JP2011066359A - Soldering method and soldering device - Google Patents

Soldering method and soldering device Download PDF

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JP2011066359A
JP2011066359A JP2009218059A JP2009218059A JP2011066359A JP 2011066359 A JP2011066359 A JP 2011066359A JP 2009218059 A JP2009218059 A JP 2009218059A JP 2009218059 A JP2009218059 A JP 2009218059A JP 2011066359 A JP2011066359 A JP 2011066359A
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solder
substrate
base material
soldering
electronic component
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JP5397120B2 (en
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Munehiko Masutani
宗彦 増谷
Shigekazu Higashimoto
繁和 東元
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Toyota Industries Corp
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Toyota Industries Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a soldering method and a soldering device capable of soldering a component to a lower surface of a base material, without fail, without being affected by the thickness of the component. <P>SOLUTION: In the soldering method, a columnar solder 50 before melting is mounted on an electronic component 11, and a substrate 10 is mounted on the columnar solder 50 before molting, in a state where the lower surface 10b of the substrate 10 is separated from a bottom surface 32a of a first recessed part 32 of a pedestal 30 which serves as a base material contact member. Furthermore, by melting the columnar solder 50, the substrate 10 is moved downward to bring the lower surface 10b of the substrate 10 into contact with the bottom surface 32a of the first recessed part 32 of the pedestal 30, as well as, by the surface tension of the melted solder, the electronic component 11 is raised, up to the lower surface 10b side of the substrate 10 to solder the electronic component 11 to the lower surface 10b of the substrate 10. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、半田付け方法および半田付け装置に関するものである。   The present invention relates to a soldering method and a soldering apparatus.

特許文献１において、平板状部材を実装用基材上に接着するための平板状部材の実装方法が開示されている。詳しくは、図１３に示すように、平板状部材１０３の実装用治具（載置台）１００は、平板状部材１０３及び実装用基材１０５を載置する２つの凹部１０１，１０２を備えている。第一凹部１０１は、実装用基材１０５をフェイスダウン姿勢で載置する開口を有している。第一凹部１０１の底部に開口する第二凹部１０２は、フェイスダウン姿勢の平板状部材１０３と平板状部材１０３上に載置した接着部材１０４とを、実装用基材１０５の接着位置に位置決めして載置する開口と平板状部材１０３の厚さより実装時の接着部材１０４の厚さ分だけ深い深さを有する。そして、第二凹部１０２にフェイスダウン姿勢で平板状部材１０３を載置し、平板状部材１０３上に接着部材１０４を載置し、第一凹部１０１に実装用基材１０５を載置する。次に、実装用基材１０５及び平板状部材１０３を載置した実装用治具１００を加熱することにより、接着部材１０４を溶融させ、平板状部材１０３を実装用基材１０５に接着する。   In patent document 1, the mounting method of the flat member for adhere | attaching a flat member on the base material for mounting is disclosed. Specifically, as shown in FIG. 13, the mounting jig (mounting table) 100 for the flat plate member 103 includes two concave portions 101 and 102 for mounting the flat plate member 103 and the mounting base material 105. . The first recess 101 has an opening for mounting the mounting substrate 105 in a face-down posture. The second recess 102 opened at the bottom of the first recess 101 positions the flat plate member 103 in a face-down posture and the adhesive member 104 placed on the flat plate member 103 at the bonding position of the mounting substrate 105. The thickness of the adhesive member 104 at the time of mounting is deeper than the thickness of the opening for mounting and the flat plate member 103. Then, the flat plate member 103 is mounted in the second recess 102 in a face-down posture, the adhesive member 104 is mounted on the flat plate member 103, and the mounting substrate 105 is mounted on the first recess 101. Next, by heating the mounting jig 100 on which the mounting base material 105 and the flat plate member 103 are placed, the adhesive member 104 is melted, and the flat plate member 103 is bonded to the mounting base material 105.

特開２００６−９３２０５号公報JP 2006-93205 A

ところが、平板状部材１０３の厚さ寸法のばらつきに対応できなかった。また、対応するためには第二凹部１０２について深さが異なる実装用治具（載置台）１００を多数用意する必要がある。   However, it was not possible to cope with variations in the thickness dimension of the flat plate member 103. In order to cope with this, it is necessary to prepare a large number of mounting jigs (mounting tables) 100 having different depths for the second recess 102.

一方、図１４に示す手法を用いることが考えられる。図１４（ａ）において、治具１１０の上面に形成した凹部１１１に電子部品１１２と半田１１３を載せるとともに治具１１０の上面に基板１１４を、半田１１３との間に空隙ＡＧができる状態で配置する。そして、加熱により半田１１３が溶融したときに、図１４（ｂ）に示すように、半田１１３ａの凝集により基板１１４に半田１１３ａが接触し、半田１１３ａの表面張力によって図１４（ｃ）に示すように電子部品１１２が持ち上げられて基板１１４の下面１１４ａに電子部品１１２を半田付けする。   On the other hand, it is conceivable to use the method shown in FIG. 14A, the electronic component 112 and the solder 113 are placed on the recess 111 formed on the upper surface of the jig 110, and the substrate 114 is disposed on the upper surface of the jig 110 so that a gap AG is formed between the electronic device 112 and the solder 113. To do. When the solder 113 is melted by heating, as shown in FIG. 14B, the solder 113a comes into contact with the substrate 114 due to the aggregation of the solder 113a, and the surface tension of the solder 113a causes the solder 113a to come into contact as shown in FIG. The electronic component 112 is lifted to solder the electronic component 112 to the lower surface 114 a of the substrate 114.

ところが、電子部品１１２の位置決め用の治具１１０の寸法が決まっているため電子部品１１２の寸法公差が大きいと、うまく接合できない場合がある。これは、半田１１３と基板１１４との間の隙間の寸法Ｌ１０（図１４（ａ）参照）が変動するため、半田１１３と基板１１４との間の隙間の寸法Ｌ１０が溶融した半田１１３ａの高さＨ（図１４（ｂ）参照）よりも大きいときには持ち上げ力が働かずに半田付けされない場合や、隙間の寸法Ｌ１０がゼロ未満となり、押し付け状態になって半田１１３ａがはみ出す場合がある。   However, since the dimensions of the positioning jig 110 for the electronic component 112 are fixed, if the dimensional tolerance of the electronic component 112 is large, it may not be possible to join well. This is because the dimension L10 of the gap between the solder 113 and the substrate 114 (see FIG. 14A) varies, and therefore the height of the solder 113a in which the dimension L10 of the gap between the solder 113 and the substrate 114 is melted. When it is larger than H (see FIG. 14B), there is a case where the lifting force does not work and soldering is not performed, or the dimension L10 of the gap becomes less than zero and the solder 113a protrudes in a pressing state.

特に、半導体素子に比べてその他の電子部品は寸法公差が大きく、隙間の寸法Ｌ１０よりも電子部品１１２の厚さの寸法の公差が大きい。そのため、基板１１４の下面１１４ａでの半田付けが困難となる。   In particular, other electronic components have a larger dimensional tolerance than the semiconductor element, and the dimensional tolerance of the thickness of the electronic component 112 is larger than the gap dimension L10. Therefore, soldering on the lower surface 114a of the substrate 114 becomes difficult.

本発明は、このような背景の下になされたものであり、その目的は、部品の厚さの影響を受けることなく基材の下面に部品を確実に半田付けすることができる半田付け方法および半田付け装置を提供することにある。   The present invention has been made under such a background, and an object thereof is a soldering method capable of reliably soldering a component to the lower surface of a base material without being affected by the thickness of the component, and It is to provide a soldering apparatus.

請求項１に記載の発明では、基材の下面に部品を半田付けする半田付け方法であって、前記部品の上に溶融前の半田を載置するとともに、当該溶融前の半田の上に前記基材を、前記基材の下面が基材接触部材から離間する状態で載置する第１工程と、前記半田を溶融させることにより前記基材を下動させて前記基材の下面を前記基材接触部材に接触させるとともに溶融させた半田の表面張力によって前記部品を前記基材の下面側に持ち上げる第２工程と、を有することを要旨とする。   The invention according to claim 1 is a soldering method for soldering a component to the lower surface of a base material, wherein the solder before melting is placed on the component, and the solder on the solder before melting A first step of placing the base material in a state in which the lower surface of the base material is separated from the base material contact member; and lowering the lower surface of the base material by lowering the base material by melting the solder. And a second step of lifting the component to the lower surface side of the substrate by the surface tension of the solder which is brought into contact with the material contact member and melted.

請求項１に記載の発明によれば、第１工程において、部品の上に溶融前の半田が載置されるとともに、溶融前の半田の上に基材が、基材の下面が基材接触部材から離間する状態で載置される。第２工程において、半田を溶融させることにより基材が下動されて基材の下面が基材接触部材に接触させられるとともに溶融させた半田の表面張力によって部品が基材の下面側に持ち上げられる。   According to the first aspect of the present invention, in the first step, the solder before melting is placed on the component, the base material is on the solder before melting, and the lower surface of the base material is in contact with the base material. It is placed in a state of being separated from the member. In the second step, the base material is moved down by melting the solder so that the lower surface of the base material is brought into contact with the base material contact member, and the component is lifted to the lower surface side of the base material by the surface tension of the melted solder. .

これにより、部品の厚さがばらついても溶融前の半田の上端が基材の下面に接触し、また、溶融前の半田の下端が部品に接触しているので、部品の厚さの影響を受けることなく基材の下面に部品が確実に半田付けされる。   As a result, even if the thickness of the component varies, the upper end of the solder before melting is in contact with the lower surface of the base material, and the lower end of the solder before melting is in contact with the component. The parts are securely soldered to the lower surface of the base material without receiving.

請求項２に記載のように、請求項１に記載の半田付け方法において、前記基材の下面および上面に部品を同時に半田付けするとよい。
請求項３に記載のように、請求項１または２に記載の半田付け方法において、前記溶融前の半田は柱状半田であるとよい。 As described in claim 2, in the soldering method according to claim 1, it is preferable to solder the parts to the lower surface and the upper surface of the base material simultaneously.
As described in claim 3, in the soldering method according to claim 1 or 2, the solder before melting is preferably columnar solder.

請求項４に記載の発明では、基材の下面に部品を半田付けする半田付け装置であって、上面に、前記基材が配置される第１の凹部が形成されるとともに、前記第１の凹部の底面に、前記部品が配置される第２の凹部が形成され、溶融前の半田の下端が前記部品の上面に接触するとともに前記溶融前の半田の上端が前記基材の下面に接触し、かつ、前記基材の下面が前記第１の凹部の底面と離間する状態で配置される台座と、前記半田を溶融させることにより前記基材を下動させて前記基材の下面を前記第１の凹部の底面に接触させるとともに溶融させた半田の表面張力によって前記部品を基材の下面側に持ち上げるための加熱手段と、を備えたことを要旨とする。   According to a fourth aspect of the present invention, there is provided a soldering apparatus for soldering a component to a lower surface of a base material, wherein a first recess in which the base material is disposed is formed on the upper surface, and the first A second recess in which the component is disposed is formed on the bottom surface of the recess, the lower end of the solder before melting contacts the upper surface of the component, and the upper end of the solder before melting contacts the lower surface of the substrate. And a base arranged in a state where the lower surface of the base material is separated from the bottom surface of the first recess, and the base material is moved downward by melting the solder so that the lower surface of the base material is And a heating means for lifting the component to the lower surface side of the base material by the surface tension of the solder which is brought into contact with the bottom surface of the concave portion of 1 and melted.

請求項４に記載の発明によれば、台座において第１の凹部に基材が配置されるとともに第２の凹部に部品が配置され、溶融前の半田の下端が部品の上面に接触するとともに溶融前の半田の上端が基材の下面に接触し、かつ、基材の下面が第１の凹部の底面と離間する状態で配置される。加熱手段によって半田を溶融させることにより基材が下動して基材の下面が第１の凹部の底面に接触するとともに溶融させた半田の表面張力によって部品が基材の下面側に持ち上げられる。これにより、部品の厚さの影響を受けることなく基材の下面に部品が確実に半田付けされる。   According to the fourth aspect of the present invention, the base is disposed in the first recess and the component is disposed in the second recess in the pedestal, and the lower end of the solder before melting contacts the upper surface of the component and melts. The upper end of the previous solder is in contact with the lower surface of the substrate, and the lower surface of the substrate is disposed in a state of being separated from the bottom surface of the first recess. When the solder is melted by the heating means, the base material moves downward, the lower surface of the base material comes into contact with the bottom surface of the first recess, and the component is lifted to the lower surface side of the base material by the surface tension of the melted solder. This ensures that the component is soldered to the lower surface of the substrate without being affected by the thickness of the component.

請求項５に記載のように、請求項４に記載の半田付け装置において、前記溶融前の半田は柱状半田であるとよい。   As described in claim 5, in the soldering apparatus according to claim 4, the solder before melting is preferably columnar solder.

本発明によれば、部品の厚さの影響を受けることなく基材の下面に部品を確実に半田付けすることができる。   According to the present invention, a component can be reliably soldered to the lower surface of the substrate without being affected by the thickness of the component.

実施形態における半田付け装置の分解図。The exploded view of the soldering apparatus in an embodiment. 実施形態における半田付け方法を説明するための断面図。Sectional drawing for demonstrating the soldering method in embodiment. 実施形態における半田付け方法を説明するための断面図。Sectional drawing for demonstrating the soldering method in embodiment. 実施形態における半田付け方法を説明するための断面図。Sectional drawing for demonstrating the soldering method in embodiment. 実施形態における半田付け方法を説明するための断面図。Sectional drawing for demonstrating the soldering method in embodiment. 実施形態における半田付け方法を説明するための断面図。Sectional drawing for demonstrating the soldering method in embodiment. 実施形態における半田付け方法を説明するための断面図。Sectional drawing for demonstrating the soldering method in embodiment. 実施形態における半田付け方法を説明するための断面図。Sectional drawing for demonstrating the soldering method in embodiment. 実施形態における半田付け方法を説明するための断面図。Sectional drawing for demonstrating the soldering method in embodiment. 別例の半田付け装置の断面図。Sectional drawing of the soldering apparatus of another example. 別例の半田付け装置の断面図。Sectional drawing of the soldering apparatus of another example. 別例の半田付け装置の断面図。Sectional drawing of the soldering apparatus of another example. 背景技術における平板状部材の実装方法を説明するための断面図。Sectional drawing for demonstrating the mounting method of the flat member in background art. （ａ），（ｂ），（ｃ）は半田付け方法を説明するための断面図。(A), (b), (c) is sectional drawing for demonstrating the soldering method.

以下、本発明を具体化した一実施形態を図面に従って説明する。
図１には、本実施形態における半田付け装置２０の分解図を示す。図２〜図５は本実施形態における半田付け方法を説明するための断面図である。半田付け装置２０を用いて、図６に示すように基材としての基板１０の下面１０ｂに電子部品１１を半田付けすることができる。つまり、基板１０における上面１０ａの表面に対し裏面となる下面１０ｂに電子部品１１が半田付けされる。 DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, an embodiment of the invention will be described with reference to the drawings.
In FIG. 1, the exploded view of the soldering apparatus 20 in this embodiment is shown. 2-5 is sectional drawing for demonstrating the soldering method in this embodiment. Using the soldering device 20, the electronic component 11 can be soldered to the lower surface 10b of the substrate 10 as a base material as shown in FIG. That is, the electronic component 11 is soldered to the lower surface 10b that is the back surface of the upper surface 10a of the substrate 10.

図１に示すように、半田付け装置２０は、電子部品半田付け用治具としての台座（ブロック）３０と、加熱手段としてのヒートプレート４０とを備えている。台座３０は上面３０ａに第１の凹部３２が形成されている。第１の凹部３２の内部には基板１０を配置することができるとともに第１の凹部３２の内部において基板１０が上下に移動できるようになっている。第１の凹部３２の底面３２ａが基板１０の下面１０ｂの接触面となる。   As shown in FIG. 1, the soldering apparatus 20 includes a pedestal (block) 30 as an electronic component soldering jig and a heat plate 40 as heating means. The pedestal 30 has a first recess 32 formed on the upper surface 30a. The substrate 10 can be placed inside the first recess 32 and the substrate 10 can move up and down inside the first recess 32. The bottom surface 32 a of the first recess 32 becomes a contact surface of the lower surface 10 b of the substrate 10.

台座３０の第１の凹部３２の底面３２ａには第２の凹部３３が形成されている。第２の凹部３３の内部には電子部品１１を配置することができるとともに第２の凹部３３の内部において電子部品１１が上下に移動できるようになっている。第２の凹部３３の底面３３ａが電子部品１１の載置面となる。   A second recess 33 is formed on the bottom surface 32 a of the first recess 32 of the pedestal 30. The electronic component 11 can be placed inside the second recess 33 and the electronic component 11 can move up and down inside the second recess 33. The bottom surface 33 a of the second recess 33 serves as a mounting surface for the electronic component 11.

また、ヒートプレート４０は通電により発熱する板状発熱体であり、ヒートプレート４０により台座３０、基板１０等を加熱して柱状半田５０を溶融することができるようになっている。   The heat plate 40 is a plate-like heating element that generates heat when energized, and the columnar solder 50 can be melted by heating the pedestal 30, the substrate 10, and the like with the heat plate 40.

次に、半田付け方法について説明する。
図２に示すように、台座３０の第２の凹部３３における底面３３ａに電子部品１１を載置する。さらに、電子部品１１の上面における中央部に、溶融前の柱状半田５０を直立した状態で配置する。柱状半田５０は円柱状または角柱状をなす。さらに、台座３０の第１の凹部３２に基板１０を配置する。柱状半田５０の下端５０ａが電子部品１１の上面に接触し、柱状半田５０の上端５０ｂが基板１０の下面１０ｂに接触し、基板１０の下面１０ｂの中央に位置する柱状半田５０で基板１０が支えられている。 Next, a soldering method will be described.
As shown in FIG. 2, the electronic component 11 is placed on the bottom surface 33 a of the second recess 33 of the pedestal 30. Furthermore, the columnar solder 50 before melting is arranged in an upright state at the center of the upper surface of the electronic component 11. The columnar solder 50 has a columnar shape or a prismatic shape. Further, the substrate 10 is disposed in the first recess 32 of the pedestal 30. The lower end 50a of the columnar solder 50 is in contact with the upper surface of the electronic component 11, the upper end 50b of the columnar solder 50 is in contact with the lower surface 10b of the substrate 10, and the substrate 10 is supported by the columnar solder 50 located at the center of the lower surface 10b of the substrate 10. It has been.

詳しくは、半田付けしたい面の面積よりも小さく、かつ厚さ方向には大きな柱状半田５０を半田付け部の中央に搭載する。この柱状半田５０は、狙いの半田付け形状と同じ体積で、半田溶融時に電子部品１１の持ち上げ力が電子部品１１の重さよりも大きくなるような濡れ形状を形成できる投影面積（図３のＡ−Ａ線における面積）の半田である。   Specifically, a columnar solder 50 smaller than the area of the surface to be soldered and large in the thickness direction is mounted at the center of the soldering portion. The columnar solder 50 has the same volume as the target soldering shape, and a projected area (A- in FIG. 3) that can form a wet shape in which the lifting force of the electronic component 11 is larger than the weight of the electronic component 11 when the solder is melted. (Area in A line).

このとき、基板１０の下面１０ｂは第１の凹部３２の底面３２ａと離間する状態で配置される。即ち、基板１０の下面１０ｂと第１の凹部３２の底面３２ａとの間には空隙が形成されている。   At this time, the lower surface 10 b of the substrate 10 is disposed in a state of being separated from the bottom surface 32 a of the first recess 32. That is, a gap is formed between the lower surface 10 b of the substrate 10 and the bottom surface 32 a of the first recess 32.

このようにして、第１工程として、電子部品１１の上に溶融前の柱状半田５０を載置するとともに、溶融前の柱状半田５０の上に基板１０を、基板１０の下面１０ｂが基材接触部材としての台座３０の第１の凹部３２の底面３２ａから離間する状態で載置する。   In this way, as a first step, the columnar solder 50 before melting is placed on the electronic component 11, the substrate 10 is placed on the columnar solder 50 before melting, and the lower surface 10 b of the substrate 10 is in contact with the base material. It mounts in the state spaced apart from the bottom face 32a of the 1st recessed part 32 of the base 30 as a member.

そして、ヒートプレート４０の作動（通電）によりヒートプレート４０を発熱させ、柱状半田５０を加熱によって溶融させる。これにより、図２の柱状半田５０が溶融することによって図３に示すように流動化した溶融半田５０ｃとなる。溶融させた半田５０ｃにおいては、上下方向の中央がくびれた（絞られた）形状になる。柱状半田５０の溶融により基板１０はその重さにより下動して図４に示すように基板１０の下面１０ｂが第１の凹部３２の底面３２ａに接触する。そして、溶融させた半田５０ｃの表面張力により図５に示すように電子部品１１が基板１０の下面１０ｂ側に持ち上げられる（上動される）。   Then, the operation of the heat plate 40 (energization) causes the heat plate 40 to generate heat, and the columnar solder 50 is melted by heating. As a result, the columnar solder 50 of FIG. 2 is melted to form a fluidized molten solder 50c as shown in FIG. The melted solder 50c has a constricted (squeezed) shape in the vertical center. As the columnar solder 50 melts, the substrate 10 moves downward due to its weight, and the lower surface 10b of the substrate 10 contacts the bottom surface 32a of the first recess 32 as shown in FIG. Then, the electronic component 11 is lifted (moved upward) to the lower surface 10b side of the substrate 10 by the surface tension of the melted solder 50c as shown in FIG.

つまり、加熱し柱状半田５０が溶融すると、電子部品１１と基板１０に対して溶融半田５０ｃが濡れ、液体の溶融半田５０ｃの表面張力により持ち上げ力が発生する。詳しくは、図３において、電子部品１１の持ち上げ力は、半田５０ｃの表面張力、半田５０ｃにおける基板１０の濡れ角度θ、液体の溶融半田５０ｃのメニスカス架橋半径ｒ、基板１０と電子部品１１との距離Ｌ１で決定される。そして、持ち上げ力が電子部品１１の重さよりも大きくなる形状になるように予め準備してあるため、電子部品１１は持ち上げられる。   That is, when the columnar solder 50 is melted by heating, the molten solder 50c gets wet with the electronic component 11 and the substrate 10, and a lifting force is generated by the surface tension of the liquid molten solder 50c. Specifically, in FIG. 3, the lifting force of the electronic component 11 includes the surface tension of the solder 50 c, the wetting angle θ of the substrate 10 in the solder 50 c, the meniscus bridge radius r of the liquid molten solder 50 c, and the substrate 10 and the electronic component 11. It is determined by the distance L1. Since the lifting force is prepared in advance so as to have a shape larger than the weight of the electronic component 11, the electronic component 11 is lifted.

電子部品１１が持ち上げられることにより、電子部品１１と基板１０の間の距離Ｌ１が小さくなり、それに伴って溶融半田５０ｃが濡れ広がり、最終的には電子部品１１と基板１０が所望の形状で半田付けされる。   When the electronic component 11 is lifted, the distance L1 between the electronic component 11 and the substrate 10 is reduced, and accordingly, the molten solder 50c is wet and spreads. Finally, the electronic component 11 and the substrate 10 are soldered in a desired shape. Attached.

このようにして、第２工程として、半田を溶融させることにより基板１０を下動させて基板１０の下面１０ｂを台座３０の第１の凹部３２の底面３２ａに接触させるとともに溶融させた半田の表面張力によって電子部品１１を基板１０の下面１０ｂ側に持ち上げる。   In this way, as a second step, the substrate 10 is moved downward by melting the solder so that the lower surface 10b of the substrate 10 is brought into contact with the bottom surface 32a of the first recess 32 of the pedestal 30, and the molten solder surface The electronic component 11 is lifted to the lower surface 10b side of the substrate 10 by tension.

その後、冷却すると、図６に示すように、基板１０の下面１０ｂに電子部品１１が半田５０ｄにより接合される（半田付けされる）。
図７，８，９を用いて電子部品１１の厚さにばらつきがあった場合を説明する。 Thereafter, when cooled, as shown in FIG. 6, the electronic component 11 is joined (soldered) to the lower surface 10b of the substrate 10 by solder 50d.
A case where the thickness of the electronic component 11 varies will be described with reference to FIGS.

図２に比べて図７に示すように電子部品１１の厚さがΔｔだけ薄くなった場合において、図２に比べて図７では基板１０がΔｔだけ下方に位置する。そして、加熱によって図８に示すように柱状半田５０を溶融させて、半田５０ｃの表面張力により図９に示すように電子部品１１が持ち上げられる。その後、冷却すると、基板１０の下面１０ｂに電子部品１１が半田付けされる。   When the thickness of the electronic component 11 is reduced by Δt as shown in FIG. 7 as compared with FIG. 2, the substrate 10 is positioned downward by Δt in FIG. 7 as compared with FIG. Then, the columnar solder 50 is melted by heating as shown in FIG. 8, and the electronic component 11 is lifted as shown in FIG. 9 by the surface tension of the solder 50c. Thereafter, when cooled, the electronic component 11 is soldered to the lower surface 10 b of the substrate 10.

このようにして、図２，３，５と図７，８，９を比較すれば、いずれの場合も、加熱時に柱状半田５０は上端５０ｂが基板１０の下面１０ｂと接触するとともに下端５０ａが電子部品１１と接触している。即ち、電子部品１１の厚さにばらつきがあっても半田溶融前の状態において柱状半田５０を基板１０および電子部品１１と接触させることができる。   2 and 5 and FIGS. 7, 8, and 9, the columnar solder 50 has the upper end 50b in contact with the lower surface 10b of the substrate 10 and the lower end 50a is an electron in any case. It is in contact with the part 11. That is, even if the thickness of the electronic component 11 varies, the columnar solder 50 can be brought into contact with the substrate 10 and the electronic component 11 before the solder is melted.

つまり、電子部品１１の寸法ばらつきに対応でき、また、図１４で説明した基板１１４と半田１１３との間に空隙ＡＧがある手法に比べて、より大きな隙間がある場合（電子部品１１の厚さに大きなばらつきがある場合）に対応できる。これにより、電子部品１１の厚さ寸法のばらつきの許容値が緩くなる。   That is, it is possible to cope with the dimensional variation of the electronic component 11 and when there is a larger gap (the thickness of the electronic component 11) than the method in which the gap AG is present between the substrate 114 and the solder 113 described in FIG. In the case of large variations). Thereby, the tolerance value of the variation of the thickness dimension of the electronic component 11 becomes loose.

以上のごとく本実施形態によれば、以下のような効果を得ることができる。
（１）半田付け方法として、図２のように電子部品１１上において柱状半田５０により基板１０を支える。このとき、基板１０の下面１０ｂは台座３０の第１の凹部３２の底面３２ａと離間している。そして、図３に示すように柱状半田５０を溶融することによって図５に示すように半田の表面張力により電子部品１１を持ち上げる。これにより、電子部品１１の厚さがばらついても溶融前の半田５０の上端５０ｂが基板１０の下面１０ｂに接触し、また、溶融前の半田５０の下端５０ａが電子部品１１に接触しているので、電子部品１１の厚さの影響を受けることなく基材としての基板１０の下面１０ｂに電子部品１１を確実に半田付けすることができる。即ち、電子部品１１の寸法公差の影響が無くなる。 As described above, according to the present embodiment, the following effects can be obtained.
(1) As a soldering method, the substrate 10 is supported by the columnar solder 50 on the electronic component 11 as shown in FIG. At this time, the lower surface 10 b of the substrate 10 is separated from the bottom surface 32 a of the first recess 32 of the pedestal 30. Then, by melting the columnar solder 50 as shown in FIG. 3, the electronic component 11 is lifted by the surface tension of the solder as shown in FIG. Thereby, even if the thickness of the electronic component 11 varies, the upper end 50b of the solder 50 before melting is in contact with the lower surface 10b of the substrate 10, and the lower end 50a of the solder 50 before melting is in contact with the electronic component 11. Therefore, the electronic component 11 can be reliably soldered to the lower surface 10b of the substrate 10 as a base material without being affected by the thickness of the electronic component 11. That is, the influence of the dimensional tolerance of the electronic component 11 is eliminated.

（２）半田付け装置の構成として、第１の凹部３２および第２の凹部３３が形成された台座３０と、加熱手段としてのヒートプレート４０を備え、台座３０の第２の凹部３３に電子部品１１を配置するとともに第１の凹部３２に基板１０を配置し、かつ、基板１０を電子部品１１の上の柱状半田５０で支え、ヒートプレート４０により柱状半田５０を溶融させて半田の表面張力により電子部品１１を持ち上げる。この装置を用いて上記（１）の半田付け方法を行なうことができる。   (2) As a configuration of the soldering apparatus, a pedestal 30 in which the first concave portion 32 and the second concave portion 33 are formed and a heat plate 40 as a heating means are provided, and an electronic component is provided in the second concave portion 33 of the pedestal 30. 11 and the substrate 10 is disposed in the first recess 32, and the substrate 10 is supported by the columnar solder 50 on the electronic component 11, and the columnar solder 50 is melted by the heat plate 40, and the surface tension of the solder The electronic component 11 is lifted. Using this apparatus, the soldering method (1) can be performed.

実施形態は前記に限定されるものではなく、例えば、次のように具体化してもよい。
○図２に代わり図１０に示すように、溶融前の半田として、上下方向において分割した半田５１，５２，５３を用い、これら半田５１，５２，５３を積層して使用してもよい。 The embodiment is not limited to the above, and may be embodied as follows, for example.
As shown in FIG. 10 instead of FIG. 2, solder 51, 52, 53 divided in the vertical direction may be used as the solder before melting, and these solders 51, 52, 53 may be laminated and used.

○図２に代わり図１１に示すように、溶融前の半田として、曲げ等の形状加工が施された半田５４を用いてもよい。図１１の場合には板状の半田を半円状に曲げ加工して用いた場合を示している。   As shown in FIG. 11 instead of FIG. 2, solder 54 that has been subjected to shape processing such as bending may be used as the solder before melting. In the case of FIG. 11, a case where a plate-like solder is bent into a semicircle is used.

○図２に代わり図１２に示すように、一つの電子部品１１の上に複数の柱状半田５７，５８を配置してもよい。
○加熱手段としてヒートプレート４０（通電により発熱する板状発熱体）を用いたが、これに限るものではなく、他にも例えば、高周波誘導加熱装置や、ランプで光や赤外線を加熱すべき箇所に照射して加熱を行う加熱機器や、加熱炉の内部全体を加熱する装置であってもよい。 As shown in FIG. 12 instead of FIG. 2, a plurality of columnar solders 57 and 58 may be arranged on one electronic component 11.
Although the heat plate 40 (a plate-like heating element that generates heat when energized) is used as a heating means, the present invention is not limited to this. For example, a place where light or infrared rays should be heated by a high-frequency induction heating device or a lamp It may be a heating apparatus that irradiates and heats, or a device that heats the entire interior of the heating furnace.

○図１において仮想線で示すごとく基板１０の上面１０ａに板半田５５を介して電子部品１５を載せて加熱により基板１０の下面１０ｂと同時に上面１０ａの半田付けを行なう場合に適用してもよい。即ち、基板１０の下面１０ｂおよび上面１０ａに部品（１０，１５）を同時に半田付けするようにしてもよい。   As shown in phantom lines in FIG. 1, the electronic component 15 may be placed on the upper surface 10a of the substrate 10 via the plate solder 55, and the upper surface 10a may be soldered simultaneously with the lower surface 10b of the substrate 10 by heating. . That is, the components (10, 15) may be soldered to the lower surface 10b and the upper surface 10a of the substrate 10 at the same time.

○基材は基板１０であったが、これに限るものでなく、基板１０に代わり、例えばヒートシンク等の放熱部材（放熱板）を基材として、この放熱部材に部品を半田付けする場合に適用してもよい。   ○ The base material was the substrate 10, but is not limited to this, and instead of the substrate 10, for example, a heat radiating member (heat radiating plate) such as a heat sink is used as a base material and applied when soldering parts to the heat radiating member May be.

１０…基板、１０ａ…上面、１０ｂ…下面、１１…電子部品、１５…電子部品、２０…半田付け装置、３０…台座、３２…第１の凹部、３２ａ…底面、３３…第２の凹部、４０…ヒートプレート、５０…柱状半田、５１，５２，５３…半田、５４…半田、５７，５８…柱状半田。   DESCRIPTION OF SYMBOLS 10 ... Board | substrate, 10a ... Upper surface, 10b ... Lower surface, 11 ... Electronic component, 15 ... Electronic component, 20 ... Soldering device, 30 ... Base, 32 ... 1st recessed part, 32a ... Bottom surface, 33 ... 2nd recessed part, 40 ... Heat plate, 50 ... Columnar solder, 51, 52, 53 ... Solder, 54 ... Solder, 57, 58 ... Columnar solder.

Claims (5)

基材の下面に部品を半田付けする半田付け方法であって、
前記部品の上に溶融前の半田を載置するとともに、当該溶融前の半田の上に前記基材を、前記基材の下面が基材接触部材から離間する状態で載置する第１工程と、
前記半田を溶融させることにより前記基材を下動させて前記基材の下面を前記基材接触部材に接触させるとともに溶融させた半田の表面張力によって前記部品を前記基材の下面側に持ち上げる第２工程と、
を有することを特徴とする半田付け方法。 A soldering method for soldering a component to the lower surface of a substrate,
A first step of placing the unmelted solder on the component, and placing the substrate on the unmelted solder in a state in which the lower surface of the substrate is separated from the substrate contact member; ,
The base material is moved downward by melting the solder so that the lower surface of the base material comes into contact with the base material contact member, and the component is lifted to the lower surface side of the base material by the surface tension of the melted solder. Two steps,
A soldering method characterized by comprising: 前記基材の下面および上面に部品を同時に半田付けすることを特徴とする請求項１に記載の半田付け方法。   The soldering method according to claim 1, wherein parts are simultaneously soldered to the lower surface and the upper surface of the base material. 前記溶融前の半田は柱状半田であることを特徴とする請求項１または２に記載の半田付け方法。   The soldering method according to claim 1 or 2, wherein the solder before melting is columnar solder. 基材の下面に部品を半田付けする半田付け装置であって、
上面に、前記基材が配置される第１の凹部が形成されるとともに、前記第１の凹部の底面に、前記部品が配置される第２の凹部が形成され、溶融前の半田の下端が前記部品の上面に接触するとともに前記溶融前の半田の上端が前記基材の下面に接触し、かつ、前記基材の下面が前記第１の凹部の底面と離間する状態で配置される台座と、
前記半田を溶融させることにより前記基材を下動させて前記基材の下面を前記第１の凹部の底面に接触させるとともに溶融させた半田の表面張力によって前記部品を基材の下面側に持ち上げるための加熱手段と、
を備えたことを特徴とする半田付け装置。 A soldering device for soldering a component to the lower surface of a substrate,
A first recess in which the base material is disposed is formed on the upper surface, and a second recess in which the component is disposed is formed on the bottom surface of the first recess, and the lower end of the solder before melting is A pedestal that is in contact with the upper surface of the component, the upper end of the solder before melting is in contact with the lower surface of the base material, and the lower surface of the base material is separated from the bottom surface of the first recess; ,
The base material is moved downward by melting the solder so that the lower surface of the base material is brought into contact with the bottom surface of the first recess, and the component is lifted to the lower surface side of the base material by the surface tension of the melted solder. Heating means for,
A soldering apparatus comprising: 前記溶融前の半田は柱状半田であることを特徴とする請求項４に記載の半田付け装置。   The soldering apparatus according to claim 4, wherein the solder before melting is a columnar solder.
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Publication number Priority date Publication date Assignee Title
JP2016078109A (en) * 2014-10-22 2016-05-16 株式会社フジクラ Solder joint method, production method of ld module and solder joint device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230292A (en) * 1988-03-09 1989-09-13 Fujitsu Ltd Soldering method for surface mounting parts
JP2006093205A (en) * 2004-09-21 2006-04-06 New Japan Radio Co Ltd Mounting tool and mounting method for flat member

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01230292A (en) * 1988-03-09 1989-09-13 Fujitsu Ltd Soldering method for surface mounting parts
JP2006093205A (en) * 2004-09-21 2006-04-06 New Japan Radio Co Ltd Mounting tool and mounting method for flat member

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2016078109A (en) * 2014-10-22 2016-05-16 株式会社フジクラ Solder joint method, production method of ld module and solder joint device

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