JP2011115717A - Ultrasonic cleaner - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an ultrasonic cleaner for performing treatment by bringing an ultrasonic oscillating plane close to the surface of the object to be cleaned which improves the uniformity of intensity of ultrasound irradiated to an object to be cleaned, prevents unstable action of an oscillator due to the influence of reflected waves from the object to be cleaned, and suppresses generation of standing waves between a vibrating plane and the object to be cleaned, thereby suppressing the damage of the object to be cleaned and obtaining stable and high cleaning performance. <P>SOLUTION: The ultrasonic cleaner includes a vibration element 120, an ultrasonic wave oscillator 110, a vibration transmitting material 130, and cleaning liquid supply piping 140. In the vibration transmitting material 130, one end thereof is disposed with the vibration element 120 and the other end thereof is disposed with the vibrating plane 131 facing the object W to be cleaned. The vibrating plane 131 is provided with at least two recessed and projected portions, such as minute projections 132, so as to face the object W to be cleaned. The vibrating plane 131 having the recessed and projected portions is brought into contact with cleaning liquid 141 to generate ultrasound. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a cleaning apparatus, and in particular, irradiates ultrasonic vibration to, for example, a substrate for a semiconductor integrated device, a glass substrate for a display device, a substrate for a photomask device, a substrate for an optical disk, a substrate for a magnetic disk, a film substrate, etc. The present invention relates to a technique that is effective when applied to an ultrasonic cleaning apparatus that performs a cleaning process using a prepared liquid.

  Cleaning methods in the manufacturing process of a semiconductor integrated device are roughly classified into batch cleaning and single wafer cleaning. Batch cleaning is a cleaning method in which a plurality of objects to be cleaned are simultaneously immersed in a processing tank in which a cleaning liquid is stored. On the other hand, the single wafer cleaning is a cleaning method in which an object to be cleaned is processed one by one while applying a cleaning liquid. In recent years, with the increase in the size of silicon wafer substrates used for manufacturing, the importance of preventing contamination transfer between objects to be cleaned is increasing, and single wafer cleaning is becoming mainstream.

  FIG. 2 shows an example of the overall configuration of a conventional single wafer ultrasonic cleaning apparatus. The ultrasonic cleaning apparatus includes an ultrasonic oscillator 10, a vibration element 20, a vibration transmission material 30, and a cleaning liquid supply pipe 40. The vibration element case 21 is mounted so as to cover the vibration element 20. The cable 22 is passed through the end of the vibration element case 21, connected to the vibration element 20 at one end, and connected to the ultrasonic oscillator 10 at the other end. The rod-shaped horn-shaped vibration transmission material 30 has one end cut obliquely to form a vibration surface 31 and the other end connected to the vibration element 20. The vibration surface 31 is disposed so as to be opposed to the object to be cleaned W and keep a minute interval. The cleaning liquid supply pipe 40 flows in the cleaning liquid 41 from the side of the vibration surface 31.

  The vibration surface 31 is formed at a position farther from the focal position 32 where the ultrasonic vibration generated by the vibration element 20 converges in the vibration transmitting material 30 in order to increase the uniformity of the ultrasonic intensity. In addition, the vibration surface 31 is connected to the connection surface with the vibration element 20 in order to prevent the vibration element 20 from being affected by a reflected wave from the object to be cleaned W and the operation of the ultrasonic oscillator 10 to become unstable. Are arranged diagonally.

JP 2004-249212 A

  However, the ultrasonic cleaning apparatus having the above-described structure is also insufficient in the uniformity of the ultrasonic intensity applied to the workpiece W. Therefore, in order to prevent the destruction (damage) of the wiring pattern of the article W to be cleaned, it is necessary to suppress the ultrasonic intensity at a position where the ultrasonic intensity is maximum on the vibration surface 31 to a predetermined value or less. In that case, since most of the remaining ultrasonic intensity on the vibration surface 31 becomes insufficient, the cleaning performance deteriorates. Furthermore, since a standing wave is generated between the vibration surface 31 and the workpiece W and the behavior of the standing wave varies depending on the distance, there arises a problem that the cleaning performance is not stable.

  The present invention is an ultrasonic cleaning apparatus that processes the ultrasonic vibration surface as described above close to the surface of the object to be cleaned, and improves the uniformity of the ultrasonic intensity irradiated to the object to be cleaned and from the object to be cleaned. Prevents unstable operation of the oscillator due to the influence of reflected waves, and further suppresses the occurrence of standing waves between the vibration surface and the object to be cleaned, thereby suppressing damage to the object to be cleaned and obtaining stable and high cleaning performance. For the purpose.

  The above and other objects and novel features of the present invention will be apparent from the description of this specification and the accompanying drawings.

  Of the inventions disclosed in the present application, the outline of typical ones will be briefly described as follows.

  That is, the outline of a typical one is an ultrasonic cleaning apparatus including a vibration element (ultrasonic vibration element), an ultrasonic oscillator, a vibration transmission material, and a cleaning liquid supply unit. In particular, the vibration transmitting material has a vibration element at one end, a vibration surface facing the object to be cleaned at the other end, and the vibration surface has at least two uneven portions (projections) toward the object to be cleaned. Is provided. Then, an ultrasonic wave is generated by bringing the vibration surface having an uneven portion into contact with the cleaning liquid.

  Among the inventions disclosed in the present application, effects obtained by typical ones will be briefly described as follows.

  In other words, the effect obtained by a typical device is that in an ultrasonic cleaning apparatus, ultrasonic waves propagated from a vibration element (ultrasonic vibration element) to a vibration surface are diffused by uneven portions (protrusions) and are uniformly distributed on an object to be cleaned. Is emitted. As a result, damage to the object to be cleaned is suppressed, and high cleaning performance is obtained. Also, the ultrasonic waves reflected by the object to be cleaned and reaching the vibration surface are diffused by the concavo-convex portions and attenuated while interfering with each other in the vibration transmitting material or the cleaning liquid. As a result, the operation of the oscillator is stabilized and the generation of standing waves is suppressed, so that the cleaning performance is also stabilized.

It is a figure showing the whole ultrasonic cleaning device composition concerning a 1st embodiment of the present invention. It is a figure which shows the whole structure of the conventional ultrasonic cleaning apparatus. It is a perspective view which shows an example of arrangement | positioning of the microprotrusion in the 1st Embodiment of this invention. It is a perspective view which shows the other example of arrangement | positioning of the microprotrusion in the 1st Embodiment of this invention. It is sectional drawing which shows the process in which the ultrasonic wave is irradiated to to-be-cleaned object in the 1st Embodiment of this invention. In the 1st Embodiment of this invention, it is a graph which shows the sound pressure distribution of the ultrasonic wave irradiated to a to-be-cleaned object. FIG. 4 is a cross-sectional view showing a process of reflecting ultrasonic waves in the first embodiment of the present invention. It is a figure which shows the whole structure of the ultrasonic cleaning apparatus which concerns on the 2nd Embodiment of this invention. In 2nd Embodiment of this invention, it is sectional drawing which shows the process in which an ultrasonic wave is irradiated to a to-be-cleaned object. In the 2nd Embodiment of this invention, it is a graph which shows the sound pressure distribution of the ultrasonic wave irradiated to a to-be-cleaned object. In the 2nd Embodiment of this invention, it is sectional drawing which shows the process in which an ultrasonic wave reflects. It is an expanded sectional view showing an important section of an ultrasonic cleaning device concerning a 3rd embodiment of the present invention. It is an expanded sectional view which shows the principal part of the ultrasonic cleaning apparatus which concerns on the 4th Embodiment of this invention. It is an expanded sectional view showing an important section of an ultrasonic cleaning device concerning a 5th embodiment of the present invention. It is an expanded sectional view showing an important section of an ultrasonic cleaning device concerning a 6th embodiment of the present invention. It is an expanded sectional view which shows the principal part of the ultrasonic cleaning apparatus which concerns on the 7th Embodiment of this invention. It is an expanded sectional view which shows the principal part of the ultrasonic cleaning apparatus which concerns on the 8th Embodiment of this invention. It is an expanded sectional view which shows the principal part of the ultrasonic cleaning apparatus which concerns on the 9th Embodiment of this invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Note that components having the same function are denoted by the same reference symbols throughout the drawings for describing the embodiment, and the repetitive description thereof will be omitted.

<First Embodiment>
An ultrasonic cleaning apparatus according to a first embodiment of the present invention will be described with reference to FIGS. 1 and 3 to 7.

  FIG. 1 is a diagram showing an overall configuration of an ultrasonic cleaning apparatus according to the first embodiment of the present invention. The ultrasonic cleaning apparatus includes an ultrasonic oscillator 110, a vibration element (ultrasonic vibration element) 120, a vibration transmission material 130, and a cleaning liquid supply pipe 140 that is a cleaning liquid supply unit.

  The ultrasonic oscillator 110 supplies a predetermined frequency to the vibration element 120 to vibrate. For example, the ultrasonic oscillator 110 applies an electric signal (high frequency power) having a frequency of 20 kHz or more and a predetermined amplitude to the vibration element 120. When the object to be cleaned W has a fine wiring pattern with a wiring width of less than 100 nm, the optimal frequency is 0.5 MHz to 3 MHz.

  The vibration element 120 is covered with the vibration element case 121. The cable 122 is passed through the end of the vibration element case 121, connected to the vibration element 120 at one end, and connected to the ultrasonic oscillator 110 at the other end. The vibration element 120 expands and contracts when high frequency power is applied from the ultrasonic oscillator 110 and propagates the expansion and contraction vibration to the vibration transmitting material 130.

  The vibration transmission material 130 transmits vibration of the vibration element 120, and is preferably made of a material that has high ultrasonic wave propagation properties, does not cause dust generation due to use deterioration, and does not elute metal components. . In this embodiment mode, quartz glass is used. The shape of the vibration transmitting material 130 is a plate shape, and the thickness t is determined according to the equation (1).

t [m] = nλ _Q / 2 (1)
n: Natural number [-]
λ _Q : Wavelength of ultrasonic wave in quartz glass [m]
For example, when the frequency is 1 MHz, the wavelength λ _Q is about 6 mm, so the thickness t may be a natural number multiple of about 3 mm. The vibration element 120 is connected to the upper surface of the vibration transmitting material 130, and the vibration surface 131 is formed on the lower surface. At this time, since the vibration transmitting material 130 resonates with respect to the vibration of the vibration element 120, the ultrasonic wave can be efficiently propagated.

  The vibration surface 131 is disposed so as to face the object to be cleaned W and keep a minute interval of about several mm. Further, on the vibration surface 131, curved minute protrusions 132 protruding toward the object to be cleaned W are formed at equal pitches as uneven portions provided at least two toward the object to be cleaned W.

  FIG. 3 is a perspective view showing an example of the arrangement of the fine protrusions 132. The microprotrusions 132 are linearly arranged along the y direction in the figure. The y direction in the figure is preferably parallel to the transport direction of the article W to be cleaned. This is because when the object to be cleaned W is conveyed, a water flow in a certain direction is generated in the space (concave portion) between the fine protrusions 132, and the attached bubbles are efficiently discharged.

  FIG. 4 is a perspective view showing another example of the arrangement of the minute protrusions 132. The microprotrusions 132 are arranged in a dotted and regular manner as viewed from the xy plane in the drawing. In this case, it is desirable that the x direction or the y direction in the drawing is parallel to the conveyance direction of the article W to be cleaned.

  The dimensions of the microprojections 132 are preferably determined according to the equations (2) to (4).

{A ² − (λ _L / 2) ² } / λ _L ≦ h (2)
b = (2n−1) λ _L / 4 (3)
s ≦ 2a (4)
a: Half value [m] of width (2a) of minute protrusion 132
λ _L : Wavelength of ultrasonic wave [m] in the cleaning liquid 141
h: Distance from the tip of the microprojection 132 to the workpiece W [m]
b: Height of minute protrusion 132 [m]
n: Natural number [-]
s: space between microprojections 132 [m]
Equation (2) is a condition that promotes the diffusion of ultrasonic waves because the position of the object to be cleaned W is in the far field with respect to the ultrasonic waves that enter the cleaning liquid 141 from the minute protrusions 132. The expression (3) is a condition in which the ultrasonic wave that is vertically reflected from the workpiece W toward the vibration surface 131 side and the ultrasonic wave that is incident vertically from the vibration surface 131 side efficiently interfere with each other. Thereby, the intensity of the ultrasonic wave reflected to the vibration element 120 via the vibration transmitting material 130 can be reduced to some extent. Equation (4) is a condition in which the ultrasonic waves that are perpendicularly incident on the object to be cleaned W from the space (concave portion) between the micro protrusions 132 and the ultrasonic waves that are diffused from the micro protrusions 132 interfere efficiently. For example, when the frequency is 1 MHz, the cleaning liquid 141 is ultrapure water, and the distance h is 3 mm, the width 2a of the microprojection 132 is 4.5 mm or less, the height b is an odd multiple of 0.375 mm, and the space s is 4.5 mm or less. It is.

  The arrangement and dimensions of the microprojections 132 determined according to FIGS. 3 to 4 and formulas (2) to (4) are also applied to microprojections or microdimples in second to ninth embodiments described later. Is possible.

  The cleaning liquid supply pipe 140 supplies the cleaning liquid 141 so that the minute gap between the vibration surface 131 and the workpiece W is satisfied. It is desirable that a gas (gas) of about the saturated dissolution amount is dissolved in the cleaning liquid 141. In the present embodiment, the cleaning liquid 141 is ultrapure water, in which only about 20 ppm of nitrogen gas is dissolved. When ultrasonic waves are incident on the cleaning liquid 141, a part of the gas dissolved in the cleaning liquid 141 is bubbled, so that a cleaning effect for the cleaning target W is exhibited.

  FIG. 5 is a cross-sectional view showing a process in which ultrasonic waves are irradiated from the vibration transmitting material 130 to the object to be cleaned W in the first embodiment. Most of the ultrasonic waves propagating from the vibration element 120 to the vibration surface 131 in the vertical direction are refracted by the minute protrusions 132 and enter the cleaning liquid 141. Therefore, most of the ultrasonic waves incident on the cleaning liquid 141 travel obliquely with respect to the vertical direction. That is, the ultrasonic wave diffuses from the minute protrusion 132 and travels in the cleaning liquid 141. The diffused ultrasonic waves are attenuated while interfering with each other in the cleaning liquid 141. Through the above process, when ultrasonic waves are applied from the cleaning liquid 141 to the cleaning object W, the uniformity of the ultrasonic intensity on the surface of the cleaning object W is improved.

  FIG. 6 is a graph showing the sound pressure P of the ultrasonic wave irradiated to the cleaning object W in the first embodiment. The sound pressure P indicates the amount (pressure amplitude) by which the pressure of the medium (in this case, the cleaning liquid 141) changes due to the irradiation of ultrasonic waves, and is theoretically expressed by equation (5).

_{P [Pa] = (ρ L} c L I) 1/2 (5)
ρ _L : density of the cleaning liquid 141 (= 1000 kg / m ³ )
c _L : Propagation speed of ultrasonic waves in the cleaning liquid 141 (= 1500 m / s)
I: Ultrasonic intensity [W / m ² ]
That is, the uniformity of ultrasonic intensity can be evaluated by measuring the sound pressure distribution. The horizontal axis of the graph indicates the position along the x direction in FIG. 5 on the surface of the workpiece W, and the vertical axis indicates the sound pressure P at that position. The sound pressure distribution is represented by a distribution curve P1 (solid line). The sound pressure distribution is indicated by a distribution curve P0 (dotted line) as a comparative example in which the microprojections 132 are not provided.

  The sound pressure distribution curve P1 according to the first embodiment is flatter than the sound pressure distribution curve P0 according to the comparative example. In the first embodiment, since the ultrasonic waves diffuse and interfere with each other in the cleaning liquid 141, the uniformity is improved. On the other hand, in the comparative example, since the ultrasonic wave travels in the vertical direction without diffusing, it becomes non-uniform due to variation in vibration of the vibration element 120.

  FIG. 7 is a cross-sectional view showing a process in which ultrasonic waves are reflected in the first embodiment. Most of the ultrasonic waves travel obliquely with respect to the vertical direction and enter the cleaning object W. Therefore, most of the ultrasonic waves reflected from the cleaning object W to the cleaning liquid 141 also proceed obliquely with respect to the vertical direction. Therefore, since the incident wave and the reflected wave are not on the same straight line, the occurrence of a standing wave can be suppressed. Further, a part of the reflected wave is reflected and diffused by the minute protrusion 132 and attenuates while interfering with each other in the vibration transmitting material 130 or the cleaning liquid 141. As a result, the intensity of the ultrasonic wave reflected to the vibration element 120 becomes weak, and the operation of the ultrasonic oscillator 110 is not affected.

  According to the first embodiment described above, the ultrasonic wave propagated from the vibration element 120 to the vibration surface 131 is diffused by the fine protrusions 132 and is uniformly emitted to the object to be cleaned W. W damage can be suppressed and high cleaning performance can be obtained. Further, since the ultrasonic waves reflected by the object to be cleaned W and reaching the vibration surface 131 are diffused by the minute protrusions 132 and attenuated while interfering with each other in the vibration transmitting material 130 or the cleaning liquid 141, the ultrasonic oscillator 110. Since the operation of this is stable and the occurrence of standing waves is suppressed, the cleaning performance is also stable.

<Second Embodiment>
An ultrasonic cleaning apparatus according to the second embodiment of the present invention will be described with reference to FIGS.

  FIG. 8 is a diagram showing an overall configuration of an ultrasonic cleaning apparatus according to the second embodiment of the present invention. The ultrasonic cleaning apparatus includes the ultrasonic oscillator 110, the vibration element 120, the vibration element case 121, the cable 122, and the cleaning liquid supply pipe 140, which are the same as those in the first embodiment. The cleaning liquid 141 is ultrapure water in which only about 20 ppm of nitrogen gas is dissolved.

  The vibration transmitting material 130 is made of plate-like quartz glass, and the thickness t is determined according to the equation (1). The vibration element 120 is connected to the upper surface of the vibration transmitting material 130, and the vibration surface 131 is formed on the lower surface. The vibration surface 131 is disposed so as to face the object to be cleaned W and keep a minute interval of about several mm. On the vibration surface 131, curved fine dimples 133 that are depressed toward the vibration element 120 are formed at an equal pitch.

  The minute dimples 133 are arranged in a linear manner as in FIG. 3 or in a dotted manner as in FIG. Further, it is desirable that the size of the minute dimple 133 is determined according to the equations (2) to (4). In this case, a in the equation is a half value of the width of the minute dimple 133, h is a distance from the space (convex portion) between the minute dimples 133 to the object to be cleaned W, b is a depth of the minute dimple 133, and s is a minute dimple. It is replaced with a space between 133.

  FIG. 9 is a cross-sectional view showing a process in which ultrasonic waves are irradiated from the vibration transmitting material 130 to the object to be cleaned W in the second embodiment. Most of the ultrasonic waves propagated in the vertical direction from the vibration element 120 to the vibration surface 131 are refracted by the fine dimples 133 and enter the cleaning liquid 141. In contrast to the first embodiment, most of the ultrasonic waves travel through the cleaning liquid 141 while converging on the central axis of the fine dimples 133.

  FIG. 10 is a graph showing the sound pressure P of the ultrasonic wave irradiated to the cleaning object W in the second embodiment. The horizontal axis of the graph indicates the position along the x direction in FIG. 9 on the surface of the workpiece W, and the vertical axis indicates the sound pressure P at that position. The sound pressure distribution is represented by a distribution curve P2 (solid line). Note that the sound pressure distribution is shown by a distribution curve P0 (dotted line) in the case of not having the minute dimples 133 as a comparative example.

  The sound pressure distribution curve P2 according to the second embodiment has maximum points at equal pitches. The coordinate of the horizontal axis that becomes the maximum corresponds to the position on the central axis of the fine dimple 133 described above. On the other hand, in the comparative example, since the ultrasonic wave travels in the vertical direction without converging, the distribution is caused by variation in vibration of the vibration element 120.

  FIG. 11 is a cross-sectional view showing a process in which ultrasonic waves are reflected in the second embodiment. Since most of the ultrasonic waves converge on the central axis of the minute dimples 133, the ultrasonic waves travel obliquely with respect to the vertical direction and enter the cleaning object W. Therefore, most of the ultrasonic waves reflected from the cleaning object W to the cleaning liquid 141 also proceed obliquely with respect to the vertical direction. Therefore, since the incident wave and the reflected wave are not on the same straight line, the occurrence of a standing wave can be suppressed. Further, a part of this reflected wave is reflected by the minute dimple 133 and converges on the above-mentioned central axis. As a result, the intensity of the ultrasonic wave reflected to the vibration element 120 becomes weak and does not affect the operation of the ultrasonic oscillator 110.

  The second embodiment is applied when it is necessary to obtain a stable and high cleaning performance for an object to be cleaned W that does not have a fine wiring pattern. In this case, it is desirable to scan at least one of the vibration transmitting material 130 and the object W to be cleaned along the surface direction of the vibration surface 131, that is, the x direction in FIG. By scanning, there is an effect that the maximum point of the sound pressure distribution curve P2 shown in FIG.

  In the following third to ninth embodiments, various modifications of the minute protrusion 132 shown in the first embodiment and the minute dimple 133 shown in the second embodiment will be described. Also in the third to ninth embodiments, the same effect as in the first to second embodiments can be obtained.

<Third Embodiment>
FIG. 12 is an enlarged cross-sectional view showing a main part of an ultrasonic cleaning apparatus according to the third embodiment of the present invention. Similar to the first embodiment, on the vibration surface 131, minute protrusions 132 that protrude toward the article to be cleaned W are formed at an equal pitch. The difference from the first embodiment is that the fine protrusion 132 has a sharp apex instead of a curved surface. The minute protrusions 132 are pyramid-shaped or conical protrusions that protrude toward the object to be cleaned W.

  On the other hand, the vibration surface 131 has a minute dimple 133 that is depressed toward the vibration element 120, and the deepest point of the dimple has a flat surface 134.

<Fourth embodiment>
FIG. 13: is an expanded sectional view which shows the principal part of the ultrasonic cleaning apparatus concerning the 4th Embodiment of this invention. Similar to the second embodiment, minute dimples 133 that are depressed toward the vibration element 120 are formed on the vibration surface 131 at an equal pitch. The difference from the second embodiment is that the minute dimples 133 are not curved but have a sharpest deepest point. The minute dimples 133 are pyramid-shaped or conical dimples that are depressed toward the vibration element 120.

  On the other hand, the vibration surface 131 has a minute protrusion 132 protruding toward the object W to be cleaned, and the apex of the protrusion has a flat surface 134.

<Fifth embodiment>
FIG. 14 is an enlarged cross-sectional view showing a main part of an ultrasonic cleaning apparatus according to the fifth embodiment of the present invention. Similar to the first embodiment, curved fine protrusions 132 protruding toward the article W to be cleaned are formed on the vibration surface 131 at an equal pitch. The difference from the first embodiment is that the space (concave portion) between the minute projections 132 is small and has a sharpest deepest point at the same time.

<Sixth Embodiment>
FIG. 15 is an enlarged cross-sectional view showing a main part of an ultrasonic cleaning apparatus according to the sixth embodiment of the present invention. Similar to the second embodiment, minute dimples 133 that are depressed toward the vibration element 120 are formed on the vibration surface 131 at an equal pitch. The difference from the second embodiment is that the space (convex portion) between the minute dimples 133 is small and has a sharp apex at the same time.

<Seventh embodiment>
FIG. 16: is an expanded sectional view which shows the principal part of the ultrasonic cleaning apparatus concerning the 7th Embodiment of this invention. Similar to the third embodiment, fine protrusions 132 having sharp vertices are formed on the vibration surface 131 at an equal pitch. The difference from the third embodiment is that the space (concave portion) between the microprojections 132 is small and has a sharpest deepest point at the same time.

<Eighth Embodiment>
FIG. 17 is an enlarged cross-sectional view showing a main part of the ultrasonic cleaning apparatus according to the eighth embodiment of the present invention. A microprojection 132 similar to that of the first embodiment and a micro dimple 133 similar to that of the second embodiment are simultaneously provided.

<Ninth embodiment>
FIG. 18 is an enlarged cross-sectional view showing a main part of an ultrasonic cleaning apparatus according to the ninth embodiment of the present invention. Similar to the first embodiment, on the vibration surface 131, minute protrusions 132 that protrude toward the article to be cleaned W are formed at an equal pitch. The difference from the first embodiment is that both the fine protrusion 132 and its space (concave portion) have a flat surface.

  As mentioned above, the invention made by the present inventor has been specifically described based on the embodiment. However, the present invention is not limited to the embodiment, and various modifications can be made without departing from the scope of the invention. Needless to say.

  The cleaning apparatus of the present invention, for example, applies a liquid irradiated with ultrasonic vibrations to a substrate for a semiconductor integrated device, a glass substrate for a display device, a substrate for a photomask device, a substrate for an optical disk, a substrate for a magnetic disk, a film substrate, etc. It is effective when applied to an ultrasonic cleaning apparatus that performs a cleaning process.

DESCRIPTION OF SYMBOLS 10 ... Ultrasonic oscillator, 20 ... Vibration element, 21 ... Vibration element case, 22 ... Cable, 30 ... Vibration transmission material, 31 ... Vibrating surface, 32 ... Focus position, 40 ... Cleaning liquid supply piping, 41 ... Cleaning liquid, 110 ... Super Sound wave oscillator, 120 ... vibration element, 121 ... vibration element case, 122 ... cable, 130 ... vibration transmitting material, 131 ... vibration surface, 132 ... minute projection, 133 ... minute dimple, 134 ... flat surface, 140 ... cleaning liquid supply pipe, 141 ... cleaning liquid, W ... object to be cleaned,
P0: Sound pressure distribution curve according to the comparative example, P1: Sound pressure distribution curve according to the first embodiment, P2: Sound pressure distribution curve according to the second embodiment.

Claims (2)

A vibrating element;
An ultrasonic oscillator for applying high-frequency power to the vibrating element to vibrate;
A vibration transmitting material in which the vibration element is disposed at one end and a vibration surface facing the object to be cleaned is disposed at the other end;
A cleaning liquid supply means for supplying a cleaning liquid to the surface of the object to be cleaned, and an ultrasonic cleaning apparatus comprising:
The vibration surface includes at least two uneven portions toward the object to be cleaned,
An ultrasonic cleaning apparatus, wherein an ultrasonic wave is generated by bringing a vibration surface having the uneven portion into contact with a cleaning liquid supplied to a surface of the object to be cleaned. An ultrasonic vibration element, an ultrasonic oscillator that supplies a predetermined frequency to the ultrasonic vibration element, vibrates, a vibration transmission material that transmits vibration of the ultrasonic vibration element, and a cleaning liquid that supplies a cleaning liquid to an object to be cleaned In an ultrasonic cleaning apparatus having a supply means,
The ultrasonic cleaning apparatus according to claim 1, wherein a vibration surface of the vibration transmitting material that irradiates vibration to the cleaning liquid is configured by a plurality of protrusions.

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