JP2011078997A - Die exchange device and die exchange method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To automatically improve the fitting defect of a punch die P by automatically performing the retry operation of a punch die P when the fitting defect of the punch die P is caused. <P>SOLUTION: In the die exchange device 9, a punch die P which has been stored is mounted to a turret 5U. The device includes: a monitoring part 25a, during the mounting of the punch die P grasped to a grasper 11 provided at an arm 13 to the turret 5U, monitoring the loaded state to the grasper 11; and an operation control part 25b, in the case an abnormal load is detected during the monitoring of the monitoring part 25a, repeatedly practicing the inserting operation of the punch die P. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a mold exchanging apparatus and a mold exchanging method for attaching a punch held by an exchanging arm in a mold exchanging apparatus to a punch mounting portion of an upper turret in a turret punch press.

  Conventionally, in order to mount the punch die on the mounting portion on the turret, for example, the following operations [1] to [4] have been performed.

  [1]: The mold held by the punch arm (ATC) is moved to a mold replacement position on a turret set in advance (using a turning / sliding shaft).

  [2]: The punch arm is lowered to a predetermined position in a direction perpendicular to a predetermined turret station and stopped. The stop position depends on parameters prepared for each diameter of the punch die from the relationship between the die rotation prevention key in the hole-shaped mounting portion of the turret and the key groove of the punch die.

  The punch arm is configured to bend in the vertical direction in the event of any failure during the insertion operation in order to detect a die insertion error. And it has a proximity switch (proximity sensor) that detects the bending of the arm.

  [3]: In the punch insertion step, the punch arm is not bent due to force majeure, and when the release position is reached, the gripped mold is released and the mold is set at a predetermined station by falling under its own weight.

  [4]: As a final step of mold insertion, after the mold is opened, the normal mold is lowered to a clamping position and it is confirmed whether the punch mold is mounted correctly.

JP 2000-94064 A JP 2001-71062 A

  [A]: When a punch arm breakage is detected while the punch arm is moving to the position where the mold is released in the mold insertion step (background art [3] item) (shown in the background art [2] item) However, it was judged that the mold replacement was not completed normally, and the mold insertion process was interrupted and the machine was stopped.

  [B]: If the mold change process is interrupted, the failure will be restored, and the system cannot be continued unless the operator manually restores and restarts, so it takes time to recover. It was.

  [C]: There are no allowances for mold replacement that can cope with various situations of the mold and changes in the situation, such as changes over time of the machine. Maintenance was requested.

  An object of the present invention is to provide an effective punch mounting apparatus and punch mounting method.

  The invention according to claim 1 is a mold exchanging device for mounting a stored punch mold to a mounting portion of the turret, wherein the punch mold clamped by a gripping means provided on an arm is attached to the turret. Monitoring means for monitoring the load state on the gripping means during mounting on the mounting portion, and operation control means for continuing the mounting operation of the punch die when an abnormal load is recognized during monitoring by the monitoring means Is a mold exchanging device.

  According to a second aspect of the present invention, when the monitoring means recognizes the abnormal load, the operation of continuing the mounting of the punch mold is to place the punch mold held by the gripping means at a predetermined safety position. The mold exchanging apparatus according to claim 1, wherein the mold exchanging apparatus is raised once.

  The invention according to claim 3 has a detection sensor for detecting bending of the gripping means with respect to the arm, and the monitoring means recognizes the abnormal load based on detection of the detection sensor. It is a metal mold | die exchange apparatus as described in.

  According to a fourth aspect of the present invention, the punch die has a preset drop height when inserted into the mounting portion depending on its size, and is stored as a parameter. Or a mold exchanging apparatus according to claim 1.

  According to a fifth aspect of the present invention, the punch die has a key groove that slides with the key of the mounting portion, and the drop height of the punch die is determined in consideration of the slip between the key and the key groove. It is a metal mold | die exchange apparatus of any one of Claims 1 thru | or 4 memorize | stored beforehand.

  According to a sixth aspect of the present invention, the gripping means includes a confirmation sensor that detects the presence or absence of the punch mold, and the monitoring means determines that an abnormality occurs when the punch mold is not stored in a predetermined position. Item 6. The mold exchanging device according to any one of Items 1 to 5.

  According to a seventh aspect of the present invention, when the detection sensor detects a load while the gripping means is descending to confirm the presence or absence of the punch die, the operation control means performs the ascending operation and the descending operation a predetermined number of times. The mold exchanging apparatus according to claim 6, wherein the mold exchanging apparatus is executable.

  The invention according to claim 8 is a mold exchanging method for mounting the accommodated punch mold to the mounting portion of the turret, wherein the punch mold clamped by the gripping means provided on the arm is attached to the turret. A monitoring step of monitoring a load state on the gripping means during mounting, and an operation control step of continuing an insertion operation of the punch die when an abnormal load is detected during monitoring in the monitoring step. It is a mold exchange method including.

  In the event of punch mounting failure, the punch mounting failure can be automatically improved, so automatic die replacement work can be carried out over a long period of time with minimal interruption of automatic die replacement work. Can be done continuously.

It is the schematic which shows an outline in a metal mold | die exchange apparatus. It is explanatory drawing explaining an upper part and a lower turret. It is explanatory drawing explaining the basic operation | movement of a metal mold | die exchange apparatus. It is explanatory drawing explaining the basic operation | movement of a metal mold | die exchange apparatus. It is explanatory drawing explaining a parameter. It is explanatory drawing explaining the attachment operation | movement of a punch. It is explanatory drawing explaining the detection of the bending of a punch gripper. It is a flowchart which shows operation | movement of a metal mold | die exchange apparatus. It is explanatory drawing explaining the state in operation | movement of a holding means. It is explanatory drawing explaining the state in operation | movement of a holding means. It is explanatory drawing explaining the state in operation | movement of a holding means. It is explanatory drawing explaining the state in operation | movement of a holding means. It is explanatory drawing explaining the state in operation | movement of a holding means. It is explanatory drawing explaining the state in operation | movement of a holding means. It is explanatory drawing explaining the state in operation | movement of a holding means.

Embodiments of the present invention will be described with reference to the drawings.
Please refer to FIG. The processing system 1 of this example includes a storage (die storage device) 3 and a turret punch press 5.

  The storage 3 stores a punch die P and a die die D. Further, the punch dies P and die dies D mounted on the upper turret 5U and lower turret 5L of the turret punch press 5, and the punch dies stored in the upper storage turret 7U and lower storage turret 7L of the storage 3 are used. Since a mold exchanging device 9 (hereinafter referred to as “ATC”) for automatically exchanging the mold P and the die mold D is already well known, detailed description thereof will be omitted.

  Please refer to FIG. In general, in the turret punch press 5, the upper turret 5U has a plurality of punch mold mounting portions 5Uh and is configured to be rotatable with respect to the upper turret rotation center axis CU. The lower turret 5L has a plurality of die mold mounting portions 5Lh and is configured to be rotatable with respect to the lower turret rotation center axis CL. The upper turret rotation center axis CU and the lower turret rotation center axis CL are at different positions with respect to the press center PC.

  On the other hand, although not shown, a gap is provided at the center of the frame, and the upper turret 5U is rotatably supported by the upper frame in the gap. Further, the lower turret 5L of the lower frame is supported so as to be rotatable and indexable so as to face the upper turret 5U. A ram cylinder is provided at a location corresponding to the machining position of the upper frame, and machining is performed by lowering the ram.

  In the ATC 9, the axis for moving the arm (punch changer arm or the like) 13 holding the gripping means (punch gripper or the like) 11 up and down is the Pz axis, and the pivot axis in the horizontal plane of the arm (punch changer arm or the like) 13 is the R axis. A movement (movement in the expansion / contraction direction) axis of the gripping means (punch gripper or the like) 11 with respect to the (punch changer arm or the like) 13 is represented by a Ps axis. Also, the axis that moves the die changer arm 17 having the die gripper 15 at the tip is indicated by the Dz axis, the axis that opens and closes the gripper 15 that clamps (holds) the die is indicated by the Dg axis, and the expansion / contraction axis of the die changer arm 17 is indicated by the Ds axis. . A control device 25 for controlling the turret punch press 5, ATC 9, and storage 3 is provided in the vicinity of the machining system 1. The control device 25 is connected to the ATC 9 and is connected to the turret punch press 5 via the ATC 9. The storage 3 is also connected.

  The control device 25 is composed of a computer, and the CPU has input means (for example, a keyboard) for inputting various data, output means (for example, a CRT) for displaying various data, and the like. It is connected.

  In addition, the control device 25 monitors a load state on the gripping means 11 while the punch die P held by the gripping means 11 provided on the arm 13 is mounted on the upper turret 5U. An operation control unit 25b for continuing the mounting operation of the punch die P and a memory 27 when an abnormal load is detected during monitoring by the monitoring unit 25a.

  Then, the mounting operation of the punch die P when the monitoring unit 25a detects the load state by the operation control unit 25b is performed after the punch die P gripped by the gripping means 11 is raised to a predetermined safe position. Continue the downward insertion action.

  Please refer to FIG. 3 and FIG. FIG. 3 shows a case where the gripping means 11 is a normal load, and FIG. 4 shows a case where the load is an abnormal load. The arrow a1 indicates the rotation direction of the R axis, the arrow a2 indicates the vertical movement direction of the Pz axis, the arrow a3 indicates the horizontal movement direction of the Ps axis, and the arrow a4 indicates the downward direction of the Pz axis (see FIG. 1 for the detailed configuration).

  The monitoring unit 25a detects an abnormal load. This includes a detection sensor 13 s that detects bending of the gripping means 11 with respect to the arm 13, and the monitoring unit 25 a recognizes an abnormal load by detection of the detection sensor 13 s. On the other hand, a confirmation sensor 11s for detecting whether or not there is a punch die P is provided near the tip of the gripping means 11.

  Please refer to FIG. The contents of the table 27a stored in the memory 27 are shown. In addition, the following prm1-prm12 are parameters, and arbitrary numerical values can be set.

  [Setting item 1]: With respect to the setting item 1 of the load state release pull-up amount, the movement amount of the gripping means 11 for returning the folding of the gripping means 11 with respect to the arm 13 when the machine is stopped is set to prm1 (mm) and is set in the table 27a Remembered. [Setting item 2]: In the setting item 2 of the turret insertion retry counter, the number of executions of the retry operation of the punch die P is stored. In this example, prm is stored twice in the table 27a.

  [Setting item 3]: In the setting item 3 of the A range turret threshold, the safety height (A range) when the punch die P is opened is stored in the table 27a. In the case of the A range, prm3 (mm) is stored. [Setting item 4]: In the setting item 4 for the B range turret threshold, the safe height (B range) when the punch die P is opened is stored in the table 27a. In the case of the B range, prm4 (mm) is stored. [Setting item 5]: In the setting item 5 of the C range turret threshold, the safe height (C range) when the punch die P is opened is stored in the table 27a. In the case of the C range, prm5 (mm) is stored. [Setting item 6]: In the setting item 6 for the D range turret threshold, the safety height (D range) when the punch die P is opened is stored in the table 27a. In the case of the D range, prm6 (mm) is stored. Furthermore, [Setting item 7]: In the setting item 7 of the E range turret threshold, the safe height (E range) when the punch die P is opened is stored in the table 27a. In the case of the E range, prm7 (mm) is stored.

  [Setting item 8]: The setting value 8 of the die insertion release amount (A range) stores the punch die opening height (A range) during the normal operation of the gripping means 11. In this example, prm8 (mm) is stored. [Setting item 9]: A setting value 9 of the die insertion release amount (B range) stores the punch die opening height (B range) during the normal operation of the gripping means 11. In this example, prm9 (mm) is stored. [Setting item 10]: The setting value 10 of the die insertion release amount (C range) stores the punch die opening height (C range) during the normal operation of the gripping means 11. In this example, prm10 (mm) is stored. [Setting Item 11]: The setting value 11 of the die insertion release amount (D range) stores the punch die opening height (D range) during the normal operation of the gripping means 11. In this example, prm11 (mm) is stored. [Setting item 12]: The die insertion release amount (E range) setting item 12 stores the punch die opening height (E range) during normal operation of the gripping means 11. In this example, prm12 (mm) is stored.

  Please refer to FIG. The contents of [setting item prm3-7] and [setting item prm8-12] in the above (FIG. 5) are illustrated, and the punch mold has a diameter A (for example, 1/2, 1 + 1/4, 2, 3 + 1 / 2) (inch). In addition, it is illustrated that the safety height at which the punch die P held by the holding means 11 is opened is any one of prm3-7 (mm) from the reference position. Further, it is shown that the line CL of the normal opening height of the punch die P3 is any one of prm8-12 (mm) from the reference position. The reference position is the position of the lower end of the punch mold P when the punch mold P is mounted on the mounting portion 5Uh (position (predetermined (mm) from the line UL shown in FIG. 6)).

  On the other hand, a rotation prevention key K is provided below the mounting portion 5Uh of the punch die P. The rotation prevention key K is slidingly inserted into the key groove M of the punch die P to prevent the punch die P from rotating. Here, when the punch die P has a small diameter with respect to the opening position of the punch die P, the grip by the gripping means 11 is strong and the punch die P is restrained. It is desirable to open at a height that does not overlap with K.

  On the other hand, when the punch mold P has a large diameter, the punch mold P can rotate along the key groove M because the punch mold P can overcome the gripping force by the gripping means 11 by its own weight. The open position is lowered until it overlaps the prevention key K.

  In the above, when the punch mold P is mounted on the mounting portion 5Uh, each punch mold P gripped by the gripping means 11 from the storage 3 moves so as not to rotate. As a result, the punch mold P is stored in advance in the storage 3 at a predetermined angle (an angle at which the key groove and the angle of the key coincide with each other) so that the key groove M of the punch mold P slides on the rotation prevention key K. Insert it.

  Please refer to FIG. It has a detection sensor 13S for detecting the bending of the gripping means 11 with respect to the arm 13, and indicates that the monitoring means 25a recognizes the abnormality detection by the detection of the detection sensor 13S.

  The punch die P is gripped by an openable / closable claw portion GR provided at the tip of the horizontally long gripping means 11 (left side in FIG. 11). The claw portion GR has the same configuration as an ordinary punch die gripper and operates in the same manner, and thus detailed description thereof is omitted.

The gripping means 11 is held on the holding member 19 by two overload detection springs 17 and the like. When the punch mold P is in the descending stop state for some reason during the insertion of the punch mold P, a load from the punch mold P acts on the gripping means 11. In accordance with this load, the horizontally long gripping means 11 rotates overcoming the holding force of the two overload detection springs 17 with the overload rotation center position 15 as a reference axis. As a result, the proximity sensor 13S ₁ in the vicinity of the right end (see FIG. 11) of the gripping means 11 can recognize that is under abnormal load by a proximity sensor 13S ₂ leaves. Here, the holding member 19 is configured to be movable in the left-right direction on the paper surface via a slide portion 21 that slides on the rail 23. Since the holding member 19 has the center key 13K, it is possible to prevent the gripping means 11 from rolling (swing in the direction perpendicular to the paper surface).

  The operation of ATC 9 will be described with reference to FIG. The process in which the gripping means grips the mold taken out from the storage turret and the PZ axis is moved from the state (state a) positioned above the turret, the grip of the mold is released halfway and the turret is mounted normally. Three operation units: an operation unit (steps S01, S03, S15, S17, S27, S29), a retry operation unit before punch release (S05, S07, S09, S11) and a retry unit after punch release (S21, S23, S25) Consists of.

  First, in step S01, the die insertion operation of the punch die P is started under the control of the operation control unit 25b (Pz axis lowering start). At this time, in order to insert the punch die P into the mounting portion 5Uh having a small clearance with respect to the punch die P, the gripping force necessary for gripping the punch die P is reduced, and the degree of freedom of movement of the punch die P is increased. It is relaxed. This state (a) is shown in FIG. The gripping means of the arm 13 is in a state of being directly above the punch mold housing part 5Uh of the upper turret 5U into which the punch mold P gripped by 11 is to be inserted.

  In step S03, the monitoring unit 25a determines whether or not the Pz-axis positioning of the gripping unit 11 is complete. If the monitoring unit 25a determines that the positioning is complete, the process proceeds to step S15. If the monitoring unit 25a determines that the positioning is not complete, the process proceeds to step S05. Here, the set value of Prm8-12 (see FIG. 5) is used for each die range (diameter 1/2, 1 + 1/4, 2, 3 + 1/2 inch, etc.) of the punch die P.

  In step S05, the monitoring unit 25a determines whether or not an overload has occurred in the gripping means 11 and the arm 13. If the monitoring unit 25a determines that an overload has occurred in the gripping means 11 and the arm 13, the process proceeds to step S07. If the monitoring unit 25a determines that no load is generated on the gripping means 11 and the arm 13, the process returns to step S03.

  This state (b) is shown in FIG. While the gripping means 11 of the arm 13 is lowered on the Pz axis toward the punch mold P release position, the mold is caught on the inner wall portion of the turret, the punch mold P is not lowered, and only the gripping means 11 is lowered. A load is applied to the arm 13, and the monitoring unit 25a receives the detection signal and stops descending. The punch die P is often caught by the inner wall portion of the turret due to the relationship between the key (or key groove) of the punch die P and the key groove (or key) of the inner wall portion of the turret. The line L shown in the mounting portion 5Uh represents the position of the bottom surface of the punch die P at the release position of the punch die P, and the parameter prm8-12 (see FIG. 5) according to the die range. Set as

  In step S07, the operation control unit 25b performs the pulling-up operation of the punch die P for releasing the load state. Here, the lifting amount is prm1 (mm) of [Setting item 1] set in the table 27a from the position where the machine is stopped.

  In step S09, the monitoring unit 25a determines whether or not the overload state is canceled. When the monitoring unit 25a determines that the overload is released, the process proceeds to step S11. When the monitoring unit 25a determines that the overload is not canceled, the process proceeds to step S13.

  In step S11, the monitoring unit 25a determines whether or not the threshold determination at the completion of positioning is appropriate (whether it is within the threshold). When the monitoring unit 25a determines that the threshold determination at the completion of positioning is appropriate (within the threshold), the process proceeds to step S15. If the monitoring unit 25a determines that the threshold determination at the completion of positioning is not appropriate (outside the threshold), the process proceeds to step S13 and transitions to an alarm process. Here, each threshold value of prm3-7 (see FIG. 5) for each range of the punch die P set in the table 27a is referred to. Thereby, a safe height can be maintained.

  This state (c) is shown in FIG. The gripping means 11 that has stopped by detecting the load on the arm 13 pulls up the punch die P (the amount of pulling is set by prm1), catches the turret inner wall, and releases the load on the arm 13. As a result of raising the punch die P at this time, if the die position exceeds the turret threshold, it is judged that the punch die P has jumped out of the turret and it is difficult to release the punch, and an alarm process (step S13) is executed and the process is interrupted. If it is within the threshold, the punch is released (step S15). The turret threshold is set as a parameter (prm3-7).

  In step S13, the process transitions to an alarm process by the monitoring unit 25a. Thereby, it is possible to notify the operator of the defective setting of the punch die P.

  On the other hand, in step S15, the operation control unit 25b controls the gripping means 11 to open the punch die P (release the gripper clamp).

  This state (d) is shown in FIG. As a result of the above processing, the punch die P is set at the release position of the punch die P. If this position is normal and the process proceeds to step S15, the punch is released at the release position. However, when the process proceeds from step S11 to step S15, the position is released at the position where the value of prm1 is added to the position where the overload is detected (state (c) shown in FIG. 11). After this position is determined, the gripping means 11 releases the punch die P and releases it. Then, the punch die P naturally falls by its own weight and moves toward the punch insertion position. Further, the gripping means moves toward the insertion confirmation position of the punch die P in order to confirm that the punch die P has been set at the proper position.

  In step S17, in order to confirm the presence of the opened punch die P, the gripping means 11 moves to the punch insertion confirmation position under the control of the operation control unit 25b.

  In step S19, it is determined whether or not the positioning to the confirmation position is complete. If it is determined that the positioning has been completed, the process proceeds to step S27. If it is determined that the positioning has not been completed, the process proceeds to step S21 again.

  In step S21, the monitoring unit 25a determines whether or not an overload of the gripping means 11 and the arm 13 has occurred. If the monitoring unit 25a determines that an overload has occurred in the gripping means 11 and the arm 13, the process proceeds to step S23. If the monitoring unit 25a determines that no overload occurs in the gripping means 11 and the arm 13, the process returns to step S19 to continue the process.

  This state (e) is shown in FIG. This is a case in which the punch die P that naturally falls due to its own weight does not reach the punch insertion position but is caught in the middle, and the punch arm loading state of the gripping means 11 that has descended later is detected.

  In step S <b> 23, the operation control unit 25 b executes the load state release lifting operation of the gripping unit 11.

  This state (f) is shown in FIG. The method of releasing the catch of the punch die P in this case is by lifting the gripping means 11 by a predetermined amount (prm1) and then descending again to push down the head of the punch die P. This operation is executed by repeating the predetermined maximum number of times of switching (prm2) to the upper limit. If it still cannot be caught, an alarm process is performed and the process is interrupted. That is, in step S25, the monitoring unit 25a determines whether or not the retry counter is counted up. When the monitoring unit 25a determines that the retry counter is counted up, the process proceeds to step S13. When the monitoring unit 25a determines that the retry counter is not counted up, the process returns to step S17.

  In step S27, it is detected whether or not there is a punch die P at the confirmation position. Here, whether the punch die P is present or not is determined by the monitoring unit 25a based on detection by the punch confirmation sensor 11S (see FIGS. 3 and 4). When it is determined that the punch die P is present at the confirmation position, the process proceeds to step S29 where it is confirmed that the punch has ended normally. If it is determined that there is no punch die P at the confirmation position, the process proceeds to step S13.

  This state (g) is shown in FIG. The die that spontaneously drops due to its own weight is set to a normal position without being caught, the gripping means 11 is moved to the punch insertion confirmation position, and the punch mold at the confirmation position is confirmed by the punch confirmation sensor 11S attached to the gripping means 11. This is a state in which the presence of P is confirmed. Here, if it is confirmed that there is a punch die P, the process is temporarily ended (step S29), and a new punch die P2 is taken out from the storage turret to insert another punch die P into the turret. When the state (a) in step S01 is reached, the process is restarted. That is, in step S29, the process ends normally and shifts to the next sequence.

  The present invention is not limited to the embodiments of the invention described above, and can be implemented in other modes by making appropriate modifications.

DESCRIPTION OF SYMBOLS 1 ... Processing system 3 ... Storage 5 ... Turret punch press 5L ... Lower turret 5Lh ... Die mold storage part 5U ... Upper turret 5Uh ... Punch mold storage part 7L ... Lower storage turret 7U ... Upper storage turret 9 ... ATC
DESCRIPTION OF SYMBOLS 11 ... Grasping means 13 ... Arm 13S1 ... Proximity sensor 13S2 ... Proximity sensor 13s ... Detection sensor 15 ... Overload rotation center position 17 ... Overload detection spring 19 ... Holding member 21 ... Slide member 23 ... Rail 25 ... Control device 25a ... Monitoring Unit 25b ... Operation control unit 27 ... Memory P Punch (die)
D die

Claims (8)

A mold exchanging device for mounting a stored punch mold to a mounting portion of a turret,
Monitoring means for monitoring a load state on the gripping means during mounting the punch die held by the gripping means provided on the arm to the mounting portion of the turret;
A mold exchanging apparatus comprising: an operation control means for continuing the mounting operation of the punch mold when an abnormal load is recognized during monitoring by the monitoring means.   The operation of continuing the mounting of the punch mold when the monitoring means recognizes the abnormal load is characterized by temporarily raising the punch mold held by the gripping means to a predetermined safe position. The mold exchanging apparatus according to claim 1.   3. The sensor according to claim 1, further comprising: a detection sensor that detects bending of the gripping unit with respect to the arm, wherein the monitoring unit recognizes the abnormal load based on detection of the detection sensor. Mold changer.   4. The punch die according to any one of claims 1 to 3, wherein a drop height at the time of insertion into the mounting portion is set in advance depending on a size thereof, and is stored as a parameter. The mold exchanging device described in 1.   The punch mold has a key groove that slides with the key of the mounting portion, and the drop height of the punch mold is stored in advance in consideration of the slip between the key and the key groove. The mold exchanging apparatus according to any one of claims 1 to 4.   The said holding means is provided with the confirmation sensor which detects the presence or absence of the said punch metal mold | die, The said monitoring means judges that it is abnormal when the punch metal mold | die is not accommodated in the predetermined position. The mold exchanging apparatus according to any one of 5.   When the detection means detects a load while the gripping means is being lowered to confirm the presence or absence of the punching die, the operation control means can perform the ascending operation and the descending operation a predetermined number of times. The mold exchanging apparatus according to claim 6. A mold exchanging method for mounting the stored punch mold to the mounting portion of the turret,
A monitoring step of monitoring a load state on the gripping means while mounting the punch die held by the gripping means provided on the arm to the turret;
A mold exchanging method comprising: an operation control step of continuing an insertion operation of the punch die when an abnormal load is detected during monitoring in the monitoring step.

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