作製した場合は、筐体の重量が重くなり、また、成形後に別途、切削加工が必要となる。また、アルミニウムの板金加工で筐体を作製した場合は、天板と底板とを組み合わせるための構造やタップ加工が複雑となり、製造コストが高くなる。更に、これら、アルミニウム単体で形成された筐体は振動を吸収する性能に乏しい。一方、ＡＢＳ樹脂を用いた成形で筐体を作製した場合は、ＡＢＳ樹脂自身の物性に起因し、筐体の熱伝導性、導電性及び電界遮蔽性が不十分であるという問題がある。   However, when a housing is manufactured by aluminum die casting, the weight of the housing becomes heavy, and a separate cutting process is required after molding. In addition, when the case is manufactured by aluminum sheet metal processing, the structure for combining the top plate and the bottom plate and tapping are complicated, and the manufacturing cost is increased. Furthermore, these cases made of aluminum alone have poor performance for absorbing vibration. On the other hand, when a housing is produced by molding using ABS resin, there is a problem that the thermal conductivity, conductivity, and electric field shielding properties of the housing are insufficient due to the physical properties of the ABS resin itself.

それ故に、本発明では、軽量であり、熱伝導性、導電性及び電界遮蔽性を有し、かつ、振動を吸収する能力に優れた筐体を提供することを目的とする。   Therefore, an object of the present invention is to provide a housing that is lightweight, has thermal conductivity, electrical conductivity, and electric field shielding properties, and has an excellent ability to absorb vibration.

本発明は、電子部品を収容するための中空箱形状の筐体に関する。筐体は、金属からなり、第１の平面部と、第１の平面部の外周縁から垂直に立ち上がる第１の側壁部と、側壁部の端縁から内方に向かって第１の平面部と平行に突出する複数のツメとを有するカバーと、導電性を有する樹脂からなり、第２の平面部と、第２の平面部の外周縁から垂直に立ち上がる第２の側壁部とを有し、第１の平面部及び第２の平面部を対向させた状態で、カバーに嵌め込まれるボトムハウジングとを備える。第２の側壁部には、カバ−とボトムハウジングとを嵌め合わせた際に、ツメの各々が挿入される複数の切欠きと、カバーとボトムハウジングとを嵌め合わせて切欠きの各々にツメの各々を挿入した状態で、カバーボトムハウジングとを相対的にスライドさせることによって、切欠きの各々が差し込まれる複数のスリットとが形成される。   The present invention relates to a hollow box-shaped housing for housing electronic components. The housing is made of metal, and includes a first flat surface portion, a first side wall portion that rises perpendicularly from an outer peripheral edge of the first flat surface portion, and a first flat surface portion inward from the edge of the side wall portion. A cover having a plurality of claws projecting in parallel with the electrode, a conductive resin, a second flat surface portion, and a second side wall portion rising vertically from the outer peripheral edge of the second flat surface portion And a bottom housing fitted into the cover with the first plane portion and the second plane portion facing each other. When the cover and the bottom housing are fitted to the second side wall portion, the plurality of notches into which the claws are inserted and the cover and the bottom housing are fitted to each other to form the claws in the notches. A plurality of slits into which each of the cutouts are inserted are formed by sliding the cover bottom housing relative to each other with each inserted.

本発明によると、軽量であり、熱伝導性、導電性及び電界遮蔽性を有し、かつ、振動を吸収する能力に優れた筐体を作製することができる。   According to the present invention, it is possible to manufacture a housing that is lightweight, has thermal conductivity, electrical conductivity, and electric field shielding properties, and has an excellent ability to absorb vibration.

本発明の実施形態に係る筐体の分解斜視図The disassembled perspective view of the housing | casing which concerns on embodiment of this invention 本発明の実施形態に係る筐体の嵌め合わせ方法を説明する斜視図The perspective view explaining the fitting method of the housing | casing which concerns on embodiment of this invention. 図２に示す筐体のＡ−Ａ’ラインに沿った断面図Sectional drawing along the A-A 'line of the housing | casing shown in FIG.

（実施形態）
図１は、本発明の実施形態に係る筐体の分解斜視図である。 (Embodiment)
FIG. 1 is an exploded perspective view of a housing according to an embodiment of the present invention.

筐体１は、一面に開口を有する中空の扁平な直方体形状であり、アルミニウム製のカバー１０と、導電性を有する樹脂製のボトムハウジング２０とを備える。   The housing 1 has a hollow flat rectangular parallelepiped shape having an opening on one surface, and includes a cover 10 made of aluminum and a bottom housing 20 made of resin having conductivity.

カバー１０は、表面に導電性材料をコーティングしたアルミニウム板の板金加工で作製され、矩形上の第１の平面部１１と第１の平面部１１の３辺における外縁から、図１の下方向に垂直に延びる側壁部１２ａ〜１２ｃとを有する。側壁部１２ａ〜１２ｃの端縁には、平面部に平行に突出するツメ１３ａ〜１３ｃが設けられる。より詳細には、側壁部１２ａの端縁には３つのツメ１３ａが設けられ、側壁部１２ｂにはツメ１３ｂが設けられ、側壁部１２ｃの端縁には３つのツメ１３ｃが設けられる。尚、これらのツメ１３ａ〜１３ｃは、側壁部１２ａ〜１２ｃの端縁から延長方向に延びる突起を内方に垂直に折り曲げて形成されている。また、第１の平面部１１には、皿ネジ取り付け１４ｅが形成されている。更に、第１の平面部１１の内面（図１における下面）には、基板３０上の電子部品から発生する熱を外部に放出するための放熱シート４０ａが貼着されている。尚、側壁部１２ａ及び１２ｃは第１の側壁部に相当し、側壁部１２ｂは第３の側壁部に相当する。   The cover 10 is manufactured by sheet metal working of an aluminum plate whose surface is coated with a conductive material, and extends from the outer edges of the three sides of the first flat surface portion 11 and the first flat surface portion 11 on the rectangle downward in FIG. And side wall portions 12a to 12c extending vertically. At the edges of the side wall parts 12a to 12c, claws 13a to 13c projecting in parallel to the plane part are provided. More specifically, three claws 13a are provided at the edge of the side wall 12a, claws 13b are provided at the side wall 12b, and three claws 13c are provided at the edge of the side wall 12c. The claws 13a to 13c are formed by bending a protrusion extending in the extending direction from the end edges of the side wall portions 12a to 12c vertically inward. Further, a countersunk screw attachment 14 e is formed on the first flat surface portion 11. Further, a heat radiating sheet 40 a for releasing heat generated from the electronic components on the substrate 30 to the outside is attached to the inner surface (the lower surface in FIG. 1) of the first flat portion 11. The side wall portions 12a and 12c correspond to the first side wall portion, and the side wall portion 12b corresponds to the third side wall portion.

ボトムハウジング２０はカバー１０に嵌め込まれるものであって、樹脂を用いた一体成形で作製され、矩形状の第２の平面部２１と、第２の平面部２１の３辺における外縁から、図１の上方向に垂直に延びる側壁部２２ａ〜２２ｃとを有する。また、側壁部２２ａ及び２２ｃの各々には、矩形状に切り取られた切欠２３ａ及び２３ｃが夫々３つ設けられる。更に、切欠２３ａ及び２３ｃの下部には一方向（図１の左斜め下方向）に伸びるスリット２４ａ及び２４ｃが設けられる。側壁部２２ｂには切欠きを設けずに、中央部分にスリット２４ｂのみを設けている。これらの切欠２３ａ、２３ｃ及びスリット２４ａ〜２４ｃと、先述したカバーに設けられるツメ１３ａ〜１３ｃとは、カバー１０にボトムハウジング２０が嵌め込まれた時に対応する位置関係となるように配置されている。尚、側壁部２２ａ及び２２ｃは第２の側壁部に相当し、側壁部２２ｂは第４の側壁部に相当する。   The bottom housing 20 is fitted into the cover 10 and is manufactured by integral molding using a resin. From the rectangular second flat surface portion 21 and the outer edges on the three sides of the second flat surface portion 21, FIG. Side wall portions 22a to 22c extending perpendicularly to the upper direction. Each of the side wall portions 22a and 22c is provided with three notches 23a and 23c cut out in a rectangular shape. Further, slits 24a and 24c extending in one direction (left obliquely downward in FIG. 1) are provided below the notches 23a and 23c. The side wall portion 22b is not provided with a notch, and only the slit 24b is provided in the central portion. These notches 23 a and 23 c and slits 24 a to 24 c and the claws 13 a to 13 c provided on the cover described above are arranged to have a corresponding positional relationship when the bottom housing 20 is fitted into the cover 10. The side wall portions 22a and 22c correspond to a second side wall portion, and the side wall portion 22b corresponds to a fourth side wall portion.

第２の平面部２１の内面には、ボス２５ａ〜２５ｅが設けられている。ボス２５ａ〜２５ｄには電子基板がネジ留めされ、ボス２５ｅには、皿ネジ取り付け穴１４ｅを通してカバー１０がネジ留めされる。これらのボス２５ａ〜２５ｅは樹脂で形成されているため、セルフタップによるネジ留めが可能である。従って、予めボス２５ａ〜２５ｅにタップ構造を設けておく必要がなく、ボトムハウジング２０を成形する金型入れ子の構造を簡易にすることができる。   Boss 25a-25e is provided in the inner surface of the 2nd plane part 21. As shown in FIG. Electronic boards are screwed to the bosses 25a to 25d, and the cover 10 is screwed to the bosses 25e through the countersunk screw mounting holes 14e. Since these bosses 25a to 25e are made of resin, they can be screwed by self-tapping. Therefore, it is not necessary to previously provide the tap structures on the bosses 25a to 25e, and the structure of the mold insert for forming the bottom housing 20 can be simplified.

また、第２の平面部２１の一方面かつ電子基板３０に対向する位置には、厚み９μｍ以上のアルミニウム箔を有する複合フィルム２６が設けられ、更に、この複合フィルム２６の一部を覆うように放熱シート４０ｂが貼着されている。複合フィルム２６は、インサート成形によりボトムハウジング２０と一体化しても良いし、成形後に別途ボトムハウジング２０に貼着しても良い。   In addition, a composite film 26 having an aluminum foil having a thickness of 9 μm or more is provided on one surface of the second flat surface portion 21 and facing the electronic substrate 30, and further covers a part of the composite film 26. A heat radiation sheet 40b is adhered. The composite film 26 may be integrated with the bottom housing 20 by insert molding, or may be separately attached to the bottom housing 20 after molding.

ボトムハウジング２０を成形する樹脂は導電性を有するもの（ボトムハウジングの形状において、１０0〜１０3Ωの抵抗を示すもの）であれば良く、例えば、ポリアミド樹脂又はポリアミド樹脂とアクリロニトリル・ブタジエン・スチレン共重合合成樹脂とのポリマーアロイに、フィラーとして炭素繊維を１０〜３０重量％添加した複合材料を好適に用いることができる。ここで、フィラーを添加するベースとなる樹脂（以下、「ベース樹脂」という）に、ポリアミド樹脂を用いると、成形時においてスキン層が形成され、成形品の表面を円滑にすることができ、更に、アイゾット衝撃強度が高くなり、後述するセルフタップ時の割れや欠けを回避することが可能となる。ベース樹脂に添加するフィラーとして、上記した炭素繊維や金属フィラーを用いると、ベース樹脂に導電性及び電界遮蔽性を付与することができる。また、銅やアルミ等の金属、黒鉛、窒化ホウ素、窒化ケイ素、窒化アルミニウム、アルミナ、酸化マグネシウム、シリカ、酸化亜鉛又はカーボンナノチューブをフィラーとしてベース樹脂に添加すると、ベース樹脂に熱伝導性を付与することができる。更に、パーマアロイ合金、磁性ステンレス鋼、Ｆｅ−Ｃｒ−Ａｌ系合金、Ｆｅ−Ｃｒ−Ａｌ−Ｓｉ系合金、その他Ｆｅ系合金等の金属磁性粉をフィラーとしてベース樹脂に添加することで、ベース樹脂の電界遮蔽性を高めることができる。 The resin for forming the bottom housing 20 may be any one having conductivity (in the shape of the bottom housing, exhibiting a resistance of 10 0 to 10 3 Ω). For example, polyamide resin or polyamide resin and acrylonitrile butadiene styrene A composite material obtained by adding 10 to 30% by weight of carbon fiber as a filler to a polymer alloy with a copolymerized synthetic resin can be suitably used. Here, when a polyamide resin is used as a base resin (hereinafter referred to as “base resin”) to which a filler is added, a skin layer is formed at the time of molding, and the surface of the molded product can be smoothed. The Izod impact strength is increased, and it becomes possible to avoid cracks and chipping during self-tapping, which will be described later. When the above-described carbon fiber or metal filler is used as the filler to be added to the base resin, conductivity and electric field shielding can be imparted to the base resin. Further, when a metal such as copper or aluminum, graphite, boron nitride, silicon nitride, aluminum nitride, alumina, magnesium oxide, silica, zinc oxide or carbon nanotube is added as a filler to the base resin, the base resin is given thermal conductivity. be able to. Furthermore, by adding metal magnetic powder such as permalloy alloy, magnetic stainless steel, Fe—Cr—Al alloy, Fe—Cr—Al—Si alloy, and other Fe alloys as a filler to the base resin, It is possible to improve the electric field shielding property.

図２は、筐体の組み立て方法を説明する斜視図である。より詳細には、（ａ）は、切欠きにツメを嵌め込んだ状態を示す図であり、（ｂ）は、スリットにツメを差し込んだ状態を示す図である。尚、図２では、図を見やすくするために、電子基板やボスの記載を省略している。   FIG. 2 is a perspective view illustrating a method for assembling the casing. In more detail, (a) is a figure which shows the state which inserted the nail | claw in the notch, and (b) is a figure which shows the state which inserted the nail | claw in the slit. In FIG. 2, the illustration of the electronic substrate and the boss is omitted for easy understanding of the drawing.

カバー１０にボトムハウジング２０を嵌め合わせるには、まず、（ａ）に示すように、カバー１０とボトムハウジング２０とを対向させた状態で、ボトムハウジング２０の切欠２３ａ及び２３ｃにカバーのツメ１３ａ及び１３ｃを図の矢印方向に挿入する。この時、ツメ１３ａ及び１３ｃは切欠２３ａ及び２３ｃ内に収容され、ツメ１３ｂはボトムハウジング２０の外側に配置される。次に、（ａ）に示す状態から、（ｂ）に示すように、スリット２４ａ及び２４ｃが延びる一方向（図の矢印方向）にカバー１０を動かし、カバー１０とボトムハウジング２０とを相対的にスライドさせると、各々のツメ１３ａ〜１３ｃがスリット２４ａ〜２４ｃに差し込まれる。詳細には、３つのツメ１３ａが３つのスリット２４ａに差し込まれ、３つのツメ１３ｃが３つのスリット２４ｃに差し込まれ、ツメ１３ｂがボトムハウジング２０の外側からスリット２４ｂに差し込まれる。このようにして、カバー１０とボトムハウジング２０とが嵌め合わされる。   In order to fit the bottom housing 20 to the cover 10, first, as shown in (a), with the cover 10 and the bottom housing 20 facing each other, the notches 23 a and 23 c of the bottom housing 20 are covered with the tabs 13 a and 13 c of the cover. 13c is inserted in the direction of the arrow in the figure. At this time, the claws 13 a and 13 c are accommodated in the notches 23 a and 23 c, and the claws 13 b are disposed outside the bottom housing 20. Next, from the state shown in (a), as shown in (b), the cover 10 is moved in one direction in which the slits 24a and 24c extend (arrow direction in the figure), and the cover 10 and the bottom housing 20 are relatively moved. When it is slid, the claws 13a to 13c are inserted into the slits 24a to 24c. Specifically, the three claws 13a are inserted into the three slits 24a, the three claws 13c are inserted into the three slits 24c, and the claws 13b are inserted into the slit 24b from the outside of the bottom housing 20. In this way, the cover 10 and the bottom housing 20 are fitted together.

このように、ツメ１３ａ〜１３ｃがスリット２４ａ〜２４ｃに差し込まれることにより、カバー１０とボトムハウジング２０とのガタツキが効果的に防止される。また、カバー１０とボトムハウジング２０との嵌め合わせ時には、ツメ１３ａ〜１３ｃのスリット２４ａ〜２４ｃへの差し込みにあそびが設けられており、ガタツキが防止される状態を維持しながらカバー１０とボトムハウジング２０とを図２（ｂ）の矢印に平行な方向に相対的に移動できる。これによって、例えば、カバー１０及びボトムハウジング２０に寸法誤差が発生することに起因して、カバー１０にボトムハウジング２０を嵌め合わせた際に、ボス２５ｅと皿ネジ取り付け穴１４ｅとの相対的な位置ズレが発生する場合においても、ボス２５ｅと皿ネジ取り付け穴１４ｅの位置を合わせることが可能となる。   As described above, when the claws 13a to 13c are inserted into the slits 24a to 24c, rattling between the cover 10 and the bottom housing 20 is effectively prevented. Further, when the cover 10 and the bottom housing 20 are fitted together, play is provided in the insertion of the claws 13a to 13c into the slits 24a to 24c, and the cover 10 and the bottom housing 20 are maintained while maintaining a state in which rattling is prevented. Can be moved relatively in a direction parallel to the arrow in FIG. Thereby, for example, when the bottom housing 20 is fitted to the cover 10 due to the occurrence of a dimensional error in the cover 10 and the bottom housing 20, the relative positions of the boss 25e and the countersunk screw mounting hole 14e. Even when a deviation occurs, the positions of the boss 25e and the countersunk screw mounting hole 14e can be aligned.

ここで、側壁部１２ａ〜１２ｃに設けられるツメ１３ａ〜１３ｃの位置（図１の上下方向における位置）を変更することで、カバー１０とボトムハウジング２０との嵌め合いの強弱を調整することができる。具体的には、ツメ１３ａ〜１３ｃの位置を図１の上側にするほど、カバー１０とボトムハウジング２０との嵌め合いが強くなる。先述したように、ツメ１３ａ〜１３ｃは側壁部１２ａ〜１２ｃの端縁から延長方向に延びる突起を内方に折り曲げて形成している。従って、ツメ１３ａ〜１３ｃの折り曲げ位置を変えることで、側壁部１２ａ〜１２ｃに設けられるツメ１３ａ〜１３ｃの位置を変更することが可能となる。   Here, the strength of fitting between the cover 10 and the bottom housing 20 can be adjusted by changing the positions of the claws 13a to 13c (positions in the vertical direction in FIG. 1) provided on the side walls 12a to 12c. . Specifically, the fitting between the cover 10 and the bottom housing 20 becomes stronger as the positions of the claws 13a to 13c are set to the upper side in FIG. As described above, the claws 13a to 13c are formed by bending inward the protrusions extending in the extending direction from the end edges of the side walls 12a to 12c. Therefore, it is possible to change the positions of the claws 13a to 13c provided on the side walls 12a to 12c by changing the folding positions of the claws 13a to 13c.

また、筐体１では、ツメ１３ａ〜１３ｃがスリット２４ａ〜２４ｃに差し込まれているため、ボトムハウジング２０のボス２５ｅにカバー１０をネジ留めするだけで、カバー１０にボトムハウジング２０を完全に固定することができる。そして電子基板３０を収容した筐体１は、例えば、カバー１０がパソコン本体（図示せず）の内面に接触するように、パソコン本体内部に取り付けられ、電子基板３０の端子（図示せず）に開口から挿入したコネクタを接続して使用される。   Further, in the case 1, since the claws 13a to 13c are inserted into the slits 24a to 24c, the bottom housing 20 is completely fixed to the cover 10 only by screwing the cover 10 to the boss 25e of the bottom housing 20. be able to. The housing 1 containing the electronic substrate 30 is attached to the inside of the personal computer main body so that the cover 10 contacts the inner surface of the personal computer main body (not shown), and is connected to a terminal (not shown) of the electronic substrate 30. Used by connecting a connector inserted from the opening.

カバー１０にボトムハウジング２０を嵌め込んだ筐体１においては、ツメ１３ａ〜１３ｃがスリット２４ａ〜２４ｃを形成する部分の側壁部２２ａ〜２２ｃに接触している。これによって、樹脂製であるボトムハウジング２０に帯電する電荷や熱をカバー１０に移動させることが可能となり、筐体１の導電性、電界遮蔽性及び熱伝導性が良好となる。また、筐体１は、ボトムハウジング２０が樹脂製であるため、振動を吸収する特性にも優れる。   In the housing 1 in which the bottom housing 20 is fitted into the cover 10, the claws 13a to 13c are in contact with the side wall portions 22a to 22c of the portions that form the slits 24a to 24c. As a result, the charge and heat charged in the bottom housing 20 made of resin can be moved to the cover 10, and the conductivity, electric field shielding, and thermal conductivity of the housing 1 are improved. Moreover, since the bottom housing 20 is resin, the housing | casing 1 is excellent also in the characteristic which absorbs a vibration.

また、カバー１０を形成するアルミニウム板の表面には導電性材料がコーティングされているため、アルミニウム表面の酸化皮膜形成による導電性及び電界遮蔽性の劣化が効果的に抑制される。これによって、長期間に渡り、筐体１において熱伝導性、導電性及び電界遮蔽性の効果が発揮される。   Further, since the surface of the aluminum plate forming the cover 10 is coated with a conductive material, the deterioration of the conductivity and electric field shielding property due to the formation of an oxide film on the aluminum surface is effectively suppressed. Thereby, the effects of thermal conductivity, conductivity, and electric field shielding are exhibited in the casing 1 for a long period of time.

図３は、図２（ｂ）に示す筐体のＡ−Ａ’ラインの断面図である。   FIG. 3 is a cross-sectional view taken along line A-A ′ of the housing illustrated in FIG.

カバー１０の内面に設けられる放熱シート４０ａと、ボトムハウジング２０の内面に設けられる複合フィルム２６及び放熱シート４０ｂとは、各々電子基板３０に対向するように配置されている。これにより、電子基板３０で発生する熱をカバー１０及びボトムハウジング２０に素早く伝えることができる。特に、集積回路チップのような発熱の大きな電子部品に対して接触するように放熱シート４０ａ及び４０ｂを配置した場合、電子基板３０から発生する熱をより効果的にカバー１０及びボトムハウジング２０に伝えることが可能となる。この放熱シート４０ａ及び４０ｂには、例えば熱伝導率が１Ｗ／ｍ・ｋ以上であり、かつ、弾性を有する、シリコンゴムや非シリコンゴムを好適に用いることが出来る。   The heat radiating sheet 40 a provided on the inner surface of the cover 10, and the composite film 26 and the heat radiating sheet 40 b provided on the inner surface of the bottom housing 20 are disposed so as to face the electronic substrate 30. Thereby, the heat generated in the electronic substrate 30 can be quickly transferred to the cover 10 and the bottom housing 20. In particular, when the heat radiation sheets 40a and 40b are arranged so as to come into contact with an electronic component that generates a large amount of heat, such as an integrated circuit chip, the heat generated from the electronic substrate 30 is more effectively transmitted to the cover 10 and the bottom housing 20. It becomes possible. For the heat radiating sheets 40a and 40b, for example, silicon rubber or non-silicon rubber having a thermal conductivity of 1 W / m · k or more and having elasticity can be suitably used.

尚、本実施形態では、カバーをアルミニウムの板金加工で形成しているが、形成方法はこれに限定されず、例えばアルミダイキャスト成形で製作しても良い。   In this embodiment, the cover is formed by aluminum sheet metal processing, but the forming method is not limited to this, and the cover may be manufactured by, for example, aluminum die casting.

また、本実施形態では、カバーはアルミニウムで形成されているが、金属であれば特にこれに限定されない。また、アルミニウムの表面に導電性材料をコーティングすることは任意である。   In this embodiment, the cover is made of aluminum, but is not particularly limited as long as it is a metal. Moreover, it is optional to coat the surface of aluminum with a conductive material.

更に、本実施形態では、筐体は一面が開口した扁平な直方体形状であるが、特にこれに限定されず、電子基板の形状や筐体の組み込み先の形状を考慮して最適なものを選択することができる。   Furthermore, in this embodiment, the housing has a flat rectangular parallelepiped shape with an opening on one side, but is not particularly limited to this, and an optimal one is selected in consideration of the shape of the electronic board and the shape of the housing installation destination. can do.

更に、本実施形態では、ツメ及びスリットを各々７箇所に設けているが、これに限定されない。例えば、ツメ及びスリットの各々を２箇所に設けても良い。   Furthermore, in this embodiment, the claw and the slit are provided at seven locations, respectively, but the present invention is not limited to this. For example, each of the claw and the slit may be provided in two places.

更に、本実施形態では、ボトムハウジングに設けられる複合フィルム及び放熱シートと、カバーに設けられる放熱シートには矩形状のものを採用しているが、形状は特に限定されず、電子基板や筐体の形状に応じて適宜最適なものを選択することができる。更に、複合フィルムや放熱シートを設けることは任意である。   Furthermore, in the present embodiment, the composite film and the heat radiating sheet provided on the bottom housing and the heat radiating sheet provided on the cover adopt a rectangular shape, but the shape is not particularly limited, and the electronic substrate or housing The optimum one can be selected as appropriate according to the shape of the. Furthermore, it is optional to provide a composite film or a heat dissipation sheet.

本発明は、例えばＳＳＤのような電子部品を収容するための筐体に用いることができる。   The present invention can be used for a housing for accommodating an electronic component such as an SSD.

１ 筐体
１０ カバー
１１ 第１の平面部
１２ａ〜１２ｃ 側壁部
１３ａ〜１３ｃ ツメ
２０ ボトムハウジング
２１ 第２の平面部
２２ａ〜２２ｃ 側壁部
２３ａ、２３ｃ 切欠
２４ａ〜２４ｃ スリット
２５ａ〜２５ｅ ボス
２６ 複合フィルム
３０ 電子基板
４０ａ、４０ｂ 放熱シート DESCRIPTION OF SYMBOLS 1 Housing | casing 10 Cover 11 1st plane part 12a-12c Side wall part 13a-13c Claw 20 Bottom housing 21 2nd plane part 22a-22c Side wall part 23a, 23c Notch 24a-24c Slit 25a-25e Boss 26 Composite film 30 Electronic board 40a, 40b Heat dissipation sheet

Claims (5)

電子部品を収容するための中空箱形状の筐体であって、
金属からなり、第１の平面部と、前記第１の平面部の外周縁から垂直に立ち上がる第１の側壁部と、前記第１の側壁部の端縁から内方に向かって前記第１の平面部と平行に突出する複数のツメとを有するカバーと、
導電性を有する樹脂からなり、第２の平面部と、前記第２の平面部の外周縁から垂直に立ち上がる第２の側壁部とを有し、前記第１の平面部及び前記第２の平面部を対向させた状態で、前記カバーに嵌め込まれるボトムハウジングとを備え、
前記第２の側壁部には、前記カバ−と前記ボトムハウジングとを嵌め合わせた際に、前記ツメの各々が挿入される複数の切欠きと、前記カバーと前記ボトムハウジングとを嵌め合わせて前記切欠きの各々に前記ツメの各々を挿入した状態で、前記カバーと前記ボトムハウジングとを相対的にスライドさせることによって、前記ツメの各々が差し込まれる複数のスリットとが形成される、筐体。 A hollow box-shaped housing for housing electronic components,
The first flat portion made of metal, the first side wall portion that rises perpendicularly from the outer peripheral edge of the first flat surface portion, and the first side wall portion inward from the edge of the first side wall portion. A cover having a plurality of claws projecting parallel to the flat surface portion;
It consists of resin which has electroconductivity, has the 2nd plane part and the 2nd side wall part which stands up perpendicularly from the peripheral edge of the 2nd plane part, The 1st plane part and the 2nd plane With the bottom housing fitted into the cover, with the parts facing each other,
When the cover and the bottom housing are fitted to the second side wall, the plurality of notches into which the claws are inserted are fitted together with the cover and the bottom housing. A housing in which a plurality of slits into which each of the claws is inserted are formed by relatively sliding the cover and the bottom housing in a state where each of the claws is inserted into each of the notches. 前記第１の平面部及び前記第２の平面部は矩形状であり、
前記第１の側壁部は、前記第１の平面部の対向する一対の辺に設けられ、
前記カバーは、前記第１の平面部の他の一辺から、前記第１の平面部と垂直に立ち上がる第３の側壁部と、前記第３の側壁部の端縁に、内方に向かって前記第１の平面部に平行に突出するツメとを更に有し、
前記ボトムハウジングは、前記第３の側壁部に対応する前記第２の平面部の１辺から、前記第２の平面部と垂直に立ち上がる第４の側壁部を更に有し、
前記第４の側壁部には、前記カバーと前記ボトムハウジングを嵌め合わせた際に、前記第３の側壁部のツメが差し込まれるスリットが形成される、請求項１に記載の筐体。 The first plane part and the second plane part are rectangular,
The first side wall portion is provided on a pair of opposing sides of the first flat surface portion,
The cover has a third side wall portion that rises perpendicularly to the first flat surface portion from the other side of the first flat surface portion, and an edge of the third side wall portion toward the inside. A claw projecting parallel to the first plane portion,
The bottom housing further includes a fourth side wall portion that rises perpendicularly to the second flat surface portion from one side of the second flat surface portion corresponding to the third side wall portion,
The housing according to claim 1, wherein a slit into which a claw of the third side wall portion is inserted is formed in the fourth side wall portion when the cover and the bottom housing are fitted together. 前記導電性を有する樹脂は、ポリアミド樹脂又はポリアミド樹脂とアクリロニトリル・ブタジエン・スチレン共重合合成樹脂とのポリマーアロイに炭素繊維を１０〜３０重量％添加した複合材料からなる、請求項１または２に記載の筐体。   The said resin which has electroconductivity consists of a composite material which added the carbon fiber to 10 to 30weight% to the polymer alloy of a polyamide resin or a polyamide resin, and an acrylonitrile butadiene styrene copolymer synthetic resin. Housing. 前記カバー及び前記ボトムハウジングの少なくとも一方の内面に、熱伝導性を有する放熱シートが設けられる、請求項１〜３に記載の筐体。   The housing according to claim 1, wherein a heat radiating sheet having thermal conductivity is provided on an inner surface of at least one of the cover and the bottom housing. 前記カバーはアルミニウムで成形され、
前記成形されたアルミニウムの表面には導電性を有する材料がコーティングされる、請求項１〜４に記載の筐体。 The cover is formed of aluminum;
The housing | casing of Claims 1-4 with which the material which has electroconductivity is coated on the surface of the shape | molded aluminum.
JP2010006085A 2010-01-14 2010-01-14 Housing Pending JP2011146532A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010006085A JP2011146532A (en) 2010-01-14 2010-01-14 Housing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2010006085A JP2011146532A (en) 2010-01-14 2010-01-14 Housing

Publications (1)

Publication Number Publication Date
JP2011146532A true JP2011146532A (en) 2011-07-28

Family

ID=44461126

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2010006085A Pending JP2011146532A (en) 2010-01-14 2010-01-14 Housing

Country Status (1)

Country Link
JP (1) JP2011146532A (en)

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6350176U (en) * 1986-09-19 1988-04-05
JPH04134895U (en) * 1991-06-07 1992-12-15 日本電産株式会社 metal case
JPH06268390A (en) * 1993-03-09 1994-09-22 Inoac Corp Electromagnetic shield case
JPH11354966A (en) * 1998-06-11 1999-12-24 Mitsubishi Electric Corp Shield structure
JP2002009460A (en) * 2000-06-26 2002-01-11 Sony Tektronix Corp Electronic apparatus frame
JP2003285002A (en) * 2002-03-29 2003-10-07 Shinwa Kogyo Kk Inverter cover
JP2008193108A (en) * 2008-03-04 2008-08-21 Denso Corp Electronic control device

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6350176U (en) * 1986-09-19 1988-04-05
JPH04134895U (en) * 1991-06-07 1992-12-15 日本電産株式会社 metal case
JPH06268390A (en) * 1993-03-09 1994-09-22 Inoac Corp Electromagnetic shield case
JPH11354966A (en) * 1998-06-11 1999-12-24 Mitsubishi Electric Corp Shield structure
JP2002009460A (en) * 2000-06-26 2002-01-11 Sony Tektronix Corp Electronic apparatus frame
JP2003285002A (en) * 2002-03-29 2003-10-07 Shinwa Kogyo Kk Inverter cover
JP2008193108A (en) * 2008-03-04 2008-08-21 Denso Corp Electronic control device

Similar Documents

Publication Publication Date Title
JP6521171B2 (en) Circuit structure
JP5418851B2 (en) Electronic control unit
JP2011023459A (en) Electronic control unit
US8760868B2 (en) Electronic device enclosures and heatsink structures with thermal management features
US11864362B2 (en) Power supply device with a heat generating component
JP5252793B2 (en) Electrical component unit
JP5501816B2 (en) Electronic control unit for automobile
JP3213707U (en) Control device for electric power steering
JP2011258508A (en) Connector
JP5387738B2 (en) Electrical component unit
JP2019193466A (en) Power conversion device
JP2011176079A (en) Housing
JP2018098927A (en) Electric connection box
JP7496556B2 (en) Capacitor
US20220263305A1 (en) Circuit structure
JP2017098418A (en) Circuit structure, electric connection box, and manufacturing method of circuit structure
JP2011146532A (en) Housing
JP6194868B2 (en) Electrical junction box
JP2015104183A (en) Circuit structure body and dc-dc converter device
JP2015065307A (en) Housing
JP7163022B2 (en) electronic controller
JP2007067201A (en) Electronic circuit unit
JP2024091990A (en) Power supplies and power conversion equipment
JP2017011235A (en) Heat sink and electric connection box
JP6011886B2 (en) Electrical junction box

Legal Events

Date Code Title Description
RD02 Notification of acceptance of power of attorney

Free format text: JAPANESE INTERMEDIATE CODE: A7422

Effective date: 20110902

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20121220

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131002

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20131107

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131227

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20140304