JP2011119474A - Two-color molding with heat radiation part and equipment with heating body - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a two-color molding with a heat radiation part which can be suitably used as a heat radiation member of electronic equipment etc. having a heating part and made of a synthetic resin, and the equipment with the heating body including the two-color molding with the heat radiation part. <P>SOLUTION: The two-color molding 40 with the heat radiation part includes: a main body part 41 made of a synthetic resin; and the heat radiation part 42 provided to at least a part of an external surface of the main body part 41 and made of a synthetic resin having higher thermal conductivity than the main body part 41; wherein the main body part 41 and heat radiation part 42 are molded in one body through two-color molding. The equipment with the heating body includes: a case 50; the heating body 57 installed in the case 50; and a facing body which faces the heating body 57; wherein the facing body comprises the two-color molding 40 with the heat radiation part, and the heat radiation part 42 of the two-color molding 40 with the heat radiation part comes into contact with the heating body 57 directly or via heat transmitting material. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a two-color molded product with a heat radiating part and a device with a heating element, and in particular, a heat radiating part suitably used as a heat radiating member for efficiently radiating heat generated by a CPU of an electronic device to prevent local overheating. The present invention relates to a two-color molded product with a heating element and a device with a heating element including the two-color molded product with a heat radiating portion.

  In recent years, OA equipment and electronic devices have become smaller and lighter and more accurate, and the Internet has spread rapidly and the IT revolution has progressed rapidly. Along with this, so-called mobile phones are carried around these OA devices and electronic devices. The spread of terminals (mobile) is remarkable. Typical examples of the portable terminal include a notebook personal computer, an electronic notebook, a mobile phone, and a PDA, and it is expected that diversification, multifunction, and performance will be further increased in the future.

  Not only these mobile terminals, but also in the field of electrical / electronic / OA equipment parts, machine parts, and vehicle parts, most equipments are equipped with heat-generating parts such as CPUs. As the performance increases, the amount of power consumption increases and the amount of heat generated from the components tends to increase. Therefore, there is a concern that local high temperatures may cause troubles such as malfunctions.

  Conventionally, in order to prevent local overheating of these devices, a heat sink made of a metal having excellent thermal conductivity such as aluminum or copper has been used. That is, one end of the heat radiating plate is brought into contact with the heat generating part directly or via a heat transfer material, and the heat transmitted from the heat generating part to the abutting part is radiated to the other end side of the heat radiating plate, so that the overall temperature is increased. Leveling is performed, thereby preventing local overheating of the heat generating part (for example, Patent Documents 1 and 2).

  Generally, housings such as electrical / electronic / OA equipment parts, machine parts, and vehicle parts are made of thermoplastic resin. Therefore, conventionally, a metal body manufactured in a separate process from the manufacturing process of the housing is used. The heat sink is attached to the housing made of thermoplastic resin when assembling the parts, or the heat sink is arranged by attaching a metal heat sink to the substrate made of thermoplastic resin in advance. The material is made.

JP 2002-184920 A JP 2001-166851 A

However, a heat sink made of a metal material has the following problems.
(1) Since the weight is heavier than resin, it becomes a factor that increases the weight of the equipment.
(2) It is necessary to manufacture a heat sink separately from the housing manufacturing process, and attach the manufactured heat sink to the substrate etc. when assembling the equipment or in a separate process. It becomes a factor to increase.

  It is also conceivable to arrange a heat sink made of metal in advance in a mold and attach the heat sink together with the case or the substrate when forming the case or the substrate, even in this case, Separately, it is necessary to manufacture a heat radiating plate, and in the case of integrally molding a metal and a resin, there may be a problem in the adhesion between the two due to differences in materials and thermal expansion coefficients.

  The present invention solves the above-described conventional problems and can be suitably used as a heat radiating member for an electronic device or the like having a heat generating portion. It is an object to provide a device with a heating element comprising:

  As a result of intensive studies to solve the above-mentioned problems, the present inventor is a two-color molded product with a heat radiation portion in which a heat radiation portion made of a synthetic resin having high thermal conductivity is integrally molded with a synthetic resin main body portion by two-color molding. The present inventors have found that the above problems can be solved.

  The present invention has been achieved on the basis of such findings, and the gist thereof is as follows.

[1] A main body portion made of a synthetic resin and a heat radiating portion made of a synthetic resin having higher thermal conductivity than the main body portion provided on at least a part of the outer surface of the main body portion. And a two-color molded product with a heat-dissipating part, wherein the two-color molding is integrally molded.

[2] In [1], the main body portion and the heat radiating portion are plate-shaped, and the plate-shaped heat radiating portion is provided on one plate surface of the plate-shaped main body portion. Molding.

[3] The two-color molded product with a heat radiating part according to [2], wherein the plate-like heat radiating part protrudes from a plate surface of the plate-like main body part.

[4] The two-color molded product with a heat radiating portion according to [2], wherein the plate-like heat radiating portion does not protrude from the plate surface of the plate-like main body portion.

[5] In any one of [1] to [4], the main body portion is made of a polycarbonate resin composition comprising a polycarbonate resin or a composite resin composition of a polycarbonate resin and a styrene resin, and the heat dissipation portion is A two-color molded product with a heat radiating part, comprising a polycarbonate resin composition containing a high thermal conductive filler.

[6] In any one of [1] to [5], the heat radiating portion is directly or heat-transferred to the heating element of the device with the heating element including the case and the heating element installed in the case. A two-color molded product with a heat radiating part, wherein the two-color molded product is used so as to abut through a material.

[7] A two-color molded product with a heat radiating part according to [6], which is used so as to constitute at least a part of the case or the lid of the case.

[8] In [6] or [7], in the case, a first region in which a heating element is disposed, and a low heat generation in which the heating element is not disposed or the amount of heat generated is smaller than that of the heating element. A two-color molded product with a heat dissipating part, such that the heat dissipating part continuously extends from the first area to the second area. A two-color molded product with a heat radiating part characterized by being used.

[9] The two-color molded product with a heat radiating part according to any one of [6] to [8], wherein the device with a heating element is an electronic device, and the heating element is a CPU.

[10] In a device with a heating element including a case, a heating element installed in the case, and an opposing body facing the heating element, the opposing body is any one of [1] to [9] A device with a heating element, comprising a two-color molded product with a heat radiating portion, wherein the heat radiating portion of the two-color molded product with a heat radiating portion is in contact with the heat generating member directly or through a heat transfer material.

[11] The device with a heating element according to [10], wherein the two-color molded product with a heat radiation portion constitutes at least a part of the case or a lid of the case.

[12] In [10] or [11], the first region in which the heating element is disposed in the case, and the low heating element in which the heating element is not disposed or has a smaller amount of heat generation than the heating element. There is a second area where the heater is installed, and the heat dissipating part continuously extends from the first area to the second area.

[13] The device with a heating element according to any one of [10] to [12], wherein the device with a heating element is an electronic device, and the heating element is a CPU.

  The two-color molded product with a heat radiating portion of the present invention includes a synthetic resin main body portion, a heat radiating portion made of a synthetic resin having higher thermal conductivity than the main body portion, provided on at least a part of the outer surface of the main body portion. Is formed by two-color molding, so heat generated by using a heat-dissipating part made of highly heat-conductive synthetic resin directly in contact with a heat-generating part such as an electronic device or via a heat transfer material It is possible to efficiently dissipate the heat generated from the part and prevent local overheating (Claim 1).

  In general, resin molded products with increased thermal conductivity tend to have lower physical properties such as mechanical strength than resin molded products that do not contain these fillers due to the blending of high thermal conductive fillers with the resin. However, since the two-color molded product with a heat radiating portion of the present invention has a synthetic resin-made main body portion as a support member of the heat radiating portion, the heat radiating portion can be effectively reinforced with the main body portion.

  The two-color molded product with a heat dissipation portion of the present invention is lightweight because the whole is made of a synthetic resin, can suppress an increase in weight of an electronic device, etc., and is integrally molded by two-color molding, It can be manufactured in a single molding process and has excellent productivity. Moreover, since it is easy to adjust the material and the thermal expansion coefficient of the main body and the heat radiating portion, a molded product having excellent adhesion between the main body and the heat radiating portion can be obtained.

  In the two-color molded product with a heat radiating portion of the present invention, the main body portion and the heat radiating portion are particularly plate-shaped, and the plate-shaped heat radiating portion is preferably provided on one plate surface of the plate-shaped main body portion. In this case, the plate-like heat radiation part may protrude from the plate surface of the plate-like main body part (Claim 3), or may not protrude (Claim 4).

  The main body according to the present invention is made of a polycarbonate resin composition or a polycarbonate composite resin composition of a polycarbonate resin and a styrene resin, and the heat radiating part is made of a polycarbonate resin composition containing a high thermal conductive filler. In this case, it is possible to improve the adhesion between the main body and the heat radiating portion by using a polycarbonate resin material. Since the resin is excellent in various properties such as impact resistance, heat resistance, weather resistance, and electrical properties, it is also suitable for use as a structural member of a casing (Claim 5).

  The two-color molded product with a heat radiating part of the present invention is, for example, in a device with a heating element including a case and a heating element installed in the case, the heat radiating part directly with the heating element or via a heat transfer material. It is used so as to abut (Claim 6).

  Moreover, the device with a heating element of the present invention is a device with a heating element including a case, a heating element installed in the case, and an opposing body that faces the heating element, and the heat dissipation portion of the present invention is used as the opposing body. The two-color molded product is provided such that the heat dissipating part is in contact with the heating element directly or via a heat transfer material. By causing the color molded product to radiate heat through the heat radiating portion, local overheating is effectively prevented (claim 10).

  In this case, it is preferable that the two-color molded product with a heat radiating portion of the present invention constitutes at least a part of the case or the lid of the case (Claims 7 and 11).

  The case also includes a first region where the heating element is disposed and a second region where the heating element is not disposed or where a low heating element having a smaller heating amount than the heating element is disposed. In this case, the heat dissipating part of the two-color molded product with the heat dissipating part of the present invention is provided so as to continuously extend from the high temperature first region including the heat generating part to the low temperature second region. (Claims 8 and 12) are preferable.

  An example of the device with a heating element is an electronic device. According to the present invention, heat generated from the CPU as the heating element can be effectively radiated (claims 9 and 13).

It is a figure which shows embodiment of the two-color molded product with a thermal radiation part of this invention, Comprising: (a) A figure is a perspective view, (b) A figure is sectional drawing which follows the BB line of (a) figure. It is a figure which shows other embodiment of the two-color molded product with a thermal radiation part of this invention, Comprising: (a) A figure is a perspective view, (b) A figure is sectional drawing which follows the BB line of (a) figure. is there. It is a top view which shows the specific example of the shape of the heat sink of the two-color molded product with a thermal radiation part of this invention. It is a perspective view which shows embodiment of the apparatus with a heat generating body of this invention provided with the two-color molded product with a thermal radiation part of this invention. It is a top view which shows the shape and dimension of a heat sink used for the heat dissipation evaluation in Experimental Examples 1-3. It is a graph which shows the result of Experimental Examples 1-3. It is a top view which shows the shape and dimension of the heat sink and support plate which were used for the heat dissipation evaluation in Example 1 and Comparative Examples 1 and 2. It is a graph which shows the result of Example 1 and Comparative Examples 1 and 2.

Embodiments of a two-color molded product with a heat radiating portion and a device with a heating element of the present invention will be described in detail below.
In the two-color molding according to the present invention, two types of molding materials having different colors, types or materials are filled in a mold sequentially or simultaneously from different injection mechanisms, and a molded product in which a plurality of molding materials are combined. A molding method to be manufactured.

In the following, as a two-color molded product with a heat radiating part of the present invention, a flat heat radiating part (hereinafter may be referred to as “heat radiating plate”) and a flat body part (hereinafter referred to as “support plate”). ) Is integrally molded by two-color molding (hereinafter, such a two-color molded product with a heat radiating portion of the present invention may be referred to as a “two-color molded product with a heat radiating plate”). However, the heat radiating portion and the main body according to the present invention are not limited to a flat plate shape, and may be a curved plate shape in which a curved surface is formed partially or entirely, and not limited to a plate shape. Or the whole may be a block shape.
In the two-color molded product with a heat radiating part of the present invention, at least a part of the heat radiating part can receive heat from the heating element and transfer it to other parts of the heat radiating part to dissipate heat. And what is necessary is just a structure which can support this thermal radiation part with a main-body part.

[Two-color molded product with heat dissipation part]
First, with reference to FIGS. 1-3, embodiment of the two-color molded product with a heat sink of this invention is described in detail.
1 and 2 are views showing an embodiment of a two-color molded product with a heat sink of the present invention, wherein (a) is a perspective view, and (b) is a BB line in (a). FIG. (B) The figure is shown with the support plate in (a).
FIG. 3 is a plan view showing a specific example of the shape of the heat sink of the two-color molded product with a heat sink of the present invention.

  The two-color molded products 1 and 4 with a heat sink shown in FIGS. 1 and 2 are formed by integrally forming the support plates 2 and 5 and the heat sinks 3 and 6 by two-color molding. In the two-color molded product 1 with a heat sink shown in FIG. 1, a flat heat sink 3 is integrally formed in a form laminated on a flat support plate 2. Moreover, in the two-color molded product 4 with a heat sink shown in FIG. 2, the flat heat sink 6 is embedded in the flat support plate 5 which has a recessed part of the same shape as the heat sink 6 on the plate surface, and the heat sink 6 And the support plate 5 are flush with each other, and the radiator plate 6 and the support plate 5 are integrally formed so as to be flat. In addition, the heat sink may be integrally molded in a form in which only a part thereof is embedded in the support plate.

  Each of the heat radiating plates 3 and 6 has narrow portions (small area portions) 3a and 6a and wide portions (large area portions) 3b and 6b, and may be referred to as narrow portions (hereinafter referred to as "heat receiving portions"). .) 3a and 6a receive heat generated from the heating element, and the heat is transferred to the wide portions (hereinafter sometimes referred to as "heat dissipating portions") 3b and 6b to dissipate heat.

  In the present invention, the shape of the heat radiating plate is not particularly limited, and the heat from the heating element is received by the heat receiving portion having a relatively small area, and the heat is transferred to the heat radiating portion having a relatively large area to be radiated. As long as it is a configuration that can be used, the configuration of a heating element installation region (first region described later) and a heat dissipating region (second region described later) of a device with a heating element to which the two-color molded product with a heat sink is applied. It is designed accordingly.

For example, as a shape of a heat sink, what is shown to Fig.3 (a)-(f) is mentioned. In the heat sink 7 of FIG. 3A, a narrow portion (small area portion) 7a that is a heat receiving portion is one end in the longitudinal direction of a wide portion (large area portion) 7b that is a heat dissipating portion, and an end in the short direction. It is provided in the part.
In the heat radiating plate 8 of FIG. 3B, a narrow portion (small area portion) 8a which is a heat receiving portion is provided at one end in the longitudinal direction of the wide portion 8b which is a heat radiating portion and at a central portion in the short direction. Is.
3 (c) and 3 (d), the heat sinks 9 and 10 are wide portions (large area portions) 9b and 10b that are heat dissipating portions, as opposed to the narrow portions (small area portions) 9a and 10a that are heat receiving portions. Are provided in two.
The heat radiating plate 11 in FIG. 3 (e) is obtained by further connecting a narrow portion (small area portion) 11a that is a heat receiving portion and a wide portion (large area portion) 11b that is a heat radiating portion by a heat transfer portion 11c. 3 (f), two heat radiating portions 12b are connected to one heat receiving portion 12a by two heat transfer portions 12c.

  In any heat radiating plate, in the heat receiving part, the heat received from the heat generating element (in FIG. 3A to FIG. 3F, X represents the heat generating element abutting part) is used. As indicated by the arrow in (f), heat can be transferred to the heat radiating portion and efficiently radiated.

  On the other hand, in the present invention, the shape of the support plate is not particularly limited, and depends on the heater-equipped device to which a two-color molded product with a heat sink is applied in addition to the rectangular plan view shape as shown in FIGS. Thus, various shapes such as an irregular shape having a notch can be taken.

In addition, the heat dissipation plate does not necessarily have a structure in which the entire surface is lined with a support plate. If mechanical strength can be ensured in handling, a part of the structure protrudes from the support plate. It may be.
Further, the heat radiating plate is not limited to being provided at one place with respect to one support plate, and the heat radiating plates may be provided at two or more places.

Moreover, there is no restriction | limiting in particular also about the magnitude | size of the support plate of a two-color molded product with a heat sink of this invention, and a heat sink, and it determines suitably according to the apparatus with a heat generating body to which this is applied. The thickness is also appropriately determined according to the target device.
As the size and thickness of the heat sink increases, the heat dissipation performance improves, but on the other hand, it becomes a cause of hindering the reduction in size and weight of the target device.
Similarly, the larger the size and thickness of the support plate, the greater the mechanical strength. However, on the other hand, it becomes a cause of hindering the reduction in size and weight of the target device.

  When an electronic device such as a notebook computer is exemplified, the thickness of the heat sink of the two-color molded product with the heat sink may be about 0.2 to 2 mm, and the thickness of the support plate may be about 0.5 to 2 mm. preferable.

  In the present invention, the synthetic resin constituting the support plate (main body portion) and the heat radiating plate (heat radiating portion) is not particularly limited, but the support plate is a polycarbonate resin composition or a composite resin composition of a polycarbonate resin and a styrene resin. The heat sink is preferably made of a polycarbonate resin composition containing a high thermal conductive filler. In this case, the support plate and the heat sink are both made of a polycarbonate resin material so In addition, polycarbonate resin or composite resin of polycarbonate resin and styrenic resin is excellent in various properties such as impact resistance, heat resistance, weather resistance, and electrical characteristics. It is also suitable when used as a constituent member of a device with a heating element.

  As the polycarbonate resin used for the support plate and the heat radiating plate, aromatic polycarbonate resin, aliphatic polycarbonate resin, and aromatic-aliphatic polycarbonate resin can be used, and among them, aromatic polycarbonate resin is preferable. The aromatic polycarbonate resin is a thermoplastic aromatic polycarbonate polymer or copolymer obtained by reacting an aromatic dihydroxy compound with phosgene or a diester of carbonic acid.

  Examples of the aromatic dihydroxy compound include 2,2-bis (4-hydroxyphenyl) propane (= bisphenol A), tetramethylbisphenol A, bis (4-hydroxyphenyl) -P-diisopropylbenzene, hydroquinone, resorcinol, 4, 4-dihydroxybiphenyl etc. are mentioned, Preferably bisphenol A is mentioned. Further, for the purpose of further enhancing the flame retardancy, a compound in which one or more tetraalkylphosphonium sulfonates are bonded to the above aromatic dihydroxy compound, or a polymer or oligomer having a siloxane structure and containing both terminal phenolic OH groups is used. Can do.

  The aromatic polycarbonate resin used in the present invention is preferably a polycarbonate resin derived from 2,2-bis (4-hydroxyphenyl) propane, or 2,2-bis (4-hydroxyphenyl) propane and other fragrances. And a polycarbonate copolymer derived from an aromatic dihydroxy compound. Further, two or more kinds of polycarbonate resins may be used in combination.

  The molecular weight of the polycarbonate resin is a viscosity average molecular weight converted from the solution viscosity measured at a temperature of 25 ° C. using methylene chloride as a solvent, and is in the range of 14,000 to 30,000, preferably 15,000 to 28. 16,000, more preferably 16,000-26,000. If the viscosity average molecular weight is less than 14,000, the mechanical strength is insufficient, and if it exceeds 30,000, the moldability tends to be difficult, which is not preferable.

  The method for producing such an aromatic polycarbonate resin is not limited, and the aromatic polycarbonate resin can be produced by a phosgene method (interfacial polymerization method), a melting method (transesterification method), or the like. Furthermore, the aromatic polycarbonate resin which adjusted the amount of OH groups of the terminal group manufactured by the melting method can be used.

  As the aromatic polycarbonate resin, not only a virgin raw material but also an aromatic polycarbonate resin regenerated from a used product, that is, a so-called material recycled aromatic polycarbonate resin can be used. Used products include optical recording media such as optical disks, light guide plates, automobile window glass and automobile headlamp lenses, vehicle transparent members such as windshields, containers such as water bottles, glasses lenses, soundproof walls and glass windows, waves A building member such as a plate is preferred. In addition, as the recycled aromatic polycarbonate resin, non-conforming product, pulverized product obtained from sprue or runner or pellets obtained by melting them can be used.

  Examples of the styrene resin used in the polycarbonate resin / styrene resin composite resin composition constituting the support plate include acrylonitrile-styrene copolymer, acrylonitrile-styrene-butadiene copolymer, acrylonitrile-ethylenepropylene rubber-styrene copolymer. And acrylonitrile-styrene-acrylic rubber copolymer. A bulk polymerization method or an emulsion polymerization method can be exemplified as a polymerization method of these styrene resins, and a resin polymerized by the bulk polymerization method is desirable.

  As the styrene resin, not only a virgin raw material but also a styrene resin regenerated from a used product, that is, a so-called material-recycled styrene resin can be used. As a used product, a housing etc. are mainly mentioned. In addition, as the regenerated styrene resin, non-conforming products, pulverized products obtained from sprues, runners, etc., or pellets obtained by melting them can be used.

  In the polycarbonate resin, the styrene resin, and the composite resin composition constituting the support plate, the ratio of the styrene resin is 100 parts by mass or less, for example, 3 to 50 parts by mass, and further 10 to 30 parts with respect to 100 parts by mass of the polycarbonate resin. It is preferable that it is a polycarbonate composite resin composition of a mass part. By adding a styrene resin to the polycarbonate resin, it is possible to improve mechanical strength and fluidity. However, when the amount is excessively large, the load deflection temperature decreases greatly.

  On the other hand, examples of the high thermal conductive filler include carbon fibers, thermal conductive powders such as graphite and boron nitride, and plate-like graphite.

  The polycarbonate resin composition blended with the high heat conductive filler forming the heat sink is not particularly limited as long as it exhibits sufficient heat conductivity as the heat sink, but for example, prior to the present applicant. The following patent applications are listed.

<High thermal conductive polycarbonate resin composition 1>
(A) Carbon fiber that is graphitized carbon fiber (B) with respect to 100 parts by mass of polycarbonate-based resin, and has a thermal conductivity in the length direction of 100 W / m · K or more and an average fiber diameter of 5 to 20 μm. A resin composition containing 5 parts by mass or more and less than 40 parts by mass of fibers and (C) 5 to 100 parts by mass of graphite powder having an average particle diameter of 1 to 500 μm (Japanese Patent Laid-Open No. 2007-91985).

  Here, the (B) graphitized carbon fiber preferably has a thermal conductivity in the length direction of 400 W / m · K or more.

  (B) When the thermal conductivity of the graphitized carbon fiber is out of the above range, sufficient thermal conductivity cannot be obtained at a low filling rate. The carbon fiber is formed by, for example, converging carbon short fibers (chopped strands) usually cut to 2 to 20 mm at a bulk density of 450 to 800 g / l, as described in JP-A No. 2000-143826. A carbon short fiber converging body obtained by graphitization is preferable. The carbon short fiber converging body is obtained by converging carbon fibers with a sizing agent, cutting to a predetermined length, and graphitizing to reduce the content of the sizing agent to 0.1% by weight or less. It is. Examples of the conditions for the graphitization treatment include a method of heating at 2800 ° C. to 3300 ° C. in an inert gas atmosphere. As another method, continuous fibers (rovings) can be graphitized and then cut into a predetermined length for use. The average fiber diameter of the carbon fiber can be measured with an image analyzer (for example, image processing R & D system TOSPIX-i manufactured by Toshiba Corporation), and is 5 to 20 μm. If it is less than 5 μm, it tends to cause problems such as a decrease in thermal conductivity when the polycarbonate resin is mixed and filled, and warpage of the molded product increases, and if it exceeds 20 μm, the dimensional stability decreases and a good appearance is obtained. Hateful. Moreover, when there is more content of a sizing agent than 0.1 weight%, it will be easy to cause the fall of heat conductivity. The compounding amount of the carbon fiber is less than 40 parts by mass, and if it is more than this, the moldability and dimensional stability are lowered, and the warpage is increased. Furthermore, sufficient heat conductivity is not obtained as this compounding quantity is less than 5 mass parts. The blending amount is preferably 10 parts by mass or more and less than 40 parts by mass, and more preferably 15 parts by mass or more and 35 parts by mass or less.

  Further, (B) a carbon fiber is preferably used as the carbon fiber. For example, a fiber length of 1 to 30 mm, preferably 2 to 20 mm is used. The use of a long fiber is effective in terms of improving thermal conductivity and reducing warpage of the molded product.

  In this highly heat-conductive polycarbonate resin composition 1, in order to improve heat conductivity and molding processability and reduce warpage of the molded product, (C) 5 parts by mass or more of graphite powder having an average particle diameter of 1 to 500 μm 100 parts by mass or less are used in combination. (C) The average particle diameter of the graphite powder is a value obtained by measuring the average particle diameter in accordance with JIS Z8819-2 by measuring with a laser diffraction method in accordance with JIS Z8825-1. When this value exceeds 500 μm, or when the content exceeds 100 parts by mass, the moldability deteriorates. (C) Even if the average particle diameter of the graphite powder is less than 1 μm, it is difficult to handle such as being scattered at the time of blending, and it is difficult to uniformly disperse it in the resin composition. Furthermore, sufficient heat conductivity is not acquired as content is less than 5 mass parts. (C) It is preferable that the average particle diameter of graphite powder is 5-100 micrometers. Further, when the amount of the carbon fiber (B) is small, the amount of (C) the graphite powder is relatively large, and is adjusted as appropriate so as to obtain a predetermined thermal conductivity. For example, when the amount of (B) carbon fiber is 5 parts by mass or more and 25 parts by mass or less, the amount of (C) graphite powder is preferably 20 parts by mass or more and 100 parts by mass or less, more preferably 20 parts by mass or more and 80 parts by mass. It is below mass parts. (B) When the amount of carbon fiber is 25 parts by mass or more and less than 40 parts by mass, the amount of (C) graphite powder is preferably 5 parts by mass or more and 40 parts by mass or less, more preferably 5 parts by mass or more. It is preferably 20 parts by mass or less.

<High thermal conductive polycarbonate resin composition 2>
(A) 1 part by mass or more and 40 parts by mass or less of (B) aromatic polycarbonate oligomer, and (C) graphitized carbon fiber with respect to 100 parts by mass of polycarbonate-based resin, and the thermal conductivity in the length direction is Heat of 100 W / m · K or more and 5 to 20 μm carbon fiber having an average fiber diameter of 5 to 20 μm and (D) heat conductivity of 10 W / m · K or more and an average particle diameter of 1 to 500 μm Resin composition containing 5 to 100 parts by mass of conductive powder (excluding boron nitride) (Japanese Patent Laid-Open No. 2007-99798).

  Here, (C) graphitized carbon fiber is the same as (B) graphitized carbon fiber in the above-described high thermal conductive polycarbonate resin composition 1, and the preferable blending amount thereof is also the same.

  (B) The aromatic polycarbonate oligomer is obtained by reacting bisphenol A (BPA) with phosgene or a carbonic acid diester using an appropriate molecular weight regulator. Further, a copolymer type in which a part of bisphenol A is replaced with another divalent phenol may be used, and the divalent phenol described in the above aromatic polycarbonate resin is used as the other divalent phenol.

  Examples of the terminal terminator or the molecular weight regulator include compounds having a monovalent phenolic hydroxyl group and compounds having an aromatic carboxylic acid group, such as normal phenol, pt-butylphenol, 2,3,6-triol. In addition to bromophenol and the like, long-chain alkylphenols, aliphatic carboxylic acid chlorides, aliphatic carboxylic acids, hydroxybenzoic acid, and the like can be mentioned. Aromatic polycarbonate oligomers may be used singly or as a mixture of two kinds. Such an aromatic polycarbonate oligomer tends to bleed out from a molded product at the time of molding at a degree of polymerization of 1, while it becomes difficult to obtain satisfactory fluidity and surface smoothness when the degree of polymerization becomes large. is there. The compounding quantity of an aromatic polycarbonate oligomer is 1 mass part or more and 40 mass parts or less with respect to 100 mass parts of (A) polycarbonate-type resin in the highly heat conductive polycarbonate resin composition 2. As shown in FIG. When the amount is less than 1 part by mass, sufficient fluidity and surface smoothness are hardly obtained, and when it exceeds 40 parts by mass, the mechanical properties are deteriorated. A more preferable blending amount is 2 parts by mass or more and 30 parts by mass or less with respect to 100 parts by mass of the (A) polycarbonate resin.

  In the high thermal conductivity polycarbonate resin composition 2, in order to improve thermal conductivity and molding processability and reduce warpage of the molded product, (D) the thermal conductivity is 10 W / m · K or more and the average particle size is 1 to 1. A heat conductive powder of 500 μm (excluding boron nitride) is used in an amount of 5 to 100 parts by mass. Examples of the component (D) include carbon-based powder, silicon-based powder, boron-based powder (excluding boron nitride), at least one carbide, oxide, and nitride of a metal element, and a simple metal Of powders and fibers. More preferably, the component (D) is carbon fiber (not included in the category of the component (C)), graphite, metal-coated carbon fiber, metal-coated graphite, metal-coated glass, aluminum oxide, aluminum nitride, boron carbide, Examples thereof include thermally conductive powders composed of one or more of the group consisting of silicon nitride, silicon carbide, zinc oxide, magnesium oxide, metal fibers and metal powders. Among these, graphite powder is preferable. Other preferable powders are at least one carbide, oxide, and nitride selected from silicon, magnesium, aluminum, and boron. The average particle size of the component (D) is a value obtained by measuring according to JIS Z8825-1, measuring by a laser diffraction method, and complying with JIS Z8819-2. When this value exceeds 500 μm, or when the content exceeds 100 parts by mass, the moldability deteriorates. Even if the average particle size of the component (D) is less than 1 μm, it is difficult to handle such as being scattered at the time of blending, and it is difficult to uniformly disperse it in the resin composition. The average particle size of the component (D) is preferably 5 to 100 μm. Furthermore, sufficient heat conductivity is not acquired as content is less than 5 mass parts. When the amount of the carbon fiber (C) is small, the amount of the heat conductive powder (D) is relatively large, and is adjusted as appropriate so as to obtain a predetermined thermal conductivity. For example, when the amount of the carbon fiber (C) is 5 parts by mass or more and 25 parts by mass or less, the amount of the thermally conductive powder (D) is preferably 20 parts by mass or more and 100 parts by mass or less, more preferably 20 parts. It is not less than 80 parts by mass. When the amount of the carbon fiber (C) is 25 parts by mass or more and less than 40 parts by mass, the amount of the thermally conductive powder (D) is preferably 5 parts by mass or more and 40 parts by mass or less, more preferably. The amount is preferably 5 parts by mass or more and 20 parts by mass or less.

<High thermal conductive polycarbonate resin composition 3>
(A) 1 part by mass or more and 40 parts by mass or less of (B) aromatic polycarbonate oligomer, and (C) graphitized carbon fiber with respect to 100 parts by mass of polycarbonate-based resin, and the thermal conductivity in the length direction is 100 W / m · K or more and 5 mass parts or more and less than 40 mass parts of carbon fibers having an average fiber diameter of 5 to 20 μm, and (D) 5 mass parts or more and 100 mass parts or less of boron nitride having an average particle diameter of 1 to 500 μm. Resin composition (Japanese Patent Laid-Open No. 2007-99799).

Here, as (B) aromatic polycarbonate oligomer, the thing similar to (B) aromatic polycarbonate oligomer in the highly heat conductive polycarbonate resin composition 2 can be used, The suitable compounding quantity is also equivalent.
Further, (C) graphitized carbon fiber is the same as (B) graphitized carbon fiber in the above-described high thermal conductive polycarbonate resin composition 1, and a preferable blending amount thereof is also the same.

  In the highly heat conductive polycarbonate resin composition 3, in order to provide insulation, enhance heat conductivity and molding processability, and reduce warpage of the molded product, (A) with respect to 100 parts by weight of the polycarbonate resin, (D) 5 to 100 parts by mass of boron nitride having an average particle size of 1 to 500 μm is used. The average particle size of the component (D) is a value obtained by measuring according to JIS Z8825-1, measuring by a laser diffraction method, and complying with JIS Z8819-2. When this value exceeds 500 μm, or when the content exceeds 100 parts by mass, the moldability is deteriorated. Even if the average particle size of the component (D) is less than 1 μm, it is difficult to handle such as being scattered during compounding, and it is difficult to uniformly disperse it in the resin. Furthermore, sufficient heat conductivity and insulation are not acquired as content is less than 5 mass parts. Moreover, the preferable range of content of (D) component changes with content of (C) component to use together, and it is preferable to set it as an equal mass part or more with (C) component. When the content is less than the component (C), sufficient thermal conductivity and insulation may not be obtained. In addition, when the content of the carbon fiber as the component (C) is small, the content of boron nitride as the component (D) is made relatively large so that the predetermined thermal conductivity is appropriately adjusted. It is also preferable. For example, when the amount of carbon fiber (C) is 5 parts by mass or more and 25 parts by mass or less, the amount of boron nitride (D) is preferably 20 parts by mass or more and 100 parts by mass or less, more preferably 20 parts by mass or more. 80 parts by mass or less. When the amount of carbon fiber (C) is 25 parts by mass or more and less than 40 parts by mass, the amount of boron nitride (D) is preferably 5 parts by mass or more and 40 parts by mass or less, more preferably 5 parts by mass. The amount is preferably 20 parts by mass or less.

Boron nitride has a plurality of stable structures such as c-BN (zinc blende structure), w-BN (wurtzite structure), h-BN (hexagonal crystal structure), and r-BN (rhombohedral crystal structure). It has been known. In the present invention, any boron nitride may be used. Among them, hexagonal structure boron nitride is preferably used. Boron nitride can be either spherical or scaly, and any of these can be used, but when a scaly one is used, a molded product with better insulation can be obtained and mechanical properties can be obtained. Is preferable. Further, the average particle diameter of the scaly boron nitride powder is generally 1 to 50 μm, and it is also preferable to use a powder having an average particle diameter in such a range. However, the specific gravity and average particle diameter of boron nitride are not limited to this range.
The thermal conductivity of the boron nitride is preferably 10 W / m · K or more.

<High thermal conductive polycarbonate resin composition 4>
(A) A thermoplastic resin, preferably a thermoplastic resin composition comprising a polycarbonate resin and (B) graphite, wherein the (B) graphite has an aspect ratio of 20 to 50 and an average particle diameter of 10 to 200 μm. And a resin composition having a fixed carbon content of 98% by mass or more (Japanese Patent Application No. 2009-162853).

  The average particle diameter referred to here is the particle diameter of 100 samples in SEM (scanning electron microscope) observation (here, the particle diameter is the parallel plate when graphite is sandwiched between two parallel plates). Is the average value of the values obtained by measuring the diameter (the length of the interval between the plates) of the portion where the interval is the largest. If the average particle size is too small, air pollution problems such as flying in the air during melt-kneading may occur, or the melt viscosity of the resin composition may be significantly increased and fluidity may be lowered. However, if the average particle size is too large, supply failure such as bridging of the graphite-containing powder in the hopper may occur during melting and kneading, or the appearance of the molded product may be deteriorated. It is difficult to produce or obtain excessively large graphite. More preferably, the average particle diameter of (B) graphite is 20 to 200 μm.

  Further, when the aspect ratio calculated by the ratio of the particle diameter and the thickness of graphite is smaller than 20, the graphite is so formed that the thickness direction of the molded product matches the thickness direction of the graphite in the molded product in the injection molding process. Although oriented, in that case, the contribution to the thermal conductivity of graphite in the plane direction perpendicular to the thickness direction of the molded product is reduced, and higher thermal conductivity cannot be obtained. For this reason, this aspect ratio is larger than 20, in particular 25 or more, and particularly preferably 30 or more. However, if the aspect ratio is too large, a dispersion failure may occur due to the entanglement of graphite, and therefore the aspect ratio is 50 or less, preferably 45 or less.

  Here, the aspect ratio of graphite is the thickness of 100 samples in SEM (scanning electron microscope) observation (here, the thickness is the interval between the parallel plates when graphite is sandwiched between two parallel plates). The average value of the values obtained by measuring the diameter of the part where the diameter is smallest (the length of the interval between the plates) is the average thickness, and the average particle diameter / average thickness of the above average particle diameter It is obtained by calculating the ratio.

  In addition, the graphite (B) used in the high thermal conductive polycarbonate resin composition 4 has a fixed carbon amount measured in accordance with JIS M8511 of 98% by mass or more, preferably 98.5% by mass or more, more preferably 99% by mass. By being above, excellent thermal conductivity can be obtained.

  In the high thermal conductive polycarbonate resin composition 4, it is preferable to use pyrolytic graphite obtained by heat-treating powder coke at 1000 ° C. or higher among graphite having the above-described physical properties. Here, when heat treatment is insufficient, high thermal conductivity may not be obtained. The heat treatment conditions are preferably those obtained by treatment in an inert gas at a temperature of 1000 to 3500 ° C.

  Pyrolytic graphite subjected to such heat treatment is preferable because it has few impurities, has high thermal conductivity, and suppresses decomposition of the resin.

The content of (B) graphite in the high thermal conductive polycarbonate resin composition 4 is preferably 1 to 50% by mass, more preferably 1 to 40% by mass, still more preferably 5 to 40% by mass, and particularly preferably 10 to 10% by mass. 40% by mass.
(B) If the graphite content is too low, the required thermal conductivity may not be obtained, and if it is too high, the resin composition may be difficult to knead and the composition may not be prepared.

  In addition, (B) 2 or more types of graphites having different materials, shapes, physical properties, etc. may be used in combination.

<Highly heat conductive polycarbonate resin composition 5>
(A) thermoplastic resin, preferably polycarbonate resin 20% by mass to 85% by mass, (B) plate graphite having an apparent density of 0.16 g / cm ³ or more, 5% by mass to 30% by mass, and (C) A resin composition (Japanese Patent Application No. 2009-162852) containing 10% by mass or more and 60% by mass or less of an electrically insulating filler (hereinafter referred to as “insulating filler”).

The (B) graphite used here is plate-like graphite having an apparent density of 0.16 g / cm ³ or more, and preferably selected from natural scaly graphite, natural scaly graphite, pyrolytic graphite, and quiche graphite. Can be mentioned.

If the apparent density of (B) graphite is less than 0.16 g / cm ³ , the difference in apparent density between (A) thermoplastic resin and (C) insulating filler is too large, and it is easy to separate during resin composition production. This is not preferable because the productivity is lowered and the quality of the obtained resin composition varies greatly. (B) The apparent density of graphite is preferably 0.18 g / cm ³ or more, more preferably 0.20 g / cm ³ or more. The upper limit of the apparent density is usually about 0.5 g / cm ³ . The apparent density can be obtained by filling a graduated cylinder with 30 ml of graphite in a naturally falling state and measuring the weight.

  The fixed carbon content of (B) graphite used in the high thermal conductive polycarbonate resin composition 5 is preferably 97% by mass or more, and more preferably 98% by mass or more. (B) The ash content of graphite is preferably 2% by mass or less, more preferably 1% by mass or less. Moreover, the volatile matter content rate of (B) graphite becomes like this. Preferably it is 1.5 mass% or less, More preferably, it is 1.0 mass% or less. When the fixed carbon, ash content, and volatile content of graphite deviate from the above ranges, the thermal conductivity and heat stability of the resin composition may be lowered.

  The average particle diameter of the (B) graphite used in the high thermal conductive polycarbonate resin composition 5 is preferably 3 to 100 μm, more preferably 5 to 80 μm, and more preferably 5 to 60 μm on a weight average basis. Further preferred. When the graphite having an average particle size of less than 3 μm is melt-kneaded using an extruder or the like, the graphite does not easily bite into the screw, becomes unstable in measurement, and decreases in productivity. When the average particle diameter of graphite exceeds 100 μm, the surface smoothness and dispersibility of the molded product are inferior.

  The (B) graphite used in the high thermal conductive polycarbonate resin composition 5 is graphite having a plate shape. Here, the plate shape is a flaky or scaly shape having a small thickness with respect to the area of the plate surface. Preferably, the average thickness / average particle size is 2-20.

  The average particle diameter and average thickness of this (B) graphite are the average particle diameter and average thickness before melt-kneading, and usually use catalog values, but when not disclosed, the median measured by the ISO 13320 laser method The value obtained by the particle size (sometimes expressed as D50 value) was used as the average particle size. After the graphite was hardened with an epoxy resin and polished, the polished surface was observed with an SEM (scanning electron microscope). Let the average value of thickness be an average thickness.

  As long as the (B) graphite used in the high thermal conductive polycarbonate resin composition 5 does not impair its properties, (A) surface treatment such as epoxy treatment, urethane treatment, An oxidation treatment or the like may be performed.

  The high thermal conductivity polycarbonate resin composition 5 includes (B) graphite and (C) an insulating filler, thereby having both excellent thermal conductivity and insulating properties.

  That is, in the high thermal conductivity polycarbonate resin composition 5, thermal conductivity can be obtained by including (B) graphite. This (B) graphite is plate-like graphite, and (C) an insulating filler. Coexisting with (C) the insulating filler during the molding promotes the orientation of the plate-like (B) graphite, and as a result, the thermal conductivity of the plate-like graphite is enhanced. Moreover, insulation is also provided by including an insulating (C) insulating filler. Furthermore, the inclusion of (C) an insulating filler improves surface smoothness and dimensional stability, and increases the hardness of the resulting molded product, thereby improving the choke resistance. The

  The (C) insulating filler used in the high thermal conductive polycarbonate resin composition 5 may be in the form of particles, plates, or fibers, preferably in the form of plates or fibers, particularly preferably. It is plate-shaped.

Examples of the plate-like (C) insulating filler include flaky and scaly talc, mica, clay, kaolin, and glass flakes, with glass flakes being particularly preferred.
Examples of the fibrous (C) insulating filler include glass fiber and wallast fiber, and glass fiber is preferable.
These insulating fillers may be used alone or in combination of two or more.

Glass flake is a plate-shaped amorphous glass having a thickness of 3 to 7 μm and a particle diameter of 10 to 4000 μm, and exhibits unique effects depending on the properties of glass as an inorganic material and the properties obtained from the shape. The glass used includes C glass and E glass. Since E glass has less Na ₂ O or K ₂ O or the like than C glass, glass flakes using E glass are preferably used. As the glass flake, for example, REFG-101 of Nippon Electric Glass Co., Ltd., which is a commercial product, is used, and the average particle diameter is 600 μm and the average thickness is 3 to 7 μm. Glass flakes having a larger average particle size than other additives cause an appearance defect when the amount added is increased, so the amount to be blended must be adjusted.

  As the glass fiber, those having an average fiber diameter of about 5 to 20 μm and an average fiber length of about 30 to 200 μm in the molded product are preferable.

  The (C) insulating filler used in the high thermal conductive polycarbonate resin composition 5 is surface-treated, for example, epoxy-treated, urethane, in order to increase the affinity with the (A) thermoplastic resin as long as the properties are not impaired. Treatment, oxidation treatment, etc. may be performed.

  The blending ratios of the above components (A) to (C) of the high thermal conductive polycarbonate resin composition 5 are: (A) 20% by mass to 85% by mass of the thermoplastic resin, and (B) 5% by mass to 30% by mass of the graphite. % Or less, and (C) the insulating filler is 10% by mass or more and 60% by mass or less.

  When the component (A) is less than 20% by mass, surface smoothness and molding processability are deteriorated, and when it exceeds 85% by mass, thermal conductivity and dimensional stability are deteriorated. When the component (B) is less than 5% by mass, the thermal conductivity is lowered, and when it exceeds 40% by mass, the moldability and the insulation are lowered. When the component (C) is less than 10% by mass, the dimensional stability and thermal conductivity are lowered, and when it exceeds 60% by mass, the moldability and the surface smoothness are lowered.

A more preferable blending ratio is
(A) Thermoplastic resin 55-85 mass%
(B) Graphite 10-30% by mass
(C) Insulating filler 5-15% by mass
It is.

  The blending ratio of the (B) component and the (C) component is such that when the relationship between the content C of the (C) component and the content B of the (B) component in the composition is represented by C = aB, a Is preferably 1 or more and 2 or less. When the blending ratio is such that the value of a is less than 1, the insulating property is lowered, and when it exceeds 2, the thermal conductivity is lowered. a is more preferably 1.2 to 1.8.

  In addition, in highly heat conductive polycarbonate resin composition 5, in order to obtain the effect by including the above-mentioned (A) ingredient, (B) ingredient, and (C) ingredient certainly, (A) ingredient in a resin composition, The total amount of the component (B) and the component (C) is preferably 80% by mass or more.

  Further, in the high thermal conductive polycarbonate resin composition 5, when the relationship between the average particle diameter R1 of (B) graphite and the average particle diameter R2 of (C) the insulating filler is represented by R2 = bR1, The value is preferably 0.1 or more and less than 15. When the particle size ratio is such that the value of b is less than 0.1, the effect of promoting the orientation of the component (B) by the component (C) is weak, and the thermal conductivity is lowered. Even if b exceeds 15, (C) component becomes a barrier and thermal conductivity falls. b is more preferably 0.5-15.

Here, (C) the average particle diameter of the insulating filler is, for example, (C) when the insulating filler is a fibrous filler, a residue obtained by burning the resin composition or its molded product at a high temperature (for example, polycarbonate The resin was obtained by separating the residue obtained by dissolving and removing the resin with an organic solvent (for example, chloroform for polycarbonate) or the like using a difference in specific gravity (for example, at 600 ° C. for 4 hours). C) The insulating filler is dispersed on the preparation and then observed with an optical microscope, and the length of the filler is randomly measured for about 100 fillers and averaged. .
In addition, in the case where (C) the insulating filler is a granular or plate-like filler, a residue obtained by burning the resin composition or a molded product thereof at a high temperature (for example, 4 hours at 600 ° C. for a polycarbonate resin), (C) Insulating filler obtained by, for example, separating the residue obtained by dissolving and removing the resin with an organic solvent (for example, chloroform in the case of polycarbonate) using a difference in specific gravity, etc. is dispersed on the preparation. It is observed with an optical microscope, and the diameter of the minimum circumscribed circle of the filler is measured and averaged for about 100 of the fillers at random.

<Other ingredients>
The resin composition constituting the support plate and the heat radiating plate (hereinafter sometimes referred to as “resin composition according to the present invention”) contains the following other components as long as the object of the present invention is not impaired. You may do it.

(1) Flame retardant In the resin composition according to the present invention, a flame retardant can be blended to impart flame retardancy.
In use as a casing of an electric / electronic device or the like, in many cases, flame retardancy is also required. Therefore, it is preferable to add a flame retardant.

  The flame retardant is not particularly limited as long as it improves the flame retardancy of the resin composition. For example, polycarbonate of halogenated bisphenol A, brominated bisphenol epoxy resin, brominated bisphenol phenoxy resin, brominated polystyrene And halogenated flame retardants such as phosphoric acid ester flame retardants, organic sulfonic acid metal salt flame retardants, and silicone flame retardants.

These may be used alone or in combination of two or more at any ratio.
As the flame retardant, a phosphate ester flame retardant is preferable because it has a high flame retardant effect, has a fluidity improving effect, and hardly causes mold corrosion.

  In particular, the phosphate ester flame retardant is preferably a phosphate ester compound represented by the following general formula (1).

(Wherein R ¹ , R ² , R ³ and R ⁴ each independently represents an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 20 carbon atoms which may be substituted with an alkyl group, p, q, r, and s are each independently 0 or 1, t is an integer of 1 to 5, and X represents an arylene group.)

In the general formula (1), examples of the aryl group represented by R ^{1 to} R ¹² include a phenyl group and a naphthyl group. Examples of the arylene group for X include a phenylene group and a naphthylene group.
When t is 0, the compound represented by the general formula (1) is a phosphate ester, and when t is greater than 0, it is a condensed phosphate ester (including a mixture). For this purpose, condensed phosphate esters are preferably used.

  Specific examples of the phosphate ester flame retardant represented by the general formula (1) include trimethyl phosphate, triethyl phosphate, tributyl phosphate, trioctyl phosphate, tributoxyethyl phosphate, triphenyl phosphate. Fate, tricresyl phosphate, tricresyl phenyl phosphate, octyl diphenyl phosphate, diisopropyl phenyl phosphate, tris (chloroethyl) phosphate, tris (dichloropropyl) phosphate, tris (chloropropyl) phosphate, bis (2,3-dibromopropyl) phosphate, bis (2,3-dibromopropyl) -2,3-dichlorophosphate, bis (chloropropyl) monooctylphosphate, bisfete Various types such as diol A tetraphenyl phosphate, bisphenol A tetracresyl diphosphate, bisphenol A tetraxylyl diphosphate, hydroquinone tetraphenyl diphosphate, hydroquinone tetracresyl phosphate, hydroquinone tetraxyl diphosphate Illustrated. Of these, triphenyl phosphate, bisphenol A tetraphenyl phosphate, resorcinol tetraphenyl phosphate, resorcinol tetra-2,6-xylenol phosphate, and the like are preferable.

  These phosphate ester flame retardants improve the flame retardancy of the composition and reduce the viscosity by blending the phosphoric ester ester flame retardant, for example, in the kneading step at the time of preparing the above-described high thermal conductive polycarbonate resin composition 4 ( B) It is possible to prevent the effect of imparting the original thermal conductivity of graphite (B) due to the aspect ratio and particle size of the graphite being crushed and being changed, which is preferable.

  The blending amount of the flame retardant may be appropriately selected and determined. However, if the amount is too small, the flame retardant effect becomes insufficient. Conversely, if the amount is too large, the heat resistance and mechanical properties may decrease. The content of the flame retardant in the resin composition according to the invention is, for example, 5 to 20% by mass for a phosphate ester flame retardant, and 0.02 to 0.2 for an organic sulfonate metal salt flame retardant. If it is a mass% and a silicone compound type flame retardant, it is 0.3-3 mass%.

  In addition, these flame retardants may be used in combination with inorganic compound flame retardant aids, and examples of inorganic compound flame retardant aids include talc, mica, kaolin, clay, silica powder, fumed silica, glass flakes, and the like. 1 type (s) or 2 or more types.

  When these flame retardants are used in combination with inorganic compound flame retardant aids, if the amount of inorganic compound flame retardant aid is too small, a sufficient blending effect cannot be obtained, and if too much, heat resistance and mechanical properties are reduced. Therefore, the content of the inorganic compound-based flame retardant aid in the resin composition according to the present invention is preferably 1 to 20% by mass, and more preferably 3 to 10% by mass.

(2) Anti-dripping agent The resin composition according to the present invention may contain an anti-drip agent for the purpose of preventing dripping during combustion. As the anti-dripping agent, a fluororesin can be preferably used.

  Here, the fluororesin is a polymer or copolymer containing a fluoroethylene structure. For example, a difluoroethylene polymer, a tetrafluoroethylene polymer, a tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene and fluorine. And a copolymer with an ethylene-based monomer that does not contain polytetrafluoroethylene (PTFE), preferably having an average molecular weight of 500,000 or more, particularly preferably 500,000 to 10,000,000.

  As the polytetrafluoroethylene that can be used in the present invention, all types of polytetrafluoroethylene that are currently known can be used. However, when polytetrafluoroethylene having a fibril-forming ability is used, it is even higher. Melting dripping prevention property can be provided. Although there is no restriction | limiting in particular in the polytetrafluoroethylene (PTFE) which has a fibril formation ability, For example, what is classified into the type 3 in ASTM standard is mentioned. Specific examples thereof include, for example, Teflon (registered trademark) 6-J (manufactured by Mitsui DuPont Fluorochemical Co., Ltd.), Polyflon D-1, Polyflon F-103, Polyflon F201 (Daikin Industries, Ltd.), CD076 ( Asahi IC Fluoropolymers Co., Ltd.). Other than those classified as type 3, for example, Argoflon F5 (manufactured by Montefluos Co., Ltd.), polyflon MPA, polyflon FA-100 (manufactured by Daikin Industries, Ltd.) and the like can be mentioned. These polytetrafluoroethylene (PTFE) may be used independently and may combine 2 or more types. Polytetrafluoroethylene (PTFE) having the fibril-forming ability as described above is prepared by, for example, using tetrafluoroethylene in an aqueous solvent in the presence of sodium, potassium, ammonium peroxydisulfide, at a pressure of 1 to 100 psi, at a temperature of 0. It is obtained by polymerizing at ˜200 ° C., preferably 20˜100 ° C. Alternatively, Teflon (registered trademark) 30-J (Mitsui / Dupont Fluorochemical Co., Ltd.) dispersed in a solvent may be used.

  The anti-dripping agent may be a polytetrafluoroethylene-containing mixed powder composed of polytetrafluoroethylene particles and organic polymer particles. Specific examples of monomers for producing organic polymer particles include styrene, p-methylstyrene, o-methylstyrene, p-chlorostyrene, o-chlorostyrene, p-methoxystyrene, o-methoxystyrene. Styrene monomers such as 2,4-dimethylstyrene, α-methylstyrene, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, 2-ethylhexyl acrylate (Meth) acrylic acid ester-based single quantities such as 2-ethylhexyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tridodecyl acrylate, tridodecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate , Vinyl cyanide monomers such as acrylonitrile and methacrylonitrile, vinyl ether monomers such as vinyl methyl ether and vinyl ethyl ether, vinyl carboxylate monomers such as vinyl acetate and vinyl butyrate, ethylene, propylene, isobutylene Examples thereof include, but are not limited to, olefin monomers such as diene monomers such as butadiene, isoprene and dimethylbutadiene. Preferably, two or more kinds of polymers or copolymers of these monomers can be used to obtain organic polymer particles.

  As a compounding quantity of a dripping inhibitor, Preferably it is 0.01-1 mass% as content in the resin composition which concerns on this invention, More preferably, it is 0.1-0.5 mass%.

(3) Impact resistance improver The resin composition according to the present invention may contain an elastomer as an impact resistance improver in order to improve impact strength.

  The elastomer is not particularly limited, but a multilayer structure polymer is preferable. Examples of the multilayer structure polymer include those containing an alkyl (meth) acrylate polymer. These multi-layered polymers include, for example, polymers produced by continuous multi-stage seed polymerization in which a polymer in a previous stage is sequentially coated with a polymer in a subsequent stage, and a basic polymer. As a structure, it is a polymer having an outermost core layer made of a polymer compound that improves the adhesion between the inner core layer, which is a crosslinking component having a low glass transition temperature, and the matrix of the composition. A rubber component having a glass transition temperature of 0 ° C. or lower is selected as a component that forms the innermost core layer of these multilayer polymers. These rubber components include rubber components such as butadiene, rubber components such as styrene / butadiene, rubber components of alkyl (meth) acrylate polymers, polyorganosiloxane polymers and alkyl (meth) acrylate polymers. Or a rubber component using these in combination. Furthermore, examples of the component forming the outermost core layer include an aromatic vinyl monomer, a non-aromatic monomer, or a copolymer of two or more thereof. Examples of the aromatic vinyl monomer include styrene, vinyl toluene, α-methyl styrene, monochloro styrene, dichloro styrene, bromo styrene, and the like. Of these, styrene is particularly preferably used. Examples of non-aromatic monomers include alkyl (meth) acrylates such as ethyl (meth) acrylate and butyl (meth) acrylate, vinyl cyanide such as acrylonitrile and methacrylonitrile, and vinylidene cyanide. These may be used alone or in combination of two or more.

  As a compounding quantity of an impact resistance improving agent, Preferably it is 1-10 mass% as content in the resin composition based on this invention, More preferably, it is 2-5 mass%.

(4) Reinforcing Material A reinforcing material can be added to the resin composition according to the present invention in order to improve the elastic modulus, strength, and deflection temperature under load.

  Here, as a reinforcing material, silica, diatomaceous earth, pumice powder, pumice balloon, aluminum hydroxide, magnesium hydroxide, basic magnesium carbonate, calcium sulfate, potassium titanate, barium sulfate, calcium sulfite, talc, clay, mica, Examples thereof include glass fiber, glass flake, glass bead, calcium silicate, montmorillonite, bentonite, molybdenum sulfide, boron fiber, silicon carbide fiber, polyester fiber, polyamide fiber, and aluminum borate. These may be used alone or in combination of two or more. Although not particularly limited, the reinforcing material is preferably glass fiber, glass flake, talc, or mica.

  As a compounding quantity of a reinforcing material, Preferably it is 1-100 mass parts with respect to 100 mass parts of resin components in the resin composition which concerns on this invention, More preferably, it is 10-80 mass parts.

(5) Mold Release Agent The resin composition according to the present invention can be blended with a mold release agent in order to improve mold release properties during injection molding.

  Examples of the release agent include aliphatic carboxylic acids and alcohol esters thereof, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15000, polysiloxane silicone oil, and the like.

  Examples of the aliphatic carboxylic acid include saturated or unsaturated, linear or cyclic, aliphatic 1 to 3 carboxylic acids. Among these, monovalent or divalent carboxylic acids having 6 to 36 carbon atoms are preferable, and aliphatic saturated monovalent carboxylic acids having 6 to 36 carbon atoms are particularly preferable. Specific examples of such aliphatic carboxylic acids include palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, melissic acid, tetrariacontanoic acid, Examples include montanic acid, adipic acid, and azelaic acid.

  The aliphatic carboxylic acid component in the aliphatic carboxylic acid ester has the same meaning as the above-mentioned aliphatic carboxylic acid. On the other hand, the alcohol component of the aliphatic carboxylic acid ester includes a saturated or unsaturated, linear or cyclic monovalent or polyhydric alcohol. These may have a substituent such as a fluorine atom or an aryl group, and among them, a monovalent or polyvalent saturated alcohol having 30 or less carbon atoms is preferable, particularly 30 or less carbon atoms, a saturated aliphatic monovalent or Polyhydric alcohols are preferred.

  Specific examples of such alcohol components include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, and ditrimethylolpropane. And dipentaerythritol. The aliphatic carboxylic acid ester may contain an aliphatic carboxylic acid and / or alcohol as an impurity, and may be a mixture of a plurality of aliphatic carboxylic acid esters.

  Specific examples of the aliphatic carboxylic acid ester include beeswax (a mixture based on myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate, glycerin diester. Examples thereof include stearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, pentaerythritol tetrastearate and the like.

  Examples of the aliphatic hydrocarbon having a number average molecular weight of 200 to 15000 include liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and α-olefin oligomer having 3 to 12 carbon atoms. Here, the aliphatic hydrocarbon includes alicyclic hydrocarbons. Moreover, these hydrocarbon compounds may be partially oxidized.

  Among these aliphatic hydrocarbons, paraffin wax, polyethylene wax, or partial oxides of polyethylene wax are preferable, and paraffin wax and polyethylene wax are particularly preferable. The number average molecular weight is preferably 200 to 5,000. These aliphatic hydrocarbons may be used alone or in combination of two or more at any ratio as long as the main component is within the above range.

  Examples of the polysiloxane silicone oil include dimethyl silicone oil, phenylmethyl silicone oil, diphenyl silicone oil, fluorinated alkyl silicone, and the like. These may be used alone or in combination of two or more.

  The content of the release agent in the resin composition according to the present invention may be selected and determined as appropriate. However, if the amount is too small, the release effect is not sufficiently exhibited. There are cases in which there is a decrease in mold and mold contamination during injection molding. Therefore, the compounding quantity of a mold release agent is 0.001-2 mass parts with respect to 100 mass parts of resin components in the resin composition based on this invention, and it is preferable that it is 0.01-1 mass part especially.

(6) Others In addition to the above components, the resin composition according to the present invention contains, as necessary, additives such as stabilizers such as ultraviolet absorbers and antioxidants, pigments, dyes, lubricants, and the like as necessary. You may mix | blend.

  In order to produce a two-color molded product with a heat sink of the present invention, a support plate molding resin composition and a heat sink molding resin composition are prepared, and two-color molding is performed according to a conventional method using them. Good.

  In order to sufficiently secure the heat dissipation performance of the two-color molded product with a heat sink of the present invention, the heat conductivity of the heat sink of the two-color molded product with a heat sink of the present invention has a thermal conductivity of 0 measured by the following evaluation method. .6 W / (m · K) or more, and particularly preferably 1 W / (m · K) or more. In addition, in order to sufficiently secure the adhesion between the heat sink and the support plate of the two-color molded product with a heat sink of the present invention, it is preferable that the difference in thermal expansion coefficient between the heat sink and the support plate is small.

<Method of measuring thermal conductivity>
Using an injection molding machine (manufactured by Sumitomo Heavy Industries, SH100, mold clamping force 100T), at a cylinder temperature of 300 ° C. and a mold temperature of 80 ° C., a mold: 100 mm long, 100 mm wide, 3 mm thick Was injection molded under the condition of injection pressure: 147 MPa, and three of the obtained injection molded products were stacked, and the heat of the injection molded product was measured using a rapid thermal conductivity measurement device (Kemtherm QTM-D3, manufactured by Kyoto Electronics Industry Co., Ltd.). Measure conductivity.

[Equipment with heating element]
Next, an embodiment of the device with a heating element of the present invention will be described in detail with reference to FIG.
FIG. 4 is a perspective view showing a state in which the keyboard portion of the notebook computer according to the embodiment of the device with a heating element of the present invention is opened, and corresponds to a keyboard substrate (corresponding to a lid facing the casing (case)). Is constituted by the two-color molded product 40 with a heat sink of the present invention. The support plate 41 and the heat radiating plate 42 of the two-color molded product 40 with a heat radiating plate are integrally formed by two-color molding.

  Reference numeral 50 denotes a casing (case) that constitutes the main body of the notebook personal computer. A circuit board 51 is provided on one half of the inside of the notebook personal computer, and various parts mounting plates 52, 53, 54, 55 are provided on the circuit board 51. , 56 and a CPU 57 as a heating element is provided on the mounting plate 52. There is no heating element on the other half side of the casing 50 (or there is a heating element with a low calorific value) with respect to the high temperature area (first area) on one half side in the casing 50 provided with the CPU 57 and the like. The low temperature region (second region).

  As for the heat sink 42, the narrow part (small area part) 42a which is the heat receiving part contacts the CPU 57, and the wide part (large area part) 42b which is the heat dissipating part continues to the low temperature region on the other half side of the housing 50. And provided to extend.

Therefore, when the keyboard substrate (two-color molded product 40 with a heat sink) is placed on the casing 50, the CPU 57 and the heat receiving portion 42a of the heat sink 42 come into contact with each other, and the heat generated from the CPU 57 is transferred from the heat receiving portion 42a of the heat sink 42 to the heat sink. Heat is transferred to 42b.
Since the heat radiating portion 42b extends to a location facing the low temperature region in the housing 50, heat from the CPU 57 is efficiently radiated in this region to prevent local overheating of the CPU 57.

  In addition, the heat sink of the two-color molded product with a heat sink may be in direct contact with a heating element such as a CPU, and includes an adhesive, grease, rubber, thermoplastic film, etc. containing a high thermal conductivity component. The heat transfer material may be contacted.

  In the above, the notebook computer is used as an example to describe the device with a heating element of the present invention. However, the device with a heating element of the present invention is not limited to a notebook computer, and various electrical / electronic / OA devices, mechanical parts, It can be applied to various devices with heating elements such as vehicle parts.

  Hereinafter, the present invention will be described in more detail with reference to experimental examples, examples and comparative examples.

  In the following, as the polycarbonate resin composition for molding the heat radiating plate or the support plate, those having the following composition and physical properties were used.

<Polycarbonate resin composition I (Example of high heat conduction for heat sink)>
Polycarbonate resin ("Iupilon (registered trademark) S-3000" manufactured by Mitsubishi Engineering Plastics Co., Ltd., viscosity average molecular weight 21,000): 65% by mass
Graphitized carbon fiber (pitch-based) (Mitsubishi Resin “Dialead K223HG”): 15% by mass
Flaky graphite (“PB90” manufactured by Nishimura Graphite Industry Co., Ltd.): 20% by mass
Thermal conductivity of resin composition: 9 W / (m · K)

<Polycarbonate resin composition II (comparative example low heat conduction compound for heat sink)>
Polycarbonate resin ("Iupilon (registered trademark) S-3000" manufactured by Mitsubishi Engineering Plastics Co., Ltd., viscosity average molecular weight 21,000)
Thermal conductivity of resin composition: 0.2 W / (m · K)

<Polycarbonate resin composition III (high strength formulation for support plate)>
Polycarbonate resin ("Iupilon (registered trademark) S-3000" manufactured by Mitsubishi Engineering Plastics Co., Ltd., viscosity average molecular weight 21,000): 70% by mass
Acrylonitrile-styrene-butadiene copolymer (ABS) (Technopolymer "AT-08"): 30% by mass
Condensed phosphoric acid ester (FP700 manufactured by Adeka): 15 parts by mass with respect to 100 parts by mass of the resin component Thermal conductivity of the resin composition: 0.2 W / (m · K)

  The heating element used in the heat dissipation test was a CPU made of Si (PentiumM, 1.1 GHz, 10 mm square, wall thickness 1 mm), and generated heat at about 1/3 of 1.5 W when the maximum power was 5 W.

[Experimental Examples 1-3]
The heat sink 21 (thickness 2 mm) 21 having the shape and dimensions shown in FIG. 5 is molded from the material shown in Table 1, and the CPU is energized with the central portion of the narrow heat receiving portion 21a of the heat sink in contact with the CPU. The central portion (B portion in FIG. 5) of the boundary between the CPU and the back surface side of the CPU contact portion (A portion in FIG. 5), the narrow heat receiving portion 21a of the heat radiating plate 21 and the wide heat radiating portion 21b, A temperature sensor is attached to each of the end portion (D portion in FIG. 5) of the wide heat radiating portion 21b of the heat radiating plate 21 and the central portion (C portion in FIG. 5) between the B portion and the D portion to measure the temperature. Thus, the heat dissipation performance was evaluated.
If the heat sink is capable of efficiently transferring the heat generated by the CPU (initial temperature 25 ° C.) from the heat receiving portion 21a to the heat radiating portion 21b, the temperature difference between the A portion and the D portion is small, and the heat dissipation is smooth. As a result, the measured temperature of the CPU and the measured temperatures of the A to D parts are lowered.

6A to 6C show changes with time in the measurement temperatures of the temperature measurement units of the CPU and the heat sink.
Table 1 shows the maximum CPU temperature after 60 seconds.

  As is apparent from FIG. 6 and Table 1, in Experimental Example 1 using the heat radiating plate formed with the polycarbonate resin composition I having high thermal conductivity, the heat dissipation is inferior to that in Experimental Example 2 using the heat radiating plate made of aluminum. However, it exhibits better heat dissipation performance than that of Experimental Example 3 using a heat dissipation plate molded with a normal low thermal conductivity polycarbonate resin composition II, and can prevent local overheating by the CPU.

[Example 1]
A two-color molded product 30 with a heat sink of the present invention is manufactured by integrally molding a heat sink (thickness 2 mm) 31 and a support plate 32 (thickness 2 mm) having the shape and dimensions shown in FIG. 7 by two-color molding. did. The polycarbonate resin composition I was used for molding the heat radiating plate 31 portion, and the polycarbonate resin composition III was used for molding the support plate 32 portion.

The CPU is energized with the central portion of the narrow heat receiving portion 31a of the heat radiating plate 31 of the two-color molded product 30 with the heat radiating plate in contact with the CPU, and the back side of the CPU and the CPU abutting portion (see FIG. 7). A portion), the central portion (B portion in FIG. 7) of the boundary between the narrow heat receiving portion 31a and the wide heat radiating portion 31b of the heat radiating plate 31, and the end portion of the wide heat radiating portion 31b (see FIG. 7). The heat radiation performance was evaluated by measuring the temperature by attaching temperature sensors to the D part) and the central part of the B part and the D part (C part in FIG. 7).
As described above, if the heat sink is capable of efficiently transferring heat from the CPU (initial temperature 25 ° C.) from the heat receiving portion 31a to the heat radiating portion 31b, the temperature difference between the A portion to the D portion is small. By smoothly performing heat dissipation, the measured temperature of the CPU and the measured temperatures of the A to D parts are low.

FIG. 8 (a) shows changes with time in the measurement temperatures of the temperature measurement units of the CPU and the heat sink.
Table 2 shows the maximum CPU temperature after 60 seconds.

[Comparative Example 1]
The same size and the same shape as the support plate 32 in Example 1 were molded using the polycarbonate resin composition III, and an aluminum plate having the same size and the same shape as the heat dissipation plate in Example 1 was formed on this support plate. Attached with an adhesive, an aluminum heat sink / polycarbonate resin support plate integrated product similar to the two-color molded product 30 with heat sink shown in FIG. 7 was produced.
For this integrated product, the heat dissipation performance was evaluated in the same manner as in Example 1, and the results are shown in FIG.

[Comparative Example 2]
Except that the polycarbonate resin composition II was used for molding the heat sink 31 part, the two-color molded product 30 with the heat sink was integrally formed in the same manner as in Example 1, and the heat dissipation performance was similarly evaluated. This is shown in FIG.

  As is clear from FIG. 8 and Table 2, in Example 1, which is a two-color molded product in which the heat radiating plate portion is molded with the polycarbonate resin composition I having high thermal conductivity, compared with Comparative Example 1 using a heat radiating plate made of aluminum. Although heat dissipation is inferior, it shows better heat dissipation performance compared to Comparative Example 2 using the low thermal conductivity polycarbonate resin composition II and can prevent local overheating by the CPU.

  In the two-color molded product with a heat sink of Example 1, the heat sink 31 is supported by a support plate 32 having excellent mechanical characteristics and is an integrally molded product. It can be used for assembling electronic devices and the like. This two-color molded product is integrally formed by one-time two-color molding, and is excellent in productivity.

1, 4, 40 Two-color molded product with heat sink 2, 5, 41 Support plate 3, 6, 7, 8, 9, 10, 11, 12, 21, 31, 42 Heat sink 30 Two-color molded product with heat sink 32 Support plate 50 Housing (case)
51 Circuit board 57 CPU

Claims (13)

A synthetic resin body,
A heat radiating portion made of a synthetic resin having a higher thermal conductivity than the main body portion, provided on at least a part of the outer surface of the main body portion, and the main body portion and the heat radiating portion are integrally formed by two-color molding. A two-color molded product with a heat dissipating part.   2. The two-color molded product with a heat radiating portion according to claim 1, wherein the main body portion and the heat radiating portion are plate-shaped, and the plate-shaped heat radiating portion is provided on one plate surface of the plate-shaped main body portion.   3. The two-color molded product with a heat radiating portion according to claim 2, wherein the plate-shaped heat radiating portion protrudes from a plate surface of the plate-shaped main body portion.   3. The two-color molded product with a heat radiating portion according to claim 2, wherein the plate-shaped heat radiating portion is not projected from the plate surface of the plate-shaped main body portion.   5. The body portion according to claim 1, wherein the main body portion is made of a polycarbonate resin composition comprising a polycarbonate resin or a composite resin composition of a polycarbonate resin and a styrene resin, and the heat dissipation portion has a high thermal conductivity. A two-color molded product with a heat radiating portion, comprising a polycarbonate resin composition containing a filler.   6. The heating element according to claim 1, wherein the heat radiating portion is directly or via a heat transfer material on the heating element of a device with a heating element including a case and a heating element installed in the case. A two-color molded product with a heat radiating part, wherein the two-color molded product is used so as to come into contact with each other.   7. The two-color molded product with a heat radiating portion according to claim 6, wherein the two-color molded product is provided so as to constitute at least a part of the case or the lid of the case. In Claim 6 or 7, in said case, the 1st field where a heating element is arranged,
There is no second heating element or a second region where a low heating element with a lower heating value than the heating element is installed,
The two-color molded product with a heat radiating portion is used so that the heat radiating portion extends continuously from the first region to the second region.   9. The two-color molded product with a heat radiating part according to claim 6, wherein the device with a heating element is an electronic device, and the heating element is a CPU. Case and
A heating element installed in the case;
In a device with a heating element provided with an opposing body facing the heating element,
The counter body is a two-color molded product with a heat radiating portion according to any one of claims 1 to 9,
A device with a heating element, wherein the heat dissipation part of the two-color molded product with a heat dissipation part is in contact with the heating element directly or via a heat transfer material.   The device with a heating element according to claim 10, wherein the two-color molded product with a heat radiating portion constitutes at least a part of the case or a lid of the case. In Claim 10 or 11, the 1st field where a heating element is arranged in the case,
There is no second heating element or a second region where a low heating element with a lower heating value than the heating element is installed,
The device with a heating element, wherein the heat radiating portion extends continuously from the first region to the second region.   13. The device with a heating element according to claim 10, wherein the device with a heating element is an electronic device, and the heating element is a CPU.

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