JP2011086663A5 - - Google Patents
Download PDFInfo
- Publication number
- JP2011086663A5 JP2011086663A5 JP2009236230A JP2009236230A JP2011086663A5 JP 2011086663 A5 JP2011086663 A5 JP 2011086663A5 JP 2009236230 A JP2009236230 A JP 2009236230A JP 2009236230 A JP2009236230 A JP 2009236230A JP 2011086663 A5 JP2011086663 A5 JP 2011086663A5
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009236230A JP2011086663A (ja) | 2009-10-13 | 2009-10-13 | 多層基板の放熱構造 |
| PCT/JP2010/067933 WO2011046134A1 (ja) | 2009-10-13 | 2010-10-13 | 多層基板の放熱構造 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2009236230A JP2011086663A (ja) | 2009-10-13 | 2009-10-13 | 多層基板の放熱構造 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2011086663A JP2011086663A (ja) | 2011-04-28 |
| JP2011086663A5 true JP2011086663A5 (ja) | 2011-06-16 |
Family
ID=43876183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009236230A Pending JP2011086663A (ja) | 2009-10-13 | 2009-10-13 | 多層基板の放熱構造 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2011086663A (ja) |
| WO (1) | WO2011046134A1 (ja) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN205810855U (zh) | 2015-07-03 | 2016-12-14 | 西铁城电子株式会社 | 具有基板和安装于基板的发光元件的发光装置 |
| CN110740562A (zh) * | 2018-07-19 | 2020-01-31 | 青岛海信电器股份有限公司 | 微尺寸led用印制电路板、制备方法及装置 |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0470760U (ja) * | 1990-10-30 | 1992-06-23 | ||
| DE4335946C2 (de) * | 1993-10-21 | 1997-09-11 | Bosch Gmbh Robert | Anordnung bestehend aus einer Leiterplatte |
| JPH08222855A (ja) * | 1995-02-17 | 1996-08-30 | Sharp Corp | 多層配線板 |
| JP3890639B2 (ja) * | 1996-09-13 | 2007-03-07 | イビデン株式会社 | プリント配線板の放熱構造 |
| JP4737575B2 (ja) * | 2001-01-30 | 2011-08-03 | ハリソン東芝ライティング株式会社 | 発光ダイオードアレイ及び光源装置 |
| JP2003304069A (ja) * | 2002-04-09 | 2003-10-24 | Murata Mach Ltd | 多層回路基板 |
| JP2004153142A (ja) * | 2002-10-31 | 2004-05-27 | Kubota Corp | 電子回路基板 |
| JP2006019660A (ja) * | 2004-07-05 | 2006-01-19 | Melec:Cc | パワー素子面実装用の回路基板 |
-
2009
- 2009-10-13 JP JP2009236230A patent/JP2011086663A/ja active Pending
-
2010
- 2010-10-13 WO PCT/JP2010/067933 patent/WO2011046134A1/ja active Application Filing