JP2011146488A - Led照明装置 - Google Patents
Led照明装置 Download PDFInfo
- Publication number
- JP2011146488A JP2011146488A JP2010005370A JP2010005370A JP2011146488A JP 2011146488 A JP2011146488 A JP 2011146488A JP 2010005370 A JP2010005370 A JP 2010005370A JP 2010005370 A JP2010005370 A JP 2010005370A JP 2011146488 A JP2011146488 A JP 2011146488A
- Authority
- JP
- Japan
- Prior art keywords
- light
- led
- lighting device
- illuminance
- illuminating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052984 zinc sulfide Inorganic materials 0.000 claims abstract description 15
- 239000005083 Zinc sulfide Substances 0.000 claims abstract description 11
- DRDVZXDWVBGGMH-UHFFFAOYSA-N zinc;sulfide Chemical compound [S-2].[Zn+2] DRDVZXDWVBGGMH-UHFFFAOYSA-N 0.000 claims abstract description 11
- 150000001875 compounds Chemical class 0.000 claims abstract description 9
- 230000000694 effects Effects 0.000 claims description 18
- 238000005286 illumination Methods 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 10
- 239000000463 material Substances 0.000 abstract description 13
- 230000005540 biological transmission Effects 0.000 abstract description 4
- 238000009792 diffusion process Methods 0.000 description 10
- 239000002245 particle Substances 0.000 description 9
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- FAPWRFPIFSIZLT-UHFFFAOYSA-M Sodium chloride Chemical compound [Na+].[Cl-] FAPWRFPIFSIZLT-UHFFFAOYSA-M 0.000 description 6
- 239000011230 binding agent Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000012190 activator Substances 0.000 description 3
- 239000013078 crystal Substances 0.000 description 3
- 239000011780 sodium chloride Substances 0.000 description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- TWRXJAOTZQYOKJ-UHFFFAOYSA-L Magnesium chloride Chemical compound [Mg+2].[Cl-].[Cl-] TWRXJAOTZQYOKJ-UHFFFAOYSA-L 0.000 description 2
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 2
- 229910052946 acanthite Inorganic materials 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- WDIHJSXYQDMJHN-UHFFFAOYSA-L barium chloride Chemical compound [Cl-].[Cl-].[Ba+2] WDIHJSXYQDMJHN-UHFFFAOYSA-L 0.000 description 2
- 229910001626 barium chloride Inorganic materials 0.000 description 2
- 238000001354 calcination Methods 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- SQQMAOCOWKFBNP-UHFFFAOYSA-L manganese(II) sulfate Chemical compound [Mn+2].[O-]S([O-])(=O)=O SQQMAOCOWKFBNP-UHFFFAOYSA-L 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000011593 sulfur Substances 0.000 description 2
- 229910052717 sulfur Inorganic materials 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000005406 washing Methods 0.000 description 2
- -1 BaCl Chemical class 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 229910005191 Ga 2 O 3 Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- AJNVQOSZGJRYEI-UHFFFAOYSA-N digallium;oxygen(2-) Chemical compound [O-2].[O-2].[O-2].[Ga+3].[Ga+3] AJNVQOSZGJRYEI-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 229910001195 gallium oxide Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PDPJQWYGJJBYLF-UHFFFAOYSA-J hafnium tetrachloride Chemical compound Cl[Hf](Cl)(Cl)Cl PDPJQWYGJJBYLF-UHFFFAOYSA-J 0.000 description 1
- 150000004820 halides Chemical class 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052748 manganese Inorganic materials 0.000 description 1
- 239000011572 manganese Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- YPNVIBVEFVRZPJ-UHFFFAOYSA-L silver sulfate Chemical compound [Ag+].[Ag+].[O-]S([O-])(=O)=O YPNVIBVEFVRZPJ-UHFFFAOYSA-L 0.000 description 1
- XUARKZBEFFVFRG-UHFFFAOYSA-N silver sulfide Chemical compound [S-2].[Ag+].[Ag+] XUARKZBEFFVFRG-UHFFFAOYSA-N 0.000 description 1
- 229940056910 silver sulfide Drugs 0.000 description 1
- FSJWWSXPIWGYKC-UHFFFAOYSA-M silver;silver;sulfanide Chemical compound [SH-].[Ag].[Ag+] FSJWWSXPIWGYKC-UHFFFAOYSA-M 0.000 description 1
- DANYXEHCMQHDNX-UHFFFAOYSA-K trichloroiridium Chemical compound Cl[Ir](Cl)Cl DANYXEHCMQHDNX-UHFFFAOYSA-K 0.000 description 1
- 229910052727 yttrium Inorganic materials 0.000 description 1
- VWQVUPCCIRVNHF-UHFFFAOYSA-N yttrium atom Chemical compound [Y] VWQVUPCCIRVNHF-UHFFFAOYSA-N 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
- 229910000368 zinc sulfate Inorganic materials 0.000 description 1
- 229960001763 zinc sulfate Drugs 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49107—Connecting at different heights on the semiconductor or solid-state body
Abstract
【解決手段】 並置された複数のLED構造体1と、これら複数のLED構造体1の全体を包囲する硫化亜鉛(ZnS-Ag)化合物を拡散配置した光透過体を有することを特徴とする照明装置。
【選択図】 図4
Description
汎用の照明装置40型蛍光灯具と、同じ輝度を有するため、図4で示したような配置で、31個のLED13を14のアルミ基板上に均一に並置した。LED13としては、1ミリ角の350mAチップ青色LEDを217mAの電流で使用した。すなわち、1ミリ角のLED13を5ミリ間隔に直列に取り付け、それを光拡散効果を有する光透過体11で包囲し、定電流回路と整流ダイオードを介して商用電源に接続できるようにボンディングワイアー等で電気的に配線をした。消費電力は同じ形状の照明装置の約1/2であった。また、寿命は10倍以上あるはずである。
混ぜ合わされた材料は高温反応炉において1250℃で2時間加熱される。
このステップは残りの6方結晶ZnSを立法結晶ZnSに変え、立法結晶ZnSは大部分は活性光拡散材料である。灼熱した後、蓋付きのるつぼは加熱炉から取り除かれて室温まで冷却され、材料は一緒に混合されて脱イオン(DI)水を用いて洗浄された。2つ又は3つのDI水が洗浄した後、未反応のZnO及びいくらかの取り入れられていない酸化銅を除去するために、材料は酢酸で洗浄された。酸で洗浄された材料は、少なくとも2回、DI水で再度洗浄され、次に残滓の大部分を光拡散材料から除去するためにKCNで再度洗浄される。洗浄の後、光拡散粒子はKCN洗浄の前に光拡散粒子が有したダークグレイの実体色から明るい実体色に変化する。
また、照明装置の17から20よりに10度きざみに18の方向に10度まで測定した。
輝度の測定は、トプコン製輝度計を使用して行った。
実施例1において、光透過体11を15にした以外は実施例1と同様にして照明装置を得た。すなわち、光拡散効果を持つ光透過体を使用せず透明バインダーを使用した以外は実施例1と同様にして照明装置を得て、同様に照度を測定した。結果を表3に示す。
2 p層
3 p層
4 pn接合層
5 n層
6 n層
7 n電極
8 バッファ層
9 サファイア基板など
10 波長変換層(イットリウム等蛍光層)
11 光拡散効果を持つ光透過体
12 ボンディングワイアー(電極間接続)
13 LED
14 LED構造体取り付け基板
15 一般的な光透過体
16 光屈折体の実質的焦点距離
17 発光面から90度の方向
18 発光面方向に40度の角度
19 発光面より1mの地点
20 平面照明装置(照明板)発光面
21 測定ポイント
Claims (5)
- 並列に接続された複数のLED構造体と、これら複数のLED構造体を包囲する硫化亜鉛(ZnS-Ag)化合物を拡散配置した光透過体を有する照明装置であることを特徴とする照明装置。
- 上記硫化亜鉛(ZnS-Ag)化合物を拡散配置した光透過体がLED構造体の基板バッファー層までを包囲し且つ接続のボンディングワイアーの上面までを包囲する請求項1記載の照明装置。
- 上記硫化亜鉛(ZnS-Ag)化合物を拡散配置した光透過体は光拡散効果を有する光屈折体を有しているものである請求項1又は請求項2記載の照明装置。
- 上記光照明装置が、内部に包囲している個々のLED構造体の輪郭が目視で識別できない程度に面発光しているものである請求項1ないし請求項3の何れかの請求項記載の照明装置。
- 上記照明装置の中央から、光の照射される方向に1mの距離を隔てて存在する平面上の照度において、上記照明装置の中央を通り、上記照明装置から直角に伸びた直線が該平面となす角が
10°の地点の照度が、上記照明装置の中央を通る直線と該平面のなす角が90°の地点の照度の1/3以上である請求項1ないし請求項5の何れかの請求項記載の照明装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010005370A JP5710126B2 (ja) | 2010-01-14 | 2010-01-14 | Led照明装置 |
CN2010106106209A CN102128369A (zh) | 2010-01-14 | 2010-12-29 | Led照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010005370A JP5710126B2 (ja) | 2010-01-14 | 2010-01-14 | Led照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011146488A true JP2011146488A (ja) | 2011-07-28 |
JP5710126B2 JP5710126B2 (ja) | 2015-04-30 |
Family
ID=44266568
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010005370A Expired - Fee Related JP5710126B2 (ja) | 2010-01-14 | 2010-01-14 | Led照明装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP5710126B2 (ja) |
CN (1) | CN102128369A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019054447A1 (ja) * | 2017-09-14 | 2019-03-21 | 株式会社グリーンウェル | ブルーライトを低減した白色led素子および該白色led素子を複数個、配線基板上に配列・搭載した白色ledユニット |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002226847A (ja) * | 2000-04-11 | 2002-08-14 | Toshiba Corp | 表示装置用蛍光体およびそれを用いた電界放出型表示装置 |
JP2008038051A (ja) * | 2006-08-08 | 2008-02-21 | Sumitomo Chemical Co Ltd | 蛍光体 |
JP2008124153A (ja) * | 2006-11-09 | 2008-05-29 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
JP2009004698A (ja) * | 2007-06-25 | 2009-01-08 | Kyocera Corp | 照明用光源 |
JP2009065199A (ja) * | 2008-11-17 | 2009-03-26 | Toshiba Corp | 発光装置 |
JP2009076576A (ja) * | 2007-09-19 | 2009-04-09 | Sharp Corp | 発光装置 |
-
2010
- 2010-01-14 JP JP2010005370A patent/JP5710126B2/ja not_active Expired - Fee Related
- 2010-12-29 CN CN2010106106209A patent/CN102128369A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002226847A (ja) * | 2000-04-11 | 2002-08-14 | Toshiba Corp | 表示装置用蛍光体およびそれを用いた電界放出型表示装置 |
JP2008038051A (ja) * | 2006-08-08 | 2008-02-21 | Sumitomo Chemical Co Ltd | 蛍光体 |
JP2008124153A (ja) * | 2006-11-09 | 2008-05-29 | Toyoda Gosei Co Ltd | 発光装置及びその製造方法 |
JP2009004698A (ja) * | 2007-06-25 | 2009-01-08 | Kyocera Corp | 照明用光源 |
JP2009076576A (ja) * | 2007-09-19 | 2009-04-09 | Sharp Corp | 発光装置 |
JP2009065199A (ja) * | 2008-11-17 | 2009-03-26 | Toshiba Corp | 発光装置 |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2019054447A1 (ja) * | 2017-09-14 | 2019-03-21 | 株式会社グリーンウェル | ブルーライトを低減した白色led素子および該白色led素子を複数個、配線基板上に配列・搭載した白色ledユニット |
JP2019054098A (ja) * | 2017-09-14 | 2019-04-04 | 株式会社グリーンウェル | ブルーライトを低減した白色led素子および該白色led素子を複数個、配線基板上に配列・搭載した白色ledユニット |
CN110168757A (zh) * | 2017-09-14 | 2019-08-23 | 株式会社格林维爱 | 具有减少蓝光的白色led元件和由多个该白色led元件在布线板上组装成的白色led组件 |
Also Published As
Publication number | Publication date |
---|---|
JP5710126B2 (ja) | 2015-04-30 |
CN102128369A (zh) | 2011-07-20 |
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