JP2011016936A - High thermal conduction insulating resin composition and molding - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high thermal conductivity resin composition which is excellent particularly in thermal conductivity and insulation, ensures good moldability, surface smoothness and dimensional stability, is inexpensive and easy to produce, and to provide a molding thereof.SOLUTION: The high thermal conductivity resin composition comprises (A) 20-85 mass% of a thermoplastic resin, (B) 5-30 mass% of platy graphite having apparent density of ≥0.16 g/cm, and (C) 10-60 mass% of a filler having electric insulation. The molding is a high thermal conductivity resin molding obtained by molding the high thermal conductivity resin composition.

Description

  The present invention is a highly thermally conductive resin composition that is excellent in thermal conductivity, molding processability, surface smoothness, dimensional stability, has high surface resistance and excellent insulation, is inexpensive and easy to manufacture, and is molded. The present invention relates to a high thermal conductive resin molding.

  Polycarbonate resin is excellent in impact resistance, heat resistance, electrical insulation, dimensional stability, etc., and has a good balance of these properties. Therefore, the electrical / electronic field, precision machine field, automotive field, safety / medical field It is used in a wide range of applications such as food and sundries. In particular, demand is growing in the OA field, electrical / electronic field, precision machine field, and automobile field.

  In these fields, most devices are equipped with components that generate heat. However, in recent years, the power consumption per component has increased and the amount of heat generated from components has increased as the performance of devices and components has increased. Therefore, there is a concern that local high temperatures may cause troubles such as malfunctions. At present, the heat generated from metal materials is diffused in the chassis, chassis, heat sink, etc., but by increasing the thermal conductivity of resin materials that are inexpensive and have a high degree of design freedom, these resin materials There is an increasing demand for replacement materials for metal parts. In OA and electric / electronic parts, there are many applications where insulation is required, and a resin material having both high thermal conductivity and insulation is desired.

  As a method for imparting thermal conductivity to a resin material, many methods for mixing various thermal conductive fillers with a resin component have been reported. For example, Patent Document 1 discloses a thermoplastic resin composition having excellent thermal conductivity in which both high thermal conductivity inorganic fibers and high thermal conductivity inorganic powders are filled. However, in Patent Document 1, the vapor-grown carbon fiber whisker specifically used as the high thermal conductive inorganic fiber has a small fiber diameter and a large aspect ratio, so that uniform dispersion in the resin is difficult. In addition, sufficient thermal conductivity cannot be obtained due to fiber breakage during dispersion. Moreover, in patent document 1, it is not evaluated at all about warpage, dimensional stability, fluidity | liquidity, electroconductivity, and surface smoothness.

Patent Document 2 discloses a thermally conductive polymer composition containing graphitized carbon fiber having a fiber diameter of 5 to 20 μm, an average particle diameter of 10 to 500 μm, and a density of 2.20 to 2.26 g / cm ^3. Are listed. In Patent Document 2, in order to obtain high thermal conductivity, the main purpose is to increase the filling amount in the resin, and improvement of moldability, dimensional stability, and surface smoothness is not intended at all. Moreover, the electrical conductivity of the composition has not been evaluated at all.

  Patent Document 3 describes a thermoplastic resin composition having excellent heat dissipation by blending carbon fiber having a thermal conductivity of 100 W / mK or more and graphite having an average particle diameter of 1 to 100 μm. The total amount of carbon fiber and graphite used is very large, and this Patent Document 3 has no description regarding dimensional stability, surface smoothness, and conductivity.

  Further, Patent Document 4 describes a method for producing vapor grown carbon fiber coated with boron nitride, and further uses the vapor grown carbon fiber as a filler, thereby insulating and heat-dissipating heat. It is stated that the material is obtained. However, specific examples of addition are not shown, and in order to produce carbon fibers coated with boron nitride, not only the cost of equipment such as a heat treatment furnace is required, but also productivity is poor and practical. The level is not reached.

Further, Patent Document 5 discloses a thermoplastic resin and graphite having an apparent density of 0.15 g / cm ³ or less and a pH of an aqueous layer of 4 to 10 when 5 g of graphite powder is dispersed in 100 g of water. A thermoplastic resin composition is described. However, in Patent Document 5, since the apparent density of the graphite used is too low compared to the apparent density of the thermoplastic resin used, it is easy to classify the thermoplastic resin and the graphite at the time of producing the resin composition, thereby improving productivity. Inferior, it was difficult to obtain a resin composition having stable thermal conductivity.

JP-A-8-283456 JP 2002-88250 A JP 2003-49081 A JP 2002-235279 A JP 2007-31611 A

  The present invention has been made in view of the above-described conventional situation, and is particularly excellent in thermal conductivity and insulation, as well as good moldability, surface smoothness and dimensional stability, and is inexpensive and easy to manufacture. The object is to provide a highly thermally conductive resin composition and a molded product thereof.

  As a result of intensive studies to solve the above-mentioned problems, the present inventors have excellent thermal conductivity and insulation properties by blending specific graphite and a filler having electrical insulation properties into a thermoplastic resin. Further, it has been found that a highly heat conductive resin composition and a molded body thereof which are excellent in molding processability, surface smoothness and dimensional stability, are inexpensive and easy to produce can be obtained.

  The present invention has been achieved on the basis of such findings, and the gist thereof is as follows.

[1] (A) 20% by mass to 85% by mass of a thermoplastic resin, (B) 5% by mass to 30% by mass of plate-like graphite having an apparent density of 0.16 g / cm ³ or more, and (C) electrical insulation. A highly heat-conductive resin composition comprising 10% by mass or more and 60% by mass or less of a filler having a property (hereinafter referred to as “insulating filler”).

[2] When the relationship between (B) graphite content B and (C) insulating filler content C is represented by C = aB, a is 1 or more and 2 or less. The high thermal conductive resin composition according to [1].

[3] When the relationship between the average particle size R1 of (B) graphite and the average particle size R2 of (C) the insulating filler is represented by R2 = bR1, b is 0.1 or more and less than 15. The high thermal conductive resin composition according to [1] or [2].

[4] (C) The high thermal conductive resin composition according to any one of [1] to [3], wherein the insulating filler is a plate-like filler.

[5] The highly thermally conductive resin composition according to [4], wherein the insulating filler (C) is glass flakes.

[6] The high thermal conductive resin composition according to any one of [1] to [5], wherein (A) the thermoplastic resin includes a polycarbonate resin.

[7] A high thermal conductive resin molded article obtained by molding the high thermal conductive resin composition according to any one of [1] to [6].

According to the present invention, a highly thermally conductive resin composition and its molded body, which are particularly excellent in thermal conductivity and insulation, are excellent in molding processability, surface smoothness and dimensional stability, are inexpensive and easy to produce. Provided.
That is, the highly heat-conductive insulating resin composition of the present invention contains (B) plate-like graphite having a predetermined apparent density, and thus has good heat conductivity, and (B) molding of the plate-like graphite. When the orientation in the process is promoted by (C) the insulating filler, the thermal conductivity imparting effect by (B) plate-like graphite is further improved. In addition, by including (C) an insulating filler, excellent insulating properties are imparted, and surface smoothness and dimensional stability are also excellent.
In addition, the high thermal conductive insulating resin composition of the present invention has good moldability, and (B) plate-like graphite and (C) insulating filler are less expensive than carbon fiber and the like. Cost reduction is possible and manufacturing is also easy.
The highly thermally conductive resin composition and molded product thereof according to the present invention are used in various fields such as OA equipment, electrical and electronic parts, precision equipment, and automotive parts that require both thermal conductivity and insulation. It is extremely useful industrially as a component material.

  Embodiments of the high thermal conductive resin composition of the present invention and the molded body thereof will be described in detail below.

[(A) Thermoplastic resin]
The type of (A) thermoplastic resin used in the present invention is not particularly limited, and may be either an amorphous thermoplastic resin or a crystalline thermoplastic resin. Examples of the amorphous thermoplastic resin include polycarbonate resin, polyphenylene ether resin, and styrene resin, and examples of the crystalline thermoplastic resin include polyolefin resin, polyester resin, polyamide resin, and polyacetal resin. Among these thermoplastic resins, a polycarbonate resin, a resin composition composed of a polycarbonate resin and a polyester resin, and a resin composition composed of a polycarbonate resin and a styrene resin are preferable.

  As the polycarbonate resin, an aromatic polycarbonate resin, an aliphatic polycarbonate resin, and an aromatic-aliphatic polycarbonate resin can be used, and among them, an aromatic polycarbonate resin is preferable. The aromatic polycarbonate resin is a thermoplastic polycarbonate polymer or copolymer obtained by reacting an aromatic dihydroxy compound with phosgene or a diester of carbonic acid.

  Examples of the aromatic dihydroxy compound include 2,2-bis (4-hydroxyphenyl) propane (= bisphenol A), tetramethylbisphenol A, bis (4-hydroxyphenyl) -p-diisopropylbenzene, hydroquinone, resorcinol, 4, 4-dihydroxydiphenyl etc. are mentioned, Preferably bisphenol A is mentioned. Further, for the purpose of enhancing flame retardancy, a compound in which one or more tetraalkylphosphonium sulfonates are bonded to the above aromatic dihydroxy compound, or a polymer or oligomer having a siloxane structure and containing both terminal phenolic OH groups may be used. it can.

  The aromatic polycarbonate resin is preferably an aromatic polycarbonate resin derived from 2,2-bis (4-hydroxyphenyl) propane, or 2,2-bis (4-hydroxyphenyl) propane and other aromatic dihydroxy. And a polycarbonate copolymer derived from the compound.

  The molecular weight of the polycarbonate resin is a viscosity average molecular weight converted from the solution viscosity measured at a temperature of 25 ° C. using methylene chloride as a solvent, and is in the range of 14,000 to 30,000, preferably 15,000 to 28, 000, more preferably 16,000 to 26,000. If the viscosity average molecular weight is less than 14,000, the mechanical strength is insufficient, and if it exceeds 30,000, the moldability is likely to be difficult.

  The method for producing such a polycarbonate resin is not limited and can be produced by a phosgene method (interfacial polymerization method), a melting method (transesterification method), or the like. Furthermore, a polycarbonate resin produced by a melting method and having an adjusted amount of terminal OH groups can be used.

  Furthermore, as the aromatic polycarbonate resin, not only virgin raw materials but also aromatic polycarbonate resins regenerated from used products, so-called material recycled aromatic polycarbonate resins can be used. Used products include optical recording media such as optical disks, light guide plates, automobile window glass and automobile headlamp lenses, vehicle transparent members such as windshields, containers such as water bottles, glasses lenses, soundproof walls and glass windows, waves A building member such as a plate is preferred. In addition, as the regenerated aromatic polycarbonate resin, non-conforming product, pulverized product obtained from sprue or runner, or pellets obtained by melting them can be used.

  Preferred examples of the polyester resin include polyethylene terephthalate resin and polybutylene terephthalate resin.

The polyethylene terephthalate resin (PET) may be produced by either a transesterification reaction between dimethyl terephthalate and ethylene glycol or a direct esterification reaction between terephthalic acid and ethylene glycol.
In addition, the polybutylene terephthalate resin (PBT) may be produced by either a DMT method based on a transesterification reaction between dimethyl terephthalate and 1,4-butanediol, or a direct polymerization method of terephthalic acid and 1,4-butanediol. good.

  In both cases of PET and PBT, two compounds such as phthalic acid, isophthalic acid, naphthalenedicarboxylic acid, diphenyldicarboxylic acid, adipic acid, sebacic acid and trimellitic acid are used together with terephthalic acid or a dialkyl ester thereof during the polycondensation reaction. Basic acids, tribasic acids and the like, and dialkyl esters thereof can be used. It is preferable that these usage-amounts are the range of 40 mass parts or less with respect to 100 mass parts of terephthalic acid or its dialkyl ester.

  Similarly, during the polycondensation reaction, together with ethylene glycol or 1,4-butanediol, as other aliphatic glycols, for example, ethylene glycol, propylene glycol, 1,4-butanediol, hexamethylene glycol, etc., aliphatic In addition to glycol, other diols such as cyclohexanediol, cyclohexanedimethanol, xylene glycol, 2,2-bis (4-hydroxyphenyl) propane, glycerin, pentaerythritol, and polyhydric alcohols can be used in combination. The amount of these diols or polyhydric alcohols used is preferably in the range of 40 parts by mass or less based on 100 parts by mass of the aliphatic glycol. Moreover, it is preferable that these usage-amounts are the range of 40 mass parts or less with respect to 100 mass parts of terephthalic acid or its dialkyl ester.

  The molecular weight of the polyester resin is an intrinsic viscosity measured at 30 ° C. in a mixed solvent of phenol and tetrachloroethane (weight ratio = 50/50), preferably 0.5 to 1.8, and more preferably 0. .7 to 1.5.

  As the polyester resin, not only a virgin raw material but also a polyester resin regenerated from a used product, that is, a so-called material recycled polyester resin can be used. Spent products include mainly containers, films, sheets, fibers, etc., but more suitable are containers such as PET bottles. In addition, as the recycled polyester resin, non-conforming products, pulverized products obtained from sprues, runners, etc., or pellets obtained by melting them can be used.

  In the present invention, when the thermoplastic resin (A) is an alloy of a polycarbonate resin and a polyester resin such as PET or PBT, it is preferable that the thermoplastic resin is contained in a proportion of 100 parts by mass or less of the polyester resin with respect to 100 parts by mass of the polycarbonate resin. . When the polyester resin exceeds this upper limit, the load deflection temperature and the impact resistance decrease greatly.

  Examples of the styrene resin include acrylonitrile-styrene copolymer, acrylonitrile-styrene-butadiene copolymer, acrylonitrile-ethylenepropylene rubber-styrene copolymer, acrylonitrile-styrene-acrylic rubber copolymer, and the like. A bulk polymerization method or an emulsion polymerization method can be exemplified as a polymerization method of these styrene resins, and a resin polymerized by the bulk polymerization method is desirable.

  As the styrene resin, not only a virgin raw material but also a styrene resin regenerated from a used product, that is, a so-called material-recycled styrene resin can be used. As a used product, a housing etc. are mainly mentioned. In addition, as the regenerated styrene resin, non-conforming products, pulverized products obtained from sprues, runners, etc., or pellets obtained by melting them can be used.

  In the present invention, when (A) the thermoplastic resin is an alloy of a polycarbonate resin and a styrene resin, it is preferably contained in a proportion of 100 parts by mass or less of the styrene resin with respect to 100 parts by mass of the polycarbonate resin. When the styrene-based resin exceeds this upper limit, the load deflection temperature decreases greatly.

[(B) Graphite]
The (B) graphite used in the present invention is a plate-like graphite having an apparent density of 0.16 g / cm ³ or more, preferably selected from natural scaly graphite, natural scaly graphite, pyrolytic graphite, and quiche graphite. Is mentioned.

When the apparent density of (B) graphite is less than 0.16 g / cm ³ , the difference in apparent density between (A) the thermoplastic resin and (C) the insulating filler is too large, and the resin composition of the present invention is produced. It is not preferable because it is easy to separate, the productivity is lowered, and the quality of the obtained resin composition varies greatly. (B) The apparent density of graphite is preferably 0.18 g / cm ³ or more, more preferably 0.20 g / cm ³ or more. The upper limit of the apparent density is usually about 0.5 g / cm ³ . The apparent density can be obtained by filling a graduated cylinder with 30 ml of graphite in a naturally falling state and measuring the weight.

  The fixed carbon content of (B) graphite used in the present invention is preferably 97% by mass or more, and more preferably 98% by mass or more. (B) The ash content of graphite is preferably 2% by mass or less, more preferably 1% by mass or less. Moreover, the volatile matter content rate of (B) graphite becomes like this. Preferably it is 1.5 mass% or less, More preferably, it is 1.0 mass% or less. When the fixed carbon, ash content, and volatile content of graphite deviate from the above ranges, the thermal conductivity and heat stability of the resin composition may be lowered.

  The average particle diameter of the (B) graphite used in the present invention is preferably 3 to 100 μm, more preferably 5 to 80 μm, and further preferably 5 to 60 μm in terms of weight average. When the graphite having an average particle size of less than 3 μm is melt-kneaded using an extruder or the like, the graphite does not easily bite into the screw, becomes unstable in measurement, and decreases in productivity. When the average particle diameter of graphite exceeds 100 μm, the surface smoothness and dispersibility of the molded product are inferior.

  Further, (B) graphite used in the present invention is a graphite having a plate-like shape. Here, the plate-like refers to a flaky or scaly thin one with respect to the area of the plate surface, Preferably, the average thickness / average particle size is 2-20.

  The average particle diameter and average thickness of this (B) graphite are the average particle diameter and average thickness before melt-kneading, and usually use catalog values, but when not disclosed, the median measured by the ISO 13320 laser method The value obtained by the particle size (sometimes expressed as D50 value) was used as the average particle size. After the graphite was hardened with an epoxy resin and polished, the polished surface was observed with an SEM (scanning electron microscope). Let the average value of thickness be an average thickness.

  As long as (B) graphite used in the present invention does not impair the properties of the resin composition of the present invention, (A) surface treatment such as epoxy treatment, urethane treatment, An oxidation treatment or the like may be performed.

[(C) Insulating filler]
The resin composition of the present invention includes (B) graphite and (C) an insulating filler, thereby having both excellent thermal conductivity and insulating properties.

  That is, in the resin composition of the present invention, thermal conductivity can be obtained by including (B) graphite, but (B) graphite is plate-like graphite and (C) coexists with an insulating filler. By doing so, the orientation of the plate-like (B) graphite is promoted by the (C) insulating filler during molding, and as a result, the thermal conductivity of the plate-like graphite is enhanced. Moreover, insulation is also provided by including an insulating (C) insulating filler. Furthermore, the inclusion of (C) an insulating filler improves surface smoothness and dimensional stability, and increases the hardness of the resulting molded product, thereby improving the choke resistance. The

  The (C) insulating filler used in the present invention may be in the form of particles, plates, or fibers, but is preferably plate or fiber, and particularly preferably plate.

Examples of the plate-like (C) insulating filler include flaky and scaly talc, mica, clay, kaolin, and glass flakes, with glass flakes being particularly preferred.
Examples of the fibrous (C) insulating filler include glass fiber and wallast fiber, and glass fiber is preferable.
These insulating fillers may be used alone or in combination of two or more.

Glass flake is a plate-shaped amorphous glass having a thickness of 3 to 7 μm and a particle diameter of 10 to 4000 μm, and exhibits unique effects depending on the properties of glass as an inorganic material and the properties obtained from the shape. The glass used includes C glass and E glass. Since E glass has less Na ₂ O or K ₂ O or the like than C glass, glass flakes using E glass are preferably used. As the glass flake, for example, REFG-101 of Nippon Electric Glass Co., Ltd., which is a commercial product, is used, and the average particle diameter is 600 μm and the average thickness is 3 to 7 μm. Glass flakes having a larger average particle size than other additives cause an appearance defect when the amount added is increased, so the amount to be blended must be adjusted.

  As the glass fiber, those having an average fiber diameter of about 5 to 20 μm and an average fiber length of about 30 to 200 μm in the molded product are preferable.

  As long as the (C) insulating filler used in the present invention does not impair the properties of the resin composition of the present invention, (A) surface treatment, for example, epoxy treatment, urethane is used to increase the affinity with the thermoplastic resin. Treatment, oxidation treatment, etc. may be performed.

[Combination ratio]
The blending ratio of the above components (A) to (C) in the high thermal conductive resin composition of the present invention is as follows: (A) thermoplastic resin is 20% by mass to 85% by mass, and (B) graphite is 5% by mass to 30%. It is 10 mass% or less and 60 mass% or less of (C) insulating filler.

  When the component (A) is less than 20% by mass, surface smoothness and molding processability are deteriorated, and when it exceeds 85% by mass, thermal conductivity and dimensional stability are deteriorated. When the component (B) is less than 5% by mass, the thermal conductivity is lowered, and when it exceeds 40% by mass, the moldability and the insulation are lowered. When the component (C) is less than 10% by mass, the dimensional stability and thermal conductivity are lowered, and when it exceeds 60% by mass, the moldability and the surface smoothness are lowered.

A more preferable blending ratio is
(A) Thermoplastic resin 55-85 mass%
(B) Graphite 10-30% by mass
(C) Insulating filler 5-15% by mass
It is.

  The blending ratio of the (B) component and the (C) component is such that when the relationship between the content C of the (C) component and the content B of the (B) component in the composition is represented by C = aB, a Is preferably 1 or more and 2 or less. When the blending ratio is such that the value of a is less than 1, the insulating property is lowered, and when it exceeds 2, the thermal conductivity is lowered. a is more preferably 1.2 to 1.8.

  In addition, in the resin composition of this invention, in order to acquire the effect by including the above-mentioned (A) component, (B) component, and (C) component reliably, (A) component in a resin composition, (B The total amount of the component (C) and the component (C) is preferably 80% by mass or more.

[Average particle size ratio]
In the present invention, when the relationship between (B) the average particle diameter R1 of graphite and (C) the average particle diameter R2 of the insulating filler is represented by R2 = bR1, the value of b is 0.1 or more and less than 15 It is preferable that When the particle size ratio is such that the value of b is less than 0.1, the effect of promoting the orientation of the component (B) by the component (C) is weak, and the thermal conductivity is lowered. Even if b exceeds 15, (C) component becomes a barrier and thermal conductivity falls. b is more preferably 0.5-15.

Here, (C) the average particle diameter of the insulating filler is the residue (for example, polycarbonate) obtained by burning the resin composition or its molded body at a high temperature when the insulating filler is a fibrous filler. The resin was obtained by separating the residue obtained by dissolving and removing the resin with an organic solvent (for example, chloroform for polycarbonate) or the like using a difference in specific gravity (for example, at 600 ° C. for 4 hours). C) The insulating filler is dispersed on the preparation and then observed with an optical microscope, and the length of the filler is randomly measured for about 100 fillers and averaged. .
In addition, when the insulating filler (C) is a granular or plate-like filler, a residue obtained by burning the resin composition or its molded body at a high temperature (for example, 4 hours at 600 ° C. for a polycarbonate resin), (C) Insulating filler obtained by, for example, separating the residue obtained by dissolving and removing the resin with an organic solvent (for example, chloroform in the case of polycarbonate) using a difference in specific gravity, etc. is dispersed on the preparation. It is observed with an optical microscope, and the diameter of the minimum circumscribed circle of the filler is measured and averaged for about 100 of the fillers at random.

[Other ingredients]
In addition to the above (A) thermoplastic resin, (B) graphite, and (C) insulating filler, the high thermal conductive resin composition of the present invention can be used as long as the object of the present invention is not impaired. Further, other blending components may be included.

<Aromatic polycarbonate oligomer>
The resin composition of the present invention preferably contains an aromatic polycarbonate oligomer for the purpose of imparting excellent fluidity and surface smoothness. The aromatic polycarbonate oligomer can be obtained by reacting bisphenol A (BPA) with phosgene or a carbonic acid diester using an appropriate terminal terminator or molecular weight regulator. Further, a copolymer type in which a part of bisphenol A is replaced with another divalent phenol may be used, and the aromatic dihydroxy compound described in the above aromatic polycarbonate resin is used as the other divalent phenol. .

  Examples of the terminal terminator or the molecular weight regulator include compounds having a monovalent phenolic hydroxyl group and compounds having an aromatic carboxylic acid group, such as normal phenol, pt-butylphenol, 2,3,6-triol. In addition to bromophenol and the like, long-chain alkylphenols, aliphatic carboxylic acid chlorides, aliphatic carboxylic acids, hydroxybenzoic acid, and the like can be mentioned.

  Such an aromatic polycarbonate oligomer tends to bleed out from a molded product at the time of molding at a degree of polymerization of 1, while it becomes difficult to obtain satisfactory fluidity and surface smoothness when the degree of polymerization becomes large. is there.

  As the aromatic polycarbonate oligomer, one kind may be used alone, or two or more kinds of raw material compounds or those having different polymerization degrees may be mixed and used.

  The compounding quantity of the aromatic polycarbonate oligomer in the resin composition of this invention becomes like this. Preferably it is 40 mass parts or less with respect to 100 mass parts of (A) thermoplastic resins, for example, 1-40 mass parts. If this ratio is less than 1 part by mass, sufficient fluidity and surface smoothness are hardly obtained, and if it exceeds 40 parts by mass, the mechanical properties are deteriorated. A more preferable blending amount is 2 to 30 parts by mass with respect to 100 parts by mass of (A) the thermoplastic resin.

<Flame Retardant>
In the present invention, a flame retardant can be used to impart flame retardancy. The flame retardant is not particularly limited as long as it improves the flame retardancy of the resin composition, but a phosphoric acid ester compound, an organic sulfonic acid metal salt, and a silicone compound are preferable.

As a phosphate ester compound used by this invention, the compound represented by following formula (1) is preferable, for example.

(In the formula, R ₁ , R ₂ , R ₃ and R ₄ are each independently an aryl group which may be substituted, and X is a divalent aromatic which may have another substituent. And n represents a number of 0 to 5.)

In the above formula (1), examples of the aryl group represented by R _{1 to} R ₄ include a phenyl group and a naphthyl group. Examples of the divalent aromatic group represented by X include a phenylene group, a naphthylene group, and a group derived from, for example, bisphenol. Examples of the substituent that these groups may have include an alkyl group, an alkoxy group, and a hydroxyl group.
The compound represented by the formula (1) is a phosphate ester when n is 0, and is a condensed phosphate ester (including a mixture) when n is greater than 0. For this purpose, condensed phosphate esters are preferably used.

  Specific examples of such phosphate ester flame retardants include bisphenol A bisphosphate, hydroquinone bisphosphate, resorcinol bisphosphate, resorcinol-diphenyl phosphate, and substituted or condensates thereof. Examples of commercially available condensed phosphate compounds that can be suitably used as such components include, for example, “CR733S” (resorcinol bis (diphenyl phosphate)), “CR741” (bisphenol A bis ( Diphenyl phosphate)), “PX200” (resorcinol bis (dixylenyl phosphate)), and “FP700” (bisphenol A bis (diphenyl phosphate)) from Asahi Denka Co., Ltd. It is.

  These phosphate ester flame retardants may be used alone or in combination of two or more.

  Content of the phosphate ester type flame retardant in the resin composition of the present invention is 50 parts by mass or less, for example 1 to 50 parts by mass, preferably 3 to 40 parts by mass with respect to 100 parts by mass of the (A) thermoplastic resin. Part, particularly preferably 5 to 30 parts by weight. If the content of the phosphate ester flame retardant is less than 1 part by mass, the flame retardancy is insufficient, and if it exceeds 50 parts by mass, the heat resistance is excessively lowered, which is not preferable.

  Preferred examples of the organic sulfonic acid metal salt used in the present invention include aliphatic sulfonic acid metal salts and aromatic sulfonic acid metal salts. The metal constituting the organic sulfonic acid metal salt is preferably an alkali metal, alkaline earth metal, etc., for example, sodium, lithium, potassium, rubidium, cesium, beryllium, magnesium, calcium, strontium, barium and the like. Can be mentioned. The organic sulfonic acid metal salt can also be used by mixing two or more kinds of salts.

  The aliphatic sulfonate is preferably a fluoroalkane-sulfonic acid metal salt, more preferably a perfluoroalkane-sulfonic acid metal salt. The fluoroalkane-sulfonic acid metal salt is preferably an alkali metal salt of fluoroalkane-sulfonic acid or an alkaline earth metal salt of fluoroalkane-sulfonic acid, more preferably 4 to 8 carbon atoms. Examples thereof include alkali metal salts and alkaline earth metal salts of fluoroalkanesulfonic acid. Specific examples of the fluoroalkane-sulfonic acid metal salt include perfluorobutane-sodium sulfonate, perfluorobutane-potassium sulfonate, perfluoromethylbutane-sodium sulfonate, perfluoromethylbutane-potassium sulfonate, perfluoro Examples include octane-sodium sulfonate and potassium perfluorooctane-sulfonate.

  The aromatic sulfonic acid metal salt is preferably an aromatic sulfonic acid alkali metal salt, an aromatic sulfonic acid alkaline earth metal salt, an aromatic sulfone sulfonic acid alkali metal salt, or an aromatic sulfone sulfonic acid alkaline earth metal. Salts, and the like, and the aromatic sulfonesulfonic acid alkali metal salt and the aromatic sulfonesulfonic acid alkaline earth metal salt may be a polymer. Specific examples of the aromatic sulfonic acid metal salt include 3,4-dichlorobenzenesulfonic acid sodium salt, 2,4,5-trichlorobenzenesulfonic acid sodium salt, benzenesulfonic acid sodium salt, diphenylsulfone-3-sulfonic acid. Sodium salt, potassium salt of diphenylsulfone-3-sulfonic acid, sodium salt of 4,4′-dibromodiphenyl-sulfone-3-sulfonic acid, potassium salt of 4,4′-dibromodiphenyl-sulfone-3-sulfonic acid 4-chloro-4′-nitrodiphenylsulfone-3-sulfonic acid calcium salt, diphenylsulfone-3,3′-disulfonic acid disodium salt, diphenylsulfone-3,3′-disulfonic acid dipotassium salt, and the like. Can be mentioned.

  These organic sulfonic acid metal salts may be used alone or in combination of two or more.

  The compounding amount of the organic sulfonic acid metal salt in the resin composition of the present invention is preferably 0.01 to 5 parts by mass, more preferably 0.02 to 3 parts by mass with respect to 100 parts by mass of the (A) thermoplastic resin. Particularly preferred is 0.03 to 2 parts by mass. When the amount of the organic sulfonic acid metal salt is less than 0.01 parts by mass, sufficient flame retardancy is difficult to obtain, and when it exceeds 5 parts by mass, the thermal stability tends to be lowered.

The silicone flame retardant used in the present invention is preferably a polyorganosiloxane having a direct or branched structure. The organic group possessed by the polyorganosiloxane includes hydrocarbons such as alkyl groups and substituted alkyl groups having 1 to 20 carbon atoms, vinyl and alkenyl groups, cycloalkyl groups, and aromatic hydrocarbon groups such as phenyl and benzyl. Chosen from.
Even if polydiorganosiloxane does not contain a functional group, it may contain a functional group. In the case of a polydiorganosiloxane containing a functional group, the functional group is preferably a methacryl group, an alkoxy group or an epoxy group.
These polyorganosiloxanes may be supported on silica.
These silicone flame retardants may be used alone or in combination of two or more.

  As for the compounding quantity of the silicone type flame retardant in the resin composition of this invention, 0.1-5 mass parts is preferable with respect to 100 mass parts of (A) thermoplastic resins, More preferably, 0.3-4 mass parts, Particularly preferred is 0.5 to 3.5 parts by mass. When the blending amount of the silicone flame retardant is less than 0.1 parts by mass, it is difficult to obtain sufficient flame retardancy, and when it exceeds 5 parts by mass, the thermal stability tends to decrease.

<Anti-dripping agent>
In the present invention, an anti-dripping agent can be included for the purpose of preventing dripping during combustion. The anti-dripping agent is preferably a fluororesin. Here, the fluororesin is a polymer or copolymer containing a fluoroethylene structure, such as a difluoroethylene polymer, a tetrafluoroethylene polymer, a tetrafluoroethylene-hexafluoropropylene copolymer, tetrafluoroethylene and fluorine. And a copolymer with an ethylene monomer that does not contain. Polytetrafluoroethylene (PTFE) is preferable, and the average molecular weight is preferably 500,000 or more, and particularly preferably 500,000 to 10,000,000.

As the polytetrafluoroethylene that can be used in the present invention, all types of polytetrafluoroethylene that are currently known can be used. However, when polytetrafluoroethylene having a fibril-forming ability is used, it is even higher. Melting dripping prevention property can be provided. Although there is no restriction | limiting in particular in the polytetrafluoroethylene (PTFE) which has a fibril formation ability, For example, what is classified into the type 3 in ASTM standard is mentioned. Specific examples thereof include, for example, Teflon (registered trademark) 6-J (manufactured by Mitsui DuPont Fluorochemical Co., Ltd.), Polyflon D-1, Polyflon F-103, Polyflon F201 (Daikin Industries, Ltd.), CD076 ( Asahi IC Fluoropolymers Co., Ltd.). Other than those classified as type 3, for example, Argoflon F5 (manufactured by Montefluos Co., Ltd.), polyflon MPA, polyflon FA-100 (manufactured by Daikin Industries, Ltd.) and the like can be mentioned. These polytetrafluoroethylene (PTFE) may be used independently and may combine 2 or more types. Polytetrafluoroethylene (PTFE) having the fibril-forming ability as described above is prepared by, for example, using tetrafluoroethylene in an aqueous solvent in the presence of sodium, potassium, ammonium peroxydisulfide, at a pressure of 1 to 100 psi, at a temperature of 0. It is obtained by polymerizing at ˜200 ° C., preferably 20˜100 ° C.
Alternatively, Teflon (registered trademark) 30-J (Mitsui / Dupont Fluorochemical Co., Ltd.) dispersed in a solvent may be used.

Further, it may be a polytetrafluoroethylene-containing mixed powder composed of polytetrafluoroethylene particles and organic polymer particles.
Here, specific examples of the monomer for producing the organic polymer particles include styrene, p-methylstyrene, o-methylstyrene, p-chlorostyrene, o-chlorostyrene, p-methoxystyrene, o. -Styrene monomers such as methoxystyrene, 2,4-dimethylstyrene, α-methylstyrene, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, butyl acrylate, butyl methacrylate, acrylic acid- (Meth) acrylic acid esters such as 2-ethylhexyl, 2-ethylhexyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tridodecyl acrylate, tridodecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate Monomers, vinyl cyanide monomers such as acrylonitrile and methacrylonitrile, vinyl ether monomers such as vinyl methyl ether and vinyl ethyl ether, vinyl carboxylate monomers such as vinyl acetate and vinyl butyrate, ethylene Olefin monomers such as propylene and isobutylene, and diene monomers such as butadiene, isoprene and dimethylbutadiene, but are not limited thereto. Preferably, two or more types of polymers or copolymers of these monomers can be used to obtain organic polymer particles.
These may be used alone or in combination of two or more.

  In the resin composition of the present invention, when a dripping inhibitor such as polytetrafluoroethylene is blended, the content thereof is preferably 0.05 to 0.5% by weight, particularly preferably 0.2% in the resin composition. ~ 0.4 wt%. If the blending amount of the anti-dripping agent is too small, the effect of preventing dripping at the time of combustion due to the use of the anti-dripping agent cannot be obtained sufficiently, and if too large, the impact resistance is lowered.

<Impact resistance improver>
In the present invention, an elastomer can be included as an impact resistance improver.

Various known elastomers can be used as the elastomer, and it is not particularly limited, but a multilayer structure polymer is preferable. Examples of the multilayer structure polymer include those containing an alkyl (meth) acrylate polymer. These multi-layered polymers include, for example, polymers produced by continuous multi-stage seed polymerization in which a polymer in a previous stage is sequentially coated with a polymer in a subsequent stage, and a basic polymer. As a structure, it is a polymer having an outermost core layer made of a polymer compound that improves the adhesion between the inner core layer, which is a crosslinking component having a low glass transition temperature, and the matrix of the composition. A rubber component having a glass transition temperature of 0 ° C. or lower is selected as a component that forms the innermost core layer of these multilayer polymers. These rubber components include rubber components such as butadiene, rubber components such as styrene / butadiene, rubber components of alkyl (meth) acrylate polymers, polyorganosiloxane polymers and alkyl (meth) acrylate polymers. Or a rubber component using these in combination. Furthermore, examples of the component that forms the outermost core layer include an aromatic vinyl monomer, a non-aromatic monomer, or a copolymer of two or more thereof. Examples of the aromatic vinyl monomer include styrene, vinyl toluene, α-methyl styrene, monochloro styrene, dichloro styrene, bromo styrene, and the like. Of these, styrene is particularly preferably used. Examples of non-aromatic monomers include alkyl (meth) acrylates such as ethyl (meth) acrylate and butyl (meth) acrylate, vinyl cyanide such as acrylonitrile and methacrylonitrile, and vinylidene cyanide.
These may be used alone or in combination of two or more.

  In the resin composition of the present invention, when an elastomer as an impact modifier is blended, the content thereof is preferably 10 parts by mass or less, particularly preferably 2 to 100 parts by mass of (A) the thermoplastic resin. 8 parts by mass. If the amount of the elastomer is too small, the effect of improving the impact resistance due to the use of the elastomer cannot be sufficiently obtained. If the amount is too large, the melt viscosity becomes high and the moldability deteriorates.

<Reinforcing material>
Further, a reinforcing material can be added to the resin composition of the present invention in order to improve the elastic modulus, strength, and deflection temperature under load. Here, as a reinforcing material, silica, diatomaceous earth, alumina, titanium oxide, magnesium oxide, pumice powder, pumice balloon, aluminum hydroxide, magnesium hydroxide, basic magnesium carbonate, dolomite, calcium sulfate, potassium titanate, barium sulfate Examples thereof include calcium sulfite, talc, clay, mica, carbon fiber, glass beads, calcium silicate, montmorillonite, bentonite, aluminum powder, molybdenum sulfide, boron fiber, silicon carbide fiber, polyester fiber, polyamide fiber, and aluminum borate. Although not particularly limited, talc and mica are preferable. These may be used alone or in combination of two or more.

  In the resin composition of the present invention, when these reinforcing materials are used, the content thereof is preferably 100 parts by mass or less, particularly preferably 10 to 80 parts by mass with respect to 100 parts by mass of the (A) thermoplastic resin. . If the blending amount of the reinforcing material is too small, it is not possible to obtain a sufficient reinforcing effect by using the reinforcing material, and if it is too large, the melt viscosity increases and the moldability deteriorates.

<Release agent>
A release agent can be blended with the resin composition of the present invention in order to improve the mold releasability at the time of molding.

  Examples of the release agent include aliphatic carboxylic acids and alcohol esters thereof, aliphatic hydrocarbon compounds having a number average molecular weight of 200 to 15000, polysiloxane silicone oil, and the like.

  Examples of the aliphatic carboxylic acid include saturated or unsaturated, linear or cyclic aliphatic 1 to 3 carboxylic acids. Among these, monovalent or divalent carboxylic acids having 6 to 36 carbon atoms are preferable, and aliphatic saturated monovalent carboxylic acids having 6 to 36 carbon atoms are particularly preferable. Specific examples of such aliphatic carboxylic acids include palmitic acid, stearic acid, caproic acid, capric acid, lauric acid, arachidic acid, behenic acid, lignoceric acid, serotic acid, melissic acid, tetrariacontanoic acid, Examples include montanic acid, adipic acid, and azelaic acid.

  The aliphatic carboxylic acid component in the aliphatic carboxylic acid ester has the same meaning as the above-mentioned aliphatic carboxylic acid. On the other hand, examples of the alcohol component of the aliphatic carboxylic acid ester include saturated or unsaturated, linear or cyclic monovalent or polyhydric alcohols. These may have a substituent such as a fluorine atom, an aryl group, etc., among which monovalent or polyvalent saturated alcohols having 30 or less carbon atoms are preferable, particularly 30 or less carbon atoms, saturated aliphatic monovalent or Polyhydric alcohols are preferred.

  Specific examples of such alcohol components include octanol, decanol, dodecanol, stearyl alcohol, behenyl alcohol, ethylene glycol, diethylene glycol, glycerin, pentaerythritol, 2,2-dihydroxyperfluoropropanol, neopentylene glycol, ditrimethylolpropane. And dipentaerythritol. The aliphatic carboxylic acid ester may contain an aliphatic carboxylic acid and / or alcohol as an impurity, and may be a mixture of a plurality of aliphatic carboxylic acid esters.

  Specific examples of the aliphatic carboxylic acid ester include beeswax (a mixture based on myricyl palmitate), stearyl stearate, behenyl behenate, stearyl behenate, glycerin monopalmitate, glycerin monostearate, glycerin di Examples thereof include stearate, glycerin tristearate, pentaerythritol monopalmitate, pentaerythritol monostearate, pentaerythritol distearate, pentaerythritol tristearate, pentaerythritol tetrastearate and the like.

  Examples of the aliphatic hydrocarbon having a number average molecular weight of 200 to 15000 include liquid paraffin, paraffin wax, microwax, polyethylene wax, Fischer-Tropsch wax, and α-olefin oligomer having 3 to 12 carbon atoms. Here, the aliphatic hydrocarbon includes alicyclic hydrocarbons. Moreover, these hydrocarbon compounds may be partially oxidized.

  Among these aliphatic hydrocarbons, paraffin wax, polyethylene wax, or partial oxides of polyethylene wax are preferable, and paraffin wax and polyethylene wax are particularly preferable. The number average molecular weight is preferably 200 to 5,000. These aliphatic hydrocarbons may be used alone or in combination of two or more at any ratio as long as the main component is within the above range.

  Examples of the polysiloxane-based silicone oil include dimethyl silicone oil, phenylmethyl silicone oil, diphenyl silicone oil, fluorinated alkyl silicone, and the like, and these may be used alone or in combination of two or more.

  The content of the release agent in the resin composition of the present invention may be selected and determined as appropriate. However, if the amount is too small, the release effect is not sufficiently exhibited. Deterioration, mold contamination at the time of molding, etc. may be a problem. Therefore, the compounding quantity of a mold release agent is 0.001-2 mass parts with respect to 100 mass parts of (A) thermoplastic resins, and it is preferable that it is 0.01-1 mass part especially.

<Other additives>
Moreover, additives, such as stabilizers, such as a ultraviolet absorber and antioxidant, pigments, dyes, and lubricants, can be added to the resin composition of the present invention, if necessary.

[Production method]
As a method for obtaining the resin composition of the present invention, a method of kneading the above components with various kneaders, for example, a uniaxial and multiaxial kneader, a Banbury mixer, a roll, a Brabender plastogram, etc., and then solidifying by cooling. Add the above components to a suitable solvent, for example, hydrocarbons such as hexane, heptane, benzene, toluene, xylene and their derivatives, and mix the dissolved components or the dissolved and insoluble components in suspension. A solution mixing method or the like is used. The melt-kneading method is preferable from the industrial cost, but is not limited thereto. In melt kneading, it is preferable to use a single-screw or twin-screw extruder.

  In the present invention, from the viewpoint of improving thermal conductivity, insulation and dimensional stability, when (B) graphite or (C) insulating filler is blended into (A) thermoplastic resin, (B) And the compounding method in which (C) component is not crushed is preferable. For this purpose, for example, a method of feeding (B) graphite and (C) insulating filler from the middle of the extruder during kneading is preferable. Among these, a method of feeding (B) graphite and (C) insulating filler from the middle of the extruder using a twin screw extruder is preferable. By adopting this method, crushing of (B) graphite and (C) insulating filler during kneading is suppressed, and stable production becomes possible.

[Molding method]
The method for obtaining a molded body using the resin composition of the present invention is not particularly limited, and a molding method generally used for thermoplastic resin compositions such as injection molding, hollow molding, extrusion molding, and sheeting is used. A molding method such as molding, thermoforming, rotational molding, and lamination molding can be applied. Among these, a molded body obtained by injection molding is preferable because (B) graphite is easily oriented, and the thermal conductivity tends to increase.

[Molded body]
The highly thermally conductive resin molded article of the present invention is formed by molding the above-described highly thermally conductive resin composition of the present invention, and particularly OA equipment parts and electrical / electronic parts that are required to have thermal conductivity and insulation, It is widely used for precision equipment and automotive parts, but it is particularly suitable for internal parts of OA equipment and electrical / electronic equipment. For example, it is suitable for connector parts, personal computer members, mobile phones, printers, copiers, scanners, televisions, audio equipment, Applications include lighting, office equipment, AV equipment members, and the like.

  EXAMPLES The present invention will be described in detail below with reference to examples, but the present invention is not limited to the following examples.

  In the following examples and comparative examples, the following components were used as compounding components of the resin composition.

(A) Thermoplastic resin Aromatic polycarbonate resin: Poly-4,4-isopropylidene diphenyl carbonate, manufactured by Mitsubishi Engineering Plastics Co., Ltd., trade name: Iupilon (registered trademark) S-3000, viscosity average molecular weight 21,000

(B) Graphite Scale graphite: manufactured by Nishimura Graphite Co., Ltd., trade name: PB-90, fixed carbon: 90.4% by mass, ash content: 8.2% by mass, volatile content: 1.4% by mass, apparent density : 0.20 g / cm ³ , average particle diameter R1: 14 μm, average thickness: 3 μm

(C) Insulating filler Glass fiber: manufactured by Nippon Electric Glass Co., Ltd., trade name: T571, E glass, average fiber diameter: 13 μm, average fiber length: 3 mm
Glass flakes: manufactured by Nippon Sheet Glass Co., Ltd., trade name: Micro Glass Flaker REFG101, E glass, average particle size R2: 600 μm, average thickness: 4 μm

(D) Other components Mold release agent: Clariant Japan Co., Ltd. product name “LICOWAX PE520POWDER” (polyethylene wax)

[Examples 1 to 6, Comparative Example 1]
The blending components of the resin composition were set to the ratios shown in Table 1, and (B) graphite and (C) components other than glass flakes or glass fibers were uniformly mixed with a tumbler mixer, and then a twin screw extruder (Nippon Steel Works). Manufactured by TEX30XCT, L / D = 42, barrel number 12), fed to the extruder from the upstream side of the extruder at a cylinder temperature of 280 ° C. and a screw speed of 200 rpm, melted and kneaded, and further from the middle of the extruder (B) Graphite and (C) glass flakes or glass fibers (only graphite in Comparative Example 1) were fed at a ratio shown in Table 1 and melt kneaded to pelletize the resin composition. The length of the glass fiber in the pellet was about 100 to 500 μm, and the particle size of the glass flake was about 50 to 200 μm.

  The obtained resin composition was evaluated as follows, and the results are shown in Table 1.

<Thermal conductivity>
Using an injection molding machine (manufactured by Sumitomo Heavy Industries, SH100, mold clamping force 100T), at a cylinder temperature of 300 ° C. and a mold temperature of 80 ° C., a mold: 100 mm long, 100 mm wide, 3 mm thick Was injection molded under the condition of injection pressure: 147 MPa, three of the obtained injection molded products were stacked, and the heating wire of the probe was measured using a rapid thermal conductivity measurement device (Kemtherm QTM-D3, manufactured by Kyoto Electronics Industry Co., Ltd.). direction, by pressing to match the flow direction of the 3-ply top of the molded article was measured for thermal conductivity, this value and lambda _MD. Similarly, the thermal conductivity is measured by pressing so that the direction of the heating wire of the probe matches the direction perpendicular to the flow direction, and this value is set as λ _TD . Then pressed to fit the direction of three superimposed heating wire in the stacking direction and the probe of the laminate surface to measure the thermal conductivity, the value and lambda _T.
λ ₁ , λ ₂ , and λ ₃ were obtained by the following equations.
λ ₁ = λ _TD × λ _T / λ _MD
λ ₂ = λ _T × λ _MD / λ _TD
λ ₃ = λ _MD × λ _TD / λ _T

<Insulation>
Volume resistivity: Resin temperature (measured temperature of purge resin): 300 ° C., mold temperature: 80 ° C., mold: length 100 mm, width by injection molding machine (manufactured by Sumitomo Heavy Industries, SH100, clamping force 100T) A molded product obtained by injection molding under the conditions of 100 mm and thickness 2 mm was measured with a resistivity meter (manufactured by Advantest Co., Ltd .: R8340 digital ultrahigh resistance / microammeter and R12704 resiliency chamber). . The measurement was performed on three samples, and the average value was defined as volume resistivity. Volume resistivity is expressed in units of “Ω · cm”.
Surface resistivity: Injection molding machine (manufactured by Sumitomo Heavy Industries, SH100, mold clamping force 100T), resin temperature (measured temperature of purge resin): 300 ° C, mold temperature: 80 ° C, mold: vertical 100mm, horizontal A molded product obtained by injection molding under the conditions of 100 mm and thickness 2 mm was measured with a resistivity meter (manufactured by Advantest Co., Ltd .: R8340 digital ultrahigh resistance / microammeter and R12704 resiliency chamber). . The measurement was performed on three samples, and the average value was defined as the surface resistivity. The surface resistivity is displayed in units of “Ω / □”.

<Chalk resistance>
Using an injection molding machine (manufactured by Sumitomo Heavy Industries, SH100, clamping force 100T), resin temperature (measured temperature of purge resin): 300 ° C., mold temperature: 80 ° C., mold: vertical 100 mm, horizontal A molded article having a thickness of 100 mm and a thickness of 2 mm was injection-molded, and the obtained injection-molded article was visually observed for the color of the paper surface when the edge portion was rubbed against white paper. ”And“ ×: Defect ”.

  From Table 1, the resin composition of the present invention is excellent in thermal conductivity and insulation, and in particular, by blending (C) an insulating filler together with (B) graphite, the thermal conductivity can be further improved. I understand. Moreover, it turns out that it is more preferable to use glass flakes rather than glass fiber as an insulating filler especially in terms of improving thermal conductivity.

Claims (7)

(A) 20% by mass to 85% by mass of a thermoplastic resin, (B) 5% by mass to 30% by mass of plate-like graphite having an apparent density of 0.16 g / cm ³ or more, and (C) electric insulation. A high thermal conductive resin composition comprising 10% by mass or more and 60% by mass or less of a filler (hereinafter referred to as “insulating filler”).   2. The relationship between (B) graphite content B and (C) insulating filler content C is expressed by C = aB, wherein a is 1 or more and 2 or less. The high thermal conductive resin composition as described in 1.   (B) When the relationship between the average particle diameter R1 of graphite and the average particle diameter R2 of (C) the insulating filler is represented by R2 = bR1, b is 0.1 or more and less than 15. The high thermal conductive resin composition according to claim 1 or 2.   (C) The highly insulating resin composition according to any one of claims 1 to 3, wherein the insulating filler is a plate-like filler.   (C) Insulating filler is glass flakes, The highly heat conductive resin composition of Claim 4 characterized by the above-mentioned.   (A) Thermoplastic resin contains polycarbonate-type resin, The highly heat conductive resin composition in any one of Claim 1 thru | or 5 characterized by the above-mentioned.   A high thermal conductive resin molded product obtained by molding the high thermal conductive resin composition according to claim 1.