JP2011093034A5 - - Google Patents

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Publication number
JP2011093034A5
JP2011093034A5 JP2009248459A JP2009248459A JP2011093034A5 JP 2011093034 A5 JP2011093034 A5 JP 2011093034A5 JP 2009248459 A JP2009248459 A JP 2009248459A JP 2009248459 A JP2009248459 A JP 2009248459A JP 2011093034 A5 JP2011093034 A5 JP 2011093034A5
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JP
Japan
Prior art keywords
foreign matter
receiving plate
matter receiving
protrude
provided over
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JP2009248459A
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English (en)
Japanese (ja)
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JP5504471B2 (ja
JP2011093034A (ja
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Priority to JP2009248459A priority Critical patent/JP5504471B2/ja
Priority claimed from JP2009248459A external-priority patent/JP5504471B2/ja
Publication of JP2011093034A publication Critical patent/JP2011093034A/ja
Publication of JP2011093034A5 publication Critical patent/JP2011093034A5/ja
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Publication of JP5504471B2 publication Critical patent/JP5504471B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2009248459A 2009-10-29 2009-10-29 ワイヤソーの異物除去装置 Expired - Fee Related JP5504471B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2009248459A JP5504471B2 (ja) 2009-10-29 2009-10-29 ワイヤソーの異物除去装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2009248459A JP5504471B2 (ja) 2009-10-29 2009-10-29 ワイヤソーの異物除去装置

Publications (3)

Publication Number Publication Date
JP2011093034A JP2011093034A (ja) 2011-05-12
JP2011093034A5 true JP2011093034A5 (enrdf_load_stackoverflow) 2012-12-06
JP5504471B2 JP5504471B2 (ja) 2014-05-28

Family

ID=44110527

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009248459A Expired - Fee Related JP5504471B2 (ja) 2009-10-29 2009-10-29 ワイヤソーの異物除去装置

Country Status (1)

Country Link
JP (1) JP5504471B2 (enrdf_load_stackoverflow)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6455294B2 (ja) * 2015-04-22 2019-01-23 信越半導体株式会社 ワイヤソー装置

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09193142A (ja) * 1996-01-19 1997-07-29 Mitsubishi Materials Corp ワイヤ式切断加工装置
JPH10202495A (ja) * 1997-01-13 1998-08-04 Mitsubishi Materials Corp 樋付きワイヤ式切断加工装置
US6941940B1 (en) * 2000-05-31 2005-09-13 Memc Electronic Materials, S.P.A. Wire saw and process for slicing multiple semiconductor ingots

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