JP2011133465A - Radiation imaging apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a radiation imaging apparatus which obtains radiation image data with high precision, uses radiation detection panels and is highly convenient. <P>SOLUTION: In an electronic cassette 10, panel units 14B, 14C are interconnected by a hinge 64, and panel units 14A, 14B are interconnected by a hinge 66. In the panel units 14A to 14C, first surfaces 72 of radiation detection panels 20 in an open state are accommodated facing in the same direction, and in an electronic cassette, second surfaces of the radiation detection panels of the panel units 14A, 14C in a closed state face in the same direction. A filter 84 for energy conversion of the panel unit 14C is arranged between the panel units 14A and 14B. Thereby, in the electronic cassette, image capturing in the open state is possible, as well as radiation image data used for energy subtraction is obtained in the closed state. Further, enhancement of radiation efficiency is achieved, and the radiation detection panels is prevented from receiving influence of heat emitted from a control unit. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a radiation imaging apparatus, and more particularly to a radiation imaging apparatus provided with a radiation detection panel.

  In recent years, a radiation sensitive layer is arranged on a TFT (Thin Film Transistor) active matrix substrate, radiation such as irradiated X-rays is detected, and directly converted into radiation image data representing the distribution of radiation dose and output. FDP (Flat Panel Detector) has been put into practical use. A radiation imaging apparatus (hereinafter also referred to as an electronic cassette) that incorporates a panel-type radiation detector such as an FDP, a control unit including an image memory, and a power supply unit, and stores radiation image data output from the radiation detector in the image memory. Is also put into practical use.

  For example, with an electronic cassette, the subject can be photographed while being placed on a stretcher or bed, and the position of the electronic cassette relative to the subject can be changed, which makes it easy to adjust the imaging region. Even when a subject is photographed, it can be flexibly dealt with.

  In relation to such an electronic cassette, for example, in Patent Document 1, two flat sensors in which photoelectric conversion elements are arranged in a matrix shape can be opened and closed by connecting them on one side, thereby providing a flat sensor. It is proposed to ensure the area of the product and to ensure storage and portability. Japanese Patent Application Laid-Open No. 2004-228561 proposes to reduce the weight by allowing the cassette having the radiation detector and the control unit for controlling the radiation detector to be detachable.

  On the other hand, there is an energy subtraction method that emphasizes a specific structure of a subject by using a high-energy component radiation image and a low-energy component radiation image for the same subject. In this technology, in Patent Document 3 and Patent Document 4, a radiation image can be acquired between two detectors or by stimulating light emission using a filter (such as a radiation energy separation filter) containing a low-energy component absorbing material for radiation. The structure which arrange | positions a pertinent filter between the two storage fluorescent substance sheet | seats to perform 1 shot energy subtraction is proposed.

JP 2003-339687 A JP 2009-80103 A JP 2001-299733 A JP 2004-264547 A

  In a panel-shaped radiation detection panel using an FPD or the like, a photoelectric conversion layer or the like that performs radiation-charge conversion or radiation-light-charge conversion is provided on one surface of a TFT active matrix substrate (hereinafter also referred to as a TFT substrate). A radiation conversion layer is provided to collect charges generated in the radiation conversion layer. In such a radiation detection panel, radiation image data corresponding to radiation irradiated from the radiation conversion layer side is usually obtained, but irradiation is performed even when radiation is irradiated from the TFT substrate side. Radiation image data corresponding to the radiation is obtained.

  It is an object of the present invention to provide a highly convenient radiation imaging apparatus that uses such a radiation detection panel and can handle various types of radiation images.

  The present invention according to claim 1, which achieves the above object, comprises a first panel unit having a radiation detection panel and a control unit for controlling the plurality of radiation detection panels, and a radiation detection panel each controlled by the control unit. And a second panel unit and a third panel unit, each of which is connected to a different side of the first panel unit so as to be rotatable about the side.

  According to the present invention, the second panel unit is rotatably connected to one side of the first panel unit, and the first panel unit has a second side different from the side to which the second panel unit is connected. 3 panel units are connected. The first panel unit, the second panel unit, and the third panel unit contain radiation detection panels, and a control unit that controls each radiation detection panel is provided in the first panel unit.

  Thereby, it is possible to image a subject using radiation by using the three radiation detection panels housed in each of the first, second, and third panel units in any combination.

  The invention according to claim 2 is a first panel unit, a second panel unit, and a third panel unit in which one surface of the radiation detection panel is directed to one surface and the radiation detection panel is accommodated; A closed state in which one end of the first panel unit and one end of the second panel unit are opposed to one surface of the first panel unit and one surface of the second panel unit; and A first coupling member that pivotably couples so that one surface of the first panel unit and one surface of the second panel unit are in two open states directed in the same direction. And an end portion different from the one end portion of the first panel unit and an end portion of the third panel unit are connected to one surface of the first panel unit and one surface of the third panel unit. Closed opposite , And one surface of the first panel unit and one surface of the third panel unit are rotatably connected so as to be in two states of being opened in the same direction, and In the closed state of the first panel unit and the second panel unit and in the closed state of the first panel unit and the third panel unit, the second panel unit has the second panel unit on the other surface. A second connecting member that is connected so that one surface of each of the three panels faces, the first panel unit and the second panel unit in the closed state, and the first panel unit and When the third panel unit is in the closed state, the third panel unit is disposed between the second panel unit and the third panel unit to extract a predetermined energy component from incident radiation. Comprising a filter member for yield, the.

  According to this invention, the closed state in which the second and third panel units are sequentially stacked on the first panel unit, and the open state in which the first, second, and third panel units are arranged on the same plane. As can be taken, the first, second and third panel units are connected by the first and second connecting members.

  In the open state, the same surface (one surface) of the radiation detection panels in the first, second, and third panel units is directed in the same direction. In the closed state of the first, second and third panel units, the same surface (the other surface) of the radiation detection panel and the third radiation detection panel of the second panel unit is directed in the same direction. The filter member is disposed between the second and third panel units.

  Therefore, radiation image data having the same image characteristics can be obtained in the closed state of the first, second and third panel units. In the closed state of the first, second, and third panel units, the energy subtraction is performed using the same image characteristics of the radiation detection panel of the second panel unit and the radiation detection panel of the third panel unit. Radiographic image data can be obtained.

  In the present invention, the first panel unit and the second panel unit are opened in the open state, and the first panel unit and the third panel unit are opened in the same direction. The one surface may be on the same plane, and thus, radiation image data obtained by dividing the same imaging target can be obtained using three radiation detection panels.

  The invention according to claim 3 is the radiation detection apparatus according to claim 2, further comprising a control unit including a control unit and a power supply unit, wherein the radiation detection unit is accommodated in the first panel unit within the first panel unit. The control unit is accommodated at a position on the other surface side of the panel.

  According to this invention, since the control unit is provided in the first panel unit away from the radiation detection panels of the second and third panel units even in the closed state, the energy subtraction method is used. When performing image diagnosis, radiation image data that enables highly accurate diagnosis is obtained.

  In such a configuration of claim 3, as described in claim 4, back scattering during imaging is prevented between the radiation detection panel in the first panel unit and the control unit. A flat radiation absorbing member can be included.

  According to a fifth aspect of the present invention, in the second aspect, the control unit includes a control unit and a power supply unit, and the control unit is accommodated in the first and second connecting members.

  According to this invention, the control unit and the power supply unit of the control unit are accommodated in the first and second connecting members. Thereby, since a control part and a power supply part leave | separate from a radiation detection panel, it can prevent that a radiation detection panel will receive to the influence of a heat | fever.

  A sixth aspect of the present invention is the main body according to the fifth aspect, wherein the first connecting member is formed in a box shape and houses one of the control unit or the power source unit of the control unit, And a second connecting member formed in a box shape to connect the other of the control unit or the power source unit to the control unit. And a main body to be accommodated.

  According to this invention, since the periphery of the main body of the first and second connecting members is opened both in the closed state and in the open state, it is possible to improve the heat dissipation effect for the control unit and the power supply unit.

  In the invention of claim 6, as described in claim 7, the first, second, and third panel units are in the open state, the main body of the first connecting member, and the first The structure supported by the said main body of 2 connection members can be taken.

  The invention according to claim 8 is the invention according to any one of claims 2 to 7, wherein a flat grid for removing scattered rays due to an imaging target at the time of imaging is provided on the other surface of the third panel unit. Is provided.

  According to the present invention, when obtaining radiographic image data used in the energy subtraction method, it is possible to prevent the influence of the scattered light of the radiation by the imaging target, so that radiographic image data that enables highly accurate diagnosis can be obtained.

  A ninth aspect of the present invention provides the method according to the first to eighth aspects, wherein the radiation detection panel converts the radiation into light by a scintillator that converts the radiation into light, and outputs an electrical signal indicating a radiation image represented by the light. The scintillator may include a columnar crystal of a phosphor material.

  According to a tenth aspect of the present invention, in the ninth aspect, the phosphor material is preferably CsI.

  An eleventh aspect of the present invention is the sensor unit according to the ninth or tenth aspect, wherein the radiation detection panel receives a light converted by the scintillator on an insulating substrate and generates a charge. A thin film transistor for reading out the electric charge generated in the sensor unit is formed, the sensor unit includes an organic photoelectric conversion material, and an active layer of the thin film transistor includes an amorphous oxide, an organic semiconductor material, or a carbon nanotube. The substrate may be made of plastic.

  As described above, according to the first aspect of the present invention, radiation image data can be obtained by arbitrarily combining three radiation detection panels.

  Further, according to the invention of claim 2, radiation image data using a surface having the same image characteristics can be obtained between the radiation detection panels in either the closed state or the open state.

  According to the invention of claim 3, it is possible to prevent the radiation detection panel from being affected by heat when obtaining radiation image data for at least energy subtraction.

  According to invention of Claim 4, it can prevent that the radiation detection panel of the 1st panel unit in which the control unit is provided will receive to the influence of backscattered light.

  According to the invention of claim 5, any radiation detection panel of the first to third panel units is prevented from being affected by the heat of the control unit. According to the invention of claim 6, the heat dissipation effect of the control unit can be improved.

  Furthermore, according to the eighth aspect of the present invention, when obtaining radiographic image data used for diagnosis or the like by the energy subtraction method, there is no influence of scattered light caused by the imaging target.

It is a perspective view showing a schematic structure of an electronic cassette concerning a 1st embodiment. (A) is a perspective view which shows the closed state of the electronic cassette of FIG. 1, (B) is a perspective view which shows the open state of the electronic cassette of FIG. (A) is a schematic block diagram which shows the closed state of an electronic cassette, (B) is a schematic diagram which shows the open state of an electronic cassette, (C) is a schematic block diagram of the principal part of the electronic cassette which shows an example of a hinge. It is the schematic which showed the layer structure of the radiation detection panel typically. It is sectional drawing which showed roughly the structure of the switch element of a radiation detector. It is the schematic which showed typically the structure when the radiation detection panel was planarly viewed. It is a schematic block diagram of a control unit. It is a cross-sectional side view for demonstrating the surface reading system and back surface reading system of the radiation to a radiation detector. It is a schematic block diagram which shows the closed state of the electronic cassette concerning 2nd Embodiment. It is the schematic which shows the open state of the electronic cassette concerning 2nd Embodiment. It is a schematic block diagram which shows another example of the layer structure of a radiation detection panel. (A) is a schematic block diagram which shows the closed state of the electronic cassette of another form, (B) is the schematic which shows the open state of the electronic cassette of another form. (A) is a schematic block diagram which shows the closed state of the electronic cassette of another form, (B) is the schematic which shows the open state of the electronic cassette of another form. It is sectional drawing of an example of a structure at the time of arrange | positioning a radiation detection panel by a surface reading system. (A) is a schematic block diagram which shows the closed state of the electronic cassette of another form, (B) is the schematic which shows the open state of the electronic cassette of another form. It is the schematic which shows the open state of the electronic cassette of another form. It is a block diagram which shows the closed state of the electronic cassette of another form.

Hereinafter, an example of an embodiment of the present invention will be described in detail with reference to the drawings.
[First Embodiment]
1 to 3 show an electronic cassette 10 according to the present exemplary embodiment. The electronic cassette 10 includes a plurality of housings. In the present embodiment, as an example, three housings 12A, 12B, and 12C are provided. Each of the housings 12A to 12C is formed in a rectangular shape (flat plate shape) having a low (thin) height direction (up and down direction in FIG. 1 to FIG. 3).

  Each of the casings 12A to 12C accommodates the radiation detection panel 20, thereby forming panel units 14A to 14C. The casings 12A to 12C (panel units 14A to 14C) accommodate the radiation detection panel 20 having the same configuration. However, in the following, the radiation detection panel 20A is accommodated in the casing 12A for distinction. The panel unit 14A is formed, the radiation detection panel 20B is accommodated in the housing 12B, the panel unit 14B is formed, and the radiation detection panel 20C is accommodated in the housing 12C, and the panel unit 14C is formed. Shall.

  In the electronic cassette 10, the panel unit 14C is overlaid on the panel unit 14B, and the panel unit 14A is overlaid on the panel unit 14C. As shown in FIGS. 3A and 3B, the panel unit 14B and the panel unit 14C are connected to each other by a hinge 64 that is an example of a connecting member. Thereby, the panel unit 14C can rotate between the overlapping position (closed state) and the deployed position (open state) with respect to the panel unit 14B with the pin 64A of the hinge 64 as an axis (the angle θ is 0 °). ˜180 ° range).

  Here, the hinge 64 uses a relatively thin pin 64A, and a plurality of hinges 64 (one is shown in FIGS. 3A and 3B) are provided between the panel unit 14B and the panel unit 14C. Provided. As a result, the connection strength between the panel unit 14B and the panel unit 14C is secured, and the gap between the panel unit 14B and the panel unit 14C is prevented from being widened when the panel unit 14B and the panel unit 14C are opened. ing.

  The panel unit 14A and the panel unit 14B are connected by a hinge 66, which is an example of a connecting member, on one side different from the side where the hinge 64 is provided in the panel unit 14B. In the hinge 66, for example, a pin 66A is provided on the 14A and 14B sides as an example of a connecting member, and a pin 66B is provided between the pins 66A. The hinge 66 is bent about the pin 66B, and the panel unit 14A has a closed state in which the panel unit 14B overlaps with the panel unit 14B and an open state in which the panel unit 14B is aligned on the same plane while changing the distance from the panel unit 14B. It is possible to rotate between them.

  As shown in detail in FIG. 3C (only the outline is shown in FIGS. 3A and 3B), the hinge 66 is, for example, the housing 12A of the panel unit 14A and the housing of the panel unit 14B. A pin 66A is provided at one end of a fixed plate 67A attached to each of the bodies 12B. One end of a rocking plate 67B having a predetermined length is pivotally supported on the pin 66A of each fixed plate 67A. A pin 66B is pivotally supported on the other end of each swing plate 67B. Thus, the two rocking plates 67B are coupled so as to be rotatable about the pin 66B.

  The hinge 66 can extend the distance between the panel unit 14A and the panel unit 14B by extending the two rocking plates 67B, and the length of the rocking plate 67B can be increased according to the space required at this time. It has been decided. In addition, the hinge 66 can reduce the interval between the panel unit 14A and the panel unit 14B by overlapping the two swing plates 67B.

  Such a hinge 66, for example, forms the stepped portion 13A in the housing 12A and the stepped portion 13B in the housing 12B, so that the panel unit 14A (the housing) is opened in the panel units 14A and 14B. 12A) can come into contact with the panel unit 14B (housing 12B). That is, the gap between the panel units 14 and 14B can be eliminated when the panel units 14A and 14B are opened. Here, the step portions (step portions 13A and 13B) may be provided on either one of the housings 12A and 12B. In the electronic cassette 10, a hinge 66 may be provided instead of the hinge 64 between the panel units 14B and 14C. In FIGS. 1, 2A, and 2B, the hinges 64 and 66 are not shown.

  As a result, in the electronic cassette 10, the panel units 14C and 14A are sequentially stacked on the panel unit 14B (see FIGS. 2A and 3A, hereinafter also referred to as the closed state of the electronic cassette 10), and the panel. The units 14A to 14C can take positions (hereinafter also referred to as an open state of the electronic cassette 10) where the upper surfaces (surfaces on the upper side in FIG. 1 to FIG. 3) are on the same plane.

  Such an electronic cassette 10 can be held in a closed state in which the panel units 14A to 14C are overlapped by a lock mechanism (not shown). In addition, the electronic cassette 10 can move (rotate) the panel units 14A and 14C to the unfolded state by releasing the lock mechanism. Furthermore, in this Embodiment, it is made to connect with the long side of 14A-14C which is an example of a connection member, However, It is not restricted to this, You may connect with a short side, Moreover, one side is connected with a short side. However, the structure which connects the other by a long side may be sufficient. In the following description, the panel units 14A and 14C are opened so that the surfaces facing the same direction as the panel unit 14B are on the same surface. However, the present invention is not limited to this. good.

  1 and 2A, the electronic cassette 10 can be provided with a handle 69. Note that the handle 69 is not shown in FIGS.

  The handle 69 includes a handle 69A provided on the casing 12A of the panel unit 14A, a handle 69B provided on the casing 12B of the panel unit 14B, and a handle 69A provided on the casing 12C of the panel unit 14C. Yes. The handles 69A to 69C are provided on the surfaces of the casings 12A to 12C facing in the same direction. Further, the handles 69A to 69C are positioned to overlap each other when the panel units 14A to 14C are overlapped. In addition, in the closed state of the panel units 14A to 14C (the panel units 14A, 14C, and 14B are stacked in this order), for example, the handles 69A and 69C are inclined toward the handle 69B on one end side. The handles 69A and 69B are tilted toward the handle 69C on the center side and integrated.

  In the electronic cassette 10, by providing such a handle 69, the panel units 14A to 14C can be easily opened and closed (the transition from the open state to the closed state and the movement from the closed state to the open state). ing. The electronic cassette 10 is transported or stored in the closed state of the panel units 14A to 14C. However, since the handle 69 is provided, handling at this time is easy. In the present embodiment, the handle 69 is provided on the back side of the sheet of FIG. 1 and FIG. 2B, but it may be on the near side of the sheet, which will be described later.

  The radiation detection panel 20 (20A-20C) incorporated in each of the panel units 14A-14C will be described. The radiation detection panel 20 detects the irradiated radiation and outputs an electrical signal (radiation detection signal) corresponding to the distribution of the radiation dose. As shown in FIG. 4, the radiation detection panel 20 includes a substrate (hereinafter referred to as a TFT substrate 26) in which a switching element 24 such as a thin film transistor (TFT) is formed on an insulating substrate 22. Yes. For example, a glass substrate, various ceramic substrates, and a resin substrate can be used as the insulating substrate 22, but the insulating substrate 22 is not limited to these materials.

On the TFT substrate 26, a scintillator layer 28 that converts incident radiation into light is formed as an example of a radiation conversion layer that converts incident radiation. As the scintillator layer 28, for example, CsI: Tl, GOS (Gd ₂ O ₂ S: Tb) can be used, but it is not limited to these materials.

  The wavelength range of light emitted by the scintillator layer 28 is preferably a visible light range (wavelength 360 nm to 830 nm), and in order to enable monochrome imaging by the radiation detection panel 20, a green wavelength range is included. It is more preferable.

  Specifically, the phosphor used in the scintillator layer 28 preferably contains cesium iodide (CsI) when imaging using X-rays as radiation, and the emission spectrum upon irradiation with X-rays is 420 nm to 600 nm. It is particularly preferred to use some CsI (Tl). Note that the emission peak wavelength of CsI (Tl) in the visible light region is 565 nm.

  The scintillator layer 28 may be formed by vapor deposition on a vapor deposition substrate, for example, when it is intended to be formed of columnar crystals such as CsI (Tl). Thus, when the scintillator layer 28 is formed by vapor deposition, an Al plate is often used as the vapor deposition substrate from the viewpoint of X-ray transmittance and cost, but is not limited thereto. When GOS is used as the scintillator layer 28, the scintillator layer 28 may be formed by applying GOS to the surface of the TFT substrate 26 without using a vapor deposition substrate.

  Between the TFT substrate 26 and the scintillator layer 28, a photoconductive layer 30 that generates charges when light converted by the scintillator layer 28 is incident is disposed. A bias electrode 32 for applying a bias voltage to the photoconductive layer 30 is formed on the surface of the photoconductive layer 30 on the scintillator layer 28 side.

  A flattening layer 38 for flattening the TFT substrate 26 is formed on the TFT substrate 26. An adhesive layer 39 for bonding the scintillator layer 28 to the TFT substrate 26 is formed between the TFT substrate 26 and the scintillator layer 28 and on the planarizing layer 38.

  The photoconductive layer 30 absorbs light emitted from the scintillator layer 28 and generates a charge corresponding to the absorbed light. The photoconductive layer 30 may be formed of a material that generates charges when irradiated with light. For example, the photoconductive layer 30 may be formed of amorphous silicon, an organic photoelectric conversion material, or the like. The photoconductive layer 30 containing amorphous silicon has a wide absorption spectrum and can absorb light emitted by the scintillator layer 28. If the photoconductive layer 30 includes an organic photoelectric conversion material, it has a sharp absorption spectrum in the visible region, and electromagnetic waves other than light emitted by the scintillator layer 28 are hardly absorbed by the photoconductive layer 30, such as X-rays. Noise generated when radiation is absorbed by the photoconductive layer 30 can be effectively suppressed.

  The organic photoelectric conversion material constituting the photoconductive layer 30 is preferably such that its absorption peak wavelength is closer to the emission peak wavelength of the scintillator layer 28 in order to absorb light emitted by the scintillator layer 28 most efficiently. Ideally, the absorption peak wavelength of the organic photoelectric conversion material matches the emission peak wavelength of the scintillator layer 28, but if the difference between the two is small, the light emitted from the scintillator layer 28 can be sufficiently absorbed. It is. Specifically, the difference between the absorption peak wavelength of the organic photoelectric conversion material and the emission peak wavelength with respect to the radiation of the scintillator layer 28 is preferably within 10 nm, and more preferably within 5 nm.

  Examples of the organic photoelectric conversion material that can satisfy such conditions include quinacridone organic compounds and phthalocyanine organic compounds. For example, since the absorption peak wavelength of quinacridone in the visible region is 560 nm, if quinacridone is used as the organic photoelectric conversion material and CsI (Tl) is used as the material of the scintillator layer 28, the difference in the peak wavelength may be within 5 nm. The amount of charge generated in the photoconductive layer 30 can be substantially maximized.

  On the TFT substrate 26, a charge collecting electrode 34 for collecting charges generated in the photoconductive layer 30 is formed. The TFT substrate 26 reads the charges collected by the charge collection electrodes 34 by turning on the switching elements 24 provided corresponding to the charge collection electrodes 34, respectively.

  Next, the photoconductive layer 30 applicable to the radiation detection panel 20 according to the present embodiment will be specifically described.

  The electromagnetic wave absorption / photoelectric conversion site in the radiation detection panel 20 according to the present invention includes a pair of charge collection electrodes 34 and a bias electrode 32 and an organic photoconductive layer 30 sandwiched between the charge collection electrodes 34 and the bias electrode 32. It can be comprised by the organic layer to contain. More specifically, this organic layer is a part that absorbs electromagnetic waves, a photoelectric conversion part, an electron transport part, a hole transport part, an electron blocking part, a hole blocking part, a crystallization preventing part, an electrode, and an interlayer contact improvement. It can be formed by stacking or mixing parts.

  The organic layer preferably contains an organic p-type compound or an organic n-type compound.

  The organic p-type semiconductor (compound) is a donor organic semiconductor (compound) mainly represented by a hole-transporting organic compound and refers to an organic compound having a property of easily donating electrons. More specifically, an organic compound having a smaller ionization potential when two organic materials are used in contact with each other. Therefore, any organic compound can be used as the donor organic compound as long as it is an electron-donating organic compound.

  An organic n-type semiconductor (compound) is an acceptor organic semiconductor (compound) mainly represented by an electron-transporting organic compound and refers to an organic compound having a property of easily accepting electrons. More specifically, the organic compound having the higher electron affinity when two organic compounds are used in contact with each other. Therefore, as the acceptor organic compound, any organic compound can be used as long as it is an electron-accepting organic compound.

  Since the materials applicable as the organic p-type semiconductor and organic n-type semiconductor and the configuration of the photoconductive layer 30 are described in detail in Japanese Patent Application Laid-Open No. 2009-32854, description thereof is omitted. The photoconductive layer 30 may be formed by further containing fullerenes or carbon nanotubes.

  The sensor unit 35 constituting each pixel unit may include at least the charge collection electrode 34, the photoconductive layer 30, and the bias electrode 32. In order to suppress an increase in dark current, an electron blocking film and a hole blocking unit are included. It is preferable to provide at least one of the films, and it is more preferable to provide both.

  The electron blocking film can be provided between the charge collection electrode 34 and the photoconductive layer 30, and when a bias voltage is applied between the charge collection electrode 34 and the bias electrode 32, the charge collection electrode 34 to the photoconductive layer 30. It is possible to prevent the dark current from being increased due to the injection of electrons.

  An electron donating organic material can be used for the electron blocking film.

  The material actually used for the electron blocking film may be selected according to the material of the adjacent electrode, the material of the adjacent photoconductive layer 30 and the like, and the electron function is 1.3 eV or more from the work function (Wf) of the adjacent electrode material. Those having a large affinity (Ea) and an Ip equivalent to or smaller than the ionization potential (Ip) of the material of the adjacent photoconductive layer 30 are preferable. Since the material applicable as the electron donating organic material is described in detail in Japanese Patent Application Laid-Open No. 2009-32854, description thereof is omitted.

  The thickness of the electron blocking film is preferably 10 nm or more and 200 nm or less, more preferably 30 nm or more and 150 nm or less, and particularly preferably 50 nm, in order to surely exhibit the dark current suppressing effect and prevent a decrease in the photoelectric conversion efficiency of the sensor unit 35. It is 100 nm or less.

  The hole blocking film can be provided between the photoconductive layer 30 and the bias electrode 32. When a bias voltage is applied between the charge collecting electrode 34 and the bias electrode 32, the hole blocking film is applied from the bias electrode 32 to the photoconductive layer 30. It is possible to suppress the increase in dark current due to the injection of holes.

  An electron-accepting organic material can be used for the hole blocking film.

  The thickness of the hole blocking film is preferably 10 nm or more and 200 nm or less, more preferably 30 nm or more and 150 nm or less, and particularly preferably, in order to reliably exhibit the dark current suppressing effect and prevent a decrease in photoelectric conversion efficiency of the sensor unit 35. It is 50 nm or more and 100 nm or less.

  The material actually used for the hole blocking film may be selected according to the material of the adjacent electrode, the material of the adjacent photoconductive layer 30 and the like, and 1.3 eV or more from the work function (Wf) of the material of the adjacent electrode. A material having a large ionization potential (Ip) and an Ea equivalent to or larger than the electron affinity (Ea) of the material of the adjacent photoconductive layer 30 is preferable. Since the material applicable as the electron-accepting organic material is described in detail in Japanese Patent Application Laid-Open No. 2009-32854, description thereof is omitted.

  In the case where the bias voltage is set so that the holes move to the bias electrode 32 and the electrons move to the charge collecting electrode 34 among the charges generated in the photoconductive layer 30, the electron blocking film and the hole blocking are set. What is necessary is just to reverse the position of a film | membrane. Moreover, it is not necessary to provide both the electron blocking film and the hole blocking film. If either one is provided, a certain degree of dark current suppressing effect can be obtained.

  FIG. 5 schematically shows the configuration of the switching element 24.

  Corresponding to the charge collection electrode 34, a switching element 24 is formed that converts the electric charge transferred to the charge collection electrode 34 into an electric signal and outputs the electric signal. The region where the switching element 24 is formed has a portion that overlaps the charge collection electrode 34 in plan view. With such a configuration, the switching element 24 and the sensor unit 35 in each pixel portion have a thickness. There will be overlap in the direction. In order to minimize the plane area of the radiation detection panel 20 (pixel unit), it is desirable that the region where the switching element 24 is formed is completely covered by the charge collection electrode 34.

  In the switching element 24, a gate electrode 220, a gate insulating film 222, and an active layer (channel layer) 224 are stacked, and a source electrode 226 and a drain electrode 228 are formed on the active layer 224 at a predetermined interval. Yes.

  The drain electrode 228 is electrically connected to the corresponding charge collection electrode 34 through a wiring made of a conductive material formed through an insulating film 219 provided between the insulating substrate 22 and the charge collection electrode 34. Has been. Thereby, the charges collected by the charge collection electrode 34 can be moved to the switching element 24.

  The active layer 224 can be formed of, for example, amorphous silicon, amorphous oxide, organic semiconductor material, carbon nanotube, or the like. Note that the material forming the active layer 224 is not limited thereto.

The amorphous oxide that can form the active layer 224 is preferably an oxide containing at least one of In, Ga, and Zn (for example, In—O-based), and at least two of In, Ga, and Zn. Oxides containing one (for example, In—Zn—O, In—Ga—O, and Ga—Zn—O) are more preferable, and oxides including In, Ga, and Zn are particularly preferable. As the In—Ga—Zn—O-based amorphous oxide, an amorphous oxide whose composition in a crystalline state is represented by InGaO ₃ (ZnO) _m (m is a natural number less than 6) is preferable, and InGaZnO is particularly preferable. ₄ is more preferable. Note that the amorphous oxide that can form the active layer 224 is not limited thereto.

  Examples of the organic semiconductor material that can form the active layer 224 include, but are not limited to, phthalocyanine compounds, pentacene, vanadyl phthalocyanine, and the like. In addition, about the structure of a phthalocyanine compound, since it is demonstrated in detail in Unexamined-Japanese-Patent No. 2009-212389, description is abbreviate | omitted.

  If the active layer 224 of the switching element 24 is formed of an amorphous oxide, an organic semiconductor material, or a carbon nanotube, the radiation such as X-rays is not absorbed, or even if it is absorbed, a very small amount remains. Generation of noise in the element 24 can be effectively suppressed.

  Further, when the active layer 224 is formed of carbon nanotubes, the switching speed of the switching element 24 can be increased, and the switching element 24 having a low degree of light absorption in the visible light region can be formed. When the active layer 224 is formed of carbon nanotubes, the performance of the switching element 24 is remarkably deteriorated only by mixing a very small amount of metallic impurities into the active layer 224. Therefore, the carbon nanotubes of extremely high purity can be obtained by centrifugation or the like. Need to be separated and extracted.

  Here, any of the above-described amorphous oxide, organic semiconductor material, carbon nanotube, and organic photoelectric conversion material can be formed at a low temperature. Therefore, the insulating substrate 22 is not limited to a highly heat-resistant substrate such as a semiconductor substrate, a quartz substrate, and a glass substrate, and a flexible substrate such as plastic, aramid, or bionanofiber can also be used. Specifically, flexible materials such as polyesters such as polyethylene terephthalate, polybutylene phthalate, and polyethylene naphthalate, polystyrene, polycarbonate, polyethersulfone, polyarylate, polyimide, polycycloolefin, norbornene resin, and poly (chlorotrifluoroethylene). A conductive substrate can be used. If such a plastic flexible substrate is used, it is possible to reduce the weight, which is advantageous for carrying around, for example. In particular, the electronic cassette 10 according to the present exemplary embodiment incorporates three radiation detection panels 20. For this reason, each photoconductive layer 30 of the radiation detection panel 20 includes an organic photoelectric conversion material, and each active layer 224 of each switching element 24 includes an amorphous oxide, an organic semiconductor material, or a carbon nanotube. Thus, by using plastic for the insulating substrate 22, the electronic cassette 10 can be significantly reduced in weight.

  In addition, the substrate 22 is provided with an insulating layer for ensuring insulation, a gas barrier layer for preventing permeation of moisture and oxygen, an undercoat layer for improving flatness or adhesion to electrodes, and the like. May be.

  Since aramid can be applied at a high temperature process of 200 ° C. or more, the transparent electrode material can be cured at a high temperature to reduce the resistance, and can also be used for automatic mounting of a driver IC including a solder reflow process. Moreover, since aramid has a thermal expansion coefficient close to that of ITO (indium tin oxide) or a glass substrate, warping after production is small and it is difficult to crack. In addition, aramid can form a substrate thinner than a glass substrate or the like. The insulating substrate 22 may be formed by laminating an ultrathin glass substrate and aramid.

  Bionanofiber is a composite of cellulose microfibril bundles (bacterial cellulose) produced by bacteria (Acetobacter Xylinum) and a transparent resin. The cellulose microfibril bundle has a width of 50 nm and a size of 1/10 of the visible light wavelength, and has high strength, high elasticity, and low thermal expansion. By impregnating and curing a transparent resin such as an acrylic resin or an epoxy resin in bacterial cellulose, a bio-nanofiber having a light transmittance of about 90% at a wavelength of 500 nm can be obtained while containing 60-70% of the fiber. Bionanofiber has a low coefficient of thermal expansion (3-7ppm) comparable to silicon crystals, and is as strong as steel (460MPa), highly elastic (30GPa), and flexible, compared to glass substrates, etc. A thin insulating substrate 22 can be formed.

  In the present embodiment, the switching element 24, the sensor unit 35, and the transparent planarization layer 38 are sequentially formed on the insulating substrate 22, and an adhesive resin having a low light absorption property or the like is used on the insulating substrate 22. The radiation detection panel 20 is formed by attaching the scintillator layer 28 with the adhesive layer 39. Hereinafter, the insulating substrate 22 formed up to the transparent insulating film 206 is referred to as a TFT substrate 26.

  As shown in FIG. 6, the sensor unit 35 and the switching element 24 are two-dimensionally arranged on the TFT substrate 26. On the TFT substrate 26, a plurality of gate wirings 40 for turning on / off each switching element 24 extending in a certain direction (row direction) and a direction intersecting with the gate wirings 40 (column direction) are extended. In addition, a plurality of data wirings 42 for reading out charges through the switching element 24 in the on state are provided. The TFT substrate 26 has, for example, a rectangular shape having four sides at the outer edge in plan view, and individual gate wirings 40 and individual data wirings 42 are connected to one side of the peripheral portion of the TFT substrate 26 in plan view. The connection terminals 43 are arranged.

  As shown in FIG. 3, in the electronic cassette 10, a control unit 18 that performs control such as radiographic imaging using each of the radiation detection panels 20 </ b> A to 20 </ b> C is provided in the panel unit 14 </ b> B. As shown in FIG. 7, each connection terminal 43 of the radiation detection panels 20 </ b> A to 20 </ b> C is connected to a control unit 50 provided in the control unit 18 via a connection wiring 44. In FIG. 7, the radiation detection panels 20 </ b> A to 20 </ b> C are schematically arranged in a shifted manner, the connection terminals 43 are provided on one side, and the connection wiring 44 is drawn out. The panel units 14 </ b> A and 14 </ b> C and the panel unit 14 </ b> B may take any known connection form, such as a connection using a flexible cable as the connection wiring 44.

  The control unit 50 drives the radiation detection panels 20A to 20C and converts radiation detection signals output from the radiation detection panels 20A to 20C into radiation image data. Further, the control unit 18 is provided with a power supply unit 70 that supplies power to the control unit 50 and the like.

  The control unit 50 includes a gate wiring driver 52, a signal processing unit 54, an image memory 56, a cassette control unit 58, and a wireless communication unit 60. Each of the switching elements 24 (not shown in FIG. 7; see FIGS. 4 and 6) of the radiation detection panels 20A to 20C is sequentially supplied in units of rows by a signal supplied from the gate wiring driver 52 through the gate wiring 40. The electric charges read by the switching element 24 that is turned on and turned on are transmitted from the data wiring 42 through the connection wiring 44 as an electrical signal and input to the signal processing unit 54. Thereby, the electric charges are sequentially read out in units of rows, and a radiation detection signal representing a two-dimensional radiation image is acquired.

  Although not shown, the signal processing unit 54 is provided with an amplification circuit and a sample hold circuit for amplifying an input electric signal for each data wiring 42. The electric signals transmitted through the individual data wirings 42 and input are amplified by the amplifier circuit and then held by the sample and hold circuit. Further, a multiplexer and an A / D (analog / digital) converter (both not shown) are sequentially connected to the output side of the sample hold circuit, and the electric signals held in the individual sample hold circuits are the multiplexers. Are sequentially input (serially) and converted into digital image data (radiation image data) by an A / D converter.

  The signal processing unit 54 is connected to the image memory 56, and image data output from the A / D converter of the signal processing unit 54 is captured as radiation image data captured using the radiation detection panels 20A to 20C. The images are sequentially stored in the image memory 56. The image memory 56 has a storage capacity capable of storing a plurality of pieces of radiation image data (for a plurality of images), and each time a radiation image is captured, the radiation image data obtained by the imaging is The images are sequentially stored in the image memory 56. The gate wiring driver 52 and the signal processing unit 54 can operate the radiation detection panels 20A to 20C separately. Thereby, in the electronic cassette 10, the radiation image data obtained simultaneously using the three radiation detection panels 20A to 20C can be processed as one continuous radiation image data, and a set of radiation having different characteristics. It can also be processed as image data.

  A gate wiring driver 52, a signal processing unit 54, and an image memory 56 are connected to the cassette control unit 58. The cassette control unit 58 includes a microcomputer, and includes a CPU 58A, a memory 58B including a ROM and a RAM, a non-volatile storage unit 58C including a flash memory and the like, and controls the entire operation of the electronic cassette 10.

  In addition, a wireless communication unit 60 is connected to the cassette control unit 58. The wireless communication unit 60 corresponds to a wireless local area network (LAN) standard represented by IEEE (Institute of Electrical and Electronics Engineers) 802.11a / b / g / n, for example, and is an external device by wireless communication. Controls the transmission of various information to and from.

  The wireless communication unit 60 transmits various kinds of information bidirectionally by infrared communication, for example. In this case, as shown in FIGS. 1, 2A, and 2B (not shown in FIGS. 3A and 3B), in the electronic cassette 10, for example, the housing 12A A light transmitting / receiving unit 62 is provided on the side surface. Thereby, in any of the closed state of the panel units 14A to 14C and the open state of the panel units 14A to 14C, the transmission / reception unit 62 becomes a shadow of the subject and the transmission of information is hindered. Can be prevented.

  The cassette control unit 58 is an external device that controls or manages radiation imaging via the wireless communication unit 60 (for example, a console that controls the operation of a device such as a radiation generator or a server connected to a hospital network) ) And wireless communication. Here, as an example, it is assumed that various types of information are transmitted to and received from the console. In the present embodiment, the wireless communication unit 60 will be described as an example. However, instead of this, a wired communication unit that performs communication by wired connection may be applied. Standards may be applied.

  The cassette control unit 58 stores various types of information such as imaging condition information received from the console via the wireless communication unit 60 and patient information regarding the patient who is the subject, and each radiation detection panel is based on the imaging condition information. 20 operation control and charge readout control from each radiation detection panel 20 are performed.

  In such a cassette 10, for example, a display unit using a liquid crystal panel (LCD) may be provided. When the display unit is provided, the cassette control unit 58 may control the display of the display unit. At this time, the cassette control unit 58 displays information set to be useful at the time of imaging from, for example, imaging condition information and patient information input from the console via the wireless communication unit 60. As such information, for example, information such as a name and ID for identifying a subject (patient) can be applied, so that an operator such as a radiographer can It is possible to confirm whether or not the person is the person, and it is possible to prevent the subject who performs the photographing from being mixed up.

  Further, the information displayed on the display unit may include an imaging region and imaging conditions, thereby preventing the imaging region from being shifted or being imaged under an erroneous imaging condition. For example, as a method for specifying the imaging region, the corresponding region may be displayed by characters or the like, or a sample image of the imaging region may be displayed. Furthermore, imaging guidance such as imaging procedures for the subject may be displayed on the display unit. Thereby, since the radiographer can perform radiographing while confirming the operation of the subject at a location away from the subject, the amount of radiation received by the radiographer can be suppressed.

  The power supply unit 70 supplies power to the various circuits and elements described above (a microcomputer functioning as the gate line driver 52, the signal processing unit 54, the image memory 56, the wireless communication unit 60, and the cassette control unit 58). In FIG. 7, illustration of wiring connecting the power supply unit 70 to various circuits and elements is omitted. Further, the power supply unit 70 may include a battery (secondary battery), and this battery may be used as a power source.

  Incidentally, as shown in FIG. 4, in the radiation detection panel 20, the TFT substrate 26, the planarization layer 38, and the adhesive layer 39 are formed of a material that transmits radiation. The radiation used for imaging using the radiation detection panel 20 includes radiation having a high energy component (for example, energy is 50 keV or more) and radiation having a low energy component (for example, energy is 40 keV or less). In 20, the radiation of both high energy components and low energy components is transmitted, but the transmittance of radiation of low energy components is lower than the transmittance of radiation of high energy components.

  In the following, the surface on the scintillator layer 28 side (normal radiation irradiation surface, surface) of the radiation detection panel 20 is referred to as a first surface 72, and the surface on the side opposite to the scintillator layer 28 (TFT substrate 26 side) (normal radiation). The second surface 74 will be described as a surface opposite to the irradiation surface, the back surface).

  In the radiation detection panel 20, when radiation is irradiated from the scintillator layer 28 side (first surface 72 side), radiation is converted into light at a portion away from the photoconductive layer 30 along the thickness direction of the scintillator layer 28. Is done. In the radiation detection panel 20, when radiation is irradiated from the TFT substrate 26 side (second surface 74 side), conversion from radiation to light is performed in a portion near the photoconductive layer 30 in the thickness direction of the scintillator layer 28. Done.

  Therefore, in the radiation detection panel 20, between the radiation image data obtained when radiation is irradiated from the first surface 72 side and the radiation image data obtained when radiation is irradiated from the second surface 74 side. There is a difference between the obtained images.

  Specifically, as shown in FIG. 8, the radiation detection panel 20 is provided on the back side of the incident surface of the radiation irradiated with radiation from the side on which the scintillator layer 28 is formed (the first surface 72 side). When the so-called back side scanning method (so-called PSS (Penetration Side Sampling) method) is used to read a radiation image by the TFT substrate 26, the scintillator layer 28 emits light more strongly on the upper side of the figure (opposite side of the TFT substrate 26). A so-called surface reading method (so-called ISS (Irradiation Side), in which a radiation image is read by the TFT substrate 26 provided on the surface side of the radiation incident surface when radiation is irradiated from the TFT substrate 26 side (second surface 74 side). Sampling) method), the radiation transmitted through the TFT substrate 26 is incident on the scintillator layer 28, and the TFT substrate 26 side of the scintillator layer 28 is stronger. To light. Electric charges are generated in each sensor portion 35 provided on the TFT substrate 26 by the light generated in the scintillator layer 28. For this reason, the radiation detection panel 20 is closer to the light emission position of the scintillator layer 28 with respect to the TFT substrate 26 when the front side reading method is used than when the rear side reading method is used. Is expensive.

  In the radiation detection panel 20, when the photoconductive layer 30 is made of an organic photoelectric conversion material, the photoconductive layer 30 hardly absorbs radiation. For this reason, the radiation detection panel 20 according to the present embodiment suppresses a decrease in sensitivity to the radiation X because the amount of radiation absorbed by the photoconductive layer 30 is small even when the radiation is transmitted through the TFT substrate 26 by the surface reading method. be able to. In the surface reading method, radiation passes through the TFT substrate 26 and reaches the scintillator layer 28. Thus, when the photoconductive layer 30 of the TFT substrate 26 is formed of an organic photoelectric conversion material, Since there is almost no absorption of radiation and attenuation of radiation can be suppressed to a low level, it is suitable for the surface reading method.

  Further, the amorphous oxide constituting the active layer 224 of the switching element 24 and the organic photoelectric conversion material constituting the photoconductive layer 30 can be formed at a low temperature. For this reason, the insulating substrate 22 can be formed of plastic resin, aramid, or bionanofiber that absorbs little radiation. Since the insulating substrate 22 formed in this way has a small amount of radiation absorption, a decrease in sensitivity to the radiation X can be suppressed even when the radiation is transmitted through the TFT substrate 26 by the surface reading method.

  Here, as shown in FIGS. 3A and 3B, the panel unit 14B is provided with a control unit 18 on the lower side (lower side in the drawing), and radiation detection is performed above the control unit 18. Panel 20B is arranged. In the panel unit 14B, a radiation absorbing plate 76 is disposed between the control unit 18 and the radiation detection panel 20B. The radiation absorbing plate 76 is formed of, for example, lead (lead plate) or the like, and absorbs radiation that has passed through the radiation detection panel 20B.

  In the electronic cassette 10, the radiation detection panel 20B provided in the panel unit 14B is arranged with the first surface 72 side facing upward and the second surface 74 side facing the control unit 18 side. Further, in the electronic cassette 10, the panel units 14A to 14C are opened, and the radiation detection panel 20A of the panel unit 14A and the radiation detection panel 20C of the panel unit 14C are respectively the first surface 72 of the radiation detection panel 20B. It is arranged to be in the same direction as the surface.

  In the electronic cassette 10, radiation image data is obtained in the open state and the closed state of the panel units 14A to 14C. In the electronic cassette 10, when the panel units 14A to 14C are opened, the upper surfaces of the panel units 14A to 14C are imaging surfaces 78A, 78B, and 78C, and radiation is applied to the imaging surfaces 78A to 78C. Radiation is irradiated to the first surfaces 72 of the detection panels 20A to 20C. Further, in the electronic cassette 10, when the panel units 14A to 14C are closed, the upper surface (the surface opposite to the imaging surface 78A) of the panel unit 14A is used as the imaging surface 78D, and radiation is applied to the imaging surface 78D. As a result, radiation is applied to the second surfaces 74 of the radiation detection panels 20A and 20C. 2 and 3, the irradiation direction of the radiation is indicated by an arrow A.

  When the electronic cassette 10 is in the closed state, both the radiation detection panel 20A in the panel unit 14A and the radiation detection panel 20C in the panel unit 14C are of the surface reading system. For this reason, the electronic cassette 10 can obtain a high-quality image when the radiation image for energy subtraction is captured by the panel units 14A and 14C by one irradiation of radiation in the closed state.

  In addition, since the radiation detection panels 20A to 20C in the panel units 14A to 14C are both in the back surface reading mode when the electronic cassette 10 is in the open state, the image quality of the radiation image captured by the radiation detection panels 20 to 20C in the open state is high. There is no difference.

  On the other hand, as shown in FIGS. 1 to 3, the panel unit 14A is provided with a grid 80 on the imaging surface 78D. The grid 80 removes scattered radiation caused by the imaging target from the radiation (arrow A) irradiated to the imaging surface 78D of the panel unit 14A. Note that any configuration can be applied to the grid 80 as long as it is configured to remove scattered radiation from radiation.

  As shown in FIGS. 1 to 3, in the electronic cassette 10, since the control unit 18 is provided in the panel unit 14B, the height of the panel unit 14B is higher than the height of the panel units 14A and 14C. ing. As shown in FIG. 3B, in the electronic cassette 10, the panel unit 14A is provided with a grid 80, so that the height of the panel unit 14A (height along the radiation direction) is higher than that of the panel unit 14B. To match.

  For the panel unit 14C, for example, as shown in FIG. 2B, the leg unit 82 is provided such that one end is pivotally supported on the side surface. The imaging surface 78C may be supported so as to be flush with the imaging surfaces 78A and 78B. Such a leg portion 82 may be configured to be detachable from the casing 12C of the panel unit 14C. In addition, when the electronic cassette 10 is placed on a base (not shown) and images are taken, the height difference between the panel units 14A to 14C is eliminated by providing a step on the base. Also good.

  On the other hand, as shown in FIG. 3A, in the electronic cassette 10, when the panel units 14A and 14C are overlapped (closed state), energy that is an example of a filter member is interposed between the panel units 14A and 14C. A conversion filter 84 is disposed. The energy conversion filter 78 is made of, for example, heavy metal such as copper, tungsten, or molybdenum, and has a thin plate shape (for example, a thickness of about 0.8 mm to 2.0 mm. The thickness is not limited to this, but is 2.0 mm or more. May be formed). The configuration of the energy conversion filter 84 is not limited to this, and any configuration that absorbs radiation having a desired wavelength can be applied.

  For example, the energy conversion filter 84 is configured to absorb the energy of radiation in a predetermined wavelength range, and thereby, the radiation incident on the energy conversion filter 84 absorbs a predetermined energy component.

  As described above, the radiation applied to the radiation detection panel 20 includes a high energy component (high frequency component) having a relatively high frequency and a low energy component having a relatively low frequency, and high energy in the radiation. A high pressure image is obtained from the radiation image data of the component, and a low pressure image is obtained from the radiation image data of the low energy component. Further, the energy conversion filter 84 absorbs almost all of the low energy component, thereby obtaining an image (soft part image and bone part image) in which the soft tissue and the bone tissue are emphasized or separated (energy subtraction method). In the electronic cassette 10, the low energy component is absorbed by the energy conversion filter 84.

  As shown in FIGS. 1, 2B, and 3B, in the electronic cassette 10, the energy conversion filter 84 is disposed on the surface opposite to the imaging surface 78C of the panel unit 14C, that is, the panel unit 14A. , 14C are attached to the surface that faces the panel unit 14A (the surface on the upper side of the drawing), the surface that is on the lower side of the drawing in the open state of the panel unit 12C. The energy conversion filter 84 may be accommodated in the housing 12C of the panel unit 14C, or may be attached to the panel unit 12 as necessary.

  Thereby, in the electronic cassette 10, the filter 84 for energy conversion is arrange | positioned between the panel unit 14A and the panel unit 14C in the closed state of the panel units 14A-14C, and the radiation with which the imaging surface 78D of the panel unit 14A was irradiated Is irradiated to the radiation detection panels 20A and 20C. At this time, radiation including a high energy component and a low energy component is irradiated to the second surface 74 of the radiation detection panel 20A. However, the energy conversion filter 84 is applied to the second surface 74 of the radiation detection panel 20C. The low energy component is absorbed and the high energy component radiation is irradiated.

  Therefore, in the electronic cassette 10, when the panel units 14A to 14C are closed, the radiation image data of the low pressure image is obtained from the radiation detection panel 20A of the panel unit 14A, and the radiation image of the high pressure image is obtained from the radiation detection panel 20C of the panel unit 14C. Data is obtained.

  Next, the operation of the first embodiment will be described. The electronic cassette 10 has panel units 14A to 14C each provided with a radiation detection panel 20 (20A to 20C). The panel unit 14B and the panel unit 14C are connected by a hinge 64, and the panel unit 14A and the panel are connected to each other. The unit 14B is connected by a hinge 66. Thereby, in the electronic cassette 10, radiographic images can be captured in the closed state of the panel units 14A to 14C and the open state of the panel units 14A to 14C.

  In the electronic cassette 10, the panel units 14A to 14C are opened, and imaging with an area obtained by arranging the three radiation detection panels 20A to 20C becomes possible. Compared to the case where one radiation detection panel 20 is used, The imaging area is enlarged, and even a large subject can be obtained as a radiation image divided into a plurality of sheets by one irradiation of radiation. At this time, in the electronic cassette 10, the gap between the panel unit 14A and the panel unit 14B and the gap between the panel unit 14B and the panel unit 14C are reduced. Further, the electronic cassette 10 is provided with the handle 69, so that the opening / closing operation of the panel units 14A to 14C (opening / closing operation of the panel units 14A and 14C with respect to the panel unit 14B) is facilitated.

  In the electronic cassette 10, radiographic images are captured in parallel with the two radiation detection panels 20 </ b> A and 20 </ b> C by radiation applied to the imaging surface 78 </ b> D of the panel unit 14 </ b> A when the panel units 14 </ b> A to 14 </ b> C are closed. Can do.

  Here, in the electronic cassette 10, the energy conversion filter 84 is provided in the panel unit 14C, and the energy conversion filter 84 is disposed between the panel units 14A and 14C when the panel units 14A to 14C are closed. . Thereby, in the electronic cassette 10, the radiation including the low energy component is irradiated on the second surface 74 of the radiation detection panel 20A by irradiating the imaging surface 78D of the panel unit 14A with radiation. Radiation image data is obtained. Further, the panel unit 14C is irradiated with the radiation that has absorbed the low energy component by passing through the energy conversion filter 84, whereby the radiation detection panel 20C in the panel unit 14C has a high energy component. Radiation is irradiated. In the electronic cassette 10, the radiation detection panel 20 </ b> A is also irradiated with radiation having a low energy component, but by providing the energy conversion filter 84, the radiation that has been reliably absorbed and removed by the low energy component is removed. The radiation detection panel 20C is irradiated.

  As described above, in the electronic cassette 10, radiation image data based on radiation including a low energy component and radiation image data based on radiation having a high energy component, which are used in the energy subtraction method, can be obtained by a single radiation irradiation. . By using these radiation image data, a low-pressure image and a high-pressure image used in the energy subtraction method can be obtained.

  In this case, the radiation detection panel 20B is also irradiated with radiation, but if the radiation image data obtained from the radiation detection panel 20B is unnecessary, reading of the radiation image data from the radiation detection panel 20B may be stopped. . Further, in the radiation detection panel 20B, radiation is irradiated onto the first surface 72 having different image characteristics from the second surface 74. Therefore, the radiation detection panel 20B may be read as radiation image data having image characteristics different from those of the radiation detection panel 20C.

  In the electronic cassette 10, by setting the panel units 14A to 14C to the open state, radiation image data obtained by dividing the subject by the radiation detection panels 20A to 20C can be obtained by one irradiation of radiation. At this time, in the electronic cassette 10, the same first surface 72 is irradiated with radiation in each of the radiation detection panels 20A to 20C.

  On the other hand, the control unit 50 and the power supply unit 70 provided in the control unit 18 are configured to include a large number of electronic components, and generate heat when operated by the power of the power supply unit 70. In addition, the electrical characteristics of the radiation detection panel 20 change due to temperature changes. For example, when the radiation detection panel 20 is provided with an ASIC, the characteristics of the ASIC deteriorate due to the temperature rise, and the noise component increases (S / N ratio deteriorates). In the radiation detection panel 20, the dark current of the TFT (switching element 24) increases due to the temperature rise and affects the output radiation image data.

  Further, the radiation detection panel 20 is deformed or broken due to a difference in thermal expansion coefficient of each member forming the laminated structure due to a temperature rise, or peeling of a layer due to deterioration of an adhesive due to repeated temperature changes. Deterioration due to.

  Here, in the electronic cassette 10, not only the closed state in which the panel units 14 </ b> A to 14 </ b> C are overlapped but also the open state, the heat radiation area is widened, so the cooling efficiency / heat radiation efficiency is high, and the heat generated from the control unit 18 is increased. Can be released. Thereby, in the electronic cassette 10, even when acquiring continuous radiation image data using the radiation detection panel 20B of the panel unit 14A or the radiation detection panels 20A to 20C of the panel units 14A to 14C, the radiation detection panels 20A to 20C. Degradation of the quality of the radiation image data due to the temperature change of 20C, deterioration of the radiation detection panels 20A to 20C, and the like can be suppressed.

  Further, GOS hardly changes in sensitivity due to temperature change, but CsI changes in sensitivity due to temperature increase (for example, the sensitivity decreases by about 0.3% every time the temperature increases by 1 ° C.). Therefore, when the scintillator layer 28 is formed of CsI, if the temperature of the scintillator layer 28 changes greatly during moving image shooting (perspective shooting) in which continuous shooting is repeated, the sensitivity change of the scintillator layer 28 increases, and a series of moving image shooting is performed. In the image, the density difference between the image at the beginning of the frame and the last image becomes large, the visibility deteriorates, and the diagnostic accuracy also decreases. However, since the electronic cassette 10 according to the present embodiment performs moving image capturing with the radiation detection panels 20A and 20C of the panel units 14A and 14C, it is difficult for the heat of the control unit 18 to be transmitted to the radiation detection panel 20B. Sensitivity change due to temperature change can be suppressed.

  Further, in the electronic cassette 10, when the panel units 14A to 14C are closed and the radiation image data for energy subtraction is acquired, the radiation detection panel 20B close to the control unit 18 serving as a heat source is not used, and the electronic cassette 10 is separated from the heat source. Since the radiation detection panels 20A and 20C are used, radiation image data with reduced noise can be obtained.

In the electronic cassette 10, for example, fins for heat dissipation may be formed on the bottom surface of the casing 12 </ b> B where the control unit 18 is provided, and thereby a further heat dissipation effect can be obtained, and the radiation detection panel 20. In addition to preventing deterioration, radiation image data with less noise components can be obtained.
[Second Embodiment]
The second embodiment will be described below. Note that in the second embodiment, the same components as those in the first embodiment are denoted by the same reference numerals as those in the first embodiment, and description thereof is omitted.

  9 and 10 show a schematic configuration of the electronic cassette 110 according to the second exemplary embodiment. The electronic cassette 110 includes casings 112A, 112B, and 112C each formed in a rectangular thin box shape (flat plate shape), and the radiation detection panels 20A, 20B, and 20C are accommodated, whereby the panel units 114A and 114B are accommodated. , 114C are formed. The panel units 114 </ b> A to 114 </ b> C can be formed thin because they are configured to accommodate only the radiation detection panel 20.

  The electronic cassette 110 is provided with hinge portions 116 and 118 serving as connecting members. The hinge part 116 connects the panel unit 114B and the panel unit 114C. The hinge portion 118 connects the panel unit 114A and the panel unit 114B.

  The hinge part 116 includes a main body 120 formed in a box shape and a support wall 122 (only one of them is shown in FIGS. 9 and 10) protruding from the main body 120 as a pair, and a panel unit corresponding to the hinge part 116. A support shaft 124 is provided at the end of each of 14B and 14C. The panel units 114 </ b> B and 114 </ b> C are rotatably connected by the end portion where the support shaft 124 is provided being fitted between the support walls 122 of the hinge portion 116 and the support shaft 124 being pivotally supported by the support wall 122. Has been.

  In addition, the hinge portion 118 has a main body 126 formed in a box shape like the main body 120 of the hinge portion 116 and a support wall 128 projecting in pairs from the main body 126 (only one is shown in FIGS. 9 and 10). The panel unit 114A, 114B corresponding to the hinge portion 118 is provided with a support shaft 130 at the end. The panel units 114 </ b> A and 114 </ b> B are connected to each other so that the end provided with the support shaft 130 is fitted between the support walls 128 of the hinge portion 118, and the support shaft 130 is pivotally supported by the support wall 128. Has been. A long hole 132 is formed in the support wall 128 corresponding to the support shaft 130 of the panel unit 114A. The support shaft 130 of the panel unit 114A is inserted into the long hole 132, and the support wall 130 is connected to the support shaft 130 of the panel unit 114B. It is possible to move in the direction of contact.

  Accordingly, as shown in FIG. 9, in the electronic cassette 110, the panel unit 114A can be stacked so as to be placed on the panel unit 114C stacked on the panel unit 114B. At this time, since the energy conversion filter 84 is provided in the panel unit 114C, the energy conversion filter 84 is provided between the panel unit 114A and the panel unit 114C, that is, between the radiation detection panel 20A and the radiation detection panel 20C. Be placed.

  As shown in FIG. 10, in the electronic cassette 110, when the panel unit 114A is opened, the panel unit 114A is movable toward the panel unit 114B, and the panel unit 114A is moved toward the panel unit 114B. The interval with the panel unit 114B is reduced.

  Further, in the electronic cassette 110, when the panel unit 114C is opened, the panel unit 114C is not separated from the panel unit 114B, so that the gap between the panel units 114B and 114C is not opened in the open state. When the energy conversion filter 84 provided in the panel unit 114C interferes with the main body 120 of the hinge portion 116 in the open state of the panel units 114A and 114C, the step portion 120A may be provided in the main body 120. .

  In the electronic cassette 110, the panel units 114A to 114C are supported by the main body 120 of the hinge portion 116 and the main body 126 of the hinge portion 118 so that the imaging surfaces 78A to 78C are on the same plane. Note that the electronic cassette 110 is also preferably provided with a handle 69.

  On the other hand, in the electronic cassette 110, for example, the power supply unit 70 of the control unit 18 is accommodated in the main body 120 forming the hinge portion 116, and the control unit 18 is included in the main body 126 forming the hinge portion 118. The control unit 50 is accommodated.

  In the electronic cassette 110 configured as described above, in the open state, the first surfaces 70 of the radiation detection panels 20A to 20C are directed in the same direction (radiation direction), and radiation image data is obtained by irradiation with radiation. Obtainable. In the electronic cassette 110, the energy conversion filter 84 is disposed between the panel units 114A and 114C with the panel units 114A to 114C being closed. Thereby, in the electronic cassette 110, radiation image data including a low energy component is obtained from the radiation emitted to the second surface 74 of the radiation detection panel 20A, and from the radiation emitted to the second surface 74 of the radiation detection panel 20C. Radiation image data of high energy components can be obtained.

  On the other hand, in the electronic cassette 10, the control unit 50 and the power supply unit 70 of the control unit 18 serving as a heat generation source are provided in the main body 120 of the hinge unit 116 and the main body 126 of the hinge unit 118 that are separated from the panel units 114 </ b> A to 114 </ b> C. Yes. Thereby, the radiation detection panels 20A to 20C in the panel units 114A to 114B are not affected by the heat generated by the control unit 50 or the power supply unit 70.

  Further, the main body 120 of the hinge part 116 and the main body 126 of the hinge part 118 have a high heat dissipation effect because their surroundings are open. For this reason, even if heat is generated in the control unit 50 and the power supply unit 70, temperature rises of the panel units 114A to 114C and the radiation detection panels 20A to 20C in the panel units 114A to 114C are suppressed.

  In general, the panel units 114 </ b> A to 114 </ b> C are often touched by the subject to be imaged, and if the temperature rises, the subject may feel uncomfortable or uneasy. At this time, in the electronic cassette 110, the temperature of the panel units 114 </ b> A to 114 </ b> C touched by the subject is raised, and the main body 120 of the hinge part 116 and the main body 126 of the hinge part 118 provided with the control unit 50 and the power supply unit 70. Therefore, the subject is not made uncomfortable or uneasy.

  In the electronic cassette 110, the grid 80 is omitted, but the grid 80 may be provided in the panel unit 114A in advance, or may be attached as necessary. The energy conversion filter 84 may be accommodated in the panel unit 114C. Furthermore, the surface of the main body 120 of the hinge part 116 and the main body 126 of the hinge part 118 may be provided with unevenness and a large number of heat dissipating fins, thereby improving the heat dissipating effect and suppressing the temperature rise. Can do.

  In the present embodiment described above, as an example of the radiation detection panel, an indirect conversion method in which radiation is once converted into light by the scintillator layer 28, and then the converted light is converted into charges by the photoconductive layer 30 and stored. However, the present invention is not limited to this. For example, a direct conversion radiation detection panel that directly converts radiation into charges by a sensor unit using amorphous selenium or the like may be used.

FIG. 11 shows an example of the direct conversion type radiation detection panel 100. In the radiation detection panel 100, a photoconductive layer 102 that converts incident radiation into electric charges is formed on the TFT substrate 26. As the photoconductive layer 102, amorphous Se, Bi ₁₂ MO ₃₀ (M: Ti, Si, Ge), Bi ₄ M ₃ O ₁₂ (M: Ti, Si, Ge), Bi ₂ O ₃ , BiMO ₄ (M: Nb, Ta, V), Bi ₂ WO ₆ , Bi ₂₄ B ₂ O ₃₉ , ZnO, ZnS, ZnSe, ZnTe, MNbO ₃ (M: Li, Na, K), PbO, HgI ₂ , PbI ₂ , CdS, CdSe , CdTe, BiI ₃ , GaAs, and the like are used as a main component, but they have high dark resistance and show good photoconductivity against X-ray (radiation) irradiation. Therefore, an amorphous material capable of forming a large area film at a low temperature is suitable.

  A bias electrode 104 for applying a bias voltage to the photoconductive layer 102 is formed on the photoconductive layer 102 on the surface side of the photoconductive layer 102. Further, on the TFT substrate 26, as in the indirect conversion type radiation detection panel 20, a charge collection electrode 34 that collects charges generated in the photoconductive layer 102 is formed. Further, the TFT substrate 26 of the direct conversion type radiation detection panel 100 is provided with a charge storage capacitor 106 for storing charges collected by the charge collection electrodes 34. The charge accumulated in each charge storage capacitor 106 is read when the switching element 24 is turned on.

  Further, as shown in FIG. 12A, the electronic cassette 10 is in a closed state, and the radiation detection panel 20A in the panel unit 14A and the radiation detection panel 20C in the panel unit 14C are on the first surface 72 side upward (see FIG. 12A, and the radiation detection panel 20B in the panel unit 14B is disposed so that the second surface 74 side is directed upward (upward in FIG. 12A). May be.

  Accordingly, as shown in FIG. 12B, the electronic cassette 10 can be photographed with high image quality because the radiation detection panels 20A to 20C in the panel units 14A to 14C are in the open state in the open state. In addition, there is no difference in image quality between radiographic images taken by the radiation detection panels 20A to 20C in the open state.

  Further, as shown in FIG. 13A, the electronic cassette 10 is in a closed state, and the radiation detection panel 20A in the panel unit 14A is directed upward on the second surface 74 side (upper side of the paper surface in FIG. 13A). The radiation detection panel 20B in the panel unit 14B and the radiation detection panel 20C in the panel unit 14C are arranged so that the first surface 72 side is directed upward (upward on the paper surface in FIG. 13A). May be.

  As a result, the radiation detection panel 20A in the panel unit 14A in the closed state becomes the surface reading method, so that a high-quality image can be obtained by shooting in the closed state. In this case, as shown in FIG. 13B, in the electronic cassette 10, the radiation detection panel 20C in the panel unit 14C is in a surface reading mode in the open state, and the radiation detection panels 20A in the panel units 14A and 14B 20B is a back side scanning method, and there is a difference in image quality between radiographic images taken by the radiation detection panels 20A and 20B and the radiation detection panel 20C in the open state, but this can be solved by performing predetermined image processing.

  Further, as shown in FIG. 15A, the electronic cassette 10 is in a closed state, and the radiation detection panel 20A in the panel unit 14A and the radiation detection panel 20C in the panel unit 14C are on the second surface 74 side upward (see FIG. 15A). 15A, and the radiation detection panel 20B in the panel unit 14B is arranged so that the first surface 72 side is directed upward (upward in FIG. 15A). May be. As a result, the radiation detection panel 20A in the panel unit 14A in the closed state becomes the surface reading method, so that a high-quality image can be obtained by shooting in the closed state. In this case, as shown in FIG. 15B, in the electronic cassette 10, the radiation detection panels 20B and 20C in the panel units 14B and 14C are in a surface reading mode in the open state, and the radiation detection panel in the panel unit 14A. 20A becomes the back side scanning method, and there is a difference in image quality between the radiation images captured by the radiation detection panels 20B and 20C and the radiation detection panel 20A in the open state, but this can be solved by performing predetermined image processing.

  Moreover, when arrange | positioning the radiation detection panels 20A-20C by a surface reading system, as shown in FIG. 14, for example, it is good also as what is affixed on the housing | casing part inside panel units 14A-14C, respectively. When the insulating substrate 22 is formed of a highly rigid plastic resin, aramid, or bionanofiber, the radiation detection panel 20 itself has a high rigidity, so that the casing of the panel unit 14 or the panel unit 16 can be formed thin. In addition, when the insulating substrate 22 is formed of a highly rigid plastic resin, aramid, or bionanofiber, the radiation detection panel 20 itself has flexibility, so that the radiation detection panel 20 is not easily damaged even when an impact is applied.

  The scintillator layers 28 of the radiation detection panels 20A to 20C may have the same configuration or different configurations. For example, you may comprise all the scintillator layers 28 of radiation detection panel 20A-20C by GOS. In this case, the electronic cassette 10 can be manufactured at low cost.

  Alternatively, all of the scintillator layers 28 of the radiation detection panels 20A to 20C may be formed of columnar crystals of CsI or the like. In this case, since light generated in the columnar crystal by being irradiated with radiation is guided along the columnar crystal, the image quality can be improved.

  Further, the scintillator layer 28 of the radiation detection panels 20A and 20C in the panel units 14A and 14C may be configured by columnar crystals of CsI or the like, and the scintillator layer 28 of the radiation detection panel 20B in the panel unit 14B may be configured by GOS. . In this case, a high-quality image can be obtained when radiographic images for energy subtraction are taken by the panel units 14A and 14C with one irradiation of radiation with the electronic cassette 10 closed. Further, even if a temperature change occurs in the panel unit 14B, it is possible to suppress a change in the image quality of the radiographic image captured by the panel unit 14B. Further, the scintillator layer 28 of the radiation detection panel 20A in the panel unit 14A may be composed of columnar crystals made of CsI or the like, and the scintillator layers 28 of the radiation detection panels 20B and 20C in the panel units 14B and 14C may be composed of GOS. . In these cases, as shown in FIGS. 3, 13, and 15, the grid 80 is arranged by disposing the radiation detection panel 20 </ b> A in the panel unit 14 </ b> A in the closed state so that the second surface 74 side faces upward. Since the radiation detection panel 20A can capture an image of the radiation that has passed through, a high-quality image can be obtained. In addition, when capturing a radiation image for energy subtraction, a high-energy, low-energy irradiation line image can be obtained by the radiation detection panel 20A.

  For example, in the above-described embodiment, the case where the panel unit 14B has a flat plate shape has been described, but the present invention is not limited to this. For example, the radiation detection panel 20 can be formed on a glass substrate or the like like a liquid crystal display, and can be made relatively thin. On the other hand, the panel unit 14 </ b> B has a built-in control unit 18, and a circuit element such as an inductance or a coil or a battery built in the control unit 18 has a higher height than the radiation detection panel 20. For this reason, the panel unit 14B is formed thicker than the panel units 14A and 14C.

  Therefore, as shown in FIGS. 16 and 17, the panel units 14A and 14 are formed thin. Further, the casing 12B of the panel unit 14B is formed longer than the panel units 14A and 14C, and the radiation detection panel 20B is placed in the overlapping portion 150 where the panel units 14A and 14C are folded and overlapped when the panel unit 14A is closed. Is formed to have substantially the same thickness as the panel units 14A and 14, and a non-overlapping portion 152 that does not overlap with the panel units 14A and 14C when being closed is formed thicker than the overlapping portion 150. The control unit 18 may be disposed in the overlapping portion 14B.

  Furthermore, in the present embodiment, the electronic cassettes 10 and 110 have been described as examples. However, the radiographic image capturing apparatus to which the present invention is applied is not limited to this, and can be appropriately changed without departing from the gist of the present invention. Needless to say.

10, 110 Electronic cassette 14A, 114A Panel unit (third panel unit)
14B, 114B Panel unit (first panel unit)
14C, 114C Panel unit (second panel unit)
18 Control unit 20 (20A, 20B, 20C), 100 Radiation detection panel 50 Control unit 64 Hinge (first connecting member)
66 Hinge (second connecting member)
70 Power Supply Unit 72 First Surface 74 Second Surface 76 Radiation Absorbing Plate 80 Grid 84 Energy Conversion Filter (Filter Member)
116 Hinge part (first connecting member)
118 Hinge part (second connecting member)
120, 126 Main body 122, 128 Support wall 124, 130 Spindle 132 Long hole

Claims (11)

A first panel unit having a radiation detection panel and a controller for controlling the plurality of radiation detection panels;
A second panel unit and a second panel unit each having a radiation detection panel controlled by the control unit, each side of which is connected to a different side of the first panel unit so as to be rotatable about the side. 3 panel units,
A radiation imaging apparatus including: A first panel unit, a second panel unit, and a third panel unit in which one side of the radiation detection panel is directed to one side and the radiation detection panel is accommodated;
A closed state in which one end of the first panel unit and one end of the second panel unit are opposed to one surface of the first panel unit and one surface of the second panel unit; and A first coupling member that pivotably couples so that one surface of the first panel unit and one surface of the second panel unit are in two open states directed in the same direction. When,
The one end of the first panel unit and the one end of the third panel unit are opposed to the end different from the one end of the first panel unit and the one end of the third panel unit. In a closed state and in an open state in which one surface of the first panel unit and one surface of the third panel unit are directed in the same direction so as to be rotatable. And the other surface of the second panel unit in the closed state of the first panel unit and the second panel unit and in the closed state of the first panel unit and the third panel unit. A second connecting member that is connected so that one surface of the third panel is opposed to the third panel;
The second panel unit when the first panel unit and the second panel unit are in the closed state and the first panel unit and the third panel unit are in the closed state; A filter member disposed between the third panel unit and absorbing a predetermined energy component from incident radiation;
The radiation imaging apparatus according to claim 1, comprising: Including a control unit including a control unit and a power supply unit;
In the first panel unit, the control unit is accommodated at a position on the other surface side of the radiation detection panel accommodated in the first panel unit.
The radiation imaging apparatus according to claim 2. Between the radiation detection panel in the first panel unit and the control unit, a flat radiation absorbing member that prevents back scattering during imaging is included.
The radiation imaging apparatus according to claim 3. A control unit and a control unit including a power supply unit, and the control unit is accommodated in the first and second connecting members;
The radiation imaging apparatus according to claim 2. The first connecting member is formed in a box shape and accommodates one of the control unit and the power supply unit of the control unit, and the first and second panel units can be rotated on the main body. And a connecting part connected to
The second connecting member includes a main body that is formed in a box shape and accommodates the other of the control unit or the power supply unit of the control unit.
The radiation imaging apparatus according to claim 5. The first, second and third panel units are supported by the main body of the first connecting member and the main body of the second connecting member in an open state,
The radiation imaging apparatus according to claim 6. On the other surface of the third panel unit, a flat grid for removing scattered radiation due to an imaging target at the time of imaging is provided.
The radiation imaging apparatus according to any one of claims 2 to 7. The radiation detection panel is a scintillator that converts radiation into light, converts the radiation into light, and outputs an electrical signal indicating a radiation image represented by the light,
The radiation imaging apparatus according to any one of claims 1 to 8, wherein the scintillator includes a columnar crystal of a phosphor material. The radiation imaging apparatus according to claim 9, wherein the phosphor material is CsI. In the radiation detection panel, a sensor part that generates charges by receiving light converted by the scintillator and a thin film transistor for reading out the charges generated by the sensor part are formed on an insulating substrate.
The sensor unit includes an organic photoelectric conversion material,
The active layer of the thin film transistor includes an amorphous oxide or an organic semiconductor material or a carbon nanotube,
The radiation imaging apparatus according to claim 9, wherein the substrate is made of plastic.

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