JP2011085458A - Apparatus for inspection of semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inspection apparatus which does not cause phenomena such as signal reflection from an on-chip antenna and non-operation of a chip under inspection and can prevent a problem in which a chip on a sheet tilts to be in contact with an inspection antenna substrate. <P>SOLUTION: The semiconductor device inspection apparatus 20 is an inspection apparatus for a semiconductor device 3 in which an antenna 1 (which is also called the "on-chip antenna") is placed on one side of a semiconductor wafer. The inspection apparatus includes: an inspection antenna 10 which can transmit and receive a signal to/from an antenna on the side of the semiconductor device 3 formed on an insulating substrate 21 in a noncontact manner; a stage 30 placed at a position facing the inspection antenna 10; the sheet 31 which is placed on the stage 30 and to which the diced semiconductor device 3 is affixed; and a suction means 32 for fixing the semiconductor device 3 affixed to the sheet 31 to the stage 30 by suction. The stage 30 is formed of a porous nonmagnetic material. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an inspection apparatus for a semiconductor device in which an antenna is integrally formed on an IC chip.

  In recent years, there has been proposed a semiconductor module that has an IC chip and an antenna coil for wireless communication, and transmits and receives signals using the antenna coil. This IC module is a wireless authentication system called RF-ID (Radio Frequency IDentification systems), has a high information processing capability by an IC chip, and can read and write signals without contact. For this reason, in recent years, it has spread in the fields of access control, electronic money, anti-counterfeiting technology and logistics.

  In such a semiconductor module, an external type spiral antenna coil for obtaining operating power by electromagnetic induction from a radio wave received from a reader / writer is generally formed on the same surface on an insulating substrate provided with an IC chip. There are card type, tag type, coin type and so on.

  As described above, since the antenna and the IC chip are separate, when a conventional non-contact IC card is mounted, both of them must be electrically connected. However, the connection between the terminal of the minute IC chip and the antenna is not only technically difficult, but also a stress is applied to the connection point particularly when a flexible card is used, causing disconnection.

  In order to solve the above problems and to further reduce the size and cost of the semiconductor module, an antenna coil was formed by applying a semiconductor process in the same plane and directly above the IC chip provided with the electrodes. An on-chip antenna has been proposed (see, for example, Patent Document 1).

In such a conventional non-contact IC card made of an external antenna, an IC chip and an antenna coil are separately manufactured and connected to each other after being mounted on the card. Thereafter, the performance inspection of the entire tag is performed. Therefore, since the conventional non-contact IC card can be inspected only after the IC chip and the antenna are connected, the manufacturing efficiency is poor. In addition, inspection of a finished product takes time and labor for arranging tags, which is very time consuming.
Further, Patent Document 2 discloses an inspection evaluation method corresponding to an on-chip antenna. However, since the chip packed in the tray after the dicing is evaluated, there is a problem that the time for tray packing is lost.

Therefore, the present inventors examined a method for performing non-contact inspection as it is on-wafer. However, if the stage in the on-wafer inspection system is made of metal such as SUS, and the wafer is attached to the tape in a diced state, the stage is made of metal. It has been confirmed that a phenomenon such as non-operation of the chip to be inspected or interference with adjacent chips due to signal reflection or the like occurs.
Furthermore, if the suction hole has a diameter of about several hundreds of micrometers, when a diced chip is placed on the hole, the chip may be tilted and contact the antenna for inspection.

Japanese Patent No. 3347138 Japanese Patent Laid-Open No. 2003-248031

  The present invention has been devised in view of such a conventional situation, and does not cause a phenomenon such as reflection of a signal from an on-chip antenna or non-operation of a chip to be inspected, and the chip on the sheet is tilted. An object of the present invention is to provide an inspection apparatus capable of preventing troubles such as contact with an inspection antenna board (probe card).

  A semiconductor device inspection apparatus according to a first aspect of the present invention is a semiconductor device inspection apparatus in which an antenna is disposed on one surface side of a semiconductor wafer, the semiconductor device-side antenna formed on an insulating substrate; An inspection antenna capable of transmitting and receiving signals in a non-contact manner, a stage disposed at a position facing the inspection antenna, a sheet disposed on the stage and having the diced semiconductor device attached thereto, A suction means for sucking and fixing the semiconductor device attached to a sheet on the stage, and the stage is made of a porous nonmagnetic material.

  In the inspection apparatus of the present invention, the stage is made of a porous nonmagnetic material (for example, porous ceramic), so that the signal from the on-chip antenna is not reflected on the stage, and the inspected chip does not operate. Such a phenomenon can be prevented. Further, in the present invention, the use of a porous nonmagnetic material having a micron-sized pore diameter can prevent the occurrence of trouble such that the chip on the sheet is inclined and contacts the antenna substrate for inspection.

Explanatory drawing which shows typically an example of the antenna for a test | inspection used by this invention. Explanatory drawing which shows typically an example of the form of the test | inspection apparatus of this invention, and an example of the test | inspection method using the same.

The present invention will be described below with reference to the drawings based on the best mode.
FIG. 1 is an explanatory view schematically showing an example of an inspection antenna used in the present invention. FIG. 2 is an explanatory view schematically showing an example of an inspection apparatus according to the present invention and an example of an inspection method using the inspection apparatus.

A semiconductor device inspection apparatus 20 according to the present invention is an inspection apparatus for a semiconductor device 3 in which an antenna is arranged on one surface side of a semiconductor wafer, and is not in contact with the antenna on the semiconductor device 3 side formed on an insulating substrate 21. The inspection antenna 10 capable of transmitting and receiving signals, a stage 30 disposed at a position facing the inspection antenna 10, a sheet 31 disposed on the stage 30 and having the diced semiconductor device 3 attached thereto, The semiconductor device 3 attached to the sheet 31 is provided with suction means 32 that sucks and fixes the semiconductor device 3 on the stage 30, and the stage 30 is made of a porous nonmagnetic material.
In the inspection apparatus 20, the stage 30 is made of a porous nonmagnetic material, so that a signal from the on-chip antenna is not reflected, and a phenomenon such as a malfunction of the chip to be inspected can be prevented. Further, in the present invention, the use of a porous nonmagnetic material having a micron-sized pore diameter can prevent the occurrence of trouble such that the chip on the sheet 31 is inclined and comes into contact with the inspection antenna substrate.

As shown in FIGS. 1 and 2, in the inspection apparatus 20 of this embodiment, the inspection antenna 10 is arranged on an insulating substrate 21.
An antenna pattern 11 is formed on one surface 21 a of the insulating substrate 21 of the inspection antenna 10. The antenna pattern 11 is disposed at a position facing the on-chip antenna 1 at a distance capable of transmitting and receiving signals in a non-contact manner with a wafer-state antenna (hereinafter referred to as “on-chip antenna”) 1 that is an object to be measured. . The distance between the antenna pattern 11 and the on-chip antenna 1 may be an arbitrary distance according to the specifications and usage conditions of the on-chip antenna 1, but is, for example, 0.1 to 5 mm.

In the case of the inspection apparatus 20 according to this embodiment, as shown in FIG. 1, the antenna pattern 11 of the inspection antenna 10 has a loop antenna shape. In order to avoid interference with the on-chip antenna adjacent to the on-chip antenna to be inspected, the inner diameter of the loop antenna is preferably the same size as the on-chip antenna to be inspected.
As the antenna shape of the inspection antenna 10, an antenna known in the art such as a dipole antenna, a monopole antenna, a loop antenna, a slot antenna, or a microstrip antenna can be applied. In any case, it is preferable that the size is approximately the same as the on-chip antenna to be inspected.

  As shown in FIG. 1, wiring 14 is formed on the other surface 21 b of the insulating substrate 21. The wiring 14 is electrically connected to the antenna pattern 11 through the via 13 provided in the through hole 12 penetrating the insulating substrate 21 in the thickness direction. In order to obtain a desired resonance frequency, a capacitor 15 is connected to the wiring 14 so that the terminals 15a and 15b are electrically connected to both ends of the antenna pattern 11, respectively. Examples of the capacitor 15 include a chip capacitor and a variable capacitor. A variable capacitor is preferable because the resonance frequency can be easily adjusted. It is preferable to provide at least one capacitor 15 for each antenna pattern 11. A plurality of capacitors may be used to adjust the resonance frequency of one antenna pattern 11.

  The wiring 14 is extended to the outer periphery of the insulating substrate 21 as a connection wiring. A connector connection portion 17 is provided at the end of the connection wiring. As shown in FIG. 2, the connector connecting portion is connected to a reader / writer device, a control PC (programmable controller), or the like by a cable 18 such as a coaxial cable.

In the inspection apparatus of this embodiment, the antenna pattern 11 and the wiring 14 are formed on a conductive substrate such as copper on an insulating substrate 21. As a material for manufacturing this inspection device, a double-sided copper-clad substrate in which copper foils are laminated on both sides of an insulating substrate can be mentioned.
Examples of the insulating substrate include a substrate made of an insulator such as resin, glass, or ceramic, such as an FR4 substrate made of glass epoxy resin.

Examples of a method for forming a conductor pattern such as an antenna or wiring include a method of forming a conductor pattern by etching copper foil, a method of forming a conductor layer by plating or vapor deposition, and a method of printing a conductive paste. As the conductor, an appropriate conductor such as copper (copper foil or copper plating), silver, aluminum or the like can be used, and the conductor is not particularly limited.
In the case of the inspection apparatus 20 of this embodiment, using a substrate in which a metal layer such as a copper foil is laminated on both surfaces in advance, and removing unnecessary portions by etching or the like, the cost of forming a conductor layer can be reduced, preferable.

  The semiconductor device inspection apparatus 20 according to the present invention includes a stage 30 disposed at a position facing the inspection antenna 10 and a sheet 31 on which the diced semiconductor device 3 disposed on the stage is attached. And suction means 32 for sucking and fixing the semiconductor device 3 attached to the sheet 31 onto the stage.

The semiconductor wafer 2 is, for example, a silicon (Si) wafer, and an IC element is formed to process information transmitted / received via each antenna.
The semiconductor device 3 has an antenna 1 formed on one surface side of a semiconductor wafer 2, and the semiconductor wafer 2 is diced into a plurality of on-chip antennas (antennas formed on an IC chip). A plurality of sheets are arranged and pasted on the sheet 31.

The sheet 31 to which the plurality of semiconductor devices 3 are attached is arranged on the stage 30 so as not to sag due to the weight of the semiconductor device 3.
Further, the semiconductor device 3 attached to the sheet 31 is sucked and fixed onto the stage 30 by the suction means 32. Thereby, the sheet | seat 31 with which the semiconductor device 3 was affixed can be fixed on the stage 30 flat, without lifting up.

And in the inspection apparatus 20 of this invention, the said stage 30 consists of a porous nonmagnetic material, It is characterized by the above-mentioned.
In the present invention, the stage 30 is made of a porous nonmagnetic material (for example, porous ceramic), so that a signal from the on-chip antenna is not reflected and a phenomenon such as non-operation of the chip to be inspected is prevented. be able to.

  The porous nonmagnetic material preferably has a micron-sized pore size. As porous non-magnetic material, the slope for example, using a pore size of micron-sized porous ceramic, a porous glass, a semiconductor device 3 on the sheet 31, depressed in the suction holes provided conventionally, Occurrence of troubles such as contact with the inspection antenna substrate can be prevented. By porous non-magnetic material has a pore size of micron size, with the semiconductor device 3 affixed to the sheet 31 can be adsorbed on the stage 30, since holes are small, the semiconductor device 3 falls into the hole There is nothing.

Next, a semiconductor device inspection method using such an inspection apparatus 20 will be described.
As shown in FIG. 2, the inspection method of the on-chip antenna using the inspection apparatus 20 of the present embodiment is pasted on the sheet 31 in a diced state on the stage 30 made of porous ceramic. The semiconductor device 3 on which the on-chip antenna 1 is formed is placed, and the inspection antenna 10 is disposed at a position facing the on-chip antenna 1. The distance between the on-chip antenna 1 and the inspection antenna 10 may be inspected at an arbitrary distance according to the application and usage of the on-chip antenna, but is, for example, about 0.1 mm to 5 mm.

The diced on-chip antenna 1 is placed on the stage 30 in a state of being affixed to a plurality of sheets 31, and is sucked and fixed onto the stage 30 by the suction means 32. Then, the antenna pattern 11 of the inspection apparatus 20 is arranged at a position facing the on-chip antenna 1 to perform transmission / reception with the on-chip antenna 1 in a non-contact manner.
The on-chip antenna determined to be defective at the time of inspection can be removed later by recording the position on the sheet 31 or the like.

  Particularly in the present invention, since the stage 30 is made of porous ceramic, a signal from the on-chip antenna is not reflected, and a phenomenon such as non-operation of the chip to be inspected can be prevented. In the present invention, the use of a micron-sized porous ceramic with a pore size can prevent the occurrence of trouble such that the chip on the sheet 31 tilts and comes into contact with the inspection antenna substrate.

  The semiconductor device inspection apparatus according to the present invention has been described above. However, the present invention is not limited to this, and various modifications can be made without departing from the spirit of the invention.

  The present invention is applicable to a semiconductor device inspection apparatus in which an antenna is integrally formed on an IC chip.

  DESCRIPTION OF SYMBOLS 1 On-chip antenna, 3 Semiconductor device, 10 Inspection antenna, 11 Antenna pattern, 12 Through hole, 13 Via, 14 Wiring, 15 Capacitor, 20 Inspection apparatus, 21 Insulating substrate, 30 Stage, 31 Sheet, 32 Suction means.

Claims (1)

An inspection apparatus for a semiconductor device in which an antenna is arranged on one side of a semiconductor wafer,
An inspection antenna capable of transmitting and receiving signals without contact with the antenna on the semiconductor device side formed on an insulating substrate;
A stage disposed at a position facing the inspection antenna;
A sheet on which the semiconductor device disposed on the stage and diced is attached;
A suction means for adsorbing and fixing the semiconductor device attached to the sheet on the stage;
An inspection apparatus for a semiconductor device, wherein the stage is made of a porous nonmagnetic material.

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