JP2011096840A - Mounting apparatus and method for electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting apparatus for mounting semiconductor chips under a minute mounting load. <P>SOLUTION: The mounting apparatus for electronic component provides a mounting head 14 to be driven in the vertical and horizontal directions with a mounting tool 17 is so provided as to move in the vertical directions; an ascending fluid supplying means 24 for activating the compressed fluid for driving the mounting tool in the ascending direction to the mounting head; a descending fluid supplying means 31 for activating the compressed fluid for driving the mounting tool in the descending direction to the mounting head; a self-weight detecting sensor 22 for detecting the self-weight of the mounting tool, when the mounting head is driven in the descending direction, until the front end touches under the condition that the compressed fluid does not activate the mounting tool in the ascending and the descending directions; and a control device 29 for activating a mounting load for mounting a semiconductor chip T to the mounting tool, by controlling the pressure of the compressed fluid, with the descending fluid supplying means under the condition that supply of the compressed fluid is controlled with the ascending fluid supply means so that the self-weight of the mounting tool detected by the self-weight detecting sensor becomes zero. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus and mounting method for mounting an electronic component such as a semiconductor chip on a substrate using a mounting tool.

  For example, a substrate on which a semiconductor chip as an electronic component is mounted is used in a small electronic device such as a mobile phone or an electronic dictionary. Recently, there has been a strong demand for thinning of the above-mentioned small electronic devices, and along with this, the semiconductor chip has become very thin with a size of several tens of microns.

  When mounting a very thin semiconductor chip with a thickness of several tens of microns on a substrate, the mounting load applied to the semiconductor chip must be precise to prevent defects such as chipping and cracking during mounting. Must be controlled. For example, when the thickness of the semiconductor chip is 50 μm, the mounting load applied to the semiconductor chip during mounting is required to be controlled to about 0.1 N (about 10 g).

  Generally, a mounting apparatus for mounting a semiconductor chip has a mounting head. A mounting tool is provided on the mounting head so as to be driven in the vertical direction. When the semiconductor chip is delivered to the lower end of the mounting tool, the semiconductor chip held by the mounting tool is positioned with respect to the substrate by the mounting head. Next, the mounting tool is driven in the downward direction, and the semiconductor chip held at the lower end of the mounting tool is mounted on the substrate.

  The mounting apparatus disclosed in Patent Document 1 can be controlled by switching the mounting load between a low load pressurization of 2 to 3 kg or less and a high load pressurization of 20 to 30 kg. That is, the mounting apparatus includes a first pressurizing unit capable of controlling the pressurization with a low load and a second pressurizing control unit capable of controlling the pressurizing with a high load. A mounting load is applied to the mounting tool.

  In the mounting apparatus, in order to enable pressurization control with a low load, the bonding tool has a self-weight canceling cylinder, and the bonding tool is detected while detecting a load applied to the bonding tool with a load cell provided in the tool holder. By controlling the driving of the Z-axis motor that drives the motor in the downward direction, mounting can be performed with low load pressure.

JP 2009-27105 A

  However, in the above mounting apparatus, although the load applied to the bonding tool is detected by the load cell provided in the tool holder, the bonding tool controls the drive of the Z-axis motor and the semiconductor chip held at the tip of the bonding tool is applied to the substrate. I am trying to implement it.

  Therefore, even if the mounting load is controlled by low load pressurization, as described above, it is in the range of about 2-3 kg, and the thickness is 50 μm depending on the load cell detection accuracy and the Z-axis motor drive accuracy. It is not a configuration that can be mounted on a semiconductor chip of about a degree by controlling the mounting load at around several tens of grams.

  It is an object of the present invention to provide an electronic component mounting apparatus and mounting method that can mount an electronic component such as a very thin semiconductor chip with a low load without causing cracks.

The present invention is a mounting apparatus for mounting electronic components,
A mounting head driven in a vertical direction and a horizontal direction by a driving means;
A mounting tool provided on the mounting head so as to be movable in the vertical direction and holding the electronic component at the lower end;
Ascending fluid supply means for applying a pressure fluid that drives the mounting tool in the ascending direction to the mounting head;
A descending fluid supply means for applying a pressure fluid that drives the mounting tool in the descending direction to the mounting head;
When the mounting head is driven in the downward direction by the driving means and the tip of the mounting tool is brought into contact with the mounting tool in a state where the upward or downward pressure fluid is not acting, A dead weight detection sensor for detecting the dead weight;
The mounting tool is controlled by controlling the pressure fluid pressure by the descending fluid supply means in a state where the supply of the pressure fluid by the rising fluid supply means is controlled so that the weight of the mounting tool detected by the self-weight detection sensor becomes zero. And a control means for applying a mounting load for mounting the electronic component.

The mounting head is a cylinder, and the mounting tool is provided in the cylinder so as to be movable in the vertical direction, and has a piston that separates the internal space of the cylinder into a lower chamber and an upper chamber,
The ascending fluid supply means is provided in a middle portion of the first pressure fluid supply pipe connected to the lower chamber and the first pressure fluid supply pipe, and controls supply and discharge of the pressure fluid to the lower chamber. Constituted by a first electropneumatic regulator;
The descending fluid supply means is provided in a middle portion of the second pressure fluid supply pipe connected to the upper chamber and the second pressure fluid supply pipe, and controls supply and discharge of the pressure fluid to the upper chamber. A second electropneumatic regulator,
Preferably, the control means controls supply and discharge of pressure fluid to and from the upper chamber and the lower chamber by the first electropneumatic regulator and the second electropneumatic regulator.

The present invention is a mounting method in which a mounting tool is movably provided in a mounting head driven in the vertical direction and the horizontal direction, and an electronic component held on the lower end of the mounting head is mounted.
Supplying a pressure fluid that drives the mounting tool in the upward direction to the mounting head;
Supplying a pressure fluid that drives the mounting tool in a downward direction to the mounting head;
When the mounting tool is not supplied with pressure fluid in the upward and downward directions, the mounting head is driven in the downward direction, and the tip of the mounting tool is brought into contact with the weight detection sensor to detect the weight of the mounting tool. And a process of
In a state in which the weight of the mounting tool detected by the self-weight detection sensor is zeroed by applying a fluid pressure that drives the mounting tool in a downward direction with the tip of the mounting tool in contact with the self-weight detection sensor. And a step of applying a mounting load for mounting the electronic component on the mounting tool by controlling the pressure of the pressure fluid that drives the mounting tool in the downward direction.

The present invention is a mounting apparatus for mounting electronic components,
A mounting head driven in a vertical direction and a horizontal direction by a driving means;
A mounting tool provided on the mounting head so as to be movable in the vertical direction and holding the electronic component at the lower end;
Ascending fluid supply means for supplying pressure fluid for driving the mounting tool in the ascending direction to the mounting head;
Position detecting means for detecting a rising position of the mounting tool with respect to the mounting head;
A descending fluid supply means for supplying a pressure fluid for driving the mounting tool in the descending direction to the mounting head;
A pressure fluid corresponding to a mounting load for mounting the electronic component by the descending fluid supply means is supplied from the ascending fluid supply means in a state in which the pressure fluid that reduces the weight acting below the mounting tool is zero. And a control means for mounting the electronic component.
When the mounting tool is lifted by the pressure fluid supplied from the rising fluid supply means, the relationship between the change of the pressure fluid and the rising position of the mounting tool detected by the position detection means is below the mounting tool. An electronic component mounting apparatus is characterized in that the pressure of a pressure fluid with which the acting weight is zero is detected.

The mounting head is a cylinder with an open bottom, and the mounting tool is provided in the cylinder so as to be movable in the vertical direction, and has a rod that forms a space in the cylinder.
The ascending fluid supply means has a first electropneumatic device that has one end connected to the space portion and the other end connected to a decompression pump, and controls negative pressure in the space portion that is decompressed by the decompression pump in the middle portion. Having a suction tube with a regulator,
Preferably, the descending fluid supply means has a supply pipe having one end connected to the space portion and a second electropneumatic regulator provided in the middle portion for controlling the supply of the pressure fluid to the space portion.

The present invention is a mounting method in which a mounting tool is movably provided in a mounting head driven in the vertical direction and the horizontal direction, and an electronic component held on the lower end of the mounting head is mounted.
Supplying a pressure fluid that drives the mounting tool in the upward direction to the mounting head;
Detecting the rising position of the mounting tool relative to the mounting head;
Supplying a pressure fluid that drives the mounting tool in a downward direction to the mounting head;
Supplying a pressure fluid that raises the mounting tool, and detecting the pressure of the pressure fluid with a weight of zero acting below the mounting tool from the relationship between the change in the pressure fluid and the rising position of the mounting tool; ,
The electronic component is mounted by applying a pressure fluid corresponding to a mounting load for mounting the electronic component to the mounting tool in a state in which the pressure fluid that acts under the mounting tool to zero is supplied to the cylinder. An electronic component mounting method comprising the steps of:

  According to the present invention, since the mounting pressure that is not affected by the weight of the mounting tool can be applied to the electronic component by controlling the pressure of the fluid, the electronic component can be mounted with a very small mounting load of, for example, several tens of grams. Can be implemented.

The block diagram which shows the mounting apparatus of 1st Embodiment of this invention. The graph which measured the relationship between the pressure which cancels the weight of a mounting tool, and the weight of the mounting tool which a weight detection sensor detects. (A) is explanatory drawing which showed the process of measuring the dead weight of a mounting tool, (b) is explanatory drawing which showed the process of mounting the semiconductor chip hold | maintained at the mounting tool with the optimal mounting load. The block diagram which abbreviate | omits and shows the mounting apparatus of 2nd Embodiment of this invention. The graph which showed the relationship between the negative pressure made to act on the space part of a mounting head, and the gap which a gap sensor detects.

  Embodiments of the present invention will be described below with reference to the drawings.

  1 to 3 show a first embodiment of the present invention. The mounting apparatus shown in FIG. An X rail 2 is provided on the base 1 along the X direction indicated by an arrow in FIG. An X movable body 3 is provided on the X rail 2 so as to be driven in the X direction by an X drive source (not shown).

  A pair of upper and lower Y rails 4 are provided on the front end surface of the X movable body 3 along a direction perpendicular to the X direction with respect to the horizontal direction. A pair of receiving members 6 provided on the back surface of the vertical side 5a of the support 5 having an angled side surface is movably engaged with the Y rail 4.

  The support 5 is driven in the Y direction along the Y rail 4 by a Y drive source (not shown). That is, the support 5 can be driven and positioned in the X direction and the Y direction.

  On the inner surface of the vertical side 5a of the support 5, a pair of Z rails 7 (only one shown) spaced in parallel with the Y direction are provided along the Z direction which is the vertical direction. A receiving member 10 provided on one side surface of the Z movable body 8 is movably engaged with the Z rail 7.

  A Z pulse motor 11 is provided on the upper surface of the horizontal side 5 b of the support 5. The rotation shaft 11a of the Z pulse motor 11 projects to the lower surface side of the horizontal side 5b, and a screw shaft 12 is connected to the tip thereof.

  The screw shaft 12 is screwed into a nut body 13 provided on the side surface of the Z movable body 8. Therefore, when the Z pulse motor 11 is driven, the Z movable body 8 is driven in the Z direction (indicated by an arrow) that is the vertical direction along the Z rail 7.

  A mounting head 14 is attached to the lower end surface of the Z movable body 8 via a connecting member 8a. The mounting head 14 has a hollow cylinder shape, and a piston 15 is housed therein so as to be movable in a fluid-tight state. Thereby, the internal space of the mounting head 14 is separated into a lower chamber 15 a and an upper chamber 15 b by the piston 15.

  The upper end of the rod 16 is connected to the lower surface of the piston 15. The rod 16 protrudes from the lower end surface of the mounting head 14 in a fluid-tight state, and a mounting tool 17 is provided at the tip thereof.

  A suction hole (both not shown) that is connected to a suction pump to generate a suction force is formed in the tip surface of the mounting tool 17 as an electronic component that is delivered by a delivery tool (not shown) by the suction force. For example, a semiconductor chip T having a thickness of about 50 μm can be sucked and held.

  The semiconductor chip T held on the tip surface of the mounting tool 17 is mounted on the substrate 19 mounted on the mounting table 18 by a mounting load controlled to several tens of grams as will be described later. A self-weight measurement table 21 is provided on the side of the placement table 18 in the X direction. A self-weight detection sensor 22 such as a load cell for detecting the self-weight of the mounting tool 17 including the weight of the piston 15 and the rod 16 is provided on the upper surface of the self-weight measurement table 21.

  Ascending fluid supply means 24 for controlling the supply of pressurized gas for urging the mounting tool 17 in the upward direction is connected to the lower chamber 15a of the mounting head 14. The rising fluid supply means 24 has a first air supply pipe 25 as a first pressure fluid supply pipe having one end connected to the lower chamber 15a. The first air supply pipe 25 is provided with a first electropneumatic regulator 26 in the middle, and the other end is connected to an air supply source 27 that supplies compressed air.

  The first electropneumatic regulator 26 is electrically connected to a first setting unit 28 that sets the pressure of the gas supplied to the lower chamber 15a. The first setting unit 28 is controlled by the control device 29. Thereby, the pressure of the gas supplied to the lower chamber 15a is controlled.

  A descending fluid supply means 31 for controlling the supply of pressurized gas for urging the mounting tool 17 in the descending direction is connected to the upper chamber 15b of the mounting head 14. The descending fluid supply means 31 has a second air supply pipe 32 as a second pressure fluid supply pipe having one end connected to the upper chamber 15b. The second air supply pipe 32 is provided with a second electropneumatic regulator 33 in the middle, and the other end is connected to the air supply source 27 for supplying compressed air.

  The second electropneumatic regulator 33 is electrically connected to a second setting unit 34 that sets the pressure of the gas supplied to the upper chamber 15b. The second setting unit 34 is controlled by the control device 29. Thereby, the pressure of the gas supplied to the upper chamber 15b is controlled.

  The first and second electropneumatic regulators 26 and 33 are controlled by the control device 29 via the first and second setting units 28 and 34, so that the lower chamber 15a and the upper chamber 15b In addition to controlling the pressure of the gas supplied to the gas, the gas supplied to the lower chamber 15a and the upper chamber 15b can be discharged.

  That is, when supplying gas to one of the lower chamber 15a and the upper chamber 15b, the other chamber can be communicated with the atmosphere. Thereby, the piston 15 in the mounting head 14 can be moved in the upward direction or the downward direction.

  The driving of the Z pulse motor 11 is controlled by the control device 29, and a detection signal of the self-weight detection sensor 22 is output to the control device 29.

  Next, a case where the semiconductor chip T supplied and held on the front end surface of the mounting tool 17 by the mounting apparatus having the above configuration is mounted on the substrate 19 will be described.

  First, before mounting the semiconductor chip T on the substrate 19, the weight of the mounting tool 17 (including the weight of the piston 15 and the rod 16) is detected. That is, the self-weight measurement of the mounting tool 17 is positioned above the self-weight measurement table 21 in a state where the mounting tool 17 does not hold the semiconductor chip T.

  Next, no gas is supplied to the lower chamber 15a and the upper chamber 15b of the mounting head 14, and the chambers 15a and 15b communicate with the atmosphere through the first and second electropneumatic regulators 26 and 33, that is, In a state where the mounting tool 17 is movable in the vertical direction, the Z pulse motor 11 is operated to drive the mounting head 14 in the downward direction. This state is shown in FIG.

  When the mounting head 14 is lowered, the front end surface of the mounting tool 17 interlocked with the mounting head 14 comes into contact with the self-weight detecting sensor 22 provided on the self-weight measuring table 21, so that the self-weight detecting sensor 22 detects the self-weight of the mounting tool 17. Is done.

  If the weight of the mounting tool 17 is detected, gas is supplied to the lower chamber 15a of the mounting head 14 through the first air supply pipe 25, and the pressure thereof is controlled by the control device 29 via the first setting unit 28. By gradually controlling the electro-pneumatic regulator 26, it is gradually increased.

  The curve A in FIG. 2 shows the relationship between the pressure of the gas supplied to the lower chamber 15a and time, and the curve B is a mounting tool detected by the self-weight detection sensor 22 in accordance with the change in the pressure of the gas supplied to the lower chamber 15a. The change of the weight of 17 and the relationship of time are shown.

  As can be seen from the curves A and B in the figure, as the pressure of the gas supplied to the lower chamber 15a increases, the weight of the mounting tool 17 detected by the self-weight detection sensor 22 decreases. Then, the pressure of the gas supplied to the lower chamber 15a becomes constant at time t, and the weight acting on the lower side in the vertical direction of the mounting tool 17 detected by the own weight detection sensor 22 becomes zero. That is, the weight of the mounting tool 17 is canceled. The pressure at this time is n1.

  The pressure n1 of the gas supplied to the lower chamber 15a of the mounting head 14 when the weight of the mounting tool 17 becomes zero is output from the weight detection sensor 22 to the control device 29, and the control device 29 is illustrated. Not stored in the storage unit.

  If the pressure n1 applied to the lower chamber 15a of the mounting head 14 is detected in order to cancel the weight of the mounting tool 17, the semiconductor chip T has a minute mounting load, for example, 0.1 N (about 10 grams). When mounting with a mounting load, the gas pressure applied by the descending fluid supply means 31 to the upper chamber 15b of the mounting tool 17 is calculated by an arithmetic processing unit (not shown) provided in the control device 29. The pressure at this time is defined as a mounting pressure (load) n2. The mounting load n2 is indicated by an arrow in FIG.

  When the pressures n1 and n2 are obtained in this way, the mounting head 14 is positioned at the transfer position of the semiconductor chip T, and the semiconductor chip T is received by the transfer tool (not shown) on the tip surface of the mounting tool 17 there. Passed.

  When the mounting tool 17 receives the semiconductor chip T, the mounting head 14 is positioned above the mounting table 18 on which the substrate 19 is mounted. Next, the Z pulse motor 11 is driven by the control device 29 to drive the mounting head 14 in the downward direction, and the semiconductor chip T held at the tip of the mounting tool 17 hits the substrate 19.

  At this time, the mounting tool 17 is displaced upward without applying a mounting load to the semiconductor chip T because the weight of the mounting tool 17 is canceled by the gas of the pressure n1 supplied to the lower chamber 15a of the mounting head 14.

  When the mounting head 14 is lowered by a predetermined distance and the semiconductor chip T comes into contact with the substrate 19, the second electropneumatic regulator 33 of the descending fluid supply means 31 is driven by the control device 29, as shown in FIG. As shown, a gas having a pressure corresponding to the mounting load n2 is supplied to the upper chamber 15b of the mounting head.

  As a result, the mounting tool 17 is pressed downward with a gas having a pressure corresponding to the mounting load n2, and the semiconductor chip T provided at the tip of the mounting tool 17 is mounted on the substrate 19 with the mounting load n2, that is, several tens of times. Will be implemented with a pressure of grams.

  Even if the semiconductor chip T is very thin, for example, about 50 μm, the semiconductor chip T is not damaged or chipped by the pressure of the mounting load n2, so that the semiconductor chip T is securely attached to the substrate 19. It can be implemented.

  Hereinafter, when the semiconductor chip T having the same thickness is mounted using the same mounting apparatus, the pressure n1 and the mounting load n2 at which the weight of the mounting tool 17 is canceled are the same value. Mounting may be repeated without obtaining n1 and n2.

  As described above, according to the mounting device having the above-described configuration, the mounting load necessary for mounting the semiconductor chip T held by the mounting tool 17 in a state where the load n1 for canceling the weight of the mounting tool 17 is applied. n2 is given to the mounting tool 17.

  The pressure n1 for canceling the weight of the mounting tool 17 can be precisely controlled by the rising fluid supply means 24, and the mounting load n2 applied to the mounting tool 17 can be precisely controlled by the falling fluid supply means 31.

  Therefore, when the semiconductor chip T is thin and has a thickness of several tens of μm, and it is necessary to set the mounting load n2 for mounting the semiconductor chip T to a very small value, the mounting load n2 is precisely set to the above semiconductor The chip T can be mounted. That is, a thin semiconductor chip T of several tens of μm can be reliably mounted without causing cracks or chips.

  4 and 5 show a mounting apparatus according to a second embodiment of the present invention. In this embodiment, the mounting head 14A is a cylinder whose lower end is open as shown in FIG. 4, and the mounting tool 17A is provided on a rod 41 movably provided on the mounting head 14A and on the lower end of the rod 41. The semiconductor chip T is composed of a suction portion 42 and is held by suction by the lower end surface of the suction portion 42.

  Inside the mounting head 14A, a space 43 is formed on the upper end side of the rod 41. In the space 43, the fluid pressure is controlled by the ascending fluid supply means 24A and the descending fluid supply means 31A, and the mounting tool 17A. Can be driven in the upward and downward directions.

  In this embodiment, the drive mechanism for driving the mounting head 14A in the X and Y directions is omitted, but the drive mechanism has the same configuration as that shown in FIG. 1 of the first embodiment. Is used.

  The rising fluid supply means 24 </ b> A has a suction pipe 44 having one end connected to the space 43, and the other end of the suction pipe 44 is connected to a decompression pump 45. A decompression electropneumatic regulator 26A is provided in the middle of the suction pipe 44, and the decompression electropneumatic regulator 26A is electrically connected to the control device 29 via the first setting unit 28.

  Accordingly, the control device 29 can set the suction force (negative pressure) acting on the space portion 43 by controlling the pressure reducing electropneumatic regulator 26A. When the space 43 has a negative pressure, the rod 41 rises in the mounting head 14A according to the pressure.

  A gap sensor 46 is provided at the lower end portion of the rod 41 as position detecting means for detecting the rising position of the mounting tool 17A that rises with the rod 41 with reference to the lower end surface of the mounting head 14A. The raised position of the mounting tool 17A detected by the gap sensor 46 is output to the control device 29.

  The gap sensor 46 can measure the position of the mounting tool 17A with respect to the mounting head 14A. For example, after the mounting tool 17A is moved down by the Z pulse motor 11 and the semiconductor chip T held by the suction unit 42 contacts the substrate 19, the position where the suction unit 42 of the mounting tool 17A contacts the substrate 19 It is possible to measure how much the semiconductor chip T is pressed against the substrate 19, that is, how much load is applied.

  Further, the position of the mounting tool 17A where the dead weight is canceled, that is, the gaps (G1 to G0) detected by the gap sensor 46 can also be determined.

  The descending fluid supply means 31A has one end connected to the space 43 and the other end connected to the air supply source 27, and a pressurized fluid supply pipe 47 provided with a pressurizing electropneumatic regulator 33A in the middle. Have

  The driving of the pressurizing electropneumatic regulator 33 </ b> A is controlled by the control device 29 via the second setting unit 34. When the pressurizing electropneumatic regulator 33A is controlled to supply a gas of a predetermined pressure to the space 43, the rod urged in the upward direction to a predetermined height by the negative pressure by the upward fluid supply means 24A. 41 can be lowered by a distance corresponding to the predetermined pressure.

  In the mounting apparatus having the above configuration, first, as shown by a curve D in FIG. 5, a change in the negative pressure acting on the space 43 by the rising fluid supply means 24A and a gap detected by the gap sensor 46, that is, the mounting tool 17A. Find the relationship with the ascending position.

  When the negative pressure acting on the space 43 is gradually increased (depressurized) from 0 in the same figure, the rod 41 moves up, and the gap detected by the gap sensor 46 decreases. When the gap detected by the gap sensor 46 is G1 to G0, that is, when the gap sensor 46 hits the lower end surface of the mounting head 14A and becomes zero, even if the negative pressure acting on the space 43 is increased thereafter, the gap sensor 46 The gap detected by is constant at G0 and does not decrease any further.

  If the negative pressure applied to the space 43 when the gap detected by the gap sensor 46 is constant at G0 is −n1, the negative pressure −n1 is applied to the space 43, thereby the rod 41 The weight of the mounting tool 17A including is zero, that is, the weight of the mounting tool 17A is cancelled.

  Therefore, after the mounting head 14A is positioned on the substrate 19 in a state in which the negative pressure of -n1 is applied to the space 43 and the mounting tool 17A is lifted together with the rod 41, the mounting head 14A is lowered while the mounting head 14A is lowered. A gas having a positive pressure corresponding to the mounting load n2 for mounting the semiconductor chip T having a thickness of several tens of μm on the part 43 is applied by the descending fluid supply means 31A.

  When the mounting load n2 is applied to the space portion 43 to which the negative pressure of −n1 is applied, the mounting tool 17A is lowered by the mounting load n2, so that the semiconductor chip T held on the lower end surface of the mounting tool 17A is several tens of times. The semiconductor chip T having a thickness of μm can be mounted with a mounting load n2 without damaging it.

  That is, also in the second embodiment, the mounting load n2 for mounting the very thin and fragile semiconductor chip T held on the lower end surface of the mounting tool 17A is canceled with the weight of the mounting tool 17A being canceled. The pressure is set by the pressure of the gas supplied to the space 43 of the mounting head 14A.

  Therefore, the semiconductor chip T can be mounted with a small mounting load n2 that does not cause cracks or chipping, for example, a mounting load n2 of several tens of grams.

  Further, since the position of the mounting head 14A and the suction portion 42 of the mounting tool 17A can be measured by the gap sensor 46, if the semiconductor chip T held by the suction portion 42 comes into contact with the substrate 19, the measurement is performed by the gap sensor 46. Since the gap is reduced, the control device 29 can know that the semiconductor chip T has contacted the substrate 19.

  Then, from the point of time when the semiconductor chip T contacts the substrate 19, it is known how much the gap detected by the gap sensor 46 can be reduced to apply a mounting load of several tens of grams suitable for the semiconductor chip T. be able to. Usually, when the thickness of the semiconductor chip T is about 50 μm, in order to apply a mounting load of several tens of grams to the semiconductor chip T, the gap is set to 0.1 to 0 from the time when the semiconductor chip T contacts the substrate 19. It will be about 2 mm smaller.

  Thus, if the gap sensor 46 is provided, the gap (G0 to G1) in which the weight of the mounting tool 17A is canceled is measured and confirmed by the control device 29, and a mounting load is applied based on the confirmation, The semiconductor chip T can be mounted without being cracked or chipped.

  The present invention is not limited to the above-described embodiments. For example, in the first embodiment, the mounting head and the mounting tool, and the rising fluid supply means and the descending fluid supply means are configured as shown in the second embodiment. In the second embodiment, the mounting head and the mounting tool, and the rising fluid supply means and the descending fluid supply means may be configured as shown in the first embodiment.

  DESCRIPTION OF SYMBOLS 14,14A ... Mounting head, 17, 17A ... Mounting tool, 19 ... Board | substrate, 22 ... Self-weight detection sensor, 24 ... Ascending fluid supply means, 25 ... 1st air supply pipe (1st pressure fluid supply pipe), 26 ... 1st electropneumatic regulator, 26A ... electropneumatic regulator for pressure reduction, 28 ... 1st setting part, 29 ... control apparatus, 31 ... descending fluid supply means, 32 ... 2nd air supply pipe (2nd pressure fluid supply pipe) ), 33... Second electropneumatic regulator, 33A... Pressurizing electropneumatic regulator, 34... Second setting section, 43... Space section, 44. means).

Claims (6)

A mounting device for mounting electronic components,
A mounting head driven in a vertical direction and a horizontal direction by a driving means;
A mounting tool provided on the mounting head so as to be movable in the vertical direction and holding the electronic component at the lower end;
Ascending fluid supply means for applying a pressure fluid that drives the mounting tool in the ascending direction to the mounting head;
A descending fluid supply means for applying a pressure fluid that drives the mounting tool in the descending direction to the mounting head;
When the mounting head is driven in the downward direction by the driving means and the tip of the mounting tool is brought into contact with the mounting tool in a state where the upward or downward pressure fluid is not acting, A dead weight detection sensor for detecting the dead weight;
The mounting tool is controlled by controlling the pressure fluid pressure by the descending fluid supply means in a state where the supply of the pressure fluid by the rising fluid supply means is controlled so that the weight of the mounting tool detected by the self-weight detection sensor becomes zero. And a control means for applying a mounting load for mounting the electronic component to the electronic component mounting apparatus. The mounting head is a cylinder, and the mounting tool is provided in the cylinder so as to be movable in the vertical direction, and has a piston that separates the internal space of the cylinder into a lower chamber and an upper chamber,
The ascending fluid supply means is provided in a middle portion of the first pressure fluid supply pipe connected to the lower chamber and the first pressure fluid supply pipe, and controls supply and discharge of the pressure fluid to the lower chamber. Constituted by a first electropneumatic regulator;
The descending fluid supply means is provided in a middle portion of the second pressure fluid supply pipe connected to the upper chamber and the second pressure fluid supply pipe, and controls supply and discharge of the pressure fluid to the upper chamber. A second electropneumatic regulator,
2. The electronic component mounting according to claim 1, wherein the control means controls supply and discharge of pressure fluid to and from the upper chamber and the lower chamber by the first electropneumatic regulator and the second electropneumatic regulator. apparatus. A mounting method in which a mounting tool is movably moved in a vertical direction on a mounting head driven in the vertical direction and the horizontal direction, and an electronic component held on the lower end of the mounting head is mounted.
Supplying a pressure fluid that drives the mounting tool in the upward direction to the mounting head;
Supplying a pressure fluid that drives the mounting tool in a downward direction to the mounting head;
When the mounting tool is not supplied with pressure fluid in the upward and downward directions, the mounting head is driven in the downward direction, and the tip of the mounting tool is brought into contact with the weight detection sensor to detect the weight of the mounting tool. And a process of
In a state in which the weight of the mounting tool detected by the self-weight detection sensor is zeroed by applying a fluid pressure that drives the mounting tool in a downward direction with the tip of the mounting tool in contact with the self-weight detection sensor. And a step of controlling the pressure of the pressure fluid that drives the mounting tool in the downward direction to apply a mounting load for mounting the electronic component on the mounting tool. A mounting device for mounting electronic components,
A mounting head driven in a vertical direction and a horizontal direction by a driving means;
A mounting tool provided on the mounting head so as to be movable in the vertical direction and holding the electronic component at the lower end;
Ascending fluid supply means for supplying pressure fluid for driving the mounting tool in the ascending direction to the mounting head;
Position detecting means for detecting a rising position of the mounting tool with respect to the mounting head;
A descending fluid supply means for supplying a pressure fluid for driving the mounting tool in the descending direction to the mounting head;
A pressure fluid corresponding to a mounting load for mounting the electronic component by the descending fluid supply means is supplied from the ascending fluid supply means in a state in which the pressure fluid that reduces the weight acting below the mounting tool is zero. And a control means for mounting the electronic component.
When the mounting tool is lifted by the pressure fluid supplied from the rising fluid supply means, the relationship between the change of the pressure fluid and the rising position of the mounting tool detected by the position detection means is below the mounting tool. An apparatus for mounting an electronic component, wherein the pressure of a pressure fluid with zero acting weight is detected. The mounting head is a cylinder with an open bottom, and the mounting tool is provided in the cylinder so as to be movable in the vertical direction, and has a rod that forms a space in the cylinder.
The ascending fluid supply means has a first electropneumatic device that has one end connected to the space portion and the other end connected to a decompression pump, and controls negative pressure in the space portion that is decompressed by the decompression pump in the middle portion. Having a suction tube with a regulator,
The descending fluid supply means includes a supply pipe having one end connected to the space and a second electropneumatic regulator provided in the middle for controlling the supply of pressure fluid to the space. Item 5. The electronic component mounting apparatus according to Item 4. A mounting method in which a mounting tool is movably moved in a vertical direction on a mounting head driven in the vertical direction and the horizontal direction, and an electronic component held on the lower end of the mounting head is mounted.
Supplying a pressure fluid that drives the mounting tool in the upward direction to the mounting head;
Detecting the rising position of the mounting tool relative to the mounting head;
Supplying a pressure fluid that drives the mounting tool in a downward direction to the mounting head;
Supplying a pressure fluid that raises the mounting tool, and detecting the pressure of the pressure fluid with a weight of zero acting below the mounting tool from the relationship between the change in the pressure fluid and the rising position of the mounting tool; ,
The electronic component is mounted by applying a pressure fluid corresponding to a mounting load for mounting the electronic component to the mounting tool in a state in which the pressure fluid that acts under the mounting tool to zero is supplied to the cylinder. An electronic component mounting method comprising the steps of:

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