JP2011128509A - Heat dissipation structure of electronic musical instrument - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a heat dissipation structure of an electronic musical instrument, capable of efficiently dissipating heat of a circuit substrate to outside of a musical instrument case, which is safe for burn etc., without spoiling appearance and design of a musical instrument case. <P>SOLUTION: An attachment groove 11 for attaching a music stand member 10 to an upper case 3 is provided, and an aperture 12a is provided corresponding to a heat sink 16 provided on a circuit substrate 13 at a bottom section 12 of the attachment groove 11. Thus, when heat generated at the circuit substrate 13 is dissipated with the heat sink 16, the dissipated heat is released to an upper direction of the upper case 3 through the aperture 12a of the bottom section 12 at the attachment groove 11 of the upper case 3. Consequently, the heat generated in the circuit substrate 13 is efficiently dissipated to outside of the musical instrument case 1, and as the attachment groove 11 for attaching the music stand member 10 is utilized, excellent appearance and design is achieved and it is safe for burn etc. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a heat dissipation structure for an electronic musical instrument such as an electronic piano or an electronic organ.

  2. Description of the Related Art Conventionally, in an electronic musical instrument such as an electronic piano, as described in Patent Document 1, a heat radiating plate is provided on a circuit board provided in a musical instrument case, and the heat of the circuit board is transferred to the outside of the musical instrument case by the heat radiating plate. Those configured to dissipate heat are known.

JP 2008-170477 A

  However, in such a conventional electronic musical instrument, in order to radiate the heat of the circuit board to the outside of the instrument case by the heat radiating plate, a large number of heat radiating holes are provided in the instrument case, and the heat radiating plate radiates heat through the many heat radiating holes. Because it is configured to dissipate the heat generated outside the instrument case, fingers and hands are easy to touch the numerous heat dissipation holes provided in the instrument case, so there is a risk of burns and many heat dissipation holes Since it is easily visible from the outside of the case and the appearance of the musical instrument case is impaired, there is a problem that it is not preferable in terms of appearance and design.

  The problem to be solved by the present invention is an electronic musical instrument that is highly safe against burns and the like and that can efficiently dissipate the heat of the circuit board to the outside of the musical instrument case without impairing the appearance and design of the musical instrument case. It is to provide a heat dissipation structure.

In order to solve the above problems, the present invention includes the following components.
The invention according to claim 1 is a heat dissipation structure for an electronic musical instrument in which a heat sink is provided on a circuit board provided in the instrument case, and the heat of the circuit board is radiated by the heat sink, and a music stand member is attached to the instrument case And an opening that penetrates the inside and outside of the musical instrument case is provided in correspondence with the heat sink provided on the circuit board. Structure.

  According to a second aspect of the present invention, a heat radiating plate that guides heat of the heat sink to the opening and dissipates heat is provided at the bottom of the mounting groove corresponding to the opening. The heat dissipation structure for an electronic musical instrument according to claim 1, wherein:

  According to a third aspect of the present invention, there is provided the electron according to the second aspect, wherein the heat sink is provided with a hole penetrating up and down corresponding to the opening of the mounting groove. This is a heat dissipation structure for musical instruments.

  The invention according to claim 4 is a rib portion for forming a gap in the mounting groove portion between the mounting insertion portion of the music rest member inserted therein and the inner surface of the mounting groove portion opposed to the mounting portion. The heat dissipation structure for an electronic musical instrument according to any one of claims 1 to 3, wherein the electronic musical instrument has a heat dissipation structure.

  The invention according to claim 5 is characterized in that a heat conduction plate for conducting and radiating the heat radiated by the heat radiating plate is provided on the music rest member. A heat dissipation structure for an electronic musical instrument according to any one of the above.

  According to the present invention, when the heat generated in the circuit board is radiated by the heat sink, the radiated heat can be radiated to the outside of the instrument case through the opening at the bottom of the mounting groove of the instrument case. For this reason, the heat of the circuit board can be efficiently radiated to the outside of the musical instrument case, and by using the mounting groove portion for mounting the music rest member, a finger or a hand is placed in the opening at the bottom of the mounting groove portion. Since it is hard to touch, the safety against burns is high, and the opening at the bottom of the mounting groove is difficult to see from the outside of the instrument case. Also, a preferable one can be provided.

It is a top view of Embodiment 1 which applied this invention to the electronic keyboard musical instrument. It is an expanded sectional view in the AA arrow of the electronic keyboard musical instrument of FIG. It is the top view which showed the state which removed the upper case in the electronic keyboard instrument of FIG. It is the enlarged plan view which showed the A section of FIG. It is the expanded sectional view which showed the B section of FIG. It is an expanded sectional view in the BB arrow of FIG. It is the enlarged plan view which showed the heat sink of FIG. It is sectional drawing which expanded and showed the principal part of FIG. FIG. 2 shows the music rest member of FIG. 2, (a) is a front view thereof, and (b) is a cross-sectional view taken along the CC arrow. It is the expanded sectional view of the principal part which showed the heat dissipation state at the time of removing the music stand member in FIG. The 1st modification of the musical score stand member of Embodiment 1 is shown, (a) is the front view, (b) is sectional drawing in the DD arrow. It is the expanded sectional view which showed the principal part in Embodiment 2 which applied this invention to the electronic keyboard musical instrument. It is sectional drawing which expanded and showed the principal part of FIG. It is the expanded sectional view which decomposed | disassembled and showed the attachment insertion part of the music stand member of FIG. It is the expansion perspective view which showed the 2nd heat conductive member of FIG. The musical score stand member of FIG. 12 is shown, (a) is the front view, (b) is sectional drawing in the EE arrow. The 2nd modification of the 2nd heat conductive member of Embodiment 2 is shown, (a) is the front view, (b) is sectional drawing in the FF arrow. It is the expanded sectional view which showed the 3rd modification which applied this invention to the electronic keyboard musical instrument.

(Embodiment 1)
A first embodiment in which the present invention is applied to an electronic keyboard instrument will be described below with reference to FIGS.
This electronic keyboard instrument includes a musical instrument case 1 as shown in FIGS. This musical instrument case 1 is composed of a lower case 2 and an upper case 3, and the whole is formed in a horizontally long, substantially box shape.

  That is, as shown in FIGS. 1 to 3, the lower case 2 is formed in a box shape that is elongated in the lateral direction (in the left-right direction in FIG. 1) opened upward. As shown in FIGS. 1 and 2, the upper case 3 has a substantially half size corresponding to the rear side of the lower case 2 and is formed in an elongated substantially box shape opened to the lower side. It is configured to be attached to the top.

  In this case, on both sides of the upper case 3 in the longitudinal direction (left-right direction in FIG. 1), as shown in FIG. 1, the lower case 2 extends from the front end of the upper case 3 (end on the near side in FIG. 1). A pair of cover portions 3a extending to the front end portion is provided. Thus, the musical instrument case 1 is configured such that the lower case 2 is opened upward except for the upper case 3 and the pair of cover portions 3a on both sides, with the upper case 3 attached to the lower case 2. ing.

  In the musical instrument case 1, a keyboard portion 4 is provided as shown in FIGS. As shown in FIG. 2, the keyboard unit 4 includes a keyboard chassis 5 disposed in the lower case 2 of the musical instrument case 1 and a plurality of keys 6 mounted on the keyboard chassis 5 so as to be rotatable in the vertical direction. It has. In this case, the plurality of keys 6 are composed of a white key and a black key, and are arranged so as to be exposed upward from the opened portion of the musical instrument case 1 in a state where they are arranged in the musical scale order on the keyboard chassis 5. ing.

  In addition, the musical instrument case 1 is provided with a speaker unit 7, a display unit 8, and a switch unit 9, as shown in FIG. The speaker unit 7 is for generating musical sounds, and is provided on both sides in the upper case 3 located on the rear side of the keyboard unit 4 as shown in FIG. The display unit 8 displays musical tone information and is provided at a substantially central portion on the upper surface of the upper case 3. The switch unit 9 includes various switches such as volume adjustment and timbre selection, and is provided in a distributed manner in places other than the speaker unit 7 and the display unit 8 in the upper case 3.

  Further, as shown in FIGS. 1 and 2, a mounting groove portion 11 for detachably mounting the music rest member 10 is provided on the rear portion (upper side portion in FIG. 1) on the upper surface of the upper case 3. As shown in FIGS. 1 and 2, the mounting groove 11 is an elongated groove formed along the rear side portion (upper side portion in FIG. 1) of the upper case 3, and only in the middle portion of the bottom portion 12. The opening 12 a is configured to penetrate through the upper case 3 in the vertical direction.

  Further, as shown in FIG. 3, a plurality of circuit boards 13, 14 are provided along the mounting groove 11 of the music rest member 10 at the rear part in the upper case 3 with the circuit boards 13, 14 positioned behind the keyboard part 4. It has been. That is, as shown in FIGS. 2 and 5, the plurality of circuit boards 13 and 14 are respectively attached to a plurality of mounting bosses 15 provided on the lower surface in the upper case 3 in a substantially horizontal state by screws 15a. Yes.

  Among the plurality of circuit boards 13 and 14, one circuit board 13 is a main board for electrically controlling and driving the entire musical instrument, and the other circuit board 14 is an auxiliary circuit board. As shown in FIGS. 2 to 5, in the main circuit board 13, the heat sink 16 for radiating the heat of the circuit board 13 corresponds to the opening 12 a of the bottom 12 in the mounting groove 11 of the upper case 3. It is provided on the lower side.

  As a result, the heat sink 16 is configured such that the heat dissipated is dissipated above the upper case 3 through the opening 12a of the bottom 12 of the mounting groove 11 of the upper case 3, as shown in FIG. In this case, as shown in FIGS. 2 to 5, a heat radiating plate 17 is provided corresponding to the heat sink 16 on the lower surface of the bottom 12 at a location corresponding to the opening 12 a of the mounting groove 11.

  The heat radiating plate 17 is made of a metal plate having high thermal conductivity, and is formed in a rectangular shape that is slightly larger than the overall size of the upper surface of the heat sink 16, as shown in FIGS. That is, as shown in FIGS. 4 and 7, the heat radiating plate 17 has a length along the longitudinal direction of the mounting groove 11 that is substantially the same as the length of the opening 12 a and is orthogonal to the longitudinal direction of the mounting groove 11. It is formed in a substantially rectangular shape having a length in the direction of about four times the width of the opening 12a.

  In this case, as shown in FIGS. 4 and 7, a pair of mounting projections 17 a are arranged in the lateral direction of the heat radiating plate 17 (FIG. 4) at locations corresponding to the openings 12 a of the bottom 12 of the mounting groove 11 in the heat radiating plate 17. In the left-right direction). As shown in FIG. 6, the pair of mounting projections 17a extend along both sides of the opening 12a in the bottom 12 of the mounting groove 11, and the extended both ends are substantially L-shaped downward. And is arranged below the bottom 12 of the mounting groove 11.

  As shown in FIGS. 4 to 6, the heat radiating plate 17 is attached to four mounting bosses 18 a provided on the lower surface in the upper case 3 by screws 19. Further, the heat radiating plate 17 has a pair of mounting projections 17 a attached to mounting bosses 18 b provided on the lower surface of the bottom 12 located on both sides of the opening 12 a of the mounting groove 11 by screws 19.

  Accordingly, as shown in FIG. 10, the heat radiating plate 17 conducts heat radiated by the heat sink 16 toward the opening 12 a of the mounting groove 11, and this conducted heat is opened in the bottom 12 of the mounting groove 11. It is configured to radiate heat from the portion 12 a toward the mounting groove portion 11. That is, as shown in FIG. 10, the heat radiating plate 17 radiates heat by the heat sink 16 when the portion corresponding to the opening 12 a of the bottom 12 in the mounting groove 11 is cooled by the outside air of the instrument case 1 through the mounting groove 17. The generated heat is conducted toward the opening 12 a of the mounting groove 11.

  Further, as shown in FIG. 4 and FIG. 7, a number of small portions except for both ends of the pair of mounting projections 17 a are provided at locations corresponding to the opening 12 a of the bottom 12 in the mounting groove 11 of the heat radiating plate 17. The hole 20 is formed so as to penetrate vertically by punching or pressing. Thus, the heat radiating plate 17 is configured such that the surface area of the portion corresponding to the opening 12 a in the bottom 12 of the mounting groove 11 is sufficiently wide due to the large number of small holes 20.

  On the other hand, as shown in FIG. 2 and FIG. 5, a state where the music rest member 10 stands on the musical instrument case 1 is inserted into the attachment groove 11 as shown in FIG. 2 and FIG. It is configured to be attached with. In this case, as shown in FIG. 8, a rib portion 21 for forming a gap S between the mounting insertion portion 10 a of the music rest member 10 and the inner surface of the mounting groove portion 11 facing the mounting groove portion 11 in the mounting groove portion 11. Is provided.

  Thereby, as shown in FIG. 5 and FIG. 8, even if the attachment insertion part 10a of the music stand member 10 is inserted in the attachment groove part 11, the attachment insertion part 10a and the attachment groove part 11 opposite to this are inserted. The heat dissipated in the mounting groove 11 through the gap S provided between the inner surface and the upper case 3 is dissipated.

  By the way, as shown in FIGS. 2, 5, and 9, the music rest member 10 is slightly curved from the inside of the attachment groove 11 toward the front upper side of the upper case 3 and is inserted into the attachment groove 11 so as to be detachable. The mounting insertion portion 10a, the music score receiving portion 10b inclined obliquely downward from the upper end portion of the mounting insertion portion 10a toward the rear side of the upper case 3, and the upper case 3 from the rear end portion of the musical score receiving portion 10b. And a musical score resting portion 10c extending obliquely rearward and upward.

  As a result, the musical score support member 10 is inserted into the mounting groove portion 11 of the upper case 3 from above as shown in FIGS. 2, 5, and 9, so that the musical score support portion 10c is inserted. Is tilted to the rear side of the upper case 3 and is erected and mounted on the upper case 3. In this state, a musical score (not shown) is placed on the musical score receiving portion 10b and leaned against the musical score leaning portion 10c. The musical score is arranged.

Next, the operation of the heat dissipation structure of such an electronic keyboard instrument will be described.
First, the case where it plays without using the music stand member 10 will be described. In this case, as shown in FIG. 10, the mounting groove portion 11 provided in the upper case 3 is opened above the upper case 3. When the circuit board 13 generates heat in this state, the heat is radiated in the musical instrument case 1 by the heat sink 16.

  As shown in FIG. 10, the heat radiated by the heat sink 16 is transmitted to the heat radiating plate 17 disposed on the upper side thereof, and is conducted toward the mounting groove 11 of the upper case 3 by the heat radiating plate 17. That is, since the heat radiating plate 17 is arranged corresponding to the opening 12 a provided in the bottom 12 of the mounting groove 11, the heat radiation plate 17 is caused by the outside air of the instrument case 1 that has passed through the opening 12 a of the bottom 12 in the mounting groove 11. By being cooled, the heat of the heat radiating plate 17 is transmitted toward the opening 12 a of the bottom 12 in the mounting groove 11.

  Thereby, the heat radiating plate 17 radiates the heat radiated by the heat sink 16 toward the opening 12 a of the bottom 12 in the mounting groove 11. In this case, the heat sink 17 is provided with a large number of small holes 20 corresponding to the openings 12 a of the bottom 12 in the mounting groove 11, so that the surface area of the heat sink 17 in this portion is increased. Therefore, it is possible to increase the heat exchange performance of the heat radiating plate 17 at a location where a large number of small holes 20 are provided.

  For this reason, the heat radiating plate 17 where the small holes 20 are provided is sufficiently cooled by the outside air of the musical instrument case 1 that has passed through the opening 12 a of the bottom 12 in the mounting groove 11. As a result, the heat radiated by the heat sink 16 is efficiently and reliably guided toward the opening 12 a of the bottom 12 in the mounting groove 11 by the heat radiating plate 17.

  The guided heat is radiated into the mounting groove 11 from the entire surface of the heat radiating plate 17 where the numerous small holes 20a are provided through the opening 12a of the bottom 12 of the mounting groove 11. Further, of the heat radiated by the heat sink 16, a part of the heat passes through the numerous small holes 20 of the heat radiating plate 17 as it is and is radiated into the mounting groove 11 through the openings 12 a of the mounting groove 11. The heat radiated into the mounting groove 11 in this way is radiated to the upper case 3 through the mounting groove 11.

  Next, the case where the musical score support member 10 is attached to the attachment groove portion 11 of the upper case 3 to perform is described. In this case, when the mounting insertion portion 10 a of the music score standing member 10 is inserted into the mounting groove portion 11 of the upper case 3, the music score standing member 10 is erected and attached to the upper case 3. In this state, a gap S is formed between the inner surface of the attachment groove 11 and the attachment insertion portion 10 a of the music rest member 10 by the rib portion 21 provided in the attachment groove 11.

  For this reason, when the circuit board 13 generates heat during performance, the heat is radiated into the mounting groove 11 through the heat sink 16 and the heat radiating plate 17 as described above. At this time, the heat dissipated in the mounting groove 11 is attached to the mounting insertion portion 10a of the music rest member 10 and the mounting insertion portion 10a of the music rest member 10 even if the mounting insertion portion 10a of the music rest member 10 is inserted into the mounting groove 11. Heat is dissipated above the upper case 3 through a gap S provided between the inner surface of the groove 11.

  As described above, according to the heat dissipation structure of the electronic keyboard instrument, the mounting groove portion 11 for mounting the music rest member 10 is provided in the upper case 3 of the musical instrument case 1, and the bottom portion 12 of the mounting groove portion 11 is provided with the upper case 3. Since the opening 12a penetrating inside and outside is provided corresponding to the heat sink 16 provided on the circuit board 13, if the heat generated in the circuit board 13 is dissipated by the heat sink 16, the heat is dissipated in the mounting groove 11 of the upper case 3. The heat can be radiated from the opening 12a of the bottom portion 12 to the upper portion of the upper case 3 through the mounting groove 11.

  For this reason, the heat generated in the circuit board 13 can be efficiently radiated to the outside of the musical instrument case 1, and the bottom of the mounting groove 11 is provided by using the mounting groove 11 for mounting the music rest member 10. Since it is difficult for fingers and hands to touch the opening 12a of the twelve, there is little risk of burns and safety against burns is high, and the opening 12a of the bottom 12 in the mounting groove 11 is difficult to see from the outside. The appearance and design of No. 1 are not impaired, and a favorable appearance and design can be provided.

  In this case, a heat radiating plate 17 that guides the heat of the heat sink 16 to the opening 12 a of the mounting groove 11 and dissipates heat is provided on the bottom 12 of the mounting groove 11 corresponding to the opening 12 a corresponding to the heat sink 16. Therefore, the heat radiated by the heat sink 16 can be efficiently conducted by the heat radiating plate 17 toward the opening 12 a of the bottom 12 in the mounting groove 11 of the upper case 3.

  That is, since the heat radiating plate 17 is disposed at the bottom 12 corresponding to the opening 12 a of the mounting groove 11, the outside air of the instrument case 1 can be taken from the opening 12 a of the bottom 12 of the mounting groove 11. The taken-out outside air can surely and well cool the portion corresponding to the opening 12a in the heat radiating plate 17, so that the heat of the heat radiating plate 17 is surely directed toward the opening 12a of the bottom 12 in the mounting groove portion 11. Moreover, it can be transmitted well and can be radiated into the mounting groove 11.

  Further, the heat sink 17 is provided with a large number of small holes 20 penetrating vertically, corresponding to the opening 12a of the bottom portion 12 of the mounting groove portion 11, so that the large number of small holes 20 are provided. The surface area of the heat radiating plate 17 in the portion can be sufficiently widened by the large number of small holes 20, and thus heat exchange can be improved, so that the heat radiating plate 17 can efficiently radiate heat.

  That is, the heat radiating plate 17 radiates heat by the heat sink 16 when the portion provided with a large number of small holes 20 is sufficiently cooled by the outside air of the instrument case 1 that has passed through the opening 12 a of the bottom 12 in the mounting groove 11. The generated heat can be efficiently transmitted to the opening 12 a of the bottom 12 in the mounting groove 11 by the heat radiating plate 17.

  As a result, the heat radiated from the heat sink 16 can be radiated into the mounting groove 11 from the opening 12a of the bottom 12 of the mounting groove 11 by the heat radiating plate 17, and also radiated by the heat sink 16 as shown in FIG. The generated heat can be radiated as it is into the mounting groove 11 through the numerous small holes 20 a of the heat radiating plate 17.

  Further, a rib for forming a gap S on the inner surface of the mounting groove portion 11 between the mounting insertion portion 10a of the music rest member 10 inserted into the mounting groove portion 11 and the inner surface of the mounting groove portion 11 facing the mounting insertion portion 10a. By providing the portion 21, even if the mounting portion 10 a of the musical score support member 10 is inserted into the mounting groove portion 11 and the musical score support member 10 is attached to the upper case 3, the musical score case 1 is inserted into the mounting groove portion 11. The radiated heat can be reliably radiated to the outside of the upper case 3 by the gap S provided between the mounting insertion portion 10a of the music rest member 10 and the inner surface facing the mounting insertion portion 10a.

  In addition, in Embodiment 1 mentioned above, although the case where the attachment insertion part 10a of the music stand member 10 was formed in simple substantially flat plate shape was described, it is not restricted to this, For example, Fig.11 (a) and FIG. As in the first modification shown in b), the notch 25 may be provided in the mounting insertion portion 10 a of the music rest member 10 so as to correspond to the heat radiating plate 17. In this case, the notch 25 is provided from the bottom 12 in the mounting groove 11 of the upper case 3 to a position located above the upper case 3.

  According to this structure, even if the mounting member 10 a of the music rest member 10 is inserted into the mounting groove 11 of the upper case 3 and the music rest member 10 is mounted on the upper case 3, the mounting groove portion is attached by the heat radiating plate 17. The heat dissipated in the heat sink 11 can be dissipated above the upper case 3 by the notch 25 provided in the mounting insertion portion 10 a of the music rest member 10. In this case, it is not always necessary to provide the rib portion 21 in the attachment groove portion 11 and provide the gap S between the attachment insertion portion 10a of the music rest member 10 and the inner surface of the attachment groove portion 11 opposite to the attachment portion 10a. The structure of the groove 11 is simplified, and the upper case 3 can be easily formed.

(Embodiment 2)
Next, a second embodiment in which the present invention is applied to an electronic keyboard instrument will be described with reference to FIGS. In addition, the same code | symbol is attached | subjected and demonstrated to the same part as Embodiment 1 shown by FIGS.
In this electronic keyboard instrument, the mounting insertion portion 30 of the music rest member 10 has a configuration different from that of the first embodiment, and the other configuration is substantially the same as that of the first embodiment.

  That is, as shown in FIGS. 12 to 14, the attachment insertion portion 30 of the musical score rest member 10 includes the first heat conductive member 31 having elasticity provided at the lower end portion thereof, and the rear surface of the attachment insertion portion 30 ( 10 is provided with a second heat conducting member 32 provided on the left side surface in FIG. The first heat conductive member 31 is formed of a heat conductive elastomer rich in flexibility. The heat conductive elastomer is, for example, a material having high heat diffusibility in which silicon nitride is added to silicon elastomer as a heat conductive filler.

  As shown in FIGS. 13 and 16, the first heat conducting member 31 is provided at the lower end portion of the mounting insertion portion 30 of the music rest member 10 so as to correspond to the opening portion 12 a of the bottom portion 12 in the mounting groove portion 11. ing. Thereby, as shown in FIGS. 12 and 13, the first heat conducting member 31 has the first heat conducting member 31 when the mounting insertion portion 30 of the music rest member 10 is inserted into the mounting groove portion 11 of the upper case 3. The lower surface of the heat conducting member 31 is elastically contacted with the upper surface of the heat radiating plate 17 through the opening 12 a of the bottom 12 in the mounting groove 11, thereby transferring the heat radiated from the heat radiating plate 17 to the second heat conducting member 32. At the same time, heat is dissipated into the mounting groove 11.

  The second heat conducting member 32 is made of a metal having high heat conductivity such as aluminum or copper, and as shown in FIGS. 13 and 16, the music rest corresponding to the opening 12 a of the bottom 12 in the mounting groove 11. It is provided in the location of the attachment insertion part 30 of the member 10 from the upper part of the 1st heat conductive member 31 to the location located above the attachment groove part 11 of the upper case 3. As shown in FIG.

  Thereby, as shown in FIG. 12 and FIG. 13, the second heat conducting member 32 has the first heat conducting member 32 when the mounting insertion portion 30 of the music rest member 10 is inserted into the mounting groove portion 11 of the upper case 3. The heat dissipated by the heat conducting member 31 is transmitted to the upper case 3 to be dissipated, and the heat is dissipated into the mounting groove 11.

  Also in this case, in the mounting groove portion 11, as in the first embodiment, a rib portion for forming a gap S between the mounting insertion portion 30 of the music rest member 10 and the inner surface of the mounting groove portion 11 that faces the mounting insertion portion 30. 21 is provided. Thereby, as shown in FIG. 13, even if the attachment insertion part 30 of the music stand member 10 is inserted in the attachment groove part 11, the attachment insertion part 30 and the inner surface of the attachment groove part 11 facing this are inserted. The heat radiated in the mounting groove 11 is dissipated above the upper case 3 by the gap S provided therebetween.

Next, the operation of the heat dissipation structure of such an electronic keyboard instrument will be described.
In this heat radiating structure, when performing without using the music rest member 10, heat is radiated in the same manner as in the first embodiment. Further, when playing with the music rest member 10 attached to the mounting groove 11 of the upper case 3, the heat generated by the circuit board 13 is dissipated by the heat sink 16 as in the first embodiment. The heat radiating plate 17 radiates heat toward the opening 12 a of the bottom 12 in the mounting groove 11.

  At this time, the mounting insert 30 of the music rest member 10 is inserted into the mounting groove 11 of the upper case 3, and the first heat conducting member 31 provided at the lower end of the mounting insert 30 is connected to the upper case 3. Since the heat dissipation plate 17 is elastically contacted through the opening 12 a of the bottom 12 in the mounting groove 11, the heat radiated by the heat dissipation plate 17 is transmitted to the first heat conducting member 31. The heat transmitted to the first heat conductive member 31 is transmitted to the second heat conductive member 32, and the heat transmitted to the second heat conductive member 32 is transmitted to the upper case 3 and dissipated. The

  Also in this case, a gap S is formed between the inner surface of the mounting groove portion 11 and the mounting insertion portion 10a of the music rest member 10 by the rib portion 21 provided in the mounting groove portion 11. The heat dissipated in the gap S between the inner surface of the mounting groove 11 and the mounting insertion portion 10a of the music rest member 10 by the first heat conductive member 31 and the second heat conductive member 32 is generated in the mounting groove 11. Heat is dissipated above the upper case 3 through the gap S.

  Therefore, even if the circuit board 13 generates heat during the performance, as described above, the heat passes through the heat sink 16, the heat radiating plate 17, the first heat conducting member 31, and the second heat conducting member 32, and the upper case. The heat is dissipated above 3 and is also dissipated in the mounting groove 11. The heat dissipated in the mounting groove 11 is dissipated above the upper case 3 through a gap S provided between the mounting insertion portion 10a of the music rest member 10 and the inner surface of the mounting groove 11 opposite to the mounting insertion portion 10a. .

  As described above, according to the heat dissipation structure of the electronic keyboard instrument, the same effects as those of the first embodiment are obtained, and the opening 12a of the bottom 12 of the mounting groove 11 at the lower end of the mounting insertion portion 30 of the music rest member 10 is provided. Since the first heat conductive member 31 made of a heat conductive elastomer having a high flexibility is provided at the corresponding position, the mounting insertion portion 30 of the music rest member 10 is inserted into the mounting groove portion 11 of the upper case 3. The first heat conducting member 31 can be elastically contacted with the heat radiating plate 17 without damaging the heat radiating plate 17, and the heat radiated from the heat radiating plate 17 in this state The heat conducting member 31 can reliably and satisfactorily transmit to the second heat conducting member 32 to dissipate heat.

  Further, the second heat conducting member 32 is provided from the lower side of the mounting insertion portion 30 to the portion corresponding to the opening 12 a of the bottom portion 12 of the mounting groove portion 11 in the mounting insertion portion 30 of the music rest member 10. The first heat conducting member 31 is provided even in a state in which the mounting insertion portion 30 of the music rest member 10 is inserted into the mounting groove portion 11 of the upper case 3 because it is provided over the portion located above the mounting groove portion 11. The heat dissipated by the heat can be transmitted to the upper case 3 by the second heat conducting member 32 to be dissipated.

  For this reason, the heat generated in the circuit board 13 can be radiated to the outside of the musical instrument case 1 more efficiently than in the first embodiment, and the mounting groove 11 for mounting the music rest member 10 is used. Therefore, as in the first embodiment, it is difficult for a finger or a hand to touch the opening 12a of the bottom 12 in the mounting groove 11, so that there is less danger of burns and the like, and the safety against burns is high, and the bottom 12 in the mounting groove 11 Since the opening 12a is difficult to be seen from the outside, the appearance and design of the musical instrument case 1 are not impaired, and a favorable appearance and design can be provided.

  In the second embodiment described above, the case where the second heat conducting member 32 is formed in a simple substantially flat plate shape has been described. However, the present invention is not limited to this, and for example, FIG. 17 (a) and FIG. 17 (b). A configuration in which a plurality of slit holes 32 a are provided in the second heat conducting member 32 may be employed as in the second modification shown in FIG. If comprised in this way, since the surface area of the 2nd heat conductive member 32 can be enlarged by the some slit hole 32a, the heat dissipation of the 2nd heat conductive member 32 can be improved further.

  Further, in the above-described first and second embodiments and the modifications thereof, the case where a large number of small holes 20 are provided in the heat radiating plate 17 has been described. The slit hole may be provided, and the heat dissipation plate 17 is not necessarily provided with the small hole 20 or the slit hole, and may be formed in a simple flat plate shape.

  Further, in the above-described first and second embodiments and the modifications thereof, the case where the circuit boards 13 and 14 are arranged in the instrument case 1 in a substantially horizontal state has been described. However, the circuit boards 13 and 14 are not necessarily horizontal. The circuit boards 13 and 14 may be disposed in a substantially vertical state in the musical instrument case 1 as in the third modification shown in FIG. Also in this case, the heat sink 16 provided on the circuit board 13 may be disposed so as to correspond to the lower side of the opening 12 a of the bottom 12 in the mounting groove 11 of the upper case 3.

  In addition, in the first and second embodiments and the modifications thereof described above, the case where the present invention is applied to an electronic keyboard instrument has been described. However, the present invention does not necessarily need to be an electronic keyboard instrument, and is widely applied to an electronic instrument that does not have a keyboard section. can do.

DESCRIPTION OF SYMBOLS 1 Musical instrument case 2 Lower case 3 Upper case 4 Keyboard part 10 Musical stand member 10a, 30 Mounting insertion part 11 Mounting groove part 12 Bottom part 12a Opening part 13 Circuit board 16 Heat sink 17 Heat sink 20 Small hole 21 Rib part 25 Notch part 31st 1 heat conducting member 32 second heat conducting member 32a slit hole

Claims (5)

In a heat dissipation structure of an electronic musical instrument in which a heat sink is provided on a circuit board provided in a musical instrument case and the heat of the circuit board is radiated by the heat sink,
The musical instrument case is provided with an attachment groove for attaching the music rest member, and an opening penetrating the inside and outside of the musical instrument case is provided at the bottom of the attachment groove corresponding to the heat sink provided on the circuit board. A heat dissipation structure for an electronic musical instrument.   The heat sink which guides the heat of the heat sink to the opening and radiates heat is provided corresponding to the heat sink at the bottom of the portion corresponding to the opening in the mounting groove. The heat dissipation structure of the electronic musical instrument according to 1.   3. The heat dissipation structure for an electronic musical instrument according to claim 2, wherein the heat radiating plate is provided with holes extending vertically therethrough corresponding to the openings of the mounting groove.   In the mounting groove portion, a rib portion is provided for forming a gap between the mounting insertion portion of the music stand member inserted therein and the inner surface of the mounting groove portion facing the mounting insertion portion. The heat dissipation structure for an electronic musical instrument according to any one of claims 1 to 3. The electronic musical instrument according to any one of claims 1 to 4, wherein the musical score stand member is provided with a heat conduction plate that conducts and dissipates heat radiated by the heat radiating plate. Heat dissipation structure.

Images