JP2011119292A - Light-emitting device (cob module) - Google Patents

Light-emitting device (cob module) Download PDF

Info

Publication number
JP2011119292A
JP2011119292A JP2009259515A JP2009259515A JP2011119292A JP 2011119292 A JP2011119292 A JP 2011119292A JP 2009259515 A JP2009259515 A JP 2009259515A JP 2009259515 A JP2009259515 A JP 2009259515A JP 2011119292 A JP2011119292 A JP 2011119292A
Authority
JP
Japan
Prior art keywords
light
emitting device
silicone resin
cob module
particulates
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2009259515A
Other languages
Japanese (ja)
Inventor
Shingo Kawakami
真吾 川上
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Astech Co Ltd
Original Assignee
Shin Etsu Astech Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Astech Co Ltd filed Critical Shin Etsu Astech Co Ltd
Priority to JP2009259515A priority Critical patent/JP2011119292A/en
Publication of JP2011119292A publication Critical patent/JP2011119292A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sealing part capable of diffusing and dissipating heat generated at emission in an LED with high efficiency, without reducing the originally aimed quantity of emission in a light-emitting device (COB module). <P>SOLUTION: Particulates having a higher heat-dissipation properties, a higher conductivity and a higher transparency than a silicone resin are added into a sealant made of the silicone resin. It is preferable that the particulates are made of glass, or the particulates consist of diamond or the particulates are made of glass and diamond. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、発光装置（ＣＯＢモジュール）に関し、特には、発光効率を高めた発光装置（ＣＯＢモジュール）に関する。   The present invention relates to a light emitting device (COB module), and more particularly, to a light emitting device (COB module) with improved luminous efficiency.

発光ダイオード（ＬＥＤ：Light Emitting Diode）は、表示装置（特許文献１参照）や発光装置（特許文献２参照）を始めとして、照明器具、ディスプレイ、液晶ディスプレイのバックライト光源などとして、広く利用されてきている。
ＬＥＤから光を取り出すには、ダイオード素子と、ダイオードに通電する導線とが必要であるが、発光した光を無駄にしないための反射材および光を減衰させることの少ない光透過材、更には所望の方向に指向させるための集光体（レンズ等）・取り出される光の色相を調節するための蛍光材等が用いられ、電気を光に変換するに際して発生する熱を伝導・放熱する方策を施すことも欠かすことができない。 2. Description of the Related Art Light emitting diodes (LEDs) have been widely used as display light sources (see Patent Document 1) and light emitting devices (see Patent Document 2), as well as lighting fixtures, displays, and backlight sources for liquid crystal displays. ing.
In order to extract light from an LED, a diode element and a conducting wire for energizing the diode are required. However, a reflecting material for preventing wasted light and a light transmitting material that does not attenuate the light, and further desired. Concentrators (lenses, etc.) for directing in the direction of light, fluorescent materials for adjusting the hue of the extracted light, etc. are used, and measures are taken to conduct and dissipate heat generated when converting electricity into light It is indispensable.

ＬＥＤを利用した発光装置（ＣＯＢモジュール）は、図１を用いて説明すれば、装置基板２と、発光体たるＬＥＤチップ４、導電路たる回路パターン５、リフレクタ６、封止材７とで基本的に構成されるのが一般的である。なお、８は、回路間等を接続するワイヤ、である。
封止材としては、アクリル系、メタクリル系、エポキシ系など多種類のものが利用されるが、シリコーン系樹脂も用いられる（特許文献３参照）。また、ウレタン系が用いられることもある。中でも、特に青色の透過性特性から、シリコーン系樹脂が最近では多用されている。
ところで、シリコーン系樹脂は、熱伝導性の面では余り望ましい材料とは言い難く、ＬＥＤにおける発光に際して発生する発熱のために、高出力とし難い難点がある。 A light emitting device (COB module) using LEDs is basically composed of a device substrate 2, an LED chip 4 that is a light emitter, a circuit pattern 5 that is a conductive path, a reflector 6, and a sealing material 7. It is common to be configured. Reference numeral 8 denotes a wire for connecting circuits and the like.
As the sealing material, various types such as acrylic, methacrylic, and epoxy are used, and silicone resins are also used (see Patent Document 3). A urethane system may also be used. Among these, silicone resins have recently been frequently used because of their blue transmission characteristics.
By the way, a silicone resin is not a very desirable material in terms of thermal conductivity, and has a drawback that it is difficult to achieve a high output due to heat generated during light emission in the LED.

特開平１０−２４２５２３号公報Japanese Patent Laid-Open No. 10-242523 特開２００９−１１１２７３号公報JP 2009-111273 A 特開２００９−１３５４８５号公報JP 2009-135485 A

本発明は、上記の問題を解決するもので、発光装置（ＣＯＢモジュール）本来の眼目である発光量を減殺することなく、ＬＥＤにおける発光に際して発生する熱を高効率に拡散・放熱し得る封止部を提供することを課題とする。   The present invention solves the above-mentioned problem, and seals that can diffuse and dissipate heat generated at the time of light emission in the LED with high efficiency without reducing the light emission amount that is the original eye of the light emitting device (COB module) It is an issue to provide a department.

本発明の発光装置（ＣＯＢモジュール）は、シリコーン樹脂からなる封止材中に、当該シリコーン樹脂に比して、放熱性が高く、伝導度が高く、透明度が同等又はそれ以上の微粒子を添加させたことを特徴とする。
前記微粒子がガラスであること、あるいは前記微粒子がダイヤモンドであること、また、前記微粒子がガラス及びダイヤモンドとからなることが好ましい。 The light-emitting device (COB module) of the present invention is made by adding fine particles having higher heat dissipation, higher conductivity, and equal or higher transparency than the silicone resin to the sealing material made of silicone resin. It is characterized by that.
Preferably, the fine particles are glass, the fine particles are diamond, and the fine particles are made of glass and diamond.

本発明によれば、シリコーン樹脂よりも放熱性が高く、熱伝導度が高く、透明度が高い微粒子を分散させたことにより、封止材中の光量伝導を減衰することなく伝熱・放熱することができ、高放光出量の発光装置（ＣＯＢモジュール）を実現することができる。   According to the present invention, heat dissipation and heat dissipation can be achieved without attenuating light quantity conduction in the sealing material by dispersing fine particles with higher heat dissipation, higher thermal conductivity, and higher transparency than silicone resin. Thus, a light emitting device (COB module) having a high light emission amount can be realized.

本発明の発光装置（ＣＯＢモジュール）の構造を示す説明図である。It is explanatory drawing which shows the structure of the light-emitting device (COB module) of this invention.

本発明は、封止材のベースをなすシリコーン樹脂の熱伝導よりも熱伝導性の高い微粒子を封止材中に添加させることによって熱の放散を図ることを基本とする。
以下に、添付図面を参照しながら、本発明を詳細に説明する。
本発明は、透明であるシリコーン樹脂を封止材とする発光装置（ＣＯＢモジュール）をベースとする。
前述のとおり、シリコーン樹脂は、熱伝導・熱放出の面で物足りないところがあり、もう一段の改善が図れれば、発光させるための電流をそれだけ増加させることができる。 The present invention is basically based on the purpose of dissipating heat by adding fine particles having higher thermal conductivity than that of the silicone resin that forms the base of the sealing material to the sealing material.
Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
The present invention is based on a light emitting device (COB module) using a transparent silicone resin as a sealing material.
As described above, the silicone resin is insufficient in terms of heat conduction and heat release, and if further improvement can be achieved, the current for light emission can be increased accordingly.

そのためには、シリコーン樹脂からなる封止材中に熱伝導・熱放出伝達の良好な材料を挿入することが考えられる。しかし、熱的な条件を満足しても、ＬＥＤから発光する光を効率的に外部に放出することができないのでは、何にもならない。したがって、熱の良導体であると同時に、光の良導体、すなわち、光に対して透明であることが望まれる。   For that purpose, it is conceivable to insert a material having good heat conduction and heat transfer into the sealing material made of silicone resin. However, even if the thermal condition is satisfied, there is nothing if the light emitted from the LED cannot be efficiently emitted to the outside. Therefore, it is desired that the heat good conductor and at the same time the light good conductor, that is, transparent to light.

ＬＥＤの周囲を囲繞する封止材には、ＬＥＤから発光される光の色調を調節するために、蛍光物体が混入される。その他、特許文献３に記載されるように、［１］光散乱剤として、［２］クラックの発生を防止する結合剤として、［３］粘度調整剤として、〔４〕封止剤部の収縮を低減するために、各種の無機粒子が混入されてきた。同文献では、無機粒子の例として、シリカ、チタン酸バリウム、酸化チタン、酸化ジルコニウム、酸化ニオブ、酸化アルミニウム、酸化セリウム、酸化イットリウムなどの無機酸化物粒子やダイヤモンド粒子が挙げられるが、目的に応じて他の物質を選択することもでき、これらに限定されるものではない、とされている。   In order to adjust the color tone of the light emitted from the LED, a fluorescent object is mixed in the sealing material surrounding the periphery of the LED. In addition, as described in Patent Document 3, [1] as a light scattering agent, [2] as a binder for preventing the occurrence of cracks, [3] as a viscosity modifier, [4] shrinkage of the sealant part In order to reduce this, various inorganic particles have been mixed. In this document, examples of inorganic particles include inorganic oxide particles such as silica, barium titanate, titanium oxide, zirconium oxide, niobium oxide, aluminum oxide, cerium oxide, yttrium oxide, and diamond particles. Other substances can also be selected and are not limited to these.

しかし、同文献においては、混入される無機粒子の具備すべき性能として、“透明性”の必要性が認識されていなかった。そのため、「ダイヤモンド粒子」は、単に“無機粒子”の一つとして単に例示されるだけで、それ以上の“検討・検証”はなされていない。
同文献を含めて、従来、「ダイヤモンド粒子」を“混入粒子”とした例は、人工ダイヤモンド含めて、“検討・検証”はなされていない。 However, in this document, the necessity of “transparency” has not been recognized as the performance of the inorganic particles to be mixed. Therefore, the “diamond particles” are merely exemplified as one of the “inorganic particles”, and no further “examination / verification” has been made.
Including the same literature, the “diamond particles” as “mixed particles” has not been “examined / verified” including artificial diamonds.

本発明は、この、混入される無機粒子の具備すべき性能として、“透明性”を導入したものである。
“透明性”としては、封止材として用いられるシリコーン樹脂と少なくとも同等程度であることが望ましく、同等以上とすることがより望ましい。
本発明では、封止材に混入される無機粒子として、従来［１］〜［４］として混入されていた無機粒子の少なくとも一部を代替するとして、ダイヤモンド粒子および／またはガラス粒子（図１における透明粒子９）が挙げられる。
その混入量としては、特に限定されない。また、その粒径も、特に限定されるものではないが、概ね、混入される蛍光物体の粒径とコンパラブルなものとすることができる。 In the present invention, “transparency” is introduced as the performance of the mixed inorganic particles.
The “transparency” is preferably at least equivalent to the silicone resin used as the sealing material, and more preferably equal to or higher than that.
In the present invention, diamond particles and / or glass particles (in FIG. 1) are used as the inorganic particles mixed in the sealing material, replacing at least part of the inorganic particles conventionally mixed as [1] to [4]. Transparent particles 9).
The mixing amount is not particularly limited. The particle size is not particularly limited, but can generally be compatible with the particle size of the fluorescent material to be mixed.

１：発光装置（ＣＯＢモジュール）
２：装置基板
３：素子基板
４：ＬＥＤチップ
５：（導電路たる）回路パターン
６：リフレクタ
７：封止材
８：ワイヤ
９：透明粒子 1: Light emitting device (COB module)
2: Device substrate 3: Element substrate 4: LED chip 5: (conductive path) circuit pattern 6: reflector 7: sealing material 8: wire 9: transparent particles

Claims (4)

シリコーン樹脂からなる封止材中に、当該シリコーン樹脂に比して、放熱性が高く、熱伝導度が高く、透明度が同等又はそれ以上の微粒子を添加させたことを特徴とする発光装置（ＣＯＢモジュール）。   A light emitting device (COB) characterized in that fine particles having higher heat dissipation, higher thermal conductivity, and equal or higher transparency than a silicone resin are added to a sealing material made of silicone resin. module). 前記微粒子がガラスである請求項１に記載の発光装置（ＣＯＢモジュール）。   The light emitting device (COB module) according to claim 1, wherein the fine particles are glass. 前記微粒子がダイヤモンドである請求項１に記載の発光装置（ＣＯＢモジュール）。   The light emitting device (COB module) according to claim 1, wherein the fine particles are diamond. 前記微粒子がガラス及びダイヤモンドとからなる請求項１に記載の発光装置（ＣＯＢモジュール）。   The light emitting device (COB module) according to claim 1, wherein the fine particles are made of glass and diamond.
JP2009259515A 2009-11-06 2009-11-13 Light-emitting device (cob module) Pending JP2011119292A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009259515A JP2011119292A (en) 2009-11-06 2009-11-13 Light-emitting device (cob module)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009254747 2009-11-06
JP2009254747 2009-11-06
JP2009259515A JP2011119292A (en) 2009-11-06 2009-11-13 Light-emitting device (cob module)

Publications (1)

Publication Number Publication Date
JP2011119292A true JP2011119292A (en) 2011-06-16

Family

ID=44284325

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009259515A Pending JP2011119292A (en) 2009-11-06 2009-11-13 Light-emitting device (cob module)

Country Status (1)

Country Link
JP (1) JP2011119292A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012124587A1 (en) * 2011-03-16 2012-09-20 シャープ株式会社 Wavelength conversion member, production method for same, light-emitting device, illumination device, and headlight
JP2013004480A (en) * 2011-06-21 2013-01-07 Sharp Corp Light emitting device, luminaire and vehicular headlamp
JP2013030600A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Heat generation device
JP2013030597A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Heat generation device
WO2013073181A1 (en) * 2011-11-15 2013-05-23 パナソニック株式会社 Light-emitting module and lamp using same
US9202996B2 (en) 2012-11-30 2015-12-01 Corning Incorporated LED lighting devices with quantum dot glass containment plates
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10158057B2 (en) 2010-10-28 2018-12-18 Corning Incorporated LED lighting devices
WO2012124587A1 (en) * 2011-03-16 2012-09-20 シャープ株式会社 Wavelength conversion member, production method for same, light-emitting device, illumination device, and headlight
JP2013004480A (en) * 2011-06-21 2013-01-07 Sharp Corp Light emitting device, luminaire and vehicular headlamp
JP2013030600A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Heat generation device
JP2013030597A (en) * 2011-07-28 2013-02-07 Sumitomo Bakelite Co Ltd Heat generation device
WO2013073181A1 (en) * 2011-11-15 2013-05-23 パナソニック株式会社 Light-emitting module and lamp using same
CN103339751A (en) * 2011-11-15 2013-10-02 松下电器产业株式会社 Light-emitting module and lamp using same
JPWO2013073181A1 (en) * 2011-11-15 2015-04-02 パナソニックＩｐマネジメント株式会社 Light emitting module and lamp using the same
EP2660887A4 (en) * 2011-11-15 2015-06-03 Panasonic Ip Man Co Ltd Light-emitting module and lamp using same
US9423118B2 (en) 2011-11-15 2016-08-23 Panasonic Intellectual Property Management Co., Ltd. Light-emitting module and lamp using same
CN103339751B (en) * 2011-11-15 2016-12-14 松下知识产权经营株式会社 Light emitting module and use the lamp of this light emitting module
US9202996B2 (en) 2012-11-30 2015-12-01 Corning Incorporated LED lighting devices with quantum dot glass containment plates

Similar Documents

Publication Publication Date Title
JP5733743B2 (en) Optical semiconductor device
EP3340297A1 (en) Light emitting device
JP5415622B2 (en) Light emitting diode device with wide angular distribution
TWI527891B (en) Phosphor layer having enhanced thermal conduction and light sources utilizing the phosphor layer
JP2011119292A (en) Light-emitting device (cob module)
TWI332560B (en) High power led lamp with heat dissipation enhancement
US8847481B2 (en) Lighting device comprising photoluminescent plate
JP2012054242A (en) Lighting device
JP2007036232A (en) Device for emitting output light for photoluminescence material using multiple optical sources, and its method
JP2007081234A (en) Lighting system
BR112015026316B1 (en) LIGHT EMITTING DEVICE
JP2002280617A (en) Illuminating device
CN101619822A (en) Lighting device
JP2007018936A (en) Light source device
JP2014146661A (en) Light emitting module, illumination device and luminaire
KR20140040778A (en) A light emitting module comprising a thermal conductor, a lamp and a luminaire
JP2017215568A (en) Wavelength conversion element, light source device, and image projection device
JP2006049026A (en) Led illumination light source
TWI528083B (en) Backlight module
JP2006310568A (en) Light emitting device
JP3220566U (en) Shell integrated light emitting diode assembly, shell integrated light emitting diode lamp
US20200028047A1 (en) Light emitting diode array package structure with high thermal conductivity
TWI270631B (en) High power LED lamp
JP2016072263A (en) Light-emitting module and illumination apparatus
JP2015133455A (en) Light-emitting device, illumination light source, and luminaire