JP2011124139A - Electronic component, module and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component module having superior reliability, and to provide an electronic equipment. <P>SOLUTION: An illumination fixture 1 (electronic equipment) has: a substrate 8 in which a resin material is impregnated into a fibrous base material constituted by having an organic material as the main material; a plurality of light-emitting devices 9 which are mounted on the substrate 8 and accompanied with heat generation by energization; and a plate-like heat dissipating member 10 to mount the plurality of light-emitting devices 9 together with the substrate 8. A linear expansion coefficient in a direction parallel to a plate face of the heat dissipating member 10 is larger than the linear expansion coefficient in the same direction of the light-emitting devices 9. Moreover, the substrate 8 has flexibility to follow thermal deformation in the direction parallel to the plate face of the heat dissipating member 10. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component module and an electronic device.

  In an electronic component module including an electronic component such as a chip component, the electronic component is usually mounted (mounted) on a substrate (see, for example, Patent Document 1).

  For example, the lighting fixture (electronic device) disclosed in Patent Document 1 includes a module in which a light emitting device (electronic component) including a light emitting diode is directly mounted on one surface of a substrate. Thereby, it is possible to energize the light emitting device through the wiring provided on the substrate.

  The light emitting diode element generates heat with light emission, but the heat causes the light emitting device and the substrate to thermally expand.

  In general, the linear thermal expansion coefficient of the substrate is larger than that of the light emitting device, and the difference is large. For this reason, conventionally, excessive stress due to a difference in thermal expansion is generated between the substrate and the light emitting device due to the heat generation as described above, and a joint portion such as solder joining the substrate and the light emitting device may be damaged. Moreover, if the temperature rises and falls repeatedly, the joint may be fatigued and damaged.

JP 2009-93926 A

  An object of the present invention is to provide an electronic component module and an electronic apparatus having excellent reliability.

Such an object is achieved by the present invention described in the following (1) to (17).
(1) a first substrate obtained by impregnating a resin material into a fiber base material composed mainly of an organic material;
An electronic component mounted on the first board and generating heat when energized;
An electronic component module comprising: a second substrate on which the electronic component is mounted together with the first substrate.

  (2) The electronic component module according to (1), wherein a linear expansion coefficient in a direction parallel to the plate surface of the second substrate is larger than a linear thermal expansion coefficient in the same direction of the electronic component.

  (3) The electronic component module according to (2), wherein the first substrate has flexibility so as to follow thermal deformation in a direction parallel to a plate surface of the second substrate.

  (4) The electronic component module according to (3), wherein the elastic modulus of the first substrate is 5000 to 15000 MPa.

(5) The electronic component module according to (3) or (4), wherein a linear expansion coefficient in the surface direction of the first substrate is 10 to 25 [× 10 ⁻⁶ / ° C.].

  (6) A first wiring electrically connected to the electronic component is provided on the first substrate, and a second wiring electrically connected to the first wiring is provided on the second substrate. The electronic component module according to any one of (1) to (5), wherein two wirings are provided.

  (7) The first wiring is provided near a surface of the first substrate on the second substrate side, and the second wiring is a surface of the second substrate on the first substrate side. The electronic component module according to (6), which is provided in the vicinity.

  (8) The electronic component module according to (7), wherein the electronic component is provided on the second substrate side of the first substrate.

  (9) The electronic component module according to (7) or (8), wherein the first wiring is connected to the second wiring through solder.

  (10) The first substrate, the electronic component, and the second substrate are accommodated in a housing, and the first substrate is supported by the housing. The electronic component module according to any one of the above.

  (11) The electronic component module according to (10), wherein the second substrate has a function of radiating heat from the electronic component.

  (12) The electronic component module according to (11), wherein the second substrate is made of a metal material.

  (13) The electronic component module according to any one of (1) to (12), wherein the fiber base material includes pulp as a main material.

  (14) The electronic component module according to any one of (1) to (13), wherein the resin material includes a curable resin as a main material.

  (15) The electronic component module according to (14), wherein the resin material includes a phenol resin as a main material.

  (16) The electronic component module according to any one of (1) to (15), wherein the electronic component is a light emitting device including a light emitting diode element.

  (17) An electronic apparatus comprising the electronic component module according to any one of (1) to (16).

  According to the electronic component module of the present invention, even if the thermal expansion difference between the electronic component and the second substrate is large due to heat generation of the electronic component, the stress generated between them due to the thermal expansion difference is the first. The substrate can be relaxed. Therefore, it is possible to prevent damage to the joint portion between the first substrate and the electronic component and the joint portion between the first substrate and the second substrate due to the difference in thermal expansion. As a result, the electronic component module according to the present invention has excellent reliability.

  In addition, the electronic apparatus of the present invention provided with such an electronic module having excellent reliability also has excellent reliability.

It is a figure which shows the external appearance of the lighting fixture (light source device) concerning 1st Embodiment of this invention. It is sectional drawing which shows schematic structure of the lighting fixture shown in FIG. It is a partial expanded sectional view for demonstrating the principal part (electronic component module) of the lighting fixture shown in FIG. FIG. 3 is a plan view (a view seen from the heat radiating member side) for explaining a substrate (first substrate) and a light emitting device (electronic component) provided in the lighting fixture shown in FIG. 2. It is a top view (figure seen from the board | substrate side) for demonstrating the heat radiating member (2nd board | substrate) with which the lighting fixture shown in FIG. 2 was equipped. It is a top view for demonstrating the board | substrate (1st board | substrate) and the light-emitting device (electronic component) with which the lighting fixture concerning 2nd Embodiment of this invention was equipped. It is a top view for demonstrating the heat radiating member (2nd board | substrate) with which the lighting fixture concerning 2nd Embodiment of this invention was equipped.

  Hereinafter, embodiments of the present invention will be described with reference to the accompanying drawings. In addition, below, the example which applied the electronic device of this invention to the lighting fixture is demonstrated.

<First Embodiment>
FIG. 1 is a diagram showing an appearance of a lighting fixture (electronic device) according to a first embodiment of the present invention, FIG. 2 is a cross-sectional view showing a schematic configuration of the lighting fixture shown in FIG. 1, and FIG. FIG. 4 is a partially enlarged cross-sectional view for explaining a main part (electronic component module) of the illustrated lighting fixture. FIG. 4 shows a substrate (first substrate) and a light emitting device (electronic component) provided in the lighting fixture shown in FIG. FIG. 5 is a plan view (viewed from the heat dissipation member side) for explanation, and FIG. 5 is a plan view (viewed from the substrate side) for explaining the heat dissipation member (second substrate) provided in the lighting fixture shown in FIG. Figure). In the following description, for convenience of explanation, the upper side in FIGS. 1 to 3 is referred to as “upper” and the lower side is referred to as “lower”. For convenience of explanation, the insulating layer 82 is not shown in FIG. 4, and the insulating layers 102 and 104 are not shown in FIG. 5.

  A lighting fixture 1 shown in FIG. 1 is a light bulb-type lighting fixture, and includes a main body 2 that is a light source device, a base 3, and a cover 4.

  The main body 2 includes a housing 5 having a substantially cylindrical shape. The housing 5 is provided with a base 3 at one end (the lower end in FIG. 1), and the other end (see FIG. 1). 1 is provided with a translucent cover 4 so as to cover the opening.

  Further, as shown in FIG. 2, a light source unit 6, which is an electronic component module including a substrate 8, a plurality of light emitting devices 9 and a heat radiating member 10, and a power supply unit 7 are housed in the housing 5.

  The power supply unit 7 includes a substrate 71 and an electronic component 72 provided on the substrate 71, and is electrically connected to the base 3 via a wiring 73 (lead wire). Further, the substrate 71, the electronic component 72, and the like are accommodated in an insulating casing 74 made of a resin material, and insulation between the housing 5 and the housing 5 is ensured.

  The power supply unit 7 has a function of converting power supplied from the base 3 into power suitable for light emission of the plurality of light emitting devices 9 (for example, converting AC voltage 100V to DC voltage 24V).

  Moreover, it is preferable that the casing 74 of the power supply unit 7 also has heat insulation. Thereby, conduction to the light source unit 6 due to heat from the power supply unit 7 can be prevented, and the temperature rise of the light emitting device 9 can be more reliably suppressed.

  The base 3 is defined by the JIS standard or the like, and is attached to a light bulb socket (not shown), and receives power supply from a commercial power source or the like.

  The cover 4 is made of a transparent resin material or glass material. The cover 4 may be subjected to a process such as an uneven process for diffusing light from the light emitting device 9. The cover 4 may be provided with a phosphor that emits light when excited by light from the light emitting device 9.

  In such a luminaire 1, the power supply unit 7 that is supplied with power from a commercial power source (not shown) through the base 3 lights up the plurality of light emitting devices 9, and the light is emitted to the outside through the cover 4. . At this time, each light-emitting device 9 generates heat as the light is emitted, but the heat is radiated to the outside by the heat radiating member 10 and the housing 5.

Hereinafter, each part which comprises the main body 2 of the lighting fixture 1 is demonstrated in detail sequentially.
(housing)
The housing 5 has an annular shape in cross section, and includes a main body portion 51 and a reduced diameter portion 52 having a diameter smaller than that of the main body portion 51.

  The shape of the housing 5 is not limited to the above as long as it can accommodate the substrate 8, the LED 7, and the heat radiating member 10. For example, when the housing 5 has an annular cross section, the inner shape and outer shape thereof may be a polygonal shape such as a triangular shape, a quadrangular shape, or a pentagonal shape, an elliptical shape, or an irregular shape, respectively. The inner shape and the outer shape may be the same or different. Further, when the housing 5 has a cylindrical shape, the size and shape of the cross section may be constant or different in the axial direction.

  The constituent material of the housing 5 is not particularly limited. For example, a metal material, a ceramic material, a resin material, or the like can be used. From the viewpoint of improving the heat dissipation of the heat dissipation member 10 as described later, the heat dissipation member. As in 10, it is preferable to use a material excellent in heat dissipation.

  In the main body 51 of the housing 5, the heat radiating member 10 supported by the housing 5, the substrate 8 supported by the heat radiating member 10, and a plurality of light emitting devices 9 supported by the substrate 8 are accommodated. ing.

  That is, the substrate 8, the plurality of light emitting devices 9, and the heat radiating member 10 are accommodated in the main body 51 of the housing 5 in a state where the plurality of light emitting devices 9 mounted on the substrate 8 are mounted on the heat radiating member 10 together with the substrate 8. In addition, the heat dissipation member 10 is supported by the housing 5.

(substrate)
The substrate 8 is a substrate on which a plurality of (four in this embodiment) light emitting devices 9 are mounted (directly mounted).

  In the present embodiment, the substrate 8 has a disk shape (annular shape), and a plurality of light emitting devices 9 are mounted at equal intervals in the circumferential direction as will be described later. Note that the shape of the substrate 8 is not limited to a disk shape, and is determined according to the shape of the internal space of the housing 5, the arrangement and number of the light emitting devices 9, and the like, and is arbitrary. Therefore, the planar view shape of the substrate 8 is not limited to a circle, and may be, for example, a polygonal shape such as a triangular shape, a quadrangular shape, or a pentagonal shape, an elliptical shape, or a different shape.

  Such a substrate 8 is obtained by impregnating a resin material into a fiber base material composed mainly of an organic material (first substrate). Such a substrate 8 is relatively flexible.

  Therefore, even if a difference in thermal expansion occurs between the light emitting device 9 and the heat radiating member 10 due to heat generation of the light emitting device 9 described later, the substrate 8 can relieve stress generated between them due to the difference in thermal expansion. . Therefore, it is possible to prevent the junction between the substrate 8 and the light emitting device 9 and the junction between the substrate 8 and the heat dissipation member 10 from being damaged due to the difference in thermal expansion. As a result, the light source unit 6 according to the present invention has excellent reliability.

  Examples of fiber base materials composed mainly of organic materials include, for example, polyamide resin fibers, aromatic polyamide resin fibers, wholly aromatic polyamide resin fibers, and the like, polyester resin fibers, aromatic polyester resin fibers, Synthetic fiber substrate composed of polyester resin fiber such as wholly aromatic polyester resin fiber, polyimide resin fiber, fluororesin fiber, etc., woven fabric or non-woven fabric, kraft paper, cotton linter paper, linter and kraft pulp And pulp fibers (paper base material) mainly composed of a mixed paper or the like.

  Among these, as such a fiber base material, it is more preferable to use pulp fibers (fibers composed of pulp as a main material).

  Thereby, the softness | flexibility (elasticity and flexibility) of the board | substrate 8 can be made excellent, suppressing the linear thermal expansion coefficient in the surface direction of the board | substrate 8. FIG. As a result, the substrate 8 can follow thermal deformation in a direction parallel to the plate surface of the heat dissipation member 10. Therefore, it is possible to prevent damage to the joint portion (specifically, solder 11 described later) between the substrate 8 and the heat dissipation member 10 due to a difference in thermal expansion between the substrate 8 and the heat dissipation member 10.

  A thermosetting resin is preferably used as the resin material impregnated in the fiber base material. Examples of the thermosetting resin include novolak type phenol resins such as phenol novolak resin, cresol novolak resin, bisphenol A novolak resin, unmodified resole phenol resin, oil-modified resole modified with tung oil, linseed oil, walnut oil and the like. Such as phenol resin, phenol resin such as resol type phenol resin, bisphenol type epoxy resin such as bisphenol A epoxy resin, bisphenol F epoxy resin, novolac epoxy resin such as novolac epoxy resin, cresol novolac epoxy resin, biphenyl type epoxy resin, etc. Resin having triazine ring such as epoxy resin, urea (urea) resin, melamine resin, unsaturated polyester resin, bismaleimide resin, polyurethane resin, diallyl phthalate resin, silico Down resins, resins having a benzoxazine ring, cyanate ester resins.

  Among these, as the resin material, it is preferable to use a phenol resin or an epoxy resin, and it is more preferable to use a phenol resin. Thereby, in combination with pulp fibers, the heat resistance and flexibility of the substrate 8 can be made excellent.

  Further, the thickness (average thickness) of the substrate 8 is not particularly limited, but is preferably 0.2 to 3.0 mm, and more preferably 1.0 to 1.6 mm. Thereby, the light emitting device 9 can be reliably fixed on the substrate 8 while the substrate 8 has the flexibility as described above.

The linear expansion coefficient in the plane direction of the substrate 8 is not particularly limited, but is preferably 10 to 20 [× 10 ⁻⁶ / ° C.], and 13 to 17 [× 10 ⁻⁶ / ° C.]. Is more preferable. Thereby, the board | substrate 8 can be made to have a softness | flexibility as mentioned above, suppressing the amount of thermal expansion in the surface direction of the board | substrate 8. FIG. In addition, in this specification, a linear expansion coefficient (thermal expansion coefficient) means a linear expansion coefficient in 50-100 degreeC. The linear expansion coefficient can be evaluated by, for example, TMA (thermomechanical analysis).

  The elastic modulus of the substrate 8 is preferably 5.0 to 15.0 GPa, and more preferably 6.0 to 10.0 GPa. Thereby, the light emitting device 9 can be reliably fixed on the substrate 8 while the substrate 8 has the flexibility as described above. In the present specification, the elastic modulus means an elastic modulus at normal temperature. The elastic modulus can be evaluated by, for example, DMA (dynamic thermomechanical measurement).

  The substrate 8 may have a structure in which a plurality of fiber bases as described above are stacked, or may have only one layer of fiber base as described above.

  On one surface side of the substrate 8 (near the upper surface in FIG. 3), as shown in FIG. 4, a pair of wirings 81, which are first wirings conducting to the light emitting device 9, emit light. A plurality of sets (four sets in this embodiment) are provided corresponding to the apparatus 9. Thereby, each light emitting device 9 provided on the substrate 8 can be energized through the pair of wirings 81.

  Further, an insulating layer 82 made of a resin material is provided on the opposite side of the wiring 81 from the substrate 8. Thereby, problems such as deterioration of the wiring 81 and short circuit can be prevented.

(Light emitting device)
As shown in FIG. 5, the plurality of light emitting devices 9 are arranged at equal intervals in the circumferential direction on one surface side of the substrate 8 described above.

  Each light emitting device 9 generates light emission by electroluminescence (EL) effect and light emission by fluorescence.

  Such a light emitting device 9 (light emitting diode device) covers the package 91 having the recess 91a, the light emitting diode element 92 (LED chip) provided on the bottom surface of the recess 91a of the package 91, and the light emitting diode element 92. And a pair of external terminals 94 provided on the lower surface of the package 91.

  The package 91 is made of an insulating material such as a resin material or a ceramic material. The package 91 is provided with wiring (not shown) that electrically connects the light emitting diode element 92 and the pair of external terminals 94.

  The light emitting diode element 92 is formed by forming a semiconductor such as GaAlN, ZnS, ZnSe, SiCGaP, GaAlAs, AlN, InN, AlInGaP, InGaN, GaN, and AlInGaN on a substrate as a light emitting layer. In the present embodiment, a light emitting diode element 92 that emits light having a wavelength that can excite a phosphor material contained in a translucent resin portion 93 to be described later is used. More specifically, a light emitting diode element 92 that emits blue light is used.

  Such a translucent resin portion 93 is mainly composed of a resin material such as an epoxy resin, a modified epoxy resin, a silicone resin, a modified silicone resin, an acrylate resin, a urethane resin, or a polyimide resin having transparency.

  In the present embodiment, the translucent resin portion 93 includes a phosphor material that is excited by the light from the light emitting diode element 92 and emits yellow light.

  The translucent resin portion 93 has a function of protecting the light emitting diode element 92 from external force, dust, moisture, and the like.

  The pair of external terminals 94 is composed of a conductive material as a main material. One external terminal 94 is an anode electrode (anode), and the other external terminal 94 is a cathode electrode (cathode). .

  The pair of external terminals 94 extend in opposite directions parallel to the lower surface of the package 91.

  Each of the pair of external terminals 94 is generally composed of a metal material such as Al, Ti, Fe, Cu, Ni, Ag, Au, and Pt as a main material.

  The pair of external terminals 94 are connected by solder 83 to the pair of wirings 81 provided on the substrate 8 side described above.

  In such a light emitting device 9, when voltage is applied to the light emitting diode element 92 via a pair of external terminals 94, light emission based on the electroluminescence effect occurs in the light emitting diode element 92. By this light emission, the light is transmitted through the translucent resin portion 93 and emitted to the outside. At this time, a part of the light is reflected on the inner wall surface of the recess 91 a of the package 91, then passes through the translucent resin portion 93 and is emitted to the outside.

  Further, the light emitting device 9 emits blue light by the EL effect of the light emitting diode element 92, and the translucent resin portion 93 is excited by a part of the blue light and emits yellow light by fluorescence, and has a complementary color relationship. White light is emitted by mixing these blue light and yellow light.

  The light emitting diode element 92 may emit ultraviolet light or violet light. Moreover, each light emitting diode element 92 is not limited to the above-mentioned thing, For example, monochromatic light emitting diode elements, such as red, blue, and green, may be sufficient. In this case, the translucent resin portion 93 does not have to include a phosphor material. Each light emitting device 9 may have a plurality of light emitting diode elements, and in this case, the light emission colors may be the same or different from each other.

  Such a light emitting device 9 has a relatively small thermal expansion coefficient. Therefore, the linear expansion coefficient in the direction parallel to the plate surface of the heat radiating member 10 described later is larger than the linear thermal expansion coefficient in the same direction of the light emitting device 9. In such a case, the effect by applying this invention becomes remarkable.

(Heat dissipation member)
The heat radiating member 10 is provided on one surface side (upper side in FIG. 2) of the substrate 8 described above. That is, the heat radiating member 10 is provided on the same surface side as each light emitting device 9 of the substrate 8 described above.
The heat radiating member 10 is a device (second substrate) on which a plurality of light emitting devices 9 are mounted together with the substrate 8.

  In this embodiment, the heat radiating member 10 has a function of radiating heat from each light emitting device 9 to be described later.

  Thus, by providing the heat radiating member 10 on the same surface side as each light emitting device 9 of the substrate 8, the heat generated in each light emitting device 9 can be transferred without passing through the portion having the low thermal conductivity of the substrate 8. Can be directly conducted. Therefore, the heat generated in each light emitting device 9 can be efficiently radiated by the heat radiating member 10. Therefore, even if each light emitting device 9 is turned on with high brightness, the temperature rise of each light emitting device 9 can be suppressed. As a result, it is possible to provide a lighting device 1 having a high luminance and a long life.

  The heat radiating member 10 has a plate shape, and a plurality of through holes 101 penetrating in the thickness direction are formed. This through hole 101 is formed corresponding to the installation site of the light emitting device 9 described above. And each light-emitting device 9 mentioned above is provided so that it may face in each said through-hole 101. FIG.

  Thereby, the area of the plate surface of the heat radiating member 10 is increased and the heat radiating property of the heat radiating member 10 while preventing the heat radiating member 10 from inhibiting light emission from each light emitting device 9 with a relatively simple configuration. Can be improved.

  In the present embodiment, each through hole 101 has a circular shape when viewed in plan. The plan view shape of the through hole 101 is not limited to the above-described shape as long as it can prevent the heat dissipation member 10 from inhibiting the emission of light from each light emitting device 9. It may be a polygonal shape such as a square shape or a pentagonal shape, an elliptical shape, an irregular shape, or the like. Moreover, the heat radiating member 10 does not need to be provided with a plurality of through holes 101 corresponding to the plurality of light emitting devices 9, for example, even if provided with a plurality of light emitting devices 9 facing one through hole. Good. Moreover, the heat radiating member 10 may have a notch corresponding to the installation site of the plurality of light emitting devices 9. Moreover, the heat radiating member 10 is not limited to a plate shape, and may be a block shape. Moreover, each through-hole 101 may have a different part even if the width in the cross section is constant.

  The heat radiating member 10 is configured to abut against the inner surface of the housing 5 and radiate at least a part of heat from the heat radiating member 10. In the present embodiment, the heat dissipation member 10 is in contact with the inner surface of the housing 5 over substantially the entire circumference.

  Thereby, the heat of the heat radiating member 10 can be efficiently conducted to the housing 5, and the temperature rise of each light emitting device 9 can be more reliably suppressed.

  Further, when there is a gap between the heat radiating member 10 and the inner surface of the housing 5, it is preferable to fill a resin material (heat radiating resin) having a heat radiating property therebetween. Moreover, the heat radiating member 10 and the inner surface of the housing 5 can be joined via a heat radiating resin. By using the heat radiating resin in this way, the heat of the heat radiating member 10 can be efficiently conducted to the housing 5 and the temperature rise of each light emitting diode element 92 can be more reliably suppressed.

  As such a heat-dissipating resin, a thermosetting liquid resin having a thermal conductivity of 0.7 W / mK or more is preferably used.

  Specifically, examples of such heat-dissipating resins include liquid phenolic resins and liquid epoxy resins filled with electrically insulating and high thermal conductive fillers typified by metal oxides such as alumina and nitrides such as boron nitride. It is done.

  The heat radiating member 10 is configured to receive heat from each light emitting device 9 through a wiring 81 provided on the substrate 8 side described later.

  Thereby, the heat generated in each light emitting device 9 can be conducted to the heat dissipation member 10 via the wiring 81 provided on the substrate 8 side. Since the wiring 81 is made of, for example, a metal material and has excellent thermal conductivity, the heat conductivity from each light emitting device 9 to the heat radiating member 10 is further improved by adopting such a configuration. Can be.

  In the present embodiment, on the heat radiating member 10 (specifically, near the lower surface of the heat radiating member 10) is the second wiring that is electrically connected to the wiring 81 (electrode) provided on the substrate 8 side described above. Wiring 103 (electrode) is provided through an insulating layer 102 made of a resin material.

  In addition, the insulating layer 102 prevents the short circuit between the heat radiating member 10 and the wiring 103, and energizes the wiring 81 provided on the substrate 8 side and each light emitting device 9 through the wiring 103 provided on the heat radiating member 10 side. Each light emitting device 9 can emit light. Further, heat can be efficiently conducted from the wiring 81 provided on the substrate 8 side to the heat radiating member 10. As a result, it is not necessary to provide wiring for energizing each light emitting device 9 on the side of the substrate 8 opposite to the plurality of light emitting devices 9, and the structure of the substrate 8 can be simplified and thinned. it can. By simplifying and thinning the structure of the substrate 8, the flexibility and flexibility of the substrate 8 are improved, and each light emission is caused by the difference in thermal expansion between each light emitting device 9 and the substrate 8. It is possible to prevent damage to the joint portion between the device 9 and the substrate 8 (specifically, a solder 83 to be described later).

  In particular, the wiring 103 provided on the heat radiating member 10 side is connected to the wiring 81 provided on the substrate 8 side via the solder 11.

  Thereby, electrical transmission and thermal transmission can be performed between the wiring 81 provided on the substrate 8 side and the wiring 103 provided on the heat radiating member 10 side relatively easily and reliably. The connection between the wiring 81 provided on the substrate 8 side and the wiring 103 provided on the heat radiating member 10 side is not limited to the one using solder, for example, anisotropic conductive adhesive (ACF) or the like. May be used.

  As shown in FIG. 4, the wiring 103 includes a plurality of wirings (electrodes) 103a to 103e. These wirings 103a to 103e are arranged so that the plurality of light emitting devices 9 described above are connected in series and energized. For example, the plurality of light emitting devices 9 are respectively arranged so that the anode side faces the center side of the heat radiating member 10 and the cathode side faces the outer peripheral side of the heat radiating member 10. Then, each light emitting device 9 is caused to emit light by energizing between the wiring 103d and the wiring 103e via the pair of wirings 61 from the power supply unit 7 described above.

  Further, the plurality of wirings 103a to 103e are formed so as to cover the entire surface of the heat dissipation member 10 as much as possible. Thereby, the heat | fever of wiring 103a-103e can be more efficiently conducted to the thermal radiation member 10. FIG.

The heat dissipation member 10 also has a function of reflecting light from each light emitting device 9.
Thereby, the utilization efficiency of the light from each light-emitting device 9 can be improved, or the light emitted from the lighting fixture 1 can be made into a desired thing by diffusing or condensing the light from each light-emitting device 9. . Moreover, since it is not necessary to separately provide a reflecting member for reflecting the light of each light emitting device 9, the configuration of the lighting fixture 1 can be simplified and the cost can be reduced.

  The constituent material of the heat radiating member 10 is not particularly limited as long as the heat radiating member 10 can exhibit the heat radiating property as described above, and a metal material, a ceramic material, a carbon material, or the like is used. Although it is possible, it is preferable to use a metal material.

  Metal materials have a relatively high thermal conductivity, are inexpensive, and are easy to process. Moreover, by comprising the heat radiating member 10 with a metal material, the surface of the heat radiating member 10 can have light reflectivity as described above without special processing. Therefore, by constituting the heat radiating member 10 with a metal material, the temperature rise of each light emitting device 9 can be more reliably suppressed, and the cost of the lighting fixture 1 can be reduced.

  Although it does not specifically limit as a metal material which comprises the heat radiating member 10, Aluminum can be used suitably.

When the linear expansion coefficient in the direction parallel to the plate surface of the substrate 8 is A and the linear thermal expansion coefficient in the same direction of the heat dissipation member 10 is B, (AB) is 3 to 20 [× 10 ⁻⁶ / ° C.] is preferable, and 3 to 10 [× 10 ⁻⁶ / ° C.] is more preferable.

  Thereby, the selection of the constituent materials of the substrate 8 and the heat dissipation member 10 is made relatively simple, and the junction between the substrate 8 and the heat dissipation member 10 is caused by the difference in thermal expansion between the substrate 8 and the heat dissipation member 10. It is possible to prevent (solder 11) from being damaged.

Moreover, the linear expansion coefficient in the surface direction of the heat radiating member 10 is not particularly limited, but is preferably 15 to 30 [× 10 ⁻⁶ / ° C.], and is preferably 20 to 25 [× 10 ⁻⁶ / ° C.]. Is more preferable.

  Moreover, the thickness (average thickness) of the plate-shaped heat dissipation member 10 is not particularly limited, but is preferably 1 to 5 mm, and more preferably 1 to 3 mm. Thereby, by setting the thickness of the heat radiating member 10 to be less than the upper limit value, the heat radiating member 10 can be manufactured relatively easily and inexpensively by processing a sheet metal by press working or the like. Moreover, the heat dissipation of the heat radiating member 10 can be made excellent by making the thickness of the heat radiating member 10 more than the said lower limit.

  As described above, according to the lighting fixture 1, even if a difference in thermal expansion between the light emitting device 9 and the heat radiating member 10 occurs due to heat generation of the light emitting device 9 described later, it occurs between these due to the difference in thermal expansion. The substrate 8 can relieve the stress. Therefore, it is possible to prevent the junction between the substrate 8 and the light emitting device 9 and the junction between the substrate 8 and the heat dissipation member 10 from being damaged due to the difference in thermal expansion. As a result, the light source unit 6 according to the present invention has excellent reliability.

  In the present embodiment, since the heat radiating member 10 is provided on the surface side of the substrate 8 on which the light emitting device 9 is mounted, the heat generated in each light emitting device 9 is passed through the portion of the substrate 8 having low thermal conductivity. Instead, it can conduct directly to the heat dissipating member 10. Therefore, the heat generated in each light emitting device 9 can be efficiently radiated by the heat radiating member 10. Therefore, even if each light emitting device 9 is turned on with high brightness, the temperature rise of each light emitting device 9 can be suppressed. As a result, it is possible to provide a lighting device 1 having a high luminance and a long life.

Second Embodiment
FIG. 6 is a plan view for explaining a substrate (first substrate) and a light emitting device (electronic component) provided in a lighting apparatus (electronic device) according to a second embodiment of the present invention. FIG. It is a top view for demonstrating the heat radiating member (2nd board | substrate) with which the lighting fixture concerning 2nd Embodiment of invention was equipped.

  The luminaire according to the present embodiment is the luminaire according to the first embodiment described above, except that the wiring arrangement of the substrate (first substrate) on which the light emitting device is mounted and the heat dissipation member (second substrate) are different. Same as 1.

  In the following description, the lighting fixture of the second embodiment will be described with a focus on the differences from the lighting fixture of the first embodiment, and the description of the same matters will be omitted. Moreover, in FIG. 6 and FIG. 7, the same code | symbol is attached | subjected about the thing similar to the structure of the lighting fixture of 1st Embodiment.

  The lighting fixture of this embodiment has the some board | substrate 8A and the one heat radiating member 10A, as shown to FIG. 6 and FIG. That is, one heat radiating member 10A supports a plurality of substrates 8A.

  A light emitting device 9 is provided on one surface side of each substrate 8A (surface side facing the heat radiating member 10A). That is, one light emitting device 9 is mounted on one substrate 8A.

  Also, four wirings (electrodes) 103A are provided on one surface side of the heat dissipation member 10A (surface side facing the plurality of substrates 8A) so as to connect the plurality of light emitting devices 9 in series.

  The heat dissipating member 10A dissipates heat from the light emitting device 9 mounted on each substrate 8A. That is, one heat radiating member 10 </ b> A is configured to radiate heat from the plurality of light emitting devices 9.

  Thereby, compared with the case where a plurality of light emitting devices 9 are provided on one substrate 8A as in the first embodiment described above, the size of each substrate 8A is reduced and the surface direction on each substrate 8A is reduced. The amount of thermal expansion of can be reduced. Therefore, it can prevent more reliably that the junction part of 8 A of board | substrates and the heat radiating member 10A resulting from the thermal expansion difference between the board | substrate 8A and the heat radiating member 10A is damaged.

  Also by the lighting fixture which concerns on 2nd Embodiment which was demonstrated above, the effect similar to the lighting fixture which concerns on 1st Embodiment mentioned above can be exhibited.

  In particular, in the lighting fixture according to the second embodiment, by using the plurality of substrates 8A as the substrates for mounting the plurality of light emitting devices 9, the amount of thermal expansion of each substrate 8A is suppressed, and problems due to such thermal expansion are prevented. And can have a very long life.

  As mentioned above, although this invention was demonstrated based on suitable embodiment, this invention is not limited to these.

  For example, the structure of each part of the light source device and the luminaire of the present invention can be replaced with an arbitrary structure that exhibits the same function, and an arbitrary structure can be added.

  Further, in each of the above-described embodiments, the case where one lighting fixture (light source device) has four light emitting devices has been described as an example, but the present invention is not limited to this, and the number of light emitting devices is 1 to 3 or 5 or more.

  In the above-described embodiment, the case where the light emitting device 9 is provided on the surface of the substrate 8 on the side of the heat radiating member 10 has been described as an example. It may be provided. In this case, the light source unit 6 may be installed so that the substrate 8 side faces the cover 4. Further, the substrate 8 may be provided with a through electrode for electrically connecting the light emitting device 9 and the wiring 103 on the heat radiating member 10 side. Moreover, what is necessary is just to provide a reflecting plate separately from the thermal radiation member 10 as needed.

  In the above-described embodiment, an example in which a light emitting device is used as an electronic component has been described. However, the present invention is not limited thereto, and examples of the electronic component include a vacuum tube, traveling wave tube (klystron), magnetron, and cathode ray tube. , Plasma displays, electron tubes such as imaging tubes, transistors, integrated circuits, diodes, semiconductors such as liquid crystal displays, active parts such as electric motors, resistors, capacitors (capacitors), coils, transformers, relays, piezoelectric elements, Passive components such as crystal resonators, ceramic resonators, speakers, light bulbs, fluorescent lamps, and batteries, and mechanical components such as printed boards, connectors, sockets, plugs, switches, electric wires, and antennas can be used.

  In the above-described embodiment, the second substrate is described as an example made of a ceramic material, a metal material, or the like. However, the present invention is not limited to this. For example, the second substrate may be a fiber substrate. A material impregnated with a resin material can be used. In this case, as the fiber base material, glass fiber base materials such as glass woven fabric and glass nonwoven fabric, polyamide resin fibers, aromatic polyamide resin fibers, polyamide resin fibers such as wholly aromatic polyamide resin fibers, polyester resin fibers, aromatic Synthetic fiber substrate, kraft paper, cotton linter paper composed of woven fabric or non-woven fabric mainly composed of polyester resin fiber such as aromatic polyester resin fiber, wholly aromatic polyester resin fiber, polyimide resin fiber, fluororesin fiber Examples thereof include pulp fibers (paper base material) mainly composed of linter and kraft pulp mixed paper, etc., but it is preferable to use glass fibers in order to reduce the thermal expansion coefficient of the second substrate. Further, as the resin material impregnated into the fiber base material, the same resin material as that of the substrate 8 described above can be used.

  Further, in each of the above-described embodiments, an example in which the electronic apparatus of the present invention is applied to a lighting fixture has been described as a representative example. However, the present invention is not limited to this, for example, a liquid crystal display, car navigation, portable Telephone, game console, compact cassette, CD player, digital camera, TV, DVD player, electronic notebook, electronic dictionary, calculator, hard disk recorder, personal computer, personal digital assistant (PDA), video camera, printer, plasma display, minidisc It can also be applied to radios, word processors, etc.

DESCRIPTION OF SYMBOLS 1 Lighting fixture 2 Main body 3 Base | cover 4 Cover 5 Housing 6 Light source unit 7 Power supply unit 8 Board | substrate 8A Board | substrate 9 Light-emitting device 10 Radiation member 10A Radiation member 11 Solder 51 Main-body part 52 Reduced diameter part 71 Board | substrate 72 Electronic component 73 Wiring 74 Casing 81 Wiring 82 Insulating layer 83 Solder 91 Package 91a Recess 92 Light emitting diode element 93 Translucent resin portion 94 External terminal 101 Through hole 102, 104 Insulating layer 103 Wiring 103a-103e Wiring

Claims (17)

A first substrate formed by impregnating a resin base material into a fiber base material composed mainly of an organic material;
An electronic component mounted on the first board and generating heat when energized;
An electronic component module comprising: a second substrate on which the electronic component is mounted together with the first substrate.   2. The electronic component module according to claim 1, wherein a linear expansion coefficient in a direction parallel to the plate surface of the second substrate is larger than a linear thermal expansion coefficient in the same direction of the electronic component.   The electronic component module according to claim 2, wherein the first substrate has flexibility so as to follow thermal deformation in a direction parallel to a plate surface of the second substrate.   The electronic component module according to claim 3, wherein the elastic modulus of the first substrate is 5000 to 15000 MPa. 5. The electronic component module according to claim 3, wherein a linear expansion coefficient in the surface direction of the first substrate is 10 to 25 [× 10 ⁻⁶ / ° C.].   A first wiring electrically connected to the electronic component is provided on the first substrate, and a second wiring electrically connected to the first wiring is provided on the second substrate. The electronic component module according to claim 1, wherein the electronic component module is provided.   The first wiring is provided in the vicinity of the surface of the first substrate on the second substrate side, and the second wiring is provided in the vicinity of the surface of the second substrate on the first substrate side. The electronic component module according to claim 6.   The electronic component module according to claim 7, wherein the electronic component is provided on the second substrate side of the first substrate.   The electronic component module according to claim 7 or 8, wherein the first wiring is connected to the second wiring through solder.   The first substrate, the electronic component, and the second substrate are accommodated in a housing, and the first substrate is supported by the housing. Electronic component module.   The electronic component module according to claim 10, wherein the second substrate has a function of radiating heat from the electronic component.   The electronic component module according to claim 11, wherein the second substrate is made of a metal material.   The electronic component module according to any one of claims 1 to 12, wherein the fiber base material is composed of pulp as a main material.   The electronic component module according to claim 1, wherein the resin material is mainly composed of a curable resin.   The electronic component module according to claim 14, wherein the resin material includes a phenol-based resin as a main material.   The electronic component module according to claim 1, wherein the electronic component is a light emitting device including a light emitting diode element.   An electronic device comprising the electronic component module according to claim 1.

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