JP5504471B2 - ワイヤソーの異物除去装置 - Google Patents
ワイヤソーの異物除去装置 Download PDFInfo
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- JP5504471B2 JP5504471B2 JP2009248459A JP2009248459A JP5504471B2 JP 5504471 B2 JP5504471 B2 JP 5504471B2 JP 2009248459 A JP2009248459 A JP 2009248459A JP 2009248459 A JP2009248459 A JP 2009248459A JP 5504471 B2 JP5504471 B2 JP 5504471B2
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- 239000000463 material Substances 0.000 claims description 41
- 239000007788 liquid Substances 0.000 claims description 34
- 238000003754 machining Methods 0.000 claims description 28
- 238000005192 partition Methods 0.000 claims description 26
- 230000004888 barrier function Effects 0.000 claims description 13
- 239000012530 fluid Substances 0.000 claims description 7
- 239000006061 abrasive grain Substances 0.000 description 4
- 239000012634 fragment Substances 0.000 description 4
- 239000000126 substance Substances 0.000 description 3
- 239000000110 cooling liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000004804 winding Methods 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
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- 238000003672 processing method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
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Images
Landscapes
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Description
2 ワイヤ
3 受け部材
4 加工台
5 ダミー部材
6 加工物
7 ワイヤソー支持プレート
8 前壁
9 後壁
10 取付片
11 切欠溝
12 固定片
13 ピン
14 取付片
15 貫通孔
16 固定片
17 ネジ
18 上壁
19 加工台テーブル
20 金網
21 切欠部
22 異物受け板
23 小障壁
24 仕切板
25 加工液ノズル
26 加工液ノズル
27 傾斜板
28 加工液
29 異物
Claims (3)
- 複数の溝ローラー間にて張設されたワイヤ列に対して上方から加工物を下降させながらワイヤ列の切断部に押し付けて切断するワイヤソーの異物除去装置であって、前記ワイヤ列の下方に切断後の加工物が収納される受け部材を設け、前記溝ローラーと受け部材の側板との間に溝ローラーから受け部材に向けて下向き傾斜した異物受け板を設け、前記異物受け板の表面に突出するとともに千鳥状に配置された小障壁を、異物受け板の傾斜面全体に亘って複数設け、ワイヤに対して上方から異物受け板及び/又は受け部材に向かって加工液を吹き付けるようにしたことを特徴とするワイヤソーの異物除去装置。
- 加工液ノズルを前記ワイヤ列を介して異物受け板と対向する上部位置に設けるとともに、前記加工液ノズルの下方に加工液を前記受け部材側に向けて流出するようにした傾斜板をワイヤ列と接触しない程度に近接した位置に設けたことを特徴とする請求項1に記載のワイヤソーの異物除去装置。
- 複数列の加工物を切断する際に、前記受け部材の加工物間に位置する仕切板を設けたことを特徴とする請求項1又は2に記載のワイヤソーの異物除去装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009248459A JP5504471B2 (ja) | 2009-10-29 | 2009-10-29 | ワイヤソーの異物除去装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009248459A JP5504471B2 (ja) | 2009-10-29 | 2009-10-29 | ワイヤソーの異物除去装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2011093034A JP2011093034A (ja) | 2011-05-12 |
JP2011093034A5 JP2011093034A5 (ja) | 2012-12-06 |
JP5504471B2 true JP5504471B2 (ja) | 2014-05-28 |
Family
ID=44110527
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009248459A Expired - Fee Related JP5504471B2 (ja) | 2009-10-29 | 2009-10-29 | ワイヤソーの異物除去装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5504471B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6455294B2 (ja) * | 2015-04-22 | 2019-01-23 | 信越半導体株式会社 | ワイヤソー装置 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09193142A (ja) * | 1996-01-19 | 1997-07-29 | Mitsubishi Materials Corp | ワイヤ式切断加工装置 |
JPH10202495A (ja) * | 1997-01-13 | 1998-08-04 | Mitsubishi Materials Corp | 樋付きワイヤ式切断加工装置 |
DE60033574T2 (de) * | 2000-05-31 | 2007-11-15 | Memc Electronic Materials S.P.A. | Drahtsäge und verfahren zum gleichzeitigen schneiden von halbleiterbarren |
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2009
- 2009-10-29 JP JP2009248459A patent/JP5504471B2/ja not_active Expired - Fee Related
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JP2011093034A (ja) | 2011-05-12 |
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