JP2011086905A - Laser assembly - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser assembly of high efficiency which is not complicated in a structure of an optical system so that fewer man-hours are required for assembling and adjusting, and condenses a laser beam emitted from a semiconductor laser light source. <P>SOLUTION: The laser assembly includes a plurality of laser subassemblies 100A, 100B and 100C. The laser subassembly 100A includes a semiconductor laser light source 101A, a first lens group 103A and a second lens group 105A. The first lens group condenses a light at a predetermined position on an optical axis, in a plane containing the optical axis and the fast axis of the semiconductor laser light source; the second lens group condenses a light at the predetermined position, in a plane containing the optical axis and a slow axis of the semiconductor laser light source. The optical axes of the plurality of laser subassemblies are arranged in a radial pattern with the predetermined position as a center, in the plane containing the fast axis of the semiconductor laser light source of the plurality of laser subassemblies. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a laser assembly for condensing laser light emitted from a semiconductor laser light source.

  High-power semiconductor lasers are used in various industrial fields.

  The output beam of the semiconductor laser has a divergence angle in a direction perpendicular to the semiconductor junction of the emitter (fast axis direction) larger than a divergence angle in a direction parallel to the semiconductor junction of the emitter (slow axis direction). As a result, the cross section of the output beam of the semiconductor laser becomes an ellipse. For this reason, when the output beam is used, an optical system for shaping the cross section is required. Since such an optical system is required, it is not easy to combine a plurality of output beams emitted from a plurality of semiconductor lasers in order to increase the output.

  15 and 16 are diagrams showing a configuration of a conventional laser assembly for combining a plurality of output beams emitted from a plurality of semiconductor lasers (Patent Document 1). FIG. 15 is a diagram showing a cross section including the fast axis of the semiconductor laser (fast axis cross section), and FIG. 16 is a diagram showing a cross section including the slow axis of the semiconductor laser (slow axis cross section).

  The laser assembly includes three semiconductor laser light sources 201A, 201B and 201C, three first lenses 203A, 203B and 203C, three second lenses 205A, 205B and 205C and a condenser lens 207. The laser light emitted from the semiconductor laser light source 201A is collimated in the fast axis section by the first lens 203A, and the path is maintained without being influenced in the slow axis section. The laser light that has passed through the first lens 203A is collimated in the slow axis section by the second lens 205A, and the path is maintained without being affected in the fast axis section. The laser light that has passed through the second lens 205 </ b> A is collimated in the fast axis cross section and the slow axis cross section, and is collected by the condenser lens 207 at the position of the end face of the optical fiber 221. Similarly, the light emitted from the semiconductor laser light sources 201B and 201C is condensed at the position of the end face of the optical fiber 221, and thus the laser light emitted from the three semiconductor laser light sources 201A, 201B, and 201C is transmitted through the optical fiber 221. Combined.

  FIG. 17 is a diagram showing cross-sectional shapes of laser beams at various positions in a conventional laser assembly. FIG. 17A is a diagram showing a cross-sectional shape of the laser beam after passing through the first lens 203A. The cross section of the laser beam has a shape elongated in the fast axis direction. FIG. 17B is a diagram showing a cross-sectional shape of the laser beam after passing through the second lens 205A. The cross section of the laser beam has a shape elongated in the slow axis direction. Since the laser beam is collimated in the fast axis section by the first lens 203A, the width in the fast axis direction of the laser beam section is maintained after passing through the first lens 203A. On the other hand, the width in the slow axis direction of the cross section of the laser beam increases after passing through the first lens 203A. FIG. 17C is a diagram showing the cross-sectional shape of the laser beam after passing through the condenser lens 207. The cross-sectional shape shown in FIG. 17B is a shape in which three pieces are stacked in the fast axis direction. Since the laser beam is collimated in the slow-axis cross section by the second lens 205A, the width of the cross section of the laser beam in both axial directions is maintained after passing through the second lens 205A. As shown in FIG. 17C, beams having substantially the same size in both axial directions in the cross section are formed by overlapping the cross sections elongated in the slow axis direction in the fast axis direction. The beam having the cross-sectional shape shown in FIG. 17C is condensed at the position of the end face of the optical fiber 221 by the condenser lens 207, and thus from the three semiconductor laser light sources 201A, 201B and 201C. The emitted laser light is coupled in the optical fiber 221.

  However, in the above laser assembly, for example, light that has passed through the first lenses 203A, 203B, and 203C is not completely collimated by diffraction in the fast axis cross section, but diffuses at a predetermined angle. Since the optical path lengths from the first lenses 203A, 203B and 203C to the condenser lens 207 are different, the spot diameter of the beam from the first lens 203A is the largest at the position of the condenser lens 207, and the beam from the first lens 203C The spot diameter is the smallest. As a result, for example, the numerical apertures required for focusing on the optical fiber 221 are uneven for each beam, resulting in waste. In addition, the optical system becomes complicated, and man-hours required for assembly and adjustment increase.

  On the other hand, a laser assembly that equalizes the optical path length from each semiconductor laser to the condensing point has been developed in the prior art (Patent Document 2). However, this laser assembly also performs collimation on the fast-axis cross-section and the slow-axis cross-section in the same manner as the above-described laser assembly. Compared with the above-described laser assembly, the optical system becomes more complicated, and assembly and More man-hours are required for adjustment.

  Thus, a laser assembly for condensing laser light emitted from a semiconductor laser light source, which is highly efficient, has a complicated optical system configuration, and requires less man-hours for assembly and adjustment. Was not developed.

US2008 / 0291955A1 JP 2008-311655 A

  Accordingly, there is a need for a laser assembly that collects laser light emitted from a semiconductor laser light source, has high efficiency, does not have a complicated optical system configuration, and requires less man-hours for assembly and adjustment. There is.

  A laser assembly according to the present invention is a laser assembly that focuses laser light at a predetermined position, and includes a plurality of laser subassemblies. Each laser subassembly includes a semiconductor laser light source, a first lens group, and a second lens group. Using the direction of light perpendicularly incident on both the first lens group and the second lens group as the optical axis of each laser subassembly, the first lens group uses the laser light emitted from the semiconductor laser light source. The second lens group focuses the laser light emitted from the semiconductor laser light source in a plane including the optical axis and the fast axis of the semiconductor laser light source. The light is condensed at the predetermined position on the optical axis in a plane including the optical axis and the slow axis of the semiconductor laser light source. The optical axis of the plurality of laser subassemblies includes the fast axis of the semiconductor laser light source of the plurality of laser subassemblies so that the plurality of laser subassemblies focus laser light at the predetermined location. In the plane, they are arranged radially around the predetermined position.

  In the laser assembly according to the present invention, the first lens group condenses the laser beam at a predetermined position on the optical axis in a cross section including the optical axis of the optical system and the fast axis of the semiconductor laser light source. The second lens group condenses the laser light at the predetermined position on the optical axis in a cross section including the optical axis of the optical system and the slow axis of the semiconductor laser light source. Since the emitter size of the cross section including the fast axis of the semiconductor laser light source is smaller than the emitter size of the cross section including the slow axis, the numerical aperture on the condensing side in the cross section including the optical axis and the fast axis of the optical system is sufficient. The optical axes of the plurality of laser subassemblies are arranged radially about the predetermined position in a plane including the optical axis and the fast axis of the semiconductor laser light source. The laser beam of the laser subassembly can be focused on the predetermined position.

  A laser assembly according to an embodiment of the present invention includes a housing and a plurality of plates attached to the housing, each of the plurality of plates including a semiconductor laser light source, a first lens group, and the like. And a second lens group to form a laser subassembly, wherein the housing and the plurality of plates are configured to position and attach the plurality of plates to the housing.

  According to the present embodiment, the optical system is adjusted when the laser subassembly is formed by attaching the semiconductor laser light source, the first lens group, and the second lens group on the plate. By positioning and attaching the laser subassembly adjusted to the above to the housing, the laser assembly can be efficiently manufactured.

  The laser assembly according to an embodiment of the present invention further includes a common heat sink in contact with the plurality of semiconductor laser light sources.

  According to this embodiment, the heat generated by the plurality of semiconductor laser light sources can be efficiently removed by the common heat sink in contact with the plurality of semiconductor laser light sources.

1 is a slow-axis cross-sectional view of a semiconductor laser light source of an optical system of a laser subassembly according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of a plurality of laser subassembly optics according to an embodiment of the present invention in a cross section perpendicular to the cross section of FIG. 1. FIG. 3 is a cross-sectional view of a plurality of laser subassembly optical systems according to another embodiment of the present invention in a cross section perpendicular to the cross section of FIG. 1. It is a figure for demonstrating the geometrical relationship of the optical system in a fast-axis cross section and a slow-axis cross section. It is a figure which shows the relationship between the optical system in the slow-axis cross section, and the taking-in angle (theta) of the optical fiber 121. FIG. It is a figure which shows the relationship between the optical system in the fast-axis cross section, and the taking-in angle (theta) of the optical fiber. It is a figure which shows the cross-sectional shape of the laser beam in the various positions of a laser assembly. 1 is a side view of a laser subassembly according to one embodiment of the invention. FIG. 1 is a plan view of a laser subassembly according to an embodiment of the invention. FIG. It is a figure which shows the unit attached to the unit assembly apparatus. It is a figure which shows the unit of the laser subassembly attached to a housing. It is a figure which shows the housing provided with the positioning guide for positioning a unit. It is a figure which shows the housing before mounting | wearing with a heat sink. It is a figure which shows the housing | casing equipped with one type of heat sink. It is a figure which shows the housing | casing which mounted | wore with the other type of heat sink. It is a figure which shows the structure of the conventional laser assembly which couple | bonds several output beams inject | emitted from several semiconductor lasers. It is a figure which shows the structure of the conventional laser assembly which couple | bonds several output beams inject | emitted from several semiconductor lasers. It is a figure which shows the shape of the cross section of the laser beam in the various positions of the conventional laser assembly.

  FIG. 1 is a cross-sectional view of an optical system of a laser subassembly 100 according to an embodiment of the present invention, including a slow axis of a semiconductor laser light source. The laser subassembly 100 includes a semiconductor laser light source 101, a first lens 103, and a second lens 105. Here, the direction of light perpendicularly incident on both the first lens and the second lens is defined as the optical axis of each laser subassembly. In FIG. 1, the optical axis is indicated by a one-dot chain line. Note that the first lens and the second lens may be a lens group including a plurality of lenses.

  In the slow axis cross section, the path of the laser light emitted from the semiconductor laser light source 101 is maintained as it is when passing through the first lens 103. In other words, the optical surface of the first lens 103 is flat in the slow axis section of the semiconductor laser light source. The laser light that has passed through the first lens 103 is condensed at a predetermined position on the optical axis by the second lens 105. In FIG. 1, the end of the optical fiber 121 is disposed at a predetermined position, and the laser light enters the optical fiber 121.

  2A is a cross-sectional view of the optical system of the three laser subassemblies 100A, 100B, and 100C according to the present embodiment in a cross section perpendicular to the cross section of FIG. The cross section of FIG. 2 includes the fast and optical axes of three laser subassemblies 100A, 100B and 100C. The three laser subassemblies 100A, 100B, and 100C are radially arranged such that the three optical axes intersect at a predetermined position where the end of the optical fiber 121 is disposed.

  For example, the laser light emitted from the semiconductor laser light source 101A is condensed at the predetermined position on the optical axis by the first lens 103A. The path of the laser light that has passed through the first lens 103A is maintained as it is when it passes through the second lens 105A. In other words, the optical surface of the second lens 105A is flat in the fast axis cross section of the semiconductor laser light source.

  Therefore, the laser light emitted from the semiconductor laser light sources 101A, 100B, and 100C is condensed at the predetermined position where the end of the optical fiber 121 is disposed, and enters the optical fiber 121. In this manner, the laser beams emitted from the semiconductor laser light sources 101A, 100B, and 100C are combined in the optical fiber 121.

遅軸断面のエミッタのサイズ（光軸からの高さ）ｈ_１は、速軸断面のエミッタのサイズ（光軸からの高さ）ｈ_１よりも大きい。したがって、遅軸断面の場合のｈ_１に基づいて光学系が設計される。速軸断面の場合のｈ_１は、遅軸断面の場合のｈ_１よりも小さいので集光側の開口数ＮＡ_２を十分に小さくすることができる。 FIG. 3 is a diagram for explaining the geometrical relationship of the optical system in the fast axis cross section and the slow axis cross section. The emitter size of the semiconductor laser 101 (height from the optical axis) is h ₁ , the cross-sectional radius of the optical fiber 121 is h ₂ , the distance from the light emitting surface of the semiconductor laser 101 to the lens is L ₁ , and the lens to the optical fiber 121 is The distance to the end surface is L ₂ and the effective diameter of the lens is D. The numerical aperture on the light source side is NA ₁ , and the numerical aperture on the light collecting side is NA ₂ . The lens in FIG. 3 is the second lens 105 in the case of the slow axis cross section, and the first lens 103 in the case of the fast axis cross section. From the geometric relationship, the following equation holds.

H ₁ (the height from the optical axis) emitter size of the slow axis cross section is greater than h ₁ (the height from the optical axis) emitter sizes of the fast-axis slice. Therefore, the optical system is designed based on h ₁ in the case of the slow axis cross section. Since h _{1 in} the case of the fast axis section is smaller than h _{1 in} the case of the slow axis section, the numerical aperture NA ₂ on the condensing side can be made sufficiently small.

Specifically, NA ₁ of the fast axis cross section is 0.3 to 0.9, and NA ₂ is 0.002 to 0.25. NA _{1 of the} slow axis cross section is 0.05 to 0.3, and NA ₂ is 0.05 to 0.5.

FIG. 4 is a diagram showing the relationship between the optical system and the capture angle θ of the optical fiber 121 in the slow axis cross section. The optical system is designed so that the numerical aperture NA ₂ on the condensing side is matched with the take-in angle θ of the optical fiber 121.

FIG. 5 is a diagram showing the relationship between the optical system and the capture angle θ of the optical fiber 121 in the fast axis cross section. The condensing side numerical aperture NA ₂ is smaller than the capture angle θ of the optical fiber 121. Therefore, as shown in FIG. 2A, in the fast axis cross section, the three laser subassemblies 100A, 100B, and 100C are arranged at predetermined positions where the three optical axes are disposed at the end of the optical fiber 121. The laser beams from the three laser subassemblies 100 </ b> A, 100 </ b> B, and 100 </ b> C can be taken into the optical fiber 121 and coupled to each other by arranging them radially.

  FIG. 6 is a diagram showing cross-sectional shapes of laser beams at various positions of the laser assemblies 100A, 100B, and 100C. FIG. 6A is a diagram showing a cross-sectional shape of the laser beam after passing through the first lenses 103A, 103B, and 103C. The cross-sectional shape of the laser beam is elongated in the fast axis direction, similar to when emitted from the semiconductor laser light sources 101A, 101B, and 101C. FIG. 6B is a diagram illustrating a cross-sectional shape of the laser beam after passing through the second lenses 105A, 105B, and 105C. The cross-sectional shape of the laser beam is elongated in the slow axis direction. For example, after passing through the first lens 103A, the laser beam is narrowed by the power of the first lens 103A in the fast axis cross section. On the other hand, after passing through the first lens 103A, the laser beam diffuses without being affected by the power of the first lens 103A in the slow axis cross section. Therefore, at the position of the second lens 105A, compared to the shape shown in FIG. 6A, the shape becomes narrower in the fast axis direction and wider in the slow axis direction. FIG. 6C is a diagram showing a cross-sectional shape of the laser beam at the end of the optical fiber 121. The laser beam is condensed at the end of the optical fiber 121 by the second lens 105A so as to have a substantially circular cross-sectional shape. The three laser beams are focused on the end cross section of the optical fiber 121.

  In the present embodiment, since the optical path lengths of the laser beams emitted from the semiconductor laser light sources 101A, 100B, and 100C and reaching the end of the optical fiber 121 are equal, the numerical aperture required for focusing on the optical fiber 121 Are equal for each beam and no waste occurs.

  Embodiments and configurations of the optical system of the laser assembly according to the present invention will be described below.

Example 1
The laser assembly of Example 1 was described using FIGS. 1 and 2A.

Table 1 is a table showing the surface spacing of the optical elements, the refractive index of the lens, and the Abbe number of the lens of the laser subassembly 100 of Example 1. In Table 1 and other tables, the unit of length is millimeter. In Table 1, the first surface (surface with surface number 1, the same applies hereinafter) represents the radiation surface of the light source 101. The second surface and the third surface represent the entrance surface and the exit surface of the first lens 103, respectively. The fourth surface and the fifth surface represent the entrance surface and the exit surface of the second lens 105, respectively. The sixth surface represents the end surface of the optical fiber 121. The distance between the first surfaces refers to the distance between the first surface and the second surface. The same applies to other aspects.

ここで、ｋは２次曲線の形状を定める定数、ｃは中心曲率、Ｒは中心曲率半径である。また、α_2iは補正係数である。 The optical surface (the second surface on the light source side and the third surface on the image side) of the first lens 103 can be expressed by the following equations, where the fast axis direction is the x-axis direction and the slow axis direction is the y-axis direction.

Here, k is a constant that determines the shape of the quadratic curve, c is the central curvature, and R is the central curvature radius. Α _2i is a correction coefficient.

Table 2 is a table | surface which shows the coefficient and constant of the type | formula showing a 2nd surface and a 3rd surface.

ここで、ｋは２次曲線の形状を定める定数、ｃは中心曲率、Ｒは中心曲率半径である。また、α_2iは補正係数である。 The optical surface (the fourth surface on the light source side and the fifth surface on the image side) of the second lens 105 can be expressed by the following equations, where the fast axis direction is the x-axis direction and the slow axis direction is the y-axis direction.

Here, k is a constant that determines the shape of the quadratic curve, c is the central curvature, and R is the central curvature radius. Α _2i is a correction coefficient.

Table 3 is a table showing the coefficients and constants of the expressions representing the fourth surface and the fifth surface.

Example 2
The laser assembly according to the second embodiment includes five laser subassemblies 100A, 100B100C, 100D, and 100E.

  For example, the laser subassembly 1000A includes a semiconductor laser light source 1010A, a first lens group including a first lens 1031A and a second lens 1033A, and a second lens including a third lens 1051A and a fourth lens 1053A. Including groups.

  2B is a cross-sectional view including the fast axis of the semiconductor laser light source of the laser assembly of Example 2. FIG.

Table 4 is a table showing the surface spacing of the optical elements, the refractive index of the lens, and the Abbe number of the lens of the laser subassembly of Example 2. In Table 2, the first surface (surface with surface number 1, the same applies hereinafter) represents the radiation surface of the light source 1010A, for example. The second surface and the third surface represent, for example, the entrance surface and the exit surface of the first lens 1031A, respectively. The fourth surface and the fifth surface represent, for example, the entrance surface and the exit surface of the second lens 1033A, respectively. The tenth surface represents the end surface of the optical fiber 1211. The distance between the first surfaces refers to the distance between the first surface and the second surface. The same applies to other aspects.

ここで、ｋは２次曲線の形状を定める定数、ｃは中心曲率、Ｒは中心曲率半径である。また、α_2iは補正係数である。 With the fast axis direction as the x-axis direction and the slow axis direction as the y-axis direction, the optical surfaces (second to fifth surfaces) of the first and second lenses (first lens group) can be expressed by the following equations.

Here, k is a constant that determines the shape of the quadratic curve, c is the central curvature, and R is the central curvature radius. Α _2i is a correction coefficient.

Table 5 is a table showing the coefficients and constants of the expressions representing the second to fifth surfaces.

ここで、ｋは２次曲線の形状を定める定数、ｃは中心曲率、Ｒは中心曲率半径である。また、α_2iは補正係数である。 With the fast axis direction as the x-axis direction and the slow axis direction as the y-axis direction, the optical surfaces (sixth to ninth surfaces on the light source side) of the third and fourth lenses (second lens group) can be expressed by the following equations.

Here, k is a constant that determines the shape of the quadratic curve, c is the central curvature, and R is the central curvature radius. Α _2i is a correction coefficient.

Table 6 is a table showing the coefficients and constants of the expressions representing the sixth to ninth surfaces.

Laser Assembly Configuration FIG. 7 is a side view of a laser subassembly 100 according to one embodiment of the invention.

  FIG. 8 is a plan view of the laser subassembly 100 according to the present embodiment.

  In the present embodiment, an optical system including the semiconductor laser light source 101, the first lens 103, and the second lens 105 is disposed on the plate 107. 7 and 8, the optical axis is indicated by a one-dot chain line. The plate 107 and the optical system are referred to as a unit. That is, in this embodiment, the laser subassembly 100 is formed by a unit. The semiconductor laser light source 101 is installed on the side surface of the block 1011 installed on the plate 107.

  FIG. 9 is a diagram illustrating a unit attached to the unit assembly device 141. The unit assembling apparatus 141 is for assembling a unit by positioning and arranging the semiconductor laser light source 101, the first lens 103, and the second lens 105 with respect to the block 1011 previously set on the plate 107. Device. The semiconductor laser light source 101 may be installed on the side surface of the block 1011 in advance. The unit assembly device 141 includes an aperture 143. First, the plate 107 is installed in the unit assembly apparatus 141 by inserting a pin installed at a predetermined position of the unit assembly apparatus 141 into a pin hole provided in the plate 107. The positions of the first lens 103 and the second lens 105 are adjusted so that the laser light emitted from the semiconductor laser light source 101 is condensed on the aperture 143 through the first lens 103 and the second lens 105. After the position adjustment, the first lens 103 and the second lens 105 are fixed to the plate 107. Thereafter, the unit is removed from the unit assembling apparatus 141.

  FIG. 10 is a diagram showing a unit of a laser subassembly attached to the housing 161A. The unit is installed in the casing 161A by inserting a pin installed at a predetermined position of the casing 161A into a pin hole provided in the plate 107.

  FIG. 11 is a diagram showing a housing 161B provided with a positioning guide for positioning the unit. The unit may be positioned on the housing 161B with a positioning guide instead of the pin.

  As described above, in this embodiment, after the optical system is adjusted for each unit of the laser subassembly 100, the unit is installed in the housing by the pin or the positioning guide. Therefore, the trouble of adjusting the optical system is greatly reduced.

  Electrical energy that is not converted to light energy in a semiconductor laser is released as heat. Therefore, a high-power semiconductor laser emits a lot of heat. For this reason, in the laser assembly, it is necessary to remove the heat emitted from the semiconductor laser. In the present embodiment, since the semiconductor lasers are arranged side by side on the housing, the heat emitted from the semiconductor laser can be efficiently removed by installing a heat sink as shown below.

  FIG. 12 is a diagram showing the housing 161B before the heat sink is attached.

  FIG. 13 is a diagram showing a housing 161B equipped with one type of heat sink 181A. This type of heat sink 181A is attached to the housing 161B so as to cover the portion of the semiconductor laser arranged side by side on the housing 161B. The heat sink 181A is preferably made of a metal having high thermal conductivity such as copper.

  FIG. 14 is a diagram showing a housing 161B equipped with another type of heat sink 181B. This type of heat sink 181B is attached to the casing 161B so as to cover a wide range including the portion of the semiconductor laser arranged side by side on the casing 161B.

100A, 100B, 100C Laser subassemblies 101A, 101B, 101C Semiconductor laser light sources 103A, 103B, 103C First lens 105A, 105B, 105C Second lens

Claims (3)

  A laser assembly for condensing laser light at a predetermined position, comprising a plurality of laser subassemblies, each laser subassembly comprising a semiconductor laser light source, a first lens group, and a second lens Each of the first lens group and the second lens group, and the direction of light perpendicularly incident on both the first lens group and the second lens group is an optical axis of each laser subassembly. The emitted laser light is condensed at the predetermined position on the optical axis in a plane including the optical axis and the fast axis of the semiconductor laser light source, and the second lens group is separated from the semiconductor laser light source. The emitted laser light is condensed at the predetermined position on the optical axis in a plane including the optical axis and the slow axis of the semiconductor laser light source, and the plurality of laser subassemblies are arranged at the predetermined position. Condensing laser light The optical axes of the plurality of laser subassemblies are arranged radially about the predetermined position in a plane including the fast axis of the semiconductor laser light source of the plurality of laser subassemblies. assembly.   A housing, and a plurality of plates attached to the housing, each of the plurality of plates including a semiconductor laser light source, a first lens group, and a second lens group on the plate. The laser assembly of claim 1, wherein the laser assembly is formed such that the housing and the plurality of plates are configured to position and attach the plurality of plates to the housing.   The laser assembly according to claim 1, further comprising a common heat sink in contact with the plurality of semiconductor laser light sources.

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