JP2011122743A - Sheath for burning - Google Patents

Sheath for burning Download PDF

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Publication number
JP2011122743A
JP2011122743A JP2009278703A JP2009278703A JP2011122743A JP 2011122743 A JP2011122743 A JP 2011122743A JP 2009278703 A JP2009278703 A JP 2009278703A JP 2009278703 A JP2009278703 A JP 2009278703A JP 2011122743 A JP2011122743 A JP 2011122743A
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bottom plate
sheath
plate
firing
adjustment
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JP5434544B2 (en
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Keiji Asakawa
慶治 浅川
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Murata Manufacturing Co Ltd
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Murata Manufacturing Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheath for burning, preventing deterioration of mechanical strength and reducing a difference of heat capacity of a bottom plate and a main face of a burned object, as a storage container used when a ceramic electronic component etc. is burned. <P>SOLUTION: The sheath 11 for burning is equipped with: the bottom plate 2 having one main face on which the burned object is placed; a sidewall plate 5 provided around the bottom plate 2; and an adjustment plate 9 arranged to come into contact with the other main face of the bottom plate 2 and having through-holes 3a, 3b formed in the vicinity of the center and on the periphery. <P>COPYRIGHT: (C)2011,JPO&amp;INPIT

Description

本発明は電子部品を焼成する際に使用される焼成用さやに関する。   The present invention relates to a sheath used for firing an electronic component.

従来、セラミックを用いた電子部品などを焼成する際に使用する収納容器として焼成用さやが使用されてきた。セラミック電子部品は、そのセラミック電子部品を構成する子基板が複数配置された親基板の状態で作製され、その親基板を焼成用さやの底部に配置して焼成を行っていた。焼成用さやは、基板を載置する底部と、その底部の周縁部に配置された側壁部とから構成されている。このような焼成用さやである収納容器として、特許文献1が開示されている。   Conventionally, a firing sheath has been used as a storage container used when firing an electronic component or the like using ceramic. The ceramic electronic component is manufactured in a state of a parent substrate in which a plurality of sub-substrates constituting the ceramic electronic component are arranged, and the parent substrate is disposed on the bottom of the sheath for firing. The sheath sheath is composed of a bottom portion on which the substrate is placed and a side wall portion disposed on the peripheral edge of the bottom portion. Patent document 1 is disclosed as a storage container which is such a sheath for baking.

特許文献1の収納容器の構成を、図9と図10を参照しながら説明する。図9はさや101の斜視図、図10はその断面図である。図9に示すように、さや101は底板103と、底板103から上方に突出した側壁105から構成されている。そして、セラミック電子部品などの被加熱物は、底板103の一方主面120上に載置される。また、底板103の他方主面122には、複数の凹部107が形成されている。この凹部107により、加熱時に底板103の中央部に加わる応力を側壁105側に分散することができ、底板103の変形を防ぐとともに被加熱物の変形をも防ぐことができる。   The configuration of the storage container of Patent Document 1 will be described with reference to FIGS. 9 and 10. 9 is a perspective view of the sheath 101, and FIG. 10 is a sectional view thereof. As shown in FIG. 9, the sheath 101 includes a bottom plate 103 and a side wall 105 protruding upward from the bottom plate 103. Then, an object to be heated such as a ceramic electronic component is placed on the one main surface 120 of the bottom plate 103. A plurality of recesses 107 are formed on the other main surface 122 of the bottom plate 103. The recess 107 can disperse the stress applied to the central portion of the bottom plate 103 during the heating to the side wall 105 side, thereby preventing the deformation of the bottom plate 103 and the object to be heated.

特開2000−18840号公報JP 2000-18840 A

ところで、子基板を複数個配列して形成したセラミック電子部品の親基板を焼成用さやに載置して焼成炉などで加熱あるいは焼成する場合、焼成用さやは焼成炉内の中央付近に複数個積み重ねて配置されるため、焼成炉内部の熱源により焼成用さやの側壁側から加熱されることになる。そのため、焼成炉を所定の焼成温度まで昇温する場合、焼成用さやの周縁部は中央部よりも熱源に近いため、周縁部の方が中央部よりも昇温時間が短くなり、降温する場合の降温時間も短くなる。そのため、焼成用さやに載置された親基板の中央部と縁端部とでは異なる焼成状態になり、電子部品としての電気特性や機械的強度のばらつきが発生するという問題点があった。   By the way, when a ceramic electronic component parent substrate formed by arranging a plurality of sub-substrates is placed on a firing sheath and heated or fired in a firing furnace or the like, a plurality of firing sheaths are located near the center in the firing furnace. Since they are arranged in a stacked manner, they are heated from the side of the firing sheath by the heat source inside the firing furnace. Therefore, when the firing furnace is heated up to a predetermined firing temperature, the peripheral portion of the firing sheath is closer to the heat source than the central portion, so that the peripheral portion has a shorter temperature rising time than the central portion and the temperature is lowered. The temperature drop time is shortened. For this reason, there is a problem in that the center portion and the edge portion of the parent substrate placed on the sheath for firing are in different firing states, resulting in variations in electrical characteristics and mechanical strength as electronic components.

また、特許文献1には、焼成用さや1の底板3の断面をテーパ状に形成したり、底板3に凹部111を形成した構造が記載されている。底板の厚みを変化させることにより底板における熱容量の分布をある程度均一化することができるが、図10に示すように、底板の中央部は厚みが薄く、周縁部は厚みが厚いく形成されるため、底板の機械的強度が弱くなり焼成用さやが破損するという問題点もあった。   Patent Document 1 describes a structure in which a cross section of the bottom plate 3 of the firing sheath 1 is formed in a tapered shape or a recess 111 is formed in the bottom plate 3. By changing the thickness of the bottom plate, the heat capacity distribution in the bottom plate can be made uniform to some extent. However, as shown in FIG. 10, the center portion of the bottom plate is thin and the peripheral portion is thick. Further, there was a problem that the mechanical strength of the bottom plate was weakened and the sheath for baking was damaged.

そこで、本発明は機械的強度が劣化せず、被焼成物における熱容量の差を小さくすることができる焼成用さやを提供することを目的とする。   Therefore, an object of the present invention is to provide a sheath for firing that can reduce the difference in heat capacity between the objects to be fired without deteriorating mechanical strength.

上記問題点を解決するために、本発明に係る焼成用さやは一方主面上に被焼成物を載置する底板と、前記底板の周囲に設けられた側壁板と、前記底板の他方主面に接触するように配置され、複数の貫通穴が形成された調整板と、を備えた
ことを特徴とする。
In order to solve the above-mentioned problems, the sheathing sheath according to the present invention has a bottom plate on which a material to be fired is placed on one main surface, a side wall plate provided around the bottom plate, and the other main surface of the bottom plate. And an adjustment plate that is disposed so as to be in contact with each other and in which a plurality of through holes are formed.

上記のように焼成用さやの底板に接触するように配置される調整板を使用することにより、焼成用さやの機械的強度を劣化させることなく底板および被焼成物の主面内における熱容量の差を小さくすることができる。   By using the adjustment plate arranged so as to be in contact with the bottom plate of the firing sheath as described above, the difference in heat capacity in the main surface of the bottom plate and the object to be fired without deteriorating the mechanical strength of the firing sheath. Can be reduced.

また、前記調整板における前記複数の貫通穴の配置密度が前記側壁板に近づくにつれて低くなるように前記貫通穴が形成されていてもよく、さらに前記貫通穴の大きさは前記側壁板に近づくにつれて小さくなるように前記貫通穴が形成されていてもよい。   Further, the through holes may be formed such that the arrangement density of the plurality of through holes in the adjustment plate becomes lower as the side plate is approached, and the size of the through holes is closer to the side wall plate. The through hole may be formed to be smaller.

この場合、調整板の中央部よりも周縁部における貫通穴の配置密度を低くしたり、貫通穴の大きさを小さくすることで、貫通穴がない場合に比べて底板および被焼成物の中央部と周縁部での昇温時間あるいは降温時間の差を小さくすることができ、底板および被焼成物の主面内における熱容量の差を小さくすることができる。   In this case, by lowering the arrangement density of the through holes in the peripheral part than the center part of the adjusting plate or by reducing the size of the through holes, the center part of the bottom plate and the object to be fired is compared with the case where there is no through hole. The difference between the temperature rising time or the temperature falling time at the peripheral edge can be reduced, and the difference in heat capacity between the bottom plate and the main surface of the object to be fired can be reduced.

また、前記底板と前記調整板とは異なる材料で形成されていてもよい。   Further, the bottom plate and the adjustment plate may be formed of different materials.

この場合、底板および被焼成物の中央部と周縁部における昇温時間あるいは降温時間の差が小さくなるような熱容量になる材料を使用して調整板を形成することにより、底板および被焼成物の主面内における熱容量の差を小さくすることができる。   In this case, by forming the adjustment plate using a material that has a heat capacity such that the difference between the temperature rising time or the temperature falling time in the central portion and the peripheral portion of the bottom plate and the object to be fired is reduced, The difference in heat capacity in the main surface can be reduced.

また、少なくとも一つの前記貫通穴の内部に調整用部材が配置されていてもよい。   Further, an adjusting member may be disposed inside at least one of the through holes.

底板の領域内において部分的に熱容量を調整したい場合などに、所定の貫通孔内に調整用部材を配置することで細かく熱容量を調整することができ、底板および被焼成物の主面内における熱容量の差をさらに小さくすることができる。   When you want to adjust the heat capacity partially in the area of the bottom plate, you can finely adjust the heat capacity by arranging the adjusting member in the predetermined through hole, the heat capacity in the main surface of the bottom plate and the object to be fired This difference can be further reduced.

また、前記底板の一方主面上から平面視したとき、前記被焼成物の載置領域に前記貫通穴を形成した領域が含まれていてもよい。   Moreover, the area | region which formed the said through-hole may be contained in the mounting area | region of the said to-be-baked material when planarly viewed from the one main surface of the said baseplate.

この場合、被焼成物の載置領域の直下に貫通穴を形成した領域の少なくとも一部が配置されるため、焼成時に被焼成物に加わる熱量を直接調整することができ、底板および被焼成物の主面内における熱容量の差を小さくすることができる。   In this case, since at least a part of the region in which the through hole is formed is disposed immediately below the mounting region of the object to be fired, the amount of heat applied to the material to be fired during firing can be directly adjusted. It is possible to reduce the difference in heat capacity in the main surface.

さらに、前記調整板の前記底板と接触するように配置される主面と対向する主面の周縁部に側壁部が配置されてもよい。   Furthermore, a side wall part may be arrange | positioned in the peripheral part of the main surface facing the main surface arrange | positioned so that the said bottom plate of the said adjustment plate may be contacted.

この場合、側壁部において熱容量が大きくなるため、底板および被焼成物の主面における熱容量の差をさらに小さくすることができる。   In this case, since the heat capacity is increased at the side wall, the difference in heat capacity between the bottom plate and the main surface of the object to be fired can be further reduced.

本発明によれば、焼成用さやの機械的強度を劣化させず、焼成用さやの底板および被焼成物の主面における熱容量の差を小さくすることができる。   According to the present invention, it is possible to reduce the difference in heat capacity between the bottom plate of the firing sheath and the main surface of the object to be fired without deteriorating the mechanical strength of the firing sheath.

本発明の第1の実施形態に係る焼成用さやの概観斜視図である。It is a general | schematic perspective view of the sheath for baking which concerns on the 1st Embodiment of this invention. 本発明の第1の実施形態に係る焼成用さやの断面図である。It is sectional drawing of the sheath for baking which concerns on the 1st Embodiment of this invention. 本発明の第1の実施形態に係る焼成用さやにおける調整板の平面図である。It is a top view of the adjustment board in the sheath for baking which concerns on the 1st Embodiment of this invention. 本発明の第2の実施形態に係る焼成用さやにおける調整板の平面図である。It is a top view of the adjustment board in the sheath for baking which concerns on the 2nd Embodiment of this invention. 本発明の第3の実施形態に係る焼成用さやにおける断面図である。It is sectional drawing in the sheath for baking which concerns on the 3rd Embodiment of this invention. 本発明の第4の実施形態に係る焼成用さやにおける調整板の平面図である。It is a top view of the adjustment board in the sheath for baking which concerns on the 4th Embodiment of this invention. 本発明の第5の実施形態に係る焼成用さやにおける断面図である。It is sectional drawing in the sheath for baking which concerns on the 5th Embodiment of this invention. 本発明の第5の実施形態に係る焼成用さやにおける調整板の平面図である。It is a top view of the adjustment board in the sheath for baking which concerns on the 5th Embodiment of this invention. 従来の焼成用さやの概観斜視図である。It is a general | schematic perspective view of the conventional sheath. 従来の焼成用さやの断面図である。It is sectional drawing of the conventional sheath for baking.

以下、本発明に係る焼成用さやの実施の形態について添付の図を参照しながら説明する。
[第1の実施形態 図1〜図3]
本発明に係る第1の実施形態の構成を図1〜図3に示す。図1は焼成用さや11の概観斜視図、図2は図1のA−A’線における断面図、図3は焼成用さや11における調整板の平面図である。
Hereinafter, embodiments of a sheath for firing according to the present invention will be described with reference to the accompanying drawings.
First Embodiment FIGS. 1 to 3
The configuration of the first embodiment according to the present invention is shown in FIGS. FIG. 1 is a schematic perspective view of the firing sheath 11, FIG. 2 is a cross-sectional view taken along the line AA ′ in FIG. 1, and FIG. 3 is a plan view of the adjustment plate in the firing sheath 11.

図1に示すように、第1の実施形態の焼成用さや11は、底板2とその底板2の一方主面である表面6の周縁部から上方に伸びるように配置された側壁板5から構成されている。なお、底板2および側壁板5はアルミナなどから形成されている。そして、底板2の表面6には被焼成物である親基板7が配置されている。親基板7は、1辺の長さが10cmから13cm程度の矩形形状であり、数cm角程度の子基板が複数個、格子状に配置されている。また、本実施形態における親基板7は、チタン酸バリウムなどを含むセラミック誘電体材料から作製される絶縁体層とその絶縁体層上に形成された配線電極とを交互に積層した後、絶縁体層と配線電極とを同時焼成することにより形成した低温同時焼結多層セラミック基板を使用しているが、単一のセラミック基板を用いた電子部品、あるいは複数の実装部品を表面に実装した樹脂多層基板などであっても構わない。   As shown in FIG. 1, the firing sheath 11 of the first embodiment is composed of a bottom plate 2 and a side wall plate 5 arranged so as to extend upward from the peripheral portion of the surface 6 which is one main surface of the bottom plate 2. Has been. The bottom plate 2 and the side wall plate 5 are made of alumina or the like. And on the surface 6 of the bottom plate 2, a parent substrate 7, which is an object to be fired, is disposed. The parent substrate 7 has a rectangular shape with a side length of about 10 cm to 13 cm, and a plurality of sub-substrates of about several cm square are arranged in a lattice shape. Further, in the present embodiment, the parent substrate 7 is formed by alternately laminating insulator layers made of a ceramic dielectric material containing barium titanate and the like and wiring electrodes formed on the insulator layers. Low temperature co-sintered multilayer ceramic substrate formed by co-firing layers and wiring electrodes, but resin multilayer with a single ceramic substrate or multiple mounting components mounted on the surface It may be a substrate or the like.

図2は焼成用さや11の断面図を示しているが、底板2の他方主面である裏面8に接触するように調整板9が配置されている。なお、本実施形態において調整板9は底板2と同じアルミナを使用して作製している。図3は調整板9の平面図を示しているが、調整板9の所定の箇所には貫通穴3が設けられている。また、調整板9と底板2とは接着剤を使用して固着しているが、ねじなどにより調整板9を底板2に固定しても構わない。   FIG. 2 shows a cross-sectional view of the firing sheath 11, but the adjustment plate 9 is arranged so as to contact the back surface 8 which is the other main surface of the bottom plate 2. In the present embodiment, the adjustment plate 9 is made using the same alumina as the bottom plate 2. FIG. 3 shows a plan view of the adjustment plate 9, but through holes 3 are provided at predetermined locations of the adjustment plate 9. Further, although the adjustment plate 9 and the bottom plate 2 are fixed using an adhesive, the adjustment plate 9 may be fixed to the bottom plate 2 with screws or the like.

第1の実施形態においては、調整板9の主面の中央付近に円形の貫通穴3aが形成され、その貫通穴3aの周囲に貫通穴3aよりも小さい貫通穴3bを配置している。本実施形態のように、調整板9の中央部に大きい貫通穴3aを配置することにより底板2の中央部での熱容量が小さくなり、調整板9の周縁部に小さい貫通穴3bを配置することにより底板2の周縁部での熱容量が高くなる。これにより、底板の中央部と周縁部での熱容量の差が小さくなり、焼成用さや11の中央部と周縁部における焼成時の昇温時間および降温時間の差を小さくすることができ、親基板においてもその主面内における焼成状態の違いによる電気特性ばらつきや機械的強度のばらつきを小さくすることができる。さらに、本実施形態においては、底板に調整板を接触するように配置するだけであるので、焼成用さやの機械的強度が低下することもない。
[第2の実施形態 図4]
本発明に係る第2の実施形態の構成を図4に示す。図4は第2の実施形態の焼成用さやにおける調整板29の平面図である。本実施形態における調整板29も、底板の裏面に接触するように取りつけられることにより、焼成用さやの熱容量を調整する機能を有している。なお、本実施形態における焼成用さやの概観斜視図は図1と同じであり、断面図は図2と一部異なるだけであるため、ここでは省略する。
In the first embodiment, a circular through hole 3a is formed near the center of the main surface of the adjusting plate 9, and a through hole 3b smaller than the through hole 3a is disposed around the through hole 3a. As in this embodiment, by disposing the large through hole 3a in the central portion of the adjustment plate 9, the heat capacity at the central portion of the bottom plate 2 is reduced, and the small through hole 3b is disposed in the peripheral portion of the adjustment plate 9. This increases the heat capacity at the peripheral edge of the bottom plate 2. Thereby, the difference in the heat capacity between the center portion and the peripheral portion of the bottom plate is reduced, and the difference between the heating time and the cooling time at the time of baking in the central portion and the peripheral portion of the sheath 11 can be reduced. The variation in electrical characteristics and the variation in mechanical strength due to the difference in the firing state in the main surface can be reduced. Furthermore, in the present embodiment, since the adjustment plate is simply disposed so as to come into contact with the bottom plate, the mechanical strength of the sheath is not reduced.
Second Embodiment FIG. 4
The configuration of the second embodiment according to the present invention is shown in FIG. FIG. 4 is a plan view of the adjustment plate 29 in the sheath for firing according to the second embodiment. The adjustment plate 29 in the present embodiment also has a function of adjusting the heat capacity of the pod for firing by being attached so as to be in contact with the back surface of the bottom plate. In addition, since the general perspective view of the sheath for firing in this embodiment is the same as that in FIG. 1 and the sectional view is only partially different from that in FIG.

第2の実施形態における調整板29では、大きさの異なる3種類の貫通穴23を、調整板29の中央部から周縁部に向かってその大きさが小さくなるように配置している。調整板29の中央部に最も大きい貫通穴23a、その貫通穴23aの周囲に2番目に大きい貫通穴23b、貫通穴23bの周囲に最も小さい貫通穴23cを配置することで、調整板29の単位面積あたりの貫通穴の配置密度が中央部から周縁部に近づくにつれて低くなる。そのため、焼成用さやの中央部と周縁部における熱容量を細かく調整することができ、焼成用さやの機械的強度を低下させることなく、親基板に形成された電子部品の電気特性ばらつきや親基板の機械的強度のばらつきを小さくすることができる。
[第3の実施形態 図5]
本発明に係る第3の実施形態の構成を図5に示す。図5は第3の実施形態における焼成用さや31の断面図である。本実施形態における調整板39も、底板32の裏面38に接触するように取りつけられることにより、焼成用さやの熱容量を調整する機能を有している。なお、焼成用さや31の概観斜視図は図1と同じであり、調整板39の平面図は図3と一部異なるのみであるため、ここでは省略する。
In the adjustment plate 29 according to the second embodiment, three types of through holes 23 having different sizes are arranged so that the sizes of the through holes 23 decrease from the central portion toward the peripheral portion of the adjustment plate 29. By arranging the largest through hole 23a at the center of the adjustment plate 29, the second largest through hole 23b around the through hole 23a, and the smallest through hole 23c around the through hole 23b, the unit of the adjustment plate 29 The arrangement density of the through holes per area decreases as the distance from the central portion approaches the peripheral portion. Therefore, it is possible to finely adjust the heat capacity at the central portion and the peripheral portion of the firing sheath, and without reducing the mechanical strength of the firing sheath, variation in electrical characteristics of the electronic components formed on the parent substrate and Variation in mechanical strength can be reduced.
[Third Embodiment FIG. 5]
The configuration of the third embodiment according to the present invention is shown in FIG. FIG. 5 is a cross-sectional view of a scab 31 for firing in the third embodiment. The adjustment plate 39 in the present embodiment also has a function of adjusting the heat capacity of the pod for firing by being attached so as to contact the back surface 38 of the bottom plate 32. Note that an overview perspective view of the firing sheath 31 is the same as FIG. 1, and a plan view of the adjustment plate 39 is only partially different from FIG.

第3の実施形態における調整板39では、第1の実施形態における調整板9と同様に、大きさの異なる貫通穴33を調整板39の中央部から周縁部に向かってその大きさが小さくなるように配置している。そして、貫通穴33aの内部に調整用部材40を配置している。この調整用部材40は、貫通穴33aの側壁に接するように配置され、その側壁部で接着剤により固着されている。なお、接着剤の代わりに調整用部材40と調整板39とをねじなどの取り付け部材により接合しても構わない。この調整用部材40として、調整板39とは異なる材料、特に熱容量の異なる材料を用いることにより、底板32の主面方向における熱容量の差を小さくすることができる。また、焼成炉内の水平方向あるいは高さ方向などの場所による温度ばらつきにより焼成用さや31および親基板37の主面方向に均一に温度が加わらずに焼成されるような場合、所定の貫通穴にのみ調整用部材40を配置することによりその温度ばらつきを小さくすることができ、電子部品の電気特性や機械的強度のばらつきを小さくすることができる。また、図5に示す断面図においては、貫通穴33aの内部全体に調整用部材40を配置しているが、貫通穴33aの厚み方向の一部にのみ調整用部材40を配置してもよい。このような構造にすることにより、底板32および親基板37の主面における熱容量の差をさらに小さくすることができる。
[第4の実施形態 図6]
本発明に係る第4の実施形態の構成を図6に示す。図6は第4の実施形態の焼成用さやにおける調整板49の平面図である。本実施形態における調整板49も、底板の裏面に接触するように取りつけられることにより、焼成用さやの熱容量を調整する機能を有している。なお、焼成用さやの概観斜視図は図1と同じであり、断面図は図2と一部異なるのみであるため、ここでは省略する。
In the adjustment plate 39 according to the third embodiment, the size of the through hole 33 having a different size decreases from the central portion toward the peripheral portion of the adjustment plate 39, similarly to the adjustment plate 9 according to the first embodiment. Are arranged as follows. And the adjustment member 40 is arrange | positioned inside the through-hole 33a. The adjusting member 40 is disposed so as to be in contact with the side wall of the through hole 33a, and is fixed to the side wall portion with an adhesive. In addition, you may join the adjustment member 40 and the adjustment board 39 with attachment members, such as a screw, instead of an adhesive agent. By using a material different from the adjustment plate 39, particularly a material having a different heat capacity, as the adjustment member 40, the difference in heat capacity in the main surface direction of the bottom plate 32 can be reduced. In addition, when the firing sheath 31 and the main surface of the parent substrate 37 are fired without being uniformly heated due to temperature variations depending on the location in the firing furnace in the horizontal direction or the height direction, the predetermined through hole is used. By arranging the adjusting member 40 only on the surface, the temperature variation can be reduced, and the variation in the electrical characteristics and mechanical strength of the electronic component can be reduced. In the cross-sectional view shown in FIG. 5, the adjustment member 40 is disposed in the entire inside of the through hole 33 a. However, the adjustment member 40 may be disposed only in a part in the thickness direction of the through hole 33 a. . By adopting such a structure, the difference in heat capacity between the main surfaces of the bottom plate 32 and the parent substrate 37 can be further reduced.
[Fourth Embodiment FIG. 6]
The configuration of the fourth embodiment according to the present invention is shown in FIG. FIG. 6 is a plan view of the adjustment plate 49 in the sheath for firing according to the fourth embodiment. The adjustment plate 49 in the present embodiment also has a function of adjusting the heat capacity of the sheath sheath by being attached so as to be in contact with the back surface of the bottom plate. Note that an outline perspective view of the sheath for baking is the same as that in FIG. 1, and a cross-sectional view is only partially different from that in FIG.

第4の実施形態における調整板49は、第1の実施形態における調整板9と同じ形状であり、調整板49の中央部に大きい貫通穴43a、貫通穴43aの周囲に小さい貫通穴43bを配置している。図6に示す平面図においては、底板の一方主面上に配置される親基板47を点線で示している。本実施形態においては、親基板47を載置した領域に貫通穴43を形成した領域が含まれるように構成しているため、底板および親基板47の中央部と周縁部における熱容量の差を小さくできるため、親基板47を構成する電子部品の電気特性や機械的強度ばらつきをさらに小さくすることができる。なお、貫通穴43の配置は、親基板47の熱容量のばらつきに応じて変更してもよく、親基板47の直下にすべての貫通穴43が配置されても構わない。
[第5の実施形態 図7、図8]
本発明に係る第5の実施形態の構成を図7、図8に示す。図7は第5の実施形態における焼成用さや51の断面図であり、図8は焼成用さや51における調整板59の平面図である。本実施形態における調整板59も、底板52の裏面に接触するように取りつけられることにより、焼成用さやの熱容量を調整する機能を有している。なお、焼成用さや51の概観斜視図は図1と同じであるため、ここでは省略する。
The adjustment plate 49 in the fourth embodiment has the same shape as the adjustment plate 9 in the first embodiment, and a large through hole 43a is arranged at the center of the adjustment plate 49, and a small through hole 43b is arranged around the through hole 43a. is doing. In the plan view shown in FIG. 6, the parent substrate 47 arranged on one main surface of the bottom plate is indicated by a dotted line. In the present embodiment, since the region where the through-holes 43 are formed is included in the region where the parent substrate 47 is placed, the difference in heat capacity between the center portion and the peripheral portion of the bottom plate and the parent substrate 47 is reduced. Therefore, variations in electrical characteristics and mechanical strength of the electronic components constituting the parent substrate 47 can be further reduced. The arrangement of the through holes 43 may be changed according to variations in the heat capacity of the parent substrate 47, and all the through holes 43 may be arranged immediately below the parent substrate 47.
[Fifth Embodiment FIGS. 7 and 8]
The configuration of the fifth embodiment according to the present invention is shown in FIGS. FIG. 7 is a cross-sectional view of the firing sheath 51 in the fifth embodiment, and FIG. 8 is a plan view of the adjustment plate 59 in the firing sheath 51. The adjustment plate 59 in this embodiment also has a function of adjusting the heat capacity of the pod for firing by being attached so as to be in contact with the back surface of the bottom plate 52. Note that an overview perspective view of the sheath for sheath 51 is the same as FIG.

第5の実施形態における調整板59は、第1の実施形態における調整板9と類似の形状であり、調整板59の中央部に大きい貫通穴53a、貫通穴53aの周囲に小さい貫通穴53bを配置している。そして、本実施形態においては、調整板59の周縁部に側壁部58を配置している。この側壁部58は、貫通穴53による熱容量の調整機能を補助する機能を有しており、調整板59と一体に形成されていても、別体で形成した後、調整板59と接着剤等により接合するように形成しても構わない。側壁部58は、特に底板52の周縁部での熱容量を大きくする効果があり、大型の焼成用さやなどの場合、熱容量を効果的に調整することができる。なお、側壁部58は底板52の周縁部全体に配置する必要はなく、底板52の対向辺部分にのみ配置したり、底板52の裏面からの高さを部分的に変更したり、調整板59と異なる材料を用いたりすることにより、さらに細かく熱容量を調整することができる。   The adjustment plate 59 in the fifth embodiment has a shape similar to that of the adjustment plate 9 in the first embodiment. A large through hole 53a is formed at the center of the adjustment plate 59, and a small through hole 53b is formed around the through hole 53a. It is arranged. In the present embodiment, the side wall 58 is disposed on the peripheral edge of the adjustment plate 59. The side wall portion 58 has a function of assisting the adjustment function of the heat capacity by the through hole 53. Even if the side wall portion 58 is formed integrally with the adjustment plate 59, the side wall portion 58 is formed separately from the adjustment plate 59 and the adhesive or the like. You may form so that it may join by. The side wall portion 58 has an effect of increasing the heat capacity particularly at the peripheral edge portion of the bottom plate 52, and the heat capacity can be effectively adjusted in the case of a large sized sheath. The side wall portion 58 does not need to be disposed on the entire periphery of the bottom plate 52, but is disposed only on the opposite side portion of the bottom plate 52, the height from the back surface of the bottom plate 52 is partially changed, or the adjustment plate 59. The heat capacity can be adjusted more finely by using different materials.

なお、本願発明における実施形態は前記の形態に限定されるものではなく、所望の特性を得るために適宜変更しても構わない。例えば、調整板に形成する貫通穴は矩形でもよく、1枚の調整板の中で部分的に貫通穴の形状を変更しても構わない。また、調整板は底板と同じ大きさでなくてもよく、底板の中央付近からずらして配置しても構わない。   In addition, embodiment in this invention is not limited to the said form, You may change suitably in order to acquire a desired characteristic. For example, the through hole formed in the adjustment plate may be rectangular, and the shape of the through hole may be partially changed in one adjustment plate. Further, the adjustment plate does not have to be the same size as the bottom plate, and may be shifted from the vicinity of the center of the bottom plate.

11、31、51 ・・・ 焼成用さや
2、32、52 ・・・底板
3、23、33、43、53 ・・・ 貫通穴
5、35,55 ・・・ 側壁板
7、37、47、57 ・・・ 親基板
9、29、39、49、59 ・・・ 調整板
40 ・・・ 調整用部材
58 ・・・ 側壁部
11, 31, 51 ・ ・ ・ Sheath sheath 2, 32, 52 ・ ・ ・ Bottom plate 3, 23, 33, 43, 53 ・ ・ ・ Through hole 5, 35, 55 ・ ・ ・ Side wall plate 7, 37, 47, 57... Parent substrate 9, 29, 39, 49, 59... Adjustment plate 40... Adjustment member 58.

Claims (7)

一方主面上に被焼成物を載置する底板と、
前記底板の周囲に設けられた側壁板と、
前記底板の他方主面に接触するように配置され、複数の貫通穴が形成された調整板と、
を備えたことを特徴とする焼成用さや。
On the other hand, a bottom plate for placing the object to be fired on the main surface;
A side wall plate provided around the bottom plate;
An adjustment plate disposed so as to be in contact with the other main surface of the bottom plate and having a plurality of through holes;
A pod for firing characterized by comprising:
前記調整板における前記複数の貫通穴の配置密度が前記側壁板に近づくにつれて低くなるように前記貫通穴が形成されていることを特徴とする請求項1記載の焼成用さや。   2. The firing sheath according to claim 1, wherein the through holes are formed so that an arrangement density of the plurality of through holes in the adjustment plate becomes lower as the side plate is approached. 前記貫通穴の大きさは前記側壁板に近づくにつれて小さくなるように前記貫通穴が形成されていることを特徴とする請求項1または2に記載の焼成用さや。   The sheath hole according to claim 1 or 2, wherein the through hole is formed so that a size of the through hole becomes smaller as the side wall plate is approached. 前記底板と前記調整板とは異なる材料で形成されていることを特徴とする請求項1乃至3のいずれかに記載の焼成用さや。   The pod for firing according to any one of claims 1 to 3, wherein the bottom plate and the adjustment plate are formed of different materials. 少なくとも一つの前記貫通穴の内部に調整用部材が配置されていることを特徴とする請求項1乃至4のいずれかに記載の焼成用さや。   The pod for firing according to any one of claims 1 to 4, wherein an adjustment member is disposed in at least one of the through holes. 前記底板の一方主面上から平面視したとき、前記被焼成物の載置領域に前記貫通穴を形成した領域が含まれることを特徴とする請求項1乃至5のいずれかに記載の焼成用さや。   6. The firing according to claim 1, wherein when viewed in plan from one main surface of the bottom plate, a region in which the through hole is formed is included in a placement region of the object to be fired. Saya. 前記調整板の前記底板と接触するように配置される主面と対向する主面の周縁部に側壁部が配置されていることを特徴とする請求項1乃至6のいずれかに記載の焼成用さや。   The side wall part is arrange | positioned in the peripheral part of the main surface opposite to the main surface arrange | positioned so that the said bottom plate of the said adjustment plate may be contacted, The baking for any one of Claim 1 thru | or 6 characterized by the above-mentioned. Saya.
JP2009278703A 2009-12-08 2009-12-08 Pod for baking Expired - Fee Related JP5434544B2 (en)

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JP2016074561A (en) * 2014-10-07 2016-05-12 三井金属鉱業株式会社 Firing jig and firing method

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JP2001146463A (en) * 1999-11-16 2001-05-29 Murata Mfg Co Ltd Jig for firing ceramic
JP2005225748A (en) * 2004-01-13 2005-08-25 Ngk Insulators Ltd Method for producing ceramic body and firing tool
JP2006240941A (en) * 2005-03-04 2006-09-14 Tdk Corp Method for firing ceramic molding
JP3153992U (en) * 2009-07-16 2009-09-24 株式会社丸栄産業合作社 Firing jig

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JP2001146463A (en) * 1999-11-16 2001-05-29 Murata Mfg Co Ltd Jig for firing ceramic
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Publication number Priority date Publication date Assignee Title
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