JP2011118064A - Method of manufacturing moving mechanism - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a moving mechanism that facilitates suppressing failures caused by entry of foreign matter. <P>SOLUTION: The moving mechanism has a reference part and a moving object part, at least one of which has an inner cavity, and the moving object part being supported by a support disposed in the reference part, and the moving object part being moved in a distance within a predetermined range on the basis of the reference part. The moving mechanism is manufactured by sequentially performing the following steps (1) to (3): (1) a step of forming a laminating member in which a plurality of unit parts each including the reference part and the moving object part are arrayed at a predetermined rule, (2) a step of cutting the laminating member while a suppression structure to suppress the passage of a substance from the outside to the inner cavity is formed between the reference part and the moving object part, then, separating the laminating member for each of the units, and (3) a step of making the moving object part movable in the distance within the predetermined range on the basis of the reference part, in accordance with the status change of the suppression structure. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a moving mechanism.

  In recent years, it has become common for camera modules to be mounted on small electronic devices such as mobile phones. Further, the camera module is required to be further reduced in size and weight.

  Such a camera module includes a lens, a lens holder that supports the lens, an infrared (IR) cut filter, a substrate, and an imaging device, and has various shapes including a housing that supports these members. Consists of parts. In order to further reduce the size of the camera module, it is conceivable to reduce the number of the above parts.

  However, if a large number of parts are miniaturized, it becomes difficult to manufacture a camera module by accurately combining the many parts. Furthermore, if the camera module is provided with functions such as autofocus (AF) and zoom, the number of parts increases, the configuration becomes complicated, and the combination becomes difficult.

  Under such circumstances, recently, a substrate, a semiconductor sheet on which a large number of imaging elements are formed, and a lens array sheet on which a large number of imaging lenses are formed are bonded via a resin layer to form a wafer-like laminated member. And a technique for completing individual camera modules by dicing the laminated member (for example, Patent Documents 1 and 2).

  According to this technique, it is also possible to manufacture several hundred camera modules from a single wafer-like laminated member. The technique also has good matching with microfabrication such as MEMS (Micro Electro Mechanical Systems). For this reason, it is considered that the camera module greatly contributes to reduction in size, thickness, and cost.

Japanese Patent Laid-Open No. 2004-200965 JP 2007-12995 A

  However, in the techniques of Patent Documents 1 and 2, since a plurality of wafer-like sheets are stacked, it is very difficult to arrange conventionally known actuators such as a voice coil motor. It is difficult to give the module.

  By the way, an actuator using a drive element having a so-called unimorph shape (using PZT, SMA, bimetal, etc.) is known. Then, it is conceivable to apply functions such as AF and zoom to the camera module by applying a wafer-like sheet on which a large number of the actuators are formed to the techniques of Patent Documents 1 and 2 above. However, it is difficult to support the lens unit with other members while keeping the lens unit movable.

  As a method for solving such a problem, (i) after completing each camera module by dicing a wafer-like laminated member, the portion that temporarily supports the lens portion is cut using a laser or the like. Method, and (ii) each lens unit separated by dicing a wafer-like member on which a large number of lens units are arranged is divided into a layer having an actuator function (actuator layer) or parallel A method in which a layer having a spring function (parallel spring layer) or the like is laminated and bonded to the parallel spring layer is conceivable.

  However, in the methods (i) and (ii) described above, the manufacturing process becomes complicated and the manufacturing cost increases.

  In addition, (iii) a wafer-like sheet in which a large number of lens layers are arranged is included in a plurality of wafer-like sheets constituting the laminated member in a form that is not bonded to other sheets, and dicing of the laminated member is performed. A method is also conceivable in which a camera module is manufactured in which the lens unit is supported so as to be movable with respect to the fixed unit.

  However, in the method of (iii) above, for example, a gap is generated between the moving part and the fixed part, and through the gap, cooling water or cutting powder during dicing enters the camera module, Adhering to the imaging sensor may adversely affect the captured image, and may impede the operation of the drive unit configured by an actuator, a parallel spring, or the like.

  These problems are generally common when a moving mechanism that moves a plurality of various objects is manufactured by dicing the laminated member.

  The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a moving mechanism that can easily suppress the occurrence of problems caused by the entry of foreign matter.

  In order to solve the above-described problem, in the method of manufacturing the moving mechanism according to the first aspect, at least one of the reference portion and the movement target portion has an internal space, and the movement target portion is provided in the reference portion. And a moving mechanism manufacturing method in which the moving target part moves at a distance in a predetermined range with respect to the reference part, the reference part and the moving target part being included respectively. Forming a laminated member in which a plurality of unit parts are arranged according to a predetermined rule, and a suppression structure for suppressing the passage of an object from the outside to the internal space is formed between the reference part and the movement target part A cutting step of separating the laminated member into the unit portions by cutting the laminated member in a state where the laminated structure is cut, and after the cutting step, the form of the restraining structure is changed to Moving object portion and a form change step of a state movable in the length of the predetermined range range based on the reference portion.

  Moreover, the manufacturing method of the moving mechanism which concerns on a 2nd aspect is a manufacturing method of the moving mechanism which concerns on a 1st aspect, Comprising: The said suppression structure adhere | attaches the said reference | standard part and the said moving object part. Including a structure to be formed, and in the form changing step, by releasing at least one of heating and irradiation of light having a wavelength in a predetermined value range, the reference portion and the movement target portion are bonded. The shape of the suppression structure is changed.

  Moreover, the manufacturing method of the moving mechanism which concerns on a 3rd aspect is a manufacturing method of the moving mechanism which concerns on a 2nd aspect, Comprising: The said heating is an electrical connection of the external wiring and the wiring contained in the said moving mechanism. Includes heating during soldering to make connections.

  Moreover, the manufacturing method of the moving mechanism which concerns on a 4th aspect is a manufacturing method of the moving mechanism which concerns on any one 1st to 3rd aspect, Comprising: The said suppression structure is the said reference | standard part as said moving object part. Or a structure formed by fitting the movement target part to the reference part, and in the form changing step, between the reference part and the movement target part. The form of the suppression structure is changed by releasing the fitted state.

  Moreover, the manufacturing method of the moving mechanism which concerns on a 5th aspect is a manufacturing method of the moving mechanism which concerns on any one 1st to 4th aspect, Comprising: The said suppression structure is the said movement of the said reference | standard part. While the convex portion having flexibility provided on at least one of the first facing surface facing the target portion and the second facing surface facing the reference portion among the moving target portions is elastically deformed, Including a structure formed by pressing the movement target portion relative to the reference portion, and releasing the force of pressing the movement target portion relative to the reference portion in the form changing step. Thus, the form of the suppression structure is changed.

  Moreover, the manufacturing method of the moving mechanism which concerns on a 6th aspect is a manufacturing method of the moving mechanism which concerns on any one 1st-5th aspect, Comprising: The said suppression structure is the said movement of the said reference | standard part. A portion having water repellency is formed on at least one of the first facing surface facing the target portion and the second facing surface facing the reference portion of the moving target portion, and the first facing surface And the second facing surface are made close to or in contact with each other, and in the form changing step, the first facing surface and the second facing surface are separated from each other than in the cutting step. By doing so, the form of the suppression structure is changed.

  Moreover, the manufacturing method of the moving mechanism which concerns on a 7th aspect is a manufacturing method of the moving mechanism which concerns on any one 1st-6th aspect, Comprising: The said suppression structure is the said reference | standard part and the said moving object part. And connecting the reference portion and the movement target portion by the connection portion by a force that separates the reference portion and the movement target portion in the form changing step. By canceling, the form of the suppression structure is changed.

  Moreover, the manufacturing method of the moving mechanism which concerns on an 8th aspect is a manufacturing method of the moving mechanism which concerns on any one 1st to 6th aspect, Comprising: The said suppression structure is the said reference | standard part and the said moving object part. In the form changing step, the connecting part is plastically deformed by a force that separates the reference part and the movement target part in the form changing step. To change.

  A moving mechanism manufacturing method according to a ninth aspect is the manufacturing method of the moving mechanism according to any one of the first to eighth aspects, wherein the reference unit includes an imaging device and the moving object The optical system that guides light from the subject to the image sensor is included in the part, or the optical system is included in the reference part, and the image sensor is included in the movement target part.

  Even with the manufacturing method of the moving mechanism according to any one of the first to ninth aspects, the entry of foreign matter into the internal space in the cutting process is suppressed, so that the occurrence of defects due to the entry of foreign matter is easily suppressed. The

  According to the moving mechanism manufacturing method according to the second aspect, the adhesion state suppresses the entry of foreign matter into the internal space in the cutting process, and the adhesion state is released using heat or light. Occurrence of defects due to the above can be easily suppressed.

  According to the method of manufacturing the moving mechanism according to the third aspect, since the bonded state is released in the process for achieving different purposes, the defect caused by the intrusion of foreign matter without causing an increase in manufacturing cost. Is easily suppressed.

  According to the method for manufacturing the moving mechanism according to the fourth aspect, it is only necessary to release the fitted state between the reference portion and the moving target portion before the moving mechanism is mounted on the apparatus. Occurrence of defects due to the above can be easily suppressed.

  According to the manufacturing method of the movement mechanism which concerns on a 5th aspect, since the form in which a movement object part is relatively pressed with respect to a reference | standard part is cancelled | released, and the form of the suppression structure changes, the form of the suppression structure Can be easily changed.

  According to the method for manufacturing the moving mechanism according to the sixth aspect, it is possible to suppress the occurrence of defects due to the entry of foreign matter or the like with a very simple configuration.

  Also by the manufacturing method of the moving mechanism which concerns on either the 7th and 8th aspect, generation | occurrence | production of the malfunction resulting from the penetration | invasion of a foreign material, etc. is suppressed reliably and easily by using a film-shaped connection part.

  According to the moving mechanism manufacturing method according to the ninth aspect, in the manufacturing of the moving mechanism according to the imaging apparatus, the occurrence of defects due to the entry of foreign matter or the like is easily suppressed.

It is a schematic diagram which shows schematic structure of the mobile telephone carrying the camera module which concerns on 1st Embodiment. It is a cross-sectional schematic diagram which paid its attention to the 1st housing | casing of a mobile telephone. It is a side surface schematic diagram which shows the structure of a camera module. It is a disassembled perspective view which shows the structure of the moving mechanism of a camera module. It is an upper surface schematic diagram which shows the structure of a camera module. It is a cross-sectional schematic diagram which shows the structure of a camera module. It is a cross-sectional schematic diagram which shows the structure of a camera module. It is a figure which shows the structure of a lens group typically. It is an upper surface schematic diagram which shows the structure of a lens group. It is a bottom view which shows the structure of a lens group. It is a schematic diagram which shows the manufacturing method of a 1st lens structure layer. It is an upper surface schematic diagram which shows the structure of a connection plate. It is a cross-sectional schematic diagram which shows the structure of a connection plate. It is a cross-sectional schematic diagram which shows the structure of a connection plate. It is an upper surface schematic diagram which shows the structure of a temporarily fixed layer. It is an upper surface schematic diagram which shows the structure of a 1st parallel spring layer. It is an upper surface schematic diagram which shows the structure of a space | interval board layer. It is an upper surface schematic diagram which shows the structure of a 2nd parallel spring layer. It is an upper surface schematic diagram which shows the structure of a spacer layer. It is an upper surface schematic diagram which shows the structure of an actuator layer. It is an upper surface schematic diagram which shows the structure of a cover glass layer. It is a flowchart which shows the flow of the manufacturing process of a camera module. It is a figure which shows typically the joining process of a some sheet | seat. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a figure which shows typically the joint process of several sheet | seats paying attention to the part corresponding to one camera module. It is a schematic diagram for demonstrating the dicing process which cut | disconnects a laminated member. It is a figure for demonstrating the cancellation | release process of an adhesion state, and operation | movement of a camera module. It is a figure for demonstrating the cancellation | release process of an adhesion state, and operation | movement of a camera module. It is a cross-sectional schematic diagram which shows the structure of the camera module which concerns on 2nd Embodiment. It is a lower surface schematic diagram which shows the structure of the connection plate which concerns on 2nd Embodiment. It is a cross-sectional schematic diagram which shows the structure of the connection plate which concerns on 2nd Embodiment. It is an upper surface schematic diagram which shows the structure of the temporarily fixed layer which concerns on 2nd Embodiment. It is a cross-sectional schematic diagram which shows the structure of the temporarily fixed layer which concerns on 2nd Embodiment. It is a schematic diagram which shows the fitting state of a connection plate and a temporary fixing layer. It is a schematic diagram which shows the state by which the fitting state of the connection board and the temporary fixing layer was cancelled | released. It is a cross-sectional schematic diagram which shows the structure of the camera module which concerns on a 1st modification. It is a lower surface schematic diagram which shows the structure of the connection plate which concerns on a 1st modification. It is a cross-sectional schematic diagram which shows the structure of the connection plate which concerns on a 1st modification. It is an upper surface schematic diagram which shows the structure of the lower valve layer which concerns on a 1st modification. It is a cross-sectional schematic diagram which shows the structure of the lower valve layer which concerns on a 1st modification. It is a cross-sectional schematic diagram which shows the state by which the connection plate and the lower valve layer were pressed. It is a side surface schematic diagram which shows the state by which the connection plate and the lower valve layer were pressed. It is a schematic diagram which shows the state by which the pressing state of the connection plate and the lower valve layer was cancelled | released. It is a cross-sectional schematic diagram which shows the structure of the camera module which concerns on a 2nd modification. It is a cross-sectional schematic diagram which shows the structure of the membranous connection valve layer which concerns on a 2nd modification. It is a side surface schematic diagram which shows the structure of the membranous connection valve layer which concerns on a 2nd modification. It is an upper surface schematic diagram which shows the structure of the membranous connection valve layer sheet which concerns on a 2nd modification. It is a schematic diagram which shows the fracture | rupture process of the membranous connection valve layer which concerns on a 2nd modification. It is a cross-sectional schematic diagram which shows the structure of the camera module which concerns on a 3rd modification. It is a schematic diagram which shows the expansion | extension process of the membranous connection valve layer which concerns on a 3rd modification. It is a schematic diagram which shows the state after plastic deformation of the membranous connection valve layer which concerns on a 3rd modification. It is a cross-sectional schematic diagram which shows the structure of the camera module which concerns on a 4th modification. It is a cross-sectional schematic diagram which shows the suppression structure which concerns on a 4th modification. It is a cross-sectional schematic diagram which shows the state by which the suppression structure which concerns on a 4th modification was cancelled | released. It is a cross-sectional schematic diagram which shows the structure of the camera module which concerns on a 5th modification. It is a cross-sectional schematic diagram which shows the suppression structure which concerns on a 5th modification. It is a cross-sectional schematic diagram which shows the state by which the suppression structure which concerns on a 5th modification was cancelled | released. It is a cross-sectional schematic diagram which shows the structure of the camera module which concerns on a 6th modification. It is a schematic diagram which shows the state by which the connection plate and the temporary fixing layer were fitted. It is a schematic diagram which shows the state by which the fitting state of the connection board and the temporary fixing layer was cancelled | released.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

<(1) First Embodiment>
<(1-1) Schematic configuration of electronic equipment equipped with imaging device>
FIG. 1 is a schematic diagram illustrating a schematic configuration of a mobile phone 100 that is an example of an electronic device in which a camera module 500 according to an embodiment is mounted. In FIG. 1 and other drawings, three axes XYZ orthogonal to each other are appropriately attached in order to clarify the orientation relation.

  As shown in FIG. 1, the mobile phone 100 is configured as a foldable mobile phone, and includes a first housing 200, a second housing 300, and a hinge part 400. Each of the first casing 200 and the second casing 300 has a plate-like substantially rectangular parallelepiped shape and serves as a casing for storing various electronic members.

  Specifically, the first casing 200 includes a camera module 500 and a display, and the second casing 300 includes a control unit that electrically controls the mobile phone 100 and an operation member such as a button. Have. In addition, the hinge part 400 connects the 1st housing | casing 200 and the 2nd housing | casing 300 so that rotation is possible. For this reason, the mobile phone 100 can be folded.

  In addition, the current supply driver 600, the electric resistance detection unit 700, and the contrast detection unit 800 are mounted on the first casing 200. The current supply driver 600 controls supply of current to the heater unit of the actuator layer 20 (FIG. 3) constituting the camera module 500. The electrical resistance detector 700 detects electrical resistance in the heater unit. The contrast detector 800 detects the contrast of the image signal obtained by the image sensor IS (FIG. 6) of the image sensor layer PB (FIG. 3).

  In addition, a focusing control unit 310 is mounted on the second casing 300. The focus control unit 310 controls the amount of current supplied to the conductive layer via the current supply driver 600 in accordance with the input of signals from the electrical resistance detection unit 700 and the contrast detection unit 800, and thereby the camera module 500. Auto focus (AF) control is performed to adjust the in-focus state.

  FIG. 2 is a schematic cross-sectional view focusing on the first casing 200 of the mobile phone 100. As shown in FIG. 1 and FIG. 2, the camera module 500 is a small imaging device, so-called micro camera unit, having an XY cross-section of about 5 mm square and a thickness (depth in the Z direction) of about several mm. (MCU).

  Hereinafter, the configuration of the camera module 500, the manufacturing method of the camera module 500, and the operation of the camera module 500 will be sequentially described.

<(1-2) Camera module configuration>
The camera module 500 is manufactured by, for example, a so-called micromachining technique used to integrate fine elements. The technique includes, for example, MEMS (Micro Electro Mechanical Systems) as a kind of semiconductor processing technology.

<(1-2-1) Schematic configuration of camera module>
FIG. 3 is a schematic side view showing the configuration of the camera module 500.

  As shown in FIG. 3, the image sensor layer PB, the cover glass layer 10, the actuator layer 20, the spacer layer 30, the second parallel spring layer 40, the spacing plate layer 50, the first parallel spring layer 60, the temporarily fixed layer 70, Nine layers including the lens group layer 80 are laminated in this order. Here, each of the layers PB, 10 to 80 has a substantially identical rectangular shape (here, a square having a side of about 5 mm) on the surface in the ± Z direction.

  In the camera module 500, except for the temporary fixing layer 70 and the first parallel spring layer 60, the two layers stacked adjacent to each other are joined by resin. As will be described later, the temporary fixing layer 70 and the lens group layer 80 are bonded to each other up to the middle of the manufacturing process of the camera module 500.

  Further, the cover glass layer 10, the actuator layer 20, the spacer layer 30, the second parallel spring layer 40, the spacing plate layer 50, the first parallel spring layer 60, the temporary fixing layer 70, and the lens group layer 80 are 8 layers, A moving mechanism WB for moving the lens group layer 80 is configured.

  In the camera module 500, the actuator layer 20 applies a driving force to the lens group layer 80 as a portion to be moved (movement target portion), and the lens group layer 80 is in a direction along the optical axis PL. (Here, ± Z direction). By this operation, the distance between the image sensor IS (FIG. 6) of the image sensor layer PB and the lens group layer 80 is changed, and AF control in the camera module 500 is realized.

  Here, the configuration of the camera module 500 will be specifically described.

  4 is an exploded perspective view showing the configuration of the moving mechanism WB of the camera module 500, and FIG. 5 is a schematic top view showing the configuration of the camera module when the camera module 500 is viewed from the upper surface side (here, + Z side). It is. 6 is a cross-sectional view of the camera module 500 as seen in the direction of the arrow at the cutting plane VI-VI of the camera module 500, and FIG. 7 is a view of the camera module 500 as seen in the direction of the arrow at the cutting plane VII-VII. 2 is a cross-sectional view of the camera module 500. FIG.

  As shown in FIGS. 4 to 7, the lens group layer 80 includes a lens group 82 and a connecting plate 81 provided on the back side (−Z side) of the lens group 82. In the connecting plate 81, protrusions 81Ta and 81Tb extending in the −Z direction are provided in the vicinity of the inner edges of the two opposing corners of the connecting plate 81, and the other two corners of the connecting plate 81 facing each other. Protrusions 81Tc and 81Td extending in the −Z direction are provided in the vicinity of the inner edge of the part. The two protrusions 81Ta and 81Tb are extended over a longer distance along the Z axis than the other two protrusions 81Tc and 81Td.

  Specifically, as shown in FIG. 6, the two protrusions 81Ta and 81Tb extend to the vicinity of the spacer layer 30, and the tip ends of the two protrusions 81Ta and 81Tb are connected to the movable part 20a and the actuator layer 20 respectively. 20b (FIG. 20) is arranged with a small gap with respect to the vicinity of the tip (free end). Of the two projecting portions 81Ta and 81Tb, a portion slightly on the + Z side from the tip end portion is bonded to the elastic portion 41 (FIG. 18) of the second parallel spring layer 40 by the adhesive BD. For this reason, the lens group layer 80 is supported by the elastic part 41 as a support part via the connecting plate 81.

  Further, as shown in FIG. 7, the two protrusions 81Tc and 81Td are extended to the vicinity of the first parallel spring layer 60, and the tip ends of the two protrusions 81Tc and 81Td and the vicinity thereof are the first Each of the parallel spring layers 60 is bonded to the elastic portion 61 (FIG. 16) with an adhesive BD. Therefore, the lens group layer 80 is supported by the elastic part 61 as a support part via the connecting plate 81.

  In such a moving mechanism WB, the movable portions 20a and 20b are deformed, so that the vicinity of the distal end portions (free ends) of the movable portions 20a and 20b comes into contact with the distal end portions of the two protruding portions 81Ta and 81Tb. A force is applied to the lens group layer 80 in the + Z direction via the two protrusions 81Ta and 81Tb.

  The cover glass layer 10, the frame 20 f (FIG. 20) of the actuator layer 20, the spacer layer 30, the frame 40 f (FIG. 18) of the second parallel spring layer 40, the spacing plate layer 50, and the first parallel spring layer 60. The frame 60f (FIG. 16) and the temporary fixing layer 70 serve as a fixing portion as a reference portion (reference portion) fixed to the first housing 200, and a lens group is provided with respect to the fixing portion. The layer 80 moves relatively.

  That is, in the moving mechanism WB, the lens group layer 80 supported by the elastic portions 41 and 61 provided in the first and second parallel spring layers 40 and 60 respectively moves relative to the fixed portion. According to this moving mechanism, the lens group layer 80 is movable at a distance in a predetermined range with respect to the fixed portion. In other words, the separation distance between the lens group layer 80 and the image sensor IS can be changed within a predetermined range. Note that when the lens group layer 80 moves relative to the fixed portion, the elastic portions 41 and 61 undergo substantially the same deformation, so that the optical axis PL of the lens group layer 80 does not tilt.

  The fixing portion has a space (internal space) formed by being surrounded by the cover glass layer 10, the frame bodies 20 f, 40 f, 60 f, the spacer layer 30, the spacing plate layer 50, and the temporary fixing layer 70. In the internal space, there are elastic portions 41 and 61 and movable portions 20a and 20b for realizing highly accurate movement of the lens group layer 80 of the moving mechanism WB, and an optical path from the subject to the image sensor IS. Be placed.

<(1-2-2) Configuration of each functional layer>
<(1-2-2-1) Lens group layer>
The lens group layer 80 is manufactured in the form of a wafer-like sheet (lens group layer sheet) U80 (FIG. 23) in which a plurality of lens group layers 80 are arranged in a matrix according to a predetermined rule. The lens group layer 80 is configured by superposing at least two optical lenses. The number of optical lenses constituting the lens group layer 80 is appropriately increased or decreased according to the number of effective pixels of the image sensor IS, but the lens group layer 80 according to the present embodiment has two optical lenses superimposed. It has the structure made.

  FIG. 8 is a schematic cross-sectional view showing a configuration example of the lens group 82 included in the lens group layer 80. FIG. 9 is a schematic top view illustrating a configuration example of the lens group 82. FIG. 10 is a schematic back view illustrating a configuration example of the lens group 82.

  As shown in FIGS. 8 to 10, in the lens group 82, a first lens constituent layer LY1 having an optical lens G1 and a second lens constituent layer LY2 having an optical lens G2 are laminated via a spacer layer RB. Configured.

  The first lens component layer LY1 is manufactured in the form of a wafer-like sheet (first lens component layer sheet) in which a plurality of the first lens component layers LY1 are arranged in a matrix according to a predetermined rule.

  The second lens component layer LY2 is manufactured in the form of a wafer-like sheet (second lens component layer sheet) in which a plurality of the second lens component layers LY2 are arranged in a matrix according to a predetermined rule.

  The spacer layer RB is an annular member that is formed of resin or the like and has a rectangular outer edge and inner edge. The spacer layer RB is manufactured in the form of a wafer-like sheet (spacer layer sheet) in which a plurality of spacer layers RB are arranged in a matrix according to a predetermined rule. In other words, the spacer layer sheet has a form in which rectangular hollow portions penetrating in the plate-like resin are arranged in a matrix according to a predetermined rule.

  The first and second lens component layer sheets are manufactured by a similar method. Therefore, here, a manufacturing method of the first lens constituent layer LY1 will be described as an example.

  FIG. 11 is a schematic diagram showing a manufacturing method of the first lens component layer LY1, that is, the first lens component layer sheet, and the following steps (i) to (iv) are sequentially performed, whereby the first lens component layer LY1 is manufactured. A sheet is produced.

  (i) A wafer-shaped substrate 82BS is prepared. Examples of the material of the substrate 82BS include glass materials such as Tempax (registered trademark) and resins such as PMMA.

  (ii) a resin mold 82CA in which dents corresponding to the shape of the upper half (lens upper part GP1) of the optical lens G1 are arranged in a matrix on the lower surface according to a predetermined rule, and the lower half of the optical lens G1 (lens lower part GP2). A resin mold 82CB is prepared in which dents corresponding to the shape are arranged in a matrix on the upper surface in accordance with a predetermined rule. The resin molds 82CA and 82CB are formed of a transparent resin or the like, but may be glass glass molds.

  (iii) A highly transparent acrylic or epoxy ultraviolet (UV) curable resin is applied to each of the upper surface and the lower surface of the substrate 82BS, the resin mold 82CA is pressed from above with a predetermined pressure, and the resin mold from below. 82CB is pressed at a predetermined pressure. Specifically, as shown in FIG. 11, the substrate 82BS is sandwiched between the resin molds 82CA and 82CB from above and below. At this time, the shapes of the lens upper part GP1 and the lens lower part GP2 are respectively formed.

  (iv) By irradiating with ultraviolet rays, the UV curable resin is cured, the lens upper part GP1 and the lens lower part GP2 are formed, and the first lens component layer sheet is formed.

  The spacer layer sheet is formed by molding using a resin, punching a plate-shaped resin, or the like.

  FIG. 12 is a schematic top view illustrating a configuration example of the connecting plate 81. 13 is a cross-sectional view of the connecting plate 81 as seen in the direction of the arrow at the cut surface XIII-XIII of the connecting plate 81. FIG. 14 is a view of the connecting plate 81 as seen in the direction of the arrow along the cut surface XIV-XIV. FIG.

  The connecting plate 81 includes a frame body 81f, projecting portions 81a to 81d, and projecting portions 81Ta to 81Td.

  The frame 81f is a rectangular annular plate-like portion that forms the hollow portion 81h. The protruding portions 81a to 81d are plate-like portions that are similarly protruded toward the hollow portion 81h side at the four corners of the frame 81f. Further, the protrusions 81Ta to 81Td are provided at the tips of the protrusions 81a to 81d, respectively.

  Specifically, a pair of protrusions 81Ta and 81Tb having the same shape are provided in the vicinity of two opposing corners located on one diagonal line of the connecting plate 81. In addition, a pair of protrusions 81Tc and 81Td having the same shape are provided in the vicinity of two opposing corners located on the other diagonal line of the connecting plate 81.

  Further, the protrusions 81Ta and 81Tb extend over a longer distance along the Z direction than the protrusions 81Tc and 81Td. Then, as shown in FIG. 6, the two protrusions 81Ta and 81Tb are joined to the elastic part 41 of the second parallel spring layer 40, and as shown in FIG. The portions 81Tc and 81Td are joined to the elastic portion 61 of the first parallel spring layer 60.

  Further, the tip portions of the two projecting portions 81Ta and 81Tb protrude through the gap portion of the elastic portion 41 of the second parallel spring 40, and the tip portions (free ends) of the movable portions 20a and 20b constituting the actuator layer 20 ) It extends to the vicinity.

  The connecting plate 81 having the above configuration is manufactured in the form of a wafer-like sheet (connecting plate sheet) in which a plurality of connecting plates 81 are arranged in a matrix according to a predetermined rule. The connecting plate sheet is manufactured, for example, by pressing a stainless steel metal plate. In addition, each protrusion part 81Ta-81Td is formed by a bending process, for example.

  The first and second lens component layer sheets, the spacer layer sheet, and the connecting plate sheet are provided with alignment marks (alignment marks) at two or more predetermined positions.

  The spacer layer sheet is laminated so as to be sandwiched between the first lens constituent layer sheet and the second lens constituent layer sheet, and the connecting plate sheet is further laminated. Thereby, the lens group layer sheet U80 (FIG. 23) is formed.

  Specifically, for the first lens component layer sheet, the spacer layer sheet, the second lens component layer sheet, and the connecting plate sheet, a mask aligner or the like is used, and each alignment mark is used as a reference. They are aligned and joined together.

  As a bonding method according to each sheet, there is a method in which a cured layer (UV cured layer) made of a UV curable resin is provided on the upper and lower surfaces of the spacer layer RB and the upper surface of the connecting plate 81 and bonded by exposure to ultraviolet rays. Adopted.

  Alternatively, a method (surface activated bonding method) or the like in which each surface to be bonded is irradiated with plasma of an inert gas and the surfaces are bonded together in an activated state (surface activated bonding method) may be employed.

  By such joining, a sheet (lens group layer sheet) U80 in which the first lens constituent layer sheet, the spacer layer sheet, the second lens constituent layer sheet, and the connecting plate sheet are laminated in this order is formed.

  When forming a diaphragm in the camera module 500, a method of forming a thin film of a light shielding material on the second lens constituent layer LY2 including the optical lens G2 using a shadow mask is conceivable. Further, a resin diaphragm layer or the like colored separately in black may be added to the lens group layer 80.

<(1-2-2-2) Temporary Fixed Layer>
FIG. 15 is a schematic top view illustrating a configuration example of the temporarily fixed layer 70.

  The temporary fixing layer 70 is an annular member having a rectangular outer edge and inner edge. The adhesive force on the upper surface side (+ Z side) is reduced by heating, and the adhesive force on the lower surface side (−Z side) is heated. Nevertheless, it is constructed using tape that is hardly reduced. In addition, as a tape whose adhesive force decreases in response to heating, for example, Riva Alpha (registered trademark) manufactured by Nitto Denko Corporation may be used.

  Note that the back surface (the surface on the −Z side) of the temporarily fixed layer 70 is bonded to the frame body 60f (FIG. 16) of the first parallel spring layer 60. Further, the adhesion between the surface of the temporarily fixed layer 70 (the surface on the + Z side) and the back surface of the lens group layer 80 (the surface on the −Z side) has already been released.

  The temporarily fixed layer 70 is manufactured in the form of a wafer-like sheet (temporarily fixed layer sheet) U70 (FIG. 23) in which a plurality of temporarily fixed layers 70 are arranged in a matrix according to a predetermined rule. In other words, the temporarily fixed layer sheet U70 has a form in which penetrating rectangular hollow portions 70h are arranged in a matrix according to a predetermined rule.

  The temporarily fixed layer sheet U70 can be manufactured by pressing a predetermined tape using a mold.

<(1-2-2-3) First parallel spring layer>
FIG. 16 is a schematic top view showing the configuration of the first parallel spring layer 60.

  As shown in FIG. 16, the first parallel spring layer 60 is an elastic member having a frame body 60f and an elastic portion 61, and is a layer (elastic layer) forming a spring mechanism. As a material of the first parallel spring layer 60, for example, a metal material such as stainless steel or phosphor bronze is used.

  The frame body 60f is a plate-like portion that is a rectangular ring that constitutes the outer peripheral portion of the first parallel spring layer 60 and whose front and back surfaces are substantially parallel. The front surface (+ Z side surface) of the frame body 60f is joined to the back surface (−Z side surface) of the temporarily fixed layer 70, and the back surface (−Z side surface) of the frame body 60f is bonded to the spacing plate. It is joined to the upper surface (the surface on the + Z side) of the frame 50f (FIG. 17) of the layer 50.

  The elastic portion 61 includes connection portions 60Cc and 60Cd for the frame 60f and adhesion portions 60Sc and 60Sd for the protrusion portions 81Tc and 81Td. The connection portions 60Cc and 60Cd and the adhesion portions 60Sc and 60Sd are plate-like members 61c, Connected at 61d. The adhesive portions 60Sc and 60Sd each have a U-shaped inner edge, and form space regions 60Tc and 60Td surrounded by the inner edge, respectively.

  Then, the vicinity of the tip of the protrusion 81Tc is disposed in the space region 60Tc of the adhesive part 60Sc, and the vicinity of the tip of the protrusion 81Tc and the adhesive part 60Sc are bonded using an adhesive. Further, the vicinity of the tip of the protrusion 81Td is disposed in the space region 60Td of the adhesive portion 60Sd, and the vicinity of the tip of the protrusion 81Td and the adhesive portion 60Sd are bonded together using an adhesive.

  The connecting portions 60Cc and 60Cd are provided inside two opposing corners on one diagonal line of the frame 60f. On the other hand, hollow portions 60ha and 60hb are formed between the frame 60f and the elastic portion 61 on the inner side of the two opposite corners on the other diagonal line of the frame 60f. Further, inside the elastic portion 61, a hollow portion 60h constituting a portion (light path) through which light from the subject passes is formed.

  Here, as shown in FIG. 4, the projecting portion 81Ta passes through the hollow portion 60ha and extends to the vicinity of the movable portion 20a of the actuator layer 20 without contacting the first parallel spring layer 60. . Further, the projecting portion 81Tb passes through the hollow portion 60hb and extends to the vicinity of the movable portion 20b of the actuator layer 20 without contacting the first parallel spring layer 60.

  In the first parallel spring layer 60 having the above configuration, as the lens group layer 80 is moved in the + Z direction with respect to the frame body 60f, the positions in the Z direction between the connection portions 60Cc and 60Cd and the bonding portions 60Sc and 60Sd are shifted. The plate-like members 61c and 61d are bent by bending deformation (bending deformation). That is, the first parallel spring layer 60 can be elastically deformed in the optical axis direction (± Z direction) of the lens group layer 80 by elastic deformation of the plate-like members 61c and 61d, and functions as a spring mechanism.

  The first parallel spring layer 60 is manufactured in the form of a wafer-like sheet (first parallel spring layer sheet) U60 (FIG. 23) in which a plurality of first parallel spring layers 60 are arranged in a matrix according to a predetermined rule. Is done.

  The first parallel spring layer sheet U60 is soaked in an iron chloride-based etching solution by patterning the shape of the first parallel spring layer 60 by a photolithography technique on a metal plate such as stainless steel or phosphor bronze. It is formed by performing wet etching.

<(1-2-2-4) Spacing plate layer>
FIG. 17 is a schematic top view showing the configuration of the spacing plate layer 50.

  The spacing plate layer 50 is configured by a plate-like frame body 50f whose front and back surfaces are substantially parallel, and the frame body 50f forms a hollow portion 50h on the inner side.

  The frame 50f has a width of the frame that extends inward at two opposing corners located on one diagonal line, and has grooves 50ka and 50kb along the Z-axis at the inner part of the two corners. And while the surface (+ Z side surface) of the frame 50f is joined to the back surface (-Z side surface) of the first parallel spring layer 60, the back surface (−Z side surface) of the frame 50f is It is joined to the surface (+ Z side surface) of the frame 40f (FIG. 18) of the second parallel spring layer 40.

  Further, as shown in FIG. 4, the protruding portion 81Ta extends to the vicinity of the movable portion 20a of the actuator layer 20 without contacting the spacing plate layer 50 by passing through the space formed by the groove portion 50ka. . Further, the projecting portion 81Tb passes through the space formed by the groove portion 50kb, and extends to the vicinity of the movable portion 20b of the actuator layer 20 without coming into contact with the spacing plate layer 50.

  When a strong impact is applied to the camera module 500, such as when the mobile phone 100 is dropped on the ground, a certain amount of inertial force is applied to the lens group layer 80 that is not fixed to the fixed portion. work. However, in the present embodiment, the protrusions 81Ta and 81Tb are caught on the inner walls of the groove portions 50ka and 50kb, thereby preventing the occurrence of a problem that the first and second parallel spring layers 40 and 60 are plastically deformed. Is done.

  The spacing plate layer 50 is manufactured in the form of a wafer-like sheet (spacing plate layer sheet) U50 (FIG. 23) in which a plurality of spacing plate layers 50 are arranged in a matrix according to a predetermined rule. In other words, the spacing plate layer sheet U50 has a form in which the hollow portions 50h that pass therethrough are arranged in a matrix according to a predetermined rule.

  The spacing plate layer sheet U50 having the above configuration is made of, for example, a resin material or glass. Here, when the spacing plate layer sheet U50 is formed of a resin material, the spacing plate layer sheet U50 is formed by, for example, pressing using a metal mold, injection molding, or the like.

  In addition, by using a resin material in which carbon black is kneaded to produce the spacing plate layer sheet U50, unnecessary light is blocked and electromagnetic waves can be blocked.

<(1-2-2-5) Second parallel spring layer>
FIG. 18 is a schematic top view showing the configuration of the second parallel spring layer 40.

  As shown in FIG. 18, the second parallel spring layer 40 is 90 degrees around the optical axis PL of the lens group layer 80 parallel to the Z axis, compared to the first parallel spring layer 60 (FIG. 16). It has a rotated configuration.

  Specifically, the second parallel spring layer 40 is an elastic member having a frame body 40f and an elastic portion 41, and is a layer (elastic layer) that forms a spring mechanism.

  The frame body 40f is a rectangular ring-shaped portion that constitutes the outer peripheral portion of the second parallel spring layer 40, and is a plate-like portion whose front and back surfaces are substantially parallel. The front surface (+ Z side surface) of the frame body 40f is bonded to the back surface (-Z side surface) of the spacing plate layer 50, and the back surface (−Z side surface) of the frame body 40f is bonded to the spacer layer. It joins to the surface (+ Z side surface) of 30 frame 30f (FIG. 19).

  The elastic portion 41 includes connection portions 40Ca and 40Cb for the frame body 40f and adhesion portions 40Sa and 40Sb for the projection portions 81Ta and 81Tb, and the connection portions 40Ca and 40Cb and the adhesion portions 40Sa and 40Sb are plate-like members 41a, 40Sb. Connected at 41b. The bonding portions 40Sa and 40Sb each have a U-shaped inner edge, and form space regions 40Ta and 40Tb surrounded by the inner edge, respectively.

  Then, the protrusion 81Ta is disposed in the space area 40Ta of the adhesive portion 40Sa, and the protrusion 81Ta and the adhesive portion 40Sa are bonded together using an adhesive. In addition, the protrusion 81Tb is disposed in the space area 40Tb of the bonding portion 40Sb, and the protrusion 81Tb and the bonding portion 40Sb are bonded using an adhesive.

  The connecting portions 40Ca and 40Cb are provided inside two opposite corners on one diagonal line of the frame body 40f. On the other hand, hollow portions 40hc and 40hd are respectively formed between the frame body 40f and the elastic portion 41 inside the two opposite corners on the other diagonal line of the frame body 40f. Further, inside the elastic portion 41, a hollow portion 40h constituting a portion (light path) through which light from the subject passes is formed.

  Here, as shown in FIG. 4, the protruding portion 81Ta passes through the space region 40Ta of the adhesive portion 40Sa, and the tip end portion of the protruding portion 81Ta extends to the vicinity of the movable portion 20a of the actuator layer 20. Further, the protruding portion 81Tb passes through the space region 40Tb of the bonding portion 40Sb, and the tip portion of the protruding portion 81Tb extends to the vicinity of the movable portion 20b of the actuator layer 20.

  In the second parallel spring layer 40 having the above configuration, as the lens group layer 80 is moved in the + Z direction with respect to the frame body 40f, the positions in the Z direction between the connection portions 40Ca and 40Cb and the bonding portions 40Sa and 40Sb are shifted. The plate-like members 41a and 41b are bent by bending deformation (bending deformation). That is, the second parallel spring layer 40 can be elastically deformed in the optical axis direction (± Z direction) of the lens group layer 80 by elastic deformation of the plate-like members 41a and 41b, and functions as a spring mechanism.

  Similar to the first parallel spring layer 60, the second parallel spring layer 40 has a wafer-like sheet (second parallel spring layer sheet) in which a plurality of second parallel spring layers 40 are arranged in a matrix according to a predetermined rule. ) It is manufactured in the form of U40 (FIG. 23).

  In addition, this 2nd parallel spring layer sheet | seat U40 is manufactured by the method similar to the 1st parallel spring layer sheet | seat U60.

<(1-2-2-6) Spacer layer>
FIG. 19 is a schematic top view illustrating the configuration of the spacer layer 30.

  The spacer layer 30 is configured by a plate-shaped frame 30f whose front and back surfaces are substantially parallel.

  The frame 30f is an annular and plate-like member having a rectangular outer edge and inner edge, and forms a hollow portion 30h on the inner side. The front surface (+ Z side surface) of the frame body 30f is joined to the back surface (−Z side surface) of the frame body 40f of the second parallel spring layer 40, and the back surface (−Z side surface) of the frame body 30f. Surface) is joined to the surface (+ Z side surface) of the frame 20f (FIG. 20) of the actuator layer 20.

  The spacer layer 30 is for the purpose of suppressing a phenomenon in which the lens group layer 80 is unnecessarily moved when the shapes of the movable parts 20a and 20b of the actuator layer 20 change according to environmental conditions such as changes in environmental temperature. Provided.

  Specifically, due to the presence of the spacer layer 30, at the room temperature (for example, 20 ° C.), the tip of the protrusion 81Ta and the movable part 20a are slightly separated, and the tip of the protrusion 81Tb and the movable part 20b Are slightly separated. When the environmental temperature rises to some extent, the movable parts 20a and 20b are slightly deformed but do not come into contact with the protruding parts 81Ta and 81Tb.

  The spacer layer 30 is manufactured in the form of a wafer-like sheet (spacer layer sheet) U30 (FIG. 23) in which a plurality of spacer layers 30 are arranged in a matrix according to a predetermined rule. In other words, the spacer layer sheet U30 has a form in which the penetrating rectangular hollow portions 30h are arranged in a matrix according to a predetermined rule.

  The spacer layer sheet U30 is manufactured, for example, by subjecting a stainless steel plate to press working using a mold.

<(1-2-2-7) Actuator layer>
FIG. 20 is a schematic top view showing the configuration of the actuator layer 20.

  The actuator layer 20 has a function as a so-called unimorph type actuator. The actuator layer 20 is provided with the function of an actuator by employing a so-called bimetal in which two or more types of thin metal plates having different thermal expansion coefficients are bonded.

  Specifically, as shown in FIG. 20, the actuator layer 20 includes a frame body 20f and movable portions 20a and 20b.

  The frame body 20f is a rectangular annular plate-shaped portion that forms the hollow portion 20h.

  The movable portion 20a has one end portion (on one of the four plate-like portions constituting each of the four sides of the frame 20f, which is slightly inward from the + X-side end portion of the plate-like member located on the + Y side). It is a plate-like part to which a fixed end is fixed. The movable portion 20a is linearly extended in the −Y direction from the fixed end.

  Like the movable part 20a, the movable part 20b is slightly inward from the end part on the -X side of the plate-like member located on the -Y side, out of the four plate-like parts that respectively constitute the four sides of the frame 20f. It is a plate-like part where one end (fixed end) is fixed to the part that enters. The movable portion 20b is linearly extended in the + Y direction from the fixed end.

  The movable portions 20a and 20b have a bimetal configuration and a heater portion formed of a metal wiring pattern. The heater unit is electrically connected to the imaging element layer PB via, for example, an electrode unit provided on the frame body 20f and a thin film-like wiring formed on the side surface of the camera module 500 in sequence, Further, it is electrically connected to the current supply driver 600 (FIG. 1).

  In the actuator layer 20 having such a configuration, the heater part generates heat based on Joule heat by applying a current to the heater part provided in the movable parts 20a and 20b. At this time, the movable parts 20a and 20b are heated and deformed in response to the heating.

  Specifically, as the movable parts 20a and 20b are heated, the movable parts 20a and 20b are respectively displaced so that the free ends 20Ta and 20Tb of the movable parts 20a and 20b are displaced upward (in the + Z direction). Bend.

  Due to such behavior, in the actuator layer 20, a driving force is generated in the movable parts 20a and 20b by deformation according to heating.

  The actuator layer 20 is manufactured in the form of a wafer-like sheet (actuator layer sheet) U20 (FIG. 23) in which a plurality of actuator layers 20 are arranged in a matrix according to a predetermined rule.

  The actuator layer sheet U20 is manufactured, for example, by employing a photolithography technique and appropriately performing resist film patterning on the substrate, vapor deposition or sputtering, and etching.

<(1-2-2-8) Cover glass layer>
FIG. 21 is a schematic top view showing the configuration of the cover glass layer 10.

  As shown in FIG. 21, the cover glass layer 10 has a rectangular outer edge and is formed of a transparent glass plate. Note that the upper surface of the outer peripheral portion near the outer edge of the cover glass layer 10 is bonded to the back surface of the frame 20 f of the actuator layer 20.

  The cover glass layer 10 is manufactured in the form of a wafer-like sheet (cover glass layer sheet) U10 (FIG. 23) in which portions corresponding to a plurality of cover glass layers 10 are arranged in a matrix according to a predetermined rule. However, the cover glass layer sheet U10 may be a simple glass plate.

<(1-3) Camera module manufacturing>
FIG. 22 is a flowchart showing the flow of the manufacturing process of the camera module 500.

  As shown in FIG. 22, (Process A) Preparation of a plurality of sheets (Step S1), (Process B) Joining of a plurality of sheets (Step S2), (Process C) Dicing (Step S3), and (Process D) ) The camera module 500 is manufactured by sequentially releasing the adhesive state (step S4). Hereinafter, each step will be described.

<(1-3-1) Preparation of multiple sheets (Process A)>
As shown in FIG. 23, nine sheets UPB, U10 to U80 are prepared. Here, an example in which each sheet has a disk shape will be described.

  The manufacturing method of the eight sheets U10 to U80 is as described in the description relating to the configuration of each functional layer. The image sensor layer sheet UPB is manufactured in the form of a wafer-like sheet in which portions corresponding to a plurality of image sensor layer PB are arranged in a matrix according to a predetermined rule. The imaging element layer sheet UPB is formed using, for example, a photolithography technique.

  Further, the nine sheets UPB and U10 to U80 prepared in the process A are provided with marks (alignment marks) for alignment in the sheet joining process at substantially the same positions. Examples of the alignment mark include a cross mark and the like, and are preferably provided at two or more positions in the vicinity of the outer peripheral portion of the upper surface of each of the sheets UPB and U10 to U80.

<(1-3-2) Joining multiple sheets (Process B)>
As shown in FIG. 23, the nine sheets UPB and U10 to U80 prepared in step A are sequentially stacked and joined.

  24 to 33 are diagrams schematically showing a joining process of a plurality of sheets UPB and U10 to U80, focusing on a portion corresponding to one camera module 500. 24 to 33 show configurations in respective steps corresponding to the cross section of the camera module 500 corresponding to FIG. 6. Further, in FIGS. 24 to 33, the upper and lower sides of each layer are shown inverted in comparison with FIG. 6 in accordance with the actual process.

  In this process B, the following processes (I) to (XI) are sequentially performed, so that the plurality of sheets UPB and U10 to U80 are joined. Hereinafter, the following steps (I) to (XI) will be described with reference to FIGS.

  (I) As shown in FIG. 24, an assembly jig JG is prepared. The jig JG is provided with an annular projection having a flat upper surface on which a portion corresponding to the lens group layer 80 is placed at a position where a portion corresponding to each camera module 500 is formed.

  (II) As shown in FIG. 25, the lens group layer sheet U80 in which portions corresponding to the lens group layer 80 are arranged is positioned and placed on the jig JG. Here, the positioning may be performed based on the outer shape of the lens group layer 80, the positioning may be performed using the alignment mark of the lens group layer sheet U80, or according to the feature of the outer shape of the lens group layer sheet U80. May be positioned.

  (III) As shown in FIG. 26, the temporarily fixed layer sheet U70 is positioned and placed on the lens group layer sheet U80. Specifically, a portion corresponding to the temporarily fixed layer 70 is disposed immediately above a portion corresponding to each lens group layer 80. At this time, the temporarily fixed layer sheet U70 is pressed from above (−Z direction) and bonded to the lens group layer sheet U80.

  (IV) As shown in FIG. 27, the first parallel spring layer sheet U60 is positioned and placed on the temporarily fixed layer sheet U70. Specifically, a portion corresponding to the first parallel spring layer 60 is disposed immediately above a portion corresponding to each temporary fixing layer 70. At this time, the first parallel spring layer sheet U60 is pressed from above (−Z direction) and adhered to the temporarily fixed layer sheet U70. Note that the temporarily fixed layer sheet U70 can be bonded by pressing, for example, about 1 MPa. At this time, the vicinity of the tip of the protrusion 81Tc is disposed in the space region 60Tc of each adhesive portion 60Sc of the first parallel spring layer sheet U60, and the tip of the protrusion 81Td is disposed in the space region 60Td of each adhesive portion 60Sd. The vicinity of the part is arranged.

  (V) A UV cured layer is provided on one main surface of the portion corresponding to each frame body 60f of the first parallel spring layer sheet U60 (here, the -Z side surface of the frame body 60f). As shown, the spacing plate layer sheet U50 is positioned and placed on the first parallel spring layer sheet U60. And the part corresponded to the space | interval board layer 50 is each joined with the part corresponded to each 1st parallel spring layer 60 by exposure of an ultraviolet-ray.

  (VI) A UV cured layer is provided on one main surface (here, the -Z side surface of the frame 50f) corresponding to each frame 50f of the spacing plate layer sheet U50, as shown in FIG. As described above, the second parallel spring layer sheet U40 is positioned and placed on the spacing plate layer sheet U50. And the part corresponded to the 2nd parallel spring layer 40 is each joined with the part corresponded to each space | interval board layer 50 by exposure of an ultraviolet-ray. At this time, the protrusions 81Ta are disposed in the space regions 40Ta of the bonding portions 40Sa of the second parallel spring layer sheet U40, and the protrusions 81Tb are disposed in the space regions 40Tb of the bonding portions 40Sb.

  (VII) A dispenser is used to apply an adhesive (UV curing agent) that cures in response to the irradiation of ultraviolet rays so as to be applied to both the vicinity of the tip of the projection 81Tc and the adhesive portion 60Sc. A UV curing agent is applied so as to be applied to both the vicinity of the tip portion of 81Td and the adhesive portion 60Sd. Further, a UV curing agent is applied so as to be applied to both the protrusion 81Ta and the adhesive portion 40Sa by using a dispenser, and a UV hardener is applied to be applied to both the protrusion 81Tb and the adhesive portion 40Sb. Is done. Then, the UV curing agent is cured in accordance with the irradiation of the ultraviolet rays, so that the protrusion 81Tc is between the vicinity of the tip of the protrusion 81Ta and the adhesive part 40Sa, between the vicinity of the tip of the protrusion 81Tb and the adhesive part 40Sb. The vicinity of the distal end of the protrusion and the bonding portion 60Sc and the vicinity of the distal end of the protrusion 81Td and the bonding portion 60Sd are bonded to each other.

  (VIII) A UV cured layer is provided on one main surface of the portion corresponding to each frame body 40f of the second parallel spring layer sheet U40 (here, the -Z side surface of the frame body 40f). As shown, the spacer layer sheet U30 is positioned and placed on the second parallel spring layer sheet U40. And the part corresponded to the spacer layer 30 is each joined with the part corresponded to each 2nd parallel spring layer 40 by exposure of an ultraviolet-ray.

  (IX) A UV cured layer is provided on one main surface (here, the -Z side surface of the frame 30f) corresponding to each frame 30f of the spacer layer sheet U30, as shown in FIG. The actuator layer sheet U20 is positioned and placed on the spacer layer sheet U30. And the part corresponded to each actuator layer 20 is joined to the part corresponding to each spacer layer 30 by exposure of ultraviolet rays, respectively. At this time, a portion corresponding to the actuator layer 20 is provided for the fixed portion.

  (X) A UV cured layer is provided on one main surface (here, the surface on the −Z side of the frame 20f) corresponding to each frame 20f of the actuator layer sheet U20, as shown in FIG. The cover glass layer sheet U10 is positioned and placed on the actuator layer sheet U20. And the part corresponded to the cover glass layer 10 is each joined with the part corresponded to each actuator layer 20 by exposure of an ultraviolet-ray.

  (XI) A UV cured layer is provided on one main surface (here, the surface on the −Z side of the outer peripheral portion) corresponding to each outer peripheral portion of the cover glass layer sheet U10, as shown in FIG. The imaging element layer sheet UPB is positioned and placed on the cover glass layer sheet U10. And the part corresponded to the image pick-up element layer PB is each joined with the part corresponded to each cover glass layer 10 by exposure of an ultraviolet-ray.

  By sequentially performing the steps (I) to (XI), a wafer-like laminated member U500 (FIG. 34) in which a plurality of camera modules 500 are arranged in a matrix is assembled. Therefore, it can be said that the process B is a process of assembling the laminated member U500 (assembly process). In other words, it can be said that the process B is a process (formation process) in which the laminated member U500 is formed.

  In the laminated member U500, a portion corresponding to the fixed portion fixed to the first casing 200 in the camera module 500 and a portion corresponding to the lens group layer 80 as the movement target portion are temporarily fixed layers. It is set in a state where it is bonded by a portion corresponding to 70 (bonded state). In addition, the elastic portions 41 and 61 are set from the portion corresponding to the fixed portion to the portion corresponding to the lens group layer 80 (installed state).

<(1-3-3) Dicing (Process C)>
In a laminated member U500 formed by laminating nine sheets UPB and U10 to U80, a large number of chips (camera module unit portions) 500Pr corresponding to the camera modules 500 are arranged in a matrix according to a predetermined rule.

  In step C, the laminated member U500 is separated for each camera module unit 500Pr by the dicing apparatus, and a large number of camera module unit 500Pr in which the nine layers PB and 10 to 80 are laminated are manufactured.

  FIG. 34 is a diagram schematically showing a dicing step (cutting step) for cutting the laminated member U500. As shown in FIG. 34, the laminated member U500 is separated into camera module unit parts 500Pr by being cut vertically and horizontally along a thick broken line.

  At this time, a portion corresponding to the lens group layer 80 of the lens group layer sheet U80 and a portion corresponding to the temporarily fixed layer 70 of the temporarily fixed layer sheet U70 are bonded to each other. Therefore, a structure that suppresses the passage of various objects such as foreign matters from the outside to the internal space in the fixed portion between the portion corresponding to the temporarily fixed layer 70 and the portion corresponding to the lens group layer 80 (hereinafter referred to as “suppressing structure”). Is also formed). That is, when the laminated member U500 is cut while the suppression structure is formed, the laminated member U500 is separated for each camera module unit 500Pr.

  For this reason, during dicing, unnecessary deviation due to vibration does not occur between the portion corresponding to the lens group layer 80 and the portion corresponding to the fixed portion, and cooling water or the like inside the portion corresponding to the camera module 500 Intrusion of foreign matter including odor is prevented. As a result, the occurrence of a malfunction that causes a reduction in the function of the camera module 500 is avoided.

<(1-3-4) Release of adhesive state (Process D)>
The camera module unit 500Pr immediately after dicing has a form as shown in FIG.

  FIG. 35 and FIG. 36 are diagrams for explaining the bonding state releasing step.

  In step D, the camera module unit 500Pr is heated to a certain temperature (for example, 200 ° C.), so that the adhesive force on the upper surface of the temporary fixing layer 70 (here, the + Z side main surface) is lost. In addition, the efficiency of heat processing is achieved by heating in the state where many camera module unit parts 500Pr are put in one heating box.

  Further, at this time, as shown in FIG. 35, the movable portions 20a and 20b are deformed so as to be curved in response to heating, and the lens group layer 80 is pushed upward (+ Z direction). That is, the actuator layer 20 applies a driving force to the lens group layer 80 in accordance with heat for releasing the adhesion between the temporary fixing layer 70 and the lens group layer 80.

  As a result, the bonding state in which the fixing portion including the temporary fixing layer 70 and the lens group layer 80 are bonded is more reliably and quickly released.

  By releasing the adhesive state by heating, the lens group layer 80 is supported (supported) by the first and second parallel spring layers 40 and 60 (specifically, the elastic portions 41 and 61). Is set. Thereby, the camera module 500 is completed. At this time, the form of the suppression structure is changed by releasing the adhesion state, and the lens group layer 80 can move within a predetermined range of distance with respect to the fixed portion. Moreover, it can be said that a cancellation | release process is a process (form change process) which changes the form of a suppression structure.

  When the heating of the camera module 500 is finished and the ambient temperature around the camera module 500 is lowered, the deformation of the movable parts 20a and 20b is reduced.

  Further, when the environmental temperature falls below a certain temperature (for example, 70 ° C.), as shown in FIG. 36, the pushing up of the lens group layer 80 by the actuator layer 20 is finished, and the lens group layer 80 is moved to the temporarily fixed layer 70. Touch the top surface of. However, since the adhesive force on the upper surface of the temporary fixing layer 70 is lost at this point, the state where the lens group layer 80 and the fixing portion are not bonded is maintained.

<(1-4) Operation of camera module>
<(1-4-1) Operating principle of camera module>
If the camera module 500 is not energized to the heater portion of the actuator layer 20 in a room temperature state (for example, a temperature of 25 ° C.), as shown in FIG. The state is in contact with the upper surface of the fixed layer 70 (non-driven state).

  Next, when energization to the heater portion of the actuator layer 20 is started, the movable portions 20a and 20b are heated, and the movable portions 20a and 20b are deformed. At this time, the vicinity of the free ends 20Ta and 20Tb of the movable parts 20a and 20b pushes the protrusions 81Ta and 81Tb upward, so that the lens group layer 80 is positioned upward (on the basis of the fixed part as shown in FIG. + Z direction).

  Then, when energization of the heater portion of the actuator layer 20 is finished, the deformation of the movable portions 20a and 20b is reduced. When the temperature of the movable part falls below a certain temperature (for example, 70 ° C.), as shown in FIG. 36, the pushing up of the lens group layer 80 by the actuator layer 20 is finished, and the lens group layer 80 is temporarily fixed. Contact the upper surface of the layer 70.

<(1-4-2) AF control of camera module>
AF control in the camera module 500 is realized by the current supply driver 600, the electrical resistance detection unit 700, the contrast detection unit 800, and the focus control unit 310 shown in FIG.

  The electrical resistance detection unit 700 detects the electrical resistance of the heater unit of the actuator layer 20 and outputs a signal indicating the electrical resistance to the focusing control unit 310. The focusing control unit 310 detects the deformation of the heater unit (specifically, the displacement of the free ends 20Ta and 20Tb of the movable units 20a and 20b) based on the electric resistance of the heater unit. Then, the focus control unit 310 recognizes the displacement related to the movable units 20 a and 20 b and recognizes the displacement as the displacement of the lens group layer 80.

  The detection of the displacement of the free ends 20Ta and 20Tb of the movable parts 20a and 20b is performed by utilizing the fact that the relationship between the shape of the heater part and the electrical resistance is uniquely determined.

  Then, the focus control unit 310 detects the displacement of the free ends 20Ta and 20Tb of the movable units 20a and 20b, and controls the supply of current to the heater unit via the current supply driver 600, thereby moving the movable unit 20a. , 20b, that is, the displacement of the free ends 20Ta, 20Tb is controlled.

  At this time, when the protrusions 81Ta and 81Tb are pushed up by the movable portions 20a and 20b, the lens group layer 80 is moved in the + Z direction, so that the separation distance between the lens group layer 80 and the image sensor IS is changed. The position of is changed.

  The contrast detector 800 detects the contrast of the image signal obtained by the image sensor IS. For example, a numerical value obtained by accumulating differences in gradation values between adjacent pixels for the entire image is detected as an evaluation value indicating contrast. A signal indicating the evaluation value indicating the contrast is output to the focus control unit 310.

  Specifically, AF control is realized by sequentially performing the following operations (A) to (C).

  (A) Under the control of the focus control unit 310, first, the separation distance between the lens group layer 80 and the image sensor IS is sequentially set to a preset multi-step separation distance. At this time, an image signal is acquired by the imaging element IS in a state where the lens group layer 80 and the imaging element IS are set for each separation distance.

  (B) Based on the evaluation value indicating the contrast detected by the contrast detection unit 800 for each separation distance, the focusing control unit 310 sets the separation distance at which the evaluation value indicating the contrast is maximum, that is, the lens group layer 80 is fed out. Detect position. Here, the state where the lens group layer 80 is arranged at the extended position where the evaluation value indicating the contrast is maximum corresponds to the state where the subject is in focus.

  (C) Focusing on the subject in the camera module 500 is realized by moving the lens group layer 80 to the extended position where the evaluation value indicating the contrast is maximized under the control of the focus control unit 310. That is, AF control is realized.

  As described above, in the manufacturing process of the camera module 500 according to the first embodiment, the assembly process (formation process) of the laminated member U500 and the process of releasing the adhesion state and changing the form of the suppression structure (form change process) During this period, the portion corresponding to the fixed portion and the portion corresponding to the lens group layer 80 are bonded. For this reason, when the laminated member U500 is cut and separated for each camera module unit 500Pr in the dicing process, a portion corresponding to the fixed portion and a portion corresponding to the lens group layer 80 are bonded.

  As a result, the entry of foreign matter into the internal space in the cutting process is suppressed, so that the occurrence of problems due to the entry of foreign matter is suppressed. Specifically, the deformation of the elastic parts 41 and 61 and the movable parts 20a and 20b arranged in the internal space of the fixed part, and the occurrence of a problem that the optical path from the subject to the image sensor IS is hindered by the entry of foreign matter or the like. Is easily suppressed.

  Moreover, since the bonding state is released using heat in the releasing step, the occurrence of defects due to the entry of foreign matter or the like is easily suppressed.

<(2) Second Embodiment>
In the manufacturing process of the camera module 500 according to the first embodiment, a part corresponding to the temporarily fixed layer 70 included in the fixed part and a part corresponding to the lens group layer 80 as the movement target part are included in the dicing process. In the bonded state, the invasion of foreign matter into the internal space was suppressed.

  In contrast, in the manufacturing process of the camera module 500A according to the second embodiment, in the dicing process, the portion corresponding to the temporarily fixed layer 70 included in the fixed portion and the lens group layer 80 as the movement target portion are provided. Since the corresponding part is in the fitted state, the entry of foreign matter into the internal space is suppressed.

  Compared to the camera module 500 according to the first embodiment, the camera module 500 </ b> A according to the second embodiment corresponds to a portion corresponding to the temporarily fixed layer 70 included in the fixed portion and a lens group layer 80 as a movement target portion. The parts to be replaced are replaced with different structures. Then, the manufacturing process of the camera module 500A according to the second embodiment is replaced with a process in which the processes related to the formation of the suppression structure and the change in form are different from those of the manufacturing process of the camera module 500 according to the first embodiment. It has been done.

  Hereinafter, of the configuration and manufacturing process of the camera module 500A according to the second embodiment, portions different from the configuration and manufacturing process of the camera module 500 according to the first embodiment will be sequentially described. In addition, about the structure similar to the camera module 500 which concerns on 1st Embodiment among the camera modules 500A which concern on 2nd Embodiment, the same code | symbol is attached | subjected and duplication description is abbreviate | omitted and it overlaps also about a manufacturing process. Description of the portion is omitted.

<(2-1) Differences in camera module configuration>
FIG. 37 is a schematic cross-sectional view showing a configuration of a camera module 500A according to the second embodiment. The cross-sectional schematic diagram of the camera module 500A shown in FIG. 37 corresponds to the cross-sectional schematic diagram of the camera module 500 shown in FIG.

  As shown in FIG. 37, the camera module 500A according to the second embodiment includes the lens group layer 80, the temporary fixing layer 70, and the cover glass layer 10 as compared with the camera module 500 according to the first embodiment. The lens group layer 80A, the temporary fixing layer 70A, and the cover glass layer 10A are changed.

  The lens group layer 80A is obtained by changing the connecting plate 81 to a connecting plate 81A having a slightly different shape compared to the lens group layer 80 according to the first embodiment.

  FIG. 38 is a schematic bottom view showing the configuration of the connecting plate 81A according to the second embodiment, and FIG. 39 is a schematic cross-sectional view of the connecting plate 81A as viewed in the direction of the arrow along the cut surface XXXIX-XXXIX of the connecting plate 81A. It is.

  As shown in FIGS. 38 and 39, the connecting plate 81A has protrusions 81Ta to 81Td having protrusions slightly extended in the −Z direction compared to the connecting plate 81 according to the first embodiment. The frame body 81f is changed to the portion 81TaA to 81TdA, and the frame body 81f is added to the frame body 81fA in which a rectangular and annular convex portion (annular convex portion) 81ftA along the outer edge is added on the lower surface (here, the surface on the −Z side) It has been changed.

  FIG. 40 is a schematic top view illustrating the configuration of the temporarily fixed layer 70A according to the second embodiment. FIG. 41 illustrates the temporarily fixed layer 70A viewed in the direction of the arrow along the cut plane XXXXI-XXXXI of the temporarily fixed layer 70A. It is a cross-sectional schematic diagram.

  As shown in FIGS. 40 and 41, the temporarily fixed layer 70A is along the inner edge on the upper surface (the surface on the + Z side here) of the temporarily fixed layer 70, as compared with the temporarily fixed layer 70 according to the first embodiment. A rectangular and annular convex portion (annular convex portion) 70tA is added. Further, unlike the temporary fixing layer 70 according to the first embodiment, the upper surface of the temporary fixing layer 70A (here, the surface on the + Z side) does not have an adhesive force regardless of the presence or absence of heating. Note that the lower surface (here, the −Z side surface) of the temporarily fixed layer 70A is bonded to the upper surface (here, the + Z side surface) of the first parallel spring layer 60 via a UV cured layer or the like. good.

  The cover glass layer 10 </ b> A has a recessed portion in which the central portion of the upper surface (here, the surface on the + Z side) is recessed as compared to the cover glass layer 10 according to the first embodiment. The concave portion is provided in order to secure a space where the movable portions 20a and 20b bend downward (−Z direction) due to the extended distance between the protruding portions 81TaA and TbA.

<(2-2) Differences in camera module manufacturing process>
In the manufacturing process of the camera module 500A according to the second embodiment, as compared with the manufacturing process of the camera module 500 according to the first embodiment, for the lens group layer sheet U80 in the process B in which a plurality of sheets are joined. Thus, the step (bonding step) in which the temporarily fixed layer sheet U70 is bonded and the step (release step) D for releasing the bonded state are respectively replaced with different steps.

  Specifically, in the bonding step, a sheet (temporary fixing layer sheet) in which a large number of temporarily fixed layers 70A are arranged is fitted to a sheet (lens group layer sheet) in which a large number of lens group layers 80A are arranged. Is changed to a process (fitting process). Further, the bonding state releasing step D is changed to a fitting state releasing step.

  FIG. 42 is a diagram schematically showing the fitting process by paying attention to a part of a portion corresponding to one camera module 500A.

  In the fitting step, each layer is upside down from the state shown in FIGS. 37 and 42. Therefore, a portion corresponding to the temporary fixing layer 70A is disposed immediately above a portion corresponding to each lens group layer 80A. Is done. Then, when the temporarily fixed layer sheet is pressed from above (−Z direction), as shown in FIG. 42, inside the portion corresponding to each annular protrusion 81 ftA, it corresponds to each annular protrusion 70 tA. The part fits. That is, a portion corresponding to the temporary fixing layer 70A included in the fixing portion is fitted to a portion corresponding to the connecting plate 81A included in the movement target portion. In other words, the portion corresponding to the connecting plate 81A and the portion corresponding to the temporary fixing layer 70A form a so-called inlay type structure.

  Here, due to the fitting, there is almost no gap between the portion corresponding to the connecting plate 81A and the portion corresponding to the temporary fixing layer 70A. For this reason, in the dicing process, a structure (suppression structure) 78A that suppresses passage of various objects such as foreign substances from the outside to the internal space of the fixed portion indicated by the thick arrow in FIG. 42 is formed. When the suppression structure 78A is formed, the protrusions 81TaA and 81TbA push the vicinity of the free ends of the movable portions 20a and 20b, and the movable portions 20a and 20b are elastically deformed and curved.

  Then, the laminated member U500A (FIG. 34) according to the second embodiment is cut in a state where the suppression structure 78A is formed, so that the laminated member U500A is separated for each camera module unit 500PrA (FIG. 34). Is done.

  FIG. 43 is a diagram schematically showing a fitting state releasing step by paying attention to a part of a portion corresponding to one camera module 500A.

  As shown in FIG. 43, in the fitting state releasing step, for example, the lens group layer 80A is pulled up in a state in which the position on the fixing part side of the camera module unit part 500PrA is fixed. At this time, the fitting state between the connecting plate 81A and the temporary fixing layer 70A is released, and the configuration of the suppression structure 78A is changed. As a result, a moving mechanism is completed in which the lens group layer 80A is movable at a distance in a predetermined range with respect to the fixed portion.

  Such release of the fitted state may be performed when the camera module 500A is inserted into the cover and mounted on the mobile phone 100A or before the mounting.

  In the moving mechanism completed after the fitting state is released, as shown in FIG. 37, the tip portions of the protrusions 81TaA and 81TbA and the vicinity of the free ends of the movable portions 20a and 20b are slightly separated from each other. It becomes a state.

  As described above, in the manufacturing process of the camera module 500A according to the second embodiment, the assembly process (formation process) of the laminated member U500A and the process of changing the form of the restraining structure 78A by releasing the fitting state (form change) In the period between the first step and the second step, the portion corresponding to the fixed portion and the portion corresponding to the lens group layer 80A are fitted to form the suppression structure 78A. For this reason, in the cutting process, the presence of the suppression structure 78A suppresses the entry of foreign matter into the internal space. Therefore, similarly to the manufacturing process of the camera module 500 according to the first embodiment, the occurrence of defects due to the entry of foreign matter or the like is easily suppressed.

  Here, the shape of each annular protrusion 81ftA and the shape of each annular protrusion 70tA are interchanged with each other, and a portion corresponding to the connecting plate 81A included in the movement target portion is included in the temporary portion. A configuration that is fitted to a portion corresponding to the fixed layer 70A may be employed.

<(3) Modification>
It should be noted that the present invention is not limited to the above-described embodiment, and various changes and improvements can be made without departing from the gist of the present invention.

  In the manufacturing process of the camera module 500 according to the first embodiment, formation and change of the restraining structure are realized by forming and releasing the adhesion state. In the manufacturing process of the camera module 500A according to the second embodiment, fitting is performed. The formation and change of the suppression structure are realized by the formation and release of the combined state, but this is not a limitation. The formation and change of the suppression structure may be realized by other forms.

  Hereinafter, a plurality of specific examples (first to sixth modifications) in which formation and change of the suppression structure are realized by other forms will be sequentially described.

<(3-1) First modification>
In the manufacturing process of the camera module 500B according to the first modified example, a plurality of valves are formed between a portion corresponding to the fixed portion and a portion corresponding to the movement target portion during the dicing step, so that the internal space Intrusion of foreign matter into the body is suppressed.

  Compared with the camera module 500A according to the second embodiment, the camera module 500B according to the first modification corresponds to a portion corresponding to the temporarily fixed layer 70A included in the fixed portion and a lens group layer 80A as the movement target portion. The parts to be replaced are replaced with different structures. And the manufacturing process of the camera module 500B which concerns on a 1st modification is replaced with the process from which the process which concerns on formation of a suppression structure and a change of a form differs compared with the manufacturing process of the camera module 500A which concerns on 2nd Embodiment. It has been done.

  Here, in the camera module 500B according to the first modification, the same configuration as the camera module 500A according to the second embodiment is denoted by the same reference numeral, and the duplicate description is omitted, and the manufacturing process is also duplicated. The description of the parts to be performed is omitted.

  FIG. 44 is a schematic cross-sectional view showing a configuration of a camera module 500B according to the first modification. The cross-sectional schematic diagram of the camera module 500B shown in FIG. 44 corresponds to the cross-sectional schematic diagram of the camera module 500A shown in FIG.

  As shown in FIG. 44, the camera module 500B according to the first modification is different from the camera module 500A according to the second embodiment in that the lens group layer 80A and the temporarily fixed layer 70A are the lens group layer 80B and the lens group layer 80B, respectively. The lower valve layer 70B has been changed.

  The lens group layer 80B is obtained by changing the connecting plate 81A to a connecting plate 81B having a different configuration compared to the lens group layer 80A according to the second embodiment.

  FIG. 45 is a schematic bottom view showing the configuration of the connecting plate 81B according to the first modification, and FIG. 46 is a schematic cross-sectional view of the connecting plate 81B as viewed in the direction of the arrow along the cut surface XXXXVI-XXXXVI of the connecting plate 81B. It is.

  As shown in FIGS. 45 and 46, the connecting plate 81B is rectangular and annular instead of the annular convex portion 81ftA in the lower part (here, the −Z side) compared to the connecting plate 81A according to the first embodiment. A plurality of (in this case, four) film-like portions (film-like convex portions) 81 ftB are formed. That is, a plurality of film-like convex portions 81ftB are erected on the surface of the connecting plate 81B that faces the lower valve layer 70B.

  Specifically, the second film-shaped convex portion 81ftB is formed around the first film-shaped convex portion 81ftB, and the third film-shaped convex portion is formed around the second film-shaped convex portion 81ftB. 81 ftB is formed, and the fourth film-shaped convex portion 81 ftB is formed around the third film-shaped convex portion 81 ftB. And each film-like convex part 81ftB is provided so that it may incline in the outer peripheral direction of the connection board 81B, and each uses the flexible raw material which can be elastically deformed comparatively easily, such as silicone rubber which has heat resistance. Composed.

  As for the connecting plate sheet in which a large number of connecting plates 81B are arranged, for example, a wafer-like sheet in which a large number of portions having a frame body 81fB, projecting portions 81a to 81d, and projecting portions 81TaA to 81TdA are arranged. The sheet is manufactured by adhering a sheet in which a large number of portions on which the film-shaped convex portions 81ftB are formed are arranged on the top.

  FIG. 47 is a schematic top view showing the configuration of the lower valve layer 70B according to the first modification, and FIG. 48 shows the lower valve layer 70B as viewed in the direction of the arrow on the cut surface XXXXVIII-XXXXVIII of the lower valve layer 70B. It is a cross-sectional schematic diagram.

  As shown in FIGS. 47 and 48, the lower valve layer 70B has an upper portion (here, the surface on the + Z side) instead of the annular convex portion 70tA, as compared with the temporarily fixed layer 70A according to the second embodiment. A plurality of (three in this case) film-shaped portions (film-shaped convex portions) 70tB that are projected in a rectangular and annular shape are formed. That is, a plurality of film-like convex portions 70tB are erected on the surface of the lower valve layer 70B facing the connecting plate 81B.

  Specifically, the second film-shaped convex portion 70tB is formed around the first film-shaped convex portion 70tB, and the third film-shaped convex portion is formed around the second film-shaped convex portion 70tB. 70 tB is formed. Each film-like convex portion 70tB is provided so as to be inclined in the outer peripheral direction of the lower valve layer 70B, and a flexible material that can be elastically deformed relatively easily, such as silicon rubber having heat resistance, is used. Configured.

  In addition, about the sheet | seat (lower valve layer sheet | seat) in which many lower-valve layers 70B were arranged, the sheet | seat in which many parts by which the film-like convex part 70tB is formed on a flat plate, such as resin, are arranged, for example Is attached, and a portion corresponding to the hollow portion 70h of each lower valve layer 70B is formed by press working or the like.

  In the manufacturing process of the camera module 500B according to the first modification, compared to the manufacturing process of the camera module 500A according to the second embodiment, a provisional process is performed on the lens group layer sheet in the process of joining a plurality of sheets. The step of fitting the fixed layer sheet (fitting step) and the step of releasing the fitting state (release step) are respectively replaced with different steps.

  Specifically, the fitting process is set to a state where the lower valve layer sheet is pressed against the lens group layer sheet (pressing state), so that the four film-shaped convex portions 81ftB and the triple film are formed. The convex portion 70tB is changed to a step (pressing step) for forming a plurality of valves. Moreover, the release process of a fitting state is changed into the cancellation process of a pressing state.

  49 and 50 are a cross-sectional view and a side view schematically showing the pressing step by paying attention to a part of the portion corresponding to one camera module 500B.

  In the pressing step, each layer is upside down from the state shown in FIGS. 44, 49, and 50. Therefore, the portion corresponding to the lower valve layer 70B is directly above the portion corresponding to each lens group layer 80B. Are arranged respectively. Then, when the lower valve layer sheet is pressed from above (the −Z direction), as shown in FIGS. 49 and 50, the triple film-like convex part 81 ftB has a triple film-like convex part. The part 70tB is pressed, and each film-like convex part 70tB comes into contact with the two film-like convex parts 81ftB. At this time, each film-like convex part 70tB and each film-like convex part 81ftB are elastically deformed, and there is almost no gap between the part corresponding to the lens group layer 80B and the part corresponding to the lower valve layer 70B. A multiple valve (multiple valve structure) 78B is formed.

  In the dicing process, for example, the laminated valve U500B (FIG. 34) according to the first modification is sandwiched from above and below, so that the multiple valve structure 78B is formed in each camera module unit 500PrB (FIG. 34). It becomes. The multi-valve structure 78B serves as a suppression structure that suppresses the passage of various objects such as foreign matters from the outside to the internal space of the fixed portion indicated by the bold arrows in FIG. 49 in the dicing process. Hereinafter, the multiple valve structure 78B is also referred to as a suppression structure 78B.

  FIG. 51 is a diagram schematically showing a pressing state releasing process by paying attention to a part corresponding to one camera module 500B.

  After the dicing process, if the force for holding the camera module unit 500PrB from above and below is released, the connecting plate 81B and the lower valve layer 70B are elastically generated by the elastic portions 41 and 61 and the movable portions 20a and 20b. The force pressing each other is released. That is, the form of the suppression structure 78B is changed by releasing the pressing state.

  Furthermore, when the camera module 500B is inserted into the cover and mounted on the mobile phone 100B, as shown in FIG. 51, the position of the camera module unit 500PrB on the fixed part side is fixed. The lens group layer 80B is pulled up. By such a change in the configuration of the suppression structure 78B, a moving mechanism is completed that allows the lens group layer 80B to move within a predetermined range of distance with respect to the fixed portion.

  As described above, in the manufacturing process of the camera module 500B according to the first modified example, the assembly process (formation process) of the laminated member U500B and the process of releasing the pressing state and changing the form of the suppression structure (form change process) In the cutting process between the two, the presence of the suppression structure 78B suppresses the entry of foreign matter into the internal space. As a result, similar to the manufacturing process of the camera modules 500 and 500A according to the first and second embodiments, the occurrence of defects due to the entry of foreign matter or the like is easily suppressed.

  In addition, although the film-shaped convex part was provided in both the fixed part and the movement target part here, for example, the surface corresponding to the movement target part in the fixed part, and the movement target part. A film-like convex part may be provided on at least one of the faces facing the fixed part.

<(3-2) Second modification>
In the manufacturing process of the camera module 500C according to the second modified example, in the dicing process, a film-like valve layer (membrane-like connection valve layer) that connects a portion corresponding to the fixed portion and a portion corresponding to the movement target portion. ) Is formed, foreign matter is prevented from entering the internal space.

  Compared to the camera module 500B according to the first modification, the camera module 500C according to the second modification is replaced with a different configuration in the portion corresponding to the lens group layer 80B as the movement target portion, and the lower valve layer The portion corresponding to 70B is removed, and the remains of the membrane-like coupling valve layer 78C (FIG. 53) are present. Then, the manufacturing process of the camera module 500C according to the second modified example is replaced with a process in which the process related to the formation of the suppression structure and the change in form are different from the manufacturing process of the camera module 500B according to the first modified example. It has been done.

  Here, in the camera module 500C according to the second modified example, the same configuration as the camera module 500B according to the first modified example is denoted by the same reference numeral, and redundant description is omitted, and the manufacturing process is also duplicated. The description of the parts to be performed is omitted.

  FIG. 52 is a schematic cross-sectional view showing a configuration of a camera module 500C according to the second modification. The cross-sectional schematic diagram of the camera module 500C shown in FIG. 52 corresponds to the cross-sectional schematic diagram of the camera module 500B shown in FIG.

  As shown in FIG. 52, the lens group layer 80C is obtained by changing the connecting plate 81B to a connecting plate 81C having a different configuration compared to the lens group layer 80B according to the first modification. Specifically, the connecting plate 81C has a configuration in which the four film-like convex portions 81ftB of the connecting plate 81B are removed.

  In the manufacturing process of the camera module 500C, as compared with the manufacturing process of the camera module 500B according to the first modification, instead of the suppression structure 78B, the connection plate 81C included in the movement target portion and the first parallel included in the fixing portion. A membrane-like connecting valve layer 78C (FIG. 53) that connects the spring layer 60 is formed. That is, the pressing step is replaced with a step (valve forming step) in which the membrane-like connecting valve layer 78C is formed. Further, the pressing state releasing step is replaced with a step of breaking the membranous coupling valve layer 78C (rupture step).

  53 and 54 are cross-sectional views schematically showing a valve forming step in which a portion corresponding to the membrane-like connection valve layer 78C is formed, focusing on a part of the portion corresponding to one camera module 500C. It is a side view.

  The membrane connection valve layer 78C is configured using a flexible material that can be elastically deformed relatively easily, such as heat-resistant silicone rubber. In the valve forming step, a sheet (membrane-coupled valve layer sheet) in which a plurality of membrane-coupled valve layers 78C are arranged according to a predetermined rule is used.

  FIG. 55 is a schematic plan view showing the configuration of the membrane-like connecting valve layer sheet U78C. As shown in FIG. 55, in the membrane connected valve layer sheet U78C, portions corresponding to the rectangular and annular membrane connected valve layers 78C along the shape of the frame 60f are arranged in a matrix according to a predetermined rule. At the same time, the portions corresponding to the respective membrane-like connection valve layers 78C are connected to each other. Therefore, the membrane connection valve layer sheet U78C is configured by arranging very thin membrane portions made of silicon rubber or the like in a lattice pattern.

  In the valve forming step, the upper and lower sides of each layer are reversed from the states shown in FIGS. 52, 53, and 54. Therefore, the film-like coupling valve layer 78C is directly above the portion corresponding to each lens group layer 80C. Corresponding portions are respectively arranged, and the membrane-like connecting valve layer sheet U78C is bonded to the lens group layer sheet by UV curable resin or the like. Thereafter, the first parallel spring layer sheet U60 is joined to the membrane-like connecting valve layer sheet U78C.

  As shown in FIG. 53 and FIG. 54 in each camera module unit 500PrC (FIG. 34) in the laminated member U500C (FIG. 34) according to the second modification by joining the membrane-like connecting valve layer sheet U78C. In addition, a portion corresponding to the membrane connection valve layer 78C that connects the portion corresponding to the connection plate 81C and the portion corresponding to the first parallel spring layer 60 is formed.

  The membrane-like connecting valve layer 78C serves as a restraining structure that suppresses passage of various objects such as foreign matters from the outside to the internal space of the fixed portion indicated by the bold arrows in FIG. 53 in the dicing process. Hereinafter, the membrane-like connection valve layer 78C is also referred to as a suppression structure 78C.

  FIG. 56 is a diagram schematically showing a rupture process of the membrane coupling valve layer 78C performed after the dicing process, paying attention to a part corresponding to one camera module 500C.

  As shown in FIG. 56, in the breaking step, an external force is applied so that the fixed portion including the first parallel spring layer 60 and the moving target portion including the connection plate 81 </ b> C are separated from each other. After 78C is stretched, the membrane-like connecting valve layer 78C is broken. At this time, the connection state between the connection plate 81C and the first parallel spring layer 60 by the film-like connection valve layer 78C is released, and the form of the film-like connection valve layer 78C changes. As a result, a moving mechanism is completed in which the lens group layer 80C is movable at a distance in a predetermined range with respect to the fixed portion.

  Note that the breakage of the membrane connection valve layer 78C due to the release of the connection state may be performed when the camera module 500C is inserted into the cover and mounted on the mobile phone 100C or before the mounting.

  As described above, in the manufacturing process of the camera module 500C according to the second modified example, the assembly process (formation process) of the laminated member U500C and the process of releasing the connected state and changing the form of the restraining structure (form change process) In the cutting process between the two, the presence of the suppression structure 78C suppresses the entry of foreign matter into the internal space. As a result, it is possible to reliably and easily suppress the occurrence of defects due to the entry of foreign matter.

<(3-3) Third modification>
In the manufacturing process of the camera module 500C according to the second modified example, the membrane connecting valve layer 78C was broken.

  On the other hand, in the manufacturing process of the camera module 500D according to the third modified example, the membrane coupling valve layer 78C is formed into a membrane coupling valve layer 78D that is plastically deformed by being stretched. A moving mechanism is completed in which the layer 80C is movable within a distance in a predetermined range with respect to the fixed portion.

  Here, with respect to the same configuration as the camera module 500C according to the second modified example of the camera module 500D according to the third modified example, the same reference numerals are given and the duplicate description is omitted, and the manufacturing process is also duplicated. The description of the parts to be performed is omitted.

  FIG. 57 is a schematic cross-sectional view showing a configuration of a camera module 500D according to the third modification. The cross-sectional schematic diagram of the camera module 500D shown in FIG. 57 corresponds to the cross-sectional schematic diagram of the camera module 500C shown in FIG.

  Compared with the camera module 500C according to the second modified example (FIG. 52), the camera module 500D according to the third modified example causes the remnants of the membrane connected valve layer 78C to be converted into the membrane connected valve layer 78D after plastic deformation. Has been replaced.

  Further, in the manufacturing process of the camera module 500D according to the third modified example, the breaking process is a process of extending the film-like connecting valve layer 78C to be plastically deformed as compared with the manufacturing process of the camera module 500B according to the second modified example. (Stretching step).

  FIG. 58 is a cross-sectional view schematically showing the stretching process by paying attention to a part of a portion corresponding to one camera module 500D.

  As shown in FIG. 58, in the stretching step, an external force is applied so that the fixed portion including the first parallel spring layer 60 and the moving target portion including the connecting plate 81C are separated, so that the film does not break. The concatenated valve layer 78C is extended. At this time, the membranous coupling valve layer 78C is plastically deformed to form the membranous coupling valve layer 78D, whereby the configuration of the membranous coupling valve layer 78C changes.

  Then, after the stretching step, as shown in FIG. 59, when the lens group layer 80C moves at a distance in a predetermined range with respect to the fixed portion, the membrane coupling valve layer 78D has a bellows shape. Since it has a shape and expands and contracts, movement of the lens group layer 80C is not hindered.

  The stretching process may be performed when the camera module 500D is inserted into the cover and mounted on the mobile phone 100D or before the mounting.

  As described above, in the manufacturing process of the camera module 500D according to the third modified example, in the same way as the manufacturing process of the camera module 500C according to the second modified example, in the cutting process, due to the presence of the suppression structure 78C, the internal Intrusion of foreign matter into the space is suppressed. As a result, it is possible to reliably and easily suppress the occurrence of defects due to the entry of foreign matter.

<(3-4) Fourth modification>
In the manufacturing process of the camera module 500E according to the fourth modified example, in the dicing process, the portion corresponding to the fixed portion and the portion corresponding to the moving target portion are mutually connected on the surface coated with water repellency. By abutting, entry of foreign matter into the internal space is suppressed.

  Here, with respect to the same configuration as the camera module 500C according to the second modified example of the camera module 500E according to the fourth modified example, the same reference numerals are given, and repeated description is omitted, and the manufacturing process is also duplicated. The description of the parts to be performed is omitted.

  FIG. 60 is a schematic cross-sectional view showing a configuration of a camera module 500E according to the fourth modification. The cross-sectional schematic diagram of the camera module 500E shown in FIG. 60 corresponds to the cross-sectional schematic diagram of the camera module 500C shown in FIG.

  As shown in FIG. 60, the camera module 500E according to the fourth modification is connected to the camera module 500C according to the second modification (FIG. 52) instead of the remnant of the membrane connection valve layer 78C. The plate 81C is replaced with a connecting plate 81E in which a surface (lower surface) facing the frame body 61f of the first parallel spring layer 60 is coated with water-repellent coating, and the first parallel spring layer 60 is replaced with the frame body. The first parallel spring layer 60E in which the surface (upper surface) of 61f facing the connecting plate 81C is coated with water repellency is replaced. The coating having water repellency is realized by spraying a fluorine-based liquid or the like. In addition, the lens group layer 80C is replaced with the lens group layer 80E by replacing the connection plate 81C with the connection plate 81E.

  And the manufacturing process of the camera module 500E which concerns on a 4th modification is replaced with the process from which the process which concerns on formation of a suppression structure and a change of a form differs compared with the manufacturing process of the camera module 500B which concerns on a 2nd modification. It has been done.

  FIG. 61 is a cross-sectional view schematically showing a suppression structure forming process, focusing on a part of a portion corresponding to one camera module 500E.

  As shown in FIG. 61, in the manufacturing process of the camera module 500E according to the fourth modified example, in the joining process in which a plurality of sheets are joined, on the lens group layer sheet on which the plurality of lens group layers 80E are arranged, A plurality of first parallel spring layers 60E are stacked.

  Then, by applying a force sandwiched from above and below, the portion corresponding to the lens group layer 80E is provided with a water repellent coating portion (water repellent coating portion) 81cE and the first parallel spring layer 60E. The part (water-repellent coating part) 60cE to which the coating having water repellency is applied is brought close to or in contact with each other.

  In the dicing step, for example, the laminated member U500E (FIG. 34) according to the fourth modification is sandwiched from above and below. For this reason, in each camera module unit 500PrE (FIG. 34), the water-repellent coating 81cE and the water-repellent coating 60cE are close to or in contact with each other. At this time, there is almost no gap between a portion corresponding to the first parallel spring layer 60E included in the fixed portion and a portion corresponding to the lens group layer 80E included in the movement target portion. Therefore, in the dicing process, the water-repellent coating portion 81cE and the water-repellent coating portion 60cE form the suppression structure 78E that suppresses the passage of various objects such as foreign matters to the internal space of the fixed portion from the outside.

  FIG. 62 is a diagram schematically showing a process (form changing process) of changing the form of the suppression structure 78E by paying attention to a part of the part corresponding to one camera module 500E.

  After the dicing process, if the force for holding the camera module unit 500PrE from above and below is released, at that time, the connecting plate 81E and the first parallel spring are caused by the elastic force of the elastic parts 41 and 61 and the movable parts 20a and 20b. The forces pressing against each other with the layer 60E are released, and the water repellent coating portion 81cE and the water repellent coating portion 60cE are separated from each other. That is, the pressing state is released, and the configuration of the suppression structure 78E is changed.

  Further, when the camera module 500E is inserted into the cover and mounted on the mobile phone 100E, as shown in FIG. 62, the lens group is fixed with the fixed portion side of the camera module unit portion 500PrE fixed. Layer 80E is pulled up. Such a change in the configuration of the suppression structure 78E completes a moving mechanism that allows the lens group layer 80E to move within a predetermined range of distances with reference to the fixed portion.

  As described above, in the manufacturing process of the camera module 500E according to the fourth modified example, the occurrence of defects due to the entry of foreign matter or the like is suppressed with a very simple configuration.

  Here, portions having water repellency on both the surface of the fixed portion that faces the movement target portion and the surface of the movement target portion that faces the fixed portion (water repellent coating portions 60cE and 81cE). However, the present invention is not limited to this. For example, a portion having water repellency may be formed on at least one of the surface of the fixed portion that faces the movement target portion and the surface of the movement target portion that faces the fixed portion.

<(3-5) Fifth Modification>
In the manufacturing process of the camera module 500F according to the fifth modification, the portion corresponding to the fixed portion and the portion corresponding to the movement target portion are bonded to each other with a relatively low adhesive force during the dicing step. Intrusion of foreign matter into the internal space is suppressed, and thereafter, the fixed portion and the moving target portion are separated by an external force.

  Here, with respect to the same configuration as the camera module 500E according to the fourth modified example among the camera modules 500F according to the fifth modified example, the same reference numerals are given and the duplicate description is omitted, and the manufacturing process is also duplicated. The description of the parts to be performed is omitted.

  FIG. 63 is a schematic cross-sectional view showing the configuration of a camera module 500F according to the fifth modification. The cross-sectional schematic diagram of the camera module 500F shown in FIG. 63 corresponds to the cross-sectional schematic diagram of the camera module 500E shown in FIG.

  As shown in FIG. 63, the camera module 500F according to the fifth modification is provided with water repellent coating portions 60cE and 81cE provided with double-sided tape, as compared with the camera module 500E according to the fourth modification (FIG. 60). Each of the parts (adhesive tape part) is replaced. By this replacement, the connecting plate 81E and the first parallel spring layer 60E are replaced with the connecting plate 81F and the first parallel spring layer 60F, respectively. In addition, as a double-sided tape used here, the protective tape etc. for dicing whose adhesive force is comparatively low are mentioned.

  And the manufacturing process of the camera module 500F which concerns on a 5th modification is replaced with the process from which the process which concerns on formation of a suppression structure and a change of a form differs compared with the manufacturing process of the camera module 500E which concerns on a 4th modification. It has been done.

  FIG. 64 is a cross-sectional view schematically showing a suppressing structure forming process, focusing on a part of the portion corresponding to one camera module 500F.

  As shown in FIG. 64, in the manufacturing process of the camera module 500F according to the fifth modification, in the joining process in which a plurality of sheets are joined, on the lens group layer sheet on which the plurality of lens group layers 80F are arranged, A plurality of first parallel spring layers 60F are stacked. At this time, by applying a predetermined pressing force, the adhesive tape portion 81pF attached to the portion corresponding to the lens group layer 80F and the adhesive tape portion 60pF attached to the portion corresponding to the first parallel spring layer 60F are bonded. Is set to the applied state (adhesion state).

  In the dicing step, there is almost no gap between the portion corresponding to the first parallel spring layer 60F included in the fixed portion and the portion corresponding to the lens group layer 80F as the movement target portion due to the above-described bonding state. . Therefore, in the dicing process, in each camera module unit portion 500PrF (FIG. 34) of the laminated member U500F (FIG. 34) according to the fifth modification, the adhesive tape portion 81pF and the adhesive tape portion 60pF are used to externally fix the inside of the fixed portion. The suppression structure 78F that suppresses the passage of various objects such as foreign objects to the space is formed.

  FIG. 65 is a diagram schematically showing a step of changing the form of the suppression structure 78F (form changing step) by paying attention to a part of the part corresponding to one camera module 500F.

  After the dicing process, for example, when the camera module 500F is inserted into the cover and mounted on the mobile phone 100F, the fixed part side of the camera module unit part 500PrF is fixed as shown in FIG. In the state, the lens group layer 80F is pulled up. At this time, the adhesive state between the adhesive tape portion 81pF and the adhesive tape portion 60pF is released, and the adhesive tape portion 81pF and the adhesive tape portion 60pF are separated from each other. That is, the bonded state is released, and the shape of the suppression structure 78F is changed. And the movement mechanism in which the lens group layer 80F can move in the distance of the predetermined value range range on the basis of the fixed part is completed by such a change in the form of the suppression structure 78F.

  As described above, according to the manufacturing process of the camera module 500F according to the fifth modified example, occurrence of defects due to intrusion of foreign matters or the like is suppressed with a very simple configuration using adhesion.

  Here, when only the adhesive force between the adhesive tape portion 81pF and the adhesive tape portion 60pF does not sufficiently suppress the passage of various objects such as foreign matters from the outside to the internal space of the fixed portion, the vertical direction The function of the suppression structure 78F may be enhanced by combining the pressing force and the clamping force.

<(3-6) Sixth Modification>
In the manufacturing process of the camera module 500G according to the sixth modification, as in the manufacturing process of the camera module 500A according to the second embodiment, the part corresponding to the fixed part and the part corresponding to the movement target part in the dicing process. Is set to a state in which they are fitted to each other (fitted state), the entry of foreign matter into the internal space is suppressed, and then the fitted state between the fixed portion and the movement target portion is released.

  Here, in the camera module 500G according to the sixth modification, the same configurations as those of the camera module 500A according to the second embodiment are denoted by the same reference numerals, and the duplicate description is omitted, and the manufacturing process is also duplicated. The description of the parts to be performed is omitted.

  FIG. 66 is a schematic cross-sectional view showing a configuration of a camera module 500G according to the sixth modification. The cross-sectional schematic diagram of the camera module 500G shown in FIG. 66 corresponds to the cross-sectional schematic diagram of the camera module 500A shown in FIG.

  As shown in FIG. 66, the camera module 500G according to the sixth modified example is fitted with the lens group layer 80A including the connecting plate 81A, as compared with the camera module 500A according to the second embodiment (FIG. 37). The lens group layer 80G including the connecting plate 81G having a different shape is replaced with the temporarily fixed layer 70A by the temporarily fixed layer 70G having a different shape related to the fitting.

  67 and 68 are diagrams for explaining a fitting state between the connecting plate 81G and the temporary fixing layer 70G and release of the fitting state.

  As shown in FIGS. 67 and 68, the connecting plate 81G has a plurality (six in this case) of rectangular and annular convex portions 81ftA compared to the connecting plate 81A according to the second embodiment. (Annular convex part group) It is substituted by 81ftG. Further, the temporarily fixed layer 70G has a plurality of (in this case, six) rectangular and annular convex portions (annular convex portion group) 70tG as compared with the temporarily fixed layer 70A according to the second embodiment. Has been replaced.

  And in a fitting state, as FIG. 67 shows, the cyclic | annular convex part group 81ftG and the cyclic | annular convex part group 70tG are fitted. Such a fitting state is realized in each camera module unit 500PrG (FIG. 34) by, for example, sandwiching the laminated member U500G (FIG. 34) according to the sixth modification from above and below. And by the structure which the cyclic | annular convex part group 81ftG and the cyclic | annular convex part group 70tG fitted, in a dicing process, passage of various objects, such as a foreign material, with respect to the internal space of a fixing | fixed part from the exterior shown by the thick line arrow of FIG. A suppressing structure (suppressing structure) 78G is formed.

  In addition, as shown in FIG. 68, such a release of the fitted state is realized by separating a portion corresponding to the connecting plate 81G and a portion corresponding to the temporarily fixed layer 70G by an external force or the like. The For example, when the camera module 500G is inserted into the cover and mounted on the mobile phone 100G after the dicing process, the fitting state is released.

  The movement mechanism that allows the lens group layer 80G to move at a distance in a predetermined range with respect to the fixed portion by changing the form of the suppression structure 78G by releasing the fitting state. Completed.

  As described above, according to the manufacturing process of the camera module 500G according to the sixth modified example, the foreign substance to the internal space in the cutting process is suppressed by the suppression structure 78G as in the manufacturing process of the camera module 500A according to the second embodiment. Since the intrusion is suppressed, the occurrence of defects due to the intrusion of foreign matter or the like is easily suppressed.

<(3-7) Other variations>
In the first embodiment, the bonded state is released by heating in the heating box, but the present invention is not limited to this. For example, solder balls are provided on the back surface of the image sensor layer PB, and the wiring in the image sensor layer PB and the wiring (external wiring) arranged on the wiring board are electrically connected by so-called reflow soldering. The bonding state may be released by heating at the time of soldering.

  If such a manufacturing method is adopted, in the process for achieving different purposes such as soldering, the adhesion state related to the restraining structure is released, so that the intrusion of foreign matter without causing an increase in manufacturing cost. Occurrence of defects due to the problem is suppressed.

  In the first embodiment, the temporary fixing layer 70 is configured using a tape whose adhesive force on the upper surface side is reduced in response to heating, but is not limited thereto.

  For example, you may comprise using the tape by which adhesive force is reduced according to irradiation of the light of the wavelength of a predetermined value range. In addition, as a tape whose adhesive force decreases according to the irradiation of ultraviolet rays, for example, SELFA (registered trademark) manufactured by Sekisui Chemical Co., Ltd. may be mentioned.

  When such a configuration is adopted, in the releasing step, the adhesion state is released in accordance with irradiation with light (for example, ultraviolet rays) having a wavelength in a predetermined range. For this reason, generation | occurrence | production of the malfunction resulting from the penetration | invasion of a foreign material etc. is suppressed easily.

  In addition, a thin film of a material (for example, photochromic material) that is reduced in response to irradiation with light having a wavelength in a predetermined range is provided on the substrate to form the movable portions 20a and 20b, and the wavelength in the predetermined range A mode in which the driving force is generated by deforming the free ends 20Ta and 20Tb so as to be displaced upward (+ Z direction) in accordance with the irradiation of the light may be employed.

  As a result, the actuator layer 20 applies a driving force to the lens group layer 80 by irradiation of light when releasing the adhesion state. For this reason, the adhesion state in which the lens group layer 80 is adhered to the fixed portion is released more reliably and in a short time.

  In the case where the temporary fixing layer 70 has an adhesive force that decreases in response to ultraviolet irradiation, in the assembly process, instead of the UV cured layer, a thermosetting adhesive made of a resin that cures in response to application of heat. It is preferable to employ a method in which a layer is provided and bonded by heating. Alternatively, a method (surface activated bonding method) or the like in which each surface to be bonded is irradiated with plasma of an inert gas and the surfaces are bonded together in an activated state (surface activated bonding method) may be employed.

  In addition, in the first and second embodiments and the first to sixth modifications, the movement target portions are the lens group layers 80, 80A to 80C, and 80E to 80G. That is, a configuration in which the fixed unit includes the image sensor IS and the movement target unit includes the lens group layers 80, 80A to 80C, and 80E to 80G as optical systems that guide light from the subject to the image sensor IS. Adopted. However, the configuration is not limited thereto, and other members such as an image sensor may be included in the movement target unit.

  As a specific example, among the camera modules 500, 500A to 500G according to the first and second embodiments and the first to sixth modifications, the lens group layers 80, 80A to 80C, and 80E to 80G are the first casing 200. The remaining part is a moving target part that moves relative to the lens group layers 80, 80A to 80C, and 80E to 80G. That is, a configuration in which the fixed unit includes an optical system for guiding light from the subject to the image sensor and the moving target unit includes the image sensor may be employed. At this time, the movement target part has an internal space in which the elastic parts 41 and 61, the movable parts 20a and 20b, and the optical path are arranged. Therefore, it is sufficient that at least one of the fixed part and the movement target part has an internal space in which various configurations are arranged.

  Further, the movement target unit is not limited to an element constituting the imaging apparatus such as an optical system or an imaging element. For example, the movement target portion may be another member such as an objective lens of an optical pickup lens. That is, the present invention can be applied to a general moving mechanism that includes a fixed portion and a moving target portion that moves relative to the fixed portion.

  In the first and second embodiments and the first to sixth modifications, the actuator layer 20 employs a configuration in which a bimetal is used to realize the function of the actuator. However, the present invention is not limited to this.

  For example, a thin-film actuator element is formed on a substrate made of silicon (Si) or a metal, or an actuator element processed into a foil shape is pasted, thereby realizing the function of the actuator. May be.

  As the actuator element, for example, a piezoelectric element using an inorganic material such as lead zirconate titanate (PZT), a piezoelectric element using an organic material such as polyvinylidene fluoride (PVDF), or a shape memory alloy (SMA) And the like using the element.

  Here, when a piezoelectric element thin film is employed as the actuator element, for example, an electrode thin film, a piezoelectric element thin film, and an electrode thin film are formed in this order on a substrate of a silicon wafer by a sputtering method or the like. Poling is performed and a high voltage is applied.

  Further, when SMA is adopted as the actuator element, for example, an insulating film such as silicon dioxide (silica) on the substrate, a heater thin film made of a metal wiring pattern, and a thin film of the actuator element are formed by sputtering or the like. After the formation, the movable portion is set in a mold having a shape to be memorized, and heated at a predetermined high temperature (for example, about 600 ° C.), thereby performing a shape memory process.

  Needless to say, all or a part of each of the first and second embodiments and the various modifications can be appropriately combined within a consistent range. For example, a configuration in which entry of foreign matter from the outside into the internal space may be adopted by a combination of any two or more structures of the first and second embodiments and the first to sixth modifications.

10, 10A Cover glass layer 20 Actuator layer 20a, 20b Movable part 30 Spacer layer 40 Second parallel spring layer 41, 61 Elastic part 50 Spacing plate layer 60, 60E, 60F First parallel spring layer 60cE, 81cE Water repellent coating part 60pF , 81pF Adhesive tape part 70, 70A, 70G Temporary fixing layer 70B Lower valve layer 70tA, 81ftA Annular convex part 70tB, 81ftB Film-like convex part 70tG, 81ftG Annular convex part group 78, 78A-78C, 78E-78G Inhibition structure 78D film Connecting valve layer 80, 80A to 80C, 80E to 80G Lens group layer 81, 81A to 81C, 81E to 81G Connecting plate 81Ta to 81Td, 81TaA to 81TdA Protruding portion 82 Lens group 100, 100A to 100G Mobile phone 50 , 500A to 500G Camera module 500Pr, 500PrA to 500PrC, 500PrE to 500PrG Camera module unit part IS imaging element PB imaging element layer U10 cover glass layer sheet U20 actuator layer sheet U30 spacer layer sheet U40 second parallel spring layer sheet U50 spacing plate layer Sheet U60 First parallel spring layer sheet U70 Temporarily fixed layer sheet U78C Membrane connection valve layer sheet U80 Lens group layer sheet U500, U500A to U500C, U500E to U500G Laminated member UPB Imaging element layer sheet WB Movement mechanism

Claims (9)

At least one of the reference part and the movement target part has an internal space, the movement target part is supported by a support part provided in the reference part, and the movement target part is based on the reference part. A method of manufacturing a moving mechanism that moves at a distance in a predetermined range,
A forming step of forming a laminated member in which a plurality of unit parts each including the reference part and the movement target part are arranged according to a predetermined rule;
In a state where a suppression structure that suppresses passage of an object from the outside to the internal space is formed between the reference portion and the movement target portion, the laminated member is cut into the unit portion by cutting the laminated member. A cutting process that separates every time,
After the cutting step, the shape changing step of changing the form of the restraining structure so that the moving target part is movable at a distance of the predetermined range with respect to the reference part,
The manufacturing method of the moving mechanism characterized by the above-mentioned. It is a manufacturing method of the movement mechanism according to claim 1,
The suppression structure is
Including a structure formed by bonding the reference portion and the movement target portion;
In the shape change step,
The configuration of the suppression structure is changed by releasing the state where the reference portion and the movement target portion are bonded by at least one of heating and irradiation with light having a wavelength in a predetermined value range. Manufacturing method of the moving mechanism. It is a manufacturing method of the movement mechanism according to claim 2,
The heating is
A method of manufacturing a moving mechanism comprising heating at the time of soldering for electrically connecting an external wiring and a wiring included in the moving mechanism. A method of manufacturing a moving mechanism according to any one of claims 1 to 3,
The suppression structure is
The reference part includes a structure formed by fitting to the movement target part or the movement target part fitting to the reference part,
In the shape change step,
A method of manufacturing a moving mechanism, wherein the configuration of the restraining structure is changed by releasing the fitting state between the reference portion and the moving target portion. A method of manufacturing a moving mechanism according to any one of claims 1 to 4,
The suppression structure is
Flexibility is provided on at least one of the first opposing surface of the reference portion that faces the movement target portion and the second opposing surface of the movement target portion that faces the reference portion. Including a structure formed by pressing the movement target portion relative to the reference portion while the convex portion is elastically deformed,
In the shape change step,
A method of manufacturing a moving mechanism, wherein the configuration of the restraining structure is changed by releasing a force that presses the moving target portion relative to the reference portion. A method of manufacturing a moving mechanism according to any one of claims 1 to 5,
The suppression structure is
A portion having water repellency is formed on at least one of the first facing surface of the reference portion that faces the moving target portion and the second facing surface of the moving portion that faces the reference portion. And a structure formed by bringing the first facing surface and the second facing surface into close proximity or in contact with each other,
In the shape change step,
The manufacturing method of the movement mechanism characterized by changing the form of the said suppression structure by separating the said 1st opposing surface and the said 2nd opposing surface rather than the case of the said cutting process. A method of manufacturing a moving mechanism according to any one of claims 1 to 6,
The suppression structure is
It is configured to include a film-like connecting portion that connects the reference portion and the movement target portion,
In the shape change step,
The movement mechanism characterized by changing the form of the suppression structure by releasing the connection between the reference portion and the movement target portion by the connecting portion by the force separating the reference portion and the movement target portion. Manufacturing method. A method of manufacturing a moving mechanism according to any one of claims 1 to 6,
The suppression structure is
It is configured to include a film-like connecting portion that connects the reference portion and the movement target portion,
In the shape change step,
A method of manufacturing a moving mechanism, wherein the shape of the restraining structure is changed by plastically deforming the connecting portion by a force that separates the reference portion and the moving target portion. A method of manufacturing a moving mechanism according to any one of claims 1 to 8,
The reference unit includes an image sensor, and the movement target unit includes an optical system that guides light from a subject to the image sensor, or the reference unit includes the optical system and the movement target unit includes the optical system. A method for manufacturing a moving mechanism, comprising an image sensor.

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