JP2011112508A - Pyroelectric infrared detection device - Google Patents

Pyroelectric infrared detection device Download PDF

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JP2011112508A
JP2011112508A JP2009269166A JP2009269166A JP2011112508A JP 2011112508 A JP2011112508 A JP 2011112508A JP 2009269166 A JP2009269166 A JP 2009269166A JP 2009269166 A JP2009269166 A JP 2009269166A JP 2011112508 A JP2011112508 A JP 2011112508A
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pyroelectric
substrate
pyroelectric infrared
temperature change
infrared detector
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Kuniyasu Enoki
邦泰 榎木
Kosaburo Takebe
幸三郎 武部
Satoshi Nakase
智 中瀬
Motoki Tanaka
基樹 田中
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Nippon Ceramic Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To solve a problem that, since mounting members are small in number, and a heat capacity is small relative to a capacity in a pyroelectric infrared detector, when an abrupt temperature change is caused, a heat influence on a pyroelectric element is large, and a drift of an output signal has a limit to the temperature change. <P>SOLUTION: In order to enlarge the heat capacity, to reduce the heat influence on the pyroelectric element even if the abrupt temperature change is caused, and to suppress the drift of the output signal to the temperature change, a two-storied substrate structure having two built-in substrates in the pyroelectric infrared detector is adopted. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、人体検知、照明器具制御等に用いられる焦電型赤外線検出装置に関するものである。   The present invention relates to a pyroelectric infrared detector used for human body detection, lighting fixture control, and the like.

従来の焦電型赤外線検出装置は、図2に示すように、赤外線を受光し、赤外線入射量の変化により電荷を生じる焦電素子と、前述焦電素子より生じた電荷を電圧に変換するFETと、抵抗、オペアンプIC、抵抗及びコンデンサからなる増幅回路が、赤外線透過材を具備した金属缶ケースと電気的接続を成すリード端子を備えたヘッダーにハーメチックされたTO−5型にパッケージされた構成が従来技術として知られている。   As shown in FIG. 2, the conventional pyroelectric infrared detecting device receives infrared rays and generates charges by changing the amount of incident infrared rays, and an FET that converts charges generated from the pyroelectric elements into voltages. And an amplifier circuit composed of a resistor, an operational amplifier IC, a resistor and a capacitor packaged in a TO-5 type hermetically mounted on a header having lead terminals that are electrically connected to a metal can case having an infrared transmitting material. Is known as the prior art.

また、従来の焦電型赤外線装置の内部構造は、片面にコンデンサ等の部品を実装し、もう片面には赤外線を受光し、赤外線入射量の変化により電荷を生じる焦電素子と、焦電素子を支える支持台と、前述焦電素子より生じた電荷を電圧に変換するFETと、抵抗、及びオペアンプICが、具備された表面に導体パターン等を形成した基板が、電気的接続を成すリード端子を備えたヘッダー上面へ機械的に設置されており、前述表面に導体パターン等を形成した基板と電気的接続を成すリード端子を備えたヘッダーとを、AUワイヤーにて電気的に接続している構造となる。   In addition, the internal structure of a conventional pyroelectric infrared device includes a pyroelectric element in which a component such as a capacitor is mounted on one side, infrared rays are received on the other side, and electric charges are generated by a change in the amount of incident infrared rays. A lead terminal that is electrically connected to a substrate on which a conductive pattern is formed on the surface on which a support base that supports the substrate, an FET that converts electric charges generated from the pyroelectric element into a voltage, a resistor, and an operational amplifier IC are provided. It is mechanically installed on the upper surface of the header provided with the AU wire and is electrically connected to the header having a lead terminal for electrical connection with the substrate on which the conductor pattern or the like is formed on the surface. It becomes a structure.

特願2009−12648Japanese Patent Application No. 2009-12648

しかしながら従来技術は、焦電型赤外線検出器内部の容積に対し、実装部材が少なく、熱容量が小さい事から、急激な温度変化が加わった際に、焦電素子が受ける熱影響が大きく、温度変化に対し、出力信号がドリフトしてしまうと云う課題がある。   However, the conventional technology has fewer mounting members than the internal volume of the pyroelectric infrared detector, and the heat capacity is small. Therefore, when a sudden temperature change is applied, the pyroelectric element is greatly affected by heat, and the temperature change On the other hand, there is a problem that the output signal drifts.

図2に示す通り、従来のTO−5型パッケージ焦電型赤外線検出器内部構造は、1つの基板の片面にコンデンサ等の部品を実装し、もう片面には赤外線を受光し、赤外線入射量の変化により電荷を生じる焦電素子と、焦電素子を支える支持台と、前述焦電素子より生じた電荷を電圧に変換するFETと、抵抗、及びオペアンプICをマウントしている。図3に示す、従来のフラットパック型パッケージ焦電型赤外線検出器と比較すると、図2に示す、従来のTO−5型パッケージ焦電型赤外線検出器の急激な温度変化に対する出力信号は、大幅に改善されているが、図4に示す通り、図2に示す、従来のTO−5型パッケージ焦電型赤外線検出器に於いても急激な温度変化に対し、出力信号の安定性が不十分であった。   As shown in FIG. 2, a conventional TO-5 type package pyroelectric infrared detector has an internal structure in which components such as a capacitor are mounted on one side of one substrate, infrared rays are received on the other side, Mounted are a pyroelectric element that generates a charge by change, a support that supports the pyroelectric element, an FET that converts the charge generated by the pyroelectric element into a voltage, a resistor, and an operational amplifier IC. Compared with the conventional flat pack package pyroelectric infrared detector shown in FIG. 3, the output signal for the rapid temperature change of the conventional TO-5 package pyroelectric infrared detector shown in FIG. However, as shown in FIG. 4, the conventional TO-5 type package pyroelectric infrared detector shown in FIG. 2 has insufficient output signal stability against a sudden temperature change. Met.

上記の課題を解決するために本発明は、熱容量を大きくし、急激な温度変化が加わった際に於いても、焦電素子が受ける熱影響を小さく、温度変化に対する出力信号のドリフトを抑制するために、焦電型赤外線検出器内部へ基板を2つ内蔵した2階建て基板構造とすることを特徴としている。   In order to solve the above-described problems, the present invention increases the heat capacity, reduces the thermal effect on the pyroelectric element even when a sudden temperature change is applied, and suppresses the drift of the output signal with respect to the temperature change. Therefore, it is characterized by a two-story substrate structure in which two substrates are built in the pyroelectric infrared detector.

本発明は、焦電型赤外線検出器内部へ、内部配線を形成した基板の片面側にアンプ増幅ゲイン周波数特性を決める為のコンデンサ4点と焦電素子より生じた電荷を電圧に変換するFET及び抵抗と、焦電型赤外線検出装置に印加する電圧を安定させる為のレギュレーター回路と、前記増幅回路及び、前記コンパレーター回路を1パッケージに格納したオペアンプICを搭載し、前述基板の上面に更にもう1つ片面側に赤外線を受光し、赤外線入射量の変化により電荷を生じる焦電素子を実装した内部配線を形成・配置した基板を、赤外線透過材を具備した金属缶ケースと、前記基板との電気的接続を成すリード端子を備えたヘッダーにてハーメチックシールする事で、焦電型赤外線検出器内部に於ける実装部材容積増加、つまりは、焦電型赤外線検出器自身の熱容量を増加させる事が可能であり、外来からの熱変動耐力を有す事で、温度ドリフト性能が向上する。   In the pyroelectric infrared detector, there are four capacitors for determining amplifier amplification gain frequency characteristics on one side of the substrate on which the internal wiring is formed, and an FET for converting the electric charge generated from the pyroelectric element into a voltage, and A resistor and a regulator circuit for stabilizing the voltage applied to the pyroelectric infrared detector, and an operational amplifier IC in which the amplifier circuit and the comparator circuit are housed in one package are mounted. A substrate formed and arranged with an internal wiring on which a pyroelectric element that receives an infrared ray on one side and generates an electric charge due to a change in the amount of incident infrared rays, a metal can case having an infrared transmitting material, and the substrate Hermetically sealing with a header with lead terminals that make electrical connections increases the volume of the mounting member inside the pyroelectric infrared detector, that is, pyroelectric red It is possible to increase the heat capacity of the line detector itself, by having a thermal fluctuation immunity from foreign, improved temperature drift performance.

また、本発明の焦電型赤外線検出装置は、一般的なTO−5型パッケージに格納可能な為、従来の焦電型赤外線検出装置と特異することなく、従来の焦電型赤外線検出装置との置き換え等も容易である。   In addition, since the pyroelectric infrared detector of the present invention can be stored in a general TO-5 type package, the conventional pyroelectric infrared detector and the conventional pyroelectric infrared detector are not different from the conventional pyroelectric infrared detector. It is easy to replace.

本発明の実施例1の焦電型赤外線検出装置を示す分解外観図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is an exploded external view showing a pyroelectric infrared detection device according to a first embodiment of the present invention. 従来のTO−5型パッケージ焦電型赤外線検出装置を示す分解外観図である。It is a disassembled external view which shows the conventional TO-5 type package pyroelectric infrared detection apparatus. 従来のフラットパック型パッケージ焦電型赤外線検出装置を示す分解外観図である。It is a disassembled external view which shows the conventional flat pack type package pyroelectric infrared detection apparatus. 本発明の実施例1の焦電型赤外線検出装置、及び、従来のTO−5型焦電型赤外線検出装置の急激な周囲温度変化時の出力変化を示したグラフである。It is the graph which showed the output change at the time of the rapid ambient temperature change of the pyroelectric infrared detection apparatus of Example 1 of this invention and the conventional TO-5 type pyroelectric infrared detection apparatus.

以下、本発明について図を参照して詳細な説明を行う。
図1は、本発明に関わる焦電型赤外線検出装置の分解外観図である。赤外線を入射透過させるフィルタ材1を具備した金属缶ケース2と、焦電素子3、焦電素子を支える支持台5を形成し、且つ、内部配線を形成した基板9a、また、前述基板9aの下面に、FET8、抵抗7、オペアンプIC6、コンデンサ10、前述基板9aを電気的・機械的に固定させる為の支柱14を搭載した内部配線を形成した基板9b、前記基板との電気的接続を成すリード端子12を備えたヘッダー11により、外来からの環境的変化や、電磁傷害を防止する為にハーメチックシールとした構成となっている。
Hereinafter, the present invention will be described in detail with reference to the drawings.
FIG. 1 is an exploded external view of a pyroelectric infrared detection apparatus according to the present invention. A metal can case 2 having a filter material 1 that allows infrared rays to enter and transmit, a pyroelectric element 3, a substrate 5a that supports the pyroelectric element, and a substrate 9a on which internal wiring is formed. A substrate 9b having an internal wiring on which an FET 8, a resistor 7, an operational amplifier IC6, a capacitor 10, and a support column 14 for electrically and mechanically fixing the substrate 9a are formed on the lower surface, and electrical connection with the substrate are formed. The header 11 provided with the lead terminal 12 has a hermetic seal in order to prevent environmental changes from outside and electromagnetic injuries.

基板9aは、内部配線(図1では、配線が複雑な為、割愛した。)を形成されている薄型基板である。また、焦電素子3は赤外線を受光する電極4を形成しており、この基板9aの片面側には、焦電素子3を支える支持台5を備えて、支持台5上に前記焦電素子を搭載し、導電接着剤等により機械的・電気的接続を行い、赤外線を受光し温度変化により赤外線を受光する電極4から生じた電荷を取り出している。   The substrate 9a is a thin substrate on which internal wiring (in FIG. 1, the wiring is complicated and omitted). The pyroelectric element 3 is formed with an electrode 4 for receiving infrared rays. A support base 5 for supporting the pyroelectric element 3 is provided on one side of the substrate 9a, and the pyroelectric element is provided on the support base 5. And is mechanically and electrically connected by a conductive adhesive or the like to receive infrared rays and take out the electric charges generated from the electrodes 4 that receive the infrared rays due to temperature changes.

また、基板9bへは、電荷を電圧変換として取り出す為のインピーダンス変換用のFET8及び抵抗7を設けて、さらに、焦電型赤外線検出装置に印加する電圧を安定させる為のレギュレーター回路、インピーダンス変換された信号を増幅する為の増幅回路と、増幅回路より取り出した信号出力レベルを基に、検知・非検知を判定する為のコンパレーターを1パッケージとしたオペアンプIC6と前記増幅回路を構成し、アンプ増幅ゲインの周波数特性を決める為のコンデンサ4点10を搭載している。   Further, the substrate 9b is provided with an impedance converting FET 8 and a resistor 7 for taking out electric charges as voltage conversion, and further, a regulator circuit for stabilizing the voltage applied to the pyroelectric infrared detecting device, impedance conversion is performed. The amplifier circuit is composed of an amplifier circuit 6 for amplifying the detected signal, and an operational amplifier IC6 having one comparator for determining detection / non-detection based on the signal output level extracted from the amplifier circuit, and the amplifier Four capacitors 10 for determining the frequency characteristics of the amplification gain are mounted.

尚、基板9bと基板9bへ実装されている電荷を電圧変換として取り出す為のインピーダンス変換用のFET8、抵抗7、焦電型赤外線検出装置に印加する電圧を安定させる為のレギュレーター回路、インピーダンス変換された信号を増幅する為の増幅回路と、増幅回路より取り出した信号出力レベルを基に、検知・非検知を判定する為のコンパレーターを1パッケージとしたオペアンプIC6、前記増幅回路を構成し、アンプ増幅ゲインの周波数特性を決める為のコンデンサ4点10と前記基板9bとの電気的接続を成すリード端子12を備えたヘッダー11は、AUワイヤー13によって、電気的接続を行っている。   It should be noted that the impedance conversion FET8, the resistor 7, and the regulator circuit for stabilizing the voltage applied to the pyroelectric infrared detector for taking out the electric charges mounted on the substrate 9b and the substrate 9b as voltage conversion, impedance conversion An amplifier circuit for amplifying the detected signal, and an operational amplifier IC6 having a comparator for determining detection / non-detection based on the signal output level taken out from the amplifier circuit, and the amplifier circuit. The header 11 provided with the lead terminal 12 that electrically connects the four capacitors 10 for determining the frequency characteristics of the amplification gain and the substrate 9 b is electrically connected by the AU wire 13.

基板9bには、基板9aと基板9bとを電気的・機械的に接続及び固定するための支柱4本14が具備されている。この基板9aと基板9bとを電気的・機械的に接続及び固定するための支柱4本14の上部へ基板9aを装着することで、基板9aの実装位置・高さ・平衡を保っている。   The substrate 9b is provided with four support columns 14 for electrically and mechanically connecting and fixing the substrate 9a and the substrate 9b. The mounting position / height / equilibrium of the substrate 9a is maintained by mounting the substrate 9a on the upper portion of the four columns 14 for electrically and mechanically connecting and fixing the substrate 9a and the substrate 9b.

更には、基板9aと基板9bとを電気的・機械的に接続及び固定するための支柱4本14の内、1本は基板9bへ実装されている電荷を電圧変換として取り出す為のインピーダンス変換用のFET8及び抵抗7と、基板9aへ実装されている焦電素子3とを電気的接続を成している。尚、その他の3本は、シールド性の向上のため、グラウンドとしている。   Furthermore, among the four support posts 14 for electrically and mechanically connecting and fixing the substrate 9a and the substrate 9b, one is for impedance conversion for taking out the electric charge mounted on the substrate 9b as voltage conversion. The FET 8 and the resistor 7 are electrically connected to the pyroelectric element 3 mounted on the substrate 9a. The other three are grounded to improve shielding performance.

上記焦電素子3、焦電素子を支える支持台5を形成し、且つ、内部配線を形成した基板9a、及び、前述基板9aの下面に、FET8、抵抗7、焦電型赤外線検出装置に印加する電圧を安定させる為のレギュレーター回路、インピーダンス変換された信号を増幅する為の増幅回路及び、増幅回路より取り出した信号出力レベルを基に、検知・非検知を判定する為のコンパレーター回路を1パッケージとしたオペアンプIC6、前記増幅回路を構成し、増幅回路の周波数特性を決める為の帰還コンデンサ4点10を搭載した内部配線を形成した基板9bは、金属缶ケース2及び、前述基板9bとの電気的接続を成すリード端子12を備えたヘッダー11にハーメチックシールされる。これらは、一般的なTO−5型パッケージに格納している為、焦電素子の受光電極部へ赤外線を集光させる光学レンズ及び、ミラーのデザイン並びに、使用自由度が格段にアップし、既存製品との置き換え等も可能な構造となる。また、後回路にて制御等を行う接続基板の縮小化にも繋がり、焦電型赤外線検出装置自体の低コスト化及び、小型化が可能な構造となる。さらには、金属缶ケース2及び、前記基板9との電気的接続を成すリード端子12を備えたヘッダー11が、焦電型赤外線検出装置のグランドと接続されており、アースへ接地されている為、外来からの環境的変化や、電磁傷害に対して、シールドされている構造となる。   The pyroelectric element 3, the support base 5 that supports the pyroelectric element, and the substrate 9 a on which the internal wiring is formed, and the lower surface of the substrate 9 a are applied to the FET 8, the resistor 7, and the pyroelectric infrared detector. A regulator circuit for stabilizing the voltage to be output, an amplifier circuit for amplifying the impedance-converted signal, and a comparator circuit for determining detection / non-detection based on the signal output level extracted from the amplifier circuit The substrate 9b on which the packaged operational amplifier IC6, the amplifier circuit, and the internal wiring on which the feedback capacitor 4 points 10 for determining the frequency characteristics of the amplifier circuit are mounted is formed between the metal can case 2 and the substrate 9b. Hermetically sealed to a header 11 having lead terminals 12 for electrical connection. Since these are housed in a general TO-5 type package, the design of optical lenses and mirrors for condensing infrared rays onto the light receiving electrode portion of the pyroelectric element, and the degree of freedom of use are greatly improved. The structure can be replaced with a product. In addition, this leads to a reduction in the size of the connection board that performs control and the like in a later circuit, and the pyroelectric infrared detection device itself can be reduced in cost and size. Furthermore, since the metal can case 2 and the header 11 having the lead terminal 12 that is electrically connected to the substrate 9 are connected to the ground of the pyroelectric infrared detector and are grounded. The structure is shielded against environmental changes from outside and electromagnetic injuries.

図4は本発明の焦電型赤外線検出装置、従来の焦電型赤外線検出装置へ急激な温度変化(約4℃/min.)を与えた場合の出力変化を示したグラフである。図2に示す従来構造では、焦電型赤外線検出器内部構造は、1つの基板を使用していることに対し、図1に示す本発明の焦電型赤外線検出装置は、2つの基板を使用している為、熱容量が大きくなり、急激な温度変化が加わった際に於いても、焦電素子が受ける熱影響を小さくすることが可能となる。よって、図4に見られるように、環境温度変化時の出力信号のドリフトが1/3に改善されている事を確認した。   FIG. 4 is a graph showing an output change when a sudden temperature change (about 4 ° C./min.) Is applied to the pyroelectric infrared detector of the present invention and the conventional pyroelectric infrared detector. In the conventional structure shown in FIG. 2, the internal structure of the pyroelectric infrared detector uses one substrate, whereas the pyroelectric infrared detector of the present invention shown in FIG. 1 uses two substrates. Therefore, the heat capacity is increased, and even when a sudden temperature change is applied, the thermal effect on the pyroelectric element can be reduced. Therefore, as shown in FIG. 4, it was confirmed that the drift of the output signal at the time of environmental temperature change was improved to 1/3.

尚、本実施例の焦電型赤外線検出装置では、赤外線受光電極4を2エレメントデュアルタイプとしているが、種〃の焦電素子サイズ且つ、受光電極パターンにて、赤外線検出回路を構成する事も出来る。また、焦電素子3の受光電極4へ赤外線を集光させる光学系の具備も容易である。これらは、従来の製造技術及び、組立工程から特異することなく構成されている。   In the pyroelectric infrared detection apparatus of this embodiment, the infrared light receiving electrode 4 is a two-element dual type. However, an infrared detection circuit may be configured with various pyroelectric element sizes and light receiving electrode patterns. I can do it. Also, it is easy to provide an optical system for condensing infrared rays onto the light receiving electrode 4 of the pyroelectric element 3. These are configured without any particularity from conventional manufacturing techniques and assembly processes.

1 フィルタ材
2 金属缶ケース
3 焦電素子
4 電極
5 支持台
6 オペアンプIC
7 抵抗
8 FET
9 基板
10 コンデンサ
11 ヘッダー
12 リード端子
13 AUワイヤー
14 支柱
DESCRIPTION OF SYMBOLS 1 Filter material 2 Metal can case 3 Pyroelectric element 4 Electrode 5 Support stand 6 Operational amplifier IC
7 Resistance 8 FET
9 Substrate 10 Capacitor 11 Header 12 Lead terminal 13 AU wire 14 Post

Claims (1)

焦電型赤外線検出装置内部に、表面に導体パターン等を形成した基板を2つ格納した2階建て基板構造を用いることにより、熱アブソーバーとなる部材を配置し、内部部材体積・熱容量を増加させ、赤外線透過材を具備した金属缶ケースと、ヘッダーにより、TO−5型パッケージに格納した事を特徴とする焦電型赤外線検出装置。   By using a two-story substrate structure that contains two substrates with conductive patterns formed on the surface inside the pyroelectric infrared detector, a member that becomes a thermal absorber is placed, increasing the volume and heat capacity of the internal member. A pyroelectric infrared detecting device characterized in that it is stored in a TO-5 type package by a metal can case provided with an infrared transmitting material and a header.
JP2009269166A 2009-11-26 2009-11-26 Pyroelectric infrared detection device Pending JP2011112508A (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099799A1 (en) * 2011-12-28 2013-07-04 パナソニック株式会社 Infrared detector
CN108964624A (en) * 2018-06-14 2018-12-07 吉林大学 A kind of front end circuit of pyroelectric infrared sensor

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537473A (en) * 2002-09-02 2005-12-08 キネティック リミテッド Hermetically sealed
JP2008244178A (en) * 2007-03-27 2008-10-09 Matsushita Electric Works Ltd Element packaging substrate and manufacturing method thereof, and infrared detector

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005537473A (en) * 2002-09-02 2005-12-08 キネティック リミテッド Hermetically sealed
JP2008244178A (en) * 2007-03-27 2008-10-09 Matsushita Electric Works Ltd Element packaging substrate and manufacturing method thereof, and infrared detector

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013099799A1 (en) * 2011-12-28 2013-07-04 パナソニック株式会社 Infrared detector
JP2013137259A (en) * 2011-12-28 2013-07-11 Panasonic Corp Infrared detector
CN108964624A (en) * 2018-06-14 2018-12-07 吉林大学 A kind of front end circuit of pyroelectric infrared sensor

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