JP2011146456A - Micro-component arrangement board and micro-component arrangement method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a micro-component arrangement board and a micro-component arrangement method that allow components to be held in a properly balanced manner, even if there is disturbance, and allow a large amount of micro-components to be aligned. <P>SOLUTION: An arrangement board is configured, such that a plurality of components are arranged and placed thereon in a prescribed direction; the arrangement board includes a plurality of component placing regions on either one of substrate surfaces of a substrate; each component placing region has two first grooves formed almost in parallel to each other, and one or more second grooves formed almost orthogonally to the first grooves in a region sandwiched by the two first grooves; and each component placing region is formed, by connecting the second grooves and the first grooves to each other. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an arrangement plate for minute parts and a method for arranging minute parts.

  In recent years, electronic components have been rapidly reduced in size with the development of manufacturing technology. With the miniaturization of components, for example, circuit boards to be incorporated are also relatively miniaturized, and as a result, many products can be simultaneously processed even with a conventional assembling apparatus.

  However, in assembling components on a circuit board, not only the mounting position of components but also the assembly direction must be accurately controlled. Therefore, in the conventional method of arranging one or several pieces by a robot apparatus equipped with an image processing apparatus, it takes time to arrange a large number of pieces, or multiple robot apparatuses are operated simultaneously. It becomes a method, and it becomes a big cost increase.

  As a process that does not require such a large-scale device, the parts themselves are self-aligned, and a large number of micro parts are accurately arranged on the substrate in a short time, a volatile liquid is filled in the recess according to the part shape, The component is guided to a predetermined position by the surface tension of the liquid, and the component is placed in the recess when the liquid volatilizes. That is, it is disclosed that the components are aligned by accommodating the components in a concave shape that regulates the arrangement direction (Patent Document 1).

JP 2003-209397 A

  However, even in the above-described Patent Document 1, the liquid filled in the recesses is shaken by, for example, fine vibrations from the outside, thereby causing the parts to be shaken or tilted. In this state, the liquid is volatilized, and when the component is stored in the recess, the component inclination due to shaking is stored without correction, and it is difficult to accurately align the components.

  Therefore, there are provided an arrangement plate and an arrangement method capable of holding parts in a well-balanced manner even when there is a disturbance and arranging a large number of micro parts.

  The present invention can be realized as the following forms or application examples so as to solve at least one of the above-described problems.

  [Application Example 1] The micro component array plate of this application example is an array plate for aligning and mounting a plurality of components in a predetermined direction, and is formed substantially parallel to either one of the substrate surfaces. Two first grooves, and one or more second grooves formed in a region sandwiched between the two first grooves so as to be substantially orthogonal to the first grooves, and the second grooves, A plurality of component placement areas formed by connecting the first grooves are provided.

  According to the application example described above, since the plurality of first grooves and the second grooves are connected, when the micropart is held by the liquid introduced into the grooves, the liquid level in each groove is the same. It is possible to maintain and evenly balance the component adsorption force due to the surface tension. Furthermore, even if the arrangement plate vibrates due to disturbance, the liquid fluctuation in each of the first and second grooves is suppressed to a slight extent, so that the inclination of the parts does not occur. Can be placed.

  [Application Example 2] In the above application example, at least the first groove and the second groove of the array plate, except for the formation surface of the component placement region of the substrate, has water repellency. Features.

  According to the application example described above, since the liquid introduced into the grooves is removed without staying except for the first and second grooves, the micropart can be reliably guided to the part placement region.

  Application Example 3 In the application example described above, the first groove and the second groove have hydrophilicity.

  According to the application example described above, the liquid can be reliably retained in the first and second grooves, so that the minute component can be reliably guided to the component placement region.

  Application Example 4 In the application example described above, the substrate is a silicon substrate.

  According to the application example described above, accurate groove formation and a large number of component placement regions can be easily formed on the array plate. Moreover, since it has liquid repellency, a process for imparting liquid repellency is not required, and therefore the manufacturing process can be shortened.

  Application Example 5 The method of arranging the micro components of this application example is sandwiched between two first grooves formed in parallel with one of the substrate surfaces of the substrate and the two first grooves. An array of micro components using a micro component array plate that includes one or more second grooves formed in a region, and a plurality of component mounting regions formed by connecting the second groove and the first groove. A liquid supply step of supplying a liquid to the component placement region of the array plate and removing the liquid on the substrate surface excluding the first groove and the second groove; A component placing step for placing the arrayed component on the filled first groove and the second groove, an array plate vibrating step for vibrating the array plate on which the arrayed component is placed, and the array plate vibrating step And a drying step of evaporating the liquid remaining in the first groove and the second groove. To.

  According to the application example described above, by applying vibration to the array plate, the position of the component adsorption force by the surface tension of the liquid that supports the component inside the groove is very small, that is, a position where the balance can be achieved. It can be applied even by surface tension.

  Application Example 6 In the application example described above, the liquid is water.

  Safety can be ensured and environmental load can be reduced.

An embodiment is shown, (a) is a top view typically shown, and (b) is a partial perspective view. The embodiment is shown, (a) is a partial plan view, (b) (c) is a sectional view. The flowchart which shows the manufacturing process of embodiment. Sectional drawing which shows the manufacturing method of embodiment. The flowchart which shows the components arrangement | sequence process of embodiment. Sectional drawing and top view which show the components arrangement | sequence method of embodiment. Sectional drawing and top view which show the components arrangement | sequence method of embodiment.

  Embodiments of an array plate according to the present invention will be described below with reference to the drawings.

(Embodiment)
FIG. 1A shows a schematic plan view of an array plate of the present embodiment, and FIG. 1B shows a schematic perspective view of a component placement region 100a in which the portion A in FIG. 1A is enlarged. . The array plate 100 includes a plurality of component placement regions 100 a including grooves 10 in the substrate 20. The grooves 10 formed in the component placement area 100a are formed such that components (not shown) to be arranged are oriented in a predetermined direction and arranged at predetermined positions. The outer shape of the substrate 20 of the array plate 100 is not particularly limited to a rectangular shape as illustrated, and may be a circular shape, for example.

  FIGS. 2B and 2C show the L-L ′ cross section and the M-M ′ cross section in FIG. 2A, respectively, showing a plan view of the embodiment. The first grooves 11a and 11b are formed substantially parallel to each other. The second grooves 12a, 12b, 12c, and 12d are formed in a direction orthogonal to the first grooves 11a and 11b, and both ends thereof are connected to the first grooves 11a and 11b. That is, a continuous groove 10 is formed by the first grooves 11a and 11b and the second grooves 12a, 12b, 12c, and 12d, and convex portions 30a, 30b, and 30c surrounded by the groove 10 are formed.

  The number of grooves of the second grooves 12a, 12b, 12c, and 12d is designed to an optimum number of grooves according to the form of parts to be aligned, and is not limited to the four shown in FIG. However, it is preferable that the number of the second grooves (12a, 12b, 12c, 12d) is two or more in order to hold the components in a balanced manner.

  The surface of the substrate surface 20a where the groove 10 of the substrate 20 is formed is coated with a water repellent film 40. By applying the water repellent film 40 to the surface of the substrate surface 20a in advance before forming the groove 10, the water repellent film 40 remains on the surfaces of the convex portions 30a, 30b, and 30c. As the water-repellent film 40, for example, Hilex (manufactured by NTT Advanced Technology Co., Ltd.), SS Coat (manufactured by New Showa Court Co., Ltd.), or a fluorine-based coating material is preferably used. Further, by using a material having water repellency for the substrate 20 of the array plate 100, the coating of the water repellent film 40 can be omitted.

  Further, as shown in the enlarged view of the groove 10 part in FIG. 2D, it is preferable to coat the wall 10a and the bottom part 10b inside the groove 10 with a hydrophilic film 60. The hydrophilic film 60 can surely introduce and hold the liquid into the groove 10 and ensure the amount of liquid for holding the component. For the hydrophilic film 60, for example, a coating agent made of Hydrotect (manufactured by TOTO Corporation) or a polysilazane material can be suitably applied.

[Array plate manufacturing method]
Next, a method for manufacturing the array plate 100 will be described. FIG. 3 is a flowchart showing a manufacturing process of the array plate 100, and FIG. 4 is a cross-sectional view illustrating a method of manufacturing the array plate 100.

(Water repellent treatment process)
First, the water repellent treatment step (S101) is entered. A substrate 20 having both surfaces prepared in advance is prepared. The material of the substrate 20 is not particularly limited, but a silicon substrate is preferably used because it is a suitable processing method to perform precision processing by etching in a groove forming step described later. Here, a manufacturing method using a silicon substrate will be described.

In the water repellent treatment step (S101), a water repellent film 40 is formed on one substrate surface 20a of the silicon substrate 20 prepared as shown in FIG. For example, Hi-Rex (manufactured by NTT Advanced Technology Co., Ltd.), SS Coat (manufactured by Shin-Showa Court Co., Ltd.), fluorine-based coating materials, etc. are used as the water-repellent film. And use.
A water repellent solution diluted with a solvent is uniformly applied to the substrate surface 20a of the substrate 20 by spin coating, spraying, or the like, and dried and fixed.

(Mask formation process)
Next, the process proceeds to an etching mask formation step (S102). As shown in FIG. 4B, a photosensitive resin film is uniformly applied on the water repellent film 40 of the substrate 20 on which the above-described water repellent film 40 is formed, and an opening corresponding to the groove forming portion is formed by photolithography. 50a is formed, and an etching mask 50 is formed.

(Groove formation process)
Next, the process proceeds to the groove forming step (S103). In the groove forming step (S103), as shown in FIG. 4C, the substrate 20 including the water repellent film 40 exposed from the opening 50a of the etching mask 50 formed in the etching mask forming step (S102) is etched. The groove 10 is formed by etching with a liquid.

(Hydrophilic treatment process)
Next, the process proceeds to the hydrophilic treatment step (S104). As shown in FIG. 4D, the base material of the hydrophilic film 60 is applied from above the etching mask 50. As a base material of the hydrophilic film 60, for example, a solution obtained by diluting a coating agent made of Hydrotect (manufactured by TOTO Corporation) or a polysilazane material with a solvent is used. This hydrophilic agent solution is uniformly applied to the inner wall 10a and the bottom 10b of the groove 10 by spraying or the like. The hydrophilic film 60 may not be formed on other portions, for example, the surface of the etching mask 50.

(Etching mask removal process)
Next, the process proceeds to an etching mask removing step (S105). In the etching mask removing step (S105), the etching mask 50 is removed leaving the water repellent film 40 formed on the substrate surface 20a of the substrate 20. The etching mask 50 is removed, and the array plate 100 shown in FIG. 4E can be obtained.

[Parts arrangement method]
Next, a method for arranging components using the arrangement plate 100 of the above-described embodiment will be described. FIG. 5 is a flowchart showing the component arrangement process, and FIGS. 6 and 7 are a plan view and a cross-sectional view showing each process.

(Liquid supply process)
First, as shown in FIG. 6 (a), from a supply device (not shown), the liquid 200, which is obtained by filtering and removing minute solids (dust) so as to cover the component placement region 100a of the array plate 100 that has been cleaned in advance, is covered. Supply starts from the liquid supply step (S201). Although a supply method is not specifically limited, For example, it supplies with a dispenser, spray, etc. The purpose of the liquid supply step (S201) can also be achieved by fully immersing the entire array plate 100 in the liquid bath and pulling the substrate surface 20a upward. The supplied liquid 200 covers the component placement area 100 a as a droplet on the upper surface of the array plate 100.

  It is preferable to use water or a volatile solvent as the liquid to be used. However, since pure water is used, there is little influence on parts and no influence on the environment, so that it can be applied more preferably. In the present embodiment, a case where pure water is applied to the liquid 200 will be described (hereinafter, the liquid 200 will be described as pure water 200).

  Since the water repellent performance is imparted to the surface of the substrate surface 20a by the water repellent film 40, the supplied pure water 200 has the first groove 11a, 11b, the second groove as shown in FIG. 6B. Pure water 200 remains in 12a, 12b, 12c, and 12d, resulting in residual water 200a, and in other portions, spherical water droplets 200b are formed by the surface tension of the pure water 200 due to the imparted water repellency. The spherical water droplets 200b are easy to roll on the water-repellent coating 40 of the array plate 100, and can be easily removed from the array plate 100. In addition, although it is possible to blow off the water droplets 200b with the compressed air of a low pressure, the residual water 200a must be controlled to a pressure (air volume) that is not removed at the same time.

(Part placement process)
Next, the process proceeds to the component placement process (S202). As shown in FIG. 6C, the components 300 to be arranged are placed on the residual water 200a remaining in the first grooves 11a and 11b and the second grooves 12a, 12b, 12c and 12d. The upper surface of the residual water 200a becomes cylindrical (cylindrical) from the substrate surface 20a due to surface tension. The component 300 is supported by the columnar top portion 200c.

  When the component 300 is placed on the residual water 200a, it is not necessary to find and place an accurate position. That is, there may be a relative displacement with respect to the groove 10 as shown in the plan view of FIG. Therefore, it is only necessary to place the component 300 on the residual water 200a of the array plate 100 by a simple component moving device or handwork.

(Array plate vibration process)
In order to guide the component 300 placed on the array plate 100 in a position shifted by the above-described component placement step (S202) to the predetermined position, the array plate vibration step (in which vibration is applied to the array plate 100) The process proceeds to S203). The mounted part 300 acts so that the surface tension of the residual water 200a attracts the part 300. In order to cause the effect of this surface tension, vibration F is applied to the array plate 100 by the vibration device 400 as shown in FIG. The vibration F may have a minute amplitude, and ultrasonic vibration is preferable.

  Due to the vibration F, the component 300 moves on the residual water 200a, and the component 300 is guided to the place where the surface tension of the residual water 200a is balanced, that is, to the correct arrangement position of the components 300. As shown in the plan view of FIG. 7 (f), the component 300 becomes the center of the groove 10 constituted by the first grooves 11a and 11b and the second grooves 12a, 12b, 12c, and 12d, which are accurate placement positions. To be induced.

(Drying process)
Next, the process proceeds to the drying step (S204). In the array plate vibration step (S203), the array plate 100 including the components 300 arranged at the correct positions is put into a drying device (not shown) to evaporate the residual water 200a. This is drying of a small amount of residual water 200a, and transpiration is possible by heating for about 60 seconds at a drying temperature of about 50 ° C. When a volatile liquid is used, the optimum drying temperature and time are set for the liquid used.

  As shown in FIG. 7G, the components 300 are arranged on the arrangement plate 100 in a predetermined position and direction by drying. Thereafter, the array plate 100 including the parts 300 is conveyed to an assembly apparatus for parts 300 (not shown), and predetermined parts are assembled.

  When transporting the array plate 100 including the components 300, it is preferable that the array plate 100 includes a suction device, for example, although not shown so that the components 300 do not move and shift from a predetermined array position during transport. In addition, for supplying the components 300 to an apparatus such as assembly after transport, a transport device that picks up the components 300 placed on the array plate 100 simultaneously with a suction device or the like and supplies the components 300 to an apparatus such as an assembly is used. preferable. That is, when picking up the component 300, disturbance (vibration or the like) is applied to the arrangement plate 100, and the arrangement position of the component 300 before picking up may be shifted.

  As described above, in this embodiment, a large number of minute parts can be placed on the array plate with the direction and position accurately determined in a short time. In addition, since the effect can be sufficiently exerted even if the liquid used is water (pure water), it has higher safety and higher environmental impact than conventional arrangement methods that require the use of volatile solvents. It is.

  DESCRIPTION OF SYMBOLS 10 ... Groove, 20 ... Board | substrate, 100 ... Arrangement board, 100a ... Component mounting area.

Claims (6)

An array plate for arranging and mounting a plurality of parts in a predetermined direction,
Two first grooves formed substantially parallel to one of the substrate surfaces; and
One or more second grooves formed so as to be substantially orthogonal to the first groove in a region sandwiched between the two first grooves,
A plurality of component placement areas formed by connecting the second groove and the first groove;
An array plate of micro parts characterized by that. Except at least the first groove and the second groove of the array plate, the formation surface of the component placement region of the substrate has water repellency.
The arrangement plate of micro components according to claim 1. The first groove and the second groove have hydrophilicity;
3. The micropart arrangement plate according to claim 1, wherein the microparts are arranged.   An array plate of micro parts, wherein the substrate is a silicon substrate. Two first grooves formed in parallel to either one of the substrate surfaces, and one or more second grooves formed in a region sandwiched between the two first grooves, A method for arranging micro components using a micro component array plate having a plurality of component placement areas formed by connecting the second groove and the first groove,
A liquid supply step of supplying a liquid to the component placement region of the array plate and removing the liquid on the substrate surface excluding the first groove and the second groove;
A component placing step of placing an arrayed component on the first groove and the second groove filled with the liquid;
An array plate vibration step of vibrating the array plate on which the array component is placed;
A drying step of evaporating liquid remaining in the first groove and the second groove after the array plate vibration step;
A method of arranging micro parts characterized by the above.   6. The method for arranging microcomponents according to claim 5, wherein the liquid is water.

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