JP2011134943A - Method of manufacturing internal electrode of electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic component suppressed in cracks generated upon de-binder treatment in downsizing, multi-layering and high-capacitizing the electronic component such as a laminated ceramic piezoelectric element. <P>SOLUTION: The method of manufacturing the electronic component having an internal electrode layer includes the step of: setting a distance on a printing surface from all places of a paste printing part for an internal electrode containing a powder component containing conductor powder and a conjugate material, a volatile organic component such as a solvent and nonvolatile organic components such as a binder and a plasticizer to a not-printing part of 0.1 mm or less in width to 2 mm or less; printing the not-printing part on a green sheet serving as a dielectric layer, as an internal electrode printing pattern linking up to a surface of a formed body before degreased; and volatilizing and sintering the volatile solvent to form a pre-sintered electrode film that will form the internal electrode layer. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

The present invention relates to a method for manufacturing an internal electrode of an electronic component and the electronic component, and more particularly, to a method for manufacturing an internal electrode of an electronic component and an electronic component capable of improving the yield of a multilayer electronic component such as a multilayer ceramic piezoelectric element. .

A multilayer ceramic piezoelectric element as an example of an electronic component includes an element body having a laminated structure in which a plurality of dielectric layers and internal electrode layers are alternately arranged, and a pair of external terminal electrodes formed at both ends of the element body. Consists of.

In this multilayer ceramic piezoelectric element, first, a green sheet as a dielectric layer and a pre-fired electrode film as an internal electrode layer are alternately laminated to produce a pre-fired element body, and then fired. Thereafter, a pair of external terminal electrodes are formed on both end portions of the element body after firing. Note that the green sheet and the electrode film before firing usually contain a binder. Therefore, the element body before firing is usually fired after heating and debinding to remove the binder.

That is, a slurry containing a dielectric is formed by a method such as pulling slip molding, doctor blade molding, extrusion molding, etc., and the internal electrode paste is applied onto the green sheet, and then dried and the An electrode film before firing is formed. A plurality of green sheets on which the pre-fired electrode film is formed are stacked, press-molded, and then heated to degrease the organic components in the green sheet and the internal electrode film paste. The organic component is decomposed by heating to become a gas and escapes from the green sheet and the internal electrode film before firing.

Here, the organic component in the internal electrode is degreased as a gas at a lower temperature than the organic component in the green sheet by the catalytic action of the metal particles.
At this time, the gas component pushes the green sheet that has not yet been degreased, including the dielectric, with a pressure having a component perpendicular to the stacking direction. Then, the green sheets are peeled off in the stacking direction, creating gaps between the green sheets, making subsequent sintering difficult, improving the yield by suppressing the occurrence of defects such as cracks and delamination. It would be desirable to produce laminated ceramic electronic components and membrane electronic components.

Therefore, in the firing process of the film or laminated structure on the substrate, pressure sintering is achieved by applying a centrifugal force in a direction perpendicular to the interface of the film or the laminate, thereby achieving the interface of the film or the layer. A baking method for preventing the occurrence of defects by greatly reducing the shrinkage in the horizontal direction, a baking method for improving the interfacial adhesion by matching the bonding interface, a film produced using the baking method, or Although a laminated structure and a film-like or laminated electronic member have been provided (Patent Document 1), the apparatus has become large.

Therefore, first, it is desirable to prevent the occurrence of cracks during the debinding process in electrode film formation.

JP 2005-126255 A

The present invention has been made in view of such a situation, and an object thereof is to suppress cracks generated during the debinding process when an electronic component such as a multilayer ceramic piezoelectric element is miniaturized, multilayered, and increased in capacity. A method for manufacturing electronic components is provided.

The inventors of the present invention have found that the above object can be achieved by setting a predetermined pattern of the internal electrode paste that forms an internal electrode layer after firing when manufacturing an electronic component such as a multilayer ceramic piezoelectric element. The present invention has been completed.

That is, a method for manufacturing an electronic component having an internal electrode layer, comprising a powder component containing a conductor powder and a co-material, a volatile organic component such as a solvent, and a nonvolatile organic component such as a binder and a plasticizer The distance on the printing surface from all locations of the internal electrode paste printing portion containing 2 to the non-printing portion with a width of 0.1 mm or less is 2 mm or less, and the non-printing portion is to the surface of the molded body before degreasing As a connected internal electrode print pattern, it is printed on a green sheet to be a dielectric layer, and further, a volatile solvent is volatilized and baked to form a pre-fired electrode film that forms the internal electrode layer The manufacturing method of the electronic component which has an internal electrode characterized by having the process to do.

Or a method for producing an electronic component having an internal electrode layer, comprising a powder component containing a conductor powder and a co-material, a volatile organic component such as a solvent, and a non-volatile organic component such as a binder and a plasticizer In the internal electrode paste printing part containing, there is a portion printed by 1/40 or more of the green sheet thickness thinner than the average printing thickness of the adjacent internal electrodes, the width is 0.1 mm or less, Printed on the green sheet as the dielectric layer as an internal electrode printing pattern where the part where the distance from all parts of the electrode printing part is within 2 mm is connected to the surface of the molded body before degreasing, and further volatile solvent The method of manufacturing an electronic component having an internal electrode, comprising: forming a pre-fired electrode film that volatilizes and bakes to form the internal electrode layer.

Here, the volatile component is defined as a component that volatilizes at a temperature of 45 ° C. for 15 minutes. This is because it is a component scattered by heating corresponding to preheating before degreasing after printing. To increase the delamination prevention effect due to degreasing of the internal electrode layer after firing, when the internal electrode print pattern is set to a distance of 2 mm or less from the paste print part for internal electrodes to the non-printed part, and through a predetermined process Can do.

Usually, the powder used for the internal electrode paste includes a powder having the same or similar component as the inorganic oxide contained in the green sheet as a co-material. At this time, the internal electrode paste comprises a conductor powder having an average particle diameter in the range of 0.05 to 0.6 μm and an inorganic oxide powder having an average particle diameter in the range of 0.002 to 0.6 μm. It contains as a co-material, and makes content of the said inorganic oxide powder into the range of 5-40 weight part with respect to 100 weight part of said conductor powders. Such an inorganic oxide powder is added to reduce the difference in firing shrinkage between the internal electrode layer and the ceramic layer, and to increase the adhesion strength between the internal electrode layer and the ceramic layer.

In the internal electrode manufacturing method of the present invention, the electronic component has the internal electrode layers and the dielectric layers alternately stacked. In order to alternately laminate the internal electrode layers and the dielectric layers, a pre-fired electrode film that becomes an internal electrode layer after firing and a green sheet that becomes a dielectric layer after firing are formed as follows.

That is, a slurry containing a dielectric is formed by a method such as pulling slip molding, doctor blade molding, extrusion molding, etc., and on the green sheet, the internal electrode paste is applied, and then dried to An electrode film before firing is formed. A plurality of green sheets on which the pre-fired electrode film is formed are laminated and pressure-bonded to obtain a laminate before firing. The internal electrode paste may be applied by a printing method, for example.

Although it does not specifically limit as an electronic component, A multilayer ceramic piezoelectric element, a capacitor, a chip inductor, a chip varistor, a chip thermistor, a chip resistor, and other surface mount (SMD) chip type electronic components are illustrated.

By printing on the green sheet as the dielectric layer as an internal electrode printing pattern with a distance to the non-printing area of 2 mm or less, the path through which the gas generated from the internal electrode escapes during degreasing is shortened and generated from the internal electrode. The delamination caused by the generated gas can be made difficult to occur. When the distance to the non-printing portion is longer than 2 mm, the gas generated from the internal electrode spreads between the internal electrode and the sheet, and delamination tends to occur.

Also, the internal electrode having a distance of 2 mm or less from the internal electrode paste printing part to the non-printing part or from the internal electrode printing part having a width of 0.1 mm or less to a printed part of 1/30 or more thin green sheet Print pattern. This is because a printing portion within a width of 0.1 mm and thinner than 1/30 of the green sheet does not adhere to the stacked sheets, and a space is formed. For this reason, the path | pass which the gas generated from an internal electrode escapes at the time of degreasing | defatting can be made, and it becomes difficult to generate | occur | produce the delamination by the gas generated from an internal electrode. When the width is 0.1 mm or more, or when the printed thickness of the thinly printed part is less than 1/30 of the green printed sheet and thinner than the surrounding printed thickness, the thinly printed part tends to be buried due to the plasticity of the sheet. This is because it becomes difficult to form a space.

According to the present invention, when an electronic component such as a multilayer ceramic piezoelectric element is manufactured, a continuous void is formed in the electrode film before firing, which will form an internal electrode layer after firing. A gasified binder passage can be formed in the electrode film before firing. Therefore, even when the electronic component is made thin, even if the electrode area of the internal electrode layer after firing is widened, the electronic component has an electrode structure in which delamination is prevented due to generation of cracks during the debinding process Can be provided.

It is a schematic diagram which shows a deformation | transformation of the green sheet before and behind degreasing of the internal electrode used for this invention. It is a top view which illustrates the internal electrode printing pattern which concerns on this invention. It is a top view which illustrates another internal electrode printing pattern which concerns on this invention. It is a top view which illustrates the conventional printing pattern.

Hereinafter, the present invention will be described based on embodiments shown in the drawings. FIG. 1 is a cross-sectional view of a multilayer ceramic piezoelectric element according to an embodiment of the present invention, and is a schematic view showing deformation of a green sheet before and after degreasing of an internal electrode.

First, an overall configuration of a multilayer ceramic piezoelectric element will be described as an embodiment of an electronic component manufactured by the method according to the present invention. As shown in FIG. 1, the laminated body of the multilayer ceramic piezoelectric element green sheet according to the present embodiment has an end portion on one end face of the laminated body for connecting to the piezoelectric element portion 10 and an external electrode. Electrode layers 20 were alternately stacked.

In this embodiment, the internal electrode layer is manufactured by forming a pre-fired electrode film in a predetermined pattern on the green sheet, which will form the internal electrode layer after firing, as will be described in detail later. Is done.

The material of the dielectric layer 10 is not particularly limited, and for example, lead zirconate titanate is used.

The material of the external electrode is not particularly limited, but usually copper, copper alloy, silver, silver and palladium alloy, or the like is used. The thickness of the terminal electrode is not particularly limited, but is usually about 3 to 30 μm.

The shape and size of the multilayer ceramic piezoelectric element 2 may be appropriately determined according to the purpose and application. When the multilayer ceramic piezoelectric element 2 has a rectangular parallelepiped shape, it is usually about vertical (2 to 10 mm) × horizontal (2 to 10 mm) × thickness (3 to 20 mm).

Next, an example of the manufacturing method of the internal electrode of the multilayer ceramic piezoelectric element according to this embodiment will be described. First, a dielectric slurry is prepared in order to manufacture a ceramic green sheet that will constitute the dielectric layer 10 shown in FIG. 1 after firing. The dielectric slurry is usually composed of an organic solvent-based slurry obtained by kneading ceramic powder and an organic vehicle, or an aqueous slurry.

The ceramic powder can be appropriately selected from various compounds to be complex oxides and oxides, such as carbonates, nitrates, hydroxides, organometallic compounds, and the like, and can be used as a mixture. The ceramic powder is usually used as a powder having an average particle size of 1 μm or less, preferably 0.5 μm or less.

An organic vehicle is obtained by dissolving a binder in an organic solvent. The binder used in the organic vehicle is not particularly limited, and examples thereof include various usual binders such as ethyl cellulose, polyvinyl butyral, and acrylic resin.

Also, the organic solvent used in the organic vehicle is not particularly limited, and ordinary organic solvents such as alcohol, acetone, methyl ethyl ketone (MEK), toluene, xylene, ethyl acetate, butyl stearate, terpineol, butyl carbitol, isobornyl acetate, etc. Is exemplified.

Further, the vehicle in the aqueous slurry is obtained by dissolving a water-soluble binder in water. The water-soluble binder is not particularly limited, and polyvinyl alcohol, methyl cellulose, hydroxyethyl cellulose, water-soluble acrylic resin, vinyl acetate emulsion and the like are used. The content of each component in the dielectric paste is not particularly limited, and the normal content, for example, the binder may be about 1 to 10% by mass, and the solvent (or water) may be about 10 to 50% by mass.

The dielectric slurry may contain additives selected from various dispersants, plasticizers, glass frits, charging aids, antifoaming agents, and the like as necessary. However, the total content of these is preferably 10% by mass or less. Examples of the plasticizer include phthalate esters such as dioctyl phthalate and benzylbutyl phthalate, adipic acid, phosphate esters, glycols, and the like. For example, when a butyral resin is used as the binder resin, the amount of the plasticizer can be arbitrarily selected within a range not exceeding the amount of the butyral resin, but if the amount of the plasticizer is too small, the green sheet Tends to be brittle, and if it is too much, the plasticizer may ooze out, making handling difficult.

Then, using this dielectric slurry, a green sheet is formed on the carrier sheet with a thickness of about 80 μm by the doctor blade method as shown in FIG. By forming the green sheet with such a thickness, the thickness of the dielectric layer after firing can be about 60 μm.

The green sheet 10 is dried after being formed on the carrier sheet. The drying temperature of the green sheet is preferably 50 to 150 ° C., and the drying time is preferably 1 to 20 minutes. The thickness of the green sheet after drying shrinks to a thickness of 5 to 25% as compared to before drying.

As the carrier sheet, for example, a PET film or the like is used, and a film coated with silicon or the like is preferable in order to improve peelability. The thickness of these carrier sheets is not particularly limited, but is preferably 5 to 100 μm.

Next, a pre-firing electrode film 20 having a predetermined pattern is formed on the surface of the formed green sheet, and the thickness of the pre-firing electrode film is preferably 5 μm or less, more preferably about 3 to 4 μm. By forming the pre-firing electrode film 20 with such a thickness, the thickness of the internal electrode layer 20 after firing can be set to a desired thickness.

The pre-firing electrode film 20 is preferably formed on the surface of the green sheet 10 by a thick film forming method such as a printing method using an internal electrode paste. When the pre-firing electrode film 20 is formed on the surface of the green sheet 10 by a screen printing method, which is a kind of thick film method, it is performed as follows.

First, an internal electrode paste is prepared. The internal electrode paste is prepared by kneading a conductor powder, an inorganic oxide powder as a co-material, and an organic vehicle.

The conductor powder is not particularly limited, but is preferably composed of at least one selected from silver, palladium, copper, and a copper alloy.

Such a conductor powder is not particularly limited in its shape, such as a spherical shape or a flake shape, and may be a mixture of these shapes. As the conductor powder, one having an average particle diameter of 0.1 to 1 μm is used. When a conductor powder having a large average particle is used, it is difficult to reduce the thickness of the electrode film 20 before firing, and as a result, it is difficult to reduce the thickness of the internal electrode layer 20 after firing. On the other hand, when a conductor powder having a small average particle diameter is used, a paste having an appropriate viscosity cannot be obtained.

In the internal electrode paste, inorganic oxide powder is included as a co-material. As such an inorganic oxide powder, a ceramic powder having the same composition as the ceramic powder contained in the above-mentioned green sheet is preferable. The common material has an effect of suppressing sintering of the conductor powder in the firing process. As the inorganic oxide powder used as the co-material, those having an average particle diameter of 0.1 to 1 μm are used.

The content of the inorganic oxide powder as the co-material in the internal electrode paste is preferably 5 to 40 parts by weight, and more preferably 5 to 30 parts by weight with respect to 100 parts by weight of the conductor powder. If the content of the common material is too small, the sintering of the internal electrode starts from a low temperature, and the difference in the sintering temperature between the internal electrode layer and the dielectric layer 10 becomes large, so that a firing crack occurs. If the amount is too large, the conductivity of the internal electrode is lowered and the characteristics are lowered.

The organic vehicle contains a binder and a solvent. The binder is not particularly limited, and examples thereof include ethyl cellulose, acrylic resin, polyvinyl butyral, polyvinyl acetal, polyvinyl alcohol, polyolefin, polyurethane, polystyrene, and copolymers thereof. Among these, ethyl cellulose, Polyvinyl butyral and polyvinyl acetal are preferably used.

Examples of the solvent include, but are not limited to, terpineol, butyl carbitol, kerosene, acetone, isobornyl acetate, and the like. In this embodiment, terpineol, dihydroterpineol, terpineol acetate, or dihydroterpineol acetate is particularly used. The solvent is preferably contained in the internal electrode paste at 20 to 60% by weight, more preferably 25 to 55% by weight.

The internal electrode paste preferably contains a plasticizer or a pressure-sensitive adhesive for the purpose of improving the adhesion to the green sheet. Examples of the plasticizer include phthalic acid ester, adipic acid, phosphoric acid ester, glycols and the like. The plasticizer is contained in an amount of preferably 10 to 300 parts by weight, more preferably 50 to 250 parts by weight, based on 100 parts by weight of the binder in the organic vehicle. When the content of the plasticizer is too small, there is no effect of addition, and when it is too large, the strength of the pre-fired electrode film 20 is remarkably lowered, and excessive plasticizer tends to ooze out from the pre-fired electrode film.

Furthermore, the internal electrode paste preferably contains a dispersant for the purpose of improving the dispersibility of the conductor powder and the co-material and improving the stability (change with time) of the paint. Examples of the dispersant include, but are not limited to, polyethylene glycol dispersants, polycarboxylic acid dispersants, polyhydric alcohol partial ester dispersants, ester dispersants, ether dispersants, and the like. In addition, there are block polymer type dispersants and graft polymer type dispersants. The dispersant is preferably contained in an amount of 0.1 to 5 parts by weight with respect to 100 parts by weight in total of the conductor powder and the co-material powder. When the content of the dispersant is too small, the effect of addition becomes insufficient, and when the content is too large, there may be a disadvantage that the dispersibility is lowered due to micelle formation or reaggregation.

The internal electrode paste can be formed by mixing the above-mentioned components with a ball mill, a three-roll mill, or the like to form a slurry.

And this internal electrode was apply | coated to the green sheet used as a dielectric material layer by the printing method, and the electrode before baking was obtained by drying after that.

The pre-firing electrode film 20 of this embodiment has a planar pattern as shown in FIG.

Conventionally, the pre-fired electrode film 20 after coating and drying has a planar pattern as shown in FIG.

However, in the case of such a structure, it is difficult to secure a passage for the binder decomposition gas generated during the debinding process, and as a result, there is a problem that a crack (debike rack) occurs.

On the other hand, in this embodiment, when the pattern of the electrode film 20 before firing is the predetermined one, these problems can be effectively solved.

In the present embodiment, the pattern of the electrode film 20 before firing is printed on a green sheet serving as a dielectric layer as an internal electrode printing pattern in which the distance to the non-printing portion is 2 mm or less as shown in FIG. The path through which the gas generated from the internal electrode escapes during degreasing was shortened, and delamination due to the gas generated from the internal electrode could be made difficult to occur. When the distance to the non-printing portion is longer than 2 mm, the gas generated from the internal electrode spreads between the internal electrode and the sheet, and delamination tends to occur. The numbers in FIGS. 2 to 4 are dimensions (unit: mm).

Also, as shown in FIG. 3, the distance from the internal electrode paste printing part to the non-printing part or the internal electrode printing part having a width of 0.1 mm or less to a portion printed 1/30 or more thin of the sheet is 2 mm or less. The internal electrode printing pattern was as follows. This is because a printing portion having a width of 0.1 mm or less and a thickness of 2 μm or more does not adhere to the stacked sheets, and a space is formed. For this reason, a path through which the gas generated from the internal electrode escapes during degreasing, and delamination due to the gas generated from the internal electrode is less likely to occur.

Next, the pressed laminate was cut into a predetermined size to obtain a green chip, and then the green chip was subjected to a binder removal treatment.

In the present embodiment, the binder removal treatment is performed so as to be the pre-fired electrode in the green chip after the binder removal treatment. Next, the green chip subjected to the binder removal treatment was subjected to firing and heat treatment.

The present invention is not limited to the above-described embodiment, and can be variously modified within the scope of the present invention. For example, the method of the present invention is not limited to a method for manufacturing a multilayer ceramic piezoelectric element, but can also be applied as a method for manufacturing other electronic components.

Hereinafter, although this invention is demonstrated based on a more detailed Example, this invention is not limited to these Examples.

Experimental Example The following dielectric slurry and internal electrode paste were prepared.

First, the dielectric slurry was weighed with 20 parts by weight of water, 2 parts by weight of a dispersant and 0.2 parts by weight of an antifoaming agent with respect to 100 parts by weight of lead zirconate titanate powder, and mixed for 16 hours with a ball mill. Thereafter, an acrylic binder was added at a solid content ratio of 10 parts by weight and further mixed for 4 hours. The resulting slurry was aged with stirring in vacuum.

Next, the obtained dielectric slurry was sheet-formed by a doctor blade method to obtain a dielectric green sheet. The obtained sheet thickness was about 65 μm.

As the internal electrode paste material, a coprecipitated powder having a silver / palladium weight ratio of 7: 3 was used as the conductor powder. As the common material, lead zirconate titanate used in the dielectric slurry was used. The binder used was ethyl cellulose and the plasticizer was dioctyl phthalate. Moreover, butyl carbitol was used as a solvent.

The composition used for the trial production was 15 parts by weight of the lead lead zirconate titanate powder, 6.5 parts by weight of ethyl cellulose, 12.5 parts by weight of dioctyl phthalate, butyl carbyl with respect to 100 parts by weight of the silver palladium coprecipitated powder. The amount of Torr was 40 to 45 parts by weight.

Table 1 shows the type, composition, volume, and the like of the electrode powder of the electrode paste used in the experiment.

Next, the raw material prepared above is mixed with ethyl cellulose previously dissolved in butyl carbitol with the above composition on a watch glass, and further kneaded with three rolls to obtain a paste for internal electrodes. It was.

Next, an internal electrode paste was printed on the dielectric green sheet using a screen printing method. Thereafter, drying was performed to obtain an internal electrode before firing. The thickness of the obtained internal electrode before firing was about 4 μm. 4 shows the electrode pattern of the comparative example, FIG. 2 shows the electrode pattern of Example 1, and FIG. 3 shows the electrode pattern of Example 2. In Example 1, a non-printing portion having a width of 0.1 mm is provided radially from the center of the internal electrode pattern. In the second embodiment, printing is performed by providing a non-printing portion of 0.05 mm on a screen printing mask.

At this time, the internal electrode paste is 45 parts by weight of butyl carbitol. The viscosity was lower than that of 40 parts by weight of butyl carbitol, and sagging occurred at the printing edge, resulting in a state in which the non-printing part was connected. The thickness of the internal electrode before firing in the non-printed portion where the internal electrode paste was applied by sagging was about 2 μm, which was 2 μm thinner than the printed portion (about 1/30 compared to the sheet).

170 dielectric green sheets with internal electrodes before firing thus obtained were laminated, 25 green sheets without internal electrodes printed on top and bottom of each were added, and heat-pressed with a hot press to obtain a laminate. It was. The obtained laminate was cut into a predetermined size. The size of each sample thus obtained is 9 mm × 9 mm × 14 mm, the number of dielectric layers sandwiched between the internal electrode layers is 169, the thickness is 50 μm, and the thickness of the internal electrode layers Was 3 μm.

When the cross section of the produced crimped body was observed, the non-printed portion of Example 1 having a width of 0.1 mm and the non-printed portion to which the internal electrode paste was applied by the sagging of Example 2 did not adhere to the sheet, and the space was not It was confirmed that it was formed.

The binder was removed at a temperature rising rate: 5 ° C./hour, a holding temperature: 500 ° C., a holding time: 5 hours, and an atmospheric gas: air. Subsequently, the crack generation rate at the time of binder removal was evaluated about each obtained piezoelectric element sample.

As shown in FIG. 1 (A), cracks generated at the time of binder removal are characterized by entering along the laminated surface of the laminated body.

The ratio of occurrence of cracks during debinding was 3% in Example 1, 0% in Example 2, and 50% in Comparative Example 1.

At the binder degreasing stage in firing, gasified binder paths can be formed in the pre-fired electrode film. Therefore, even when the electronic component is made thin, even if the electrode area of the internal electrode layer after firing is widened, the electronic component has an electrode structure in which delamination is prevented due to generation of cracks during the debinding process Can be provided.

10: Piezoelectric element or its green sheet 20: Print layer of internal electrode layer

Claims (2)

A method for producing an electronic component having an internal electrode layer, comprising: a powder component containing a conductor powder and a co-material; a volatile organic component such as a solvent; and a nonvolatile organic component such as a binder and a plasticizer. The distance on the printed surface from all locations of the internal electrode paste printing part contained to the non-printing part with a width of 0.1 mm or less is 2 mm or less, and the non-printing part is connected to the molded body surface before degreasing. As a printed internal electrode pattern, printing is performed on a green sheet serving as a dielectric layer, and further, a volatile solvent is volatilized and baked to form a pre-fired electrode film that will form the internal electrode layer The manufacturing method of the electronic component which has an internal electrode characterized by having a process. A method for producing an electronic component having an internal electrode layer, comprising: a powder component containing a conductor powder and a co-material; a volatile organic component such as a solvent; and a nonvolatile organic component such as a binder and a plasticizer. The internal electrode paste printing part contains a portion that is printed 1/30 or more of the sheet thickness thinner than the average printing thickness of the adjacent internal electrodes, the width is 0.1 mm or less, and the internal electrode printing part The part where the distance from all locations is within 2mm is printed on the green sheet as the dielectric layer as an internal electrode print pattern connected to the surface of the molded body before degreasing, and the volatile solvent is volatilized. And a step of forming a pre-fired electrode film that is fired to form the internal electrode layer.