JP2011126754A - Diamond covered cutting edge - Google Patents
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- JP2011126754A JP2011126754A JP2009289150A JP2009289150A JP2011126754A JP 2011126754 A JP2011126754 A JP 2011126754A JP 2009289150 A JP2009289150 A JP 2009289150A JP 2009289150 A JP2009289150 A JP 2009289150A JP 2011126754 A JP2011126754 A JP 2011126754A
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本発明は、ダイヤモンド被覆切断刃に関し、特に光ファイバの切断や、ガラス・セラミック・半導体等の脆性材料のスクライブに好適なダイヤモンド被覆切断刃に関する。 The present invention relates to a diamond-coated cutting blade, and more particularly to a diamond-coated cutting blade suitable for cutting optical fibers and scribing brittle materials such as glass, ceramics, and semiconductors.
ダイヤモンドは現存する物質中最高の硬度を持ち、古くから天然ダイヤモンドや、超高圧ダイヤモンド焼結体等により、切削、研削、耐磨等の工具用途への応用が図られてきた。１９８０年代に化学気相成長（ＣＶＤ）法による、ダイヤモンド薄膜製造技術が確立されてからは、比較的高い形状自由度を獲得し、ドリル、エンドミル等、複雑曲面を持つ切削工具への応用展開を目指して技術開発が盛んになった。近年では、航空機産業で需要が増加している繊維強化プラスチック（ＦＲＰ：Ｆiber Ｒeinforced Ｐlastics）や、Ａl，Ｔi等加工時に溶着しやすい金属との複合構造材料、及び、非金属、ガラス、セラミックス等の難削材加工用で需要が拡大している。 Diamond has the highest hardness among the existing materials, and has long been applied to tools such as cutting, grinding, and abrasion resistance by using natural diamond or ultra-high pressure diamond sintered body. Since diamond thin film manufacturing technology was established by chemical vapor deposition (CVD) in the 1980s, it gained a relatively high degree of freedom in shape and applied to cutting tools with complex curved surfaces such as drills and end mills. Aimed at technological development. In recent years, fiber reinforced plastics (FRP: Fiber Reinforced Plastics), which are in increasing demand in the aircraft industry, composite structural materials with metals that are easily welded during processing, such as Al and Ti, and non-metals, glass, ceramics, etc. Demand is increasing for difficult-to-cut materials.
一方、光ファイバの切断刃や、ガラス、セラミック、半導体等の脆性基板をスクライブ（割断）するための切断刃としては、これまで主に超硬合金が用いられてきた。超硬合金で寿命や加工精度に不満がある用途に関しては、例えば特許文献１や特許文献２に示すようなダイヤモンド焼結体を用いて、耐摩耗性を向上することで解決を図っている。ダイヤモンド焼結体は耐摩耗性が超硬合金よりも優れているが、一方でダイヤモンド粒子の脱落等があるために、実際の寿命はその耐摩耗性を十分生かし切れていないのが実情である。この問題を解決するため、例えば特許文献３では、セラミック製切断刃にＣＶＤダイヤモンドを被覆した例が開示されている。 On the other hand, cemented carbide has been mainly used as a cutting blade for scribing (breaking) an optical fiber cutting blade or a brittle substrate such as glass, ceramic, or semiconductor. For applications in which the cemented carbide is unsatisfactory in life and processing accuracy, a solution is achieved by improving the wear resistance using, for example, a diamond sintered body as shown in Patent Document 1 and Patent Document 2. Diamond sintered body is superior to cemented carbide in wear resistance, but on the other hand, the actual life is not fully utilizing its wear resistance due to diamond particles falling off, etc. . In order to solve this problem, for example, Patent Literature 3 discloses an example in which a ceramic cutting blade is coated with CVD diamond.
特許文献３は、主としてガラス基板の切断用を想定しており、ダイヤモンド膜の膜厚が２０μｍの比較的厚い膜を被覆した例が開示されている。本発明者は、同条件で光ファイバカッタを作製しその性能を検証した結果、刃先が未研磨のままでは刃先Ｒが大きいために切断不可能であったり、切断できても切断面が不規則で光ファイバの融着後に伝送損失を生じたりする場合があることが分かった。さらに刃先を研磨した例では摩擦抵抗が小さいために滑りが生じて光ファイバを切断できないことも判明した。他方、半導体基板等のスクライビングにおいてもその膜厚だけでなく、ダイヤモンド粒径（表面粗さ）によっても、刃先Ｒや滑りの影響により未切断や切断品位の悪化が起きることが分かった。 Patent Document 3 mainly assumes cutting of a glass substrate, and discloses an example in which a relatively thick film having a diamond film thickness of 20 μm is coated. As a result of producing an optical fiber cutter under the same conditions and verifying its performance, the inventor is unable to cut because the blade edge R is large when the blade edge is unpolished, or the cut surface is irregular even if it can be cut. It has been found that transmission loss may occur after fusion of optical fibers. Furthermore, it was also found that in the case where the blade edge was polished, the optical resistance could not be cut due to slippage due to low frictional resistance. On the other hand, it was found that not only in the film thickness but also in the diamond particle size (surface roughness) in the scribing of a semiconductor substrate or the like, uncut or deteriorated cutting quality due to the influence of the cutting edge R or slippage.
本発明は、上記の問題を解決するためになされたもので、光ファイバやガラス基板等の脆性材料を切断あるいはスクライブするための切断刃において、ダイヤモンドの耐摩耗性を十分生かしつつ、かつ滑りや切断品位の悪化を防止できるダイヤモンド被覆切断刃を提供することを目的とする。 The present invention has been made to solve the above problems, and in a cutting blade for cutting or scribing a brittle material such as an optical fiber or a glass substrate, while taking full advantage of the wear resistance of diamond, the present invention has been developed. An object of the present invention is to provide a diamond-coated cutting blade capable of preventing deterioration of cutting quality.
前記課題を解決するため、本発明は以下の態様を有する。
（１）基材と、前記基材の表面を被覆したダイヤモンド層とを含むダイヤモンド被覆切断刃であって、前記切断刃の切れ刃部分におけるダイヤモンド層の平均膜厚が０．５μｍ以上８．０μｍ以下であり、前記ダイヤモンド層の表面におけるダイヤモンド平均粒径が０．５μｍ以上６．０μｍ以下であり、前記ダイヤモンド層の表面は被覆後に平滑化処理がされていないことを特徴とする、ダイヤモンド被覆切断刃。
（２）前記ダイヤモンド層の平均膜厚が１．０μｍ以上５．０μｍ以下であることを特徴とする、上記（１）に記載のダイヤモンド被覆切断刃。
（３）前記ダイヤモンド平均粒径が２．０μｍ以上４．５μｍ以下であることを特徴とする、上記（１）または（２）に記載のダイヤモンド被覆切断刃。
（４）前記切断刃の切れ刃部分におけるダイヤモンド層表面の算術平均粗さＲaが、０．３μｍ以上３．０μｍ以下であることを特徴とする、上記（１）〜（３）のいずれかに記載のダイヤモンド被覆切断刃。
（５）前記基材が、超硬合金、ダイヤモンド焼結体、立方晶窒化ホウ素焼結体、シリコン多結晶、炭化珪素、窒化アルミニウム、及び窒化珪素からなる群より選ばれる一種以上からなることを特徴とする、上記（１）〜（４）のいずれかに記載のダイヤモンド被覆切断刃。
（６）前記ダイヤモンド層は、切れ刃先端から少なくとも５μｍ幅の基材表面上に連続膜として存在し、それ以外の部分はダイヤモンド層が存在しないか、又は不連続なダイヤモンド層であることを特徴とする、上記（１）〜（５）のいずれかに記載のダイヤモンド被覆切断刃。
（７）前記切断刃が回転式であることを特徴とする、上記（１）〜（６）のいずれかに記載のダイヤモンド被覆切断刃。
（８）前記ダイヤモンド層が、多結晶ダイヤモンドからなることを特徴とする、上記（１）〜（７）のいずれかに記載のダイヤモンド被覆切断刃。
（９）前記ダイヤモンド層が、化学気相成長法により形成されていることを特徴とする、上記（１）〜（８）のいずれかに記載のダイヤモンド被覆切断刃。
In order to solve the above problems, the present invention has the following aspects.
(1) A diamond-coated cutting blade including a base material and a diamond layer covering the surface of the base material, wherein an average film thickness of the diamond layer at a cutting edge portion of the cutting blade is 0.5 μm or more and 8.0 μm The diamond coated surface is characterized in that the diamond average particle diameter on the surface of the diamond layer is 0.5 μm or more and 6.0 μm or less, and the surface of the diamond layer is not smoothed after coating. blade.
(2) The diamond-coated cutting blade according to (1) above, wherein an average film thickness of the diamond layer is 1.0 μm or more and 5.0 μm or less.
(3) The diamond-coated cutting blade according to (1) or (2) above, wherein the diamond average particle diameter is 2.0 μm or more and 4.5 μm or less.
(4) Any one of the above (1) to (3), wherein the arithmetic average roughness Ra of the diamond layer surface at the cutting edge portion of the cutting blade is 0.3 μm or more and 3.0 μm or less. Diamond coated cutting blade as described.
(5) The base material comprises at least one selected from the group consisting of cemented carbide, diamond sintered body, cubic boron nitride sintered body, polycrystalline silicon, silicon carbide, aluminum nitride, and silicon nitride. The diamond-coated cutting blade according to any one of (1) to (4) above,
(6) The diamond layer is present as a continuous film on the surface of a substrate having a width of at least 5 μm from the tip of the cutting edge, and the other portions are either a diamond layer or a discontinuous diamond layer. The diamond-coated cutting blade according to any one of (1) to (5) above.
(7) The diamond-coated cutting blade according to any one of (1) to (6), wherein the cutting blade is a rotary type.
(8) The diamond-coated cutting blade according to any one of (1) to (7), wherein the diamond layer is made of polycrystalline diamond.
(9) The diamond-coated cutting blade according to any one of (1) to (8), wherein the diamond layer is formed by a chemical vapor deposition method.
本発明のダイヤモンド被覆切断刃は、上記のような構成を有することにより、光ファイバやガラス基板等の脆性材料を切断あるいはスクライブする際に、空転や滑りなく効率的に切断することができる。加えて高い切断品位を求められる用途においても、加工精度高く、再現性よく切断することができ、ダイヤモンドの高耐摩耗性を最大限に発揮できる。 The diamond-coated cutting blade of the present invention has the above-described configuration, and can efficiently cut without slipping or slipping when a brittle material such as an optical fiber or a glass substrate is cut or scribed. In addition, even in applications where high cutting quality is required, cutting can be performed with high processing accuracy and reproducibility, and the high wear resistance of diamond can be maximized.
以下、本発明についてさらに詳細に説明する。
本発明者らは、ダイヤモンドを被覆した光ファイバカッタにおけるダイヤモンド層の状態と、切断性能の関係を詳細に調査した。その結果、以下の知見が得られた。
１）ダイヤモンド被覆後の切れ刃先端Ｒが８．０μｍを超えると、未切断確率が急上昇し、切断できたものについても、その切断面が不規則で融着後の伝送損失が上昇する。
２）切れ刃先端Ｒが８．０μｍ以下であっても、表面ダイヤモンドの粒径が０．５μｍより小さいいわゆる「微粒（微結晶）ダイヤモンド」であったり、ダイヤモンド被覆後に表面を研磨等で加工して平坦化したりしてしまうと、切断刃の空転や滑りが生じ、切断できなくなる。
３）上記２条件をクリアしても、表面ダイヤモンドの平均粒径が６．０μｍを超えると、切断面の品位が悪化して融着後の伝送損失が上昇する。
Hereinafter, the present invention will be described in more detail.
The present inventors have investigated in detail the relationship between the state of the diamond layer in the optical fiber cutter coated with diamond and the cutting performance. As a result, the following knowledge was obtained.
1) When the cutting edge tip R after diamond coating exceeds 8.0 μm, the probability of non-cutting increases rapidly, and even those that can be cut have irregular cut surfaces and increase transmission loss after fusion.
2) Even when the cutting edge tip R is 8.0 μm or less, the surface diamond is smaller than 0.5 μm, so-called “fine-grained diamond”, or the surface is processed by polishing or the like after coating with diamond. If flattened, the cutting blade will slip and slip, making it impossible to cut.
3) Even if the above two conditions are satisfied, if the average particle diameter of the surface diamond exceeds 6.0 μm, the quality of the cut surface deteriorates and the transmission loss after fusion increases.
本発明は上記知見に基づき得られたものであり、切断刃ダイヤモンド層の膜厚が０．５μｍ以上８．０μｍ以下であり、ダイヤモンド層の表面におけるダイヤモンド平均粒径が０．５μｍ以上６．０μｍ以下であり、前記ダイヤモンド層の表面は被覆後に平滑化処理がされていないことを特徴とする。上記の特徴を備えたダイヤモンド被覆切断刃は、微粒ダイヤモンドとは異なり、ダイヤモンド粒子個体の結晶稜線（凹凸）で被削材を捉え、滑りや空転を誘発することなく効率的に切断力を伝達することができる。また、切れ刃先端Ｒ、即ちダイヤモンド膜厚を適切な範囲に抑えることで、未切断片や、切断面加工品位ばらつきの発生を抑制することができる。この結果、例えば光ファイバの切断では伝送損失を最小限に留めることが可能になり、脆性基板のスクライビングでは加工後の後処理工程を減らすことができる。このような切断刃の形状は、固定式、回転式どちらでも効果が得られるが、特に回転式の切断刃では本発明の効果が顕著となる。
なお、本願で述べる「平滑化処理がされていない」とは、機械的な研磨、研削、ホーニング、ブラシ処理、あるいはドライ／ウェットエッチング等により切断刃近傍のダイヤモンド粒子表面凹凸が失われていない状態を表している。すなわち、前記例示した処理等が仮に行われていたとしても、表面ダイヤモンド粒子による凹凸が残存している状態は、「平滑化処理がされていない」、つまり本願発明範囲に含まれる。
The present invention has been obtained on the basis of the above-mentioned knowledge. The film thickness of the cutting blade diamond layer is 0.5 μm or more and 8.0 μm or less, and the diamond average particle size on the surface of the diamond layer is 0.5 μm or more and 6.0 μm. The surface of the diamond layer is not smoothed after coating. A diamond-coated cutting blade with the above characteristics, unlike fine-grained diamond, captures the work material with the crystal ridges (irregularities) of the individual diamond particles and efficiently transmits the cutting force without inducing slippage or slipping. be able to. In addition, by suppressing the cutting edge tip R, that is, the diamond film thickness within an appropriate range, it is possible to suppress the occurrence of uncut pieces and variations in cut surface processing quality. As a result, for example, it becomes possible to minimize transmission loss when cutting an optical fiber, and post-processing steps after processing can be reduced when scribing a brittle substrate. Such a cutting blade shape can be obtained by either a fixed type or a rotary type, but the effect of the present invention is particularly remarkable in a rotary type cutting blade.
As used herein, “not smoothed” means that the surface roughness of the diamond particles near the cutting blade is not lost by mechanical polishing, grinding, honing, brushing, dry / wet etching, or the like. Represents. That is, even if the above-described processing is performed, the state in which the unevenness due to the surface diamond particles remains is “not smoothed”, that is, within the scope of the present invention.
上記ダイヤモンド層の膜厚及び粒径は、前記記載範囲内にあれば本発明で目的とする効果が期待できるが、好ましくは膜厚が１．０μｍ以上５．０μｍ以下、粒径が２．０μｍ以上４．５μｍ以下であることが望ましい。また、切れ刃部分におけるダイヤモンド層表面の算術平均粗さＲaは、０．３μｍ以上３．０μｍ以下であることが望ましい。膜厚、粒径、及び粗さを前記範囲内とすることにより、本発明で目的とする切断をより高いレベルで実現することができる。 If the film thickness and particle size of the diamond layer are within the above described range, the intended effect of the present invention can be expected, but preferably the film thickness is 1.0 μm or more and 5.0 μm or less, and the particle size is 2.0 μm. It is desirable that it is above 4.5 micrometer. In addition, the arithmetic average roughness Ra of the diamond layer surface at the cutting edge portion is desirably 0.3 μm or more and 3.0 μm or less. By setting the film thickness, particle size, and roughness within the above ranges, the target cutting in the present invention can be realized at a higher level.
ダイヤモンド層表面の粗さを測定する方法としては、ＩＳＯ規格又はＪＩＳ規格に準拠したパラメータ解析ができる装置を使用すればよい。特にレーザー顕微鏡は空間分解能が高い上に数値解析が容易なため、本発明のダイヤモンド被覆表面を測定するのに適している。本明細書におけるＲaは、レーザー波長４０８ｎｍ、水平方向の空間分解能１２０ｎｍ、高さ分解能１０ｎｍのレーザー顕微鏡を用いて測定して得られた値である。 As a method for measuring the roughness of the diamond layer surface, an apparatus capable of performing parameter analysis based on the ISO standard or the JIS standard may be used. In particular, a laser microscope is suitable for measuring the diamond-coated surface of the present invention because of its high spatial resolution and easy numerical analysis. Ra in the present specification is a value obtained by measurement using a laser microscope having a laser wavelength of 408 nm, a horizontal spatial resolution of 120 nm, and a height resolution of 10 nm.
本発明で規定するダイヤモンド層の膜厚及び粒径は、被覆後に走査型電子顕微鏡（ＳＥＭ）で表面や膜断面を観察することで得られる。これらは切断刃に関わる領域の平均値で定義されるが、切断刃全領域を測定することが困難な場合は一部領域の平均値でも同様と見なすことができる。一方、Ｒaは切断刃の全領域において本願発明範囲である必要はなく、一部でも本発明で規定する範囲内にあれば目的とする効果が発現される。 The film thickness and particle size of the diamond layer defined in the present invention can be obtained by observing the surface and film cross section with a scanning electron microscope (SEM) after coating. These are defined by the average value of the area related to the cutting blade. However, when it is difficult to measure the entire area of the cutting blade, the average value of a part of the area can be regarded as the same. On the other hand, Ra does not need to be within the scope of the present invention in the entire area of the cutting blade, and if it is partially within the range defined by the present invention, the intended effect is exhibited.
本発明のダイヤモンド被覆切断刃に用いる基材としては、従来公知の任意材料を用いることができるが、特に好適なのは超硬合金又はセラミックであり、超硬合金であればＫ種超硬が、セラミックであれば窒化珪素が望ましい。その他、ダイヤモンド焼結体、立方晶窒化ホウ素焼結体、シリコン多結晶、炭化珪素、及び窒化アルミニウムからなる群より選ばれる１種以上から選択することもできる。ダイヤモンド被覆前の基材に対しては、膜の密着性あるいは耐欠損性向上のために、従来公知の技術を用いることができる。例えば超硬合金に対しては、化学エッチング、電気化学エッチング、又はサンドブラスト処理等により凹凸を形成した後、ダイヤモンド粉末分散液中でダイヤモンド種付け処理を行うことが好ましい。 As the base material used for the diamond-coated cutting blade of the present invention, any conventionally known material can be used, and particularly preferable is a cemented carbide or ceramic. If so, silicon nitride is desirable. In addition, it can also be selected from one or more selected from the group consisting of a diamond sintered body, a cubic boron nitride sintered body, silicon polycrystal, silicon carbide, and aluminum nitride. For the base material before diamond coating, conventionally known techniques can be used in order to improve film adhesion or fracture resistance. For example, it is preferable that a cemented carbide alloy is subjected to diamond seeding treatment in a diamond powder dispersion after forming irregularities by chemical etching, electrochemical etching, sandblasting or the like.
前記ダイヤモンド層は、切れ刃先端から少なくとも５μｍ幅の基材表面上に連続膜として存在していればよく、それ以外の部分はダイヤモンド層が存在しないか、又は不連続なダイヤモンド層であることが望ましい。ダイヤモンド被覆切断刃においては、その作用領域は切断刃近傍に限られ、それ以外の基材領域は切断に寄与することなく、ダイヤモンドを完全に被覆する必要性はない。むしろ、全領域被覆することにより、切断時の応力による膜剥離や、切断刃固定（例えば回転軸）部分の損傷を引き起こす恐れがある。 The diamond layer only needs to be present as a continuous film on the surface of the substrate having a width of at least 5 μm from the tip of the cutting edge, and the other part may be a diamond layer or a discontinuous diamond layer. desirable. In the diamond-coated cutting blade, the working region is limited to the vicinity of the cutting blade, and the other base material regions do not contribute to cutting, and it is not necessary to completely cover the diamond. Rather, covering the entire area may cause film peeling due to stress during cutting and damage to the cutting blade fixing (for example, the rotating shaft).
さらに、本発明では適度なサイズのダイヤモンド粒径が必要であり、これは例えば、ダイヤモンド被覆時の切断刃近傍のダイヤモンド核発生密度を、基材表面平均で１×１０8個／ｃｍ2以下に抑制することで得られる。切断刃近傍は、ダイヤモンド核発生密度が相対的に高く連続膜になるが、それ以外の領域では核発生密度が低く不連続膜になることで、上記の効果を得ることができる。核発生密度を制御する方法としては、上記に例示したダイヤモンド種付け処理におけるダイヤモンド粉末濃度、処理時間を調整したり、ダイヤモンド被覆初期の成長条件を調整したりすることで所望の核発生密度が得られる。また、切断刃以外の部分にダイヤモンドが被覆されないようにマスク等を配置してもよい。核発生密度は、ダイヤモンド被覆時初期に成長を中断してダイヤモンド核を計数すれば求められるが、被覆が完了した切断刃においては、その断面を収束イオンビーム装置等で切り取り、透過型電子顕微鏡（ＴＥＭ）で観察すれば、核発生粒界が特定できて計数可能である。 Furthermore, in the present invention, a diamond particle size of an appropriate size is required. For example, the diamond nucleus generation density in the vicinity of the cutting blade at the time of diamond coating is 1 × 10 8 pieces / cm 2 or less on the average surface of the substrate. It is obtained by suppressing. In the vicinity of the cutting blade, the diamond nucleation density is relatively high and becomes a continuous film. In other regions, the nucleation density is low and the film becomes a discontinuous film, so that the above effect can be obtained. As a method for controlling the nucleation density, a desired nucleation density can be obtained by adjusting the diamond powder concentration and the treatment time in the diamond seeding process exemplified above or by adjusting the growth conditions at the initial stage of diamond coating. . Further, a mask or the like may be arranged so that a portion other than the cutting blade is not covered with diamond. The nucleation density can be obtained by interrupting the growth at the initial stage of diamond coating and counting the diamond nuclei. However, the cutting blade that has been coated is cut with a focused ion beam device or the like to obtain a transmission electron microscope ( If observed with TEM), the nucleation grain boundaries can be identified and counted.
本発明において、基材上に形成されるダイヤモンド層は、多結晶ダイヤモンドからなる膜であることが好ましい。また、多結晶ダイヤモンド層を被覆する方法としてはＣＶＤ法を用いることが好ましい。ＣＶＤ法には、熱フィラメントＣＶＤ法、マイクロ波プラズマＣＶＤ法、直流プラズマＣＶＤ法等、公知の任意の手法を用いることができる。 In the present invention, the diamond layer formed on the substrate is preferably a film made of polycrystalline diamond. Moreover, it is preferable to use the CVD method as a method for coating the polycrystalline diamond layer. As the CVD method, any known method such as a hot filament CVD method, a microwave plasma CVD method, a direct current plasma CVD method, or the like can be used.
以下、実施例により本願発明をさらに詳細に説明する。
［実施例１］
ダイヤモンド被覆切断刃の作製にあたり、基材として材質がＪＩＳ Ｋ１０超硬合金（ＷＣ-５％Ｃo）であって、住友電気工業製光ファイバカッタＦＣ-７Ｒに搭載可能な、直径２０ｍｍ、厚さ３ｍｍの円形刃を用意した（図１）。
Hereinafter, the present invention will be described in more detail by way of examples.
[Example 1]
For the production of diamond coated cutting blades, the material is JIS K10 cemented carbide (WC-5% Co) and can be mounted on Sumitomo Electric's optical fiber cutter FC-7R. Diameter 20mm, thickness 3mm A circular blade was prepared (FIG. 1).
まず、基材の前処理として、９８％硫酸と６０％硝酸の混酸に５分間浸すことで基材の表面をエッチングした。この結果、基材表面近傍のＣoが除去され、微小な凹凸が形成された。続いて、粒径５〜１０ｎｍサイズのダイヤモンド粒子をエタノール中に０．０２ｇ／Ｌで分散させ、基体を浸漬して５分間の超音波種付け処理を行った。 First, as a pretreatment of the substrate, the surface of the substrate was etched by immersing in a mixed acid of 98% sulfuric acid and 60% nitric acid for 5 minutes. As a result, Co in the vicinity of the substrate surface was removed, and minute irregularities were formed. Subsequently, diamond particles having a particle size of 5 to 10 nm were dispersed in ethanol at 0.02 g / L, the substrate was immersed, and an ultrasonic seeding treatment was performed for 5 minutes.
次に、基材を公知の熱フィラメントＣＶＤ装置内に配置して、ダイヤモンドの被覆を行った。基材中心の回転軸部分や、及び切れ刃近傍以外の領域にダイヤモンドが被覆されないように基材上には円盤状のマスク材を配置した。ダイヤモンド被覆のための導入ガスは１％ＣＨ4／Ｈ2とし、その内部の圧力は１．３×１０4Ｐaに設定した。被覆時の基材温度は９００℃、フィラメント温度は２１５０℃、被覆時間３時間として実施例１の試料を作製した。図２に、ダイヤモンド被覆後ファイバカッタの切れ刃外周方向から撮影したＳＥＭ像を示す。 Next, the base material was placed in a known hot filament CVD apparatus to perform diamond coating. A disk-shaped mask material was arranged on the base material so that diamond would not be coated on the rotation axis part at the center of the base material and the region other than the vicinity of the cutting edge. The introduced gas for diamond coating was 1% CH 4 / H 2 , and the internal pressure was set to 1.3 × 10 4 Pa. The sample of Example 1 was prepared with the substrate temperature at the time of coating being 900 ° C., the filament temperature being 2150 ° C., and the coating time being 3 hours. FIG. 2 shows an SEM image taken from the outer peripheral direction of the cutting edge of the fiber cutter after diamond coating.
［実施例２〜６、比較例１〜７］
実施例２〜６及び比較例１〜７として、表１に示すように、前処理の種付け条件や、ガス／温度条件、被覆時間、マスクの配置等を変更して種々のダイヤモンド膜厚、粒径、表面粗さの試料を作製した。また、得られたダイヤモンド層をＸ線回折法で測定したところ、全て多結晶ダイヤモンドであることを確認した。
[Examples 2-6, Comparative Examples 1-7]
As Examples 2-6 and Comparative Examples 1-7, as shown in Table 1, various diamond film thicknesses and grains can be obtained by changing the pretreatment seeding conditions, gas / temperature conditions, coating time, mask arrangement, etc. Samples of diameter and surface roughness were prepared. Moreover, when the obtained diamond layer was measured by the X ray diffraction method, it confirmed that all were polycrystalline diamond.
（評価）
得られた試料は、ＳＥＭ、ＴＥＭ、レーザー顕微鏡で種々特性を評価した後、上記光ファイバカッタＦＣ-７Ｒに搭載し、該カタログに記載される標準的な８芯テープ光ファイバを用いた切断試験を行った。切断試験では一定数毎に切断状態や８芯平均接続（融着）損失を確認した。各実施例、比較例毎の種々特性及び切断結果をまとめたものを表１に示す。
(Evaluation)
The obtained sample was evaluated for various characteristics by SEM, TEM, and laser microscope, then mounted on the optical fiber cutter FC-7R, and a cutting test using a standard 8-core tape optical fiber described in the catalog. Went. In the cutting test, the cutting state and the 8-core average connection (fusion) loss were confirmed every certain number. Table 1 shows a summary of various characteristics and cutting results for each example and comparative example.
表２に示されるように、本発明の実施例は、比較例１に示す従来材料である超硬ノンコート製のものよりも長寿命であり、伝送損失も実用上問題となるものはなかった。これに対し、膜厚及び粒径が本発明より大きい比較例２では、実施例１より切断寿命が短くなっただけでなく、接続損失が大きく切断品位が悪いことがわかった。 As shown in Table 2, the examples of the present invention had a longer life than the conventional material made of cemented carbide non-coating shown in Comparative Example 1, and there was no practical problem with transmission loss. On the other hand, it was found that in Comparative Example 2 where the film thickness and particle size were larger than those of the present invention, not only the cutting life was shorter than in Example 1, but also the connection loss was large and the cutting quality was poor.
比較例３は本発明よりも膜厚、粒径が小さいもので、比較例４は粒径が小さいままダイヤモンドを厚膜化したものである。比較例５および６は膜厚又は粒径のいずれかが本願範囲を外れた物である。比較例７は実施例１に相当する試料に対して、ダイヤモンド被覆後に切断刃近傍を研磨仕上げしたものである。比較例３、４，及び７は切れ刃の凹凸が小さくなり、ダイヤモンドの低摩擦係数の影響で、加工時に滑りが生じてファイバを切断できなかった。比較例５は粒径が大きくなったことで切断品位の悪化が認められ、比較例６では刃先Ｒ拡大の影響で切断が不可能になった。 Comparative Example 3 has a smaller film thickness and particle size than those of the present invention, and Comparative Example 4 has a thick diamond film with a small particle size. In Comparative Examples 5 and 6, either the film thickness or the particle diameter is out of the scope of the present application. In Comparative Example 7, the vicinity of the cutting blade was polished for the sample corresponding to Example 1 after diamond coating. In Comparative Examples 3, 4, and 7, the unevenness of the cutting edge was reduced, and due to the low friction coefficient of diamond, slip occurred during processing and the fiber could not be cut. In Comparative Example 5, the cutting quality was deteriorated due to the increase in particle size, and in Comparative Example 6, cutting was impossible due to the influence of the cutting edge R enlargement.
また、本実施例の基材を、窒化珪素、ダイヤモンド焼結体、立方晶窒化ホウ素焼結体、シリコン多結晶、炭化珪素、及び窒化アルミニウムに変更して同様の試験を実施したところ、上記実施例１から６と同様の結果が得られた。 In addition, when the base material of this example was changed to silicon nitride, diamond sintered body, cubic boron nitride sintered body, silicon polycrystal, silicon carbide, and aluminum nitride, the same test was performed. Similar results as in Examples 1 to 6 were obtained.
［実施例７］
次に、ガラス板用回転式切断刃の例として、直径３ｍｍ、厚さ０．８ｍｍの超硬合金製ホイールを用意した。超硬合金は平均ＷＣ粒径１．５μｍ、Ｃo量６％のＫ２０種とし、切れ刃の角度は１２０°とした。基材の前処理は実施例１と同様とした。基材を公知のマイクロ波プラズマＣＶＤ装置内に配置して、ダイヤモンドの被覆を行った。基材中心の回転軸部分や、及び切れ刃近傍以外の領域にダイヤモンドが被覆されないように基材上には円盤状のマスク材を配置した。ダイヤモンド被覆のための導入ガスは０．８％ＣＨ4／Ｈ2とし、その内部の圧力は６．７×１０3Ｐaに設定した。被覆時の基材温度は８８０℃、マイクロ波投入電力３ｋＷ、被覆時間６時間として実施例７の試料を作製した。
得られたダイヤモンド層をＸ線回折法で測定したところ、多結晶ダイヤモンドであることを確認した。さらに、ＳＥＭ、ＴＥＭ及びレーザー顕微鏡で評価したところ、膜厚４．６μｍ、粒径３．８μｍ、Ｒa２．１μｍ、核発生密度９．５×１０7個／ｃｍ２であった。
[Example 7]
Next, as an example of the rotary cutting blade for glass plate, a hard alloy wheel having a diameter of 3 mm and a thickness of 0.8 mm was prepared. The cemented carbide was K20 with an average WC particle size of 1.5 μm and a Co content of 6%, and the angle of the cutting edge was 120 °. The substrate pretreatment was the same as in Example 1. The substrate was placed in a well-known microwave plasma CVD apparatus and coated with diamond. A disk-shaped mask material was arranged on the base material so that diamond would not be coated on the rotation axis part at the center of the base material and the region other than the vicinity of the cutting edge. The gas introduced for diamond coating was 0.8% CH 4 / H 2 , and the internal pressure was set to 6.7 × 10 3 Pa. The sample of Example 7 was prepared by setting the substrate temperature at the time of coating to 880 ° C., the microwave input power of 3 kW, and the coating time of 6 hours.
When the obtained diamond layer was measured by X-ray diffraction, it was confirmed to be polycrystalline diamond. Furthermore, when evaluated by SEM, TEM and laser microscope, the film thickness was 4.6 μm, the particle size was 3.8 μm, Ra was 2.1 μm, and the nucleus generation density was 9.5 × 10 7 pieces / cm 2 .
［比較例８〜１０］
比較例として実施例７と同様のダイヤモンドを被覆し、被覆後表面を研磨して鏡面化した物（比較例８）、市販の焼結ダイヤモンド切断刃（比較例９）、及び市販の超硬ノンコート切断刃（比較例１０）の３つを用意した。
[Comparative Examples 8 to 10]
As a comparative example, the same diamond as in Example 7 was coated, and the coated surface was polished to a mirror surface (Comparative Example 8), a commercially available sintered diamond cutting blade (Comparative Example 9), and a commercially available carbide non-coated Three cutting blades (Comparative Example 10) were prepared.
（評価）
こうして得られた実施例７及び比較例８〜１０の切断刃を、市販のスクライビング装置に搭載し、液晶パネル用ガラス板（厚さ０．６ｍｍ）のスクライビングを行った。
加工結果を表２に示す。
(Evaluation)
The cutting blades of Example 7 and Comparative Examples 8 to 10 thus obtained were mounted on a commercially available scribing device, and a glass plate for liquid crystal panel (thickness 0.6 mm) was scribed.
Table 2 shows the processing results.
表２に示したとおり、ダイヤモンド被覆切断刃は従来製切断刃より長寿命で安定して切断することが可能であった。
また、基材を窒化珪素、ダイヤモンド焼結体、立方晶窒化ホウ素焼結体、シリコン多結晶、炭化珪素、及び窒化アルミニウムに変更して同様の試験を実施したところ、上記実施例６と同様の結果が得られた。
As shown in Table 2, the diamond-coated cutting blade has a longer life than the conventional cutting blade and can be stably cut.
Further, when the same test was carried out by changing the base material to silicon nitride, diamond sintered body, cubic boron nitride sintered body, silicon polycrystal, silicon carbide, and aluminum nitride, the same as in Example 6 above. Results were obtained.
以上説明したように、本発明のダイヤモンド被覆切断刃はダイヤモンド本来の耐摩耗性を生かして、長寿命で高品位に脆性材料を切断できることがわかった。 As described above, it has been found that the diamond-coated cutting blade of the present invention can cut a brittle material with a long life and high quality by utilizing the wear resistance inherent in diamond.
本発明のダイヤモンド被覆切断刃は、特に光ファイバの切断や、ガラス・セラミック・半導体等の脆性材料のスクライブに好ましく用いることができる。 The diamond-coated cutting blade of the present invention can be preferably used for cutting optical fibers and scribing brittle materials such as glass, ceramics and semiconductors.
１ 基材
２ 切れ刃
３ ダイヤモンド連続膜領域
４ 不連続ダイヤモンド層
1 Base Material 2 Cutting Edge 3 Diamond Continuous Film Region 4 Discontinuous Diamond Layer
Claims (9)
前記切断刃の切れ刃部分におけるダイヤモンド層の平均膜厚が０．５μｍ以上８．０μｍ以下であり、
前記ダイヤモンド層の表面におけるダイヤモンド平均粒径が０．５μｍ以上６．０μｍ以下であり、
前記ダイヤモンド層の表面は被覆後に平滑化処理がされていないことを特徴とする、ダイヤモンド被覆切断刃。 A diamond-coated cutting blade comprising a base material and a diamond layer covering the surface of the base material,
The average film thickness of the diamond layer at the cutting edge portion of the cutting blade is 0.5 μm or more and 8.0 μm or less,
The diamond average particle diameter on the surface of the diamond layer is 0.5 μm or more and 6.0 μm or less,
A diamond-coated cutting blade, wherein the surface of the diamond layer is not smoothed after coating.
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| WO2013133030A1 (en) * | 2012-03-08 | 2013-09-12 | 三星ダイヤモンド工業株式会社 | Scribing wheel and method for manufacturing same |
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| JP2017052281A (en) * | 2016-10-31 | 2017-03-16 | 三星ダイヤモンド工業株式会社 | Scribing wheel |
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