JP2011119527A - Package for semiconductor device and manufacturing method thereof - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a package for a semiconductor device and a manufacturing method thereof, wherein a simple manufacturing process, a low cost, and a stable operation are provided. <P>SOLUTION: The package for the semiconductor device has: a hollow package 50 with a recess formed to house the semiconductor device 10; a metallic lid 60 covering the upper surface of the hollow package; a lead terminal 30 to connect the terminal 11 of the semiconductor device to the outer wiring of the hollow package; and a connecting pin 70 formed on the side of the hollow package to connect the metallic lid to a ground terminal 31 connected to a ground wiring of all the lead terminals. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a package for a semiconductor device and a method for manufacturing the same, and more particularly to a package for a semiconductor device having a hollow package in which a recess for housing a semiconductor device is formed and a method for manufacturing the same.

  Conventionally, a base having a signal line and a ground line and having a portion on which an electronic component is mounted is provided with a bowl-shaped lid body having a recess so as to accommodate the electronic component inside with a metal sealing material interposed therebetween. An electronic component storage package that is attached by attaching a metal layer to the inner wall of the concave portion of the lid and electrically connecting the ground wire of the base body and the metal layer of the lid with a metal sealing material A component storage package is known (for example, see Patent Document 1).

  In such an electronic component storage package described in Patent Document 1, the ground wire of the base and the metal layer of the inner wall of the lid are electrically connected to shield the electronic component housed inside from the outside. It prevents the malfunction of electronic parts due to the intrusion.

Japanese Patent Laid-Open No. 5-144953

  However, in the configuration described in Patent Document 1 described above, a step of forming a metal layer is necessary, and in order to electrically connect the lid, the metal layer and the lid are bonded with a metal sealing material. Since the process is necessary, there are problems that the number of processes is increased and the cost is increased.

  Therefore, an object of the present invention is to provide a package for a semiconductor device and a method for manufacturing the same that can realize stable operation of the semiconductor device while simplifying the process and reducing the cost.

In order to achieve the above object, a package for a semiconductor device according to a first aspect of the present invention includes a hollow package in which a recess for housing a semiconductor device is formed,
A metal lid covering the upper surface of the hollow package;
A lead terminal for connecting the terminal of the semiconductor device and an external wiring of the hollow package;
It is provided in the side surface of the said hollow package, It has the connection pin which connects the said metal lid and the ground terminal connected with a ground wiring among this lead terminal, It is characterized by the above-mentioned.

  Thereby, the potential of the metal lid can be stabilized to the ground potential by connecting to the ground terminal of the metal lid by the connection pin on the side surface of the hollow package without using a complicated connection structure.

A second invention is a package for a semiconductor device according to the first invention,
The metal lid and the connection pin are integrally formed.

  As a result, the metal lid can be easily stabilized at the ground potential only by the connection between the connection pin and the ground terminal.

A third invention is a package for a semiconductor device according to the first or second invention,
The connection portion between the connection pin and the ground terminal has a fitting structure.

  As a result, the connection pin and the ground terminal can be connected very easily.

A fourth invention is a package for a semiconductor device according to the first invention,
The metal lid, the connection pin, and the metal lid are integrally formed.

  As a result, the assembly of the package for the semiconductor device can be further facilitated, and the connection portion can be eliminated, so that the possibility of poor connection can be eliminated.

A fifth invention is a semiconductor device package according to any one of the first to fourth inventions,
The hollow package is made of resin.

  Thereby, a hollow package can be constructed at low cost, and the potential of the metal lid can be stabilized while being low in cost.

According to a sixth aspect of the present invention, there is provided a method of manufacturing a package for a semiconductor device, wherein the upper surface is opened so that the die pad is accommodated on the inner bottom surface and the lead terminals arranged outside the die pad are arranged to penetrate the side surface. Forming a concave hollow package;
Mounting a semiconductor device on the die pad, and connecting a terminal of the semiconductor device to the lead terminal in the hollow package;
A process of covering the upper surface of the hollow package with a metal lid and connecting the metal lid and a ground terminal connected to the ground wiring of the lead terminal by arranging a connection pin on a side surface of the hollow package. It is characterized by including.

  Thereby, it is possible to easily connect the metal lid to the ground potential by using the connection pins on the side surface of the hollow package without forming a complicated connection structure.

A seventh invention is a method of manufacturing a package for a semiconductor device according to the sixth invention,
The metal lid and the connection pin are formed integrally, and when the metal lid is put on the upper surface of the hollow package, the connection pin is disposed so as to come to the position of the ground terminal. Features.

  As a result, the positioning for connecting the connection pin and the ground terminal is automatically performed only by placing the metal lid on the upper surface of the hollow package, and the package for the semiconductor device can be easily manufactured.

An eighth invention is a method of manufacturing a package for a semiconductor device according to the sixth or seventh invention,
The connection portion between the connection pin and the ground terminal has a fitting structure.

  Thereby, the connection between the connection pin and the ground terminal can be performed very easily by mechanical connection.

According to a ninth aspect of the present invention, there is provided a semiconductor device package manufacturing method comprising: a die pad; a lead terminal disposed outside the die pad; a metal lid; a ground terminal connected to a ground wiring among the lead terminals; Preparing a lead frame formed including a connection frame for connecting the lid;
Forming a concave hollow package having an open top surface so that the die pad is disposed on the bottom surface and the lead terminal penetrates the side surface;
Mounting a semiconductor device on the die pad, and connecting a terminal of the semiconductor device to the lead terminal in the hollow package;
Bending the lead frame so that the connection frame is along a side surface of the hollow package and the metal lid covers an upper surface of the hollow package.

  Thereby, the package for a semiconductor device can be manufactured by a simple bending process, and the package for a semiconductor device in which the potential of the metal lid is stabilized at the ground potential can be manufactured by a simple process.

A tenth invention is a method for manufacturing a package for a semiconductor device according to any one of the sixth to ninth inventions,
The step of forming the hollow package is performed by resin molding.

  Thereby, the package for semiconductor devices can be manufactured at low cost.

  According to the present invention, the potential of the metal lid of the semiconductor device package can be stabilized at a low cost by a simple process.

1 is a perspective view showing an example of an overall configuration of a package for a semiconductor device according to Example 1. FIG. It is the figure which showed an example of the hollow package formation process. It is the figure which showed an example of the semiconductor device mounting process. It is the figure which showed an example of the metal lid preparation process. It is the figure which showed an example of the metal lid installation process. 4 is a diagram illustrating an example of a method for connecting a ground connection pin 70 and a ground terminal 31. FIG. FIG. 3A is a relationship diagram between the ground connection pin 70 and the ground terminal 31 before connection. FIG. 3B is a cross-sectional view of the joint between the ground connection pin 70 and the ground terminal 31 after connection. FIG. 6 is a perspective view showing an example of the overall configuration of a semiconductor device package according to a second embodiment. It is the figure which showed the lead frame preparation process. It is the figure which showed an example of the hollow package formation process. It is the figure which showed an example of the initial stage of a semiconductor device mounting process and a bending process. It is the figure which showed an example of the completion stage of a bending process.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments for carrying out the present invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing an example of the overall configuration of a package for a semiconductor device according to Embodiment 1 of the present invention. In FIG. 1, the package for a semiconductor device according to the first embodiment includes a die pad 20, a lead terminal 30, a hollow package 50, a metal lid (lid) 60, and a ground connection pin 70. Further, a MEMS (Micro Electro Mechanical System) chip 10 and a bonding wire 40 are shown as related components of the semiconductor device package according to the first embodiment.

  In the semiconductor device package according to the first embodiment, the MEMS chip 10 is mounted on the die pad 20, and the die pad 20 is accommodated on the bottom surface of the concave hollow package 50. The MEMS chip 10 and the die pad 20 are surrounded by the side surface of the hollow package 50, and lead terminals 30 are provided so as to penetrate the side surface of the hollow package 50. That is, the lead terminal 30 exists both inside and outside the hollow package 50. The MEMS chip 10 includes a terminal 11 for inputting / outputting signals to / from an internal circuit, and the terminal 11 is electrically connected to the lead terminal 30 inside the hollow package 50 by a bonding wire 40. Yes. A metal lid 60 is provided on the upper surface of the hollow package 50, and the metal lid 60 covers the opening on the upper surface of the hollow package 50, which literally looks like a lid of the hollow package 50. On the side surface of the hollow package 50, a ground connection pin 70 is provided along the outside of the side surface extending in the vertical direction. The upper end of the connection pin 70 is connected to the metal lid 60, and the lower end is connected to the ground terminal 31 connected to the ground wiring among the lead terminals 30. The individual components of the semiconductor device package having such an arrangement will be described below.

  The MEMS chip 10 is a semiconductor device in which minute sensors, actuators, and the like are configured by a semiconductor. Therefore, a part of the MEMS chip 10 often includes a portion that performs mechanical operations such as vibration and deformation. The MEMS chip 10 can be applied to various sensors and actuators. For example, the MEMS chip 10 may be used as an acceleration sensor for a vehicle. In this case, the sensor unit of the MEMS chip 10 detects acceleration by detecting the magnitude or change of the load. The MEMS chip 10 has a circuit made of a semiconductor device inside, and input / output of signals to / from the internal circuit is performed using a terminal 11 provided on the outer surface.

  The die pad 20 is a support pad for mounting the MEMS chip 10. The die pad 20 may be made of metal, for example. The mounting of the MEMS chip 10 on the die pad 20 may be performed, for example, by bonding the side opposite to the terminal 11 of the MEMS chip 10 to the die pad 20. FIG. 1 shows an example in which the MEMS chip 10 is directly mounted on the die pad 20. For example, the MEMS chip 10 is mounted on a mounting substrate, and the mounting substrate on which the MEMS chip 10 is mounted. May be mounted on the die pad 20. As described above, the mounting of the MEMS chip 10 on the die pad 20 may be performed in various forms.

The lead terminal 30 is a terminal for inputting / outputting signals from / to the MEMS chip 10 inside the semiconductor package. Therefore, the lead terminal 30 is configured so as to penetrate the inside and the outside of the semiconductor package, and a part thereof exists inside the semiconductor package and a part exists outside the semiconductor package. The lead terminal 30 may be provided at various positions as long as it penetrates the inside and the outside of the semiconductor package, but in FIG. 1, it is provided so as to penetrate the side surface of the hollow package 50.
The lead terminal 30 includes a ground terminal 31 connected to the ground wiring, in addition to the input / output signal lead terminal 30 that conducts the input / output signal. Although the number of the ground terminals 31 is smaller than that of the input / output signal lead terminals 30, the ground terminals 31 are always provided as part of the lead terminals 30 because they are necessary for operating the internal circuit. In FIG. 1, lead terminals 30 at four corners are used as ground terminals 31.

  Note that the die pad 20 and the lead terminal 30 may be configured by punching a thin metal plate like a lead frame, for example.

  The bonding wire 40 is a metal wiring wire for connecting the terminal 11 of the MEMS chip 10 and the lead terminal 30. Using the bonding wire 40, the terminal 11 of the MEMS chip 10 is connected to a lead terminal 30 inside the semiconductor package, the lead terminal 30 outside the semiconductor package is connected to an external circuit, and voltage / current is supplied. It is performed from the outside of the semiconductor package. The ground terminal 11 of the MEMS chip 10 is connected to the ground terminal 31 among the lead terminals 30, and the ground terminal 31 is connected to an external ground wiring (not shown).

  Note that the wiring connection between the terminal 11 and the lead terminal 30 using the bonding wire 40, that is, wire bonding may be performed using, for example, a bump or the like.

  The hollow package 50 is a package for accommodating the MEMS chip 10 on the die pad 20. When a normal semiconductor device is accommodated instead of the MEMS chip 10, the periphery of the semiconductor device is generally sealed with resin. In the case of the MEMS chip 10, a sensor unit, an actuator unit, or the like is used. Since there is a part that performs the mechanical movement, it is necessary to keep the inside of the package hollow. Therefore, in the package for a semiconductor device according to the present embodiment, a concave hollow package is used and the hollow package is not sealed.

  The hollow package 50 may be made of resin, for example. The resin can be obtained at a very low cost compared to ceramics and the like. On the other hand, when resin is used, since there is no electrical shielding effect, there is a problem that the potential of the metal lid 60 is in a floating state and may become unstable. However, in the package for a semiconductor device according to the present embodiment, the metal lid 60 is connected to the ground terminal 31 so that the metal lid 60 is reliably kept at the ground potential, and the hollow package 50 is formed with an inexpensive resin package. Is possible.

  The hollow package 50 may have a concave shape with an open upper surface, like a box below the lunch box. Thereby, after resin molding, the MEMS chip 10 is mounted on the die pad 20, and wiring in the hollow package 50 can be performed by wire bonding.

  The metal lid 60 is a metal lid made of a metal plate. The metal lid 60 is configured to be larger than the upper surface of the hollow package 50, and various metal plates can be used as long as the upper surface of the metal lid 60 can be covered. However, if the size of the metal lid 60 is too large, the overall size of the semiconductor package becomes large. Therefore, the size is preferably slightly larger than the upper surface (or the bottom surface) of the hollow package 50.

  The ground connection pin 70 is a connection pin for connecting the metal lid 60 and the ground terminal 31. If the metal lid 60 is not connected to any potential and exists in a floating state, it may be affected by surrounding static electricity, high frequency, etc., and may have a potential due to static electricity. Such a potential affects an electrical signal output based on the mechanical detection of the MEMS chip 10 and may reduce the measurement accuracy and operation accuracy of the MEMS chip 10. Therefore, in the package for a semiconductor device according to the present embodiment, the metal lid 60 is connected to the ground terminal 31 and the potential of the metal lid 60 is fixed to the ground to stabilize the potential, thereby affecting the detection operation of the MEMS chip 10. The structure does not reach. Thereby, even if an inexpensive material is used for the hollow package 50 itself, the reliability of the operation of the MEMS chip 10 can be improved by fixing the potential of the metal lid 60 to the ground potential.

  The ground connection pin 70 can be provided at various positions as long as the metal lid 60 and the ground terminal 31 are electrically connected. However, from the viewpoint of reducing the resistance value of the ground connection pin 70 itself and simplifying the configuration, it is preferable to connect the metal lid 60 and the ground terminal 31 at the shortest distance. Along the side surface of the package 50, it may be provided to extend vertically toward the metal lid 60. In FIG. 1, since the ground terminals 31 are arranged at the four corners of the lead terminal 30, the ground connection pins 70 correspond to the positions of the ground terminals 31, and the four ground connection pins 70 are formed in the hollow package 50. It is provided along the side of the.

  The ground connection pin 70 is formed separately from the metal lid 60 and the ground terminal 30 and may be connected later, or may be formed integrally with either or both of the metal lid 60 and the ground terminal 30 from the beginning. May be. For example, if the ground connection pin 70 is integrally formed on the metal lid 60 from the beginning, only the connection between the ground connection pin 70 and the ground terminal 31 is performed after the metal lid 60 is put on the upper surface of the hollow package 50. What is necessary is just to reduce the number of processes of an assembly process and to assemble easily. For example, if the metal lid 60 and the ground connection pin 70 are integrally formed from the beginning and a fitting structure is formed on the joint surface between the lower end of the ground connection pin 70 and the ground terminal 31, it is extremely easy. The semiconductor package according to this embodiment can be manufactured.

  As described above, according to the semiconductor package according to the first embodiment, the potential of the metal lid 60 can be reliably set to the ground potential with a simple configuration using an inexpensive material, and the potential and electrostatic force of the MEMS chip 19 can be reduced. It is possible to reduce the unstable electric operation.

  Next, an example of a method for manufacturing a semiconductor package according to the first embodiment will be described with reference to FIGS. 2A to 2D and FIG. 2A to 2D and FIG. 3 are diagrams illustrating an example of a method for manufacturing a semiconductor package according to the first embodiment. 2A to 2D and FIG. 3, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  FIG. 2A is a diagram illustrating an example of a hollow package forming process. In the hollow package forming step, a concave hollow package 50 having an open upper surface is formed. At this time, the hollow package 50 is formed in such a shape that the die pad 20 is disposed on the bottom surface and the lead terminal 30 penetrates the side surface. For example, when the hollow package 50 is formed of a resin, the hollow package 50 may be resin-molded by injection molding using a mold having the above-described arrangement configuration. By the hollow package forming step, a concave space that can accommodate the MEMS chip 10 as a semiconductor device is formed.

  FIG. 2B is a diagram illustrating an example of a semiconductor device mounting process. In the semiconductor device mounting process, the MEMS chip 10 is mounted on the die pad 20, and the terminals 11 (not shown in FIG. 2B) of the MEMS chip 10 are connected to the lead terminals 30 including the ground terminals 31 by wire bonding. Is done. The MEMS chip 10 may be directly mounted on the die pad 20 as shown in FIG. 1, or is mounted on the mounting substrate 13 via the bumps 12 as shown in FIG. 2B. 13 may be mounted on the die pad 20 by the bumps 14. When the pitch of the terminals 11 of the MEMS chip 10 is too small, as shown in FIG. 2B, the pitch of the terminals connected to the terminals 11 through the mounting substrate 13 is widened to facilitate connection from the outside of the MEMS chip 10. You may make it.

  By the semiconductor device mounting process, the semiconductor device is accommodated on the bottom surface in the semiconductor package.

  FIG. 2C is a diagram illustrating an example of a metal lid preparation process. In the metal lid preparation process, a metal lid 60 to be placed on the upper surface of the hollow package 50 is prepared. In FIG. 2C, the metal lid 60 in which the metal lid 60 and the ground connection pin 70 are integrally formed from the beginning is prepared. In this case, the ground connection pin 70 is provided on the metal lid 60 so as to protrude substantially vertically from the flat metal lid 60. The position of the ground connection pin 70 is provided so as to reach the ground terminal 31 when the metal lid 60 is put on the upper surface of the hollow package 50.

  When the ground connection pin 70 is not integrated with the metal lid 60 and the metal lid 60 and the ground connection pin 70 are connected later, the metal lid 60 is a flat metal plate.

  FIG. 2D is a diagram illustrating an example of a metal lid installation process. In the metal lid installation process, the metal lid 60 is placed on the upper surface of the hollow package 50, and the opening on the upper surface of the hollow package 50 is closed by the metal lid 60. In the metal lid installation process, the ground connection pin 70 and the ground terminal 31 are also connected, and the metal lid 60 is connected to the ground terminal 31 via the ground connection pin 70.

  FIG. 3 is a diagram illustrating an example of a method of connecting the ground connection pin 70 and the ground terminal 31. FIG. 3A is a diagram illustrating an example of the relationship between the ground connection pin 70 and the ground terminal 31 before connection, and FIG. 3B illustrates the junction between the ground connection pin 70 and the ground terminal 31 after connection. It is the figure which showed an example of the cross section of a part.

  In FIG. 3A, the ground connection pin 70 has a cross-sectional configuration having a convex protrusion 71, and the ground terminal 31 has a cross-sectional configuration having a concave recess 32. The protrusion 71 and the recess 32 have a fitting structure, and are configured such that when the protrusion 71 is inserted into the recess 32, the ground connection pin 70 and the ground terminal 31 are fixed.

  In FIG. 3B, the protrusion 71 at the tip of the ground connection pin 70 and the recess 32 of the ground terminal 31 are fitted, and the joint surface between the ground connection pin 70 and the ground terminal 31 is fitted and fixed. It is shown.

  Thus, for example, the connection between the ground connection pin 70 and the ground terminal 31 may be performed by a mechanical fitting structure. Further, the connection between the ground connection pin 70 and the ground terminal 31 may be performed by bonding using solder or the like, or both of them may be used together by further adding bonding such as solder to the mechanical fitting structure. It may be.

  In FIG. 3, the tip of the ground connection pin 70 and the top surface of the ground terminal 31 form a joint surface. For example, the side surface is a joint surface and a side surface is provided with a fitting structure. Also good. As described above, the connection between the ground connection pin 70 and the ground terminal 31 is performed by various bonding methods as long as the electrical connection is appropriately performed and the bonding having an appropriate mechanical strength can be performed. Good.

  Returning to FIG. 2D. As described above, for example, the semiconductor device package according to the first embodiment is manufactured using the manufacturing method described with reference to FIGS. 2A to 2D. In order to fix the metal lid 60 to the ground potential, it is not necessary to form a complicated electrode connection structure, and a semiconductor package can be manufactured only by a simple assembly process.

  2C and 2D, the example in which the metal lid 60 and the ground connection pin 70 are integrated from the beginning has been described. However, in the case where the ground connection pin 70 is separate from the metal lid 60, the metal lid 60 is removed. After mounting on the upper surface of the hollow package 50, one end of the ground connection pin 70 may be connected to the metal lid 60 and the other end may be connected to the ground terminal 31. At that time, the fitting structure described with reference to FIG. 3 may be used as necessary.

  FIG. 4 is a perspective view showing an example of the entire configuration of the package for a semiconductor device according to the second embodiment of the present invention. 4, the package for a semiconductor device according to the second embodiment includes a die pad 25, a lead terminal 35, a hollow package 55, a metal lid 65, and a ground connection frame 75. The lead terminal 35 includes a ground terminal 36 connected to the ground wiring. Furthermore, a MEMS chip 15 and a bonding wire 45 are shown as related components of the semiconductor device package according to the present embodiment.

  A component of the semiconductor device package according to the second embodiment is that the ground connection pin 70 in the semiconductor device package according to the first embodiment is a ground connection frame 75. Is different.

  Further, in the arrangement configuration of the package for a semiconductor device according to the second embodiment, the arrangement position of the ground connection frame 75 is arranged not on the ground terminal 36 but on the side surface of the hollow package 55 outside the ground terminal 36. This is different from the ground connection pin 70 of the semiconductor device package according to the first embodiment.

  In appearance, other components and their arrangement are substantially the same as those of the semiconductor device package according to the first embodiment. However, the semiconductor device package according to the second embodiment is different from the semiconductor device package according to the first embodiment in that the ground terminal 36, the ground connection frame 75, and the metal lid 65 are integrally configured. Yes. That is, in the package for the semiconductor device according to the second embodiment, the die pad 25 of the metal portion, the lead terminal 35 including the ground terminal 36, the ground connection frame 75, and the metal lid 65 are configured by one lead frame, and the lead frame Is manufactured by bending. With such a configuration, a package for a semiconductor device can be manufactured very easily. In this respect, it is easier to understand the method of manufacturing the semiconductor device package, so the method of manufacturing the semiconductor device package according to the second embodiment will be described below. In the second embodiment, components similar to those in the first embodiment are referred to by the same names as those in the first embodiment, and description of each content is omitted.

  FIG. 5A to FIG. 5D are diagrams for explaining the method for manufacturing the package for a semiconductor device according to the second embodiment.

  FIG. 5A is a diagram showing a lead frame preparation process. In the lead frame preparation process, a lead frame 80 in which the metal lid 65 is integrated is prepared. The lead frame 80 includes a lead terminal 35L, a die pad 25, a lead terminal 35, a ground terminal 36, a ground connection frame 75, and a metal lid 65, and the configuration of the package for a semiconductor device according to the present embodiment. Elements are formed in a single lead frame 80. Among them, the left lead terminal 35L and the die pad 25 are each configured as an independent member, but the right lead terminal 35 includes a ground terminal 36 disposed at both ends and a metal lid 65. They are connected by a ground connection frame 75 and are integrally formed. Further, the constituent elements of the individual semiconductor device package are supported by the support frame 81 so as not to be separated until the processing is completed.

  Thus, the lead frame 80 in which the ground terminal 36, the ground connection frame 75, and the metal lid 65 are integrally formed is prepared, and the semiconductor device package according to the present embodiment is manufactured from the lead frame 80. Not only the process of connecting the frame 75 and the metal lid 65 but also the process of connecting the frame 75 for ground connection and the ground terminal 36 can be omitted, and the semiconductor device package according to the present embodiment is manufactured by a simple process. Can do.

  FIG. 5B is a diagram illustrating an example of a hollow package forming process. In the hollow package forming step, as described in the first embodiment, the lead terminals 35 and 35L including the die pad 25 and including the ground terminal 36 are recessed so that the tips on the die pad 25 side remain inside the hollow package 55. A hollow package 55 having a shape is formed. The hollow package 55 can be formed of various materials, but may be formed of resin, for example. When the hollow package 55 is configured as a resin package formed of resin, the resin molding may be performed by injection molding using a mold or the like.

  At this stage, the lead terminals 35 </ b> L and 35 and the die pad 20 are fixed to the hollow package 55 by forming the hollow package 55. Further, since the ground connection frame 75 and the metal lid 65 are fixed to the ground terminal 36 which is a part of the lead terminal 35, the support frame 81 may be cut at this stage.

  FIG. 5C is a diagram illustrating an example of an initial stage of the semiconductor device mounting process and the bending process. In the semiconductor device mounting step, the MEMS chip 25 which is a semiconductor device is mounted on the die pad 25. And using the bonding wire 45, the terminal 16 (not shown) of the MEMS chip 15 is connected to the lead terminals 35L and 35 by wire bonding. At this time, the MEMS chip 15 may be mounted on the mounting substrate 18 using the bumps 17 and the mounting substrate 18 may be mounted on the die pad 25 by the bumps 19 as necessary.

  A state in which the MEMS 15 and the lead terminals 35 and 35L are electrically connected by the semiconductor device mounting process, and power can be supplied to the MEMS chip 15 from the outside of the hollow package 55 using the lead terminals 35L and 35. It becomes.

  When the semiconductor device mounting process is completed, a bending process is performed. In the bending process, first, the ground connection frame 75 connected to the ground terminal 36 is bent and bent along the side surface of the hollow package 55. Next, the boundary portion between the ground terminal connection frame 75 and the metal lid 65 is bent so that the metal lid 65 covers and covers the open upper surface of the hollow package 65.

  FIG. 5D is a diagram illustrating an example of a completion stage of the bending process. In the final stage of the bending process, the ground connection frame 75 is bent along the side surface of the hollow package 65, and the metal lid 65 covers the open upper surface of the hollow package 65 and covers it. The opening is blocked. The lead terminals 35L and 35 including the ground terminal 36 are also bent and bent into a shape like a support base that opens outward as shown in FIG. 5D.

  Thus, according to the manufacturing method of the package for a semiconductor device according to the second embodiment, the metal lid 65 can be formed and grounded simultaneously with the lead processing step, and the number of steps can be greatly reduced. Further, since the metal lid 65 is grounded by the ground connection frame 75 and the ground terminal 36, the potential and electrostatic force of the metal lid can be reduced. Further, the hollow package 55 can use an inexpensive resin-made hollow package 55, and the metal lid 65 is grounded. This eliminates the need to reduce the cost of both materials and processing.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications and substitutions can be made to the above-described embodiments without departing from the scope of the present invention. Can be added. For example, in Embodiments 1 and 2, the semiconductor device package has been described. However, the present invention can be applied to all electronic components that are packaged using a package having a hollow structure.

  The present invention can be used for a package for an electronic component including a package for a semiconductor device. In particular, the present invention can be preferably used for packaging a MEMS that requires packaging of a hollow structure.

10, 15 MEMS chip 11, 16 Terminal 12, 14, 17, 19 Bump 13, 18 Mounting substrate 20, 25 Die pad 30, 35, 35L Lead terminal 31, 36 Ground terminal 40, 45 Bonding wire 50, 55 Hollow package 60, 65 Metal lid (lid)
70 Ground connection pin 75 Ground connection frame 80 Lead frame 81 Support frame

Claims (10)

A hollow package formed with a recess for accommodating a semiconductor device;
A metal lid covering the upper surface of the hollow package;
A lead terminal for connecting the terminal of the semiconductor device and an external wiring of the hollow package;
A package for a semiconductor device, which is provided on a side surface of the hollow package and includes a connection pin that connects the metal lid and a ground terminal connected to a ground wiring among the lead terminals.   The package for a semiconductor device according to claim 1, wherein the metal lid and the connection pin are integrally formed.   The package for a semiconductor device according to claim 1, wherein a connection portion between the connection pin and the ground terminal has a fitting structure.   The package for a semiconductor device according to claim 1, wherein the metal lid, the connection pin, and the metal lid are integrally formed.   The package for a semiconductor device according to claim 1, wherein the hollow package is made of a resin. Forming a hollow hollow package having an open top surface so that the die pad is housed on the bottom surface inside and the lead terminals disposed outside the die pad are disposed to penetrate the side surface;
Mounting a semiconductor device on the die pad, and connecting a terminal of the semiconductor device to the lead terminal in the hollow package;
A process of covering the upper surface of the hollow package with a metal lid and connecting the metal lid and a ground terminal connected to the ground wiring of the lead terminal by arranging a connection pin on a side surface of the hollow package. A method of manufacturing a package for a semiconductor device, comprising:   The metal lid and the connection pin are integrally formed, and when the metal lid is put on the upper surface of the hollow package, the connection pin is arranged so as to come to the position of the ground terminal. The method for manufacturing a package for a semiconductor device according to claim 6, wherein:   The method for manufacturing a package for a semiconductor device according to claim 6 or 7, wherein a connection portion between the connection pin and the ground terminal has a fitting structure. A lead formed including a die pad, a lead terminal disposed outside the die pad, a metal lid, and a connection frame that connects the ground terminal of the lead terminal connected to a ground wiring and the metal lid. Preparing a frame;
Forming a concave hollow package having an open top surface so that the die pad is disposed on the bottom surface and the lead terminal penetrates the side surface;
Mounting a semiconductor device on the die pad, and connecting a terminal of the semiconductor device to the lead terminal in the hollow package;
And bending the lead frame so that the connection frame is along a side surface of the hollow package and the metal lid covers the upper surface of the hollow package. .   The method for manufacturing a package for a semiconductor device according to claim 6, wherein the step of forming the hollow package is performed by resin molding.

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