JP2011060544A - Structure of connecting mounting board with electronic component, and electronic device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To suppress an increase in contact resistance at a contact by suppressing sliding of the contact of a lead part with a connector part as connection terminals. <P>SOLUTION: The connector part 40 is constituted of a locking part 41 and an unlocking part 42. When locking, a leading end of the lead part 11 is fixed by a leading end spring 41a and a nip spring 41b provided on the locking part 41. When unlocking, the nip spring 41b is pushed and opened by the unlocking part 42 that the lead part 11 can be drawn out of the connector part 40. Owing to the above configuration, when the lead part 11 is pushed into the connector part 40, the leading end of the lead part 11 can be surely fixed by the leading end spring 41a and the nip spring 41b, thereby suppressing sliding of the lead part 11 in the connector part 40 which is caused by exertion of external force due to thermal expansion. Thus, the increase in contact resistance at the contact can be suppressed. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a connection structure for performing electrical and mechanical connection between a mounting substrate provided with a connector member and an electronic component from which a lead portion is drawn, and an electronic device using the connection structure. .

  Conventionally, in Patent Document 1, as a detachable connection structure between an electronic component having a lead portion and a substrate, a socket is soldered to a through hole formed in the substrate, and the lead of the electronic component is inserted into the socket. Discloses a connection structure for electrically and mechanically connecting a substrate and an electronic component. Specifically, in such a connection structure, one end portion of the socket is provided with an elastic pinching portion that is separated into a plurality and is tapered toward the tip. The lead portion has a diameter larger than that of the elastic pinching portion. When the lead portion is inserted from the other end portion side of the socket to the one end portion side, the lead portion is electrically connected to the socket by contacting the elastic pinching portion. And mechanically connected to the socket by the elastic force of the elastic clamping portion.

  Patent Document 2 discloses a structure in which a female-side contact portion is engaged with a male-side plug portion for the purpose of preventing a connection portion from coming off for connection between a flexible substrate and a printed board. With such a structure, it is possible to make it difficult for the plug portion to come out of the contact portion, and it is possible to prevent poor connection.

Utility Model Registration No. 3104494 JP 2001-52788 A

  However, in the connection structure between the electronic component and the substrate as in Patent Document 1, the lead portion is only held by the elastic force of the elastic clamping portion. For this reason, when an external force is applied to the lead part due to thermal expansion or vibration of the electronic component, the contact may slide between the lead part and the elastic clamping part, and the contact may further slide and wear. When this occurs, there is a problem that the contact resistance increases.

  On the other hand, in the connection structure as in Patent Document 2, it is difficult to come off because the plug part and the contact part are engaged, but only the contact that is elastically deformed in the direction perpendicular to the fitting direction is engaged, The contact of the engaging part is in contact with a curved surface. For this reason, there is room for sliding of the contact in the direction in which the plug portion is removed from the contact portion. Therefore, an increase in contact resistance due to wear is inevitable.

  In view of the above points, the present invention suppresses sliding of the contact between the lead portion and the connector portion as a connection terminal, and suppresses an increase in contact resistance at the contact, and a connection structure between the mounting substrate and the electronic component and its connection An object is to provide an electronic device using the structure.

  In order to achieve the above object, according to the first aspect of the present invention, the lead portion (11) has a wall surface in a direction perpendicular to the insertion direction of the lead portion (11) into the connector portion (40) at the tip. The connector portion (40) is configured by a cylindrical member that is fitted into the through hole (31) and into which the lead portion (11) is inserted. The tip spring (41a) that pushes the tip of the lead portion (11) backward in the insertion direction at the tip of the cylindrical member, and the tip of the lead portion (11) is hooked by the locking portion (12) to the tip spring (41a). And a locking member (41b) having a clamping spring (41b) to be pressed to the side, and a cylindrical member disposed in the locking part (41) and into which the lead part (11) is inserted. , Pushed into the lock part (41) Push the clamping spring (41b) by the tip of the cylindrical member in Rukoto, it is characterized in that the releasing member releasing the clamping spring (41b) from the locking portion (12) (42) are provided.

  In such a structure, when the lead portion (11) is inserted into the connector portion (40), the tip of the lead portion (11) can be reliably fixed by the tip spring (41a) and the clamping spring (41b). For this reason, it can suppress that external force originates in thermal expansion etc. and a lead part (11) slides in a connector part (40). Therefore, it can suppress that the contact of the lead part (11) as a connection terminal and a connector part (40) slides, and it becomes possible to suppress the increase in contact resistance in a contact.

  For example, as described in claim 2, as a locking portion, a groove portion in which the tip of the lead portion (11) is partially dented in a direction perpendicular to the longitudinal direction of the lead portion (11) to be narrow. (12) can be adopted.

  According to a third aspect of the present invention, the tip spring (41a) is configured by partially projecting the tip of the cylindrical member constituting the lock portion (41) and bending the projected portion. can do. Similarly, as described in claim 4, the sandwiching spring (41b) can be configured by partially bending two opposite surfaces of the cylindrical member constituting the lock portion (41). . As described in the third and fourth aspects, if the tip spring (41a) and the pinching spring (41b) are formed by bending, the lock portion (41) can be easily formed from a single metal plate.

  In the invention according to claim 5, the lock portion (41) is a joint that extends from the side surface of the tubular member to the outside in the vertical direction at the rear end in the insertion direction of the lock portion (41) into the through hole (31). It has a part (41c), and the junction part (41c) is joined to the land (32) in the state fitted in the through hole (31).

  In this way, the lock part (41) is connected to the land (32) by the joining part (41c) extending from the side surface of the tubular member to the rear end in the insertion direction to the through hole (31) in the vertical direction. By doing so, when the lead portion (11) is inserted into the connector portion (40), the force is not applied in the direction in which the joint portion (41c) peels from the land (32). For this reason, it is possible to prevent a connection failure between the lock portion (41) and the land (32).

  The connection structure between the mounting substrate and the electronic component described in the first to fifth aspects can be applied to various things. For example, as described in claim 6, the electronic component (10) includes a case (20) having a bottom surface (21) and a side wall (22) provided in a direction perpendicular to the bottom surface (21). (21) and the mounting board (30) is fixed to the side wall (22), so that the lead part (11) is perpendicular to the mounting board (30) with respect to the connector part (40). In an electronic device in which the electronic component (10) and the mounting substrate (30) are electrically and mechanically connected to each other as a connection structure between the mounting substrate (30) and the electronic component (10). The connection structure between the mounting board and the electronic component according to any one of claims 1 to 5 can be applied.

  In addition, the code | symbol in the bracket | parenthesis of each said means shows the correspondence with the specific means as described in embodiment mentioned later.

It is the figure which showed the cross-sectional structure of the electronic device using the connection structure of the mounting board | substrate and electronic component concerning 1st Embodiment of this invention. It is an enlarged view of the dashed-two dotted line part in FIG. FIG. 3 is an exploded perspective view when the lead part 11 and the connector part 40 are taken out from the through hole 31. 4 is a perspective view when the lead part 11 and the connector part 40 are fitted into the through hole 31. FIG. FIG. 6 is a perspective cross-sectional view when the lead portion 11 is inserted into the connector portion 40 in a state where the lock portion 41 in the connector portion 40 is fitted in the through hole 31. It is the elements on larger scale of the lead part 11, the connector part 40, etc. which showed the mode of removal | desorption operation | movement. FIG. 3 is a perspective view when the lead portion 11 and the connector portion 40 of the electronic device 1 according to the first embodiment of the present invention are fitted into the through hole 31.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the following embodiments, the same or equivalent parts are denoted by the same reference numerals in the drawings.

(First embodiment)
A first embodiment of the present invention will be described. FIG. 1 is a diagram illustrating a cross-sectional configuration of an electronic device using a connection structure between a mounting board and an electronic component according to the present embodiment, and FIG. Hereinafter, the configuration of the electronic device will be described with reference to these drawings.

  As shown in FIG. 1, the electronic apparatus 1 according to the present embodiment includes an electronic component 10, a case 20, a mounting board 30, a connector part 40, and a lid part 50.

  The electronic component 10 is disposed on the bottom surface 21 of the case 20 having the bottom surface 21 and the side wall 22, and is fixed to the case 20 by screwing the screw portion 23 from the back surface side of the bottom surface 21. A plurality of lead portions 11 are drawn out from the electronic component 10 in the direction of the mounting substrate 30, and the lead portion 11 is inserted into the connector portion 40 from the vertical direction of the mounting substrate 30. The mounting board 30 is electrically and mechanically fixed. Specifically, as shown in FIG. 2, each lead portion 11 provided in the electronic component 10 has a tapered tip. Then, at the tip position of each lead portion 11, a groove portion 12 is formed which is partially recessed in the direction perpendicular to the longitudinal direction of the lead portion 11 to have a narrow width, and the connector portion 40 is engaged with this groove portion 12. By combining, the electronic component 10 and the connector part 40 are electrically and mechanically fixed via each lead part 11. Examples of such electronic component 10 include THD (through hole device).

  The case 20 has a structure in which a bottom surface 21 is rectangular and a side wall 22 is provided in a direction perpendicular to the bottom surface 21 from two opposite sides. A support portion 24 is provided on the inner wall surface of each side wall 22. The mounting substrate 30 is mounted on the support portion 24, and the mounting substrate 30 is fixed to the case 20 by being fastened to the support portion 24 by screwing the screw portion 25 from the surface side of the mounting substrate 30. Has been.

  The mounting board 30 is a circuit board on which circuit wiring (not shown) is formed, and is configured by a printed wiring board or the like. A through hole 31 into which the lead part 11 of the electronic component 10 is inserted is formed in the mounting substrate 30, and an opening edge of the through hole 31, specifically, an inner wall surface of the through hole 31 or the mounting substrate 30. Lands 32 are formed around the through holes 31 on the surface.

  In the present embodiment, the through holes 31 have a circular cross section, and are provided in the number corresponding to the lead portions 11, that is, in each lead portion 11. A land 32 is also provided for each through hole 31 and is formed so as to surround the inner wall surface of the through hole 31 having a circular cross section and the periphery of the through hole 31 on the surface of the mounting substrate 30. Each land 32 is electrically connected to a desired place of circuit wiring formed on the mounting substrate 30.

  The connector 40 is electrically connected to the land 32, thereby being electrically connected to a desired place of circuit wiring formed on the mounting substrate 30. The connector part 40 is provided in a number corresponding to the lead part 11, and the lead part 11 is electrically and mechanically connected by inserting each lead part 11 into the corresponding connector part 40. The connector part 40 has a structure in which the lead part 11 can be attached and detached. When the lead part 11 is inserted into the connector part 40, the lead part 11 is locked to perform electrical and mechanical connection. Then, by releasing the lock and extracting the lead part 11, the electrical and mechanical connection with the lead part 11 is released.

  Specifically, as shown in FIG. 2, the connector portion 40 is configured to include a lock portion 41 and a lock release portion 42. This structure will be described with reference to FIGS.

  FIG. 3 is an exploded perspective view of the lead portion 11 and the connector portion 40 taken out from the through hole 31. FIG. 4 is a perspective view when the lead portion 11 and the connector portion 40 are fitted into the through hole 31. FIG. 5 is a perspective cross-sectional view when the lead portion 11 is inserted into the connector portion 40 in a state where the lock portion 41 in the connector portion 40 is fitted into the through hole 31. In FIG. 5, the unlocking portion 42 is not shown.

  3-5, the lock | rock part 41 is comprised by the substantially square cylinder shape, for example, is comprised by bending what punched out the metal plate of 1 sheet in the desired shape. A distal end spring 41a configured by projecting the distal end of one of the four surfaces constituting the side surface of the rectangular cylinder and bending the projected portion at the distal end of the lock portion 41 in the insertion direction into the through hole 31. Is formed.

  Further, sandwiching springs 41b formed by punching out the central part and bending the lock part 41 inside are formed on both surfaces adjacent to the one surface where the tip spring 41a is formed. The sandwiching spring 41b is inclined with respect to both sides, and its tip is directed to the leading end side in the insertion direction to the through hole 31, and the spacing between the sandwiching springs 41b protruding from both sides is a lead. The dimension is set to enter the groove 12 formed in the portion 11.

  Further, a joining portion 41c is formed at the rear end of the lock portion 41 in the insertion direction into the through hole 31 so as to extend outward in the vertical direction from each side surface of the square tube.

  The lock portion 41 configured as described above is fitted into the through hole 31 from the tip spring 41 a side to a position where the joint portion 41 c contacts the land 32, and the joint portion 41 c is joined to the land 32 via the solder 60. As a result, the land 32 is electrically and mechanically connected. And since it is made to connect to the land 32 at the joint part 41c provided at the rear end in the insertion direction to the through hole 31 in the lock part 41, when the lead part 11 is inserted into the connector part 40, The force is not applied in the direction in which the bonding portion 41 c is separated from the land 32. For this reason, it is possible to prevent poor connection between the lock portion 41 and the land 32.

  Further, as shown in FIGS. 2 and 3, the unlocking portion 42 is configured in a substantially rectangular tube shape having a side wall 42 a extending linearly along the insertion direction into the through hole 31. For example, it is configured by bending one metal plate punched into a desired shape. The unlocking portion 42 has an outer dimension (dimension on the outer wall side) slightly smaller than an inner dimension (dimension on the inner wall side) of the locking portion 41, and an inner dimension (dimension on the inner wall side) than that of the lead portion 11. It is getting bigger. Further, a flange portion 42 b for pushing the linear side wall 42 a into the back side of the lock portion 41 is provided at the rear end of the lock release portion 42 in the insertion direction into the through hole 31.

  As shown in FIG. 2, the lock release portion 42 having such a structure is fitted inside the lock portion 41, and at the time of locking, the distal end in the insertion direction into the through hole 31 is more than the holding spring 41 b of the lock portion 41. Located behind the insertion direction. When the lock is released, this is pushed into the back side of the lock portion 41 via the flange portion 42b, so that the tip in the insertion direction into the through hole 31 spreads the holding spring 41b, and the holding spring 41b from the groove portion 12 of the lead portion 11 is spread. Is supposed to be released.

  The lid 50 covers the mounting substrate 30 by being disposed in parallel with the mounting substrate 30 on the opposite side of the bottom surface 21 of the case 20 with the mounting substrate 30 interposed therebetween. For example, the lid 50 is fixed to the case 20 by press fitting or the like. Between the lid 50 and the mounting substrate 30, for example, a buffer member 70 made of an elastic body is provided, and the mounting substrate 30 is pressed against the bottom surface 21 side of the case 20. For this reason, the curvature of the mounting substrate 30 and the vibration of the mounting substrate 30 due to thermal expansion can be suppressed, and the sliding of the lead portion 11 with respect to the connector portion 40 can be suppressed thereby.

  Next, the operation of attaching and detaching the lead portion 11 to the connector portion 40 by the connection structure of the mounting substrate 30 and the electronic component 10 employed in the electronic device 1 according to the present embodiment will be described. FIG. 6 is a partially enlarged view of the lead portion 11 and the connector portion 40, etc. showing the state of the detaching operation.

  First, before locking, as shown in FIG. 6A, the lock part 41 and the lock release part 42 constituting the connector part 40 are fitted in the through hole 31 in advance, and the joint part of the lock part 41 41 c is electrically and mechanically joined to the land 32 via the solder 60. The lock release part 42 is fitted in the lock part 41, but is somewhat press-fitted or a drop prevention structure (not shown) is employed to prevent the lock release part 42 from falling off.

  At the time of locking, in the state as described above, the lead portion 11 is fitted from below the connector portion 40 as indicated by an arrow in FIG. When the tapered portion at the tip of the lead portion 11 comes into contact with the pinching spring 41b of the lock portion 41, the pinching spring 41b is pushed and spread on both sides of the lead portion 11 so that the lead portion 11 further extends behind the lock portion 41. It is inserted in. Thereby, the tip of the lead portion 11 comes into contact with the tip spring 41a of the lock portion 41, and the tip spring 41a is elastically deformed by the tip of the lead portion 11. For this reason, the lead part 11 is further fitted into the back of the lock part 41, and as shown in FIG. 6B, the sandwiching spring 41b enters the groove part 12 formed at the tip of the lead part 11, and the lead The tip of the portion 11 is fixed by the elastic force of the tip spring 41a and the clamping spring 41b. Therefore, the lead portion 11 is fixed to the connector portion 40, and electrical and mechanical connection between the electronic component 10 and the mounting substrate 30 is achieved.

  On the other hand, at the time of unlocking, as shown in FIG. 6C from the state of FIG. 6B, the unlocking part 42 is pushed by pushing the flange part 42b of the unlocking part 42 in the direction of the arrow in the figure. 41 is inserted. As a result, the pinching spring 41 b of the lock portion 41 is pushed and widened by the tip of the lock release portion 42 and separated from the groove portion 12 of the lead portion 11. For this reason, the tip of the lead portion 11 is released from being fixed by the tip spring 41a and the holding spring 41b. Therefore, the lead part 11 can be extracted from the connector part 40, the lock is released, and the electronic component 10 and the mounting board 30 are separated electrically and mechanically.

  As described above, in the electronic device 1 of the present embodiment, the connector unit 40 is configured by the lock unit 41 and the lock release unit 42. At the time of locking, the tip of the lead portion 11 is fixed by a tip spring 41a and a holding spring 41b provided on the lock portion 41, and at the time of unlocking, the holding spring 41b is pushed and widened by the lock releasing portion 42, so that the lead portion 11 Can be removed from the connector portion 40. Thereby, the connection structure between the electronic component 10 and the mounting substrate 30 is a detachable structure.

  According to such a connection structure, when the lead part 11 is inserted into the connector part 40, the tip of the lead part 11 can be reliably fixed by the tip spring 41a and the holding spring 41b. For this reason, it can suppress that the lead part 11 slides in the connector part 40 due to an external force due to thermal expansion or the like. Therefore, it is possible to suppress sliding of the contact between the lead part 11 as the connection terminal and the connector part 40, and it is possible to suppress an increase in contact resistance at the contact.

  Further, since the tip of the sandwiching spring 41b enters the groove portion 12, the force when fixing the lead portion 11 is supported not in the bending direction of the sandwiching spring 41b but in the longitudinal direction, that is, in the compression direction. For this reason, it is easy to absorb the displacement of the tip of the lead portion 11 due to external force or thermal expansion. Thereby, it can suppress more that the front-end | tip of the lead part 11 leaves | separates from the clamping spring 41b during a lock | rock, and can shorten a sliding distance more. Therefore, the above effect can be obtained more.

  Further, the mounting substrate 30 is pressed against the bottom surface 21 side of the case 20 by the buffer member 70. For this reason, the curvature of the mounting substrate 30 and the vibration of the mounting substrate 30 due to thermal expansion can be suppressed, and the sliding of the lead portion 11 with respect to the connector portion 40 can be further suppressed thereby.

  In addition, since the lead portion 11 is fixed by the connector portion 40 and the housing is not required only for fixing, the number of components can be reduced.

(Second Embodiment)
A second embodiment of the present invention will be described. In the present embodiment, the configuration of the through holes 31 and the lands 32 is changed with respect to the electronic device 1 of the first embodiment, and the other aspects are the same as those of the first embodiment. Only the differences will be described.

  FIG. 7 is a perspective view when the lead portion 11 and the connector portion 40 of the electronic device 1 according to the present embodiment are fitted into the through hole 31. As shown in this figure, a plurality of connector portions 40 are fitted into one common through hole 31. In the case of such a structure, if each connector part 40 is arranged with the same area as that of the first embodiment, each connector need not be provided between adjacent connector parts 40. The size of the portion 40 can be increased. Thereby, it becomes possible to facilitate the processing of the connector part 40, in particular, the bending process for making the tip spring 41a and the holding spring 41b provided in the lock part 41 have a desired spring constant.

(Other embodiments)
In the first and second embodiments, the groove portion 12 is taken as an example at the tip of the lead portion 11 as a locking portion that is hooked on the clamping spring 41b. However, this is merely an example, and other structures may be employed. That is, the engaging portion only needs to constitute a wall surface inclined with respect to the insertion direction of the lead portion 11 into the connector portion 40. For example, a protrusion is provided at the tip of the lead portion 11, and the protrusion The holding spring 41b may be hooked by using as a locking portion.

  Moreover, in each said embodiment, as an example by which the connection structure which can perform the electrical and mechanical connection with the mounting substrate 30 and the electronic component 10 by inserting the lead part 11 with respect to the connector part 40 is employ | adopted, Although the electronic device 1 having the structure shown in FIG. 1 has been described, any device may be used as long as such a connection structure is adopted.

DESCRIPTION OF SYMBOLS 1 Electronic device 10 Electronic component 11 Lead part 12 Groove part 20 Case 30 Mounting board 31 Through hole 32 Land 40 Connector part 41 Lock part 41a Tip spring 41b Clamping spring 41c Joint part 42 Lock release part 42a Side wall 42b Flange part

Claims (6)

A connector part (40) electrically connected to a land (32) formed at the opening edge of the through hole (31) is mounted on the mounting board (30) and the lead part (11) disposed in the through hole (31). ) And the electronic component (10) can be electrically and mechanically connected by inserting the lead portion (11) into the connector portion (40), and from the connector portion (40). A connection structure between a detachable mounting board and an electronic component configured to be electrically and mechanically separated by extracting the lead portion (11),
The lead portion (11) is provided with a locking portion (12) constituting a wall surface in a direction perpendicular to the insertion direction of the lead portion (11) into the connector portion (40) at the tip,
The connector part (40) is configured by a cylindrical member that is fitted into the through hole (31) and into which the lead part (11) is inserted, and at the tip of the cylindrical member. A tip spring (41a) that pushes the tip of the lead portion (11) backward in the insertion direction, and a tip of the lead portion (11) is pushed toward the tip spring (41a) by being hooked on the locking portion (12). The lock portion (41) having a sandwiching spring (41b) and a cylindrical member that is disposed in the lock portion (41) and into which the lead portion (11) is inserted, and An unlocking part (42) that pushes the clamping spring (41b) by the tip of the cylindrical member by being pushed into the locking part (41) and separates the clamping spring (41b) from the locking part (12). Equipped with Connection structure between the mounting board and the electronic component, wherein Rukoto.   The locking portion is a groove portion (12) having a narrow width by partially denting the tip of the lead portion (11) in a direction perpendicular to the longitudinal direction of the lead portion (11). A connection structure between the mounting board and the electronic component according to claim 1.   The tip spring (41a) is formed by partially projecting the tip of a cylindrical member constituting the lock portion (41) and bending the projecting portion. Item 3. A connection structure between the mounting board according to Item 1 or 2 and an electronic component. The cylindrical member constituting the lock portion (41) has side surfaces including two opposing surfaces,
4. The clamping spring according to claim 1, wherein the clamping spring is configured such that two opposing surfaces of the cylindrical member constituting the lock portion are bent partially inward. A connection structure between the mounting board according to claim 1 and an electronic component.   The lock portion (41) has a joint portion (41c) extending from the side surface of the cylindrical member to the outside in the vertical direction at the rear end in the insertion direction of the lock portion (41) into the through hole (31). The joining portion (41c) is joined to the land (32) in a state of being fitted into the through hole (31), according to any one of claims 1 to 4. Connection structure between mounting board and electronic components. A case (20) having a bottom surface (21) and having a side wall (22) provided in a direction perpendicular to the bottom surface (21);
The electronic component (10) is fixed to the bottom surface (21), and the mounting substrate (30) is fixed to the side wall (22), whereby the lead portion (11) is connected to the mounting substrate ( 30) is inserted into the connector part (40) from the vertical direction, and the electronic component (10) and the mounting board (30) are electrically and mechanically connected, and these mounting boards (30) An electronic device, wherein the connection structure between the electronic component and the electronic component is a connection structure between the mounting board and the electronic component according to claim 1.

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