CN114112120A - Sensor packaging structure and method - Google Patents
Sensor packaging structure and method Download PDFInfo
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- CN114112120A CN114112120A CN202111341694.1A CN202111341694A CN114112120A CN 114112120 A CN114112120 A CN 114112120A CN 202111341694 A CN202111341694 A CN 202111341694A CN 114112120 A CN114112120 A CN 114112120A
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Classifications
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L1/00—Measuring force or stress, in general
- G01L1/16—Measuring force or stress, in general using properties of piezoelectric devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
- G01L9/08—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of piezoelectric devices, i.e. electric circuits therefor
Abstract
The application relates to a sensor packaging structure and a method. Firstly, providing a circuit substrate; arranging a circuit chip on the circuit substrate, wherein the circuit chip is electrically connected with the circuit substrate; forming a packaging body on the circuit substrate, and packaging the circuit chip; and arranging a ceramic base and a micro-electro-mechanical system pressure sensor chip in the packaging body, wherein the ceramic base is arranged between the micro-electro-mechanical system pressure sensor chip and the circuit substrate. The thermal expansion coefficients of the micro-electro-mechanical system pressure sensor chip and the ceramic base are close, so that the stress generated by packaging is reduced, and the precision of a packaging structure is improved. The ceramic base and the micro-electro-mechanical system pressure sensor chip are located in the protective glue, so that the reliability of the packaging structure is improved. The ceramic base is adopted instead of the circuit substrate made of ceramic materials, so that the production cost is reduced. The circuit chip and the micro-electro-mechanical system pressure sensor chip are packaged on the circuit substrate, so that the integration level of the packaging structure is improved.
Description
Technical Field
The invention relates to the technical field of sensor packaging, in particular to a sensor packaging structure and a sensor packaging method.
Background
With the development of technology, the application of MEMS pressure sensors is particularly widespread. When the MEMS pressure sensor is applied, an Application Specific Integrated Circuit (ASIC) is needed to condition signals, and in order to protect the MEMS pressure sensor and the ASIC chip from being interfered by the external environment, the MEMS pressure sensor and the ASIC chip need to be packaged.
The existing packaging scheme mainly comprises that ASIC chip surface mount welding is completed firstly, a surrounding dam needs to be added to reserve a cavity packaged by the MEMS pressure sensor when the ASIC chip is packaged, the surrounding dam is not filled with a plastic package material in the region, and then the MEMS sensor is pasted on a circuit substrate in the cavity.
The circuit substrate generally adopts a substrate with FR-4 base material or BT resin as base material, and the difference of the thermal expansion coefficient between the substrate material and the MEMS chip material is large, so that the MEMS pressure sensor generates large packaging stress in the process of surface mounting packaging on the circuit substrate, and the precision of the MEMS pressure sensor is reduced.
Disclosure of Invention
Therefore, it is necessary to provide a sensor packaging structure and method for solving the problems that in the existing packaging scheme, the MEMS pressure sensor generates a large packaging stress during the process of mounting and packaging on the circuit substrate, and the accuracy of the MEMS pressure sensor is reduced.
A sensor package structure comprising:
a circuit substrate;
the packaging body is arranged on the circuit substrate;
the circuit chip is arranged in the packaging body and is electrically connected with the circuit substrate;
the ceramic base is positioned in the packaging body and is electrically connected with the circuit substrate;
the micro electro mechanical system pressure sensor chip is positioned in the packaging body and electrically connected with the ceramic base, and the ceramic base is arranged between the micro electro mechanical system pressure sensor chip and the circuit substrate.
In one embodiment, the package body includes a molding body, and the circuit chip is disposed on the molding body.
In one embodiment, the plastic package body is provided with a containing cavity, and the ceramic base and the mems pressure sensor chip are disposed in the containing cavity.
In one embodiment, the accommodating cavity is filled with a protective adhesive, and the ceramic base and the mems pressure sensor chip are located in the protective adhesive.
In one embodiment, the sensor package structure further includes:
the cover body covers one side, far away from the circuit substrate, of the packaging body, and an opening is formed in the part, covering the accommodating cavity, of the cover body.
A sensor packaging method adopts the sensor packaging structure, and the method comprises the following steps:
s10, providing the circuit substrate;
s20, disposing the circuit chip on the circuit board, the circuit chip being electrically connected to the circuit board;
s30, forming the package on the circuit board, and packaging the circuit chip;
s40, arranging the ceramic base and the MEMS pressure sensor chip in the packaging body, wherein the ceramic base is arranged between the MEMS pressure sensor chip and the circuit substrate.
In one embodiment, the package body comprises a plastic package body, and the plastic package body is provided with a containing cavity;
the S40 includes:
in the accommodating cavity, the ceramic base is arranged on the circuit substrate and is electrically connected with the circuit substrate;
in the accommodating cavity, the micro electro mechanical system pressure sensor chip is arranged on one side of the ceramic base, which is far away from the circuit substrate, and the micro electro mechanical system pressure sensor chip is electrically connected with the ceramic base.
In one embodiment, the S40 includes: and the welding balls at the bottom of the pressure sensor chip of the micro electro mechanical system are correspondingly welded with the metal pins on the upper surface of the ceramic base, so that the pressure sensor chip of the micro electro mechanical system is electrically connected with the ceramic base.
In one embodiment, the method further comprises the following steps:
s50, filling protective glue into the containing cavity, wherein the ceramic base and the micro-electromechanical system pressure sensor chip are located in the protective glue.
In one embodiment, the method further comprises the following steps:
and S60, covering a cover body on one side of the packaging body far away from the circuit substrate, wherein the part of the cover body covering the accommodating cavity is provided with an opening.
To sum up, a sensor package structure includes a circuit substrate, a package, a circuit chip, a ceramic base and a mems pressure sensor chip. The packaging body is arranged on the circuit substrate. The circuit chip is arranged in the packaging body and is electrically connected with the circuit substrate. The ceramic base is located in the packaging body and electrically connected with the circuit substrate. The micro-electro-mechanical system pressure sensor chip is positioned in the packaging body and is electrically connected with the ceramic base. The ceramic base is arranged between the micro-electro-mechanical system pressure sensor chip and the circuit substrate. The sensor packaging structure provided by the embodiment is additionally provided with the ceramic base, and the thermal expansion coefficients of the micro electro mechanical system pressure sensor chip and the ceramic base are close, so that the packaging stress generated in the packaging process is obviously reduced, the precision of the micro electro mechanical system pressure sensor chip is improved, and the detection precision of the whole packaging structure is improved.
The sensor packaging method provided by the embodiment adopts the sensor packaging structure. Firstly, providing the circuit substrate; arranging the circuit chip on the circuit substrate, wherein the circuit chip is electrically connected with the circuit substrate; forming the packaging body on the circuit substrate, and packaging the circuit chip; and finally, arranging the ceramic base and the micro-electro-mechanical system pressure sensor chip in the packaging body, wherein the ceramic base is arranged between the micro-electro-mechanical system pressure sensor chip and the circuit substrate. In the sensor packaging method provided by this embodiment, the ceramic base is disposed between the mems pressure sensor chip and the circuit substrate, and the ceramic base transmits the pressure signal detected by the mems pressure sensor chip to the circuit substrate, so that the thermal expansion coefficients of the mems pressure sensor chip and the ceramic base are close to each other, thereby reducing stress possibly generated by packaging, improving the accuracy of the mems pressure sensor chip, and improving the detection accuracy of the whole packaging structure. In the embodiment of the application, the ceramic base and the micro-electromechanical system pressure sensor chip are positioned in the protective glue, so that the reliability of the sensor packaging structure is improved. Adopt in this application embodiment the circuit substrate of ceramic base rather than ceramic material has reduced manufacturing cost, is applicable to batch production. In the embodiment of the application, the circuit chip and the micro-electro-mechanical system pressure sensor chip are packaged on the circuit substrate at the same time, so that the integration level of the sensor packaging structure is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments or the conventional technologies of the present application, the drawings used in the descriptions of the embodiments or the conventional technologies will be briefly introduced below, it is obvious that the drawings in the following descriptions are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a first schematic structural diagram of a sensor package structure according to an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a sensor package structure according to an embodiment of the present disclosure;
fig. 3 is a schematic structural diagram three of a sensor package structure according to an embodiment of the present application;
fig. 4 is a schematic flow chart of a sensor packaging method according to an embodiment of the present application.
Reference numerals:
a sensor package structure 10; a circuit board 100; a package body 200; a plastic package body 210; a housing cavity 220; a circuit chip 300; a ceramic base 400; a mems pressure sensor chip 500; a protective adhesive 600; a cover 700.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is further described in detail below by way of embodiments and with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
The numbering of the components as such, e.g., "first", "second", etc., is used herein only to distinguish the objects as described, and does not have any sequential or technical meaning. The term "connected" and "coupled" when used in this application, unless otherwise indicated, includes both direct and indirect connections (couplings). In the description of the present application, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations or positional relationships based on those shown in the drawings, and are used only for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be considered as limiting the present application.
In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through intervening media. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
Referring to fig. 1, an embodiment of the present application provides a sensor package structure, including: the circuit board comprises a circuit substrate 100, a packaging body 200, a circuit chip 300, a ceramic base 400 and a micro-electromechanical system pressure sensor chip 500. The package 200 is disposed on the circuit substrate 100. The circuit chip 300 is disposed in the package 200. The circuit chip 300 is electrically connected to the circuit substrate 100; the ceramic base 400 is located within the package 200. The ceramic base 400 is electrically connected to the circuit board 100. The mems pressure sensor die 500 is located within the package 200. The mems pressure sensor die 500 is electrically connected to the ceramic base 400. The ceramic base 400 is disposed between the mems pressure sensor die 500 and the circuit substrate 100.
The Micro Electro Mechanical Systems (MEMS) pressure sensor chip 500 is referred to as a MEMS pressure sensor chip. The Circuit chip 300 includes an Application Specific Integrated Circuit (ASIC), which is abbreviated as an ASIC chip.
In the sensor package structure provided by this embodiment, the ceramic base 400 is added, and the thermal expansion coefficients of the mems pressure sensor chip 500 and the ceramic base 400 are close to each other, so that the package stress generated in the package process is significantly reduced, the precision of the mems pressure sensor chip 500 is improved, and the detection precision of the whole package structure is improved.
In one embodiment, the package 200 includes a molding compound 210, and the circuit chip 300 is disposed on the molding compound 210.
The molding compound 210 includes a molding compound. The plastic packaging material comprises epoxy resin glue. The circuit substrate 100 is filled with the molding compound through a pre-fabricated mold to form the molding body 210, and the circuit chip 300 is protected. The circuit chip 300 includes the ASIC chip. At present, the mainstream traditional packaging adopts metal leads (gold wires, copper wires and the like) to realize the connection and transmission of electric signals between a chip and a PCB or other media. The plastic package body 210 is formed by the plastic package material to protect the circuit chip 300, so that the reliability risks of falling or breaking of the metal lead and the like are overcome.
In one embodiment, the plastic package body 210 defines a receiving cavity 220, and the ceramic base 400 and the mems pressure sensor chip 500 are disposed in the receiving cavity 220.
The molding compound is filled into the circuit substrate 100 through the prefabricated mold to form the molding body 210. The plastic package body 210 and the circuit substrate 100 form the accommodating cavity 220 with an open upper end. The ceramic base 400 is electrically connected to the circuit board 100. The mems pressure sensor die 500 is then electrically connected to the ceramic base 400. The ceramic mount 400 is between the mems pressure sensor die 500 and the ceramic mount 400.
Electrically connecting the ceramic submount 400 with the circuit substrate 100 includes: solder paste is dotted on the metal pins of the circuit substrate 100 at the bottom of the accommodating cavity 220, the ceramic base 400 is attached to the circuit substrate 100 by a chip mounter, and then the ceramic base 400 is fixed on the circuit substrate 100 by reflow soldering. Electrically connecting the MEMS pressure sensor die 500 to the ceramic base 400 includes: ceramic base 400 keeps away from the upper surface point silica gel of circuit substrate 100, then will through the chip mounter micro-electromechanical system pressure sensor chip 500 pastes the dress and is in ceramic base 400 keeps away from one side of circuit substrate 100, micro-electromechanical system pressure sensor chip 500 bottom solder ball with ceramic base 400 keeps away from the metal pin of one side of circuit substrate 100 corresponds the welding, thereby micro-electromechanical system pressure sensor chip 500 passes through ceramic base 400 with circuit substrate 100 realizes switching on.
Referring to fig. 2, the circuit chip 300 may be electrically connected to the circuit substrate 100 by a bonding wire. The mems pressure sensor die 500 can be electrically connected to the ceramic base 400 by way of a bond wire.
Referring to fig. 3, the ceramic base 400 may be attached to the circuit substrate 100 by using a silicon gel, a conductive adhesive, or a solder paste, the silicon gel is dispensed on the upper surface of the ceramic base 400 away from the circuit substrate 100, and then the mems pressure sensor chip 500 is attached to the side of the ceramic base 400 away from the circuit substrate 100 by using the mounter, and the mems pressure sensor chip 500 may be directly electrically connected to the circuit substrate 100 by using a metal wire or the like. The mems pressure sensor chip 500 can transmit the detected pressure information to the circuit chip 300 directly through the circuit substrate 100 for processing.
The mems pressure sensor chip 500 needs to detect pressure changes and cannot be packaged by filling the molding compound. The plastic package body 210 is provided with a containing cavity 220, so that the ceramic base 400 and the mems pressure sensor chip 500 are conveniently disposed in the containing cavity 220.
In one embodiment, the cavity 220 is filled with a protective adhesive 600, and the ceramic base 400 and the mems pressure sensor chip 500 are located in the protective adhesive 600.
The protective adhesive 600 includes soft silicone. After the ceramic base 400 and the mems pressure sensor chip 500 are disposed in the accommodating cavity 220, the protective adhesive 600 is injected into the accommodating cavity 220. The height of the protective adhesive 600 is not higher than that of the plastic package body 210, so that the cover body 700 can be added later. The protective adhesive 600 is used to protect the ceramic base 400 and the mems pressure sensor chip 500. The protective adhesive 600 has waterproof, moistureproof and dustproof performances, and also has the performances of thermal shock resistance, aging resistance, salt mist resistance, good flexibility and the like. The protection adhesive 600 isolates the ceramic base 400 and the mems pressure sensor chip 500 from the outside air, thereby preventing the ceramic base 400 and the mems pressure sensor chip 500 from the external interferences such as water vapor erosion. The protective adhesive 600 includes a soft adhesive. The accommodating cavity 200 is communicated with the outside, when the air pressure changes, the protective adhesive 600 deforms, and the deformation of the protective adhesive 600 can deform the surface film of the pressure sensor chip 500 of the micro electro mechanical system, so that the pressure sensor chip 500 of the micro electro mechanical system can detect pressure information.
In an embodiment, the sensor package structure further includes a cover 700, the cover 700 covers a side of the package body 200 away from the circuit substrate 100, and an opening is formed in a portion of the cover 700 covering the accommodating cavity 220.
The cover body 700 includes a metal cover. The portion of the cover 700 covering the receiving cavity 220 is provided with an opening. The containing cavity 200 is communicated with the outside, when the packaging body is subjected to external pressure, air pressure changes, the protective adhesive 600 deforms, and the deformation of the protective adhesive 600 can enable the surface film of the micro-electro-mechanical system pressure sensor chip 500 to deform, so that the micro-electro-mechanical system pressure sensor chip 500 can detect pressure information. The mems pressure sensor chip 500 can transmit the pressure information detected by the mems pressure sensor chip 500 to the circuit chip 300 for processing through the ceramic base 400 and the circuit substrate 100.
Referring to fig. 4, in the sensor package method provided in this embodiment, the sensor package structure is adopted, and the method includes: s10, providing the circuit substrate 100. S20, the circuit chip 300 is mounted on the circuit board 100, and the circuit chip 300 is electrically connected to the circuit board 100. S30, the package 200 is formed on the circuit board 100, and the circuit chip 300 is packaged. S40, disposing the ceramic base 400 and the mems pressure sensor chip 500 in the package 200, wherein the ceramic base 400 is disposed between the mems pressure sensor chip 500 and the circuit substrate 100.
Specifically, the method for electrically connecting the circuit chip 300 to the circuit substrate 100 includes a surface mount method and a bonding wire bonding method. The surface mounting method includes mounting the circuit chip 300 on the circuit board 100 in the surface mounting method, and then soldering by reflow soldering. The surface mounting method has simple flow, but the chip stacking and packaging are difficult to realize. The wire bonding method includes electrically connecting the circuit chip 300 to the circuit substrate 100 by the wire bonding method. The flow of the mode of bonding wires by the patches is more complex than that of the mode of surface patches, but the design in the early stage is simpler, and the stack packaging can be simply realized, so that the packaging integration level is higher, and the packaging area is smaller.
Here, the step of forming the package 200 on the circuit board 100 and packaging the circuit chip 300 includes filling the circuit board 100 with the molding compound through the mold prepared in advance to form the molding compound 210 and protect the circuit chip 300.
In the sensor packaging method provided by this embodiment, the ceramic base 400 is disposed between the mems pressure sensor chip 500 and the circuit substrate 100, and the ceramic base 400 transmits the pressure signal detected by the mems pressure sensor chip 500 to the circuit substrate 100. The thermal expansion coefficients of the mems pressure sensor chip 500 and the ceramic base 400 are close to each other, which reduces the stress that may be generated by packaging, improves the precision of the mems pressure sensor chip 500, and improves the detection precision of the whole packaging structure.
In one embodiment, the package body 200 includes a molding body 210. The plastic package body 210 is provided with an accommodating cavity 220. The S40 includes: in the accommodating cavity 220, the ceramic base 400 is disposed on the circuit substrate 100, and the ceramic base 400 is electrically connected to the circuit substrate 100; in the accommodating cavity 220, the mems pressure sensor chip 500 is disposed on a side of the ceramic base 400 away from the circuit substrate 100, and the mems pressure sensor chip 500 is electrically connected to the ceramic base 400.
The circuit substrate 100 is filled with the molding compound through the prefabricated mold to form the molding compound 210, and the molding compound 210 is provided with an accommodating cavity 220. In the accommodating cavity 220, the ceramic base 400 is electrically connected to the circuit substrate 100, and then the mems pressure sensor chip 500 is electrically connected to the ceramic base 400. The ceramic mount 400 is between the mems pressure sensor die 500 and the ceramic mount 400. The signals output by the mems pressure sensor chip 500 are transmitted to the circuit substrate 100 through the ceramic base 400. The pressure signal detected by the mems pressure sensor chip 500 is transmitted to the circuit substrate 100 through the ceramic base 400. The thermal expansion coefficients of the micro electro mechanical system pressure sensor chip and the ceramic base are close, stress possibly generated by packaging is reduced, the precision of the micro electro mechanical system pressure sensor chip is improved by 500, and the detection precision of the whole packaging is improved.
In one embodiment, the S40 includes: the solder balls at the bottom of the mems pressure sensor chip 500 are soldered to the metal pins on the upper surface of the ceramic base 400, so that the mems pressure sensor chip 500 is electrically connected to the ceramic base 400.
In the embodiment of the present application, the solder balls at the bottom of the mems pressure sensor chip 500 are correspondingly soldered to the metal pins on the upper surface of the ceramic base 400, so as to fix the mems pressure sensor chip 500 on the upper surface of the ceramic base 400.
The S40 may further include: ceramic base 400 can be through subsides dress such as silica gel, conducting resin or tin cream on circuit substrate 100 ceramic base 400 keeps away from circuit substrate 100's upper surface point silica gel, then passes through the chip mounter will micro-electromechanical system pressure sensor chip 500 pastes the dress ceramic base 400 keeps away from one side of circuit substrate 100, micro-electromechanical system pressure sensor chip 500 can directly through metal wire etc. with circuit substrate 100 carries out the electricity and connects. The mems pressure sensor chip 500 can directly transmit the detected pressure information to the circuit chip 300 through the circuit substrate 100 for processing.
In one embodiment, S50, the accommodating cavity is filled with a protective adhesive 600, and the ceramic base 400 and the mems pressure sensor chip 500 are located in the protective adhesive 600.
The protective adhesive 600 includes soft silicone. The ceramic base 400 and the mems pressure sensor chip 500 are disposed behind the accommodating cavity 220, the protective glue 600 is injected into the accommodating cavity 220, and the height of the protective glue 600 is not higher than that of the plastic package body 210, so that the cover body 700 is conveniently added in a subsequent process. The protective adhesive 600 is used to protect the ceramic base 400 and the mems pressure sensor chip 500. The protective adhesive 600 has waterproof, moistureproof and dustproof performances, and also has the performances of thermal shock resistance, aging resistance, salt mist resistance, good flexibility and the like. The protection adhesive 600 isolates the ceramic base 400 and the mems pressure sensor chip 500 from the outside air, thereby preventing the ceramic base 400 and the mems pressure sensor chip 500 from the external interferences such as water vapor erosion.
In one embodiment, S60, a cover 700 covers a side of the package body 200 away from the circuit substrate 100, and an opening is disposed in a portion of the cover 700 covering the accommodating cavity 220.
The portion of the cover 700 covering the receiving cavity 220 is provided with an opening. The containing cavity 200 is communicated with the outside, when the packaging body is subjected to external pressure, air pressure changes, the protective adhesive 600 deforms, and the deformation of the protective adhesive 600 can enable the surface film of the micro-electro-mechanical system pressure sensor chip 500 to deform, so that the micro-electro-mechanical system pressure sensor chip 500 can detect pressure information. The mems pressure sensor chip 500 can transmit the pressure information detected by the mems pressure sensor chip 500 to the circuit chip 300 for processing through the ceramic base 400 and the circuit substrate 100.
Specifically, after covering the cover 700, lettering and marking are performed on the surface of the cover 700, and the types of the circuit chip 300 and the mems pressure sensor chip 500 are marked, so as to facilitate subsequent use.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present patent. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A sensor package structure, comprising:
a circuit board (100);
a package (200) provided on the circuit board (100);
a circuit chip (300) disposed in the package (200), the circuit chip (300) being electrically connected to the circuit substrate (100);
the ceramic base (400) is positioned in the packaging body (200), and the ceramic base (400) is electrically connected with the circuit substrate (100);
the MEMS pressure sensor chip (500) is located in the packaging body (200), the MEMS pressure sensor chip (500) is electrically connected with the ceramic base (400), and the ceramic base (400) is arranged between the MEMS pressure sensor chip (500) and the circuit substrate (100).
2. The sensor package structure of claim 1, characterized in that the package body (200) comprises a plastic package body (210), the circuit chip (300) being disposed on the plastic package body (210).
3. The sensor package structure of claim 2, wherein the molding compound (210) defines a receiving cavity (220), and the ceramic base (400) and the mems pressure sensor chip (500) are disposed in the receiving cavity (220).
4. The sensor package structure of claim 3, wherein the cavity (220) is filled with a protective glue (600), and the ceramic base (400) and the MEMS pressure sensor chip (500) are located in the protective glue (600).
5. The sensor package structure of claim 4, further comprising a cover (700), wherein the cover (700) covers a side of the package body (200) away from the circuit substrate (100), and an opening is formed in a portion of the cover (700) covering the accommodating cavity (220).
6. A method of packaging a sensor, using the sensor package structure of claim 1, the method comprising:
s10, providing the circuit substrate (100);
s20, arranging the circuit chip (300) on the circuit substrate (100), wherein the circuit chip (300) is electrically connected with the circuit substrate (100);
s30, forming the package (200) on the circuit board (100), and packaging the circuit chip (300);
s40, arranging the ceramic base (400) and the MEMS pressure sensor chip (500) in the packaging body (200), wherein the ceramic base (400) is arranged between the MEMS pressure sensor chip (500) and the circuit substrate (100).
7. The sensor packaging method according to claim 6, wherein the package body (200) comprises a plastic package body (210), and the plastic package body (210) is provided with a containing cavity (220);
the S40 includes:
arranging the ceramic base (400) on the circuit substrate (100) in the accommodating cavity (220), and electrically connecting the ceramic base (400) and the circuit substrate (100);
in the accommodating cavity (220), the MEMS pressure sensor chip (500) is arranged on one side, away from the circuit substrate (100), of the ceramic base (400), and the MEMS pressure sensor chip (500) is electrically connected with the ceramic base (400).
8. The sensor packaging method of claim 7, wherein the S40 includes: the solder balls at the bottom of the pressure sensor chip (500) of the micro electro mechanical system are correspondingly welded with the metal pins on the upper surface of the ceramic base (400), so that the pressure sensor chip (500) of the micro electro mechanical system is electrically connected with the ceramic base (400).
9. The sensor packaging method of claim 8, further comprising:
s50, filling a protective adhesive (600) into the containing cavity, wherein the ceramic base (400) and the MEMS pressure sensor chip (500) are located in the protective adhesive (600).
10. The sensor packaging method of claim 9, further comprising:
and S60, covering a cover body (700) on one side of the packaging body (200) far away from the circuit substrate (100), wherein an opening is formed in the part of the cover body (700) covering the accommodating cavity (220).
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