JP2010033991A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment attaining size and manufacturing cost reduction. <P>SOLUTION: When a guide pin 3 of the electronic equipment 1 enters a connection hole 7a formed in a circuit board 7, a spring part 4 is pushed by an inner wall of the connection hole 7a and elastically deforms toward the inside of the guide pin 3 to fit into the connection hole 7a, thereby electrically connecting the guide pin 3 with a ground circuit of the circuit board 7 to ground the electronic equipment 1. The electronic equipment 1 is firmly fixed to a chassis 6 by fitting the spring part 4 into the connection hole 7a. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device that is attached to an adherend by inserting a guide pin into a guide portion formed on the adherend.

  In order to improve assembly workability, maintainability, and the like, an electronic device is configured by incorporating a module in which functional parts are assembled into a chassis as shown in Patent Document 1 below. This electronic device includes a connector for connecting a functional component in the box-shaped case to the outside. The box-type case is provided with a positioning guide member, and the box-type case is attached to the chassis by inserting the guide member into the guide hole of the chassis. In this type of electronic apparatus, a box-shaped case is brought into contact with a spring-like metal fitting provided on the chassis to be grounded.

Japanese Patent Laid-Open No. 9-260872

  In electronic devices, it has been required to reduce the number of parts for positioning and grounding a box-shaped case and the installation space for these parts, thereby reducing the size and manufacturing cost.

  The present invention has been made in view of such a problem, and an object of the present invention is to provide an electronic device capable of reducing the size and the manufacturing cost.

  In order to achieve such an object, an electronic device according to the present invention is an electronic device that is attached to the adherend by inserting a guide pin into a guide portion formed on the adherend. When the pin is inserted into the guide portion, the pin is pressed by a ground conductor provided in the adherend to be elastically deformed, and includes a ground piece connected to the ground conductor.

  According to the present invention, the ground connection of the guide pin and the ground conductor of the adherend is connected to ground, thereby reducing the number of components and installation space of the electronic device, and reducing the size and manufacturing cost of the electronic device. Can be achieved.

Hereinafter, the best mode of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view illustrating an outline of an external configuration of a chassis 6 to which the electronic device 1 according to the present embodiment is mounted. FIG. 2 is a perspective view of the electronic device 1 as viewed from below. FIG. 3 is a perspective view of the guide pin 3 included in the electronic device 1 as viewed from below. In addition, each direction of the up-down, front-back, left-right used in the following description is shown in each figure used for description. These top / bottom, front / rear, and left / right are described for explanation, and needless to say, may be different from the actual arrangement.

  The electronic device 1 is modularized with functional components, and is used by being attached to a chassis 6 as shown in FIG. The chassis 6 has a substantially square box shape with an attachment / detachment opening 6a of the electronic device 1 at its upper end, and a circuit board 7 on which electronic components that operate by being electrically connected to the electronic device 1 are mounted (see FIG. 4). The lower plate 6b is positioned above () and attached to a housing (not shown) (see FIG. 5). A guide hole 6c into which a guide pin 3 of the electronic device 1 to be described later is inserted is formed in the lower plate 6b of the chassis 6 (see FIG. 5). The circuit board 7 is formed with a connection hole 7a into which a guide pin 3 to be described later is inserted. A ground conductor connected to the ground circuit of the circuit board 7 is provided on the inner wall of the connection hole 7a. The ground conductor is formed by printing on the inner wall of the connection hole 7a together with the ground circuit of the circuit board 7.

  The electronic device 1 is configured by incorporating functional components in a square box-like box-shaped case 1a. As shown in FIG. 2, a connector 2 for connecting a built-in functional component and a circuit formed on the circuit board 7 is provided on the lower surface of the box-shaped case 1 a. The connector 2 is desired downward from an opening provided in the center of the lower plate 1b of the box-shaped case 1a. When the box-shaped case 1a is attached to the chassis 6, it is attached to a connector (not shown) provided on the circuit board 7. Thus, electrical and mechanical connection between the electronic device 1 and the circuit board 7 is performed.

  A pair of guide pins 3 project downward from the lower surface of the box-shaped case 1a. Both guide pins 3 are located at the front end and the rear end of the lower surface of the box-shaped case 1a with the connector 2 in between. As shown in FIG. 3, the guide pin 3 has a cylindrical shape extending from the lower surface of the box-shaped case 1 a and extends downward, and a tip portion facing downward is gradually reduced in diameter toward the lower side. The guide pin 3 is inserted into the guide hole 6 c of the chassis 6, thereby positioning the box-shaped case 1 a with respect to the chassis 6 in the front-rear and left-right directions.

  A spring portion 4 is provided in the central portion of the guide pin 3 in the axial direction. A plurality of spring portions 4 are provided on the peripheral wall of the guide pin 3 at equal intervals along the circumferential direction of the guide pin 3. Each spring portion 4 has a shape in which the side wall of the guide pin 3 is curved in an arc shape from the upper side to the lower side, and has a spring property in a direction perpendicular to the axial direction of the guide pin 3. It is a conductive elastic body. The spring portion 4 is for making a ground connection between the electronic device 1 and the circuit board 7 by contacting a ground conductor provided on the inner wall of the connection hole 7 a provided in the circuit board 7.

  Next, a method for attaching the electronic device 1 to the chassis 6 will be described. FIG. 4 is a cross-sectional view for explaining the mounting structure of the electronic device 1 with respect to the chassis 6. FIG. 5 is a cross-sectional view illustrating a structure for attaching the guide pin 3 to the guide hole 6c.

  As shown by an arrow in FIG. 1, the electronic device 1 is accommodated in the chassis 6 through the attachment / detachment opening 6 a and attached to the chassis 6. As shown in FIG. 4, the guide pin 3 provided in the electronic device 1 is inserted from above into a guide hole 6 c formed in the lower plate 6 b of the chassis 6 to position the electronic device 1 in the front-rear and left-right directions. Thereafter, as shown in the figure, the guide pin 3 enters the connection hole 7a formed in the circuit board 7 below the chassis 6, and as shown in an enlarged view in FIG. Insert. The spring portion 4 is pressed from the inner wall of the connection hole 7a, is elastically deformed toward the inside of the guide pin 3, and is engaged with the connection hole 7a. Thereby, the guide pin 3 and the ground circuit of the circuit board 7 are electrically connected, and the electronic device 1 is grounded. In addition, the electronic device 1 is firmly fixed to the chassis 6 by fitting the spring portion 4 and the connection hole 7a.

  As described above, according to the present embodiment, when the guide pin 3 of the electronic device 1 is inserted into the connection hole 7a of the circuit board 7, the spring portion 4 is pressed against the ground conductor and is elastically deformed. 1 and the circuit board 7 are grounded. For this reason, the guide pin 3 for positioning the electronic device 1 with respect to the chassis 6 can also be used as a ground conductor of the electronic device 1. Therefore, the number of components and installation space of the electronic device 1 can be reduced and the electronic device 1 can be downsized and the manufacturing cost can be reduced as compared with the case of separately providing a ground connection component.

  In addition, the spring portion 4 is elastically deformed by fitting into the connection hole 7a provided in the circuit board 7, and is connected to the ground conductor provided on the inner wall of the connection hole 7a. It can also be used as a fixing means for the device 1.

  In addition, by configuring the spring portion 4 integrally with the guide pin 3, it is possible to perform ground connection without being affected by the structure of the chassis 6 and the circuit board 7 that are adherends of the electronic device 1. Become.

  In the above embodiment, the case where two guide pins 3 are provided on the lower surface of the box-shaped case 1a has been described. There is no problem. Moreover, the formation position of the guide pin 3 is also arbitrary. In the above embodiment, the case where the guide pin 3 has a cylindrical shape and extends from the box-shaped case 1a has been described. However, the shape of the guide pin 3 is arbitrary, for example, a rectangular tube shape or a plate shape. It may be. Further, the tip of the guide pin 3 does not necessarily have to be contracted.

  In the above embodiment, the case where the spring portion 4 has a shape in which the side wall of the guide pin 3 is curved in an arc shape has been described. However, the shape of the spring portion 4 is arbitrary as long as it can be elastically deformed by being pressed against the inner wall of the connection hole 7a and the guide pin 3 can be fitted to the connection hole 7a and grounded. For example, you may form from the tongue piece extended to the outward of the guide pin 3 toward upper side.

  Moreover, although the said embodiment demonstrated the case where the grounding of the electronic device 1 was performed by connecting the grounding circuit formed on the circuit board 7, and the spring part 4, the chassis 6, the circuit board 7, and not shown Other grounding conductors provided on the adherend such as a housing may be brought into contact with the spring portion 4 for grounding.

As mentioned above, although embodiment of this invention was described, the following can be mentioned as an embodiment of this invention.
The electronic device according to the first embodiment is an electronic device that is attached to the adherend by inserting a guide pin into a guide portion formed on the adherend, and the guide pin is inserted into the guide portion. Then, a grounding piece that is pressed and elastically deformed by a grounding conductor included in the adherend is provided.
In addition, in the electronic device of the second embodiment, in the first embodiment, the ground piece is elastically deformed by fitting into the connection hole provided in the adherend, and is connected to the ground conductor provided on the inner wall of the connection hole. It is characterized by being.

It is a perspective view showing the outline of the appearance composition of the chassis with which the electronic equipment of one embodiment of the present invention is mounted. It is the perspective view which looked at the electronic device from the lower part. It is the perspective view which looked at the guide pin with which an electronic device is provided from the downward direction. It is sectional drawing explaining the attachment structure of the electronic device with respect to a chassis. It is sectional drawing explaining the attachment structure to the guide hole of a guide pin.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Electronic device 1a Box-shaped case 2 Connector 3 Guide pin 4 Spring part 6 Chassis 6c Guide hole 7 Circuit board 7a Connection hole

Claims (1)

An electronic device to be attached to the adherend by inserting a guide pin into a guide portion formed on the adherend,
When the guide pin is inserted into the guide portion, the guide pin is pressed against a ground conductor included in the adherend to be elastically deformed, and includes an earthing piece connected to the ground conductor.

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