JP5008089B2 - Electromagnetic induction module - Google Patents

Description

  The present invention relates to an electromagnetic induction module used for radio communication such as RFID (Radio Frequency Identification), non-contact power feeding, and the like.

  Conventionally, as an RFID system that performs non-contact data communication using an electromagnetic induction method, for example, Patent Document 1 discloses an insulating substrate, an antenna coil and a parallel plate capacitor that form a resonance circuit formed thereon, and an antenna coil. There has been proposed a non-contact IC tag constituted by an IC chip that is connected and supplied with electric power by electromagnetic induction from an external reader / writer and that transmits information to and from a reader / writer as a read / write device. In the non-contact type IC module of Patent Document 1, the antenna coil is formed in a rectangular spiral pattern, and the IC chip is an inner peripheral land of the antenna coil, a via hole provided in the insulating substrate from the outer peripheral land of the antenna coil, and the insulating substrate. Are connected between the lands on the surface of the insulating substrate which is conducted through a conductor pattern provided on the back side of the substrate. The parallel plate capacitor is formed of a surface electrode formed inside the antenna coil of the insulating substrate and a back electrode formed on the inner peripheral side of the antenna coil on the back surface side of the insulating substrate. Connected in parallel with the chip. Further, the surface electrode of the parallel plate capacitor includes a reference characteristic portion and a characteristic increase adjusting portion, and is configured to be able to adjust the frequency.

  Also, an antenna device in an RFID system that performs non-contact data communication by an electromagnetic induction method, that is, a wireless medium processing device that performs communication with a wireless communication medium such as an IC card or an IC tag, or an antenna that is used for the wireless communication medium itself As an apparatus, for example, Patent Document 2 includes a magnetic sheet for making it less susceptible to the influence of surrounding metals, a spiral antenna conductor provided on the base material, a chip capacitor provided on the base material, and the like. An antenna device including a matching circuit has been proposed. It is also disclosed that the matching portion is provided with a conductor pattern capable of trimming the capacitor and the inductor so that the resonance frequency can be finely adjusted.

  FIG. 2 is an exploded perspective view of a conventional electromagnetic induction module. In this electromagnetic induction module, a loop antenna 2 in which antenna conductors are spirally wired on an insulating substrate 1 and external connection terminals 5d and 5e are provided for connection to the outside of the electromagnetic induction module. Further, a matching circuit capacitor 3 is mounted so as to bridge the antenna conductor. The soft magnetic sheet 4 is arranged so as to cover the entire surface of the insulating substrate 1. However, the external connection terminals 5d and 5e for connection to the outside are mounted so as to bridge the capacitor 3, and the thickness is increased by the height of the capacitor 3, so that the thickness is absorbed. In addition, an opening 7 corresponding to the location of the capacitor 3 is provided in the soft magnetic sheet 4.

  Further, in Patent Document 3, a good conductor antenna to be a loop antenna is formed on one side of an antenna substrate, and the composite magnetic body is disposed so as to face the loop antenna with the antenna substrate interposed therebetween. An RFID antenna device is disclosed in which a chip capacitor is fixed to the same side surface and connected in parallel with a loop antenna. Further, an example is shown in which the RFID antenna device is connected to an IC chip provided on the antenna substrate on which the chip capacitor is fixed.

  Patent Document 4 discloses an IC tag booster antenna made of a two-dimensional spiral coil formed on a base material, a resonance circuit made of a capacitor inside the coil, and a magnetic sheet material attached to one side of the base material. It is disclosed. The coil and capacitor are connected to each other at one end and formed on one side of the substrate, and each open end is connected via a jumper wire formed on the other side of the substrate. They have the same shape and the same size and are attached to each other.

  Further, Patent Document 5 describes a non-contact power transmission device in which a ferrite sheet is provided on the outer side of an opposed planar spiral coil. The electromagnetic induction module is also reduced in thickness by a configuration in which the power supply side device and the power reception side device are each provided with a planar spiral coil and a ferrite sheet.

JP 2004-280598 A JP 2007-214754 A JP 2007-12589 A JP 2004-242245 A JP 2003-45731 A

  In such an RFID communication system, an electromagnetic induction module using a loop antenna and a capacitor is used. Further, even when power transmission is mainly performed as in a non-contact power feeding device, it is possible to use LC resonance by connecting a capacitor in parallel to a planar spiral coil (loop antenna). In addition, the flat spiral coil can be formed not only by winding the coated conductive wire but also by forming a spiral conductor pattern on the insulating substrate.

  As an electromagnetic induction module of a wireless device using electromagnetic induction, such as these RFID communication systems and non-contact power supply devices, a loop antenna 2 arranged on a soft magnetic sheet 4 and an insulating substrate 1, a capacitor 3, and these The electromagnetic induction module can be thinned basically to the thickness of the insulating substrate 1 and the soft magnetic material sheet 4 by being configured with the conductive wiring pattern for connection. However, it is not easy to reduce the cost and the area as much as possible to achieve thinning while securing the characteristics.

  For example, since it is impossible to connect the loop antenna 2 and the capacitor 3 in parallel on one plane, the conventional technique uses both surfaces of the insulating substrate 1 or bridges the capacitor 3 on the antenna conductor. It is arranged. It should be noted that providing a conductor wiring between the antenna conductors of the loop antenna 2 is out of the question from the viewpoint of characteristics. Providing the conductor wiring pattern on both surfaces of the insulating substrate 1 makes the manufacturing complicated and causes an increase in cost even when a printed board or a flexible board is used.

  Further, in the case of a structure in which a chip capacitor is used as the capacitor 3 to bridge the antenna conductor, the portion of the capacitor 3 of the soft magnetic material sheet 4, that is, the loop of the loop antenna 2, in order not to increase the overall thickness. The opening 7 is provided on the part of the antenna conductor. The opening 7 of the soft magnetic sheet 4 provided just above the antenna conductor of the loop portion of the loop antenna 2 significantly reduces the effect of suppressing electromagnetic interference with other components of the wireless device. As described above, the soft magnetic sheet 4 can sufficiently suppress the electromagnetic interference effect with other components of the wireless device, and can sufficiently ensure the efficiency of electromagnetic coupling in the case of the power feeding device. It is necessary to arrange the induction module so that the area and thickness of the induction module do not increase as much as possible.

  Furthermore, it is necessary to provide an adjustment mechanism that can adjust the resonance frequency by the loop antenna 2 and the capacitor 3 of the electromagnetic induction module and to prevent the area and thickness of the electromagnetic induction module from increasing as much as possible. .

  That is, an object of the present invention is to provide an electromagnetic induction module that can adjust the resonance frequency, is reduced in size and thickness, and is reduced in cost.

  In order to solve the problem of the present invention, it is impossible to connect the loop antenna and the capacitor of the electromagnetic induction module in parallel on one plane, but instead of using the back surface of the insulating substrate as in the past. By providing three external connection terminals on the surface of the insulating substrate so that the connection can be achieved within the equipment outside the electromagnetic induction module, the thickness of the electromagnetic induction module itself is not increased, but is required here. An electromagnetic induction module can be configured even if the conductor wiring pattern is provided on only one surface of the insulating substrate.

  That is, when a loop antenna is arranged on one surface of an insulating substrate and a capacitor is arranged, one terminal of the loop antenna is arranged outside the loop and the other terminal is arranged inside the loop. Both terminals are arranged outside or inside the loop of the loop antenna. When connecting a loop antenna and a capacitor in parallel, for example, when the capacitor is placed outside the loop of the loop antenna, connect an external terminal that connects the terminal outside the loop of the loop antenna and one terminal of the capacitor. Since the terminals inside the loop of the loop antenna and the terminals outside the capacitor loop cannot be connected without crossing the loop of the loop antenna on the same plane, external terminals for connecting the respective terminals are provided. If an electrical connection is made on the device side connected to the external connection terminal, as a result, the loop antenna and the capacitor are connected in parallel.

  With this configuration, it is possible to provide a conductor wiring pattern only on one surface of the insulating substrate to provide an electromagnetic induction module. Even if a soft magnetic sheet is disposed on the loop of the antenna conductor of the loop antenna, The thickness of the electromagnetic induction module does not increase from other locations.

  Also, by using a plurality of capacitors, resonance can be achieved by cutting the conductive wiring pattern connected to each of the plurality of capacitors by laser trimming or by connecting the cut conductive wiring pattern by printing or the like. The frequency can be changed. In this case, if a capacitor that is not used for resonance frequency adjustment is provided in the circuit on the device side among the multiple capacitors on the device side to which the electromagnetic induction module is connected, the number of capacitors mounted on the electromagnetic induction module can be reduced. Mounting area can be reduced.

  In addition, the soft magnetic sheet can be arranged without increasing the thickness of the electromagnetic induction module except for the location where the capacitor is mounted, except for the location of the external connection terminal, thus reducing the mounting area of the capacitor. If possible, the area of the electromagnetic induction module is within the range, but the placement area of the soft magnetic sheet can be increased, so that the electromagnetic suppression effect can be enhanced, and in the case of a power supply device, the efficiency of electromagnetic coupling is ensured. become able to.

That is, according to the present invention, a loop antenna having a loop of one turn or more, used in parallel, a plurality of electromagnetic induction module side capacitors, a soft magnetic sheet, and a plurality of external terminals for external connection. An electromagnetic induction module comprising: the loop antenna; at least a part of the electromagnetic induction module side capacitor; one of the external terminals connecting one terminal of the loop antenna; and the other of the loop antenna wherein one of the external terminals, the same side of one insulating substrate of the external terminals for connecting the other terminal of the electromagnetic induction module side capacitor terminal and connecting the one terminal of the electromagnetic induction module side capacitor provided, the soft magnetic material sheet, in all areas immediately above at least said loop of the loop antenna, and Provided on the one side, the external terminal, the through opening through the thickness direction of the soft magnetic material sheet respectively provided inside and outside the region of the loop antenna in the soft magnetic material sheet electromagnetic One of the external terminals connected to a device outside the induction module and connecting one terminal of the loop antenna and one of the external terminals connecting the other terminal of the electromagnetic induction module side capacitor are connected to the device. An electromagnetic induction module is obtained which is electrically connected by a circuit .

According to the invention, one of the external terminals that connects the other terminal of the loop antenna and one terminal of the electromagnetic induction module-side capacitor is connected to the other terminal of the electromagnetic induction module-side capacitor. One of the external terminals is connected to both ends of a device-side capacitor that constitutes a part of the device circuit , whereby an electromagnetic induction module is obtained.

  According to the present invention, it is possible to provide an electromagnetic induction module capable of adjusting the resonance frequency, being reduced in size and thickness, and being reduced in cost.

  An electromagnetic induction module according to an embodiment of the present invention will be described below in detail with reference to the drawings.

  FIG. 1 is an exploded perspective view of an electromagnetic induction module according to the present invention. As shown in FIG. 1, a loop antenna 2 made of a spiral conductor wiring pattern is provided on an insulating substrate 1, and both terminals of the loop antenna 2 are external connection terminals for connection to the device side. Connected to 5a and 5b. A plurality of capacitors 3 are provided in the loop of the loop antenna 2, and both terminals of these capacitors 3 are connected to the external connection terminals 5b and 5c. Here, both the terminal of the loop antenna and the terminal of the capacitor are connected to one external connection terminal 5b. Further, the soft magnetic sheet 4 provided with the opening 7 at a place corresponding to the place where the external connection terminals 5a, 5b, and 5c are provided and the place where the plurality of capacitors 3 are provided, Arranged on the insulating substrate 1.

  In the case of FIG. 1, the capacitor 3 is provided in the loop of the loop antenna 2, and the area of the electromagnetic induction module can be almost secured as the loop area of the loop antenna 2. In the case of a wireless communication application, it is desirable to provide the capacitor 3 in the loop of the loop antenna 2 because the communicable distance can be extended by increasing the area in the loop of the loop antenna.

  The insulating substrate 1 may be an insulating resin substrate such as PET resin, polyimide resin, epoxy resin, or phenol resin, a paper substrate, or an insulating ceramic substrate such as alumina or aluminum nitride. Or it is not different from a flexible substrate. The conductor wiring pattern 6 may be formed by a normal conductor wiring method such as metal foil bonding etching, metal wire bonding, or conductive paste printing. The capacitor 3 can be manufactured on the insulating substrate 1 using a conductor and a dielectric, but it is easy to mount a ceramic chip capacitor.

  Further, it is desirable that the soft magnetic sheet 4 is provided so as to cover at least the portion directly above the antenna conductor forming the loop of the loop antenna 2 in order to enhance the effect of suppressing electromagnetic interference with other circuits of the device.

  The soft magnetic sheet 4 has a thickness of 0.05 to 0.3 mm because the main purpose is to suppress electromagnetic interference with other circuits on the device side when mainly using RFID wireless communication. It is desirable to use an electromagnetic wave interference suppressor having a thickness of 0.05 to 1 mm, which is made of a flat soft magnetic powder such as a soft magnetic ferrite plate or Sendust and an organic binder. The thickness of the soft magnetic material sheet may be thicker than this, but it is desirable to make the above thickness from the viewpoint of the effect of suppressing the electromagnetic interference obtained and the reduction of the thickness of the electromagnetic induction module.

  In addition, when power transmission of the non-contact power feeding apparatus is mainly used, electromagnetic coupling is emphasized. Therefore, it is desirable to use a soft magnetic ferrite plate having a thickness of 1 mm to 2 mm for the soft magnetic sheet 4.

  As the soft magnetic ferrite plate, a soft magnetic ferrite plate having a predetermined shape having an opening 7 can be used. However, since the soft magnetic ferrite plate does not have flexibility, it is difficult to manufacture and handle. Therefore, the soft magnetic ferrite plate as the soft magnetic material sheet 4 is a soft magnetic ferrite sheet in which tiles of soft magnetic ferrite plates having a shape of 5 mm to 15 mm square are arranged and both surfaces are covered with PET tape or the like. It is desirable to use a soft magnetic ferrite plate having a predetermined shape provided with an opening 7 by punching with a corrosion blade or the like. Such a soft magnetic ferrite plate has flexibility and is easy to manufacture and handle. If the tile of the soft magnetic ferrite plate is too small, the work efficiency is poor, and if it is too large, cracks occur frequently.

  FIG. 3 is an exploded perspective view of the electromagnetic induction module of the present invention. 3 differs from FIG. 1 in that a capacitor is provided outside the loop of the loop antenna. Also in this case, as shown in FIG. 3, a loop antenna 2 made of a spiral conductor wiring pattern is provided on an insulating substrate 1, and both terminals of the loop antenna 2 are connected to the device side. Are connected to the external connection terminals 5a and 5b. A plurality of capacitors 3 are provided outside the loop of the loop antenna 2, and both terminals of these capacitors 3 are connected to the external connection terminals 5b and 5c. Here, both the terminal of the loop antenna and the terminal of the capacitor are connected to one external connection terminal 5b. Further, the soft magnetic sheet 4 provided with the opening 7 at a place corresponding to the place where the external connection terminals 5a, 5b, and 5c are provided and the place where the plurality of capacitors 3 are provided, Arranged on the insulating substrate 1.

  In the case of FIG. 3, the capacitor 3 is provided outside the loop of the loop antenna 2. In the case of RFID wireless communication, it is difficult to secure a large loop area of the loop antenna 2. Can be used sufficiently. In the case where power transmission is the main purpose as in the case of the non-contact power feeding device, the loop area of the loop antenna 2 is not a big problem, and a soft magnetic sheet is arranged over almost the entire surface of the loop antenna. There is an advantage in that it can be done.

  FIG. 4 is a circuit diagram of the electromagnetic induction module of the present invention. As shown in FIG. 4, the external connection terminals 5 a, 5 b, and 5 c of the electromagnetic induction module are connected to the device 10. Usually, the loop antenna 2 and the capacitor 3 of the electromagnetic induction module are connected in parallel to the transmission detection circuit 11 of the device 10 so that signals and power are transmitted and received wirelessly with the counterpart device. In the case of FIG. 4, in the electromagnetic induction module, one terminal of the loop antenna 2 and one terminal of the capacitor 3 are connected by the external connection terminal 5b, but the other terminal of the loop antenna 2 and the capacitor are connected. The other terminal of 3 is not connected. However, the external connection terminal 5a to which the other terminal of the loop antenna 2 is connected and the external connection terminal 5c to which the other terminal of the capacitor 3 is connected in the circuit on the device 10 side are electrically connected. With this configuration, also in the electromagnetic induction module of the present invention, the loop antenna 2 and the capacitor 3 of the electromagnetic induction module are connected in parallel to the transmission detection circuit 11 of the device 10 so that signals and signals can be transmitted wirelessly to and from the counterpart device. Electric power is transmitted and received.

  FIG. 5 is a circuit diagram of the electromagnetic induction module of the present invention. In the case of the circuit of FIG. 5, a capacitor not used for resonance frequency adjustment is mounted on the device side. Similarly in FIG. 5, the external connection terminals 5 a, 5 b, and 5 c of the electromagnetic induction module are connected to the device 10. Also in this case, in the electromagnetic induction module, one terminal of the loop antenna 2 and one terminal of the capacitor 3 are connected by the external connection terminal 5b, but the other terminal of the loop antenna 2 and the other of the capacitor 3 are connected. The terminal of is not connected. However, the external connection terminal 5a to which the other terminal of the loop antenna 2 is connected in the circuit on the device 10 side and the external connection terminal 5c to which the other terminal of the capacitor 3 is connected are electrically connected, and the electromagnetic induction module The loop antenna 2 and the capacitor 3 are connected in parallel to the transmission detection circuit 11 of the device 10. Further, a capacitor 13 provided on the device side and not used for resonance frequency adjustment is connected in parallel to the transmission detection circuit 11. With this configuration, also in the electromagnetic induction module of the present invention, signals and power are transmitted and received wirelessly with the counterpart device. If the capacitor 13 that is not used for adjusting the resonance frequency is provided on the device side, the number of capacitors mounted on the electromagnetic induction module can be reduced. Therefore, the area of the electromagnetic induction module can be reduced or the opening 7 of the soft magnetic sheet 4 can be reduced. It becomes.

  FIG. 6 is an enlarged view of the vicinity of the location of the capacitor of the electromagnetic induction module of the present invention. As shown in FIG. 6, a plurality of capacitors 3 are connected in parallel by a conductive wiring pattern 6. An electromagnetic induction module is manufactured, a resonant circuit is formed by connecting a loop antenna and a capacitor in parallel, an electromagnetic wave is incident by an external loop coil or the like, and a resonance frequency can be measured by measuring reflection. The resonance frequency may be obtained directly from measurement of circuit constants. The measured resonance frequency is compared with a predetermined frequency, calculated from the deviation of the frequency, the capacitor 3 to be connected is adjusted, and the resonance frequency is finely adjusted. In this case, for example, a part of the conductive wiring 6a connected to the capacitor 3 of the conductive wiring pattern 6 is punched or cut by laser trimming to reduce the number of capacitors, or conversely, the conductive wiring pattern 6 The capacitance synthesized by the plurality of capacitors 3 is changed by providing the conductive wiring 6a connected to the capacitor 3 in a part of the capacitor by increasing the number of capacitors by printing a conductive paste or the like. The adjustment method can be adopted.

  Although the thickness of such an electromagnetic induction module increases, a soft magnetic sheet may be further provided on the back side of the insulating substrate 1. In the case where RFID wireless communication is mainly used, the effect of suppressing electromagnetic interference can be enhanced by providing it in the region excluding the vicinity of the loop antenna on the back surface of the insulating substrate. Similarly, when the power transmission of the non-contact power feeding apparatus is mainly used, it can contribute to the coupling of magnetic fluxes by providing it in a region excluding the vicinity of the loop antenna.

  In addition, the electromagnetic induction module may be provided with a joint portion such as a hole, a protrusion, or a notch for facilitating attachment to the device side. In this case, it is desirable that the loop antenna 2, the capacitor 3, and the external connection terminals 5a, 5b, and 5c are provided at positions that do not hinder use.

Example 1
An external substrate 40 mm × 30 mm, 0.2 mm thick insulating substrate 1 (flexible substrate), one side of a loop antenna 2 wound around 4 turns, external connection terminals 5 a and 5 b, and a capacitor 3 (ceramic capacitor 2 pF) in the loop of the loop antenna 2 × 3, 100 pF × 2, 0.5 pF × 3) conductive wiring patterns 6 and external connection terminals 5b and 5c were formed, and a plurality of capacitors 3 were mounted by reflow mounting.

  Furthermore, a 30 μm-thick double-sided tape is bonded to both sides of a 0.8 mm thick sendust flat soft magnetic powder and an organic binder (chlorinated polyethylene) electromagnetic interference suppression sheet, and then removed with a Bic die. Processing was performed to produce a soft magnetic sheet 4 having the same shape as the outer shape of the flexible substrate provided with the opening 7.

  Thereafter, the soft magnetic sheet 4 was attached to the flexible substrate using a jig for aligning the outer shape of the flexible substrate to produce an electromagnetic induction module. The electromagnetic induction module was mounted on the device 10 side by the remaining adhesive surface of the soft magnetic material sheet. The circuit on the device side is connected by external connection terminals 5a, 5b, and 5c of the electromagnetic induction module, and the signal received by the electromagnetic induction module is detected by the transmission detection circuit 11.

  Next, a resonance circuit was formed by connecting the loop antenna 2 and the capacitor 3 of the electromagnetic induction module in parallel, an electromagnetic wave was incident by an external loop coil or the like, and the resonance frequency was specified by measuring reflection.

  100 electromagnetic dielectric modules were produced. When the resonance frequency of this electromagnetic dielectric module was measured, it had a variation of 200 kHz with a range around 16.45 MHz. On the other hand, the resonance frequency required for normal use is required to be suppressed within a variation of 50 kHz with a range centering on 16.7 MHz.

  Therefore, when the resonance frequency is off, the conductive wiring pattern 6 connected to each capacitor is cut by punching a hole in the conductive wiring 6a and synthesized by a plurality of capacitors. The resonance frequency was adjusted by changing the capacitance.

  In this case, it has been found that cutting the conductive wiring 6a with one 2pF capacitor shifts the resonance frequency of 136kHz, and cutting the conductive wiring 6a with one 0.5pF capacitor shifts the 34kHz resonance frequency. Therefore, by using 2pF × 3 and 0.5pF × 3 as the resonance frequency adjustment capacitors, the maximum correction of about 500kHz can be made, so that the range of the resonance frequency used in normal use can be set sufficiently. It was. For example, the resonance frequency can be adjusted by cutting 2 pF × 1 and 0.5 pF × 2 capacitor conductive patterns when the deviation amount of the frequency resonance frequency is 200 kHz.

(Example 2)
Except for the soft magnetic sheet 4, 100 electromagnetic induction modules having the same specifications as those of Example 1 were produced. The soft magnetic sheet 4 was obtained by covering both surfaces of a 0.2 mm thick Mn—Zn ferrite plate with a 50 μm thick PET tape and crushing it with a jig having irregularities with a spacing of 1 mm. Similarly, after sticking a double-sided tape on both sides, a punching process was performed using a Bic die, and a soft magnetic sheet 4 having the same shape as the outer shape of the flexible substrate provided with the openings 7 was produced. Thereafter, an electromagnetic induction module was manufactured in the same manner as in Example 1, and the resonance frequency was measured and finely adjusted. Also in the result of Example 2, it was found that there was a variation of 200 kHz as a range around 16.45 MHz as in the case of Example 1. Fine adjustment of the resonance frequency was possible as well.

(Example 3)
The same printed circuit board as Example 1 was used for the insulating substrate 1, and the conductive wiring pattern was similarly formed in the single side | surface of the printed circuit board. The loop-shaped antenna 2 forms a loop of 4 turns with an antenna conductor thickness of 100 μm, and a conductive wiring pattern 6 for a capacitor 3 (7 ceramic capacitors 200 nF and 2 nF 3) is formed in the loop. Three external connection terminals 5a, 5b, and 5c were formed in the same manner, and a plurality of capacitors 3 were reflow mounted.

  As the soft magnetic sheet 4, a 10 mm square 1 mm thick Mn-Zn ferrite plate tile is used, and a soft magnetic ferrite plate covered with 50 μm thick PET tape is used to punch out a predetermined opening with a punch. Was used. The same double-sided tape as in Example 1 was bonded to both surfaces of the soft magnetic sheet 4.

  Then, 100 electromagnetic induction modules were produced by attaching the soft magnetic sheet 4 to the flexible substrate using a jig for aligning the outer shape of the flexible substrate. Next, the loop antenna 2 of the electromagnetic induction module and the capacitor 3 are connected in parallel to form a resonance circuit, and the resonance frequency is measured. If the resonance frequency is off, the conductivity connected to each capacitor is measured. The electrostatic capacitance synthesized by a plurality of capacitors was changed by cutting the wiring pattern 6 by punching holes in the conductive wiring 6a, and the resonance frequency was adjusted to be close to 100 kHz.

  The electromagnetic induction module was mounted on the device 10 side by the remaining adhesive surface of the soft magnetic material sheet. The circuit on the device side is connected by external connection terminals 5a, 5b, and 5c of the electromagnetic induction module, and the signal received by the electromagnetic induction module is detected by the transmission detection circuit 11. By bringing the electromagnetic induction module of Example 3 on the device side closer to about 1 mm to the electromagnetic induction module of the external power supply device and rectifying the detection signal of the transmission detection circuit 11, the power of non-contact power supply can be extracted. In addition, power transmission at a frequency of 100 kHz and 8 W could be performed.

The disassembled perspective view of the electromagnetic induction module of this invention. The disassembled perspective view of the electromagnetic induction module of a prior art example. The disassembled perspective view of the electromagnetic induction module of this invention. The circuit diagram of the electromagnetic induction module of this invention. The circuit diagram of the electromagnetic induction module of this invention. The enlarged view of the arrangement | positioning location vicinity of the capacitor | condenser of the electromagnetic induction module of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Insulating board 2 Loop antenna 3, 13 Capacitor 4 Soft magnetic material sheet 5a, 5b, 5c, 5d, 5e External connection terminal 6 Conductive wiring pattern 6a Conductive wiring 7 Opening 10 Equipment 11 Transmission detection circuit

Claims (2)

An electromagnetic induction module comprising a loop antenna having a loop of one turn or more, connected in parallel, a plurality of electromagnetic induction module side capacitors, a soft magnetic sheet, and a plurality of external terminals for external connection, The loop antenna, at least a part of the electromagnetic induction module side capacitor, one of the external terminals connecting one terminal of the loop antenna, the other terminal of the loop antenna and the electromagnetic induction module side One of the external terminals connecting one terminal of the capacitor and one of the external terminals connecting the other terminal of the electromagnetic induction module side capacitor are provided on the same side of the insulating substrate, and the soft magnetic body sheets, with all the areas right above of at least the loop of the loop antenna, and, provided on said one surface, Kigaibu terminals, said electromagnetic induction module external device via an opening through the thickness direction of the soft magnetic material sheet respectively provided inside and outside the region of the loop antenna in the soft magnetic material sheet One of the external terminals connected and connected to one terminal of the loop antenna and one of the external terminals connecting the other terminal of the electromagnetic induction module side capacitor are electrically connected by a circuit of the device. An electromagnetic induction module. One of the external terminals that connects the other terminal of the loop antenna and one terminal of the electromagnetic induction module side capacitor, and one of the external terminals that connects the other terminal of the electromagnetic induction module side capacitor. The electromagnetic induction module according to claim 1, wherein the electromagnetic induction module is connected to both ends of a device-side capacitor that constitutes a part of the circuit of the device .

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